JP2004031758A - Manufacturing method of winding type chip inductor - Google Patents

Manufacturing method of winding type chip inductor Download PDF

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Publication number
JP2004031758A
JP2004031758A JP2002187548A JP2002187548A JP2004031758A JP 2004031758 A JP2004031758 A JP 2004031758A JP 2002187548 A JP2002187548 A JP 2002187548A JP 2002187548 A JP2002187548 A JP 2002187548A JP 2004031758 A JP2004031758 A JP 2004031758A
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JP
Japan
Prior art keywords
chip inductor
connection terminal
wound
terminal portion
type chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002187548A
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Japanese (ja)
Inventor
Sadahiro Sato
佐藤 貞弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Okaya Electric Industry Co Ltd
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Okaya Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Okaya Electric Industry Co Ltd filed Critical Okaya Electric Industry Co Ltd
Priority to JP2002187548A priority Critical patent/JP2004031758A/en
Publication of JP2004031758A publication Critical patent/JP2004031758A/en
Pending legal-status Critical Current

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Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a winding type chip inductor which hardly rolls and is easily fixed in packaging to a printed circuit board and in reflow. <P>SOLUTION: A connector portion of a winding type chip inductor 1, wherein an insulating coating wire 3 is wound closely on an outer circumference of a magnetic core 2 and both end parts are connector portions 4 without being subjected to insulation coating, is soldered. A heater chip 6, which generates a high temperature instantaneously by passing a pulse current through, is brought into contact with the soldered connector portion and the connector portions are firmly fixed by welding the soldered part of the connector portion. <P>COPYRIGHT: (C)2004,JPO

Description

【0001】
【発明の属する技術分野】
本発明は、プリント回路基板に実装される小型な捲線型チップインダクタに係り、特に実装時やリフロー時に導線が剥がれることなく確実かつ安定して固定することができる捲線型チップインダクタに関するものである。
【0002】
【従来の技術】
従来、プリント回路基板に実装される小型な捲線型チップインダクタとしては、図3に示すごとく、円柱・角柱等の棒状の磁性体コア21の外周に絶縁被覆された細い導線にて、隣接する導線同志が当接するように密着状態で捲回し、この絶縁被覆導線22の両端の絶縁被覆を予め剥離して端子部23とした捲線型チップインダクタ20が存在している。この捲線型チップインダクタ20は、高周波数帯域で使用することができ、寄生成分が少なく、低抵抗で大電流を流すことができるという特徴を有している。
【0003】
【発明が解決しようとする課題】
しかしながら、このような捲線型チップインダクタにあっては、捲線両端の接続端子部は捲回状態のままで、相隣接する接続端子部は特に固定されていなかった。そのため、リフロー等の高温度環境下に置くと捲線の張力によりスプリングバックが発生し、両端部分が磁性体コア21から浮き上がってしまったり、プリント回路基板への実装時の作業で接触して接続端子部が磁性体コア終端から剥がれたりする虞があった。
【0004】
そこで本発明は、リフロー等の高温度環境下やプリント回路基板への実装時であっても導線が剥がれることなく確実かつ安定して固定される捲線型チップインダクタの提供を目的とする。
【0005】
【課題を解決するための手段】
上記目的を達成するため、本発明の捲線型チップインダクタの製造方法は、磁性体コアの外周に絶縁被覆導線を密着状態で捲回し両端部分は絶縁被覆することなく接続端子部としてなる捲線型チップインダクタの接続端子部を半田上げするとともに、該半田上げされた接続端子部に対し、加熱手段により上記接続端子部の半田上げ部分を溶かし隣接する接続端子部間を溶着することを特徴とするものである。
【0006】
また、加熱手段はパルス電流を通じることで瞬間的に高温を発生する加熱手段としたことを特徴とするものである。
【0007】
また、加熱手段は磁性体コアと平行方向に配設し、半田上げされてなる捲線型チップインダクタの両端部分の接続端子部を同時に加熱溶着することを特徴とするものである。
【0008】
また、加熱手段は磁性体コアと同軸方向に配設し、半田上げされてなる一方の接続端子部の複数個所を同時に加熱溶着することを特徴とするものである。
【0009】
【発明の実施の形態】
図1は、本発明の捲線型チップインダクタの製造方法の第1の実施例を示しており、捲線型チップインダクタ1は、直径が0.6mm、長さが1.7mmの角柱形状からなるフェライト製の磁性体コア2の外周に、線径が約0.11mmの絶縁被覆導線3を密着状態で捲回して構成されている。この絶縁被覆導線3の両端部分は、予め絶縁被覆を2〜3巻程度剥離して半田上げして接続端子部4としている。この段階では、捲線型チップインダクタ1の接続端子部4は密着しているものの、力を加えたり加熱したりするとその終端から導線が剥がる虞のある状態である。
【0010】
そして、この捲線型チップインダクタ1を、図1に示す溶着装置5に取り付け、その上方にはパルス電流を通じることで瞬間的に高温を発生する作用を有するヒーターチップ6を上下動自在に捲線型チップインダクタ1と平行方向に配設する。このヒーターチップ6を降下させ、その加熱部分6aを捲線型チップインダクタ1の両端の接続端子部4の導線2本分程度に当接させる。次に、ヒーターチップ6にパルス電流を通じて瞬間的に高温を発生させることで、ヒーターチップ6の加熱部分6aが当接している接続端子部4の半田を溶融させて、隣接する導線同志を半田により溶着し、そしてすぐにヒーターチップ6が冷めることにより両端の接続端子部4は一度に確実に固定されるものである。尚、一方の接続端子部4につき1個所だけ溶着するのでは、確実な溶着状態としては不足すると思われる場合には、捲線型チップインダクタ1を回転させて溶着作業を繰り返して複数個所を溶着することとしてもよいものである。
【0011】
図2は、本発明の捲線型チップインダクタの製造方法の第2の実施例を示しており、磁性体コア2の外周に絶縁被覆導線3を密着状態で捲回し、その両端部分を、予め絶縁被覆を2〜3巻程度剥離して半田上げして接続端子部4とする捲線型チップインダクタ1の基本的な構成については前述した第1の実施例と同様であり、溶着装置7にセットした捲線型チップインダクタ1の一方端の同軸方向に、パルス電流を通じることで瞬間的に高温を発生するヒーターチップ8を左右動自在に対向させ、このヒーターチップ8が右方向に移動し、捲線型チップインダクタ1の一方の接続端子部4に対し2個所で当接する構造とするものである。
【0012】
そして、ヒーターチップ8にパルス電流を通じて瞬間的に高温を発生させることで、ヒーターチップ8の加熱部分8aが当接している接続端子部4の半田を溶融させて、隣接する導線同志を半田により溶着し、そしてすぐにヒーターチップ8が冷めることにより一方の接続端子部4は確実に固着される。次に、溶着装置7に対し捲線型チップインダクタ1を左右反転させてセットし、前述同様にヒーターチップ8を対向する他方の接続端子部4に当接させ、ヒーターチップ6にパルス電流を通じることで瞬間的に高温を発生させ、ヒーターチップ8の加熱部分8aが当接している接続端子部4の半田を溶融させて、隣接する導線同志を半田により溶着し、そしてすぐにヒーターチップ6が冷めることにより他方の接続端子部4も確実に固着されるものである。
【0013】
尚、上述した各実施例の捲線型チップインダクタにあっては、1個のヒーターチップが捲線型チップインダクタの接続端子部の2個所に当接して溶着する場合について説明したが、勿論これに限定されることはなく、2個以上のヒーターチップを用いたり、1個のヒーターチップが接続端子部の3個所以上の複数個所に当接したりする構成としてもよいものである。
【0014】
【発明の効果】
以上詳述した如く、本発明の捲線型チップインダクタの製造方法によれば、磁性体コアの外周に絶縁被覆導線を密着状態で捲回し両端部分は絶縁被覆することなく接続端子部としてなる捲線型チップインダクタの接続端子部を半田上げするとともに、該半田上げされた接続端子部に対し、加熱手段により上記接続端子部の半田上げ部分を溶かし隣接する接続端子部間を溶着することで、捲線型チップインダクタ両端の接続端子部を確実に固定することができ、これによりリフロー等の高温度環境下やプリント回路基板への実装時であっても接続端子部が剥がれることなく確実かつ安定して捲線型チップインダクタが基板等に固定されるものである。
【0015】
また、加熱手段はパルス電流を通じることで瞬間的に高温を発生する加熱手段とすることで、接続端子部の半田上げ部分だけをごく短時間スポット的に加熱することができ、これにより溶着する必要のない個所を高温に加熱することもなく、かつ加熱した個所を冷ます必要もなくきわめて容易に溶着することができる。
【図面の簡単な説明】
【図1】本発明の捲線型チップインダクタの製造方法の第1の実施例を示す説明図である。
【図2】本発明の捲線型チップインダクタの製造方法の第2の実施例を示す説明図である。
【図3】従来の捲線型チップインダクタの正面図である。
【符号の説明】
1 捲線型チップインダクタ
2 磁性体コア
3 絶縁被覆導線
4 接続端子部
5 溶着装置
6 ヒーターチップ
6a 加熱部分
7 溶着装置
8 ヒーターチップ
8a 加熱部分
[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a small-sized wound chip inductor mounted on a printed circuit board, and more particularly to a wound-type chip inductor capable of securely and stably fixing a conductive wire without peeling during mounting or reflow.
[0002]
[Prior art]
Conventionally, as a small-sized wound chip inductor mounted on a printed circuit board, as shown in FIG. 3, a thin conductive wire insulated and coated on the outer periphery of a rod-shaped magnetic core 21 such as a cylinder or a prism is used. There is a wound-type chip inductor 20 which is wound in close contact with each other so as to come into contact with each other, and the insulating coating on both ends of the insulating-coated conductor 22 is peeled off in advance to form a terminal portion 23. The wire-wound chip inductor 20 is characterized in that it can be used in a high frequency band, has a small parasitic component, can flow a large current with low resistance.
[0003]
[Problems to be solved by the invention]
However, in such a wound chip inductor, the connection terminal portions at both ends of the winding remain in a wound state, and the adjacent connection terminal portions are not particularly fixed. Therefore, when placed in a high-temperature environment such as reflow, springback occurs due to the tension of the winding, and both end portions float up from the magnetic core 21 or come into contact with the work at the time of mounting on the printed circuit board, and the connection terminal is contacted. There is a possibility that the portion may be peeled off from the end of the magnetic core.
[0004]
Accordingly, an object of the present invention is to provide a wire-wound chip inductor in which a conductive wire is securely and stably fixed without peeling even in a high-temperature environment such as reflow or at the time of mounting on a printed circuit board.
[0005]
[Means for Solving the Problems]
In order to achieve the above object, a method of manufacturing a wound type chip inductor according to the present invention is a method of manufacturing a wound type chip in which an insulated wire is wound around an outer periphery of a magnetic core in a tightly contacted state and both end portions are used as connection terminals without being insulated. A method of soldering a connection terminal portion of an inductor, and melting a solder-raised portion of the connection terminal portion by heating means and welding between adjacent connection terminal portions to the soldered connection terminal portion. It is.
[0006]
Further, the heating means is a heating means which instantaneously generates a high temperature by passing a pulse current.
[0007]
Further, the heating means is arranged in a direction parallel to the magnetic core, and heat-welds the connection terminal portions at both ends of the wound-type chip inductor obtained by soldering at the same time.
[0008]
Further, the heating means is arranged coaxially with the magnetic core, and heat-welds a plurality of portions of one of the connection terminal portions formed by soldering simultaneously.
[0009]
BEST MODE FOR CARRYING OUT THE INVENTION
FIG. 1 shows a first embodiment of a method of manufacturing a wound type chip inductor according to the present invention. A wound type chip inductor 1 has a prismatic ferrite having a diameter of 0.6 mm and a length of 1.7 mm. An insulated conductor 3 having a wire diameter of about 0.11 mm is wound in close contact with the outer periphery of a magnetic core 2 made of steel. At two end portions of the insulated wire 3, the insulated coating is peeled off by about 2 to 3 turns in advance and soldered to form a connection terminal portion 4. At this stage, although the connection terminal portion 4 of the wound-type chip inductor 1 is in close contact, the conductor may be peeled off from its end when a force is applied or heated.
[0010]
The wound type chip inductor 1 is attached to the welding device 5 shown in FIG. 1, and a heater chip 6 having an action of instantaneously generating a high temperature by passing a pulse current is vertically movable over the winding type chip inductor 1. It is arranged in a direction parallel to the chip inductor 1. The heater chip 6 is lowered, and the heated portion 6a is brought into contact with about two conductors of the connection terminal portion 4 at both ends of the wound chip inductor 1. Next, by instantaneously generating a high temperature through a pulse current in the heater chip 6, the solder of the connection terminal portion 4 with which the heating portion 6 a of the heater chip 6 is in contact is melted, and the adjacent conductive wires are connected by solder. By welding and immediately cooling the heater chip 6, the connection terminal portions 4 at both ends are securely fixed at one time. In addition, if it is considered that a reliable welding state would be insufficient if only one connection terminal portion 4 is welded, the welding operation is repeated by rotating the wound chip inductor 1 to weld a plurality of locations. It is a good thing.
[0011]
FIG. 2 shows a second embodiment of the method of manufacturing a wound type chip inductor according to the present invention, in which an insulated wire 3 is wound in close contact with the outer periphery of a magnetic core 2, and both ends thereof are insulated in advance. The basic configuration of the wound type chip inductor 1 in which the coating is peeled off by about 2 to 3 turns and soldered to form the connection terminal portion 4 is the same as that of the first embodiment described above, and was set in the welding device 7. A heater chip 8 that instantaneously generates a high temperature by passing a pulse current is opposed to the one end of the wound type chip inductor 1 in a coaxial direction so that the heater chip 8 can move left and right. The chip inductor 1 has a structure in which it is in contact with one connection terminal portion 4 at two places.
[0012]
Then, a high temperature is instantaneously generated in the heater chip 8 through a pulse current to melt the solder of the connection terminal portion 4 with which the heating portion 8a of the heater chip 8 is in contact, and weld the adjacent conductive wires together by soldering. When the heater chip 8 cools down immediately, the one connection terminal portion 4 is securely fixed. Next, the winding type chip inductor 1 is set to the welding device 7 with the left and right inverted, and the heater chip 8 is brought into contact with the other opposite connection terminal portion 4 as described above, and a pulse current is passed through the heater chip 6. Instantaneously generates a high temperature, melts the solder of the connection terminal portion 4 with which the heating portion 8a of the heater chip 8 is in contact, welds adjacent conductors by solder, and immediately cools the heater chip 6. Thus, the other connection terminal portion 4 is also securely fixed.
[0013]
In the above-described wound type chip inductors of the respective embodiments, the case where one heater chip is brought into contact with and welded to two portions of the connection terminal portion of the wound type chip inductor has been described. Instead, two or more heater chips may be used, or one heater chip may contact a plurality of three or more connection terminal portions.
[0014]
【The invention's effect】
As described in detail above, according to the method for manufacturing a wound type chip inductor of the present invention, a winding type in which an insulating coated conductor is wound in close contact with the outer periphery of a magnetic core, and both end portions serve as connection terminal portions without insulating coating. The connection terminal portion of the chip inductor is soldered, and the soldered connection terminal portion is melted by a heating means to the soldered connection terminal portion and the adjacent connection terminal portions are welded to each other to form a winding type. The connection terminals at both ends of the chip inductor can be securely fixed, so that the connection terminals can be reliably and stably wound without peeling even in a high temperature environment such as reflow or when mounting on a printed circuit board. The die chip inductor is fixed to a substrate or the like.
[0015]
Further, the heating means is a heating means that generates a high temperature instantaneously by passing a pulse current, so that only the solder-raised portion of the connection terminal portion can be spot-heated for a very short time, thereby welding. Welding can be performed very easily without heating unnecessary parts to a high temperature and without cooling the heated parts.
[Brief description of the drawings]
FIG. 1 is an explanatory view showing a first embodiment of a method of manufacturing a wound type chip inductor according to the present invention.
FIG. 2 is an explanatory view showing a second embodiment of the method of manufacturing a wound chip inductor of the present invention.
FIG. 3 is a front view of a conventional wound type chip inductor.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Winding type chip inductor 2 Magnetic core 3 Insulated covering wire 4 Connection terminal part 5 Welding device 6 Heater chip 6a Heating part 7 Welding device 8 Heater chip 8a Heating part

Claims (4)

磁性体コアの外周に絶縁被覆導線を密着状態で捲回し両端部分は絶縁被覆することなく接続端子部としてなる捲線型チップインダクタの接続端子部を半田上げするとともに、該半田上げされた接続端子部に対し、加熱手段により上記接続端子部の半田上げ部分を溶かし隣接する接続端子部間を溶着することを特徴とする捲線型チップインダクタの製造方法。An insulated conductor is wound around the outer periphery of the magnetic core in a tightly contacted state, and both ends are soldered to the connection terminal portion of the wire-wound chip inductor, which serves as a connection terminal portion without being insulated, and the soldered connection terminal portion is formed. In contrast, a method for manufacturing a wire-wound chip inductor, characterized in that a soldering portion of the connection terminal portion is melted by a heating means and the adjacent connection terminal portion is welded. 加熱手段はパルス電流を通じることで瞬間的に高温を発生する加熱手段としたことを特徴とする請求項1記載の捲線型チップインダクタの製造方法。2. The method according to claim 1, wherein the heating means generates a high temperature instantaneously by passing a pulse current. 加熱手段は磁性体コアと平行方向に配設し、半田上げされてなる捲線型チップインダクタの両端部分の接続端子部を同時に加熱溶着することを特徴とする請求項1記載の捲線型チップインダクタの製造方法。2. The winding type chip inductor according to claim 1, wherein the heating means is disposed in a direction parallel to the magnetic material core, and heats and welds connection terminal portions at both ends of the winding type chip inductor formed by soldering at the same time. Production method. 加熱手段は磁性体コアと同軸方向に配設し、半田上げされてなる一方の接続端子部の複数個所を同時に加熱溶着することを特徴とする請求項1記載の捲線型チップインダクタの製造方法。2. The method for manufacturing a wire-wound chip inductor according to claim 1, wherein the heating means is arranged coaxially with the magnetic core, and heat-welds a plurality of portions of one of the connection terminals formed by soldering simultaneously.
JP2002187548A 2002-06-27 2002-06-27 Manufacturing method of winding type chip inductor Pending JP2004031758A (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61142721A (en) * 1984-12-17 1986-06-30 Matsushita Electric Ind Co Ltd Power source transformer for ic
JPH04112509A (en) * 1990-08-31 1992-04-14 Matsushita Electric Ind Co Ltd Choke coil
JPH09261905A (en) * 1996-03-25 1997-10-03 Kokusan Denki Co Ltd Armature
JPH10312922A (en) * 1997-05-14 1998-11-24 Murata Mfg Co Ltd Electronic component having wire and its manufacture

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61142721A (en) * 1984-12-17 1986-06-30 Matsushita Electric Ind Co Ltd Power source transformer for ic
JPH04112509A (en) * 1990-08-31 1992-04-14 Matsushita Electric Ind Co Ltd Choke coil
JPH09261905A (en) * 1996-03-25 1997-10-03 Kokusan Denki Co Ltd Armature
JPH10312922A (en) * 1997-05-14 1998-11-24 Murata Mfg Co Ltd Electronic component having wire and its manufacture

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