JP2003340828A - Mold for molding resin - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mold which can simply regulate the relative positional relationship between holes required for positional accuracy in the mold used to mold a resin molding including the formation of a plurality of holes assured in the positional accuracy between the holes of an optical connector or the like made of a plastic represented by an MT type optical connector. <P>SOLUTION: The mold for molding a resin is used to mold the resin in such a state that a plurality of molding pins 22, 23 are positioned in a lateral alignment and held between pin holding bases 50 and 51 by respective positioning grooves 52, 53. The mold comprises: a pair of pin holding bases 50, 52 for sandwiching the plurality of molding pins 22, 23 for molding the holes of the resin molding; and the positioning grooves 52, 53 respectively formed on mated surfaces 50a, 51a of the bases 50, 51 to position the pins 22, 23. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mold used for molding a resin molded product having a plurality of holes, and particularly to a resin molded product including the formation of a plurality of holes in which positional accuracy between holes is secured. The present invention relates to a resin molding die used for molding.

[0002]

2. Description of the Related Art As a resin molded product in which a plurality of holes are formed with high accuracy in the positional accuracy between holes, for example, JI
MT type optical connector (M
There are plastic optical parts such as T: Mechanically Transferable. Mold for molding the MT type optical connector (hereinafter, also referred to as optical connector) (hereinafter, optical connector mold,
Or simply referred to as a “mold”), for example, JP-A-9-325139 and JP-A-11-7774.
The one disclosed in Japanese Patent Publication No. 1 and the like is known.

FIG. 3 is an exploded perspective view showing the structure of the conventional optical connector mold disclosed in the above publication, and FIG. 4 shows the outer wall portion of the lower mold of the optical connector mold shown in FIG. FIG. 5 is a view of the configuration as viewed from the direction indicated by arrow A, and FIG. 5 is a perspective view showing an optical connector molded using the mold shown in FIG. 3 and 5, the lower left direction is the front and the upper right direction is the rear as viewed in the drawings.

As shown in FIG. 5, an optical connector 40 has a main body 41 made of a synthetic resin, which penetrates the main body 41 in the front-rear direction to form a joint end face 4 for butt connection of the optical connector 40.
2 a pair of pin fitting holes 4 opened on both sides facing each other
3 (hereinafter, also referred to as guide pin holes), a plurality of optical fiber holes 44 formed side by side in the joint end face 42 between the pin fitting holes 43, and an adhesive is injected into the internal space of the main body 41. The window 45 and the like are formed to have a general structure. As is well known, the optical connector 40 is highly accurately positioned and connected by a pin fitting type positioning mechanism. For example, the pair of optical connectors 4 are connected.
In the case of the connection of 0s, the part of the guide pin (not shown) inserted and fixed in the pair of pin fitting holes 43 of the optical connector 40 and protruding from the joint end surface 42 of the optical connector 40 is provided in another optical connector 40. The optical fibers (not shown) inserted in the optical fiber holes 44 are abutted to each other with high positioning accuracy by inserting and fitting them into the pair of pin fitting holes 43 of FIG. Connected.

In FIGS. 3 and 4, reference numeral 10 is a lower mold of an optical connector mold, a lower mold body 11 and the lower mold body 1.
1 and a pin holder 12 that constitutes the front outer wall portion. A pair of large V grooves (molding pin grooves) 13 and a plurality of small V grooves (core pin grooves) 14 arranged between the large V grooves 13 are formed on the upper surface of the pin holding base 12 (a mating surface 12a with the upper die 30). Is provided. Reference numeral 20 denotes a pin holder, which includes a pin holder body 21, a pair of molding pins 22 extending forward from the front end surface of the pin holder body 21, and a pair of molding pins 22 located between the molding pins 22 and forward from the front end surface of the pin holder body 21. Core pin 2 extending toward
3 and 3. The molding pin 22 is for molding the pin fitting hole 43 of the optical connector 40, and the core pin 23 is for molding the optical fiber hole 44 of the optical connector 40. The pin holder body 21 also functions as a mold (core) that forms the internal space of the optical connector 40. Reference numeral 30 is an upper die of the mold, and an upper die body 31 and a pin holding base 32 that constitutes a front outer wall portion of the upper die body 31.
It is composed of and. The lower surface of the pin holding base 32 (a mating surface 32 a with the lower die 10) functions as a pressing surface that presses the molding pin 22 and the core pin 23 into the V grooves 13 and 14 of the lower die 10. Reference numeral 34 is a hole for injecting resin into the mold which has been clamped, and is formed so as to penetrate the upper mold body 31.

In the die having such a structure, the pin holder 2
0 is housed between the lower mold 10 and the upper mold 30 and clamped,
The optical connector 40 is obtained by injecting resin into the interior and molding (transfer molding). When the mold is clamped, the molding pin 22 and the core pin 23 are fixed to the lower mold 10 and the upper mold 3.
0, specifically, the pin holding base 1 of the lower mold 10 and the upper mold 30.
It is held so as to be sandwiched between 2 and 32, and is pressed by the large and small V-grooves 13 and 14 to be positioned with high precision.

[0007]

In the optical connector 40, the relative positional accuracy between the pin fitting hole 43 and the optical fiber hole 44 is ensured with high accuracy. However, in the conventional optical connector mold, since the relative positional relationship between the large V groove 13 and the small V groove 14 is fixed, for example, the formation position of the optical fiber hole 44 is about several μm to several tens μm. Even when changing (shifting to one of the guide pin holes side), a dedicated mold was prepared, and there was a complaint that the cost was high. For this reason, there has been a demand for the development of a technique capable of easily changing the formation position of the optical fiber hole (changing the relative position with respect to the guide pin hole) at low cost.
Also, in the case of molding various resin molded products such as synthetic resin optical parts other than optical connectors, including molding of a plurality of holes formed by ensuring the positional accuracy between holes with high accuracy, similarly, For the purpose of adjustment, there is a demand for a technique capable of easily adjusting the holding position of the hole forming pin in the forming die.

In view of the above-mentioned problems, the present invention is to change the hole forming position of a resin molded product formed by a plurality of holes, such as a resin optical component, with high accuracy in the positional accuracy between holes. It is an object of the present invention to provide a resin molding die that can be easily performed at low cost.

[0009]

In order to achieve the above object, the present invention proposes the following means. The resin molding die of the present invention has a pair of pin holding bases for sandwiching a plurality of molding pins for forming holes in a resin molded product, and a positioning groove for positioning the molding pins on a mating surface of each pin holding base. Each of them is formed and is used for resin molding in a state in which a plurality of molding pins are laterally positioned by the positioning groove and sandwiched between the pair of pin holding bases. According to a second aspect of the present invention, in the resin molding die according to the first aspect, a pair of the positioning grooves are provided on a mating surface of one of the pin holding bases, and a recess is formed between the positioning grooves. An elliptical concave portion is formed, the other pin holding base is a base portion projecting from a mating surface and inserted into the concave portion, and positioning grooves of the one pin holding base formed on both sides of the base portion. And a pressing surface for pressing the molding pin against the pin holding base on one of the pin holding bases of the base portion when the base portion is inserted into the recess. It is characterized in that a positioning groove for holding the molding pin is formed between the groove and the side surface so as to be arranged side by side. Claim 3
In the resin molding die according to the second aspect of the present invention, the outside dimension of the base portion in the lateral direction is set shorter than the inside dimension of the recess of the one pin holding base in the same direction. Characterize.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of a resin molding die according to the present invention (hereinafter sometimes referred to as "die") will be described below. FIG. 1 is a perspective view showing a mold 100 of this embodiment, and FIGS. 2A and 2B show the configurations of a lower die pin holding base 50 and an upper die pin holding base 51 of the die 100. It is the front view shown, (a) shows the state which pinched | pinched the shaping | molding pin 22 and the core pin 23 between the pin holding bases 50 and 51, and hold | maintains, (b) isolate | separated between the pin holding bases 50 and 51. It is shown.

The mold 100 of this embodiment is a JIS
MT type optical connector (MT: Mec
A hanically transferable resin molding die, which uses a pin holding base 50 instead of the pin holding base 12 of the lower mold 10 of the mold illustrated in FIGS. 3 to 5, and holds the pin of the upper mold 30. Instead of the table 32, a pin holding table 51 is adopted. The structure of the mold 100 other than the pin holders 50 and 51 is the same as the mold illustrated in FIGS. 3 to 5,
Among the constituent elements of this embodiment, those common to the structure of the conventional mold shown in FIGS. 3 to 5 are designated by the same reference numerals, and the description thereof will be omitted.

In FIGS. 1, 2 (a) and 2 (b), in the mold 100, when the lower mold 10 and the upper mold 30 are integrated during mold clamping, they are integrally provided in the lower mold body 11. The molding pin 22 and the core pin 23 are sandwiched and held between the pin holding base 50 and the pin holding base 51 integrally provided on the upper mold body 31. When the lower mold 10 and the upper mold 30 are separated by the mold opening, the pin holding bases 50 and 51 are opened, and the holding of the molding pin 22 and the core pin 23 between the pin holding bases 50 and 51 is released. It

The pin holder 40 is provided on the mating surface 50a with respect to the upper die pin holding base 51 of the lower die pin holding base 50.
Pair of positioning grooves 52 for positioning the molding pin 22 of
(Here, it is a V groove. Hereinafter, it may be referred to as “molding pin groove”) and the mating surface 50 is formed between these molding pin grooves 52.
A recess 50b having a shape recessed from a is formed. On a mating surface 51a of the upper die side pin holding base 51 with respect to the lower die side pin holding base 50, a base portion 51b to be inserted and housed in the recess 50b is provided in a protruding manner.

When the lower die and the upper die are integrated, they are formed on the molding pin groove 52 on the pin holding base 50 and the lower surface (a mating surface) of the base portion 51a accommodated in the recess 50b of the pin holding base 50. Positioning groove 53 (here, V groove.
However, a V groove corresponding to the positioning of the core pin 23 having a smaller diameter than the molding pin 22. Hereinafter, it may be referred to as a “core pin groove”). 1 and 2
Although (a) and (b) exemplify the pin holding base 51 having a base 51b in which four core pin grooves 53 are formed in parallel, the number of core pin grooves formed in the base 51b is four. The number is not limited to one, and may be one to three or five or more. Note that here, the molding pin 22 and the core pin 23
Both correspond to the molding pin according to claim 1. The molding pin groove 52 and the core pin groove 53 both correspond to the positioning groove according to the first aspect.

In this mold 100, the X of the base 51b is
Direction (lateral direction. Forming pin groove arrangement direction)
It is set to be shorter than the inner dimension b of the recess 50b of the pin holding base 50 on the lower die side in the same direction (X direction, lateral direction). Here, the X direction is a direction along a straight line connecting the centers of the molding pins 22 which are respectively positioned in the molding pin grooves 52. Inner dimension b of the recess 50b and outer dimension a of the base 51b
Since the dimensional difference between and does not include 0 (zero) that makes it substantially impossible to adjust the relative positional relationship in the X direction, its lower limit is b−a.
It is represented by> 0.

In the mold having such a structure, the inner dimension b of the recess 50b and the outer dimension a of the base 51b are as required.
The pin holding base 51 on the upper die 30 side is displaced in the X direction with respect to the pin holding base 50 on the lower die 10 side within the range of the dimensional difference from the pin holder 20 between the lower die 10 and the upper die 30. In a lateral direction with respect to the guide pin hole 43 (see FIG. 5) of the optical fiber hole 44 of the optical connector 40 obtained by molding by molding the resin by injecting resin into the inside and molding (transfer molding). The formation position of can be adjusted.

When the die is clamped, the molding pin 22 and the core pin 23 are sandwiched between the lower die 10 and the upper die 30, more specifically, between the pin holding bases 50 and 51 of the lower die 10 and the upper die 30. Are held in this manner, but at this time, the molding pin 22
The tip is positioned by being pressed into the molding pin groove 52 of the pin holding base 50 on the lower mold side by the pressing surface 51c which is the mating surface 51a on both sides via the base portion 51b of the pin holding base 51 on the upper mold 30 side, The tip of the core pin 23 is recessed in the pin holding base 50 on the lower die side by the core pin groove 53 on the lower surface (matching surface) of the base portion 51b of the pin holding base 51 on the upper die 30 side.
Positioning is performed so as to be sandwiched between the bottom surface 50c of b and the bottom surface 50c. The bottom surface 50c of the recess 50b functions as a pressing surface that presses the core pin 23 into the core pin groove 53 of the base 51b.

The position adjustment of the upper die pin holding base 51 in the X direction with respect to the lower die pin holding base 50 is performed, for example, in order to secure the positional accuracy of the optical fiber hole 44 of the optical connector 40 to be molded with high accuracy. Fine adjustment of the position of the core pin groove 53 (X
Direction, for example, a minute position adjustment of several μm or 1 μm or less) or eccentricity of the optical fiber hole 44 of the optical connector 40 (eccentricity due to displacement in the X direction with respect to the optical fiber hole of the mating optical connector to be butt-connected X). The position adjustment of several μm to several tens of μm can be performed in the direction), and the minute position adjustment of the core pin groove 53 and the eccentricity of the optical fiber hole 44 can be easily realized at low cost. However, in the mold according to this embodiment, the pin holding table 50,
Even if the relative positions of the 51 in the X direction are adjusted, the positional relationship of the pin holder 20 with respect to the lower mold 10 and the upper mold 30 and the holding position of the core pin 23 in the pin holder 20 are not changed.

The bottom surface 50c of the recess 50b of the pin holding base 50 on the lower die side and the pressing surface 5 of the pin holding base 51 on the upper die 30 side.
Reference numeral 1c denotes a flat surface, and even if the relative position adjustment in the X direction between the pin holding bases 50 and 51 is performed by a maximum of about several tens of μm as in the above-described eccentricity, the pair of pin holding bases 50 and 51 is
There is no influence on the holding state and the positioning state of the molding pin 22 and the core pin 23 between them.

The mold according to the present invention can be used for molding various synthetic resin optical connectors other than the MT type optical connector and various synthetic resin optical parts other than the optical connector. Further, it can be used for molding various resin molded products having a plurality of holes formed while ensuring mutual positional accuracy, other than optical components.
The molding pin groove and the core pin groove are not limited to the V groove,
For example, the cross-sectional shape is not particularly limited as long as the pin for forming a hole such as a U groove can be positioned with high precision. The specific shape of the pin holding base is not limited to the one exemplified in the above-mentioned embodiment, and can be appropriately changed within the scope of the gist of the present invention. For example, the pressing surface that presses the molding pin into the positioning groove (the molding pin groove of the above-described embodiment) of the pin holding base on the opposite side of the pin holding base on which the base is formed is the pin holding base on the base side. It is also possible to adopt a configuration in which the bottom surface of the concave portion or the surface of the trapezoidal convex portion formed by being depressed from the mating surface is formed near the position corresponding to the positioning groove. However, the pressing surface has a lateral direction so that the molding pin can be stably held and precisely positioned between the pair of pin holding bases even if the pin holding bases are relatively moved in the lateral direction. Is formed with a lateral extension dimension secured to the extent necessary for position adjustment.

[0021]

As described above, according to the present invention, the positioning for positioning the molding pins on the respective mating surfaces of the pair of pin holders for holding the pins for molding holes (molding pins) so as to sandwich them. Since the grooves are formed and the plurality of molding pins sandwiched between the pair of pin holding bases are positioned by the positioning grooves of each pin holding base and arranged side by side, the pair of pin holdings is held. By adjusting the relative position of the base in the horizontal direction, the relative position of the positioning groove of each pin holding base in the horizontal direction can be easily adjusted.
As a result, it is possible to easily adjust the forming position of the hole formed in the resin molded product formed by using this mold while ensuring the forming position accuracy.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing a mold according to an embodiment of the present invention.

2 (a) and 2 (b) are front views showing the configuration of the lower and upper die holding bases of the mold according to the embodiment of the present invention, and FIG. 2 (a) shows a state in which a molding pin is held. , (B)
Shows a state in which the pin holders are separated from each other.

FIG. 3 is an exploded perspective view showing a configuration of a conventional optical connector molding die.

4 is a view of the configuration of the outer wall portion of the lower die of the die shown in FIG. 3 as seen from the direction indicated by arrow A. FIG.

5 is a perspective view showing an optical connector manufactured using the mold shown in FIG.

[Explanation of symbols]

10 ... Lower mold, 22 ... Molding pin, 23 ... Molding pin (core pin), 30 ... Upper mold, 32 ... Pin holding base, 32
a ... mating surface, 40 ... resin molded product (optical connector),
43 ... hole for resin molded product, pin fitting hole (guide pin hole),
44 ... Hole of resin molded product (optical fiber hole), 50, 5
1 ... Pin holder, 50a, 51a ... Mating surface, 50
b ... Recessed portion, 50c ... Bottom surface (holding surface), 51b ... Stand portion, 51c ... Holding surface, 52 ... Positioning groove (molding pin groove, V groove), 53 ... Positioning groove (core pin groove, V)
Groove), 100 ... Mold for resin molding.

   ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 2H036 JA02 QA18 QA20                 4F202 AG28 AH34 AH77 CA12 CA30                       CB01 CK13 CK53

Claims (3)

[Claims] 1. Holes (43, 44) in a resin molding (40)
A pair of pin holding bases (50, 51) sandwiching a plurality of molding pins (22, 23) for molding are provided, and positioning grooves (for positioning the molding pins on the mating surfaces (50a, 51a) of the respective pin holding bases). 52, 53) are respectively formed and are used for resin molding in a state where a plurality of molding pins are laterally positioned by the positioning groove and sandwiched between the pair of pin holding bases. Mold (100). 2. A pair of the positioning grooves and a recess (50b) recessed from the mating surface between the positioning grooves are formed on the mating surface of one of the pin holders, and the other pin holding base is formed. The base has a base portion (51b) projecting from the mating surface and inserted into the concave portion, and pressing surfaces that are formed on both sides of the base portion and press the molding pin into the positioning groove of the one pin holding base ( 51c), the mating surface of the base portion with respect to the one pin holding base is arranged side by side with the pair of positioning grooves of the one pin holding base when the base portion is inserted into the recess. The resin molding die according to claim 1, wherein a positioning groove for holding the molding pin is formed between the molding die and a bottom surface (50) of the recess. 3. The lateral outer dimension (a) of the base is
Inner dimension in the same direction of the concave portion of the one pin holding base (b)
The mold for resin molding according to claim 2, wherein the mold is set shorter.