JP2004022047A - Disk drive and head suspension assembly - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a disk drive whose head suspension assembly does not deform due to the heat generated by the head drive circuit component. <P>SOLUTION: The disk drive has a magnetic head 2 to record or reproduce data on the recording surface of the disk rotated by a motor following the drive signals, a head drive circuit components 5 to supply the drive signals to the head 2, an arm 7 supporting the head 2, an opening 16 provided on the arm 7, and a heat absorbing and radiating material 17 absorbing the heat generated by the head drive circuit component 5. The head drive component 5 and the heat absorbing and radiating material 17 are inserted into the opening 16 to complete the head suspension assembly. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a magnetic disk drive used as a peripheral device for a computer.
[0002]
[Prior art]
As a prior art of the present invention, there is a magnetic head suspension assembly and a magnetic disk drive equipped with a preamplifier and a magnetic head disclosed in Japanese Patent Application Laid-Open No. 2001-28112.
[0003]
According to this conventional technique, heat is conducted from the terminals of the circuit components of the preamplifier to the traces and the suspension, and the suspension is deformed by the heat, causing a change in the size of the gap between the magnetic disk and the magnetic head, and the floating of the magnetic disk. A change in the size of the gap with the magnetic head due to deformation of the suspension, which causes a tilt in the attitude, and a tilt in the flying attitude with respect to the magnetic disk has the problem that the waveform characteristics of the recording signal deteriorate as much as possible. .
[0004]
Also, since the head drive circuit components such as the preamplifier are mounted so as to protrude above the suspension, the head drive circuit components mounted on the suspension assembly when the suspension assembly is applied to the magnetic disk drive are replaced with the magnetic disk drive device. The head drive circuit component collides with the magnetic disk due to the shock generated inside.
[0005]
In recent years, as a host device, a thin information processing device such as a laptop (notebook) type computer or a personal digital assistant has become mainstream.
[0006]
Magnetic disk drives housed in these laptop computers, personal digital assistants and the like tend to be miniaturized.
[0007]
The space inside the housing of the magnetic disk drive is extremely small, and the amount of data that can be stored on one magnetic disk increases as the gap between the magnetic disk and the magnetic head is as close to zero as possible.
[0008]
Therefore, it is desirable that the gap between the suspension and the magnetic disk is small, and that the thickness of the suspension in the height direction is also small in order to increase the amount of data that can be stored in the magnetic disk.
[0009]
[Problems to be solved by the invention]
As described above, the conventional magnetic disk drive has a problem that heat generated by a head drive circuit component, which is a heat source, is conducted to a head suspension on which a magnetic head is mounted, causing deformation of the suspension and deteriorating characteristics. there were.
[0010]
SUMMARY OF THE INVENTION It is an object of the present invention to provide a good magnetic disk drive in which a suspension is not deformed by heat generated by a head drive circuit component.
[0011]
[Means for Solving the Problems]
In order to solve the above problems, the disk drive of the present invention is
A disk drive for recording or reproducing digital data on a recording surface of a disk,
A motor for rotating the disk,
A head for recording or reproducing the digital data on the recording surface of the disk rotated by the motor;
A head drive circuit component that supplies a drive signal for recording the digital data to the head, and amplifies a reproduction signal from a disc;
An arm supporting the head;
A heat absorbing and radiating member that contacts the head driving circuit component to absorb and radiate heat generated by the head driving circuit component;
An opening provided in the arm, into which the head driving component and the heat absorbing and radiating member are inserted, is provided.
[0012]
In order to solve the above problems, a head suspension assembly according to the present invention includes:
A head suspension assembly used in a disk drive device that includes a motor for rotating the disk and that records or reproduces digital data on a recording surface of the disk rotated by the motor,
A head for recording or reproducing the digital data on the recording surface of the disk rotated by the motor;
A head drive circuit component that supplies a drive signal for recording the digital data to the head, and amplifies a reproduction signal from a disc;
An arm supporting the head;
A heat absorbing and radiating member that contacts the head driving circuit component to absorb and radiate heat generated by the head driving circuit component;
An opening into which the head drive component and the heat absorbing and radiating member are inserted is provided.
[0013]
BEST MODE FOR CARRYING OUT THE INVENTION
FIGS. 1 to 5 are used for describing an embodiment of the present invention.
[0014]
FIG. 1 is a perspective view of a magnetic disk drive.
[0015]
The magnetic disk drive device 30 includes a base frame 31, a magnetic disk 32 rotatably supported around a disk rotation axis 35 of a spindle motor 33, and a head suspension assembly 1 having a magnetic head 2 for data recording and reproduction mounted at the tip.
[0016]
Further, the magnetic disk drive 30 includes a rotating shaft 39 rotatably supporting the head suspension assembly 1 in a rotating shaft hole 36 of the head suspension assembly 1, a voice coil motor 34 for applying a driving force to the rotating shaft 39, and Having.
[0017]
The magnetic head 2 includes an MR (Magneto Resistive) type head as a reproducing head and a thin film head as a recording head.
[0018]
The magnetic head 2 is supported above the magnetic disk 33 by the rotation of the head suspension assembly 1 around the carriage motor 34, and is supported in the direction of rotation 38.
[0019]
The head suspension assembly 1 is provided with a head IC chip 5, which is a head drive circuit component for amplifying and supplying a drive signal for recording or reproduction to the magnetic head 2.
[0020]
The head IC chip 5 supplies a drive signal for recording the digital data to the magnetic head 2 and has a function as an amplifier for amplifying a reproduction signal from a disk.
[0021]
The head IC chip 5 functions as an amplifier.
[0022]
The present invention has new and useful features as a result of devising a method of arranging the head IC chip 5 with respect to the head suspension assembly 1.
[0023]
FIG. 2 is used to describe the first embodiment of the method for arranging the head IC chips in the head suspension assembly 1.
[0024]
FIG. 2 is a top view of the head suspension assembly.
[0025]
In FIG. 1, a head suspension assembly 1 includes a magnetic head 2, a slider 3, a suspension composed of a trace 4 and a load beam 6, an arm 7, and a head IC chip 5.
[0026]
The trace 4 is a circuit board having a multilayer structure enclosing a circuit pattern for supplying a signal or power to the head IC chip 5.
[0027]
The load beam 6 is held by an arm 7, and the trace 4 is bonded on the load beam 6 and the arm 7.
[0028]
The circuit pattern enclosed in the trace is electrically connected to the magnetic head 2 and the ceramic substrate 17, and the circuit pattern is supplied from a circuit in the magnetic disk drive 1 via a connection terminal 8 protruding from the arm 7 from a power source or Receive signal supply.
[0029]
Further, the arm 7 is provided with a rotary shaft hole 36 for fitting a rotary shaft 39 that rotates by the driving force of the voice coil motor.
[0030]
The rotating shaft 39 is rotatably supported by a ball bearing bearing, and rotates at a rotating shaft hole 36 by the driving force of the voice coil motor transmitted to the arm 7.
[0031]
An opening 16 is provided in the arm 7, and a hole corresponding to the shape of the opening 16 is also provided in the trace 4, and the trace 4 is arranged on the arm 7. The head IC chip 5 mounted on the trace 4 is entirely inserted into the opening 16.
[0032]
Next, a detailed configuration of the present invention will be described with reference to FIGS.
[0033]
FIG. 3 is a sectional view of the arm 7 according to the first embodiment of the present invention.
[0034]
In the figure, a trace 4 is mounted on an arm 7. The trace 4 has a four-layer structure including a carver film 10, a copper foil 11, a base film 12, and a suspension 13.
[0035]
As described above, the head IC chip 5 is mounted on the trace 4 so as to be inserted into the opening 16.
[0036]
The head IC chip 5 mounted on the trace 4 is adhered to the ceramic substrate 17 via a high thermal conductivity resin 21 made of Ag (silver) paste containing Ag (silver) particles.
[0037]
The circuit pattern of the signal line is arranged on the ceramic substrate 17, and the head IC chip 5 and the circuit pattern are electrically connected via the bonding wires 20.
[0038]
In this way, the head IC chip 5 as a head driving component and the ceramic substrate 17 as a heat absorbing and radiating member are inserted into the opening 16 provided in the arm 7.
[0039]
Further, the head IC chip 5 and the bonding wires are sealed with a resin 22. By sealing the head IC chip 5 with the resin 22 in this manner, the adhesive strength of the head IC chip 5 to the ceramic substrate 17 is increased, and the circuit surface is protected.
[0040]
The trace 4 is provided with the opening 16 as described above, and the ceramic substrate 17 is electrically connected to the copper foil 11 of the trace 4 by solder 23 so that the surface is exposed from the opening 16.
[0041]
The ceramic substrate 17 is a member having high thermal conductivity. The adhesive bonding the head IC chip 5 and the ceramic substrate 17 contains Ag (silver) particles in order to increase the thermal conductivity.
[0042]
When the head IC chip 5 is driven by a drive signal obtained from the signal line of the trace 4, the head IC chip generates a large amount of heat due to the internal resistance when a write current is passed.
[0043]
The heat generated by the head IC chip 5 is efficiently conducted to the ceramic substrate 17 via the resin 21 containing Ag (silver) particles.
[0044]
Since the surface of the ceramic substrate 17 is exposed and is in contact with the outside air in the magnetic disk drive 30, the heat conducted to the ceramic substrate 17 is released from the surface of the ceramic substrate 17 into the outside air.
[0045]
The heat generated by the head IC chip 5 is absorbed by the ceramic substrate 17 functioning as a heat sink.
[0046]
Further, the ceramic substrate 17 is air-cooled by the outside air in the magnetic disk drive device 30, and the heat transmitted to the ceramic substrate 17 is also released into the outside air with high efficiency.
[0047]
Further, during an access operation in which the magnetic disk drive 30 performs data recording / reproduction with respect to the magnetic disk 32, an air current generated by rotation of the magnetic disk comes into contact with the ceramic substrate 17 and heat absorbed by the ceramic substrate 17 is absorbed. Is released into the outside air through the contacted airflow.
[0048]
In this way, the heat generated by the head IC chip 5 is efficiently radiated to the outside air via the ceramic substrate 17, so that the heat transmitted to the arm 7 is extremely reduced, and the head including the arm 7 is minimized. It is possible to effectively prevent thermal deformation of components constituting the suspension assembly 1.
[0049]
In FIG. 3, an example of connection between the trace and the ceramic substrate by wire bonding has been described, but a connection method using bumps as shown in FIG. 4 is also applicable.
[0050]
FIG. 4 is a sectional view of the arm 7 according to the second embodiment of the present invention.
[0051]
Also in the second embodiment, the head IC chip 5 is electrically connected to the ceramic substrate 17. Similarly, the circuit pattern of the ceramic substrate 17 is also electrically connected to the circuit pattern of the trace 4 provided on the arm 7.
[0052]
However, the point different from the cross-sectional view shown in FIG. 3 is that the head IC chip 5 is electrically connected to the circuit pattern of the ceramic substrate 17 via a bump 14 made of solder or a metal such as Au (gold). It is.
[0053]
The bumps 14 are heated by a heating device such as reflow to heat the head IC chip into a circuit pattern on the ceramic substrate 17 and immediately melt and immediately solidify to electrically connect the signal line inside the head IC chip and the circuit pattern on the ceramic substrate 17. Connect to
[0054]
Further, a resin 15 composed of an underfill is injected into a gap between the ceramic substrate 17 and the head IC chip 5.
[0055]
Further, the head IC chip 5 connected to the ceramic substrate 17 is covered with a heat dissipation cover 9 made of ceramic. Specifically, the heat dissipation cover 9 is fixed to the ceramic substrate 17 via an adhesive 25.
[0056]
The heat dissipating cover 9 is provided so as to contact the outside air in the magnetic disk drive 30 in the opening 16.
[0057]
The resin 24 containing Ag particles is also injected into the gap between the heat radiation cover 9 and the head IC chip 5. The ceramic substrate 17 is connected to the copper foil 11 of the trace 4 by solder 23 so that the surface is exposed from the opening 16 as in the case of FIG.
[0058]
Notable effects of the second embodiment include not only the air cooling effect due to the heat generated in the head IC chip 5 being conducted to the outside air via the ceramic substrate 17 but also the heat generated from the head IC chip 5. Is transmitted to the heat dissipation cover 9 via the resin 24, and the air cooling effect released from the surface of the heat dissipation cover 9 to the outside air is also realized in the present embodiment.
[0059]
As described above, in the second embodiment, heat is conducted from both the ceramic substrate 17 and the ceramic heat dissipation cover 9 to the outside air, so that a higher cooling effect can be obtained.
[0060]
It is desirable to arrange the head IC chip 5 that generates a large amount of heat in the magnetic disk drive 30 in a position where the head IC chip 5 contacts the outside air as much as possible. Even if the head IC chip 5 is arranged in the opening 16 in the head suspension assembly 1 with a relatively small amount, a sufficient cooling effect can be obtained.
[0061]
Further, placing the head IC chip 5 in the opening 16 can shorten the dimension of the head suspension assembly 1 in the height direction as compared with the case where the head IC chip 5 is disposed on the head suspension assembly 1. And contribute to miniaturization of parts as much as possible.
[0062]
Further, since the head IC chip 5 is connected to the copper foil 11 of the trace 4 via the solder 23, the head IC chip 5 can be easily removed from the head suspension assembly 1.
[0063]
By simply peeling the solder 23, the defective head IC chip 5 can be easily removed. At the time of removal, unnecessary stress does not occur in the head suspension assembly 1.
[0064]
In the head suspension assembly 1, even if a defect occurs in the head IC chip 5, only the head IC chip 5 can be replaced. Therefore, parts such as the arm 7 constituting the head suspension assembly 1 can be reused. is there.
[0065]
Next, FIG. 5 will be used to describe a third embodiment of the present invention, and FIG. 1 will be further referred to.
[0066]
FIG. 5 is a top view of the head suspension assembly 1 according to the third embodiment of the present invention.
[0067]
The feature of the third embodiment is that the opening 16 is provided at a position closer to the rotation axis 35 of the spindle motor 33 for rotating the disk than the longitudinal center line 37 of the arm 7 of the head suspension assembly 1. Have been.
[0068]
The head IC chip 5 and the ceramic substrate 17 inserted into the opening 16 are also provided at positions offset from the longitudinal center line 37 of the arm 7 toward the rotation axis 35 of the disk motor for rotating the disk. Will be done.
[0069]
Since the head IC chip 5 is offsetly arranged on the arm 7, the trace 4 enclosing a circuit pattern used for supplying a signal or supplying power to the head IC chip 5 is also replaced with the head IC chip 5. Are arranged so as to bypass the center line 37 in accordance with the position of.
[0070]
As described above, when the disk 32 shown in FIG. 1 rotates, an airflow is generated in the magnetic disk drive 30.
[0071]
The head suspension assembly 1 including the arm 7 swings in the rotation direction 38 to access an arbitrary position on the disk 32.
[0072]
At this time, since the head suspension assembly 1 moves in the airflow generated by the rotation of the disk 32, the heat generated by the head IC chip 5 is also released to the outside air via the ceramic substrate 17 of the head IC chip 5.
[0073]
The head IC chip 5 is provided at a position closer to the rotation axis 35 of the spindle motor 33 for rotating the disk than the longitudinal center line 37 of the arm 7 of the head suspension assembly 1.
[0074]
Since the arm 7 moves in the direction of the rotating shaft 35 when the arm 7 swings, the head IC chip 5 provided near the rotating shaft 35 moves on the disk for a longer time as much as it approaches the rotating shaft 35.
[0075]
In other words, this indicates that the time during which the head IC chip 5 is air-cooled by the air current generated by the rotation of the magnetic disk 32 becomes longer.
[0076]
The cooling effect of the head IC chip 5 by the airflow generated by the rotation of the magnetic disk 32 is the highest since the new airflow absorbs the heat of the head IC chip 5 immediately after the outside air absorbs the heat.
[0077]
It is desirable that the cooling effect by the air current generated by the rotation of the magnetic disk 32 be long in order to enhance the cooling effect.
[0078]
Therefore, the head suspension assembly 1 according to the third embodiment has a higher cooling effect on the head IC chip 5 than the head suspension assembly according to the other embodiments.
[0079]
As described above, in any of the embodiments, the head IC chip 5 as the head drive circuit component has a high cooling effect, and the head suspension assembly is generated by the heat generated by the operation of the head IC chip 5 as much as possible. 1 can be effectively prevented.
[0080]
【The invention's effect】
According to the present invention, it is possible to provide a good magnetic disk drive in which the suspension is not deformed by the heat generated by the head drive circuit components.
[Brief description of the drawings]
FIG. 1 is a perspective view of a magnetic disk drive.
FIG. 2 is a top view of the head suspension assembly.
FIG. 3 is a sectional view of an arm 7 according to a first embodiment of the present invention; FIG. 4 is a sectional view of an arm 7 according to a second embodiment of the present invention; FIG. 5 is a head according to a third embodiment; Top view of suspension assembly 1 [Description of reference numerals]
DESCRIPTION OF SYMBOLS 1 ... Head suspension assembly 2 ... Data recording / reproducing head 3 ... Slider 4 ... Trace 5 ... Head IC chip 6 ... Load beam 7 ... Arm 8 ... Connection terminal 9 ... Heat dissipation cover 10 ... Cover film 11 Copper foil 12 Base film 13 Suspension 14 Bump 15 Resin 16 Opening 17 Ceramic substrate 30 Magnetic disk drive 31 Base frame 32 Magnetic Disc 33 Spindle motor 34 Carriage motor 35 Rotating shaft 36 Rotating shaft hole 37 Center line 38 Rotating direction 39 Rotating shaft

Claims (10)

A disk drive for recording or reproducing digital data on a recording surface of a disk,
A motor for rotating the disk,
A head for recording or reproducing the digital data on the recording surface of the disk rotated by the motor;
A head drive circuit component that supplies a drive signal for recording the digital data to the head, and amplifies a reproduction signal from a disc;
An arm supporting the head;
A heat absorbing and radiating member that contacts the head driving circuit component to absorb and radiate heat generated by the head driving circuit component;
A disk drive device, comprising: an opening provided in the arm, into which the head drive component and the heat absorbing / radiating member are inserted. 2. The disk drive according to claim 1, wherein the heat absorbing and radiating member is a ceramic substrate. 3. The disk drive device according to claim 2, wherein the head drive component and the heat absorbing and radiating member are sealed with an adhesive and further covered with a ceramic cover. The opening is provided at a position closer to a rotation axis of the motor that rotates the disk than a center line in a longitudinal direction of the arm, and the head drive component and the heat absorbing and radiating member are inserted. 2. The disk drive according to claim 1, wherein: 2. The disk drive according to claim 1, wherein the opening faces the recording surface of the disk. A head suspension assembly used in a disk drive device that includes a motor for rotating the disk and that records or reproduces digital data on a recording surface of the disk rotated by the motor,
A head for recording or reproducing the digital data on the recording surface of the disk rotated by the motor;
A head drive circuit component that supplies a drive signal for recording the digital data to the head, and amplifies a reproduction signal from a disc;
An arm supporting the head;
A heat absorbing and radiating member that contacts the head driving circuit component to absorb and radiate heat generated by the head driving circuit component;
A head suspension assembly, comprising: an opening into which the head drive component and the heat absorbing / radiating member are inserted. 7. The head suspension assembly according to claim 6, wherein the heat absorbing and radiating member is a ceramic substrate. 8. The head suspension assembly according to claim 7, wherein the head drive component and the heat absorbing and radiating member are sealed with an adhesive and further covered with a ceramic cover. The opening is provided at a position closer to a rotation axis of the disk motor that rotates the disk than a center line in a longitudinal direction of the arm, and the head drive component and the heat absorbing and radiating member are inserted. 7. The head suspension assembly according to claim 6, wherein: 7. The head suspension assembly according to claim 6, wherein the opening faces the recording surface of the disk.

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