JP2003317885A - Ic receptacle - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To connect smoothly by contacting one end of the top end on the electrode of a test board by manufacturing a contact by a press process such as punching from a metal plate material and arranging in a row, and by depressing and contacting the other end of the top end on the IC lead of an IC package, and hold firmly the IC package without looseness. <P>SOLUTION: This is an IC receptacle that has a plurality of contacts contacting the IC lead of an IC package installed. The above contact is made of plate-shape and is elastically supported in a row by the cover member that is installed on the receptacle unit, and comprises two contact parts at the top end of the contact, and one contact part is contacted by the electrode of a test board and the other contact part is contacted by the IC lead. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention mounts a cover member provided with aligned contacts on a socket body attached to a test board to attach the contacts to the IC of the IC package for various tests of the IC package. The present invention relates to an IC socket adapted to be connected to a lead, and particularly to a high frequency test socket in which an IC package is mounted on a socket body mounted on a test board.

[0002]

2. Description of the Related Art Conventionally, in an IC package as an electric component, for various tests of the IC package, an IC such as a high frequency test socket in which the IC package is mounted on an IC socket formed by mounting a socket body on a test board. Sockets are known.

[0003]

An example of such a conventional contact type IC socket is shown in FIGS. 47 and 48.
Is shown in. First, FIG. 47 is a cross-sectional view when a conventional IC socket is attached to a test board, in which the contact pins are inserted into the pin holes of the test board, and FIG. 48 shows the IC socket on the test board. It is sectional drawing when mounting an IC package on a high-frequency measurement type IC socket in which the contacts are placed and the contacts are in contact with the electrodes of the test board.

In the conventional normal type IC socket 100 shown in FIG. 47, the contact 10 of the IC socket 100 is provided in the through hole 102 of the test board 101.
The terminal 107 portion of No. 6 is inserted and fixed.

Such a conventional IC socket 100 is
It has a plurality of contacts 106 arranged in a socket body 104 made of an insulative material, the contacts 106 being made of, for example, a thin metal plate material, the upper free end of which is curved to form a contact portion. 108 is formed, and the lower end is fixed and extends further downward as the terminal 107.

Therefore, in order to test the IC socket 100 as described above, for example, as shown in FIG.
IC socket 100 fixed on test board 101
The IC package 110 is mounted from above,
The IC lead 111 of the IC package 110 is placed on the contact portion 108 of the contact 106 so as to be connected to the printed circuit or the like of the IC package 110.

In such a conventional IC socket 100, the contact portion 108 of the contact 106 is elastically brought into contact with the IC lead 111 of the IC package 110, and foreign matter may be caught between the contact 106 and the contact 106 itself. The elastic force of the contact portion 108 is weakened, the contact force is reduced, and sufficient contact cannot be obtained.
It is unstable and cannot be firmly held, or the terminal 10
Since 7 is inserted into the through hole 102 of the test board 101, the terminal 107 of the contact 106 is easily damaged, and there is a problem that the terminal 107 is easily bent or folded.

Further, the conventional high frequency measurement type IC socket 200 shown in FIG. 48 is constructed such that the terminal 207 of the contact 206 of the IC socket 200 is placed on the electrodes of the test board 201 to be in contact therewith. ing.

Such a conventional IC socket 200 is
It has a plurality of contacts 206 arranged in a socket body 204 made of an insulating material. The contacts 206 are made of, for example, a thin metal plate material, and an elastic member 205 is pressed against the branch portion from above. Contact 2
A contact portion 208 is formed at one end of 06, and the lower end portion 207 is placed on the electrode of the test board 201 to be in contact therewith.

However, such an IC socket 2
00, the IC lead 2 of the IC package 210
Since 11 is placed on the contact portion 208 of the contact 206 and connected, the support of the IC package 210 is unstable, the connection between the contact 206 and the IC lead 211 is incomplete, and sufficient contact can be obtained. There are problems such as not being present.

Therefore, in order to solve the above-mentioned problems in the prior art, an object of the present invention is to manufacture contacts from a metal plate material by press working such as punching and arrange them in alignment to arrange one end of the tip end portion. A high-frequency wave that makes it possible to make good contact with the electrode of the test board and press the other end of the tip end onto the IC lead of the IC package to make a good connection, and at the same time firmly hold the IC package without rattling. It is to provide an IC socket such as a test socket.

[0012]

In order to achieve the above object, the IC socket of the present invention is an IC socket having a plurality of contacts for contacting the IC leads of the mounted IC package. In the form of a plate,
The contact is aligned and elastically supported by the cover member mounted on the socket body, and has two contact portions at the tip of the contact, one contact portion is in contact with the electrode of the test board, and the other contact portion is the IC lead. It is characterized by being contacted with.

Further, the IC socket of the present invention is characterized in that the contact is made of a metal plate material, one end of which is held in a cover member and pressed by an elastic pressing member.

Further, the IC socket of the present invention is characterized in that the two contact portions of the contact are provided in a protruding shape.

Furthermore, the IC socket of the present invention is characterized in that the contact is pressed by the elastic pressing member to exert a pressing force for contacting the IC lead and the test board.

In the IC socket of the present invention, the pressing force of the elastic pressing member is the same as the pressing force of the IC lead.
It is characterized in that each of the two contact portions acts as a pressing force on the test board.

Further, the IC socket of the present invention is characterized in that the elastic pressing member is a spring member that engages with and presses the upper end portion of the contact.

Further, the IC socket of the present invention is characterized in that the spring member is a coil spring which engages with the upper end portion of the contact.

Furthermore, the IC socket of the present invention is characterized in that the cover is a cover type IC socket which is pressed and locked by a pusher member.

The IC socket of the present invention is characterized in that the pusher member is pivotally supported by the socket body, and has an arm portion at a tip end portion which is engaged with the cover member.

Further, the IC socket of the present invention is characterized in that the contact is an open top type IC socket pressed by an elastic pressing member of the contact housing member.

Further, in the IC socket of the present invention, the contact accommodating member is pivotally supported by the socket body and elastically biased by a torsion spring to elastically retain the contact. .

Other objects, features and advantages of the present invention will become apparent from the following detailed description of the embodiments of the IC socket of the present invention shown in the accompanying drawings.

[0024]

DESCRIPTION OF THE PREFERRED EMBODIMENTS (Embodiment 1) Embodiment 1 of an IC socket of the present invention is shown in FIGS. 1 to 20, and the IC socket in this embodiment 1 is a cover type IC socket.

First, FIG. 1 is a perspective view showing an overall appearance when a cover type IC socket according to the present invention is attached to a test board, and FIG. 2 is an IC according to the present invention shown in FIG.
FIG. 3 is a perspective view showing a partially broken socket, FIG. 3 is an exploded perspective view of the IC socket of the present invention in FIG. 1, and FIG.
1 is a perspective view showing a part of the socket body of the IC socket of the present invention by breaking it, FIG. 5 is a front view of the socket body of FIG. 4, and FIG. 6 is a plan view of the socket body of FIG. 7 is
FIG. 8 is a side view of the socket body of FIG. 4, and FIG. 8 is a central vertical sectional view of the socket body of FIG.

FIG. 9 is a perspective view showing a part of the cover member of the IC socket of the present invention of FIG. 1 in a cutaway manner, and FIG.
11 is a front view of the cover member of FIG. 11, FIG. 11 is a plan view of the cover member of FIG. 9, FIG. 12 is a side view of the cover member of FIG. 9, and FIG. Figure 14
16 is a front view of the IC socket of the present invention in a test state of FIG. 1, FIG. 15 is a plan view of the IC socket of FIG.
FIG. 17 is a side view of the IC socket of FIG. 14, and FIG.
4 is a central vertical sectional view of the IC socket of FIG.

FIG. 18 is a central longitudinal sectional view showing a state in which an IC package of the present invention mounted on a test board is mounted with an IC package and a cover member is mounted.
18 shows an IC in the IC socket of the present invention following FIG.
FIG. 20 is a vertical cross-sectional view showing a state in which the package is mounted and the cover member is attached, and FIG. 20 is a state in which the IC package is attached to the IC socket of the present invention, the cover member is attached, and the pusher member is pressed, following FIG. It is a central longitudinal cross-sectional view showing.

As shown in the figure, the IC socket 1 according to the first embodiment of the present invention is a cover type IC socket, and is formed in a frame shape as a substrate having an opening 3 in the center.
In addition, a substantially rectangular socket body 2 attached to the test board B, a cover member 4 mounted on the socket body 2, and a pair of pusher members 5 rotatably provided facing the left and right sides of the cover member 4. The IC package mounting portion 6 is provided in the lower portion of the opening 3 of the socket body 2, and the plurality of contacts 7 and the spring member 8 for pressing the contacts 7 are also provided.
And are provided on the cover member 4.

The socket body 2 is formed in a substantially rectangular frame shape as a substrate having an opening 3 in the center, and pusher members 5 are pivotally mounted on a bracket portion 9 by a shaft or a pin 12 on both left and right sides. A plurality of projecting guide portions 14 that are supported and have inclined surfaces 15 that guide the mounting of the cover member 4 are provided, and stepped mounting holes 16 for mounting screws are provided at the four corners. It is provided.

Further, an inclined surface 17 is provided on the inner edge portion of the upper surface of the bracket portion 9 and is formed so as to guide the cover member 4 in cooperation with the guide portion 14 described above. Further, four dowels or protrusions 18 are provided on the lower surface of the socket body 2 so that they can be inserted into the mounting holes 19 of the test board B for positioning.

Further, I at the bottom of the opening 3 of the socket body 2
The C package mounting portion 6 is provided with an IC package positioning guide 20, a positioning dam portion 21, an IC lead guide portion 22, a hole portion 23, and a base portion 24.
The lead 11 is guided by the guide portion 22 so that the dam portion 21
One of the contact portions 33 of the contacts 7 can be inserted into the hole portion 23 by being positioned above the stand portion 24.

As shown in FIGS. 9 to 13, the cover member 4 is formed by integrally connecting the upper member 25 and the lower member 26 with screws 27, and the pusher member 5 is attached to the upper surface of the upper member 25. A groove 28 for locking is provided,
A space 29 for accommodating the contact 7 is formed by a partition wall 30 so that the contact 7 projects downward.
As shown, each is held by a lower member 26.

The contact 7 is composed of a plate-shaped contact main body 31 formed in a shape as shown in the drawing, for example, a substantially wedge shape by press working such as punching from a metal plate material, and has an enlarged portion 32 at the upper part. , Two protruding semi-circular contact portions 33, 34 are provided at the bottom.
Further, the contact portions 33 and 34 have a larger shape at the contact portion 33 than the contact portion 34 and are slightly smaller at the contact portion 34, so that the space 29 of the lower member 26 of the cover member 4 is formed. It is arranged so that the enlarged portion 32 of the contact 7 is located therein, and is pressed by the spring member 8 at the enlarged portion 32, the contact portions 33, 34 at the tip end portions project downward, and the contact portion 33 contacts. It is arranged so as to be located outside the portion 34. Further, the enlarged portion 32 of the contact 7 acts like a collar or a collar to prevent the contact 7 from falling out of the lower member 26 of the cover member 4.

The pusher member 5 includes the bracket portions 9 and 9
It is inserted between the brackets 9 and 9 so as to be positioned therebetween, and is pivotally supported by a pin 12
An arm portion 35 extending substantially at a right angle is provided near the tip end portion, and a locking projection portion 36 is provided at the tip end portion of the arm portion 35, and the locking projection portion 36 is provided in the groove 28 of the cover member 4. Are formed so that they can be locked.

The IC package 10 used in this embodiment is a rectangular flat lead type IC package having IC leads 11 on both left and right sides. Such a rectangular flat lead type IC is used. Of course, the package is not limited to a square package, a quad lead type IC package, and other similar IC packages can be used.

In the IC socket 1 of the present invention thus constructed, the IC board 10 is mounted on the test board B in the following manner, and the IC package 10 is mounted for the test.

First, as shown in FIG. 3, the electrodes b are arranged at predetermined positions on the test board B, and the projections 18 such as dowels of the socket body 2 are provided in the mounting holes (positioning holes) 19 for positioning. Is inserted and positioned, screws are attached to the attachment holes 16 of the socket body 2, and the socket body 2 is attached to the test board B.

In this way, with respect to the IC socket 1 of the present invention in which the socket body 2 is fixed to the test board B, as shown in FIG. 3, the IC package 10 to be subjected to the high frequency test is opened in the socket body 2. Inserted in 3,
The IC package 10 is mounted on the IC package mounting portion 6. At this time, the IC package 10 is guided by the IC package positioning guide 20, the lower surface of the IC package body is placed on the IC package mounting portion 6, and the IC leads 11 are placed on the IC package positioning dam portion 21. At the same time, the guide portion 22 guides it to place it on the base portion 24 so that it is accurately positioned and arranged.

In this state, then, as shown in FIG. 18, the cover member 4 is covered from above so that the contact 7 is on the IC lead 11.
Is dropped. In this case, the cover member 4 is guided by the inclined surface 15 of the guide portion 14 and the inclined surface 17 of the bracket 9 so that the lower surface of the upper member 25 of the cover member 4 is located on the upper surface of the socket body 2. The lower member 26 is fitted into the opening 3 of the socket body 2, and the contact portion 33 at the tip of the contact 7 is inserted into the hole portion 23.
4 is positioned on the IC lead 11 on the base 24. This state is shown in FIG.

Next, in the state shown in FIG. 19, the pusher member 5 pivots inwardly from both the left and right sides around the pin 12 to lock the protrusion of the tip of the arm portion 35 of the pusher member 5. The portion 36 is adapted to be engaged with the groove 28 on the upper surface of the upper member 25 of the cover member 4. As a result, the cover member 4 is pressed downward,
The locking projection 36 of the arm portion 35 of the pusher member 5 is firmly held by the engagement with the groove 28, the contact 7 is pressed by the spring member 8 and the contact portion 33 is pressed onto the electrode b of the test board B. 20 and the contact portion 34 is firmly pressed onto the IC lead 11 on the base portion 24, so that good contact is achieved as shown in FIG.

Further, in this case, the contact 7 is pushed by the cover member 4 to form a gap between the cover member 4 and the contact 7, and the contact 7 exists in the state shown by the chain line in FIG. Also, the spring force of the spring member 8 causes the contact 7 to rotate about the contact portion 34 as a fulcrum, so that the contact portion 33 can firmly contact the electrode b of the test board B. Further, since the contacts 7 are independent of each other, even if the shape of the IC lead 11 varies, it can be absorbed well and deal with each other.

In this way, the socket body 2 is attached to the test board B, the IC package 10 is attached, the cover member 4 is further attached, and the pusher member 5 is attached.
The IC package 10 can be satisfactorily tested after it is firmly fixed at.

As described above, in the IC socket 1 of the present invention, the one contact portion 33 of the tip end portion of the contact 7 which is elastically supported by being aligned with the cover member 4 mounted on the socket body 2 is the test board B. Since the other contact portion 34 is in contact with the IC lead 11, the one contact 7 can obtain good contact between the IC lead 11 and the electrode b of the test board B. 7 can be pressed against the IC leads 11 of the IC package 10 and brought into contact with each other for good connection, and at the same time, the IC package 10 can be firmly held without rattling.

(Embodiment 2) Embodiment 2 of the IC socket of the present invention is shown in FIGS. 21 to 46.
The IC socket in is an open top type IC socket.

First, FIG. 21 is a perspective view showing the overall appearance when the open top type IC socket of the present invention is attached to a test board, and FIG. 22 is a partially broken view of the IC socket of the present invention of FIG. 21 is an exploded perspective view showing the IC socket of the present invention of FIG. 21, and FIG. 24 is a perspective view showing a part of the socket body of the IC socket of the present invention of FIG. Figure, Figure 25
FIG. 26 is a front view of the socket main body of FIG. 24, FIG. 26 is a plan view of the socket main body of FIG. 24, FIG. 27 is a side view of the socket main body of FIG. 24, and FIG. FIG. 29 and FIG. 29 are perspective views showing a part of the cover member of the IC socket of the present invention of FIG.

FIG. 30 is a front view of the cover member of FIG. 29, FIG. 31 is a plan view of the cover member of FIG. 29, and FIG.
2 is a side view of the cover member of FIG. 29, and FIG.
9 is a central longitudinal sectional view of the cover member of FIG. 9, FIG.
FIG. 3 is an exploded perspective view of the contact storage member of the C socket.
5 is a perspective view of the contact storage member of FIG. 34, FIG.
FIG. 37 is a front view of the contact storage member of FIG.
FIG. 38 is a plan view of the contact storage member of FIG.
FIG. 39 is a side view of the contact storage member of FIG.
35 is a perspective view showing a contact of the contact accommodating member of FIG. 35 with a part broken away, and FIG. 40 is a central longitudinal sectional view of the contact accommodating member of FIG.

Further, FIG. 41 is a front view showing a state in which the open top type IC socket of the present invention is attached to a test board, FIG. 42 is a plan view of the IC socket of FIG. 41, and FIG. 44 is a side view of the IC socket of FIG. 44, and FIG. 44 is a central longitudinal sectional view thereof. Furthermore, FIG.
FIG. 46 is a central longitudinal sectional view showing a state where the IC package is mounted with the cover member pushed down and the contact storage member is opened left and right. FIG. 46 shows the IC package mounted and the contact storage member closed. It is a central longitudinal cross-sectional view showing a state at the time.

As shown in the figure, the IC socket 50 according to the second embodiment of the present invention is an open top type IC.
A socket main body 52, which is a socket and is formed in the shape of a double cross as a substrate having an opening 53 in the center and is attached to the test board B, and the socket main body 52.
Mainly composed of a cover member 54 mounted on the top and a pair of contact accommodating members 55 rotatably provided so as to oppose the left and right inner sides of the cover member 54, inside the opening 53 of the socket body 52. IC package mounting part 5 underneath
6, a plurality of contacts 57 are provided in the contact accommodating member 55, and the spring member 58 for pushing the cover member 54 upward and the contact accommodating member 55 inward. A torsion spring 59 for rotatably pressing is provided.

As shown in FIGS. 21 to 28, the socket main body 52 is formed as a board having an opening 53 in the center so as to project upward in a cross beam shape, and has a substantially rectangular shape in plan view as a whole. The contact accommodating member 55 is rotatably supported on both left and right sides by a shaft or a pin 62, and stepped mounting holes 63 are provided at four cross-shaped crossing points. A spring member 58 for pushing up the cover member 54 is inserted into the hole 63.
And mounting holes 64 for mounting on the test board B are provided at four corners.

Further, four dowels or protrusions 65 are provided on the lower surface of the socket main body 52, and the test board B
It can be positioned by inserting it in the positioning hole 78 of the mounting hole 66.
It can be screwed into the mounting hole 79 of the test board B via. Further, on the test board B, electrodes b for contacting and connecting the contacts 57 are arranged so as to be described later.

Furthermore, the opening 53 of the socket body 52
An IC package positioning guide 67, a positioning dam portion 68, an IC lead guide portion 69, and a hole portion 70 are provided in the IC package mounting portion 56 below
The C lead 61 is guided by the guide portion 69 and the dam portion 6
The contact portion 93 of the contact 57 can be inserted into the hole 70.

Further, the opening 53 of the socket body 52
On the left and right outer sides of the contact housing member 55, arc-shaped recesses 71 are provided so that the contact housing member 55 can be rotatably mounted and positioned, and the contact housing member 55 is rotatably mounted. A mounting hole 72 for mounting the pin 62 is provided. Further, a hook portion 73 for locking the cover member 54 is provided on the side in the direction orthogonal to the recessed portions 71, and is formed so that the claw portion 75 of the cover member 54 can be engaged. .

The cover member 54 is shown in FIGS. 21, 22, and 2.
As shown in FIGS. 9 to 33, it has a frame shape having an opening 74 in the center, and a claw portion 75 protruding inward so that it can be engaged with the hook portion 73 of the socket body 52.
In addition, guide portions 76 and 77 for guiding the IC package 60 when the IC package 60 is mounted are provided below the opening 74.

As shown in FIGS. 34 to 40, the contact accommodating member 55 is formed by integrally connecting an upper accommodating member 80 and a lower accommodating member 81 with a screw 82, and a lower surface side of the upper accommodating member 80. A hollow portion 83 is provided for the spring member 90 that presses the contact 57.

Further, the lower storage member 81 is provided with a cavity portion 84 for storing the contact 57 on the upper surface side, and the contact storage member 55 is rotatably supported on both left and right sides. Ears 85 are provided and holes 86 for the pins 62 are provided. Therefore, the lower storage member 81
The contact 57 is inserted into the hollow portion 84 of the upper housing member 80 to project the tip end downward, and the spring member 90 is attached to the hollow portion 83 of the upper housing member 80 to screw the upper housing member 80 and the lower housing member 81 with the screw 82. The contact housing member 55 having the contact 57 elastically urged by the spring member 90 is configured by being integrally coupled by.

With respect to the contact accommodating member 55, the pin 62 is passed through the mounting hole 72 of the socket body 52 and the hole 86 of the ear portion 85 of the lower accommodating member 81 of the contact accommodating member 55, thereby making contact. The storage member 55 can be rotatably supported by the socket body 52.

On the other hand, the contact 57 is shown in FIGS.
As shown in FIG. 0, the contact body 91 has a substantially wedge shape, has an enlarged portion 92 at the upper portion, and has two protruding contact portions 93 and 94 at the lower portion. Is larger and the contact portion 94 is slightly smaller in shape, the enlarged portion 92 of the contact 57 is arranged in the space portion 84 of the lower storage member 81 of the contact storage member 55, and the contact member 94 is formed by the spring member 90. The contact 57 is pressed in the enlarged portion 92, the contact portions 93 and 94 at the tip end portion project downward, and the contact portion 93 is contacted with the contact portion 9.
It is arranged so as to be located outside of 4.

Further, the enlarged portion 92 of the contact 57 acts like a brim to prevent the contact 57 from falling out of the lower storage member 81 of the contact storage member 55. Therefore, the cover member 54 is normally pushed upward by the spring member 58, and the contact accommodating member 55 is rotated inward by the torsion spring 59 so that the contact 57 contacts the electrode b of the test board B. Get in touch.

In the IC socket 50 of the present invention thus constructed, the IC socket 50 is attached to the test board B, the IC package 60 is attached,
The test will be performed as follows. The substantial process is almost the same as that in the above-mentioned first embodiment.

First, as shown in FIG. 23, the electrodes b are arranged at predetermined positions on the test board B, and the projections 65 such as the dowels of the socket body 52 are inserted into the positioning holes 78 for positioning and mounting. A screw 66 is attached to the hole 64, and the socket body 52 is attached to the test board B. Next, the contact accommodating member 55 is attached to the socket main body 52, and the spring member 58 is attached and the cover member 54 is attached. Therefore, the cover member 54 is normally pushed up to the upper position by the spring member 58, and the contact accommodating member 55 is moved to the pin 6 position.
It is pivoted inwardly about two times by a torsion spring 59 and is positioned in the closed position shown in FIG. However, at this closed position, the IC package 60 is not yet mounted.

As described above, in order to mount the IC package 60 to be subjected to the high frequency test on the IC socket 50 of the present invention in which the socket body 52 is fixed to the test board B and to perform the test, first, referring to FIG. As shown in
When the cover member 54 is pushed down, the cover member 54
Since the contact storage member 55 is pushed down by the contact storage member 55, the contact storage member 55 rotates outward around the pin 62, and the contact 57 is separated from the socket main body 52 and opened as shown in the figure. Therefore, the cover member 5
In this open state in which 4 is pushed down, the IC package 60 to be subjected to the high frequency test is inserted into the opening 53 of the socket body 52 through the opening 54 of the cover member 54 and mounted on the IC package mounting portion 56. .

At this time, the IC package 60 is guided by the IC package positioning guide 67 so that the lower surface of the IC package body is placed on the IC package mounting portion 56, and the IC leads 61 are positioned at the IC package positioning dam portion 68. Placed on top of and supported by
The tip portion of the IC lead 61 is placed at the hole portion 70 by the guide of the guide portion 69 and accurately positioned and arranged.

Next, in this state, the cover member 5
When the pressing of 4 is stopped, the cover member 54 is pushed upward by the spring member 58, and at the same time, the contact accommodating member 55 is rotated inwardly around the pin 62 by the torsion spring 59, so that the contact 57 is moved. 5
The second IC package can be mounted on the IC lead 61 of the IC package 60 mounted on the second IC package mounting portion 56. This state is shown in FIG. That is, as shown in the figure, in the contact 57, the contact portion 93 is in contact with the test board B, and the contact portion 94 is in contact with the IC lead 61.
Will be contacted on.

In this closed state shown in FIG. 46, the lower surface of the main body of the IC package 60 is placed on the IC package mounting portion 56, and the IC leads 61 are attached to the IC.
Since it is placed and supported on the package positioning dam portion 68, the contact portion 94 of the contact 57 contacts the tip portion of the IC lead 61, and the contact portion 93 contacts the electrode b of the test board B. It In this case, since the contact 57 is pressed by the spring member 90, a gap is formed between the contact 57 and the upper storage member 80 of the contact storage member 55, and the elastic repulsive force of the spring member 90 causes the contact 5 to move.
7 rotates about the contact portion 94 in contact with the IC lead 61 as a fulcrum, and the contact portion 93 comes into contact with the electrode b of the test board B. Further, since the contacts 57 are independent of each other, even if the IC leads 61 of the IC package 60 have variations, each contact 57 absorbs the variations of the IC leads 61 by the elastic spring force of the spring member 90. Can respond well.

In this way, the socket body 52 of the IC socket 50 of the present invention and the cover member 54 are attached to the test board B, the IC package 60 is mounted, and the cover member 54 is operated to operate the IC package. After the 60 is firmly attached, the IC package 60 can be satisfactorily tested.

As described above, in the IC socket 50 of the present invention, the one contact portion 93 of the tip portion of the contact 57 elastically supported by being aligned with the contact housing member 55 mounted on the socket body 52 is the test board. B electrode b
Since the other contact portion 94 is brought into contact with the IC lead 61, one contact 57 can provide good contact between the IC lead 61 and the electrode b of the test board B, and the contact 57 Package 6
It is possible to press the IC lead 61 of 0 to make contact with the IC lead 61 for good connection, and at the same time, firmly hold the IC package 60 without rattling.

[0067]

As described above, the IC socket according to claim 1 of the present invention is an IC having a plurality of contacts for contacting the IC leads of the mounted IC package.
In the socket, the contact is plate-shaped and elastically supported by being aligned with a cover member mounted on the socket body, and has two contact portions at a tip portion of the contact, and one contact portion is an electrode of a test board. Since the other contact portion is in contact with the IC lead, one contact can obtain good contact between the IC lead and the electrode of the test board, and the contact can be pressed onto the IC lead of the IC package. At the same time contacting and making good connection, IC
The package can be firmly held without rattling.

The IC socket according to claim 2 of the present invention is
Good contact is obtained because the contacts are made of sheet metal and are held at one end in the cover member and pressed by the spring member.

The IC socket according to claim 3 of the present invention is
Since the two contact portions of the contact are provided in a protruding shape, it is possible to obtain good contact between the IC lead and the electrode of the test board with one contact.

The IC socket according to claim 4 of the present invention is
Since the contact is pressed by the elastic pressing member to contact the IC lead and the test board, the contact is applied to the IC lead and the electrode of the test board through an appropriate pressing force. Be contacted.

The IC socket according to claim 5 of the present invention is
Since the pressing force of the spring member acts on the two contact portions as the pressing force on the IC lead and the pressing force on the test board, the contact is well contacted with the electrodes of the IC lead and the test board. Connected.

The IC socket according to claim 6 of the present invention is
Since the spring member is a spring member that engages with and presses against the upper end portion of the contact, the pressing force acts favorably and the IC lead can be favorably connected to the electrode of the test board by the contact.

The IC socket according to claim 7 of the present invention is
Since the spring member is a coil spring that engages with the upper end portion of the contact, the spring member as an elastic pressing member can exert a good pressing force on the contact and a good contact can be obtained.

The IC socket according to claim 8 of the present invention is
Since the cover is a cover type IC socket that is pressed and locked by the pusher member, the cover member and the pusher member provide good contact between the contact, the IC lead and the electrode of the test board, and the contact is IC. It is possible to press and contact the IC lead of the package to make a good connection, and at the same time, firmly hold the IC package without rattling.

The IC socket according to claim 9 of the present invention is
The pusher member is pivotally supported on the socket body,
Since the distal end portion has the arm portion that is engaged with the cover member, the cover member can be firmly fixed to the socket body.

The IC socket according to claim 10 of the present invention is an open top type IC socket in which the contact is pressed by the elastic pressing member of the contact housing member, so that the contact, the IC lead, and the test can be performed by the contact housing member. At the same time as obtaining good contact with the electrodes of the board and pressing the contact onto the IC lead of the IC package to make a good contact,
The C package can be firmly held without rattling.

According to the eleventh aspect of the present invention, in the IC socket, the contact accommodating member is pivotally supported by the socket body and elastically biased by a torsion spring,
Since the contact is elastically held, the contact portion of the contact can firmly come into contact with the IC lead of the IC package and the electrode of the test board by the pivotal movement of the contact housing member.

[Brief description of drawings]

FIG. 1 is a perspective view showing an overall appearance of an IC socket in a test state according to a first embodiment of the present invention.

FIG. 2 is a perspective view showing the IC socket of the present invention in FIG. 1 partially broken away.

FIG. 3 is an exploded perspective view of the IC socket of the present invention in FIG.

FIG. 4 is a perspective view showing the socket body of the IC socket of the present invention shown in FIG.

5 is a front view of the socket body of FIG. 4. FIG.

6 is a plan view of the socket body of FIG. 4. FIG.

FIG. 7 is a side view of the socket body of FIG.

8 is a central longitudinal cross-sectional view of the socket body of FIG.

FIG. 9 is a perspective view showing a part of the cover member of the IC socket of the present invention of FIG.

FIG. 10 is a front view of the cover member of FIG.

11 is a plan view of the cover member of FIG.

FIG. 12 is a side view of the cover member of FIG.

13 is a central longitudinal sectional view of the cover member of FIG.

FIG. 14 is a front view of the IC socket of the present invention in FIG. 1 in a test state.

FIG. 15 is a plan view of the IC socket of FIG.

16 is a side view of the IC socket of FIG.

FIG. 17 is a central longitudinal sectional view of the IC socket of FIG.

FIG. 18 is a central longitudinal sectional view showing a state in which the IC package is mounted on the IC socket of the present invention mounted on the test board and the cover member is mounted.

FIG. 19 is a central vertical cross-sectional view showing a state in which the IC package is mounted on the IC socket according to the present invention and the cover member is attached subsequent to FIG. 18;

FIG. 20 is a central vertical cross-sectional view showing a state where the IC package is mounted on the IC socket according to the present invention, the cover member is attached and the pusher member presses the IC socket in FIG. 19;

FIG. 21 is a perspective view showing an overall appearance of an IC socket in a test state according to the second embodiment of the present invention.

FIG. 22 is a perspective view showing the IC socket of the present invention of FIG. 21 with a part thereof cut away.

23 is an exploded perspective view of the IC socket of Embodiment 2 of the present invention in FIG. 21. FIG.

FIG. 24 is a perspective view showing a part of the socket body of the IC socket of Embodiment 2 of the invention shown in FIG.

25 is a front view of the socket body of FIG. 24. FIG.

26 is a plan view of the socket body of FIG. 24. FIG.

27 is a side view of the socket body of FIG. 24. FIG.

28 is a central longitudinal sectional view of the socket body of FIG. 24. FIG.

29 is a perspective view showing a part of the cover member of the IC socket of Embodiment 2 of the present invention shown in FIG.

30 is a front view of the cover member of FIG. 29. FIG.

31 is a plan view of the cover member of FIG. 29. FIG.

32 is a side view of the cover member of FIG. 29. FIG.

33 is a central vertical cross-sectional view of the cover member of FIG. 29. FIG.

34 is an exploded perspective view of a contact storage portion of the IC socket of Embodiment 2 of the present invention in FIG. 21. FIG.

35 is a perspective view of a storage portion of the IC socket of FIG. 34.

36 is a front view of the storage portion of the IC socket of FIG. 35. FIG.

37 is a plan view of a storage portion of the IC socket of FIG. 35.

38 is a side view of the storage portion of the IC socket of FIG. 35. FIG.

39 is a perspective view of a storage portion of the IC socket of FIG. 35.

40 is a cross-sectional view of a storage portion of the IC socket of FIG.

41 is a front view of the contact portion of the IC socket according to the second embodiment of the present invention shown in FIG. 21. FIG.

42 is a plan view of the contact portion of the IC socket of FIG. 41. FIG.

43 is a side view of a contact portion of the IC socket of FIG. 41. FIG.

44 is a central vertical cross-sectional view of the contact portion of the IC socket of FIG. 41.

45 is a central longitudinal sectional view for explaining the operation of the contact portion when the IC package is mounted on the IC socket of Embodiment 2 of the present invention in FIG. 21.

FIG. 46 is a central vertical cross-sectional view when the IC package is mounted and the cover member is closed, following FIG. 45;

FIG. 47 is a cross-sectional view showing a conventional IC socket of a normal type attached to a test board.

FIG. 48 is a cross-sectional view of a conventional high frequency measurement type IC socket attached to a test board.

[Explanation of symbols]

1 IC socket 2 socket body 3 openings 4 Cover member 5 Pusher member 6 IC package mounting part 7 contacts 8 spring members 9 Bracket part 10 IC package 11 IC lead 12 pin 14 Guide part 15 inclined surface 16 mounting holes 17 Inclined surface 18 protrusions 19 mounting holes 20 IC package positioning guide 21 IC package positioning dam 22 Guide 23 holes 24 units 25 Upper member 26 Lower member 27 screws 28 groove 29 Vacancy 30 bulkheads 31 Contact body 32 Enlargement 33 Contact part 34 Contact part 35 Arm 36 Locking protrusion 50 IC socket 52 Socket body 53 openings 54 cover member 55 Contact storage material 56 IC package mounting part 57 contacts 58 Spring member 59 torsion spring 60 IC package 61 IC lead 62 pin 63 mounting hole 64 mounting holes 65 Protrusion 66 screws 67 IC package positioning guide 68 IC package positioning dam 69 Guide 70 holes 71 hollow 72 Mounting hole 73 Hook part 74 openings 75 Claw 76 Guide 77 Guide 78 Positioning hole 79 mounting holes 80 Upper storage member 81 Lower storage member 82 screws 83 Vacancy 84 Vacancy 85 ears 86 holes 90 Spring member 91 Contact body 92 Enlarged section 93 Contact part 94 Contact part B test board b electrode

Claims (11)

[Claims] 1. An IC socket having a plurality of contacts for contacting an IC lead of a mounted IC package, wherein the contacts are plate-shaped and elastically supported in alignment with a cover member mounted on the socket body. An IC socket characterized in that it has two contact portions at the tip of the contact, one of the contact portions is in contact with the electrode of the test board, and the other contact portion is in contact with the IC lead. 2. The contact according to claim 1, wherein the contact is made of a metal plate material and has one end held in a cover member and pressed by an elastic pressing member.
C socket. 3. The IC socket according to claim 1, wherein the two contact portions of the contact are provided in a protruding shape. 4. The pressing force applied to the contact by the elastic pressing member to contact the IC lead and the test board is applied.
IC socket described in. 5. The pressing force of the elastic pressing member acts on the two contact portions as a pressing force on the IC lead and a pressing force on the test board, respectively. IC socket. 6. The IC socket according to claim 5, wherein the elastic pressing member is a spring member that engages and presses the upper end portion of the contact. 7. The IC socket according to claim 6, wherein the spring member is a coil spring that engages with an upper end portion of the contact. 8. The IC socket according to claim 1, wherein the cover member is a cover type IC socket that is pressed and locked by a pusher member. 9. The IC socket according to claim 8, wherein the pusher member is pivotally supported by the socket body, and has an arm portion at a tip end portion that is engaged with the cover member. 10. The IC socket according to claim 1, wherein the contact is an open top type IC socket that is pressed by an elastic pressing member of a contact storage member. 11. The IC socket according to claim 10, wherein the contact accommodating member is pivotally supported by the socket body and elastically biased by a torsion spring to elastically hold the contact. .