JP2004017588A - Mold clamping device and molding assembly - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To realize the miniaturization and cost reduction of a mold clamping device. <P>SOLUTION: The mold clamping device 5 is provided with a moving mechanism 16 for moving a pair of mold platens for holding a pair of molds, an energizing means 26 for imparting an energizing force to the moving mechanism 16 so as to clamp a pair of the molds by a prescribed force, and a transmission mechanism 27 for transmitting the energizing force of the energizing means 26 to the moving mechanism 16 and releasing the transmission of the force. Thus, since a pair of the molds are clamped by the energizing force of the energizing means 26, it is unnecessary to provide a hydraulic pressure, a servo motor or the like as a drive source for clamping a pair of the molds. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a mold clamping device for clamping a mold and a molding device having the same.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, as a molding apparatus of this type, for example, in the manufacture of semiconductor parts, there is a transfer molding apparatus of a transfer molding system for sealing a semiconductor element mounted on a lead frame with a resin.
[0003]
In a transfer molding apparatus, an upper mold and a lower mold are held by a fixed mold plate and a movable mold plate in a state where they face each other, and the movable mold plate is moved toward the fixed mold plate, and the upper and lower molds are molded. Tighten. As a result, a cavity is formed inside the mold, and a thermosetting resin is introduced as a molding material into the cavity to form a resin-sealed package, thereby performing resin sealing.
[0004]
In such a transfer molding apparatus, a large-sized mold having a plurality of cavities is used, and a large number of semiconductor components can be produced in one molding operation.
[0005]
[Problems to be solved by the invention]
However, transfer molding equipment for mass-producing such semiconductor components is large, which requires a large installation area, requires a sturdy base capable of withstanding the weight of the equipment, and requires equipment maintenance. There are problems such as complexity and cost. In addition, a hydraulic drive or a servomotor is used as a driving source for clamping of the mold clamping device used in such a transfer molding device, which increases the size of the transfer molding device and reduces the cost of the transfer molding device. Is pushing up.
[0006]
In addition, such a transfer molding apparatus has a problem in that a large-sized die must be manufactured even in trial production or small-scale production of a product, and the cost for manufacturing the die is high.
[0007]
An object of the present invention is to realize downsizing of a mold clamping device and a molding device.
[0008]
An object of the present invention is to realize cost reduction of a mold clamping device and a molding device.
[0009]
[Means for Solving the Problems]
The mold clamping device according to claim 1, wherein a pair of dies holding a pair of dies, a supporting portion movably supporting one of the dies in the opening and closing direction of the pair of dies, A moving mechanism for moving the one mold plate in the opening and closing direction of the mold, and a biasing force applied to the moving mechanism so as to clamp the pair of molds held by the pair of mold plates with a prescribed force. And a transmission mechanism for transmitting and releasing the urging force of the urging means to and from the moving mechanism.
[0010]
Therefore, the urging force of the urging means is transmitted to the moving mechanism by the transmission mechanism, whereby the pair of dies is clamped with a prescribed force by the urging force of the urging means.
[0011]
According to a second aspect of the present invention, in the mold clamping device according to the first aspect, the moving mechanism includes a rotatable rotating shaft, a rotating operation unit that manually rotates the rotating shaft by leverage, and the rotating shaft. And a converting unit that converts the rotational motion of the first die plate into a linear motion that moves the one mold plate.
[0012]
Therefore, the rotating shaft is rotated by manually operating the rotating operation means, and the rotating motion of the rotating shaft is converted into a linear motion for moving one mold board by the conversion unit, and the pair of dies is opened and closed.
[0013]
According to a third aspect of the present invention, in the mold clamping device according to the second aspect, the moving mechanism has a reduction mechanism that reduces the rotation of the rotation shaft and outputs the reduced rotation.
[0014]
Therefore, it is possible to rotate the rotating shaft with a small manual operation force.
[0015]
According to a fourth aspect of the present invention, in the mold clamping device according to the second or third aspect, the transmission mechanism is provided rotatably in a rotation direction of the rotating shaft, and a pair of the dies on the rotating shaft is formed by a mold. A rotating body urged by the urging means in the closing rotation direction, a displacement means for displacing the rotating body urged by the urging means, and the displacement means being driven manually by leverage When the rotating body rotates in a rotation direction of closing the pair of molds on the rotating shaft, the rotating shaft and the rotating body are connected to each other. A connection mechanism for releasing the connection between the rotating shaft and the rotating body when the rotating body rotates in a rotation direction for opening the mold.
[0016]
Therefore, the rotating body biased by the biasing means is displaced by manually operating the displacement operating means. When the rotating direction of the rotating body is the same as the rotating direction of closing the pair of molds on the rotating shaft, the rotating shaft and the rotating body are connected by the connecting mechanism, and the urging force of the urging means is applied to the rotating shaft. To rotate. As a result, the pair of dies is clamped. When the rotating direction of the rotating body is the same as the rotating direction of the rotating shaft for opening the pair of molds, the connection between the rotating shaft and the rotating body is released by the connecting mechanism, and the pair of molds is clamped. It is released.
[0017]
According to a fifth aspect of the present invention, in the mold clamping device according to the fourth aspect, the displacement means has a cam structure that displaces the rotating body as a follower by displacement of a cam.
[0018]
Therefore, the rotating body is displaced by displacing the cam by manually operating the displacement operating means, whereby the connection and disconnection of the rotating shaft and the rotating body are performed, and the pair of molds are clamped and molded. Tightening is released.
[0019]
According to a sixth aspect of the present invention, in the mold clamping device according to the fifth aspect, the displacement means has a rotatable rotor at a position where the cam comes into contact with the rotating body.
[0020]
Therefore, when the cam is displaced, the rotor rotates.
[0021]
According to a seventh aspect of the present invention, there is provided a molding apparatus for performing molding by introducing a molding material into a cavity formed in a pair of dies, and holding the pair of dies. A mold clamping device according to 5 or 6 is provided.
[0022]
Therefore, it is possible to achieve the same effect as the invention described in the first, second, third, fourth, fifth or sixth aspect.
[0023]
BEST MODE FOR CARRYING OUT THE INVENTION
An embodiment of the present invention will be described with reference to the drawings. The present embodiment is an example of application to a transfer molding apparatus for molding a resin-sealed package using a resin material for a semiconductor element of a semiconductor component as a molding apparatus. Thermosetting resin is used as the resin material.
[0024]
Here, FIG. 1 is a front view showing a state in which a mold apparatus is attached to the transfer molding apparatus of the present embodiment, FIG. 2 is a front view showing the transfer molding apparatus in a state in which the mold apparatus is removed, and FIG. FIG. 4 is a longitudinal sectional front view showing a mold clamping device, FIG. 5 is a cross-sectional plan view showing a mold clamping device, FIG. 6 shows a pressing mechanism, and FIG. FIG. 3B is a longitudinal sectional front view showing a state where no mold is provided, and FIG.
[0025]
As shown in FIGS. 1 and 2, a transfer molding apparatus 1 holds a mold apparatus 4 having a pair of molds, an upper mold 2 and a lower mold 3, and holds an upper mold 2 and a lower mold 3. A mold clamping device 5 for opening and closing and mold clamping, a material introducing section 6 for introducing a resin material into the mold device 4 and the like are provided.
[0026]
As shown in FIG. 3, the mold device 4 includes a cavity 7 for molding the resin material by clamping the upper mold 2 and the lower mold 3, and a runner for guiding the resin material to the cavity 7. 8 are formed. A sprue 9 communicating with the runner 8 is formed in the upper mold 2. Then, the resin material introduced from the material introduction part 6 reaches the cavity 7 from the sprue 9 through the runner 8. The lower mold 3 is provided with an ejector pin 10 for removing a molded product, an air vent (not shown) for removing air from the cavity 7, and the like.
[0027]
As shown in FIGS. 1, 2, and 4, the mold clamping device 5 includes a fixed mold plate 11 for holding the upper mold 2 and a movable mold plate 12 for holding the lower mold 3. The fixed mold board 11 is fixed to the upper frame 13. The movable mold platen 12 is slidable in the opening and closing direction of the mold device 4 by a plurality of guide shafts 15 which are support portions suspended between the upper and lower frames 13 and 14, and is moved by a moving mechanism 16 described later. It is moved in the opening and closing direction.
[0028]
As shown in FIGS. 4 to 6, the mold clamping device 5 has a moving mechanism 16 (FIGS. 4 and 5) for manually moving the movable mold platen 12 in the opening and closing direction of the mold device 4, and the mold is closed. A pressurizing mechanism 17 (FIGS. 5 and 6) for clamping the mold apparatus 4 with a specified force is provided.
[0029]
The moving mechanism 16 includes a moving shaft 19 fixed to a lower portion of the movable mold plate 12 and having a vertical direction as an axial direction and having a male screw 18 formed on an outer peripheral portion, and a female screw 20 meshed with the male screw 18 of the moving shaft 19 at the center. And a rotary shaft 23 having a worm gear 22 meshed with the worm wheel 21. The rotating shaft 23 is rotatably held by the lower frame 14 with the horizontal direction as the axial direction. At the end of the rotating shaft 23, a handle 24 as a rotating operation means for rotating the rotating shaft 23 by manual operation is attached. The outer shape of the handle 24 is formed to be larger than the diameter of the rotating shaft 23, and when rotating the rotating shaft 23, an outer peripheral portion thereof is operated to exert a leverage action. Then, the rotational motion of the rotary shaft 23 by the operation of the handle 24 is converted into a linear motion of the moving shaft 19 via the worm wheel 21, and the movable mold plate 12 moves in the opening and closing direction of the mold device 4. Here, the worm gear 22 and the worm wheel 21 are set so as to output the rotation of the rotating shaft 23 at a reduced speed, and the worm gear 22 and the worm wheel function as a reduction mechanism. Here, the worm wheel 21, the worm gear 22, and the moving shaft 19 constitute a conversion unit 25 that converts the rotational motion of the rotating shaft 23 into a linear motion that moves the movable mold plate 12.
[0030]
The pressurizing mechanism 17 includes a coil spring 26 as an urging unit that applies an urging force to the moving mechanism 16 so as to clamp the mold apparatus 4 with a predetermined force, and transmits the urging force of the coil spring 26 to the moving mechanism 16 and A transmission mechanism 27 for manually releasing the transmission.
[0031]
The coil spring 26 is rotatably mounted on the rotating shaft 23 and has one end held by a plate member 28 constituting a transmission mechanism 27, and the other end held by the lower frame 14. The coil spring 26 is a tension spring that pulls the plate member 28 to rotate in a rotation direction (hereinafter, this direction is referred to as a forward direction and a direction opposite to the direction is referred to as a reverse direction) of the rotating shaft 23 for closing the mold device 4. Function as
[0032]
The transmission mechanism 27 includes the above-described plate member 28, an operation unit 29, and a connection mechanism 30. Here, the plate member 28 functions as a rotating body. The operation unit 29 is rotatable cam shaft 31, a cam 32 fixed to the cam shaft 31, and fixed to an end of the cam shaft 31 and extends in a direction orthogonal to the axis of the cam shaft 31. And a lever 33 as displacement operation means.
[0033]
The cam 32 is arranged at a position where rotation of the plate member 28 urged by the coil spring 26 is stopped, and is in contact with the plate member 28. Here, the plate member 28 functions as a follower to the cam 32. The lever 33 is rotatable between a connection release position (FIG. 6A) and a connection position (FIG. 6B), and rotationally drives the cam 32 fixed to the cam shaft 31 by manual operation. . At this time, by operating the end of the lever 33 on the side opposite to the cam shaft 31, the lever 33 exerts a leverage action. The displacement of the cam 32 caused by the manual operation of the lever 33 causes the displacement of the plate member 28 urged by the coil spring 26. Thus, the transmission mechanism 27 has a cam structure. Here, the cam shaft 31 and the cam 32 function as displacement means for displacing the plate member 28 urged by the coil spring 26. The position of the plate member 28 when the lever 33 is at the uncoupling position is also set to the uncoupling position. At this time, the coil spring 26 is in an extended state, and the position of the plate member 28 when the lever 33 is at the coupling position is also connected. Position, and at this time, the coil spring 26 is in a contracted state.
[0034]
A roller 34 serving as a rotor is attached to a portion of the cam 32 that contacts the plate member 28. The roller 34 is rotatable in the same direction as the cam shaft 31. When the cam 32 is displaced, the roller 34 in contact with the plate member 28 rotates.
[0035]
The coupling mechanism 30 has a claw 35a formed on the outer periphery and fixed to the rotating shaft 23, a claw member 37 rotatably attached to a support shaft 36 provided on the plate member 28, and a rotation of the claw member 37. It is constituted by a rotating section 38 and the like. The rotation direction of the claw member 37 is the same as the rotation direction of the rotation shaft 23. A claw 37a engageable with a claw of a ratchet wheel 35 is formed at one end of the claw member 37, and a roller 39 is rotatably attached to the other end of the claw member 37.
[0036]
The rotating unit 38 includes a coil spring 40 and a guide member 41. The coil spring 26 has one end held by one end of the claw member 37 and the other end held by the plate member 28, and biases one end of the claw member 37 on the claw 37a side toward the ratchet wheel 35, thereby causing the claw member 37 to move. It is rotated in the forward direction about the support shaft 36. The guide member 41 is fixed to the lower frame 14 and abuts against the roller 39 of the claw member 37 in accordance with the rotation of the plate member 28 from the connection position to the connection release position, thereby resisting the urging force of the coil spring 40. Then, the claw member 37 is rotated in the opposite direction about the support shaft 36.
[0037]
When the plate member 28 is at the uncoupling position, the pawl member 37 is positioned at the uncoupling position where the pawl member 37 is not engaged with the ratchet wheel 35 by the coil spring 40 and the guide member 41. Then, as the lever 33 is manually operated and the plate member 28 rotates from the connection release position to the connection position, the roller 39 of the claw member 37 separates from the guide member 41 according to the position of the plate member 28, and the claw member 37 , And rotates forward by the urging force of the coil spring 40 to engage with the ratchet 35. Thus, the urging force of the coil spring 26 is transmitted to the rotating shaft 23. On the other hand, when the lever 33 is operated from this state to rotate the plate member 28 from the connection position to the disconnection position, the claw member 37 is reversely rotated by the guide member 41 in accordance with the position of the plate member 28 and the claw member 37 is rotated. The engagement with the vehicle 35 is released.
[0038]
As shown in FIGS. 1 and 2, the material introduction unit 6 is formed on the fixed mold platen 11 of the mold clamping device 5 and stores a tablet-shaped resin material in the pot 42, and stores the resin material stored in the pot 42 in the pot 42. It comprises a heater (not shown) for heating and melting, a plunger 43 which can freely enter and exit the pot 42 and pushes out the resin material in the pot 42. The plunger 43 is driven by a motor (not shown) via a driving mechanism (not shown) that moves the plunger 43 in the axial direction.
[0039]
In the transfer molding apparatus 1, a heater (not shown) for heating the resin material introduced into the clamped mold is provided on the fixed mold plate 11 and the movable mold plate 12.
[0040]
In such a configuration, in order to mold a resin-sealed package of a semiconductor component, first, a lead frame on which a semiconductor element is mounted is set in the mold apparatus 4 and the handle 24 is manually operated to move the moving mechanism 16. The movable mold board 12 is moved by driving to close the mold of the mold apparatus 4. Next, the lever 33 is manually rotated from the connection release position to the connection position. Thereby, the mold device 4 is clamped with a specified force by the urging force of the coil spring 26 of the pressurizing mechanism 17. The specified force is determined by the spring constant of the coil spring 26 and the distance from the position of the coil spring 26 held by the plate member 28 to the rotation center position of the rotary shaft 23. In the present embodiment, 3 tonf Is set to In such a state, the resin material is stored in the pot 42 and melted by the heater, and the resin in the melted state is pushed out to the cavity 7 by the plunger 43. Then, the resin material in the cavity 7 is heated to a hardening point by a heater and hardened. Thereby, a resin-sealed package is formed.
[0041]
Thereafter, the lever 33 is manually rotated from the connection position to the connection release position, the mold clamping of the mold device 4 is released, and the handle 24 is manually operated to drive the moving mechanism 16 to thereby mold the mold device 4. Open. Then, the semiconductor component on which the resin-sealed package has been formed is taken out.
[0042]
As described above, the mold clamping device 5 of the transfer molding device 1 of the present embodiment performs the mold clamping of the mold device 4 by the urging force of the coil spring 26. It is not necessary to provide a hydraulic pressure, a servomotor, or the like as a drive source for the motor. Thus, the size and cost of the mold clamping device 5 can be reduced, and the size and cost of the transfer molding device 1 using the mold clamping device 5 can be reduced. The transfer molding apparatus 1 is reduced in size, so that the transfer molding apparatus 1 can be installed in a wider range of places, so that the transfer molding apparatus 1 can be installed even on an ordinary workbench. Further, the miniaturization of the mold clamping device 5 and the transfer molding device 1 facilitates the handling of those devices. Further, the mold apparatus 4 can be downsized by reducing the size of the mold clamping apparatus 5, so that the cost of the mold apparatus 4 can be reduced.
[0043]
Further, the mold clamping device 5 can open and close the mold device 4 by manually operating the handle 24, and in order to open and close the mold device 4, it is necessary to use a drive source such as a hydraulic pressure or a servomotor. There is no. This makes it possible to further reduce the size and cost of the mold clamping device 5.
[0044]
Further, the mold clamping device 5 can transmit and release the urging force of the coil spring 26 to and from the moving mechanism 16 by the transmission mechanism 27 by manually operating the lever 33, thereby driving the transmission mechanism 27. Therefore, it is not necessary to provide a drive source such as a servomotor. This makes it possible to further reduce the size and cost of the mold clamping device 5.
[0045]
In addition, since the moving mechanism 16 of the mold clamping device 5 transmits the force of the manual operation to the rotating shaft 23 by leverage, the force of the manual operation for driving the moving mechanism 16 can be reduced. The operability of the fastening device 5 can be improved.
[0046]
In addition, since the moving mechanism 16 of the mold clamping device 5 has a speed reduction mechanism, the rotating shaft 23 can be rotated with a small manual operation force, thereby improving the operability of the mold clamping device 5.
[0047]
Further, since the transmission mechanism 27 of the mold clamping device 5 transmits the force of the manual operation to the cam 32 fixed to the cam shaft 31 by leverage, the force of the manual operation for driving the transmission mechanism 27 can be reduced. Thus, the operability of the mold clamping device 5 can be improved.
[0048]
Further, since the displacement means of the mold clamping device 5 has a cam structure, the configuration of the displacement means is simplified.
[0049]
Further, since the roller 34 is attached to the cam 32, when the cam 32 is displaced, the roller 34 in contact with the plate member 28 rotates, thereby preventing the plate member 28 and the cam 32 from being damaged. can do.
[0050]
In the present embodiment, the transfer molding apparatus 1 has been described as an example of the molding apparatus. However, the molding apparatus is not limited to this, and any apparatus using a mold clamping apparatus may be used. A press device or the like may be used.
[0051]
Further, in the present embodiment, the example in which the roller 34 as the rotor is provided on the cam 32 is shown, but the present invention is not limited to this, and the roller 34 is provided at the contact portion between the cam 32 and the plate member 28. And it may be attached to the plate member 28.
[0052]
Further, in the present embodiment, an example in which the moving mechanism 16 and the transmission mechanism 27 are manually operated has been described. However, the present invention is not limited to this, and the moving mechanism 16 and the transmission mechanism 27 may be driven by, for example, a servomotor or a hydraulic pressure. It may be driven by a source.
[0053]
【The invention's effect】
According to the mold clamping device of the first aspect of the present invention, a pair of mold plates that hold a pair of molds, and a support portion that movably supports one of the mold plates in the opening and closing direction of the pair of molds. A moving mechanism for moving the one mold plate in the opening and closing direction of the pair of molds, and a moving mechanism for clamping the pair of molds held by the pair of mold plates with a prescribed force. By providing an urging means for applying an urging force, and a transmission mechanism for transmitting the urging force of the urging means to the moving mechanism and canceling the transmission, the urging force of the urging means is transmitted to the moving mechanism by the transmission mechanism. This causes the pair of dies to be clamped with a prescribed force by the urging force of the urging means. Therefore, as in the conventional mold clamping device, hydraulic pressure or the like is used as a driving source for clamping the pair of dies. There is no need to provide a servomotor, etc., which reduces the size and cost of the mold clamping device. It can be current.
[0054]
According to the second aspect of the present invention, in the mold clamping device according to the first aspect, the moving mechanism includes a rotatable rotation shaft, a rotation operation unit that manually rotates the rotation shaft by leverage, and A conversion unit that converts the rotational motion of the rotating shaft into a linear motion that moves the one mold plate, whereby the pair of molds can be opened and closed by manually operating the rotary operation means. Since it is not necessary to use a drive source such as a hydraulic pressure or a servomotor for opening and closing the mold, it is possible to further reduce the size and cost of the mold clamping device. Further, since the force of the manual operation is transmitted to the rotating shaft by the leverage action, the force of the manual operation for driving the moving mechanism can be reduced, thereby improving the operability of the mold clamping device.
[0055]
According to the third aspect of the present invention, in the mold clamping device according to the second aspect, the moving mechanism includes a speed reduction mechanism that reduces the speed of the rotation of the rotation shaft and outputs the rotation. Can be rotated, whereby the operability of the mold clamping device can be improved.
[0056]
According to the fourth aspect of the present invention, in the mold clamping device according to the second or third aspect, the transmission mechanism is provided rotatably in a rotation direction of the rotating shaft, and the pair of the dies on the rotating shaft. A rotating body urged by the urging means in a rotational direction for closing the mold, a displacing means for displacing the rotating body urged by the urging means, and the displacing means being manually operated by leverage. Displacement operating means for driving the rotating shaft and the rotating body when the rotating body rotates in a rotation direction for closing the pair of molds on the rotating shaft. Manually operating the displacement operation means by having a connection mechanism for releasing the connection between the rotating shaft and the rotating body when the rotating body rotates in the rotation direction in which the mold is opened. By the transmission mechanism by the biasing hand The transmission of the urging force to the moving mechanism and the transmission of the urging force can be performed, so that there is no need to provide a driving source such as a servomotor for driving the transmitting mechanism, and the mold clamping device can be further reduced in size and reduced in size. Cost reduction can be realized. Further, since the force of the manual operation is transmitted to the displacement means by leverage, the force of the manual operation for driving the transmission mechanism can be reduced, and the operability of the mold clamping device can be improved.
[0057]
According to the fifth aspect of the present invention, in the mold clamping device according to the fourth aspect, the displacing means has a cam structure for displacing the rotating body as a follower by displacement of a cam. Displacement means can be realized.
[0058]
According to the invention described in claim 6, in the mold clamping device according to claim 5, the cam is displaced by having a rotatable rotor at a position where the cam and the rotating body come into contact with each other. In this case, since the rotor rotates, it is possible to prevent the rotating body and the cam from being damaged.
[0059]
According to the seventh aspect of the present invention, in a molding apparatus for performing molding by introducing a molding material into a cavity formed in a pair of dies, the pair of dies is held. By providing the mold clamping device according to the fourth, fifth or sixth aspect, it is possible to achieve the same effect as the invention according to the first, second, third, fourth, fifth or sixth aspect.
[Brief description of the drawings]
FIG. 1 is a front view showing a state where a mold apparatus is attached to a transfer molding apparatus according to an embodiment of the present invention.
FIG. 2 is a front view showing the transfer molding apparatus with the mold apparatus removed.
FIG. 3 is a vertical sectional front view showing a mold apparatus.
FIG. 4 is a vertical sectional front view showing a mold clamping device.
FIG. 5 is a sectional plan view showing a mold clamping device.
FIG. 6
FIG. 3A is a longitudinal sectional front view showing a state in which mold clamping is not performed, and FIG. 4B is a longitudinal sectional front view showing a state in which mold clamping is performed.
[Explanation of symbols]
1 molding equipment (transfer molding equipment)
2 Mold (upper mold)
3 mold (lower mold)
5 Mold clamping device 7 Cavity 11 Mold board (fixed mold board)
12 type board (movable type board)
15 Support part (guide shaft)
16 Moving mechanism 21 Reduction mechanism (worm wheel)
22 Reduction mechanism (worm gear)
23 rotation shaft 24 rotation operation means (handle)
25 converter 26 biasing means (coil spring)
27 Transmission mechanism 28 Rotating body (plate member)
30 connecting mechanism 31 displacement means (cam shaft)
32 Displacement means, cam 33 Displacement operation means (lever)
34 Rotor (roller)

Claims (7)

A pair of mold plates holding a pair of molds,
A support portion that movably supports one of the mold plates in the opening and closing direction of the pair of molds,
A moving mechanism for moving the one mold plate in the opening and closing direction of the pair of molds,
Biasing means for applying a biasing force to the moving mechanism so as to clamp the pair of molds held by the pair of mold plates with a prescribed force,
A transmission mechanism for transmitting and releasing the urging force of the urging means to the moving mechanism,
A mold clamping device comprising: The moving mechanism includes:
A rotatable rotating shaft,
Rotation operation means for manually rotating the rotation shaft by leverage,
A conversion unit that converts the rotational motion of the rotating shaft into a linear motion that moves the one mold plate,
The mold clamping device according to claim 1, comprising: The mold clamping device according to claim 2, wherein the moving mechanism includes a reduction mechanism that reduces the rotation of the rotation shaft and outputs the rotation. The transmission mechanism,
A rotating body that is provided rotatably in the rotation direction of the rotation shaft, and is urged by the urging means in a rotation direction that closes the pair of molds on the rotation shaft;
Displacement means for displacing the rotating body biased by the biasing means,
Displacement operation means for driving the displacement means manually by leverage,
When the rotating body rotates in a rotation direction for closing the pair of molds on the rotating shaft, the rotating shaft and the rotating body are connected to open the pair of molds on the rotating shaft. A connection mechanism for releasing the connection between the rotating shaft and the rotating body when the rotating body rotates in a rotating direction;
The mold clamping device according to claim 2, further comprising: The mold clamping device according to claim 4, wherein the displacement means has a cam structure that displaces the rotating body as a follower by displacement of a cam. The mold clamping device according to claim 5, wherein the displacement unit has a rotatable rotor at a position where the cam and the rotating body abut. In a molding apparatus that performs molding by introducing a molding material into a cavity formed in a pair of molds,
A molding apparatus, comprising: the mold clamping device according to claim 1, which holds a pair of the molds.

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