JP2003336850A - High frequency heating apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a high frequency heating apparatus excellent in cooling performance for its heating components. <P>SOLUTION: A first cooling fan 5 is disposed on the back of a heating chamber 1 and an inverter power supply 4 is disposed vertically above the first cooling fan 5 so that cold air coming from a suction opening 2 can be supplied to the inverter power supply 4. The components of the inverter power supply 4 are thus held at low service temperatures to achieve the high frequency heating apparatus with high reliability. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high frequency heating device such as a microwave oven for heating foods, etc. with microwaves generated by a magnetron.

[0002]

2. Description of the Related Art A conventional high-frequency heating device will be described with reference to the drawings. FIG. 11 is a block diagram of a conventional high-frequency heating device. The high-frequency heating apparatus of FIG. 11 radiates a magnetron 3 that generates microwaves, an inverter power supply 4 that drives the magnetron, a first cooling fan 5 that cools the magnetron 3 and the inverter power supply 4, and microwaves to the object to be heated. The heating chamber 1 has an intake port 2 and an exhaust port for supplying outside air to the first cooling fan 5.

The inverter power source 4 converts a commercial power source into a high DC voltage of about 4.5 kV with high efficiency, and the magnetron 3
Apply high DC voltage to. By applying this DC high voltage, the magnetron 3 generates a microwave of 2.45 GHz. The generated microwaves are guided to the heating chamber 1 using a waveguide or the like, and are absorbed by an object to be heated such as food placed in the heating chamber 1 to cause the object to be heated to generate heat. On this occasion,
Since the magnetron 3 and the inverter power supply 3 generate heat due to loss, the first cooling fan 5 cools each component so that each component falls within the allowable temperature rise value.

The conventional example shown in FIG. 11 shows a structure for obtaining a high output by operating a plurality of magnetrons 3 at the same time, which is particularly found in a high-frequency heating device for business use. In this type of high-frequency heating device, the intake port 2 for supplying air to the inside of the housing is provided only at the lower part of the front surface, and the magnetron 3 and the inverter power supply 4 are arranged at the rear part. Therefore, the first cooling fan 5 is arranged at the rear end, and the intake port 2
Guide cooling air from the side of the chassis to the inverter power supply 4
And the magnetron 3 is being cooled. Further, there is a method in which the cooling air passes through the magnetron 3 and then is exhausted to the outside of the housing through an exhaust port, or a method in which the cooling air is exhausted to the outside through a steam port after being guided to the heating chamber. In a high-frequency heating apparatus using a plurality of magnetrons 3 of this kind, one in which the magnetron 3, the inverter power supply 4, and the first cooling fan 5 are combined into a set has two layers stacked.

[0005]

However, in such a conventional high-frequency heating device, since the first cooling fan 5 is installed in a vertically stacked state at the rear end of the housing, the upper part thereof is provided. The intake temperature of the first cooling fan 5 arranged in the upper side rises with time, and after several tens of minutes, the intake temperature of the first cooling fan 5 arranged in the lower stage is 20 deg.
The temperature will rise above the above. This is because, in this type of casing, it is necessary to take a structure in which the intake port 2 is limited to the lower part of the front face of the casing due to the installation space. Since the intake port 2 is located at this position, the cooling fan has a sufficient intake port. This is because the air cannot be sucked in from. Therefore, the temperature of the air reaching the cooling fan is sufficiently high, and in particular, the temperature of the components of the inverter power source 4 arranged above and the temperature of the magnetron 3 increase. As a result, it becomes necessary to keep the component temperature low by reducing the input power or temporarily stopping the device. Further, by lowering the operating temperature of the component, the life of the component is extended, and the advantage of the reliability of the component is brought about.

The present invention solves the above-mentioned problems. By suppressing the rise in intake air temperature of the cooling fan, it is possible to keep the operating temperature of each component low, and to provide a highly reliable high-frequency heating device. Is intended.

[0007]

In order to solve the above-mentioned problems, the present invention provides a magnetron, an inverter power supply for driving the magnetron, a first cooling fan for cooling the magnetron and the inverter power supply, and the magnetron. A heating chamber for radiating microwaves generated from the heating chamber to the object to be heated, the first cooling fan is arranged on the rear surface of the heating chamber, and an inverter power source is arranged in a vertical direction above the first cooling fan. It is a thing.

As a result, low temperature air from the intake port is supplied to the inverter power supply through the cooling fan, so that the operating temperature of each component on the inverter power supply can be kept low, and highly reliable high frequency heating is possible. The device can be realized.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 is a magnetron, an inverter power supply for driving the magnetron, a first cooling fan for cooling the magnetron and the inverter power supply, and a micro-generator generated from the magnetron. A heating chamber that radiates waves to the object to be heated, the first cooling fan is arranged on the rear surface of the heating chamber, and an inverter power source is arranged in the vertical direction above the first cooling fan.

As a result, since low temperature air from the intake port is supplied to the inverter power supply through the cooling fan, it is possible to use each component on the inverter power supply at a low temperature, and high-reliability high-frequency heating is possible. The device can be realized.

According to a second aspect of the invention, in particular, a wind tunnel is formed in the upper vertical direction of the first cooling fan according to the first aspect,
The inverter power supply is stored in the wind tunnel.

As a result, the cooling air is surely guided to the inverter power supply, and the wind tunnel acts as a heat insulating wall for blocking the heat from the magnetron, so that the operating temperature of the components of the inverter power supply can be kept low and the reliability is high. A high frequency heating device can be realized.

The present invention according to claim 3 particularly claims 1
Alternatively, the first cooling fan described in 2 is provided with a separation wall for separating intake air and exhaust air.

As a result, the cooling fan does not suck in the air that has risen due to the heat generated by the magnetron, so that the air with a low temperature is reliably sucked through the air inlet of the cooling fan, and the component temperature of the inverter power supply is further reduced. Since it can be kept low, a highly reliable high-frequency heating device can be realized.

The present invention according to claim 4 particularly claims 1
The intake side of the first cooling fan described in any one of 1 to 3 is arranged to be inclined to the heating chamber side.

As a result, the air from the air intake port of the housing is reliably sucked from the air intake port of the cooling fan, so that the temperature of the components of the inverter power supply can be kept low and a highly reliable high frequency heating device can be realized. Is.

The present invention according to claim 5 particularly claims 1
The first air passage for guiding the cooling air generated by the first cooling fan described in any one of 1 to 4 to the magnetron after passing through the inverter power supply.

As a result, one set of the inverter power supply and the magnetron can be cooled by one cooling fan, and a low-cost high-frequency heating device can be realized.

The present invention according to claim 6 particularly relates to claim 2.
The invention according to any one of claims 1 to 4, further comprising a second cooling fan in which an intake port is located above a wind tunnel and an exhaust port is located in the magnetron.

Thus, the inverter power supply can be cooled by both pushing in the first cooling fan and sucking in the second cooling fan, so that the first cooling fan can be made compact and compact. It is possible to realize a high-frequency heating device.

The present invention according to claim 7 particularly provides claim 6.
An opening is provided in a part of the upper part of the described wind tunnel.

As a result, the air passage of the first cooling fan is secured, and the suction capacity of the first cooling fan is increased, so that the amount of air suctioned from the housing intake port to the cooling fan intake port is increased. Therefore, the temperature rise of the components of the inverter power supply can be suppressed, and a highly reliable high frequency heating device can be realized.

The present invention according to claim 8 particularly relates to claim 7.
A second air passage is formed to guide the cooling air that has passed through the described wind tunnel to the heating chamber.

Thus, it is possible to prevent the front window from being fogged by the generated steam that heats the object to be heated in the heating chamber with a simple structure, and it is possible to realize a convenient high-frequency heating device.

[0025]

(Embodiment 1) A first embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a diagram showing the structure of the high frequency heating apparatus of this embodiment. (A) is a simplified cross-sectional view of the high-frequency heating device as viewed from the side, and (b) is a simplified cross-sectional view of the high-frequency heating device as viewed from the back. The high frequency heating apparatus of the present embodiment radiates a magnetron 3 for generating microwaves, an inverter power supply 4 for driving the magnetron, a first cooling fan 5 for cooling the magnetron 3 and the inverter power supply 4, and microwaves to the object to be heated. Consists of a heating chamber 1 for
The heating chamber 1 has an intake port 2 and an exhaust port for supplying outside air to the first cooling fan 5.

In the present embodiment, the first cooling fan 5 is arranged in the lower rear portion of the housing substantially in parallel with the bottom surface of the housing, and the cooling air is immediately above the first cooling fan 5 in the direction in which the cooling air flows along the substrate. It is characterized in that it has a configuration in which substrates are arranged. The inverter power supply 4 converts the commercial power supply into a high voltage of direct current of about 4.5 kV with high efficiency, and applies the high voltage to the magnetron 3. Due to the application of this high voltage, the magnetron 3 is 2.45 GHz.
To generate the microwave. This generated microwave
It is guided to the heating chamber 1 using a waveguide or the like and is absorbed by an object to be heated such as food placed in the heating chamber 1 to cause the object to be heated to self-heat. At this time, since the magnetron 3 and the inverter power supply 3 generate heat due to loss, the first cooling fan 5 cools each component so that each component falls within the allowable temperature rise value.

The present embodiment shows a structure in which two windings of the magnetron 3, which are particularly found in a commercial high-frequency heating device, are operated simultaneously to obtain a high output. The intake port 2 is only on the lower part of the front surface of the high-frequency heating device, and the magnetron 3 is arranged at the rear part of the housing. Further, the inverter power supply 4, the magnetron 3, and the first cooling fan 5 for cooling the inverter power supply 4 are also arranged in the rear part of the housing in the same manner. During operation, each component on the inverter power supply 5 has a temperature obtained by adding the temperature rise value due to its own loss to the temperature of the cooling air of the first cooling fan 5. Therefore, by keeping the temperature of the cooling air as low as possible, the temperature of each component is lowered and a margin for the temperature allowable value of the component can be secured. In particular, since the life of electronic components tends to depend on the operating temperature, it is desirable to use the electronic components at the lowest temperature possible.

Therefore, the first cooling fan is arranged so as to be substantially parallel to the bottom plate, and the inverter power source 4 is arranged directly above the exhaust port of the first cooling fan 5 and perpendicular to the first cooling fan. By taking the above condition, the low temperature air from the intake port 2 is sucked by the first cooling fan, and the low temperature air can be supplied to the inverter power supply 4. As a result, the temperature of the cooling air that hits each component arranged on the inverter power supply 4 is lowered, and as a result, the temperature of each component can also be kept low.

The first cooling fan 5 is preferably separated from the bottom plate by 30 mm or more in order to secure an air passage from the intake port 2. Further, in this embodiment, the method of supplying the cooling air to the magnetron 3 is not particularly specified, but it is desirable to have a dedicated fan for cooling the magnetron 3.

As described above, according to this embodiment, the first cooling fan 5 is arranged on the rear surface of the heating chamber 1 and the inverter power source 4 is arranged vertically above the first cooling fan 5. As a result, low temperature air from the intake port 2 can be supplied to the inverter power source 4, and the operating temperature of each component of the inverter power source 4 is low, and a highly reliable high frequency heating device can be realized. is there.

(Second Embodiment) A second embodiment of the high-frequency heating apparatus of the present invention will be described with reference to the drawings. FIG. 2 is a diagram showing the configuration of the high-frequency heating apparatus of this embodiment.
(A) is a simplified cross-sectional view of the high-frequency heating device as viewed from the side, and (b) is a simplified cross-sectional view of the high-frequency heating device as viewed from the back. The present embodiment differs from the configuration of the first embodiment in that a wind tunnel 6 made of resin or the like is formed immediately above the first cooling fan 5, and the inverter power supply 4 is housed in the wind tunnel. .

In this structure, the cooling air discharged from the first cooling fan 5 by the wind tunnel 6 is surely guided to the inverter power supply 4. Also, magnetron 3
Since the temperature of the housing reaches 150 ° C. or higher when the temperature is saturated, the component temperature rises due to heat radiation from the magnetron 3 to the inverter power supply 4 and the increase in the ambient temperature of the inverter power supply 4. It is possible to shut off the air having a high temperature and suppress the temperature rise of the components of the inverter power supply 4 in the wind tunnel 6. Therefore, it is desirable to construct the wind tunnel 6 using a thick resin or the like.

FIG. 3 shows an example of the board arrangement of the inverter power source 4 in this embodiment. (A) is a simplified view seen from the upper surface, and (b) is a simplified sectional view of the side surface. In this embodiment, the inverter power supply board 4a and the inverter power supply board 4b are arranged on the wall surface of the wind tunnel 6. As described above, by arranging the substrates by using the wall surface of the wind tunnel 6, it is possible to realize a compact configuration.

In addition, in this board arrangement, a large number of heat-generating components,
Since it can be arranged near the first cooling fan 5, there is an advantage that heat generation of each component is suppressed.

As described above, according to the present embodiment, the wind tunnel 6 is arranged directly above the first cooling fan 5 and the inverter power source 4 is arranged in the wind tunnel 6 so that the cooling air can be reliably discharged from the inverter power source 4. In addition, since the wind tunnel 6 acts as a heat insulating wall that shuts off the heat from the magnetron 3, the operating temperature of the components in the inverter power supply 4 can be kept low, and a highly reliable high frequency heating device can be realized. is there.

(Embodiment 3) A third embodiment of the high-frequency heating apparatus of the present invention will be described with reference to the drawings. FIG. 4 is a diagram showing the circuit configuration of this embodiment. (A) is a simplified cross-sectional view of the high-frequency heating device as viewed from the side, and (b) is a simplified cross-sectional view of the high-frequency heating device as viewed from the top. The present embodiment differs from the configuration of the second embodiment in that an intake / exhaust air separation wall is provided at a position below the exhaust port of the first cooling fan 5.

In this structure, it is possible to reliably supply the air having a lower temperature than the intake port 2 to the first cooling fan 5. That is, the air around the heating chamber 1 whose temperature has risen as the temperature of the heating chamber 1 itself rises by heating the object to be heated, the air whose temperature around the magnetron 3 has risen as the magnetron 3 heats up, etc.
It is possible to prevent the first cooling fan 5 from sucking. This makes it possible to keep the intake air temperature of the first cooling fan 5 low.

Further, since the first cooling fan 5 has no other air passage for sucking air, even if the first cooling fan 5 is arranged at the rear portion of the housing, it surely sucks air from the intake port 2 on the front surface of the housing. , It becomes possible to send air of lower temperature to the inverter board 4.

As described above, according to this embodiment, by providing the intake / exhaust separation wall at a position below the exhaust port of the first cooling fan 5, the air raised by the magnetron 3 is heated by the first cooling fan 5. Since the air having a low temperature is surely sucked through the air inlet of the first cooling fan 5 from the air inlet 2 of the housing, the temperature of the components of the inverter power supply 4 can be further suppressed to be low. It is possible to realize a high-frequency heating device.

(Fourth Embodiment) A fifth embodiment of the high-frequency heating apparatus of the present invention will be described with reference to the drawings. FIG. 5 is a diagram showing the configuration of the high-frequency heating apparatus of this embodiment,
The cross-sectional view seen from the side is shown in a simplified manner. The present embodiment is different from the configuration of the third embodiment in that the intake port of the first cooling fan 5 is arranged so as to be inclined to the intake port 2 of the housing.

In this structure, since the intake port of the first cooling fan 5 faces the intake port 2 of the housing, the intake resistance is smaller and the air from the intake port 2 can be taken in. As a result, the time required for the air to reach the first cooling fan 5 from the intake port 2 can be further shortened, and the air whose temperature rises by that much can be reduced.
Can be supplied to the cooling air, and it becomes possible to use cooling air having a lower temperature.

As described above, according to the present embodiment, the air inlet of the first cooling fan 5 is disposed so as to be inclined with respect to the air inlet 2 of the housing, so that the air from the housing air inlet is reliably sucked by the air intake of the cooling fan. Since it is sucked in through the mouth, the temperature of the parts of the inverter power supply can be kept low, and a highly reliable high-frequency heating device can be realized.

(Embodiment 5) A fifth embodiment of the high-frequency heating apparatus of the present invention will be described with reference to the drawings. FIG. 6 is a diagram showing the configuration of the high-frequency heating apparatus of this embodiment.
(A) is a simplified cross-sectional view of the high-frequency heating device as viewed from the side, and (b) is a simplified cross-sectional view of the high-frequency heating device as viewed from the top. The present embodiment is different from the configuration of the second embodiment in that a first air passage 7 is formed for using the cooling air after cooling the inverter power supply 4 passing through the wind tunnel 6 as the cooling air for the magnetron 3. That is the point.

In this structure, one set of cooling fan can cool one set of magnetron 3 and inverter power supply 4, and a low cost structure can be realized. However, it is more effective to use a cooling fan having a high static pressure such as a sirocco fan as the first cooling fan 5 because the wind pressure becomes high.

However, in the case of using a sirocco fan, since the sirocco fan has a wide air suction direction, it is necessary to ensure that the intake / exhaust air separation wall 8 does not particularly suck the heat from the magnetron 3. It is necessary to surely direct the intake direction of the fan to the intake port 2 of the housing.

As described above, according to the present embodiment, by forming the first air passage 7 for guiding the cooling air, which has cooled the inverter power supply 4, to the cooling of the magnetron 3, a set of the inverter power supply and the magnetron is cooled. Since it is possible to perform the above with a single cooling fan, a low-cost high-frequency heating device can be realized.

(Embodiment 6) A sixth embodiment of the high-frequency heating apparatus of the present invention will be described with reference to the drawings. FIG. 7 is a diagram showing the circuit configuration of the present embodiment, which is a simplified sectional view as seen from the back. The present embodiment differs from the configuration of the second embodiment in that the second cooling fan 12 is arranged on the side surface or the upper surface of the wind tunnel 6.

Further, FIG. 8 shows the inverter power source 4 of this embodiment.
The wind tunnel 6 in which the air is stored, the first cooling fan 5 and the second
The positional relationship of the cooling fan 12 is shown. The first cooling fan 5 sucks in air having a low temperature in the lower part of the housing and discharges the air into the wind tunnel 6 to cool the inverter power supply 4.

Further, the second cooling fan 12 installed in the center or the upper part of the wind tunnel 6 sucks the air in the wind tunnel 6 by suction to cool the inverter power supply 4 and sends the air to the magnetron 3 to supply the magnetron. To cool. Therefore, each fan can cool both the magnetron 3 and the inverter power supply 4 with one cooling fan, so that each cooling fan can use a small one.

Further, the first cooling fan 5 is suitable for a propeller fan capable of ensuring an air volume, and the second cooling fan 12 is suitable for a sirocco fan capable of ensuring a static pressure. Optimal fans can be arranged respectively. As a result, it becomes possible to adopt an efficient cooling configuration.

As described above, in this embodiment, the second cooling fan 12 is arranged on the side surface or the upper surface of the wind tunnel 6, so that the inverter power source 4 is pushed into the first cooling fan 5 and the second cooling fan 5 is inserted. Since it can be cooled by both suction of the cooling fan 12, the first cooling fan 5 can be downsized, and a compact high-frequency heating device can be realized.

(Embodiment 7) A seventh embodiment of the high-frequency heating apparatus of the present invention will be described with reference to the drawings. FIG. 9 is a diagram showing the circuit configuration of the present embodiment, and shows the positional relationship between the wind tunnel 6 accommodating the inverter power supply 4 and the first cooling fan 5 and the second cooling fan 12. The present embodiment differs from the structure of the sixth embodiment in that an opening 9 is provided on the upper surface of the wind tunnel 6 and the cooling air from the first cooling fan 5 is used to cool the magnetron 3 by using the second cooling fan 12. This is the point that the wind used is separated from the wind that cools the inverter power supply 6 to the upper part.

In this configuration, the first cooling fan 5
The cooling air that has passed through cools some of the components, is sucked into the second cooling fan 12 and is used for cooling the magnetron 3, and passes through the opening 9 provided immediately above,
Divided into the wind that cools the parts on the way. Here, a radiation fin or the like is used for cooling the semiconductor switch or the like in the inverter power supply 4, and it is effective to dispose the radiation fin vertically to the first cooling fan 5 in order to secure the cooling capacity. . Therefore, since the opening of the wind tunnel 6 is provided above the radiating fins, the wind flows along the radiating fins, and cooling can be performed by effectively using the radiating fins.

Further, by providing the opening 9 in the upper part of the wind tunnel 6, the exhaust resistance of the first cooling fan 5 is reduced,
The cooling air easily flows, the suction capacity of the first cooling fan 5 increases, and it becomes possible to supply air having a smaller temperature rise as the cooling air for the inverter power supply 4. As a result, the temperature of the components on the inverter power supply 4 can be kept low, or the size of the heat radiation fins can be reduced, so that the inverter power supply 4 can be downsized.

As described above, according to the present embodiment, since the air passage of the first cooling fan 5 is secured by providing the opening 9 on the upper surface of the wind tunnel 6, the suction capacity of the first cooling fan 5 is improved. In order to go up, the first cooling fan 5 from the housing inlet 2
Since the amount of air sucked into the intake port is increased, the temperature rise of the components of the inverter power supply 4 is suppressed, and a highly reliable high frequency heating device can be realized.

(Claim 8) An eighth embodiment of the high-frequency heating apparatus of the present invention will be described with reference to the drawings. FIG. 10 is a diagram showing the circuit configuration of the present embodiment, which is a simplified sectional view as seen from the side. This embodiment is the seventh embodiment.
The difference from the configuration of FIG.
It is that it is led into the heating chamber 1 through.

With this structure, the wind from the opening 9 is effectively used, and the window for confirming the state of the food in the heating chamber during heating is clouded by the steam generated during cooking. Can be prevented. By this, in order to separate the air from the first cooling fan 5,
There is no need to newly separate the cooling air, and there is no need to complicate the configuration.

As described above, according to this embodiment, the opening 9
By guiding the wind from the inside of the heating chamber 1 through the second air passage 10, it is possible to prevent the front window from being fogged by the generated steam that heats the object to be heated in the heating chamber with a simple configuration.
It is possible to realize a high-frequency heating device having excellent convenience.

[0060]

As described above, according to the present invention, it is possible to supply air having a low temperature from the intake port to the inverter power supply, the rise in operating temperature of each component of the inverter power supply 4 is low, and the reliability is high. It is possible to realize a high-frequency heating device having high properties.

[Brief description of drawings]

FIG. 1 is a diagram showing a configuration of a high frequency heating apparatus according to a first embodiment of the present invention.

FIG. 2 is a diagram showing a configuration of a high-frequency heating device according to a second embodiment of the present invention.

FIG. 3 is a diagram showing a configuration of an inverter power supply according to a second embodiment of the present invention.

FIG. 4 is a diagram showing a configuration of a high-frequency heating device according to a third embodiment of the present invention.

FIG. 5 is a diagram showing a configuration of a high-frequency heating device according to a fourth embodiment of the present invention.

FIG. 6 is a diagram showing the configuration of a high-frequency heating device according to a fifth embodiment of the present invention.

FIG. 7 is a diagram showing the configuration of a high-frequency heating device according to a sixth embodiment of the present invention.

FIG. 8 is a diagram showing an arrangement of an inverter power supply and a cooling fan according to a sixth embodiment of the present invention.

FIG. 9 is a diagram showing an arrangement of an inverter power supply and a cooling fan according to a seventh embodiment of the present invention.

FIG. 10 is a diagram showing the configuration of a high-frequency heating device according to an eighth embodiment of the present invention.

FIG. 11 is a diagram showing a configuration of a conventional high-frequency heating device.

[Explanation of symbols]

1 heating chamber 2 intake 3 magnetron 4 Inverter power supply 4a Inverter power supply board a 4b Inverter power supply board b 5 First cooling fan 6 wind tunnel 7 First wind path 8 Intake and exhaust separation wall 9 openings 10 Second wind path 12 Second cooling fan

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Shinichi Sakai             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. F-term (reference) 3K051 AB09 AB10 CD43                 3K090 AA07 AA20 AB01 BA01 BA08                       BB01 EB02 EB16 EB21 EB23                       EB25                 3L086 AA01 BA05 BE01 BE02 BE11                       CC07 DA16 DA17 DA18

Claims (8)

[Claims] 1. A magnetron, an inverter power supply for driving the magnetron, a first cooling fan for cooling the magnetron and the inverter power supply, and a heating chamber for radiating microwaves generated from the magnetron to an object to be heated. A high-frequency heating device, comprising: a first cooling fan disposed on the rear surface of the heating chamber, and an inverter power source disposed vertically above the first cooling fan. 2. The high-frequency heating device according to claim 1, wherein a wind tunnel is formed in an upper vertical direction of the first cooling fan, and the inverter power source is stored in the wind tunnel. 3. The high-frequency heating device according to claim 1, further comprising a separation wall that separates intake air and exhaust air of the first cooling fan. 4. The high-frequency heating device according to claim 1, wherein the intake side of the first cooling fan is arranged so as to be inclined to the heating chamber side. 5. The first air passage for guiding cooling air generated by the first cooling fan to the magnetron after passing through the inverter power supply, according to any one of claims 1 to 4. The high frequency heating device according to item 1. 6. The high-frequency heating device according to claim 2, further comprising a second cooling fan having an intake port on an upper part of the wind tunnel and an exhaust port on the magnetron. 7. The high-frequency heating device according to claim 6, wherein an opening is provided in a part of the upper part of the wind tunnel. 8. The second air passage for guiding the cooling air passing through the wind tunnel to the heating chamber is formed.
The high-frequency heating device described.