JP2003318500A5 - - Google Patents
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- Publication number
- JP2003318500A5 JP2003318500A5 JP2002117228A JP2002117228A JP2003318500A5 JP 2003318500 A5 JP2003318500 A5 JP 2003318500A5 JP 2002117228 A JP2002117228 A JP 2002117228A JP 2002117228 A JP2002117228 A JP 2002117228A JP 2003318500 A5 JP2003318500 A5 JP 2003318500A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002117228A JP3979159B2 (en) | 2002-04-19 | 2002-04-19 | Printed circuit board and printed circuit board using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002117228A JP3979159B2 (en) | 2002-04-19 | 2002-04-19 | Printed circuit board and printed circuit board using the same |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003318500A JP2003318500A (en) | 2003-11-07 |
| JP2003318500A5 true JP2003318500A5 (en) | 2005-09-15 |
| JP3979159B2 JP3979159B2 (en) | 2007-09-19 |
Family
ID=29534508
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002117228A Expired - Fee Related JP3979159B2 (en) | 2002-04-19 | 2002-04-19 | Printed circuit board and printed circuit board using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3979159B2 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060083939A1 (en) * | 2004-10-20 | 2006-04-20 | Dunbar Meredith L | Light activatable polyimide compositions for receiving selective metalization, and methods and compositions related thereto |
| JP4967359B2 (en) * | 2006-02-06 | 2012-07-04 | 住友ベークライト株式会社 | Resin composition, resin film, interlayer adhesive, and multilayer circuit board |
| JP2008265069A (en) * | 2007-04-18 | 2008-11-06 | Kaneka Corp | Insulating adhesion sheet, laminate, and printed wiring board |
| JP5633736B2 (en) * | 2010-09-14 | 2014-12-03 | Dic株式会社 | Thermosetting resin composition and interlayer adhesive film for printed wiring board |
| JP5998576B2 (en) * | 2012-03-29 | 2016-09-28 | 宇部興産株式会社 | Heat-sealable polyimide film and polyimide metal laminate using the same |
| JP6657567B2 (en) * | 2015-02-24 | 2020-03-04 | 味の素株式会社 | Method for manufacturing resin sheet |
| JP6414260B2 (en) * | 2017-03-23 | 2018-10-31 | 三菱マテリアル株式会社 | Heat dissipation circuit board |
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2002
- 2002-04-19 JP JP2002117228A patent/JP3979159B2/en not_active Expired - Fee Related