JP2003338010A - Magnetic head slider assembly and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a magnetic head slider assembly having good heat radiation characteristics during the operation of a magnetic head. <P>SOLUTION: This magnetic head slider assembly is arranged on the yoke 6B of an upper magnetic pole 6, and provided with a heat sink layer 60 for conducting heat to the yoke 6B. When an overcoat layer 2 is made of alumina having low heat conductivity, heat generated during the operation of a magnetic head 12 is conducted from the yoke 6B to the heat sink layer 60, and the heat is smoothly radiated through the heat sink layer 60. In this case, since heat radiation characteristics are improved by an amount equal to the heat radiation operation of the heat sink layer 60 compared with a conventional magnetic head slider assembly not equipped with a heat sink layer 60, less heat is accumulated. Thus, good heat radiation characteristics are secured during the operation of the magnetic head 12. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a magnetic head slider assembly including a slider and a magnetic head provided on the slider, and a method of manufacturing the same.

[0002]

2. Description of the Related Art Generally, a composite type magnetic head having both an information reproducing function and an information recording function (hereinafter, simply referred to as a "magnetic head") is a magnetoresistive (MR) element for executing a reproducing process. And a recording head unit that executes a recording process are stacked. This type of magnetic head is provided, for example, in a slider head (hereinafter simply referred to as “slider”) attached to the tip of an actuator arm in a hard disk device, and constitutes a magnetic head slider assembly together with the slider. There is.

20 and 21 show the configuration of a conventional magnetic head slider assembly. FIG. 20 shows a cross-sectional structure of the magnetic head slider assembly, and shows a cross section taken along line XX-XX shown in FIG.
21 is an enlarged plan view of the main surface (trailing side end surface) of the magnetic head slider assembly shown in FIG.

As shown in FIG. 20, this magnetic head slider assembly is attached to one surface (bonding surface 115) of an actuator arm 130, and a magnetic head 112 and a protective layer are provided on a slider 111 as a base. And the overcoat layer 102 are sequentially laminated. The magnetic head 112 includes a slider 11
1 includes a reproducing head portion 112A and a recording head portion 112B in order from the side closer to 1, and an air bearing surface (ABS) on the side facing a magnetic recording medium (not shown) such as a magnetic disk. Has 101.

The reproducing head section 112A includes a slider 111.
From the side closer to the base layer 103 and the lower shield layer 1
21, the lower gap layer 122, and the upper gap layer 12
4 and a lower magnetic pole 104 as an upper shield layer are laminated. The air bearing surface 101 is provided between the lower gap layer 122 and the upper gap layer 124.
The MR element 108 is embedded so that one end is exposed. The MR element 108 has, for example, a laminated structure including a magnetic sensitive layer and a magnetization fixed layer (neither is shown).

The recording head portion 112B is the reproducing head portion 1
Insulating layer 1 in which lower magnetic pole 104, recording gap layer 107, and induction coil 105 are embedded in this order from the side closer to 12A.
23 and the upper magnetic pole 106 are laminated. An inner conductor 119 embedded in the overcoat layer 102 is connected to the outer peripheral end of the induction coil 105.

An end face (end face on the trailing side) 11 of the overcoat layer 102 on the trailing side (lower side in FIG. 20).
As shown in FIG. 21, four electrode pads 110A, 110B, 120A, which are electrically isolated from each other,
120B is provided. Of these, the electrode pad 11
0A and 110B are for supplying a current to the reproducing head portion 112A (MR element 108) via the internal conducting wire 109, while the electrode pads 120A and 120B are
This is for supplying a current to the recording head portion 112B (induction coil 105) via the internal conducting wire 119. As shown in FIG. 20, the electrode pad 120A has the external lead wire 1 drawn along the actuator arm 130.
It is connected to 13. The other electrode pad 110
A, 110B, and 120B are also connected to an external conductive wire (not shown) similarly to the electrode pad 120A.

In the reproducing head portion 112A, the MR element 10
In 8, when the magnetization direction of the magnetic sensitive layer changes according to the signal magnetic field from the magnetic recording medium, the relative relationship between the magnetization direction of the magnetic sensitive layer and the magnetization direction of the fixed magnetization layer changes. At this time, when a reproducing current (sense current) is passed through the MR element 108, a relative change in the magnetization direction between the magnetic sensing layer and the magnetization fixed layer is detected as a change in the electric resistance. Information is magnetically reproduced based on the change. On the other hand, in the recording head unit 112B, the induction coil 1
When a recording current (recording current) flows in 05, a magnetic flux is generated in the magnetic path including the lower magnetic pole 104 and the upper magnetic pole 106. A recording magnetic field is generated in the vicinity of the recording gap layer 107 on the air bearing surface 101 by utilizing this magnetic flux, so that the magnetic recording medium is magnetized based on the recording magnetic field, and information is magnetically recorded.

Regarding the magnetic head slider assembly, some related techniques are already known. Specifically, for example, Seagle discloses a magnetic head slider assembly having a configuration similar to that shown in FIGS. 20 and 21 (see, for example, Patent Document 1). In this magnetic head slider assembly, conductive leads for supplying a current to the reproducing head portion and the recording head portion are provided so as not to pass through the insulating layer and the shield layer.

[0010]

[Patent Document 1] US Pat. No. 5,936,811

Also, for example, Chang et al. Discloses a composite type magnetic head in which a magnetic pole tip of a recording head portion is formed through a self-aligned forming process (see, for example, Patent Document 2). Chang et al. Also touch on examples of the use of overcoat layers.

[0012]

[Patent Document 2] US Pat. No. 6,158,107

Further, for example, in Maries et al., A circuit element for executing a reproducing process and a recording process is provided on a chip, and the circuit element uses a glass ceramic material having a coefficient of thermal expansion similar to that of an adhesive agent. A magnetic head slider assembly bonded to a chip is disclosed (for example, see Patent Document 3). Maries et al. Also discloses a technique for attaching a magnetic head slider assembly to a support arm, and utilizes the thermal conductivity of the material (metal) of the support arm along with the flow of air to cool the circuit element.

[0014]

[Patent Document 3] US Pat. No. 3,770,403

Further, Phipps et al., For example, touch on the problem of static electricity accumulation that occurs when the composite magnetic head moves at high speed (see, for example, Patent Document 4). Specifically, in Phipps and the like, in order to discharge the electric charge accumulated in the magnetic head, a connecting element is welded to an existing electrode pad located at the end.

[0016]

[Patent Document 4] US Pat. No. 5,757,590

Also, for example, Wang et al. Disclose a magnetic coil and a magnetic head slider assembly used in the field of magneto-optical recording (for example, refer to Patent Document 5).

[0018]

[Patent Document 5] US Pat. No. 6,130,863

Further, for example, Han et al. Disclose a magnetoresistive effect reproducing head having a typical structure related to the composite magnetic head referred to in the present invention (see, for example, Patent Document 6). .

[0020]

[Patent Document 6] US Pat. No. 6,103,136

Further, for example, Ibaraki et al. Disclose a magnetic head in which a star-shaped metal pattern is provided on an overcoat layer in order to release Joule heat (see, for example, Patent Document 7).

[0022]

[Patent Document 7] Japanese Patent No. 5266428

[0023]

By the way, when the magnetic head 112 operates, a recording current flows through the induction coil 105 during a recording operation and a sense current flows through the MR element 108 during a reproducing operation. Joule heat is generated in the head 112, and the heat easily accumulates. In this case, the heat dissipation of the magnetic head 112 mainly depends on the thermal conductivity of the overcoat layer 102 covering the magnetic head 112. This overcoat layer 102 is typically formed using aluminum oxide (Al ₂ O ₃ ; hereinafter simply referred to as “alumina”) using sputtering.
Say. ) Is deposited. Magnetic head 112
Considering the operational stability of the magnetic head slider assembly, the heat dissipation of the magnetic head slider assembly is one of the important factors.

However, in the conventional magnetic head slider assembly, no specific proposal has been made regarding the improvement of heat dissipation except Ibaraki and the like. In the conventional magnetic head slider assembly, the overcoat layer 1
02 is composed of alumina having low thermal conductivity,
Since the heat generated during the operation of the magnetic head 112 is not easily dissipated, the temperature tends to rise locally due to heat accumulation. When a local temperature rise occurs in the magnetic head 112, for example, a complicated thermal stress is applied to a series of constituent elements of the magnetic head 112, so that the reproducing head unit 1
12A and the recording head portion 112B are not only affected, but also due to the difference in the coefficient of thermal expansion between the constituent elements, a protrusion defect (thermal) on the air bearing surface 101.
protrusion) may occur. When this protrusion defect occurs and the magnetic head 112 contacts the magnetic recording medium during operation, the magnetic head 112 and the magnetic recording medium are physically damaged. Therefore, the magnetic head 11
In order to operate Stable 2 stably, it is necessary to suppress heat accumulation as much as possible by improving the heat dissipation of the magnetic head slider assembly.

The present invention has been made in view of the above problems, and a first object thereof is to manufacture a magnetic head slider assembly having a heat dissipation property superior to that of the conventional magnetic head slider assembly. It is to provide a method of manufacturing a slider assembly.

A second object of the present invention is to provide a method of manufacturing a magnetic head slider assembly which is capable of stably and easily manufacturing a magnetic head slider assembly having excellent heat dissipation using an existing manufacturing process. To provide.

A third object of the present invention is to provide a magnetic head slider assembly having excellent heat dissipation during the operation of the magnetic head.

A fourth object of the present invention is to provide a magnetic head slider assembly capable of suppressing the occurrence of defects due to protrusion defects during the operation of the magnetic head.

[0029]

A method of manufacturing a magnetic head slider assembly according to a first aspect of the present invention includes a lower magnetic pole piece, an upper magnetic pole tip, a yoke, and a lower magnetic pole piece and a lower magnetic pole piece. A step of forming a magnetic head so as to include a recording element having an induction coil provided, a step of forming a heat sink layer so as to cover at least a part of an upper surface of the yoke and conduct heat to the yoke, and the heat sink And a step of forming an insulating overcoat layer so as to cover the layer.

A method of manufacturing a magnetic head slider assembly according to a second aspect of the present invention comprises a lower magnetic pole piece, an upper magnetic pole tip, a yoke, and an induction coil arranged between the lower magnetic pole piece and the yoke. Forming a magnetic head including a recording element having a magnetic field, a step of forming a heat sink layer so as to be partially connected to the lower magnetic pole piece and thermally conducting with the lower magnetic pole piece, and covering the heat sink layer. As described above, a step of forming an insulating overcoat layer is included.

In the method of manufacturing the magnetic head slider assembly according to the first or second aspect of the present invention, the heat sink layer is formed so as to be in thermal conduction with the yoke or the lower pole piece by using only the existing manufacturing process. It

A magnetic head slider assembly according to a first aspect of the present invention includes a lower magnetic pole piece, an upper magnetic pole tip, and
A magnetic head including a recording element having a yoke, an induction coil arranged between the lower magnetic pole piece and the yoke, and at least a part of the upper surface of the yoke, and being arranged so as to conduct heat with the yoke. And a heat sink layer, and an insulating overcoat layer disposed so as to cover the heat sink layer.

A magnetic head slider assembly according to a second aspect of the present invention comprises a lower magnetic pole piece, an upper magnetic pole tip, and
A magnetic head including a recording element having a yoke and a lower magnetic pole piece and an induction coil arranged between the lower magnetic pole piece and the yoke; and a magnetic head that is partially connected to the lower magnetic pole piece and is in thermal conduction with the lower magnetic pole piece. The heat sink layer is provided, and the insulating overcoat layer is provided so as to cover the heat sink layer.

In the magnetic head slider assembly according to the first or second aspect of the present invention, the heat sink layer thermally conducts heat with the yoke or the bottom pole piece, so that the heat generated during the operation of the magnetic head is smoothly transmitted through the heat sink layer. Is radiated to.

In the magnetic head slider assembly or the method of manufacturing the same according to the first aspect of the present invention, even if the heat sink layer extends so as to entirely cover both the upper surface of the yoke and the area where the induction coil is disposed. Alternatively, it may extend so as to partially cover both the upper surface of the yoke and the area where the induction coil is disposed.

Further, in the magnetic head slider assembly or the method for manufacturing the same according to the first aspect of the present invention, the heat sink layer has a first layer as a spacer layer which is electrically insulating and is connected to the upper surface of the yoke. , A second layer made of an electrically conductive material or a magnetic material may be laminated.

In the magnetic head slider assembly or the method of manufacturing the same according to the second aspect of the present invention, the heat sink layer is connected to the upper surface of the lower pole piece and extends over the area corresponding to the area where the induction coil is disposed. It may be present, or it may be connected to the lower surface of the lower pole piece and extend over an area corresponding to the area where the induction coil is arranged.

Further, in the magnetic head slider assembly or the method for manufacturing the same according to the second aspect of the present invention, the heat sink layer has the first layer as the spacer layer which is electrically insulating and is connected to the lower pole piece. , A second layer made of an electrically conductive material or a magnetic material may be laminated.

Further, in the magnetic head slider assembly or the method of manufacturing the same according to the first or second aspect of the present invention, the heat sink layer is made of a material having higher thermal conductivity than the overcoat layer. Is preferred. In this case, it is particularly preferable that the heat sink layer contains either an electrically conductive material or a magnetic material, and specifically, copper (Cu), gold (A
u), silver (Ag), nickel (Ni), aluminum (Al), tantalum (Ta), tungsten (W), and an alloy containing at least one of these alloys. preferable.

Further, in the magnetic head slider assembly or the method of manufacturing the same according to the first or second aspect of the present invention, the second layer is made of copper (Cu) and is 0.25 μm.
has a thickness in the range of m to 10 μm, the first
Is composed of aluminum (Al ₂ O ₃ )
It may have a thickness in the range of greater than 10 μm and greater than 10 μm.

In the magnetic head slider assembly or the method for manufacturing the same according to the first or second aspect of the present invention, the overcoat layer is formed of aluminum oxide (Al).
₂ O ₃ ) may be included.

[0042]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

[First Embodiment] First, the structure of a magnetic head slider assembly according to a first embodiment of the present invention will be described with reference to FIGS. FIG. 1 shows a cross-sectional structure of a magnetic head slider assembly.
3 shows a cross section taken along line I-I shown in FIG. 2. Figure 2
Is an enlarged plan view of the main surface (end surface on the trailing side) of the magnetic head slider assembly shown in FIG. 1, and FIG. 3 is an enlarged sectional view of the main part (recording head section) of the magnetic head slider assembly. FIG. 4 schematically shows the planar structure of the main part (heat dissipation layer etc.) of the magnetic head slider assembly.

As shown in FIG. 1, this magnetic head slider assembly is attached to one surface (bonding surface 15) of an actuator arm 30, and a slider head (hereinafter simply referred to as "slider") 11 as a base body.
The magnetic head 12, the heat sink layer 60, and the insulating overcoat layer 2 are laminated in this order on the top. The magnetic head 12 is a composite type head that performs both a reproducing function and a recording function, and is a slider 11
A reproducing head portion 12A and a recording head portion 12B (recording element) in order from the side closer to the air bearing surface, and has an air bearing surface 1 on the side facing a magnetic recording medium (not shown) such as a magnetic disk. ing.

The slider 11 is made of, for example, AlTiC (Al ₂ O ₃ .TiC) and has a thickness of about 1.2 mm.

The reproducing head section 12A is for magnetically reproducing the information recorded on the magnetic recording medium.
As shown in FIG. 5, the underlayer 3, the lower shield layer 21, and the lower gap layer 22 are arranged in this order from the side closer to the slider 11.
The upper gap layer 24 and the lower magnetic pole 4 (lower magnetic pole piece) as the upper shield layer are laminated. The MR element 8 is embedded between the lower gap layer 22 and the upper gap layer 24 so that one end is exposed on the air bearing surface 1.

The underlayer 3 is made of an insulating material such as aluminum oxide (Al ₂ O ₃ ; hereinafter simply referred to as “alumina”), and has a thickness of about 1.8.
μm. The lower shield layer 21 and the lower magnetic pole 4 are
The MR element 8 is magnetically separated from the surroundings. For example, both are made of a magnetic material such as nickel-iron alloy (NiFe), and their thickness is about 1.8 μm. The lower gap layer 22 and the upper gap layer 24 are
The MR element 8 is electrically isolated from the surroundings and is made of, for example, an insulating material such as alumina and has a thickness of about 0.2 μm. The MR element 8 is, for example,
A spin-valve structure (MR) having a spin-valve structure, and more specifically, a spin-valve structure (MR) having a magnetic sensitive layer whose magnetization direction changes according to a signal magnetic field from a magnetic recording medium and a magnetization fixed layer whose magnetization direction is fixed. Film), a pair of magnetic domain control films provided on both sides of the MR film, and a pair of lead layers provided on the pair of magnetic domain control films and used for passing a sense current through the MR film. It is configured to include.

The recording head portion 12B magnetically records information on a magnetic recording medium. As shown in FIGS. 1 and 3, the lower magnetic pole 4 and the lower magnetic pole 4 are arranged in this order from the side closer to the reproducing head portion 12A. The recording gap layer 7, the insulating layer 23 in which the induction coil 5 is embedded, and the upper magnetic pole 6 are laminated.

The lower magnetic pole 4 and the upper magnetic pole 6 are connected to each other at an opening 7A provided in the recording gap layer 7 to form a magnetic flux flow path (magnetic path). It is made of a magnetic material such as (NiFe). The lower magnetic pole 4 is, for example,
It has a step structure in which the thickness of the front portion and the rear portion is larger than the thickness of the central portion. The recording gap layer 7 is, for example,
It is made of an insulating material such as alumina and has a crank structure corresponding to the step structure of the lower magnetic pole 4. The induction coil 5 is for generating a magnetic flux for recording, and has, for example, a spiral structure wound around the opening 7A so as to pass through a region between the lower magnetic pole 4 and the upper magnetic pole 6. Have The insulating layer 23 buries the induction coil 5 in a region between the lower magnetic pole 4 and the upper magnetic pole 6,
The induction coil 5 is electrically separated from the surroundings and is made of, for example, an insulating material such as photoresist.

In particular, the upper magnetic pole 6 is arranged, for example, as shown in FIG. 3, in three elements separated from each other, that is, in the vicinity of the air bearing surface 1, and the upper pole tip exposed on the air bearing surface 1 is provided. 6A (upper magnetic pole tip), a yoke 6B which is arranged so as to recede from the air bearing surface 1 and which is connected to the upper pole tip 6A so as to partially overlap with it, and is arranged in an opening 7A of the recording gap layer 7, Stitched pole type including a connecting portion 6C connected to both the lower magnetic pole 4 and the yoke 6B (st
Itched pole type) structure.

The heat sink layer 60 dissipates heat generated during the operation of the magnetic head 12 by conducting heat with the upper magnetic pole 6 (yoke 6B). The heat sink layer 60 is made of, for example, a material having higher thermal conductivity than the surrounding components including the overcoat layer 2 (for example, the insulating layer 23, the recording gap layer 7, etc.), specifically, an electrically conductive material or a magnetic material. Material, more specifically at least one of copper (Cu), gold (Au), silver (Ag), nickel (Ni), aluminum (Al), tantalum (Ta), tungsten (W) and alloys thereof. It is composed of two heat conductive materials.

In particular, the heat sink layer 60 has electrical insulation and the yoke 6 as shown in FIG. 3, for example.
A spacer layer 62 (first layer) connected to B and a heat dissipation layer 64 (second layer) that functions as a substantial heat dissipation portion are stacked, that is, the spacer layer 62 causes the heat dissipation layer 64 to move from the yoke 6B. It has an electrically separated structure.
The spacer layer 62 is made of, for example, an insulating material such as alumina, and its thickness is in the range of more than about 0 μm and about 10 μm or less. The heat dissipation layer 64 is made of the heat conductive material listed above as a constituent material of the heat sink layer 60, for example, copper, and has a thickness of about 0.
It is 25 μm to 10 μm. Needless to say, when the heat dissipation layer 64 is made of a magnetic material, the magnetic material must have thermal conductivity. This heat sink layer 60 (spacer layer 62, heat dissipation layer 64)
Are arranged so as to cover at least a part of the upper surface of the yoke 6B. Specifically, for example, as shown in FIG. 4, the upper surface of the yoke 6B has a rectangular planar shape. Also, it extends so as to entirely cover both the area where the induction coil 5 is arranged. In addition, in FIG. 4, the induction coil 5,
Only the upper pole chip 6A, the yoke 6B and the heat sink layer 60 (the spacer layer 62, the heat dissipation layer 64) are shown, and only the outer edge of the induction coil 5 is shown.

The overcoat layer 2 is for protecting the magnetic head 12 from the surroundings. The overcoat layer 2 is arranged so as to cover the heat sink layer 60 and its peripheral region, and is made of, for example, an insulating material such as alumina. An internal conductor 19 having one end connected to the outer peripheral end of the induction coil 5 and the other end connected to an electrode pad 20A (see FIG. 2) described later is embedded in the overcoat layer 2.

On the overcoat layer 2, that is, on the trailing side (lower side in FIG. 1) end surface (trailing side end surface) 14 of the overcoat layer 2, as shown in FIG. Four separated electrode pads 10
A, 10B, 20A and 20B are provided. Each of these electrode pads 10A, 10B, 20A, 20B has, for example, a rectangular planar shape and is made of gold (A
u), silver (Ag), aluminum (Al) or copper (C
It is composed of a material having electrical conductivity and thermal conductivity such as u), specifically, a gold-plated film patterned by using a plating process. Of these, electrode pad 1
0A and 10B are reproduction heads 12 via the internal conductor 9.
For supplying a current to A (MR element 8),
On the other hand, the electrode pads 20A and 20B are for supplying a current to the recording head portion 12B (induction coil 5) via the internal conductor wire 19.

As shown in FIG. 1, the electrode pad 20A is connected to the external conductor 13 drawn along the actuator arm 30 to the magnetic head slider head assembly. The electrode pad 20B is the electrode pad 20.
Similar to A, it is connected to the inner terminal portion of the induction coil 5 through an internal conductor (not shown) embedded in the overcoat layer 2 and is also connected to an external conductor (not shown). The electrode pads 10A and 10B are both connected to the MR element 8 via an internal conductor (not shown), and
It is connected to an external conductor (not shown).

Four electrode pads 10A, 10B, 20
At least one of A and 20B has a larger area than the other three. Specifically, for example, as shown in FIG. 2, the electrode pad 20A is a large electrode pad having a larger area than the other three electrode pads 10A, 10B, and 20B. 1
0B, 20B, and a main body portion 16 having the same area as those of the three electrode pads 10A, 10B, 20B, and provided so as to cover at least a region where the magnetic head 12 is disposed, connected to the main body portion 16. And a substantially quadrangular extension portion 17 that is formed.

Electrode pads 10A, 10B, 20A, 20
The size of B is as follows, for example. That is, in the electrode pad 20A, the planar size of the main body portion 16 is about 5
0 μm to 250 μm × 50 μm to 250 μm, the thickness is about 4 μm to 5 μm, and the planar dimension of the expansion portion 17 is about 1
50 μm to 250 μm × 150 μm to 250 μm (preferably about 200 μm × 200 μm), and the thickness is about 4 μm
It is 5 μm. In addition, the electrode pads 10A, 10B, 20
Plane size of B is about 50 μm to 250 μm × 50 μm to 2
The thickness is 50 μm and the thickness is about 1 μm to 6 μm.

In this magnetic head slider assembly,
Information reproduction processing and recording processing are executed based on the following operation principle.

That is, at the time of reproduction, the reproduction head unit 12
In the MR element 8 of A, when the magnetization direction of the magnetic susceptibility layer changes according to the signal magnetic field from the magnetic recording medium, the relative relationship between the magnetization direction of the magnetic susceptibility layer and the magnetization fixed layer changes. To do. At this time, when a reproducing current (sense current) is passed through the MR element 8, a relative change in the magnetization direction between the magnetic sensitive layer and the magnetization fixed layer with respect to the signal magnetic field is detected as a change in electrical resistance. Information is magnetically reproduced based on the change in electric resistance.

On the other hand, at the time of recording, when a recording current (recording current) flows through the induction coil 5 of the recording head portion 12B,
Magnetic flux is generated in the magnetic path including the lower magnetic pole 4 and the upper magnetic pole 6. A recording magnetic field is generated in the vicinity of the recording gap layer 7 on the air bearing surface 1 by utilizing this magnetic flux, and the magnetic recording medium is magnetized based on the recording magnetic field, so that information is magnetically recorded.

Next, a method of manufacturing the magnetic head slider assembly will be described with reference to FIGS. It should be noted that the materials, dimensions, and the like of the respective constituent elements of the magnetic head slider assembly have already been described in detail below, and thus the description thereof will be omitted as appropriate.

In manufacturing the magnetic head slider assembly, as shown in FIG. 1, first, as shown in FIG. 1, the underlayer 3 is formed on the slider 11 by using, for example, sputtering, and then the plating process is used, for example. The lower shield layer 21 is patterned on the underlayer 3. Subsequently, the lower gap layer 22 is formed on the lower shield layer 21 by using, for example, sputtering, and then the MR element 8 is patterned on the gap layer 22.

The MR element 8 is formed by the following procedure, for example. That is, first, by using, for example, sputtering, a seed layer, a magnetic sensing layer (free layer), a nonmagnetic layer (spacer layer), a magnetization fixed layer (pinned layer),
After a magnetization fixed layer (pinning layer) and a protective layer are sequentially stacked to form a multilayer film, the multilayer film is patterned by using, for example, photolithography and ion milling to form an MR film. . Then, a pair of magnetic domain control films and a pair of lead layers are sequentially formed on the lower gap layer 22 so as to face each other with the MR film interposed therebetween. Finally, the MR element 8 is completed by forming the internal conducting wire 9 (see FIG. 2) made of copper (Cu) so as to be connected to the pair of lead layers.

Then, the upper gap layer 24 is formed so as to cover the MR element 8 and the lower gap layer 22 around the MR element 8 by using, for example, a sputtering method.
MR between the lower gap layer 22 and the upper gap layer 24
After embedding the element 8, for example, using a plating process,
By patterning the lower magnetic pole 4 as the upper shield layer on the upper gap layer 24, the read head unit 12 is formed.
Form A.

Then, as shown in FIG. 1 and FIG.
By forming the recording gap layer 7 so as to cover the lower magnetic pole 4 and the upper gap layer 24 around the lower magnetic pole 4 by using, for example, sputtering, and then selectively etching the recording gap layer 7 by using, for example, ion milling. , The opening 7A is formed.

Subsequently, the upper pole tip 6A forming a part of the upper magnetic pole 6 is patterned on the recording gap layer 7 by using, for example, a plating process, and the opening 7A is formed.
After patterning the connecting portion 6C, the induction coil 5 is patterned on the recording gap layer 7 so as to be wound around the connecting portion 6C, for example, by using a plating process. Subsequently, a photoresist film is patterned so as to cover the induction coil 5, and then the photoresist film is heated to form the insulating layer 23. Note that FIG.
In the above, the case where the induction coil 5 is formed in only one stage is shown, but the present invention is not limited to this, and the induction coil 5 may be formed in two or more stages.

Subsequently, for example, a plating process is used to cover the insulating layer 23 and, in the front, the top pole tip 6 is formed.
Patterning the yoke 6B so as to be connected to A and to be connected to the connecting portion 6C at the rear, and to form the upper pole 6 of the stitched pole type structure including the upper pole tip 6A, the yoke 6B and the connecting portion 6C. Thus, the recording head portion 12B is formed. As a result, the magnetic head 12 including the reproducing head portion 12A and the recording head portion 12B is constructed.

Subsequently, the heat sink layer 60 is formed by sequentially patterning and laminating the spacer layer 62 and the heat dissipation layer 64 on the yoke 6B of the upper magnetic pole 6 by using, for example, sputtering or plating. Form. When forming the heat sink layer 60, for example, as shown in FIGS. 3 and 4, both the yoke 6B and the region where the induction coil 5 is disposed are entirely covered and extended.

Subsequently, as shown in FIG. 1, the overcoat layer 2 is formed so as to cover the recording head portion 12B by using, for example, sputtering.

Subsequently, the overcoat layer 2 is selectively etched to form a through hole 2A in the overcoat layer 2. When forming the through hole 2A, for example, a photoresist pattern (not shown) is formed so as to cover the trailing side end surface 14 of the overcoat layer 2, and then ion milling is used together with the photoresist pattern. Then, the overcoat layer 2 is dug down until the outer end portion of the induction coil 5 is exposed.

Then, for example, by using a plating process, the inner conductor 19 is formed in the through hole 2A so that one end is connected to the outer end of the induction coil 5 and the other end is exposed to the trailing end face 14. To form a pattern. When forming the internal conductor 19, the same technique is used to connect one end to the inner end of the induction coil 5 and expose the other end to the trailing end face 14 so that the other internal conductor is not exposed. 19 are formed, and two internal conducting wires 9 are formed so that one end is connected to the MR element 8 and the other end is exposed at the trailing side end face 14 (see FIG. 2).

Then, as shown in FIG. 2, by using, for example, a plating treatment, the four inner conductive wires 9 and 19 exposed on the trailing side end surface 14 of the overcoat layer 2 are respectively connected, Four electrode pads 10A, 10
B, 20A, and 20B are patterned. When forming these electrode pads 10A, 10B, 20A, and 20B, for example, a photoresist pattern is formed so as to cover the trailing side end surface 14, and for example, a plating process is used to cover the photoresist pattern. After forming the plating film, the photoresist pattern is lifted off. Particularly, when forming the electrode pad 20A, the main body portion 16 having the same area as the other three electrode pads 10A, 10B, 20B, and the main body portion 16 are formed.
And an extended portion 17 that covers at least the area where the magnetic head 12 is disposed.

Finally, the electrode pads 10A, 10B, 20
The magnetic head slider assembly is completed by forming the external conductors 13 so as to be connected to A and 20B, respectively, and then forming the air bearing surface 1 by using machining or polishing.

In the magnetic head slider assembly according to this embodiment, the heat sink layer 60 disposed on the yoke 6B of the upper magnetic pole 6 and conducting heat with the yoke 6B.
As described above in the section “Problems to be solved by the invention”, the operation of the magnetic head 12 when the overcoat layer 2 is made of alumina having low thermal conductivity is described. The heat generated at some time is conducted from the yoke 6B to the heat sink layer 60, and the heat is smoothly radiated through the heat sink layer 60. In this case, as compared with the conventional magnetic head slider assembly that does not include the heat sink layer 60 (see FIGS. 20 and 21), the heat dissipation characteristics of the heat sink layer 60 are improved by the heat dissipation effect, so that heat is accumulated. It gets harder. Therefore, in the present embodiment, it is possible to ensure excellent heat dissipation during operation of the magnetic head 12.

In particular, in the present embodiment, the temperature rise hardly occurs locally in the magnetic head 12 based on the above-mentioned improvement of heat dissipation, so that it becomes difficult to induce the protrusion defect. Therefore, it is possible to suppress the occurrence of defects caused by the protrusion defects during the operation of the magnetic head 12.

Further, in this embodiment, since the heat sink layer 60 is formed so as to entirely cover both the upper surface of the yoke 6B and the area where the induction coil 5 is arranged, the induction coil 5 is used during the recording operation of the magnetic head 12. And the heat generated in the MR element 8 during the reproducing operation are efficiently conducted to the heat sink layer 60. Therefore, the heat dissipation efficiency of the heat sink layer 60 can be improved.

Further, in this embodiment, the insulating spacer layer 62 and the electrically conductive heat dissipation layer 64 are laminated 2
Since the heat sink layer 60 is configured to have the layer structure, the heat dissipation layer 64 can be electrically separated from the yoke 6B by the spacer layer 62.

Further, in this embodiment, the electrode pad 20 is used.
A is a large electrode pad (main body portion 16, extension portion 17) different from the other electrode pads 10A, 10B, 20B,
At least the magnetic head 12 is formed by the electrode pad 20A.
Of the conventional magnetic head slider assembly having no large electrode pad (see FIG. 2).
0 and refer to FIG. 21), the thermal conductivity is increased and the heat dissipation characteristics are improved by the increased area of the electrode pad 20A. Therefore, also from this viewpoint, it is possible to contribute to the improvement of the heat dissipation of the magnetic head slider assembly.

Further, in the present embodiment, since the electrode pad 20A is made of gold, which is excellent in heat conductivity and electric conductivity, as compared with the case of using other materials,
The heat dissipation based on the electrode pad 20A can be further enhanced.

In the method of manufacturing the magnetic head slider assembly according to this embodiment, only the existing manufacturing process is used to manufacture the magnetic head slider assembly having the heat sink layer 60, and a new and complicated manufacturing process is used. Not used. Therefore, by using the existing manufacturing process, it is possible to stably and easily manufacture the magnetic head slider assembly having a heat dissipation property superior to that of the conventional magnetic head slider assembly.

In this embodiment, as shown in FIG. 4, the heat sink layer 60 is formed so as to entirely cover both the upper surface of the yoke 6B and the area where the induction coil 5 is arranged. However, the heat sink layer 60 may be configured so as to partially cover both the upper surface of the yoke 6B and the area where the induction coil 5 is disposed.
Specifically, for example, as shown in FIG. 5, the heat generated in the induction coil 5 during the recording operation of the magnetic head 12 is efficiently conducted to the heat sink layer 60, and the heat generated in the MR element 8 during the reproducing operation is performed. In order to efficiently conduct heat to the heat sink layer 60, it is preferable to cover the upper surface of the yoke 6B and the front area (area near the air bearing surface 1) of the area where the induction coil 5 is arranged. Even in this case, it is possible to obtain substantially the same effect as that of the present embodiment.

Further, in this embodiment, as shown in FIG. 4, the heat sink layer 60 is configured to have a rectangular plane shape, but the present invention is not limited to this, and for example, the heat sink layer 60. The planar shape of can be freely changed according to conditions such as the shape of the yoke 6B, the size of the region where the induction coil 5 is disposed, the thermal conductivity of the heat sink layer 60, and the required heat radiation amount.

Further, in this embodiment, FIG. 1 and FIG.
As shown in FIG. 6, the heat sink layer 60 is configured to have a two-layer structure in which the spacer layer 62 and the heat dissipation layer 64 are laminated. However, the present invention is not limited to this, and for example, as shown in FIG. The heat sink layer 60 may be configured to have a single-layer structure of only the heat dissipation layer 64.
Even in this case, it is possible to obtain substantially the same effect as that of the present embodiment.

Further, in this embodiment, FIG. 1 and FIG.
As shown in, upper pole tips 6 separated from each other
Although the upper magnetic pole 6 is configured to have the stitched pole type structure including the A, the yoke 6B, and the connecting portion 6C, the upper magnetic pole 6 is not necessarily limited to this.
The structure of can be changed freely. Specifically, for example,
The upper magnetic pole 6 may be configured to have an integrated structure in which the upper pole tip 6A, the yoke 6B, and the connecting portion 6C described above are integrated.

Further, in the present embodiment, the four electrode pads 10A, 10B, 20A, 20B are provided, but the number is not limited to this, and for example, 3
The number of electrode pads may be one or less or five or more. Furthermore, the number of large electrode pads is not limited to one (for example, the electrode pad 20A), and a plurality of large electrode pads may be provided. At this time, the planar shape of the expansion portion (for example, the expansion portion 17) is not limited to a substantially quadrangle, and may be a circle, a triangle, a square, a rectangle, or a pentagon or more polygon.

Further, in the present embodiment, the electrode pad 20
The extended portion 17 constituting A is at least the magnetic head 12
It suffices if it covers the area where the electrode is arranged, and the size of the expanded portion 17 can be freely expanded as long as it does not contact the other electrode pads 10A, 10B, 20B. Further, the size of the main body portion 16 of the electrode pad 20A and the other electrode pads 10A, 10B, 20B can be freely expanded as long as they do not contact each other. Of course, it goes without saying that the thickness of the electrode pads 10A, 10B, 20A, 20B can be set at any time.

In addition, in the present embodiment, the reproducing head unit 1
Although the magnetic head 12 is configured as a composite type head including the 2A and the recording head portion 12B, the magnetic head 12 is not limited to this, and the magnetic head 12 is configured as a recording-only head including only the recording head portion 12B. You may.

Further, in this embodiment, as shown in FIG. 2, the inner conductor 19 is formed on the trailing end face 14.
Electrode pad 20A connected to the induction coil 5 via
20B inside the electrode pads 10A, 10B connected to the MR element 8 via the internal conductor 9 (magnetic head 12
Although it is arranged on the side closer to the center) of the electrode pad 20, it is not necessarily limited to this.
The positions of A and 20B and the positions of electrode pads 10A and 10B may be reversed.

[Second Embodiment] Next, the second embodiment of the present invention will be described.
The embodiment will be described.

FIG. 7 shows the structure of the magnetic head slider assembly according to this embodiment, and shows a sectional structure corresponding to the sectional structure shown in FIG. In FIG. 7, the same components as those described in the first embodiment are designated by the same reference numerals.

In this magnetic head slider assembly, instead of the heat sink layer 60 provided on the yoke 6B,
The magnetic head slider assembly has the same structure as the magnetic head slider assembly of the first embodiment except that the heat sink layer 70 is provided on the lower magnetic pole 4.

The heat sink layer 70 dissipates heat generated during the operation of the magnetic head 12 like the heat sink layer 60 described in the first embodiment by conducting heat to the lower magnetic pole 4. It is partially connected to the lower magnetic pole 4. Specifically, as shown in FIG. 7, the heat sink layer 70 is connected to the upper surface of the lower magnetic pole 4 and extends over an area corresponding to the area where the induction coil 5 is disposed. The heat sink layer 70 is
For example, it has a single-layer structure having only the heat dissipation layer 74 corresponding to the heat dissipation layer 64 of the heat sink layer 60.

In this magnetic head slider assembly, for example, the lower magnetic pole 4 is formed, and then the heat sink layer 70 (heat dissipation layer 74) is patterned on the thin central portion of the lower magnetic pole 4 by using, for example, a plating process. Then, a manufacturing method similar to the method of manufacturing the magnetic head slider assembly described in the first embodiment is used except that the recording gap layer 7 is subsequently formed so as to cover the lower magnetic pole 4 and the heat sink layer 70. Can be formed.

In the magnetic head slider assembly according to this embodiment, the magnetic head slider assembly is partially connected to the upper surface of the lower magnetic pole 4,
Since the heat sink layer 70 that conducts heat with the lower magnetic pole 4 is provided, heat generated during the operation of the magnetic head 12 is generated by the operation of the magnetic head 12 by the same action as the heat sink layer 60 described in the first embodiment. Is conducted to the heat sink layer 70 and is smoothly radiated. Therefore, in the present embodiment, the conventional magnetic head slider assembly not including the heat sink layer 70 (see FIGS. 20 and 2).
1)), the heat dissipation characteristics are improved, and the magnetic head 12
Since heat is less likely to be accumulated in the magnetic head 12, excellent heat dissipation can be ensured during operation of the magnetic head 12.

In this embodiment, the heat sink layer 70 has a single-layer structure, but the heat sink layer 70 is not limited to this. For example, as shown in FIG. Similarly to the heat sink layer 60 (the spacer layer 62, the heat dissipation layer 64) of the above embodiment, the heat sink layer 70 is formed so as to have a two-layer structure in which the spacer layer 72 and the heat dissipation layer 74 are laminated in order from the side closer to the lower magnetic pole 4. You may comprise. The functions and configurations of the spacer layer 72 and the heat dissipation layer 74 are similar to those of the spacer layer 72 and the heat dissipation layer 64, respectively. Even in this case, the same effect as the present embodiment can be obtained.

Further, in the present embodiment, the heat sink layer 70 is formed so as to be connected to the upper surface of the lower magnetic pole 4, but the present invention is not limited to this. For example, as shown in FIG. The heat sink layer 70 may be configured to be connected to the lower surface of the magnetic pole 4. In this case, further, for example, as shown in FIG. 10, the heat sink layer 70 is configured to have a two-layer structure in which a spacer layer 72 and a heat dissipation layer 74 are sequentially stacked from the side closer to the lower magnetic pole 4. May be. Even in these cases, the same effect as that of the present embodiment can be obtained.

Further, in this embodiment, the heat sink layer 70 connected to the lower magnetic pole 4 is provided as described above, and further, the heat sink layer connected to the yoke 6B described in the first embodiment. 60 may be provided. Of course, in this case, a large electrode pad 20A may be provided. In these cases, in addition to the heat dissipation effect of the heat sink layer 70, the heat dissipation effect of the heat sink layer 60 and the electrode pad 20A can be obtained, so that an extremely excellent heat dissipation property can be secured during the operation of the magnetic head 12.

The configuration, function, action, effect and modification of the magnetic head slider assembly of this embodiment other than those described above are the same as those of the magnetic head slider assembly of the first embodiment. Omit it.

[0099]

EXAMPLES Next, specific examples of the present invention will be described.

First, before examining various characteristics of the magnetic head slider assembly of the present invention, various characteristics of a conventional magnetic head slider assembly (see FIGS. 20 and 21) were examined for comparison. The results shown in 14 were obtained.

FIG. 11 shows the temperature distribution in the X-axis direction, the “horizontal axis” shows the position in the X-axis direction (distance from the origin position X0 shown in FIG. 20; μm), and the “vertical axis”. Indicates the temperature (° C). FIG. 12 shows the temperature distribution in the Z-axis direction, the “horizontal axis” indicates the position in the Z-axis direction (distance from the origin position Z0 shown in FIG. 21; μm), and the “vertical axis” indicates temperature (° C.). ) Is shown. In FIG. 11, X = about 0
The range of μm to 20 μm corresponds to the arrangement region (head region 140) of the magnetic head 112, and X = about 20 μm to 35 μm.
The range of μm corresponds to the disposition region (overcoat layer region 150) of the overcoat layer 102. The X-axis direction corresponds to the slider length direction, and the Z-axis direction corresponds to the slider width direction.

As can be seen from the results shown in FIG. 11, in the conventional magnetic head slider assembly, the overcoat layer region 1 of the head region 140 in the X-axis direction.
The temperature showed a peak near the boundary with 50. It is considered that this is because the heat generated during the operation of the magnetic head 112 was accumulated in the overcoat layer 102 due to the low thermal conductivity of the overcoat layer 102. Further, as can be seen from the results shown in FIG. 12, the temperature showed a peak in the central region in which the magnetic head 112 was arranged in the Z-axis direction. From this fact as well, the magnetic head 11
It is considered that heat is locally accumulated in the vicinity of 2.

Further, FIG. 13 shows the displacement amount distribution in the X-axis direction. The “horizontal axis” shows the position (μm) in the X-axis direction like the “horizontal axis” shown in FIG. The "axis" indicates the amount of displacement (nm) due to heat accumulation. Figure 14 is Z
It represents the displacement amount distribution in the axial direction, and the “horizontal axis” is the position (μm) in the Z-axis direction, similar to the “horizontal axis” shown in FIG.
The “vertical axis” indicates the amount of displacement (nm) due to heat accumulation. The “displacement amount due to heat accumulation” means
It is the difference between the non-operating position and the operating position of the magnetic head 112 with respect to the components of the magnetic head slider assembly, that is, the amount of deviation due to thermal expansion.

As can be seen from the results shown in FIG. 13, in the conventional magnetic head slider assembly, the amount of displacement gradually increases in the X-axis direction from the head region 140 toward the overcoat layer region 150 due to heat accumulation. became. Further, as can be seen from the results shown in FIG. 14, the displacement amount showed a peak in the central region in the Z-axis direction.

Next, a magnetic head slider assembly having the same structure as the magnetic head slider according to the first embodiment of the present invention (see FIGS. 1 to 4) except that the heat sink layer 60 is not provided. After examining various characteristics,
The results shown in FIGS. 15 to 18 were obtained.

FIG. 15 shows the temperature distribution in the X-axis direction, which corresponds to the temperature distribution shown in FIG. Figure 1
Reference numeral 6 denotes the temperature distribution in the Z-axis direction, which corresponds to the temperature distribution shown in FIG. 15 and 16, the temperature distributions (15A, 16A) of the magnetic head slider assembly of the present invention and the temperature distributions of the conventional magnetic head slider assemblies shown in FIGS. 11 and 12 are shown in order to compare the performances. (15B, 16B) is also shown. The head region 40 and the overcoat layer region 50 relating to the magnetic head slider assembly of the present invention correspond to the disposition region of the magnetic head 12 and the disposition region of the overcoat layer 2, respectively.

As can be seen from the results shown in FIG. 15, in the present invention (15A), the temperature still showed a peak in the vicinity of the boundary between the head region 40 and the overcoat layer 50 in the X-axis direction. 2), the temperature was lower throughout, and particularly in the overcoat layer region 50, the temperature was significantly lower. this is,
It is considered that this is because the heat dissipation was improved due to the existence of the large electrode pad 20A, and the heat accumulation was mitigated. Further, as can be seen from the results shown in FIG. 16, in the present invention (16A), the peak disappeared in the Z-axis direction, unlike the prior art (16B), and the temperature became almost flat throughout. From this, it was confirmed that the magnetic head slider assembly of the present invention has excellent heat dissipation properties as compared with the conventional magnetic head slider assembly.

FIG. 17 shows the displacement amount distribution in the X-axis direction, which corresponds to the displacement amount distribution shown in FIG. FIG. 18 shows the displacement amount distribution in the Z-axis direction and corresponds to the displacement amount distribution shown in FIG. In addition,
17 and 18, the displacement amount distribution (17A, 17A,
18A) together with the displacement amount distribution (17B, 1B) of the conventional magnetic head slider assembly shown in FIGS.
8B) is also shown.

As can be seen from the results shown in FIG. 17, in the present invention (17A), the conventional (17B) is used in the X-axis direction.
Compared with the above, the amount of displacement was reduced over the whole, and in particular, the amount of displacement was significantly reduced in the overcoat layer region 50. Also, as can be seen from the results shown in FIG.
In the present invention (18A), the comparative example (18
Similar to B), the amount of displacement showed a peak, but the amount of the peak was remarkably low. From this, it was confirmed that in the magnetic head slider assembly of the present invention, the displacement amount was smaller than that in the conventional magnetic head slider assembly, and the occurrence of defects due to protrusion defects was suppressed.

Next, as a representative of the magnetic head slider assemblies according to the first and second embodiments of the present invention,
When various characteristics of the magnetic head slider assembly (see FIGS. 1 to 4) according to the first embodiment were examined, the results shown in FIG. 19 were obtained. FIG. 19 shows the displacement amount distribution in the X-axis direction, and corresponds to the displacement amount distribution shown in FIG. The “horizontal axis” in FIG. 19 represents the distance from the slider 11 (or slider 111), and X = approximately 5 μ.
The range of m to 35 μm corresponds to the area where the upper pole tip 6A (or the upper magnetic pole 106) is provided. FIG. 19 shows the displacement amount distribution (19A) of the magnetic head slider assembly of the present invention and the displacement amount distribution (19B) of the conventional magnetic head slider assembly. As the structure of the magnetic head 12, the length of the yoke 6B is 18 μm, and the spacer layer 62 (alumina) of the heat sink layer 60 is used.
Thickness = 0.3 μm, the thickness of the heat dissipation layer 64 = 1.5 μm, and the power consumption of the induction coil 5 was 50 mW.

As can be seen from the results shown in FIG. 19, in the present invention (19A), the conventional method (19B) is used in the X-axis direction.
The amount of displacement is smaller than that of the above, especially, the disposition region of the upper pole tip 6A (= about 5 μm to 35 μm).
In the range of 1), the amount of displacement was significantly reduced. From this, in the magnetic head slider assembly of the present invention,
Compared with the conventional magnetic head slider assembly, the upper pole chip 6A which is a main part for executing the recording process
It was confirmed that the displacement amount at the time of the operation was reduced, and the occurrence of defects due to the protrusion defect of the upper pole tip 6A was suppressed.

[0112]

As described above, in the method of manufacturing the magnetic head slider assembly according to the first aspect of the present invention, at least a part of the upper surface of the yoke is covered with the heat sink layer which is thermally conductive with the yoke. Only existing manufacturing processes are used to manufacture the magnetic head slider assembly, and no new and cumbersome manufacturing processes are used. Therefore, the existing manufacturing process can be used to stably and easily manufacture the magnetic head slider assembly having better heat dissipation than the conventional magnetic head slider assembly.

Further, in the method of manufacturing the magnetic head slider assembly according to the second aspect of the present invention, the magnetic head slider provided with the heat sink layer which is partially connected to the lower magnetic pole piece and thermally conducts with the lower magnetic pole piece. A magnetic head with better heat dissipation than a conventional magnetic head slider assembly using the existing manufacturing process because it uses only the existing manufacturing process to manufacture the assembly and does not use a new and cumbersome manufacturing process. The slider assembly can be manufactured stably and easily.

Further, in the magnetic head slider assembly according to the first aspect of the present invention, since at least a part of the upper surface of the yoke is covered with the heat sink layer which conducts heat to the yoke, the magnetic head slider assembly is operated during operation of the magnetic head. The generated heat is conducted from the yoke to the heat sink layer and is radiated smoothly. Therefore, excellent heat dissipation can be ensured during operation of the magnetic head. In this case, in particular, the local temperature of the magnetic head is less likely to rise and the protrusion defect is less likely to be induced. Therefore, it is possible to suppress the occurrence of defects caused by the protrusion defect during the operation of the magnetic head. .

In the magnetic head slider assembly according to the second aspect of the present invention, the magnetic head slider assembly is provided with a heat sink layer which is partially connected to the lower magnetic pole piece and which conducts heat to the lower magnetic pole piece. The heat generated during the operation is conducted from the lower magnetic pole piece to the heat sink layer and is smoothly radiated. Therefore, it is possible to ensure excellent heat dissipation during operation of the magnetic head, and in particular, it is possible to suppress the occurrence of defects due to protrusion defects.

[Brief description of drawings]

FIG. 1 is a sectional view showing a sectional configuration of a magnetic head slider assembly according to a first embodiment of the invention.

FIG. 2 is a plan view showing an enlarged plan configuration of a main surface (trailing side end surface) of the magnetic head slider assembly shown in FIG.

3 is a cross-sectional view showing an enlarged cross-sectional structure of a main part (recording head part) of the magnetic head slider assembly shown in FIG.

4 is a plan view schematically showing a planar configuration of a main part (heat dissipation layer and the like) of the magnetic head slider assembly shown in FIG.

FIG. 5 is a plan view for explaining a modified example of the magnetic head slider assembly according to the first embodiment of the invention.

FIG. 6 is a plan view for explaining another modification of the magnetic head slider assembly according to the first embodiment of the invention.

FIG. 7 is an enlarged sectional view showing a sectional structure of a main part (recording head part) of a magnetic head slider assembly according to a second embodiment of the invention.

FIG. 8 is a plan view for explaining a modification example of the magnetic head slider assembly according to the second embodiment of the invention.

FIG. 9 is a plan view for explaining another modification of the magnetic head slider assembly according to the second embodiment of the invention.

FIG. 10 is a plan view for explaining still another modification example of the magnetic head slider assembly according to the second embodiment of the invention.

FIG. 11 is a diagram showing a temperature distribution in the X-axis direction of a conventional magnetic head slider assembly.

FIG. 12 is a diagram showing a temperature distribution in the Z-axis direction of a conventional magnetic head slider assembly.

FIG. 13 is a diagram showing a displacement amount distribution in the X-axis direction of a conventional magnetic head slider assembly.

FIG. 14 is a diagram showing a displacement amount distribution in the Z-axis direction of a conventional magnetic head slider assembly.

FIG. 15 is a diagram showing a temperature distribution in the X-axis direction of the magnetic head slider assembly (with a large electrode pad, without a heat sink layer) of the present invention.

FIG. 16 is a diagram showing a temperature distribution in the Z-axis direction of the magnetic head slider assembly (with a large electrode pad, without a heat sink layer) of the present invention.

FIG. 17 is a diagram showing a displacement amount distribution in the X-axis direction of the magnetic head slider assembly (with a large electrode pad, without a heat sink layer) of the present invention.

FIG. 18 is a diagram showing a displacement amount distribution in the Z-axis direction of a magnetic head slider assembly (with a large electrode pad, without a heat sink layer) of the present invention.

FIG. 19 is a diagram showing a displacement amount distribution in the Z-axis direction of the magnetic head slider assembly (with a large electrode pad, with a heat sink layer) of the present invention.

FIG. 20 is a sectional view showing a sectional configuration of a conventional magnetic head slider assembly.

FIG. 21 is an enlarged plan view showing a planar configuration of a main surface (trailing side end surface) of the magnetic head slider assembly shown in FIG. 20.

[Explanation of symbols]

1 ... Air bearing surface, 2 ... Overcoat layer, 2A ...
Through hole, 3 ... Underlayer, 4 ... Lower magnetic pole, 5 ... Induction coil, 6 ... Upper magnetic pole, 6A ... Upper pole tip, 6B ...
Yoke, 6C ... Connection portion, 7 ... Recording gap layer, 7A ... Opening portion, 8 ... MR element, 9, 19 ... Internal conductor wire, 10A, 1
0B, 20A, 20B ... Electrode pad, 11 ... Slider,
12 ... Magnetic head, 12A ... Reproducing head section, 12B ... Recording head section, 13 ... External lead wire, 14 ... Trailing side end surface, 15 ... Joining surface, 16 ...
21 ... Lower shield layer, 22 ... Lower gap layer, 23 ...
Insulating layer, 24 ... Upper gap layer, 30 ... Actuator arm, 40 ... Head region, 50 ... Overcoat layer region, 60, 70 ... Heat sink layer, 62, 72 ... Spacer layer, 64, 74 ... Heat dissipation layer.

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Morris De Bake             United States California             95138 San Jose Snowdon Place               5623 (72) Inventor Devendra Chabla             United States California             95120 San Jose Wood View Play             Space 1026 F-term (reference) 5D033 BA61 BA71 BB14 CA07 DA02                       DA31

Claims (40)

[Claims] 1. A magnetic head is formed so as to include a recording element having a lower magnetic pole piece, an upper magnetic pole tip, a yoke, and an induction coil arranged between the lower magnetic pole piece and the yoke. A step of forming a heat sink layer so as to cover at least a part of the upper surface of the yoke and conduct heat to the yoke, and a step of forming an insulating overcoat layer so as to cover the heat sink layer. A method of manufacturing a magnetic head slider assembly, comprising: 2. The heat sink layer is formed so as to entirely cover both the upper surface of the yoke and the area where the induction coil is disposed.
A method of manufacturing the magnetic head slider assembly described. 3. The heat sink layer is formed so as to extend so as to partially cover both the upper surface of the yoke and the disposition region of the induction coil.
A method of manufacturing the magnetic head slider assembly described. 4. The method of manufacturing a magnetic head slider assembly according to claim 1, wherein the heat sink layer is formed so as to include a material having higher thermal conductivity than that of the overcoat layer. 5. The method of manufacturing a magnetic head slider assembly according to claim 4, wherein the heat sink layer is formed so as to include either an electrically conductive material or a magnetic material. 6. Copper (Cu), gold (Au), silver (Ag),
The heat sink layer is formed to include at least one thermally conductive material of nickel (Ni), aluminum (Al), tantalum (Ta), tungsten (W), and alloys thereof. Item 6. A method of manufacturing a magnetic head slider assembly according to Item 5. 7. A structure in which a first layer as a spacer layer having electrical insulation properties and connected to the upper surface of the yoke, and a second layer made of an electrically conductive material or a magnetic material are laminated. 2. The method of manufacturing a magnetic head slider assembly according to claim 1, wherein the heat sink layer is formed as described above. 8. The magnetic head slider according to claim 7, wherein the second layer is formed using copper (Cu) so as to have a thickness within a range of 0.25 μm or more and 10 μm or less. Assembly manufacturing method. 9. The first layer is formed of aluminum oxide (Al ₂ O ₃ ) so as to have a thickness in the range of more than 0 μm and 10 μm or less. Of manufacturing a magnetic head slider assembly of. 10. The method of manufacturing a magnetic head slider assembly according to claim 1, wherein the overcoat layer is formed using aluminum oxide (Al ₂ O ₃ ). 11. A magnetic head is formed so as to include a recording element having a lower magnetic pole piece, an upper magnetic pole tip, a yoke, and an induction coil arranged between the lower magnetic pole piece and the yoke. A step of forming a heat sink layer so as to be partially connected to the lower magnetic pole piece and to conduct heat to the lower magnetic pole piece; and an insulating overcoat layer is formed so as to cover the heat sink layer. And a step of manufacturing the magnetic head slider assembly. 12. The heat sink layer is formed so as to be connected to an upper surface of the lower magnetic pole piece and to extend across an area corresponding to an area where the induction coil is provided. A method of manufacturing the magnetic head slider assembly described. 13. The heat sink layer is formed so as to be connected to a lower surface of the lower magnetic pole piece and to extend across an area corresponding to a disposition area of the induction coil. A method of manufacturing the magnetic head slider assembly described. 14. The method of manufacturing a magnetic head slider assembly according to claim 11, wherein the heat sink layer is formed so as to include a material having a higher thermal conductivity than that of the overcoat layer. 15. The method of manufacturing a magnetic head slider assembly according to claim 14, wherein the heat sink layer is formed so as to include either an electrically conductive material or a magnetic material. 16. Copper (Cu), gold (Au), silver (A)
g), nickel (Ni), aluminum (Al), tantalum (Ta), tungsten (W) and at least one of these alloys, a thermally conductive material,
16. The method of manufacturing a magnetic head slider assembly according to claim 15, wherein the heat sink layer is formed. 17. A structure in which a first layer, which is electrically insulating and is connected to the lower magnetic pole piece, as a spacer layer, and a second layer made of an electrically conductive material or a magnetic material are laminated. 12. The method of manufacturing a magnetic head slider assembly according to claim 11, wherein the heat sink layer is formed as described above. 18. The second layer of copper (Cu) is formed to have a thickness in the range of 0.25 μm or more and 10 μm or less.
18. The method of manufacturing a magnetic head slider assembly according to claim 17, further comprising: 19. The first layer is formed using aluminum oxide (Al ₂ O ₃ ) so as to have a thickness in the range of more than 0 μm and 10 μm or less. Of manufacturing a magnetic head slider assembly of. 20. The method of manufacturing a magnetic head slider assembly according to claim 11, wherein the overcoat layer is formed using aluminum oxide (Al ₂ O ₃ ). 21. A magnetic head including a recording element having a lower magnetic pole piece, an upper magnetic pole tip, a yoke, and an induction coil arranged between the lower magnetic pole piece and the yoke, and an upper surface of the yoke. Of the magnetic material, and a heat sink layer disposed so as to cover at least a part of the core and to conduct heat to the yoke, and an insulating overcoat layer disposed so as to cover the heat sink layer. Head slider assembly. 22. The magnetic head slider assembly according to claim 21, wherein the heat sink layer extends so as to entirely cover both the upper surface of the yoke and the area where the induction coil is disposed. . 23. The magnetic head slider assembly according to claim 21, wherein the heat sink layer extends so as to partially cover both the upper surface of the yoke and the area where the induction coil is disposed. . 24. The magnetic head slider assembly according to claim 21, wherein the heat sink layer includes a material having higher thermal conductivity than that of the overcoat layer. 25. The magnetic head slider assembly according to claim 24, wherein the heat sink layer is configured to include either an electrically conductive material or a magnetic material. 26. The heat sink layer is copper (Cu),
Gold (Au), silver (Ag), nickel (Ni), aluminum (Al), tantalum (Ta), tungsten (W)
And at least one of these alloys and a heat conductive material.
5. The magnetic head slider assembly described in 5. 27. The heat sink layer has a first layer, which is electrically insulating and is connected to the upper surface of the yoke, as a spacer layer, and a second layer made of an electrically conductive material or a magnetic material. 22. The magnetic head slider assembly according to claim 21, wherein the magnetic head slider assembly has the following configuration. 28. The magnetic material according to claim 27, wherein the second layer is made of copper (Cu) and has a thickness in the range of 0.25 μm to 10 μm. Head slider assembly. 29. The first layer is made of aluminum oxide (Al ₂ O ₃ ) and has a thickness in the range of more than 0 μm and 10 μm or less. 27. A magnetic head slider assembly according to item 27. 30. The magnetic head slider assembly according to claim 21, wherein the overcoat layer is made of aluminum oxide (Al ₂ O ₃ ). 31. A magnetic head including a recording element having a lower magnetic pole piece, an upper magnetic pole tip, a yoke, and an induction coil arranged between the lower magnetic pole piece and the yoke, and the lower magnetic pole piece. A heat sink layer that is partially connected to the bottom pole piece so as to conduct heat to the bottom pole piece, and an insulating overcoat layer that is disposed so as to cover the heat sink layer. And magnetic head slider assembly. 32. The heat sink layer according to claim 31, wherein the heat sink layer is connected to an upper surface of the lower magnetic pole piece and extends over a region corresponding to a region where the induction coil is disposed. Magnetic head slider assembly. 33. The heat sink layer according to claim 31, wherein the heat sink layer is connected to a lower surface of the lower magnetic pole piece and extends over a region corresponding to a region where the induction coil is disposed. Magnetic head slider assembly. 34. The magnetic head slider assembly according to claim 31, wherein the heat sink layer includes a material having higher thermal conductivity than that of the overcoat layer. 35. The magnetic head slider assembly according to claim 34, wherein the heat sink layer is configured to include either an electrically conductive material or a magnetic material. 36. The heat sink layer is copper (Cu),
Gold (Au), silver (Ag), nickel (Ni), aluminum (Al), tantalum (Ta), tungsten (W)
And at least one of these alloys and a heat conductive material.
5. The magnetic head slider assembly described in 5. 37. The heat sink layer has a first layer, which is electrically insulating and is connected to the lower pole piece, as a spacer layer, and a second layer made of an electrically conductive material or a magnetic material. 32. The magnetic head slider assembly according to claim 31, wherein the magnetic head slider assembly has the following configuration. 38. The magnetic according to claim 37, wherein the second layer is made of copper (Cu) and has a thickness in the range of 0.25 μm or more and 10 μm or less. Head slider assembly. 39. The first layer is made of aluminum oxide (Al ₂ O ₃ ) and has a thickness in the range of more than 0 μm and 10 μm or less. 37. A magnetic head slider assembly according to item 37. 40. The magnetic head slider assembly according to claim 31, wherein the overcoat layer is made of aluminum oxide (Al ₂ O ₃ ).