JP2004030978A - Substrate cutting method and device for organic electroluminescent display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate cutting method and device for an organic electroluminescent display device capable of minimizing a space needed for cutting and capable of cutting at a position in the vicinity of a sealing cap. <P>SOLUTION: The method includes a first step where a plurality of organic electroluminescent parts are formed in given patterns on a single substrate, sealing caps are adhered on the substrate tightly sealing each organic electroluminescent part, and stress is applied to the substrate by the sealing caps, and a second step where the substrate with the stress applied is scribed by a cutter and cut by the stress applied to the substrate. Therefore, there is no need of adding any extra shock as before, so that the direction of cutting is prevented from changing due to the shock. Moreover, since a cutting blade of the cutting device is inclined on one side, a region adjacent to the sealing cap can be cut. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for cutting a substrate made of a non-metallic material, and more particularly, to a method and apparatus for cutting a glass substrate in a process of manufacturing an organic light emitting display.
[0002]
[Prior art]
A substrate of an image display device such as a liquid crystal display device, a fluorescent display tube, a plasma display device, and an organic light emitting display device is made of a non-metallic material such as glass or ceramic. When the substrate of such an image display device is made of glass, a cutting method using a diamond saw (saw), a glass cutter wheel or a thermal shock has been used for cutting the substrate.
[0003]
The method of cutting by thermal shock is disclosed in U.S. Pat. No. 5,609,284. In this method, the cutting site is heated to rapidly cool the cutting site, thereby generating microcracks and cutting. The method of cutting glass using this thermal shock utilizes the properties of glass having poor thermal conductivity. The growth of the fine cracks is determined by the stress existing in the material. Since such stress is greatly affected by the thermal shock, the cooling and heating structure is relatively complicated to increase the thermal shock.
[0004]
When cutting a glass substrate using the glass cutter, one side of the glass substrate is scribed to generate cracks in the thickness direction on the surface of the organic substrate, and then cut by applying an impact.
[0005]
FIG. 1 shows a method of cutting a single substrate having an organic light emitting display unit at predetermined intervals using such a glass cutter.
[0006]
Referring to the drawings, a sealing cap 12 enclosing an organic light emitting portion (not shown) of an organic light emitting display device and an electrode terminal portion 13 extending from at least one edge of the sealing cap 12 are provided. In order to cut one substrate 11, first, a step of forming a crack by scribing using a cutter 15 on the front surface or the back surface between the sealing caps 12 is performed. When the formation of the crack is completed as described above, the rear surface corresponding to the crack forming portion is cut by applying an impact.
[0007]
As described above, in the process of manufacturing an organic light emitting display device, cutting a single substrate requires a step of applying a separate impact after crack formation, thus complicating the operation process. In particular, the organic film or the electrodes may be damaged when a shock is applied to the substrate, and when the sealing cap 12 is positioned on the lower surface during cutting, there is a problem that it is difficult to fix the substrate 11.
[0008]
On the other hand, an example of the glass cutter is disclosed in Japanese Patent Application Laid-Open No. 9-188534. The disclosed glass cutter has a fine projection formed on a ridge of a normal cutter wheel.
[0009]
JP-A-2000-219527 discloses another example of a glass cutter. The disclosed glass cutter includes a cutter wheel in which a groove inclined at a predetermined angle with respect to a center direction of a corresponding wheel is formed at a predetermined pitch on a cutting edge of a disk wheel in a cutter head.
[0010]
As described above, since the cutter wheel 15a has a ridge line serving as a cutting blade on the center of the thickness, the cutting blade seals when cutting a portion close to the sealing cap 12 as shown in FIG. There is a problem that it is not possible to cut a portion close to the sealing cap by contacting the stopper cap 12.
[0011]
[Problems to be solved by the invention]
The present invention has been made to solve the above-described problems, and applies a stress applied by a sealing cap and an artificial stress when cutting a glass substrate to the substrate, thereby cutting the glass substrate and cutting the glass substrate only by scribing. It is an object of the present invention to provide a substrate cutting method and an apparatus for an organic light emitting display device capable of improving the performance.
[0012]
Another object of the present invention is to provide a method and apparatus for cutting a substrate of an organic light emitting display device, which can minimize a space required for cutting and can cut at a position close to a sealing cap.
[0013]
[Means for Solving the Problems]
In order to achieve the above object, a method for cutting a substrate of an organic light emitting display device according to the present invention includes forming a plurality of organic light emitting portions in a predetermined pattern on a single substrate, and A first step in which a sealing cap to be wrapped and sealed is attached to the substrate, and a stress is applied to the substrate by the sealing cap, and a stress acting on the substrate by scribing the stressed substrate using a cutter. And a second step of cutting by the method.
[0014]
In the present invention, the first step further comprises a step of adsorbing the stressed and bent substrate to a table to apply an additional stress to the substrate, and in the step of adsorbing the substrate, adsorbing the substrate by each organic This is performed by adsorbing a portion corresponding to the electroluminescent portion.
[0015]
Another feature of the method for cutting a substrate of an organic light emitting display device according to the present invention for achieving the above object is that a plurality of organic light emitting portions are arranged in a predetermined pattern and a sealing cap for enclosing and sealing the organic light emitting portions respectively. A first step of applying a stress in a direction in which the single substrate on which the stress is applied is cut by adsorbing the substrate on a table, a second step of using a cut on the stressed substrate by using a cut, A third step of cutting the substrate by removing the applied suction force and eliminating the stress.
[0016]
A substrate cutting apparatus of an organic light emitting display device for achieving the above object includes a substrate having a plurality of organic light emitting portions formed in a predetermined pattern and a sealing cap for enclosing and sealing each of the organic light emitting portions. By cutting, a ridge line of a cutting blade portion rotatably mounted on the head and formed on the outer peripheral surface of the head includes a wheel on a disk that is deviated to one side from the center of the outer peripheral surface. It is characterized by becoming.
[0017]
In the present invention, the wheel on the disk has a truncated cone shape.
[0018]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.
[0019]
As shown in FIG. 3, the present invention cuts a single substrate 100 on which an organic electroluminescent unit (not shown) and a sealing cap 32 for enclosing and sealing the organic electroluminescent unit are formed. The present invention relates to a method of cutting a substrate of an organic light emitting display device for completing a display device and the device.
[0020]
3 to 6 show one embodiment of a method of cutting a substrate of an organic light emitting display according to the present invention.
[0021]
First, a plurality of organic electroluminescent portions are formed in a predetermined pattern on a single substrate 100, and a sealing cap 32 that encloses and seals each of the organic electroluminescent portions is attached using a separate adhesive. A first step (see FIG. 4) of applying a stress to the substrate 100 by the sealing cap 32 is performed. In this process, in order to increase the stress applied by the sealing cap 32, that is, the stress for cutting, suction is performed using a table 200 having a plurality of suction holes 201 as shown in FIG. I do. It is desirable to apply such stress to the bent substrate by applying a stress by the sealing cap 32 to thereby elastically deform the substrate and apply additional stress to the substrate. The suction of the substrate 100 by the table 200 is achieved by locating the suction holes 201 formed in the table at a position corresponding to the organic electroluminescent portion, thereby flattening the deformation by the sealing cap 32 and maximizing the generation of stress. Can be achieved.
[0022]
In this state, the glass cap is fixed to the sealing cap 32 or the sealing cap and the table using the glass cutting device, so that the side adjacent to the substrate on which the stress is applied is scribed, and a crack is formed in the thickness direction. Perform the steps (see FIG. 5). In the second stage, it is desirable to form the cracks as deep as possible.
[0023]
When the formation of the crack is completed as described above, as shown in FIG. 6, the suction force of the substrate is removed by the table 200, and the substrate on which the crack is formed by the stress applied to the substrate 100 by the sealing cap 32. A third step of cutting 100 is performed. The third step may be performed at the same time as the second step, regardless of whether the substrate is being sucked by the table 200 or not.
[0024]
In the above embodiment, the stress applied to the substrate for cutting is caused by bonding the sealing cap as described above and deforming the substrate by adsorbing the substrate deformed by the sealing cap to a table. And a table that gives a predetermined curvature to the table and applies an artificial stress by bending the substrate at the time of suction, but is not limited to this, and gives permanent deformation to the organic light emitting portion and the sealing cap. Any method capable of applying a stress to a substrate to be cut within a range not possible is possible.
[0025]
FIG. 3 shows an embodiment of a cutting apparatus for performing a method of cutting a substrate of an organic light emitting display according to the present invention.
[0026]
Referring to the drawing, the cutting device 40 includes a head 42 having a bag 41 and a disk-shaped wheel 43 rotatably mounted on the head and having a cutting blade 43a. The heads 42 are installed in parallel with a predetermined distance from each other, and support portions 42a and 42b for supporting the disk wheel 43 are formed. It is preferable that one of the two support portions 42a and 42b is formed thin so as not to interfere with the sealing cap 32.
[0027]
The disk-shaped wheel 43 is rotatably provided on a hinge shaft 44 provided at an end of the support portions 42a and 42b of the head 42. The disk body 43b and a cutting blade are provided on the outer peripheral surface of the body 43b. A portion 43a. The cutting blade portion 43a is formed so that the outer peripheral surface of the disk main body portion 43b is inclined, and its ridge line is deflected to the side of the support portion 42a having a small thickness to form a truncated cone. Make Grooves may be formed at a predetermined pitch on the outer peripheral surface of the cutting blade 43a.
[0028]
In the cutting device configured as described above, the disk wheel 43 is formed in a truncated cone shape, and the cutting blade portion 43a is adjacent to the thin support portion 42a. It can be prevented from being caught on the sealing cap 32. And since the said cutting blade part is deviated to the support part 42a side, a crack can be formed in the side close | similar to the sealing cap 32, Moreover, compared with what the said cutting blade part 43a inclines to both sides, a crack is generated. It can be formed sharp and deep.
[0029]
Although the present invention has been described with reference to the embodiments illustrated in the drawings, it is by way of example only and various modifications and equivalent different embodiments will occur to those skilled in the art. I understand that there is. Therefore, the true scope of the present invention should be determined by the appended claims.
[0030]
【The invention's effect】
As described above, the method and apparatus for cutting a substrate of an organic light emitting display device according to the present invention eliminates the need to apply a separate shock as in the related art by cutting after scribing using stress applied to the substrate. In addition, it is possible to prevent the cutting direction from being changed by the impact. Further, since the cutting blade of the cutting device is biased to one side, a portion close to the sealing cap can be cut.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view illustrating a method of cutting a substrate of a conventional organic light emitting display.
FIG. 2 is a side view showing the cutting method shown in FIG.
FIG. 3 is a perspective view illustrating a method and an apparatus for cutting a substrate of an organic light emitting display according to the present invention.
FIG. 4 is a view schematically illustrating a substrate cutting method according to the present invention;
FIG. 5 is a view schematically illustrating a substrate cutting method according to the present invention.
FIG. 6 is a view schematically illustrating a substrate cutting method according to the present invention.
[Explanation of symbols]
32 Sealing cap 40 Cutting device 41 Bag part 42 Heads 42a, 42b Support part 43 Wheel 43a Body part 44 Hinge axis 100 Substrate

Claims (8)

A plurality of organic electroluminescent portions are formed in a predetermined pattern on a single substrate, and a sealing cap for enclosing and sealing each of the organic electroluminescent portions is attached to the substrate, and stress is applied to the substrate by the sealing cap. The first stage,
Scribing the stressed substrate with a cutter using a cutter, and cutting the substrate with the stress acting on the substrate. 2. A substrate cutting apparatus for an organic light emitting display device, comprising: 2. The organic light emitting display as claimed in claim 1, further comprising the step of: adsorbing the stressed and bent substrate to a table to apply an additional stress to the substrate in the first step. Substrate cutting equipment. 3. The method according to claim 2, wherein, in the step of adsorbing the substrate, the suction of the substrate adsorbs the substrate at a portion corresponding to each organic electroluminescent unit. A first method in which a single substrate provided with a plurality of organic electroluminescent portions in a predetermined pattern and a sealing cap for enclosing and sealing each of the organic electroluminescent portions is attached to a table to apply stress in a cutting direction. Stages and
A second stage of using a cutter to scribe the stressed substrate;
Cutting the substrate by removing the attraction force applied to the substrate to eliminate the stress, thereby cutting the substrate. 5. The method according to claim 4, wherein in the first step of sucking the substrate, the sucking of the substrate sucks a substrate at a portion corresponding to each organic electroluminescent unit. . 5. The organic light emitting display as claimed in claim 4, wherein in the first step of adsorbing the substrate, an upper surface of the table for adsorbing the substrate is formed to have a predetermined curvature and the substrate is bent. Substrate cutting method. Cutting a substrate provided with a plurality of organic electroluminescent portions formed in a predetermined pattern and a sealing cap that wraps and seals each of the organic electroluminescent portions,
A ridge line of a cutting blade portion rotatably mounted on the head and formed on an outer peripheral surface of the head, the ridge line of which is deviated to one side from the center of the outer peripheral surface. A substrate cutting method for an organic light emitting display. 8. The method of claim 7, wherein the wheel on the disk is a truncated cone.

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