JP2004030236A - Ic packaged laminate body structure and ic card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a simple and inexpensive IC packaged laminate body structure which remarkably reduces a dynamic stress to an IC caused by adhesives and is adhered by the adhesives improved in insulation, heat resistance, durability, weather resistance and chemical resistance, and an IC card. <P>SOLUTION: In the IC packaged laminate body structure in which two sheets are adhered by the adhesives while locating an IC unit between the two sheets, the adhesives contain, as essential components, (A): hydrocarbon polymer of molecular weight 500-300,000 having one or more alkenyl groups in molecules, (B): hardener, and (C): curing catalyst. <P>COPYRIGHT: (C)2004,JPO

Description

注）エピオンＥＰ４００Ａ（鐘淵化学工業（株）製）、ＰＡＯ５０１０（出光興産（株）製）、スノーライトＳＳ（丸尾カルシウム（株）製）、ＮＮ５００（日東粉化工業（株）製）、タルクミクロエースＬ１（日本タルク工業（株）製）、トスパール１２０（東芝シリコーン（株）製）、マツモトマイクロスフェアーＭ６１０（松本油脂製薬（株）製）。
【００４３】
（実施例７）
上記実施例１の第一液及び第二液の代わりに、従来のエポキシ系接着剤であるセメダイン＃１５００（セメダイン（株）製）を用いその主剤及び硬化剤のそれぞれ各１００部に対し５０部の上記ホワイトンＳＢと２０部のトスパール１２０を加え上記と同様に攪拌、調製した。
【００４４】
（比較例１）
上記実施例に対し比較例として、接着剤として既存の二液型アクリル系接着剤であるセメダインＹ−６００（セメダイン（株）製）を用いた以外は実施例１と同様の条件にて試験した。
【００４５】
４．試験方法
上記第一液と第二液からなる二液型硬化性組成物をその混合率を１：１（重量比）として混合しＰＥＴフィルムの片面に３００ミクロンになるように塗布したのち、もう一方のＰＥＴフィルムを重ね合わせてＩＣユニットを封入していないこと以外は図１の構成を有する接着積層構造体を得た。使用したＰＥＴフィルムとしてはダイアフォイルＷ４０１Ｊ（三菱化学ポリエステルフィルム）厚み１８８ミクロンで表面無処理のものを用いた。但し、実施例７の接着剤組成物に対してはＰＥＴフィルムにコロナ放電処理をした市販の上記と同様の厚みのフィルムを使用した。
【００４６】
それらの接着積層構造体を常温で１週間放置後ＪＩＳＫ６８５４（接着剤のはくり試験法）に基づいて剥離試験を行った。また上記の条件にて、ＩＣユニットを封入していないこと以外は図１の構成を有する５５ｍｍ×９５ｍｍのカード型試験体を作製し、試験体を９０℃の恒温槽に１日放置した後、取り出して試験体の反り、歪み等外観変化を観察した。次に反り等の試験体と同様な試験体を紙用裁断機にて切断し、破断面の平滑さをルーペで観察した。破断面の平滑性の評価は目視で行った。
【００４７】
５．結果
結果を表２に示す。表２に示した如く、実施例１〜７の試験体はＩＣカード用に適度な剛性とたわみ性を持ち、良好な破壊状態を示し剥離強度も良好であった。また、実施例１〜６において、接着積層構造体のカードは試験片のそり、歪みなく良好な結果を得た。実施例７では試験片の反りが若干みられた。また、ＩＣカードの構造体として製造作業性に欠かせない試験片の切断適性は球状有機微粒子を添加した実施例４、６及び７では、添加していない実施例１〜３、５及び比較例１に比べ、特に著しく優れた結果を示した。比較例１は、剥離強度が低く、試験片の反りがみられた。
【００４８】
【表２】

【００４９】
【発明の効果】
以上述べたごとく、本発明によれば、炭化水素重合体を主成分とする接着剤を用いることにより、２枚のシートの間に接着剤を塗布接着する際に、接着剤が架橋構造体でありながらそれ自身可とう性を有するためシートの間にＩＣ等をはさみこみ、封止接着する場合硬化後もＩＣへの力学的ストレスが少ない。またシートの表面処理をしなくとも良好な接着性を有するためコロナ放電処理、プラズマ処理やアンカーコーティング材等オレフィンシートやＰＥＴシートに特有の工程が不要になるため工程改善やコスト低減につなげられる。さらに積層構造体からカード型に打ち抜く際に球状有機微粒子を添加混合することにより滑り性、固さを調節し機械作業性を改善することができる。
【００５０】
また、エポキシ系、アクリル系またはウレタン系接着剤に球状有機微粒子を添加混合した接着剤を用いることにより、カードに打ち抜く際の切断面を平滑でバリの発生を少なくし、滑り性、固さを調節し機械作業性を改善することができる。
【図面の簡単な説明】
【図１】本発明のＩＣ搭載積層構造体の一例を示す断面概略図である。
【符号の説明】
１０：ＩＣ搭載積層構造体、１２：シート材、１４：ＩＣユニット、１６：接着剤。[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an integrated circuit (IC) in which an integrated circuit (IC) unit having an integrated circuit (IC) chip and an antenna is disposed between two sheet materials and the two sheet materials are bonded with an adhesive. The present invention relates to an improvement in a mounting laminated structure and an IC card using the IC mounting laminated structure.
[0002]
[Related technology]
The IC card is used for, for example, an employee card, a membership card, a coupon, a commuter pass, an admission ticket, a prepaid card, a credit card, and the like. As such a card, there is a card in which a thermosetting resin is applied to both sides of two sheet materials, an IC unit is inserted therebetween, and the sheet materials are combined and heated and pressed. Conventionally, adhesive compositions of epoxy, urethane and phenol have been used in the electric and electronic fields, but these epoxy, acrylic and urethane adhesive compositions have good adhesiveness, durability and flexibility. Therefore, it has been used for the purpose of protecting the IC, improving the durability, and further maintaining the shape and imparting flexibility of the product on which the IC is mounted.
[0003]
However, these epoxy-based, acrylic-based, and urethane-based adhesive compositions suffer from volume shrinkage due to a curing reaction during bonding, causing distortion stress between the sheet material and the IC unit, causing sheet warpage and deformation. Printing cannot be performed on the surface, and adverse effects on the IC have occurred due to mechanical stress. Furthermore, when the above-mentioned adhesive composition is used, when the card is punched, smoothness cannot be obtained on the cut surface or the resin sticks to the edge portion of the cutting blade, which causes a problem in mechanical workability.
[0004]
In order to alleviate curing shrinkage in adhesives for such uses, rubber or a flexible resin is added to an adhesive composition such as an epoxy-based, acrylic-based, urethane-based, or phenol-based adhesive (JP-A-58-4261). Japanese Patent Application Laid-Open No. 7-335731 discloses an example of imparting flexibility and an example of adding an inorganic substance such as silica or calcium carbonate to reduce curing shrinkage. More specifically, there is an example in which one surface of an IC is bonded to a base material sheet and the other surface is processed so as to be in a non-bonded or weakly bonded state with an adhesive composition (JP-A-2000-76403).
[0005]
Further, sheet materials used in the present IC card include PET (polyethylene terephthalate), PET-G (polyethylene glycol-modified PET), ABS, polycarbonate, and the like. Even if they are bonded together using an adhesive, they do not adhere at all or have low adhesion, so physical surface treatment such as corona discharge treatment or plasma discharge treatment, or primer (anchor coat material) applied to the surface layer and chemically Has improved adhesion.
[0006]
[Problems to be solved by the invention]
However, the above-mentioned technology also has the following problems to be improved. In other words, since these methods are mainly intended to reduce the strain stress between the adhesive and the IC and the sheet substrate, the original performance such as adhesion, durability, insulation, heat resistance, chemical resistance, etc. In many cases, it was sacrificed, and it was not always versatile as an IC adhesive.
[0007]
In addition, the method disclosed in Japanese Patent Application Laid-Open No. 2000-76403 adds an extra step for forming a non-adhesive or weakly-adhesive film, which complicates the manufacturing process, and is not necessarily an easy and inexpensive IC card or adhesive. It was not a method of providing a laminate.
[0008]
In addition, physically or chemically performing surface treatment on a plastic sheet for a sheet material of an IC card in order to improve adhesiveness not only requires a special process for sheet treatment, but also leads to an increase in cost. I was Further, in the case of a method such as corona treatment, the surface treatment state is sometimes maintained for only several months, so that it is difficult to save the material, or the application of a primer (anchor coat material) increases the material cost, so the material cost is also extra. Was. Therefore, also in this aspect, the conventional method cannot always be said to be an easy and inexpensive method for providing an IC card or an adhesive laminate.
[0009]
A first object of the present invention is to greatly reduce the mechanical stress caused by the adhesive to the IC, and to easily bond the IC with an adhesive having excellent insulation, heat resistance, durability, weather resistance and chemical resistance. It is an object of the present invention to provide a low-cost, IC-mounted laminated structure and an IC card.
[0010]
A second object of the present invention is to provide a cut surface smoothness which cannot be avoided conventionally when manufacturing an IC mounting laminated structure such as an IC card using an adhesive such as an epoxy-based, acrylic-based, or urethane-based adhesive. An object of the present invention is to provide an IC-mounted laminated structure and an IC card which can solve the problem and improve the workability of the machine.
[0011]
[Means for Solving the Problems]
In order to solve the above-mentioned problems, a first aspect of the IC-mounted laminated structure of the present invention is to bond two sheet materials with an adhesive in a state where an IC unit is disposed between the two sheet materials. In the laminated structure mounted with an IC, the adhesive contains the following components (A), (B) and (C) as essential components.
(A) a hydrocarbon polymer having a molecular weight of 500 to 300,000 having one or more alkenyl groups in the molecule; (B) a curing agent; and (C) a curing catalyst.
As the component (A) used in the present invention, those having a main chain skeleton of an isobutylene-based polymer are preferably used.
[0013]
The component (B) used in the present invention is not particularly limited as long as it is a curing agent, but it is preferable to use a curing agent comprising a hydrocarbon compound having at least one hydrosilyl group in a molecule.
[0014]
The component (C) used in the present invention is not particularly limited, and any component can be used. It is preferable to use a platinum metal complex.
[0015]
By further blending the spherical organic fine particles (D) with the adhesive, after bonding, the slipperiness and hardness when forming into a card type by a punching machine are appropriately adjusted, and mechanical workability is obtained. Can be
[0016]
According to a second aspect of the IC-mounted laminated structure of the present invention, two sheet materials are bonded with an epoxy-based, acrylic-based, or urethane-based adhesive in a state where an IC unit is disposed between the two sheet materials. The present invention is characterized in that spherical organic fine particles (D) are blended in the adhesive.
[0017]
An IC card according to the present invention is characterized by comprising the above-mentioned IC mounting laminated structure.
[0018]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. However, these embodiments are merely illustrative, and various modifications can be made without departing from the technical idea of the present invention. Not even.
[0019]
FIG. 1 is a schematic cross-sectional view showing one structural example of an IC mounting laminated structure of the present invention. As shown in FIG. 1, the IC-mounted laminated structure 10 of the present invention adheres the two sheets 12, 12 with the IC unit 14 disposed between the two sheets 12, 12. It is bonded by the agent 16. Examples of the sheet material 12 used in the present invention include PET (polyethylene terephthalate), APET (amorphous PET), PET-G (polyethylene glycol-modified PET), ABS (acrylonitrile butadiene-styrene), PC (polycarbonate), and chloride. Resins such as vinyl resins and polymer alloys can be used.
[0020]
The adhesive 16 can be used as long as it has the following components (A), (B) and (C) as essential components, and is not particularly limited.
(A) a hydrocarbon polymer having a molecular weight of 500 to 300,000 having one or more alkenyl groups in the molecule (B) a curing agent (C) a curing catalyst
As the component (A), a main agent containing a polymer component having at least one or more crosslinkable functional groups in a living radical polymer of a radically polymerizable vinyl monomer as a main component is preferable. A liquid resin having a main chain skeleton of polyisobutylene and having at least one alkenyl group in the molecule. More specifically, for example, Epion EP600A, Epion EP403A or Epion EP203A (manufactured by Kaneka Chemical Co., Ltd.) can be used.
[0022]
As the component (B), specifically, a hydrocarbon compound having one or more hydrosilyl groups in a molecule is preferable, and a compound having 2 to 15 hydrosilyl groups in a molecule is more preferable. More specifically, CR-300 (manufactured by Kanegafuchi Chemical Industry Co., Ltd.) or the like can be used.
[0023]
As the component (C), specifically, a hydrosilylation catalyst or the like is used, for example, a platinum-phosphine complex, for example, Pt (PPh ₃ ) ₄ , Pt (PBu ₃ ) ₄ ; a platinum-vinylsiloxane complex, for example, , Ptn (ViMe ₂ SiMe ₂ Vi) n; Pt [(MeViSiO) ₄ ] m; platinum-phosphine complex, for example, Pt [P (OPh) 3] 4; Pt [P (OBu) 3)] 4; , Me represents a methyl group, Bu represents a butyl group, Vi represents a vinyl group, Ph represents a phenyl group, and n and m each represent an integer. More specifically, HS-KA (manufactured by Degussa Japan KK) or the like can be used.
[0024]
Each of the above-mentioned components may be separately blended into a three-pack type of (A), (B) and (C). However, when a two-pack unit is used, (B) is blended into the first liquid, and (C) (A) can be blended with the second liquid and blended into one or both of the first and second liquids.
[0025]
In order to make the rigidity of the laminated structure 10 after the lamination with the sheet material 12 appropriate, and to improve the mechanical suitability when punching and molding the laminated structure 10 into a card mold, an inorganic filler is added to the adhesive 16. Is preferably further added. As the inorganic filler, calcium carbonate, clay, aluminum hydroxide, talc, glass powder, barium sulfate and the like can be arbitrarily used. The particle size of the inorganic filler is preferably 0.1 to 5 μm, and it is preferable to mix 10 to 200 parts by weight with respect to 100 parts by weight of the adhesive composition. Unless inorganic fillers are added, it is difficult to obtain sufficient rigidity when using the laminated structure as a card, and when punching and molding into a card mold, the cured resin film tends to stick to the edge of the punching machine and stains on the edge Easy to cause. If the particle size of the inorganic filler is smaller than 0.1 μm, the viscosity of the compounded composition increases, making application difficult, and if the particle size is larger than 5 μm, a problem may occur in the smoothness of the surface of the card.
[0026]
As the component (D), spherical organic fine particles such as polyester, acrylic resin, and silicone resin are appropriately added to the adhesive 16 to adjust the slipperiness and hardness during punching, thereby improving workability and machine suitability. can do. Since the spherical organic fine particles have an effect of making the cut surface physically slippery during cutting, a true spherical shape is preferable. A material such as a silicone resin having a high surface energy is particularly preferable. The number of parts of the spherical organic fine particles is preferably from 1 to 50 parts by weight, particularly preferably from 5 to 30 parts by weight, per 100 parts by weight of the adhesive composition.
[0027]
Further, in order to improve the efficiency of the coating and laminating steps, the adhesive 16 used in the present invention, besides the components (A), (B) and (C), a plasticizer, an adhesion-imparting agent, an antioxidant, and an ultraviolet ray. Various additives such as an absorbent, an antifoaming agent, a viscosity modifier, a filler, and a pigment may be appropriately added.
[0028]
As the above-mentioned foaming inhibitor, any substance having a foaming preventing action can be used, and there is no particular limitation. As the inorganic material, zeolite (trade name, molecular sieve 3A, 4A, 5A, manufactured by Union Showa KK) , Calcium oxide, silica gel, magnesium oxide and the like. It is desirable that these be dried before use. Examples of the organic material include silane compounds. The amount used is preferably 0.05 to 20 parts by weight, more preferably 0.5 to 10 parts by weight, based on 100 parts by weight of the adhesive composition. Two or more of these foam inhibitors may be used in combination.
[0029]
As the adhesion imparting agent, a silane coupling agent or the like is preferably used. Specific examples thereof include, for example, r-glycidoxypropyltrimethoxysilane and β- (3,4 epoxycyclohexyl) ethyltrimethoxysilane, which can be used without affecting the inhibition of the hydrosilylation addition curing. Not necessarily.
[0030]
The filler is not particularly limited, but a thermally conductive filler can be used. The heat conductive filler is added when it is necessary to impart thermal conductivity, and may be any substance that imparts thermal conductivity. There is no particular limitation, but beryllium oxide, aluminum oxide, magnesium oxide , Aluminum nitride, boron nitride, aluminum hydroxide, and the like. Among them, aluminum hydroxide is inexpensive, low in hardness, and low in abrasion, so that it is suitable for use with a discharger. The use amount is preferably from 20 to 90 parts by weight, more preferably from 50 to 80 parts by weight, based on 100 parts by weight of the adhesive composition.
[0031]
In the present invention, the main component of the adhesive 16 itself is a radical polymer having flexibility in bonding the two sheets 12, 12, so that the mechanical stress caused by the adhesive on the IC is greatly reduced. it can. In addition, it reacts with the curing agent component to form a cross-linked structure, so it has excellent insulation, heat resistance, durability, weather resistance, and chemical resistance, and has flexibility after curing, so it has a mechanical stress due to the adhesive to IC. Does not matter.
[0032]
The adhesive containing a hydrocarbon polymer as a main component has excellent adhesion to PET, ABS, polycarbonate, vinyl chloride, etc. used for sheet materials. Since such surface treatment and coating of a primer (AC agent) are not required, the number of steps can be greatly reduced, and the manufacturing cost can be reduced. By mixing, reacting, and curing a curing agent and a curing catalyst with respect to the main component containing these hydrocarbon polymers as main components, it is possible to manufacture an easy and inexpensive IC-mounted laminated structure.
[0033]
As a laminated structure product on which these ICs are mounted, application to portable personal computers, hard disk drives, electronic organizers, mobile phones, IC cards, and the like is useful.
[0034]
That is, in the production of a so-called IC card in which an IC unit is sandwiched between two sheets and sealed and adhered, the IC-mounted laminated structure of the present invention has less warpage and distortion of the sheet, and the surface of a conventionally used sheet material. No processing or primer is required, and the cut surface when punching into a card is smooth and burrs are less generated, which can greatly contribute to improvement in production efficiency and cost reduction.
[0035]
In the above-described embodiment, the case where an adhesive mainly composed of the hydrocarbon polymer is used as the adhesive 16 has been described. However, instead of the adhesive, a structural laminate of this type is conventionally used. It is also possible to mix the spherical organic fine particles (D) with the used epoxy-based, acrylic-based or urethane-based adhesive and use it.
[0036]
By mixing the spherical organic fine particles (D) with the conventional adhesive composition described above and using the same, it is possible to produce an IC-mounted laminated body having a smooth cut surface when punching into a card and generating less burrs. It is possible to improve the product yield, and it is possible to adjust the slipperiness and hardness when forming into a card type by a punching machine by appropriately changing the properties and the addition amount of the spherical organic fine particles. This has the advantage that workability and machine suitability can be improved.
[0037]
【Example】
Hereinafter, the present invention will be described by way of examples. However, it goes without saying that the present invention is not limited to these examples.
[0038]
(Example 1)
1. Preparation of Common Base Solution for First Solution and Second Solution As shown in Table 1, Epion EP600A (trade name of a liquid resin having at least one or more alkenyl group in the molecule, manufactured by Kanegafuchi Chemical Industry Co., Ltd.) 100 parts by weight, 100 parts by weight of Diana process oil PW380 (paraffin-based process oil, manufactured by Idemitsu Kosan Co., Ltd.), 100 parts by weight of Sealets 300 (surface-treated calcium carbonate, manufactured by Maruo Calcium Co., Ltd.), talc LMR (Japan 50 parts by weight of Talc Industries Co., Ltd.) and 100 parts by weight of Whiten SB (heavy calcium carbonate, manufactured by Shiraishi Calcium Co., Ltd.) are added, mixed and stirred for 10 minutes with a Dalton-type universal mixer, and then ethyl silicate # is added. 28 (manufactured by Colcoat Co., Ltd.) was added and similarly mixed and stirred for 10 minutes. Thereafter, mixing was performed for 2 hours while stirring under reduced pressure (vacuum degree: 10 mmHg) at room temperature to prepare a common base liquid of the first liquid and the second liquid (hereinafter, unless otherwise specified, the number of parts is parts by weight).
[0039]
2. Preparation of First Liquid 100 parts of Diana process oil, 2 parts of a 50% methanol solution of aluminum acetylacetonate and 0.3 part of a xylene solution of a platinum divinyltetramethyldisiloxane complex were added and mixed to prepare a platinum catalyst solution. 15 parts of this platinum catalyst solution was added to 300 parts of the common base liquid, and mixed well under a nitrogen stream.
[0040]
3. Preparation of second liquid KB-403 (silane compound, manufactured by Shin-Etsu Chemical Co., Ltd.) in 100 parts of CR-300 (hydrocarbon compound having at least one hydrosilyl group in the molecule, manufactured by Kaneka Chemical Industry Co., Ltd.) 10 parts of KBM503 (silane compound, manufactured by Shin-Etsu Chemical Co., Ltd.) and 10 parts of allyltrimethoxysilane were added to prepare a curing agent solution. 20 parts of this curing agent solution was added to 300 parts of the common base liquid, and mixed well under a nitrogen stream.
[0041]
(Examples 2 to 6)
A base liquid common to the first liquid and the second liquid from Example 2 to Example 6 was prepared in the same manner as in Example 1 except that the mixing ratio of the compounds shown in Table 1 was used. Each of the first liquid and the second liquid was prepared in the same procedure as in Example 1 by adding the same platinum catalyst and curing agent liquid as in Example 1 to each base liquid.
[0042]
[Table 1]

Note) Epion EP400A (manufactured by Kanegafuchi Chemical Industry Co., Ltd.), PAO5010 (manufactured by Idemitsu Kosan Co., Ltd.), Snow Light SS (manufactured by Maruo Calcium Co., Ltd.), NN500 (manufactured by Nitto Powder Chemical Co., Ltd.), talc Microace L1 (manufactured by Nippon Talc Corporation), Tospearl 120 (manufactured by Toshiba Silicone Co., Ltd.), and Matsumoto Microsphere M610 (manufactured by Matsumoto Yushi Pharmaceutical Co., Ltd.).
[0043]
(Example 7)
In place of the first liquid and the second liquid of Example 1, a conventional epoxy-based adhesive, Cemedine # 1500 (manufactured by Cemedine Co., Ltd.) was used and 50 parts of the main agent and 50 parts of the curing agent were used for each. Of the above whiten SB and 20 parts of Tospearl 120 were added and stirred and prepared in the same manner as above.
[0044]
(Comparative Example 1)
As a comparative example, a test was performed under the same conditions as in Example 1 except that Cemedine Y-600 (manufactured by Cemedine Co., Ltd.), which is an existing two-part acrylic adhesive, was used as the adhesive. .
[0045]
4. Test Method The two-part curable composition composed of the first liquid and the second liquid was mixed at a mixing ratio of 1: 1 (weight ratio), and applied to one side of a PET film so as to have a thickness of 300 μm. One laminated PET film was obtained to obtain an adhesive laminated structure having the configuration shown in FIG. 1 except that the IC unit was not sealed. The PET film used was Diafoil W401J (Mitsubishi Chemical polyester film) having a thickness of 188 microns and no surface treatment. However, for the adhesive composition of Example 7, a commercially available film having the same thickness as that described above obtained by subjecting a PET film to a corona discharge treatment was used.
[0046]
After leaving these bonded laminated structures at room temperature for one week, a peeling test was performed based on JIS K 6854 (adhesive peeling test method). Under the above conditions, a card-shaped specimen of 55 mm × 95 mm having the configuration shown in FIG. 1 was prepared except that the IC unit was not sealed, and the specimen was left in a thermostat at 90 ° C. for one day. The specimen was taken out and the appearance change such as warpage and distortion of the specimen was observed. Next, a specimen similar to the specimen such as warpage was cut by a paper cutter, and the smoothness of the fracture surface was observed with a loupe. Evaluation of the smoothness of the fractured surface was performed visually.
[0047]
5. Table 2 shows the results. As shown in Table 2, the test specimens of Examples 1 to 7 had appropriate rigidity and flexibility for IC cards, showed a good destruction state, and had good peel strength. Further, in Examples 1 to 6, the card having the adhesive laminated structure obtained good results without warping or distortion of the test piece. In Example 7, the warpage of the test piece was slightly observed. In addition, the cutting suitability of a test piece, which is indispensable for manufacturing workability as a structure of an IC card, was determined in Examples 4, 6, and 7 in which spherical organic fine particles were added, in Examples 1 to 3, and Comparative Examples in which spherical organic fine particles were not added. Compared to No. 1, the results were particularly excellent. In Comparative Example 1, the peel strength was low and the test piece was warped.
[0048]
[Table 2]

[0049]
【The invention's effect】
As described above, according to the present invention, by using an adhesive containing a hydrocarbon polymer as a main component, when the adhesive is applied and bonded between two sheets, the adhesive has a crosslinked structure. In spite of the fact that the sheet itself has flexibility, an IC or the like is sandwiched between sheets, and in the case of sealing and bonding, the mechanical stress on the IC after curing is small. In addition, since it has good adhesiveness without surface treatment of the sheet, corona discharge treatment, plasma treatment, and steps specific to olefin sheets and PET sheets, such as an anchor coating material, become unnecessary, leading to process improvement and cost reduction. Furthermore, by adding and mixing the spherical organic fine particles when punching the laminated structure into a card type, the slipperiness and hardness can be adjusted to improve the mechanical workability.
[0050]
In addition, by using an adhesive obtained by adding and mixing spherical organic fine particles to an epoxy-based, acrylic-based or urethane-based adhesive, the cut surface when punching into a card is smoothed, burrs are reduced, and slipperiness and hardness are improved. Can be adjusted to improve machine workability.
[Brief description of the drawings]
FIG. 1 is a schematic cross-sectional view showing an example of an IC mounting laminated structure of the present invention.
[Explanation of symbols]
10: IC mounting laminated structure, 12: sheet material, 14: IC unit, 16: adhesive.

Claims (7)

In an IC mounting laminated structure in which an IC unit is disposed between two sheet materials and the two sheet materials are bonded by an adhesive, the adhesive has the following components (A), (B) and An IC-mounted laminated structure comprising (C) as an essential component.
(A) a hydrocarbon polymer having a molecular weight of 500 to 300,000 having one or more alkenyl groups in the molecule (B) a curing agent (C) a curing catalyst The IC-mounted laminated structure according to claim 1, wherein the hydrocarbon polymer (A) is an isobutylene-based polymer. 3. The IC-mounted laminated structure according to claim 1, wherein the curing agent (B) is a hydrocarbon compound having at least one hydrosilyl group in a molecule. The IC-mounted laminated structure according to any one of claims 1 to 3, wherein the curing catalyst (C) is a platinum metal-based complex. The IC-mounted laminated structure according to any one of claims 1 to 4, wherein spherical organic fine particles (D) are further added to the adhesive. In an IC mounting laminated structure in which an IC unit is disposed between two sheet materials and the two sheet materials are bonded with an epoxy-based, acrylic-based, or urethane-based adhesive, spherical organic fine particles are added to the adhesive. An IC-mounted laminated structure comprising (D). An IC card comprising the IC-mounted laminated structure according to claim 1.

Images