JP2004072444A - Housing for storing semiconductor chip for imaging device and imaging device - Google Patents

Housing for storing semiconductor chip for imaging device and imaging device Download PDF

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Publication number
JP2004072444A
JP2004072444A JP2002229530A JP2002229530A JP2004072444A JP 2004072444 A JP2004072444 A JP 2004072444A JP 2002229530 A JP2002229530 A JP 2002229530A JP 2002229530 A JP2002229530 A JP 2002229530A JP 2004072444 A JP2004072444 A JP 2004072444A
Authority
JP
Japan
Prior art keywords
imaging device
housing
semiconductor chip
grid array
array type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002229530A
Other languages
Japanese (ja)
Inventor
Toshiya Urakawa
浦川　俊也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Chemicals Inc
Original Assignee
Mitsui Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Chemicals Inc filed Critical Mitsui Chemicals Inc
Priority to JP2002229530A priority Critical patent/JP2004072444A/en
Publication of JP2004072444A publication Critical patent/JP2004072444A/en
Pending legal-status Critical Current

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Abstract

<P>PROBLEM TO BE SOLVED: To provide a housing for storing a semiconductor chip for an imaging device which has no metallic frames for terminals inserted and is miniaturized and to provide an imaging device using the same. <P>SOLUTION: A housing for storing a ball grid array type semiconductor chip for an imaging device is provided where a resin molding part for fixing a lens barrel part holding lenses is provided on a substrate having a wiring pattern formed thereon, and the imaging device is provided which is obtained by using the housing for the ball grid array type semiconductor chip for the imaging device. <P>COPYRIGHT: (C)2004,JPO

Description

【０００１】
【発明の属する技術分野】
本発明は小型化された撮像装置に関する。
【０００２】
【従来の技術】
撮像した映像を電気信号に変換する半導体撮像素子の小型化、高性能化に伴い、撮像装置も小型化されて各方面で使用され、世の中の利便性を高めている。また撮像装置が小型化になることで、映像の入力センサーとしての市場を広げている。
【０００３】
通常、この様な撮像装置には半導体チップを収めるための筐体が用いられている。図１は従来の端子用の金属フレームをインサートする形で作られた筐体の断面図、図２は同筐体の上面図、図３は同筐体を用いて作製した撮像装置の断面図である。筐体樹脂部１は筐体金属フレーム部２をインサートする形で成形される。この場合、筐体金属フレーム部２は筐体樹脂部１の外側に突出している。また撮像装置において、半導体チップ３は筐体の中に収められ、ワイヤー７によって端子である金属フレーム部２に接続されている。また、レンズ５は鏡筒部６にあらかじめセットされており、さらに鏡筒部６を筐体樹脂部上面に接続する。
撮像装置の小型化のためには、この筐体を如何に小さくするかが課題である。
【０００４】
【発明が解決しようとする課題】
現在使われている端子用の金属フレームをインサートする形で作られた撮像装置用半導体チップ収納用筐体は、金属フレームが筐体の外側に突出した形状をしているためその小型化には限界があり、端子用の金属フレームをインサートしない新たな形態の筐体の開発が望まれる。本発明は、端子用の金属フレームをインサートしない、小型化された筐体を提供することを課題とする。
【０００５】
【課題を解決するための手段】
本発明者らは、この課題に対して鋭意検討した結果、配線パターンが形成された基板上に、レンズを保持する鏡筒部を固定するための樹脂成形部を設けたボールグリッドアレイ型撮像装置用半導体チップ収納用筐体を用いることにより上記の課題を解決し得ることを見出し、本発明を完成するに至ったものである。
【０００６】
すなわち本発明は以下の態様を包含する。
配線パターンが形成された基板上に、レンズを保持する鏡筒部を固定するための樹脂成形部が設けられたことを特徴とするボールグリッドアレイ型撮像装置用半導体チップ収納用筐体である。
また、前記の半導体チップ収納用筐体を用いて得られる撮像装置である。
【０００７】
【発明の実施の形態】
以下、本発明の実施の形態を、図面を用いて説明する。
図４は本発明の配線パターンが形成された基板上に、レンズを保持する鏡筒部を固定するための樹脂成形部を設けることにより作られたボールグリッドアレイ型撮像装置用半導体チップ収納用筐体の断面図、図５は同筐体の上面図、図６は同筐体を用いて作製した撮像装置の断面図である。樹脂成形部１２は、表面にＣｕ等により回路部１１が形成された基板１０の上に成形される。また、基板１０において回路部１１と反対側の面にはスルーホール１３が存在し、個々のスルーホールは回路部の何れかの部分に接続されている。
【０００８】
半導体チップ３は、ポリイミドから成るチップ接着シート１４を介して基板１０に接着され、また、ワイヤー７を用いて回路部１１に接続される。また、スルーホール１３の部分には半田が注入され、先端がボール状である半田ボール１５として回路部１１からつながる端子と成る。この結果、図３の金属フレームを樹脂にインサートした形の筐体を用いた場合に比して、撮像装置を小さくすることができる。
【０００９】
【発明の効果】
配線パターンが形成された基板上に、レンズを保持する鏡筒部を固定するための樹脂成形部を設けたボールグリッドアレイ型撮像装置用半導体チップ収納用筐体を用いることで、撮像装置を小さくできる。
【図面の簡単な説明】
【図１】端子用の金属フレームをインサートした従来の筐体の断面概略図である。
【図２】従来の筐体である図１の上面図である。
【図３】従来の筐体を用いて作製した撮像装置の断面概略図である。
【図４】本発明に係るボールグリッドアレイ型撮像装置用半導体チップ収納用筐体の断面概略図である。
【図５】本発明に係る半導体チップ収納用筐体である図４の上面図である。
【図６】本発明に係る半導体チップ収納用筐体を用いて作製した撮像装置の断面概略図である。
【符号の説明】
１　筐体樹脂部
２　筐体金属フレーム部
３　半導体チップ
５　レンズ
６　鏡筒部
７　ワイヤー
９　ガラスフィルター
１０　基板
１１　回路部
１２　樹脂成形部
１３　スルーホール
１４　チップ接着シート
１５　半田ボール[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a miniaturized imaging device.
[0002]
[Prior art]
2. Description of the Related Art With the miniaturization and high performance of a semiconductor imaging device that converts a captured image into an electric signal, an imaging device is also miniaturized and used in various fields, thereby increasing convenience in the world. In addition, the miniaturization of the imaging device has expanded the market as an image input sensor.
[0003]
Usually, such an imaging device uses a housing for housing a semiconductor chip. FIG. 1 is a cross-sectional view of a housing made by inserting a conventional metal frame for terminals, FIG. 2 is a top view of the housing, and FIG. 3 is a cross-sectional view of an imaging device manufactured using the housing. It is. The housing resin part 1 is formed by inserting the housing metal frame part 2. In this case, the housing metal frame portion 2 projects outside the housing resin portion 1. Further, in the imaging device, the semiconductor chip 3 is housed in a housing and connected to the metal frame portion 2 as a terminal by a wire 7. The lens 5 is set in the lens barrel 6 in advance, and the lens barrel 6 is connected to the upper surface of the housing resin portion.
In order to reduce the size of the imaging device, it is an issue how to make this housing smaller.
[0004]
[Problems to be solved by the invention]
Currently used semiconductor chip housings for image pickup devices made by inserting metal frames for terminals are designed to be miniaturized because the metal frame has a shape protruding outside the housing. There is a limit, and it is desired to develop a new form of housing that does not insert a metal frame for terminals. An object of the present invention is to provide a miniaturized housing that does not insert a metal frame for a terminal.
[0005]
[Means for Solving the Problems]
The present inventors have intensively studied this problem, and as a result, a ball grid array type imaging apparatus in which a resin molded part for fixing a lens barrel holding a lens is provided on a substrate on which a wiring pattern is formed. It has been found that the above problem can be solved by using a semiconductor chip housing for a semiconductor device, and the present invention has been completed.
[0006]
That is, the present invention includes the following embodiments.
A semiconductor chip housing for a ball grid array type imaging device, wherein a resin molded part for fixing a lens barrel holding a lens is provided on a substrate on which a wiring pattern is formed.
Further, the present invention is an imaging device obtained using the semiconductor chip housing.
[0007]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 4 shows a semiconductor chip housing for a ball grid array type image pickup device formed by providing a resin molded portion for fixing a lens barrel holding a lens on a substrate on which a wiring pattern of the present invention is formed. FIG. 5 is a cross-sectional view of the body, FIG. 5 is a top view of the housing, and FIG. 6 is a cross-sectional view of an imaging device manufactured using the housing. The resin molded part 12 is molded on the substrate 10 on the surface of which the circuit part 11 is formed of Cu or the like. Further, through holes 13 are present on the surface of the substrate 10 opposite to the circuit section 11, and each through hole is connected to any part of the circuit section.
[0008]
The semiconductor chip 3 is bonded to the substrate 10 via a chip bonding sheet 14 made of polyimide, and is connected to the circuit section 11 using wires 7. In addition, solder is injected into the through hole 13, and the terminal is connected to the circuit section 11 as a solder ball 15 having a ball-shaped tip. As a result, the size of the imaging device can be reduced as compared with the case where the case in which the metal frame of FIG. 3 is inserted into the resin is used.
[0009]
【The invention's effect】
By using a housing for semiconductor chip storage for a ball grid array type image pickup device provided with a resin molded portion for fixing a lens barrel holding a lens on a substrate on which a wiring pattern is formed, the image pickup device can be reduced in size. it can.
[Brief description of the drawings]
FIG. 1 is a schematic cross-sectional view of a conventional housing in which a metal frame for a terminal is inserted.
FIG. 2 is a top view of FIG. 1, which is a conventional housing.
FIG. 3 is a schematic cross-sectional view of an imaging device manufactured using a conventional housing.
FIG. 4 is a schematic sectional view of a housing for housing a semiconductor chip for a ball grid array type imaging device according to the present invention.
FIG. 5 is a top view of FIG. 4, which is a semiconductor chip housing according to the present invention.
FIG. 6 is a schematic cross-sectional view of an imaging device manufactured using the semiconductor chip housing according to the present invention.
[Explanation of symbols]
REFERENCE SIGNS LIST 1 housing resin portion 2 housing metal frame portion 3 semiconductor chip 5 lens 6 lens barrel portion 7 wire 9 glass filter 10 substrate 11 circuit portion 12 resin molding portion 13 through hole 14 chip bonding sheet 15 solder ball

Claims (2)

配線パターンが形成された基板上に、レンズを保持する鏡筒部を固定するための樹脂成形部が設けられたことを特徴とするボールグリッドアレイ型撮像装置用半導体チップ収納用筐体。A semiconductor chip housing for a ball grid array type image pickup device, wherein a resin molded part for fixing a lens barrel holding a lens is provided on a substrate on which a wiring pattern is formed. 請求項１に記載の半導体チップ収納用筐体を用いて得られる撮像装置。An imaging device obtained by using the semiconductor chip housing according to claim 1.
JP2002229530A 2002-08-07 2002-08-07 Housing for storing semiconductor chip for imaging device and imaging device Pending JP2004072444A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002229530A JP2004072444A (en) 2002-08-07 2002-08-07 Housing for storing semiconductor chip for imaging device and imaging device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002229530A JP2004072444A (en) 2002-08-07 2002-08-07 Housing for storing semiconductor chip for imaging device and imaging device

Publications (1)

Publication Number Publication Date
JP2004072444A true JP2004072444A (en) 2004-03-04

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JP2002229530A Pending JP2004072444A (en) 2002-08-07 2002-08-07 Housing for storing semiconductor chip for imaging device and imaging device

Country Status (1)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007294658A (en) * 2006-04-25 2007-11-08 Fujikura Ltd Semiconductor package
CN100420275C (en) * 2005-03-29 2008-09-17 夏普株式会社 Optical device module, and method of fabricating the optical device module
WO2015186840A1 (en) * 2014-06-05 2015-12-10 Ricoh Company, Ltd. Imaging module and imaging apparatus

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100420275C (en) * 2005-03-29 2008-09-17 夏普株式会社 Optical device module, and method of fabricating the optical device module
JP2007294658A (en) * 2006-04-25 2007-11-08 Fujikura Ltd Semiconductor package
WO2015186840A1 (en) * 2014-06-05 2015-12-10 Ricoh Company, Ltd. Imaging module and imaging apparatus
JP2015230989A (en) * 2014-06-05 2015-12-21 株式会社リコー Imaging module and imaging device
CN106415841A (en) * 2014-06-05 2017-02-15 株式会社理光 Imaging module and imaging apparatus
US9912854B2 (en) 2014-06-05 2018-03-06 Ricoh Company, Ltd. Imaging module and imaging apparatus

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