JP2003510388A - Solvent composition - Google Patents

Abstract

  (57) [Summary] Solvent composition containing a) glycol monoether or diether, b) protic liquid other than glycol monoether or diether, and c) organic liquid containing amide or carboxyl group, epoxy resin, curing agent for epoxy resin, curing Particularly effective as a diluent for catalysts and / or curing inhibitors.

Description

Detailed Description of the Invention

The present invention relates to a solvent composition, and one or more epoxy resins and / or one or more curing agents for epoxy resins and / or one or more curing catalysts and / or one or more curing inhibitors. Relates to the use of this solvent composition as a diluent for use.

[0002] to reduce the viscosity of the liquid hardening agent for the background liquid epoxy resin or epoxy resins of the present invention, or a solid resin and / or a curing agent is dissolved in an organic solvent, the handling of the epoxy resin and / or curing agent The use of organic solvents to improve is a well known technique.

Excellent solvents for curing agents for epoxy resins, such as dicyandiamide, are dimethylformamide and methyl glycol. However, the use of dimethylformamide and methyl glycol requires industrial hygiene considerations.

Accordingly, one of the objects of the present invention is to be effective in dissolving an epoxy resin, a curing agent for an epoxy resin, a curing catalyst or a curing inhibitor, or to reduce the viscosity of these compounds. To find new solvents that are effective.

Known applications of epoxy resins are in the production of electrical laminates, glass laminates and coatings. In a conventional method, a solution of an epoxy resin in an organic solvent such as a ketone and a solution of a curing agent for the epoxy resin are mixed to produce an epoxy resin composition used for various purposes. When using known solvents for dicyandiamide, such as propylene glycol monomethyl ether, it can be difficult to hold the dicyandiamide in solution after mixing the dicyandiamide solution with the epoxy resin solution.

Therefore, a preferred object of the present invention is to find new solvents in which curing agents for epoxy resins, such as dicyandiamide, are sufficiently soluble even after mixing the curing agent solution with the epoxy resin solution. .

[0007] One aspect of the Summary of the Invention The present invention is a solvent composition comprising an organic low molecular weight compounds containing a) glycol monomethyl ether or diether, and b) a carbonate group.

In another embodiment of the present invention, one or more compounds selected from i) epoxy resin, ii) curing agent for epoxy resin, iii) curing catalyst, and iv) curing inhibitor are added to the above solvent composition. The composition contained therein.

Yet another aspect of the present invention is i) an epoxy resin, ii) a curing agent for the epoxy resin, i
ii) a curing catalyst, and iv) one or more compounds selected from curing inhibitors are contacted with a) a glycol monoether or diether, and b) an organic low molecular weight compound containing a carbonate group to form a solvent composition. It is a method for producing a composition containing one or more of the above compounds.

Yet another aspect of the present invention is i) epoxy resin, ii) curing agent for epoxy resin, i
The use of an organic low molecular weight compound containing a) a glycol monoether or diether, and b) a carbonate group, as a diluent for one or more compounds selected from ii) a curing catalyst and iv) a curing inhibitor.

DETAILED DESCRIPTION solvent composition of the present invention relates preferably, a), based on the total weight of b) and c), a) at least 45 percent, preferably at least 50 percent, more preferably at least 60 %, Most preferably 60-90% glycol monoether or diether, b) 1-30%, preferably 1-25%, more preferably 1-20%, most preferably 5-15% of carbonate groups. And optionally c) 25% or less, preferably 20% or less, more preferably 2-15%, most preferably 5-12% of a protic liquid other than glycol monoether or diether. .

Component a) of the solvent composition is a glycol monoether or diether or a mixture of one or more monoethers and / or diethers. Monoethers are preferred over diethers.

Preferred glycol monoethers are propylene or butylene glycol monoethers, most preferably of the formula IR ₁ O— (CH ₂ —CHR ₃ O) _n —R ₂ (I) One of R ₁ and R ₂ has 1 to 12 carbon atoms, preferably 1 to 6,
More preferably 1 to 4 alkyl groups, the other is hydrogen, R ₃ is independently ethyl or preferably methyl, n is 1 to 4, preferably 1, 2 or 3) Is an ether.

The alkyl group may be branched or unbranched. Examples of alkyl groups are
Methyl, ethyl, n-propyl, isopropyl, butyl groups such as n-butyl or isobutyl, pentyl, hexyl, octyl, decyl or dodecyl groups. Of the propyl and butyl groups, n-propyl and n-butyl are preferred. Preferably, one of the substituents R ₁ and R ₂ is methyl or n-butyl.

Preferred monoethers of formula I are propylene glycol n-butyl ether, dipropylene glycol methyl ether, dipropylene glycol n-butyl ether and most preferably propylene glycol methyl ether.

Propylene or butylene glycol diether in which both the substituents R ₁ and R ₂ are alkyl groups are also effective.

Component b) of this solvent composition is an organic low molecular weight compound containing carbonate groups. By "low molecular weight" is meant a molecular weight of 200 or less, preferably 150 or less, most preferably 120 or less. Effective components b) are, for example, ethylene carbonate or butylene carbonate. A preferred component b) is propylene carbonate.

The desired component c) of this solvent composition is a protic liquid other than a glycol monoether or diether, or a mixture of two or more such protic liquids. By "liquid" is meant a compound that is liquid at room temperature and atmospheric pressure. The most preferred protic liquid is water. Other protic liquids are alcohols or glycols such as methanol, ethanol, ethylene glycol or propylene glycol.

If component b) of the solvent composition is propylene carbonate or butylene carbonate, it is desirable to include component c) in the solvent composition, preferably water.
When the component b) of the solvent composition is ethylene carbonate, the solvent composition with or without the component c) is a good solvent for a curing agent such as dicyandiamide.

Depending on the application of the solvent composition according to the invention, in addition to components a), b) and c) one or more other solvents such as acetone, methyl ethyl ketone or methyl isobutyl ketone, or amides such as dimethylformamide. It is preferable to include. The amount depends on the use of this solvent composition.

When the solvent composition of the present invention is used for diluting an epoxy resin, the total amount of components a), b) and c) is usually at least 40 percent, based on the total weight of solvent in the solvent composition, It is preferably at least 50 percent, more preferably at least 60 percent, and the amount of one or more other solvents is usually 60 percent or less, preferably 50 percent or less, more preferably 40 percent or less.

When this solvent composition is used as a curing agent for an epoxy resin, a curing catalyst or a diluent for a curing inhibitor, the components a), b) and
The total amount of c) is usually at least 60 percent, preferably at least 75 percent, more preferably at least 90 percent, and the amount of one or more other solvents is usually 40 percent or less, preferably 25 percent or less, more preferably Below 10 percent.

Most preferably, the solvent composition of the present invention consists essentially of components a), b) and c). The solvent composition may also contain other additives such as viscosity improvers (eg N-methylpyrrolidone), thickeners (eg high molecular weight polyalkylene glycols), or plasticizers (eg dioctyl phthalate or chlorinated paraffins). . If present, their amount is preferably 0.1 to 2 based on the total mass of components a), b) and c).
It is 0 percent, more preferably 1 to 10 percent.

The solvent composition of the present invention may include solid particles such as a filler. However, the solvent composition does not contain more than 150 percent, preferably more than 100 percent, based on the total weight of components a), b) and c). Effective fillers include organic and inorganic fillers such as melamine resins, wood fillers, carbon black or graphite, talc, calcium carbonate, phosphates such as ammonium polyphosphate, fly ash, aluminum trihydrate, magnesium hydroxide, Glass fiber,
Includes marble powder, cement powder, clay, feldspar, silica or glass, fumed silica, alumina, magnesium oxide, zinc oxide, barium sulfate, aluminum silicate, titanium dioxide, titanate, glass microspheres or chalk. Effective flame-retardant fillers and additives such as sulfur compounds, phosphorus compounds, boron compounds, silicon compounds and polynuclear aromatic compounds are commercially available, for example from "International Plastics Flammability Han
dbook "by Jurgen Troitzach, 1983, ISBN 0-02-949770-1 Macmillan Publishin
g Co., Inc., New York pages 46-53 and "Ullmann's Encyclopedia of Industri
al Chemistry "Vol. A11, pages 124-126.

The solvent composition of the present invention can be manufactured by a known method. Usually, the components of the solvent composition are mixed at a temperature of 1 ° C. to 80 ° C., preferably 15 ° C. to 40 ° C., until a homogeneous mixture is obtained in the above ratios.

The solvent composition of the present invention comprises i) epoxy resin, ii) curing agent for epoxy resin, iii)
It is very effective as a curing catalyst and iv) a diluent for one or more compounds selected from curing inhibitors. This diluent acts as a means or solvent to reduce the viscosity of one or more liquid compounds.

[0027] Preferably, the curing agent for the epoxy resin, optionally the curing catalyst and optionally the curing inhibitor are diluted with the solvent composition of the present invention. This blend is preferably mixed with an epoxy resin diluted with an organic solvent.

Curing agents for epoxy resins, also commonly referred to as epoxy curing agents, are known in the art. Effective curatives include, for example, amides, anhydrides such as styrene / maleic anhydride, boron trifluoride complexes, dicyandiamide, substituted dicyandiamides, polyester resins, novolac or phenol curatives, ie containing more than one aromatic hydroxyl group. It is a compound containing. Other curing agents known in the art include adducts pre-reacted with epoxy resins and amines or anhydrides or dicyandiamide or phenolic resins. Preferred phenol curing agents are described on pages 6-8 of European Patent Specification 0,240,565. Other known curing agents are 1
Primary or secondary amines, hydrazides or hydrazines, preferably polyfunctional,
More preferably, it is a 2- to 6-functional primary amine, amide and hydrazide. Such hardeners are shown in U.S. Pat. No. 4,789,690 at col. 5, lines 47-68 and col. 6, lines 14-19.

Other effective hardeners are shown in published European patent application EP-A-0,458,502, page 11, lines 41-58, page 12, lines 1-40. Other preferred hardeners are cyanamide or dicyanamide derivatives, dihydroxyphenols, biphenols, halogenated bisphenols, alkylated bisphenols, trisphenols, phenol-aldehyde resins, halogenated phenol-aldehyde novolac resins, alkylated phenol-aldehyde novolac resins, carbonized. It is a hydrogen-phenol resin, a hydrocarbon-halogenated phenol resin, a hydrocarbon-alkylated phenol resin, or a combination of two or more thereof.

The solvent composition of the present invention is particularly effective in dissolving dicyandiamide, such as substituted dicyandiamide or unsubstituted dicyandiamide (cyanoguanidine). Solvent compositions of the present invention include substituted dicyandiamides, such as those in which some (but not all) of the hydrogen bonded to the nitrogen atom is alkyl, preferably C _1-6 alkyl, more preferably methyl, ethyl or propyl groups, or aryl, It is also effective in dissolving dicyandiamide, which is preferably substituted by benzyl, more preferably 2-methylbenzyl. Preferably, this dicyandiamide has only one of the above substituents. Most preferably, the dicyandiamide is unsubstituted.

The solvent composition of the present invention is effective in dissolving one or more of the above curing agents for epoxy resins. "Curing agent" also includes a mixture of two or more compounds that act as a curing agent for the epoxy resin.

Preferably 1 to 20 percent, more preferably 2 to 15 percent, most preferably 3 to 12 percent of the weight of the solvent composition is dissolved in the solvent composition. The solubility of the curing agent in the solvent composition of the present invention depends on various factors, such as the type of curing agent, the composition of the solvent composition, and the amount of compounds, such as curing catalysts or curing inhibitors, that are further dissolved in the solvent composition. And it depends on the type. The solubility of a particular curing agent in a particular solvent composition of the present invention can be evaluated by a series of attempts.

Curing catalysts or accelerators that enhance the reaction rate between the curing agent and the epoxy resin are also known in the art. Preferred are tertiary amine-containing or heterocyclic amine-containing compounds. With a curing catalyst, such as benzoguanamidine, imidazole, benzodimethylamine, metaphenolenediamine, or N, N, N '
, N'-Tetramethyl-1,3-butadiamine acts as a curing agent by itself. Preferred imidazoles are 2-methylimidazole, 2-ethyl-4-methylimidazole or 2-phenylimidazole. 2-Methylimidazole, 2-ethyl-4-methylimidazole and 2-phenylimidazole are the most preferred curing catalysts. Other curing agents that may be dissolved in the solvent composition of the present invention include heterocyclic nitrogen compounds, phosphines,
Sulfides or compounds containing ammonium, phosphonium or sulfonium. Such curing catalysts are disclosed in published European patent application EP-A-0,458,502, page 12, lines 41-50,
It is shown on pages 13 to 16 and pages 17 to 1 to 22. The solvent composition of the present invention is effective in dissolving one or more of the above curing catalysts. "Curing catalyst" also includes mixtures of two or more that affect the reaction rate between the epoxy resin and the epoxy curing agent.

When this solvent composition is used for dissolving the curing catalyst, the solvent composition is used in an amount of 0.1 to 40% by mass.
Percent, preferably 0.5 to 35 percent, more preferably 1 to 20 percent, most preferably 2 to 12 percent of the cure catalyst is dissolved. The solubility of the curing catalyst in the solvent composition of the present invention depends on various factors, such as the type of curing catalyst, the amount and type of curing agent optionally present in the solvent composition, the composition of the solvent composition, and the solvent composition. It will be understood that this will depend on the amount and type of compound that is further dissolved in the product. The solubility of a particular cure catalyst in a particular solvent composition of the present invention can be evaluated by a series of attempts. In the case of an imidazole such as 2-methylimidazole, preferably 1 to 20 percent by weight of the solvent composition, more preferably 2 to
Twelve percent of imidazole is dissolved in the solvent composition.

Effective cure inhibitors are boric acid, metaboric acid, boric anhydride or maleic acid or (meth) boric acid (anhydride) and at least one acid having a weakly nucleophilic anion, for example fluoroboric acid (HBF ₄ ). Is a mixture of. Curing inhibitor is published European patent application EP-A-0
, 458, 502, pages 17, lines 18-50 and pages 18, lines 1-38. When the cure inhibitor is dissolved in the solvent composition, it is preferably dissolved in 0.1 to 12 percent, more preferably 0.5 to 6 percent, most preferably 1 to 4 percent by weight of the solvent composition. When the solvent composition of the present invention contains a large amount of a curing agent, for example, 3 to 12% of dicyandiamide, the solubility of the curing catalyst and / or the curing inhibitor in the solvent composition is usually low, and usually the solvent composition has a low solubility. It is 0.1 to 3 percent by weight, and more typically 0.5 to 2 percent.

The desired amount of curing agent and / or curing catalyst and / or curing inhibitor is added to the solvent composition, and the resulting mixture is preferably stirred until a clear solution is obtained. The compounds to be dissolved may be added to the solvent composition either together or separately. Alternatively, each compound may be dissolved separately in the solvent composition, and the resulting solution may be mixed. The preferred composition of the resulting solution of the present invention is as described above.

According to another aspect of the invention, one or more compounds selected from curing agents for epoxy resins, curing catalysts, and curing inhibitors are first added to component a) or component b) and optionally to a solvent composition thereof. The substance is dissolved in another solvent and then component b) or a) is added. For example, the dicyandiamide is preferably first dissolved in the glycol monoether or diether a) and the desired component c) and then component b) is added.

Another preferred embodiment of the present invention is an epoxy resin composition containing in the above solvent composition one or more compounds selected from an epoxy resin and preferably a curing agent for an epoxy resin, a curing catalyst and a curing inhibitor. Is.

This epoxy resin composition can be produced by a known method. According to a preferred method, a solution of the abovementioned curing agent and / or curing catalyst and / or curing inhibitor in the solvent composition of the invention is mixed with an epoxy resin. Usually, the epoxy resin is diluted with a solvent. The solvent for the epoxy resin may be added at the same time as or after mixing the epoxy resin with the solution of the curing agent, the curing catalyst and / or the curing inhibitor,
The epoxy resin is preferably premixed with the solvent. This epoxy resin solution is then mixed with a solution of a curing agent, a curing catalyst and / or a curing inhibitor to form an epoxy resin composition referred to in the art as a "one component epoxy resin composition."

The epoxy resin composition may include various epoxy resins, so long as it is curable, preferably cured with dicyandiamide. Curable epoxy resins are known in the art. Examples of effective epoxy resins are The Ha
ndbook of Epoxy Resins by Lee and K. Neville, published in 1967 by McGra
w-Hill, New York, in appendix 4-1, pp. 4-56 and U.S. Pat.No. 2,633,458, 3,
477,990, 3,821,243, 3,970,719, 3,975,397, 4,071,477, and 4,582
, 892, as well as British Patent Specification No. 1,597,610.

Effective solvents or diluents for epoxy resins are known in the art.
Preferred examples are 2-methylpentanediol- (2,4), toluene, o-dichlorobenzene, cyclohexanone, cyclohexanol, or more preferably ketones such as acetone, methyl ethyl ketone or methyl isobutyl ketone. Mixtures of different solvents are also effective in dissolving the epoxy resin. Preferably, the epoxy resin is dissolved in one, two, three or more components of the solvent composition of the present invention. Usually 50 to 95 percent of the total weight of epoxy resin and solvent, preferably 60.
~ 90 percent, more preferably 70-85 percent of the epoxy resin is dissolved or diluted in a suitable solvent.

The epoxy resin composition is preferably 0.05-based on the weight of the epoxy resin.
It contains 10 percent, more preferably 0.1 to 6 percent, and most preferably 0.5 to 4 percent hardener such as dicyandiamide. This epoxy resin composition,
It also preferably contains 0.01 to 4 percent, more preferably 0.05 to 2 percent of the curing catalyst, such as 2-methylimidazole, based on the weight of the epoxy resin. The epoxy resin composition may include a cure inhibitor, such as boric acid, to modify the cure catalyst. When present, such cure inhibitors are preferably present in an amount of 4 percent or less, more preferably 2 percent or less, based on the weight of the epoxy resin.

In the epoxy resin composition, the total mass of i) the epoxy resin, ii) the curing agent for the epoxy resin, iii) the curing catalyst, and iv) the curing inhibitor is the components i) to iv) and the epoxy resin composition. 35-95 percent, preferably 45, based on the total weight of the solvent present therein.
~ 75 percent, more preferably 50-70 percent.

All the solvents in the epoxy resin composition may constitute the solvent composition of the present invention.
However, the epoxy resin composition may contain other solvents, for example higher amounts of ketone than are preferred for the solvent composition of the present invention. Generally, 25 to 100 percent, preferably 40 to 100 percent, more preferably 40 to 60 percent of the solvent present in the epoxy resin composition is derived from the solvent composition of the present invention, with the remaining amount being an epoxy such as a ketone. It is a known solvent or diluent for resins.

Epoxy resin compositions are useful in a variety of applications, such as electrical laminates and the manufacture of coatings. A preferred embodiment of this epoxy resin composition is homogeneous,
When sufficiently impregnated with a reinforcing material such as glass roving or a reinforcing mat and curing by heating, the viscosity is low enough to give a reinforcing epoxy composition. Methods of impregnating the reinforcement with the epoxy resin composition and curing the epoxy resin composition are known in the art.

In the solvent composition of the present invention, i) epoxy resin, ii) curing agent for epoxy resin, iii)
A composition comprising a curing catalyst, and iv) one or more compounds selected from curing inhibitors,
In addition to these, other components may be included. For example, the composition may include solid particles such as a filler. Fillers that increase the flame retardancy of this composition are particularly effective. However, the composition does not contain more than 50 percent filler, based on its total mass, preferably 30 percent or less, more preferably 25 percent or less.

The term “include” as used herein means “include” and does not mean “consist of”. The invention will be further described by the following examples. This does not limit the invention. Parts and percentages are by weight unless otherwise indicated.

Examples 1-8 and Comparative Examples AC Solutions of dicyandiamide (DICY) in various solvents and solvent compositions are prepared. The concentrations are shown in Table 1 below. Visually check the prepared solution at room temperature (RT) for transparency. In Table 1, the clear solution is designated as "Y". Those that are not transparent are designated as "N". What is transparent at room temperature is tested for transparency after storage at 5 ° C for 24 hours.

In addition, Table 1 shows whether this solution contains dangerous or toxic chemicals. This is Annex I of Council Directive 67/548 / EEC
It is stipulated by the EU standard, which is a classification according to.

[0050]

[Table 1]

The DICY (dicyandiamide) solutions of Examples 2-8 in Table 1 are clear and do not contain hazardous or toxic chemicals as defined by the EU standards above. This also applies to Comparative Example B. However, as shown by Comparative Examples O and P in Table 4 below, solvent compositions containing propylene glycol methyl ether without carbonate and water are susceptible to change in the selected epoxy resin. A comparison between Examples 1 and 5 shows that the third component c) when the solvent composition comprises propylene carbonate,
For example, it has proved advantageous to include water in the solvent composition.

Examples 9-20 and Comparative Examples DP Solutions of dicyandiamide (DICY) in various solvents and solvent compositions are prepared. This solution is mixed with the epoxy resin solution. Examples 9 to 13 and Comparative Examples D to J
In, the epoxy resin is dissolved in propylene glycol methyl ether or ethylene glycol methyl ether. Examples 14-18 and Comparative Examples K and L
In, the epoxy resin is dissolved in methyl ethyl ketone. Examples 19 and 20
And in Comparative Examples MP, the epoxy resin is dissolved in acetone.

With the exception of Example 20 and Comparative Example P, a brominated epoxy resin in methyl ethyl ketone was used, which is commercially available from The Dow Chemical Company under the trademark DER539 EK80. In Example 20 and Comparative Example P, a brominated epoxy resin in acetone was used, which is a trademark of The Dow Chemical Company under the trademark DER592 A80.
Is commercially available as.

The composition of the final blend is shown in Tables 2-4 below. If the blend produced is clear and homogeneous at room temperature, it is classified as compatible with the epoxy resin,
". On the other hand, for example, when the obtained blend is cloudy and contains two phases, "N
".

A laminate is manufactured, and it is visually inspected whether or not dicyandiamide crystals are observed, and if they are observed, the degree thereof is indicated. This laminate has unacceptable laminate quality (U), acceptable laminate quality (ACC), standard laminate quality (ST
), And excellent laminate quality (SUP).

In addition, Tables 2-4 indicate whether this solution contains dangerous or toxic chemicals. This is Anne from Council Directive 67/548 / EEC
It is defined by the EU standard, which is a classification by x I.

[0057]

[Table 2]

[0058]

[Table 3]

[0059]

[Table 4]

The compositions of Examples 10-13, 19 and 20 were all compatible with the epoxy resin, which is why these compositions are classified as dangerous or toxic according to the EU criteria above. It means that it is transparent and homogeneous without the presence of dimethylformamide.

A comparison of Examples 9 and 10 shows that it is advantageous to include a third component c), for example water, in the lumber composition of the present invention when the solvent composition comprises propylene carbonate. There is. Examples 11 and 12 show that when the solvent composition comprises ethylene carbonate, the composition is compatible with the epoxy resin with or without a third component c), for example water. Is shown.

In Examples 14 to 18, when the epoxy resin was dissolved in methyl ethyl ketone,
Water content in the preferred range, namely propylene glycol methyl ether (component a)
2, based on the total mass of propylene carbonate (component b) and water (component c)
It has been shown to be preferable to keep at 15 percent, most preferably 5-12 percent. The compositions of Comparative Examples D-M and P all contain dimethylformamide that is not compatible with the epoxy resin or is classified as dangerous or toxic according to the EU criteria above.

The compositions of Comparative Examples O and P are volatile in the selected epoxy resin.
The composition of Comparative Example O is compatible with the DER539 EK80 ™ epoxy resin, while the composition of Comparative P is not compatible with the DER592 A80 epoxy resin. Example 19
And a comparison of 20 show that the solvent compositions of the present invention, especially those containing propylene glycol methyl ether, propylene carbonate and water, are compatible with two different epoxy resins.

─────────────────────────────────────────────────── ─── Continued front page    (81) Designated countries EP (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, I T, LU, MC, NL, PT, SE), OA (BF, BJ , CF, CG, CI, CM, GA, GN, GW, ML, MR, NE, SN, TD, TG), AP (GH, GM, K E, LS, MW, MZ, SD, SL, SZ, TZ, UG , ZW), EA (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM), AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, BZ, C A, CH, CN, CR, CZ, DE, DK, DM, DZ , EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, K G, KR, KZ, LC, LK, LR, LS, LT, LU , LV, MA, MD, MG, MK, MN, MW, MX, MZ, NO, NZ, PL, PT, RO, RU, SD, S E, SG, SI, SK, SL, TJ, TM, TR, TT , TZ, UA, UG, US, UZ, YU, ZA, ZW (72) Inventor Goodson, Alan Earl.             Federal Republic of Germany, 77836 Rheinmuen             Star, Gutenberg Strasse 8 (72) Inventor Eraser, Manuela             Germany, 76534 Baden-Ba             Gardenstraße 4 Den F-term (reference) 4J036 AA01 DA01 DC31 FA10 KA01

Claims (12)

[Claims] 1. A) glycol monoether or diether, and b) Organic low molecular weight compounds containing carbonate groups A solvent composition containing: 2. The solvent composition according to claim 1, further comprising c) a protic liquid other than glycol monoether or diether. 3. The component a) is represented by the following formula R ₁ O— (CH ₂ —CHR ₃ O) _n —R ₂ (I) (wherein _{one of} the substituents R ₁ and R ₂ has 1 carbon atom). ~ 12 alkyl groups,
The other is hydrogen, R ₃ is independently methyl or ethyl, and n is 1 to 4) The solvent composition according to claim 1 or 2, which is propylene or butylene glycol monoether. 4. In the formula I, one of the substituents R ₁ and R ₂ has 1 to 1 carbon atoms.
4. The solvent composition according to claim 3, which is an alkyl group of 4, the other is hydrogen, R ₃ is independently methyl, and n is 1, 2 or 3. 5. The solvent composition according to claim 1, wherein component b) is butylene carbonate, propylene carbonate or ethylene carbonate. 6. The solvent composition according to claim 2, wherein the component c) is water. 7. The solvent composition according to claim 1, which contains a) propylene glycol monoether, b) propylene carbonate, and c) water. 8. The solvent composition according to claim 1, which comprises a) propylene glycol monoether and b) ethylene carbonate. 9. A composition comprising at least 45 percent of component a), 1 to 30 percent of component b), and 0 to 25 percent of component c), based on the total mass of a), b) and c). Item 9. The solvent composition according to any one of items 2 to 8. 10. One or more compounds selected from i) an epoxy resin, ii) a curing agent for an epoxy resin, iii) a curing catalyst, and iv) a curing inhibitor, and the compound according to claim 1. A composition contained in the solvent composition according to item 1. 11. One or more compounds selected from i) epoxy resin, ii) curing agent for epoxy resin, iii) curing catalyst, and iv) curing inhibitor, and a) glycol monoether or diether, and b). A method for producing a composition containing one or more of the above compounds in a solvent composition by contacting with an organic low molecular weight compound containing a carbonate group. 12. An i) epoxy resin, ii) a curing agent for epoxy resin, iii) a curing catalyst, and iv) Curing inhibitor As a diluent for one or more compounds selected from a) glycol monoethers or diethers, and b) Organic low molecular weight compounds containing carbonate groups Use of.