JP2003306702A - Method of producing chip type inductor - Google Patents

Method of producing chip type inductor

Info

Publication number
JP2003306702A
JP2003306702A JP2002117761A JP2002117761A JP2003306702A JP 2003306702 A JP2003306702 A JP 2003306702A JP 2002117761 A JP2002117761 A JP 2002117761A JP 2002117761 A JP2002117761 A JP 2002117761A JP 2003306702 A JP2003306702 A JP 2003306702A
Authority
JP
Japan
Prior art keywords
green compact
inductor
fine particles
type inductor
compact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002117761A
Other languages
Japanese (ja)
Inventor
Morikazu Hirata
守一 平田
Fumio Yokota
文男 横田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toko Inc
Original Assignee
Toko Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toko Inc filed Critical Toko Inc
Priority to JP2002117761A priority Critical patent/JP2003306702A/en
Publication of JP2003306702A publication Critical patent/JP2003306702A/en
Pending legal-status Critical Current

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  • Powder Metallurgy (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of producing a chip type inductor by which the occurrence of cracks can be prevented. <P>SOLUTION: Magnetic powder containing a binder consisting of a thermosetting resin is compacted to form a green compact 11 with a coil 12 buried at the inside. After that, the green compact 11 is placed in a pressure vessel 30 filled with micro granules 40. The green compact 11 is heated and hardened in a state where the green compact 11 is pressurized via the micro granules 40. <P>COPYRIGHT: (C)2004,JPO

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、磁性体内にコイル
を内蔵したチップ型インダクタの製造方法に関するもの
である。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a chip-type inductor having a coil inside a magnetic body.

【0002】[0002]

【従来の技術】図5はこの種のチップ型インダクタ10の
一例を示している。磁性体からなる圧粉体11の内部にコ
イル12が埋め込まれ、コイル12の両端末はそれぞれ電極
13に接続されている。圧粉体11の原材料としては、例え
ば鉄あるいはセンダスト、パーマロイ等の金属磁性粉を
熱硬化性樹脂からなるバインダ(接合剤)で包み込んだ
磁性粉末が用いられる。この磁性粉末を加圧して圧粉体
11を成形した後、バインダを加熱し反応させて硬化させ
てある。
2. Description of the Related Art FIG. 5 shows an example of this type of chip inductor 10. A coil 12 is embedded inside a powder compact 11 made of a magnetic material, and both terminals of the coil 12 are electrodes.
Connected to 13. As the raw material of the green compact 11, for example, magnetic powder obtained by wrapping metal magnetic powder such as iron or sendust or permalloy with a binder (bonding agent) made of a thermosetting resin is used. The magnetic powder is pressed to obtain a green compact.
After 11 is molded, the binder is heated and reacted to be hardened.

【0003】このようなインダクタの製造は、従来、次
のようにして行っていた。先ず、コイル12を内部に埋め
込んだ磁性粉末を金型に入れ、1平方cm当たり2トン
程度の圧力で加圧して圧粉体11を成形する。この時点で
は圧粉体11に含まれる熱硬化性樹脂からなるバインダは
未反応状態にあり、圧粉体11は所定の形状に固められて
いるが未だ硬化していない。そこで、このインダクタ10
を高温炉に通して加熱し、バインダを反応させて圧粉体
11を硬化させていた。
Conventionally, such an inductor has been manufactured as follows. First, the magnetic powder having the coil 12 embedded therein is placed in a mold to pressurize at a pressure of about 2 tons per square cm to form the green compact 11. At this time, the binder made of the thermosetting resin contained in the green compact 11 is in an unreacted state, and the green compact 11 is hardened into a predetermined shape, but is not yet hardened. So, this inductor 10
Is passed through a high-temperature furnace and heated to react the binder with it
11 had been cured.

【0004】[0004]

【発明が解決しようとする課題】ところが、圧粉体11の
内部応力と材質別の熱膨張の作用により、圧粉体11が硬
化する際に特に電極13に接する付近や凹凸のある部分な
どにクラックが発生しやすいという問題があった。そこ
で本発明は、このクラックの発生を防止できるチップ型
インダクタの製造方法を提供しようとするものである。
However, due to the internal stress of the green compact 11 and the effect of thermal expansion of each material, when the green compact 11 is hardened, especially in the vicinity of the contact with the electrode 13 or the uneven portion. There is a problem that cracks are likely to occur. Therefore, the present invention is to provide a method for manufacturing a chip-type inductor that can prevent the occurrence of cracks.

【0005】[0005]

【課題を解決するための手段】本発明によるチップ型イ
ンダクタの製造方法は、熱硬化性樹脂からなるバインダ
を含む磁性粉末を加圧成形して内部にコイル12を埋設し
た圧粉体11を形成した後、微小粒体で満たした圧力容器
内に圧粉体11を収容し、微小粒体を介して圧粉体11を加
圧した状態で圧粉体11を硬化させることを特徴とする。
In the method of manufacturing a chip-type inductor according to the present invention, a magnetic powder containing a binder made of a thermosetting resin is pressure-molded to form a powder compact 11 having a coil 12 embedded therein. After that, the powder compact 11 is housed in a pressure container filled with the fine particles, and the powder compact 11 is cured while the powder compact 11 is pressed through the fine particles.

【0006】[0006]

【実施例】図2はチップ型インダクタ10の製造途中の断
面図であり、コイル12を内部に埋め込んだ磁性粉末を金
型で加圧して圧粉体11を成形した直後の状態である。こ
の後、圧粉体11に含まれる熱硬化性樹脂からなるバイン
ダを反応させて圧粉体11を硬化させ、さらに電極13を折
り曲げ成形して図5に示したようなチップ型インダクタ
とされる。
EXAMPLE FIG. 2 is a sectional view of the chip inductor 10 in the process of being manufactured, showing a state immediately after the magnetic powder having the coil 12 embedded therein is pressed by a mold to form the green compact 11. Then, the binder made of a thermosetting resin contained in the green compact 11 is reacted to harden the green compact 11 and the electrode 13 is bent to form a chip-type inductor as shown in FIG. .

【0007】本発明によるチップ型インダクタの製造方
法は、インダクタの圧粉体を硬化させる工程に特徴を有
する。以下、図2に示したインダクタ10を例にとり、そ
の圧粉体11を硬化させる工程について、図面を参照して
説明する。
The method of manufacturing a chip-type inductor according to the present invention is characterized by the step of hardening the green compact of the inductor. Hereinafter, taking the inductor 10 shown in FIG. 2 as an example, a process of hardening the green compact 11 will be described with reference to the drawings.

【0008】図1はインダクタ10の圧粉体11を硬化させ
る装置の概要を示すもので、保持具20に取付けた複数の
インダクタ10を筒形の圧力容器30の内部に収容してあ
る。圧力容器30内部の残りの空間には隙間なく微小粒体
40が充填してあり、インダクタ10は図3のように微小粒
体40の中に埋没した状態となっている。
FIG. 1 shows an outline of an apparatus for curing a powder compact 11 of an inductor 10. A plurality of inductors 10 mounted on a holder 20 are housed inside a cylindrical pressure vessel 30. There are no gaps in the remaining space inside the pressure vessel 30
40 is filled, and the inductor 10 is in a state of being buried in the fine particles 40 as shown in FIG.

【0009】圧力容器30両端の開口部は、圧力容器30内
の一定の範囲をスライド可能な側板32によって、密封し
た状態に塞いである。二つの側板32には図1の矢印方向
の圧力が加えられ、圧力容器30の内部を満たしている微
小粒体40を圧縮するように両側から加圧する。
The openings at both ends of the pressure vessel 30 are closed in a sealed state by a slidable side plate 32 within a certain area of the pressure vessel 30. A pressure in the direction of the arrow in FIG. 1 is applied to the two side plates 32, and the fine particles 40 filling the inside of the pressure vessel 30 are pressed from both sides so as to be compressed.

【0010】微小粒体40としては、ガラスあるいはステ
ンレス、セラミック等からなる球体を用いる。この球体
の大きさは圧粉体11の外形寸法や凹凸の状態に応じて決
められるが、通常のインダクタの場合は直径が50〜3
00μm程度となる。微小粒体40は表面が平滑で摩擦係
数の低いものを選ぶことにより液体に類似した性質が得
られ、液体と同様に加圧力は伝播される。このため、側
板32による加圧力は微小粒体40を介してインダクタ10の
圧粉体11の外周全面に作用することになる。
As the fine particles 40, spherical bodies made of glass, stainless steel, ceramics or the like are used. The size of the sphere is determined according to the external dimensions of the green compact 11 and the state of the irregularities, but in the case of a normal inductor, the diameter is 50 to 3
It will be about 00 μm. By selecting a fine particle 40 having a smooth surface and a low friction coefficient, a property similar to a liquid can be obtained, and a pressing force is propagated like a liquid. Therefore, the pressure applied by the side plate 32 acts on the entire outer periphery of the powder compact 11 of the inductor 10 via the fine particles 40.

【0011】そして、微小粒体40を介して圧粉体11を加
圧した状態を維持したまま、圧力容器30ごと圧粉体11が
加熱される。その結果、圧粉体11の温度が上昇してバイ
ンダが反応し、外周全面に圧力が加わっている状態の下
で圧粉体11は硬化する。この後、側板32を開放して圧力
容器30内の圧力を解除し、取り出したインダクタ10の電
極を折り曲げ成形することによりチップ型インダクタと
して完成する。
Then, the green compact 11 is heated together with the pressure container 30 while maintaining the pressed state of the green compact 11 through the fine particles 40. As a result, the temperature of the green compact 11 rises, the binder reacts, and the green compact 11 is hardened under the condition that pressure is applied to the entire outer circumference. After that, the side plate 32 is opened to release the pressure in the pressure vessel 30, and the electrodes of the taken out inductor 10 are bent and formed to complete a chip-type inductor.

【0012】図1の装置をさらに具体化した構成例を図
4に示す。これは圧力容器30の両端の開口部を塞ぐ二つ
の側板32を、スプリング50の弾性によって内側に付勢し
て加圧するものである。この例では、等間隔に配置した
3本のスプリング50を二つの側板32の間に取付けてあ
る。スプリング50を使用する代わりに、側板32を圧力容
器30内に進入自在なピストンで構成するようにしてもよ
い。
FIG. 4 shows a configuration example in which the apparatus of FIG. 1 is further embodied. This is one in which the two side plates 32 that close the openings at both ends of the pressure vessel 30 are urged inward by the elasticity of the spring 50 to apply pressure. In this example, three springs 50 arranged at equal intervals are mounted between the two side plates 32. Instead of using the spring 50, the side plate 32 may be composed of a piston that can enter the pressure vessel 30.

【0013】なお、圧粉体11のバインダを硬化させる際
の温度は、圧粉体11に使用される磁性粉末の温度特性に
応じて決められる。バインダの材料によっては硬化させ
るための加熱が不要となる場合もある。圧粉体11の硬化
後に圧力容器30から取り出したインダクタ10と微小粒体
40との分離を容易にするために、インダクタ10全体ある
いは圧粉体11部分をポリエチレン樹脂等からなる薄膜シ
ートで被ってから圧力容器30に入れて硬化させるように
してもよい。
The temperature at which the binder of the green compact 11 is hardened is determined according to the temperature characteristics of the magnetic powder used for the green compact 11. Depending on the binder material, heating for curing may not be necessary. Inductor 10 and fine particles taken out from the pressure vessel 30 after the green compact 11 was cured
In order to facilitate separation from the inductor 40, the inductor 10 as a whole or the powder compact 11 portion may be covered with a thin film sheet made of polyethylene resin or the like and then placed in the pressure container 30 and cured.

【0014】[0014]

【発明の効果】圧粉体の外面形状に大きな凹凸があると
特にクラックができやすいが、本発明によれば凹凸があ
っても圧粉体の外面全体が均等に押圧された状態で硬化
するので、クラックの発生のない良好な圧粉体を得るこ
とができる。また、磁性粉末の原材料や配合比率を変更
したときでも、圧粉体に加える圧力を調整することでク
ラックが出ないように容易に対応できる。熱硬化性樹脂
が反応過程でゲル化する時にも外周全面から継続して圧
力が加えられることになるので、圧粉体の密度のばらつ
きが少なくなり、インダクタの電気的特性が安定化する
効果もある。
[Effects of the Invention] When the outer shape of the green compact has large irregularities, cracks are particularly likely to occur. However, according to the present invention, the entire outer surface of the green compact is cured while being pressed uniformly. Therefore, it is possible to obtain a good green compact having no cracks. Further, even when the raw material and the compounding ratio of the magnetic powder are changed, it is possible to easily cope with the occurrence of cracks by adjusting the pressure applied to the green compact. Even when the thermosetting resin gels during the reaction process, pressure is continuously applied from the entire outer circumference, so the density variation of the green compact is reduced and the electrical characteristics of the inductor are also stabilized. is there.

【図面の簡単な説明】[Brief description of drawings]

【図1】 本発明の製造工程で用いる装置の基本構造を
示す部分断面正面図
FIG. 1 is a partial sectional front view showing a basic structure of an apparatus used in a manufacturing process of the present invention.

【図2】 製造途中のインダクタの正面断面図FIG. 2 is a front sectional view of an inductor in the process of being manufactured.

【図3】 圧力容器中のインダクタの概念図FIG. 3 is a conceptual diagram of an inductor in a pressure vessel.

【図4】 本発明における硬化装置の具体的な構成例を
示す正面図
FIG. 4 is a front view showing a specific configuration example of a curing device according to the present invention.

【図5】 チップ型インダクタの一例を示す正面図FIG. 5 is a front view showing an example of a chip inductor.

【符号の説明】[Explanation of symbols]

10 インダクタ 11 圧粉体 12 コイル 30 圧力容器 40 微小粒体 10 inductor 11 Green compact 12 coils 30 pressure vessel 40 small particles

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 熱硬化性樹脂からなるバインダを含む磁
性粉末を加圧成形して内部にコイルを埋設した圧粉体を
形成した後、微小粒体で満たした圧力容器内に該圧粉体
を収容し、微小粒体を介して圧粉体を加圧した状態で該
圧粉体を硬化させることを特徴とするチップ型インダク
タの製造方法。
1. A magnetic powder containing a binder made of a thermosetting resin is pressure-molded to form a powder compact having a coil embedded therein, and the powder compact is then filled in a pressure container filled with fine particles. And a method of manufacturing a chip-type inductor, characterized in that the powder compact is cured while the powder compact is housed in a state of being pressed through the fine particles.
【請求項2】 微小粒体で圧粉体を加圧すると同時に、
該圧粉体を加熱する請求項1のチップ型インダクタの製
造方法。
2. At the same time as pressurizing the green compact with fine particles,
The method for manufacturing a chip-type inductor according to claim 1, wherein the green compact is heated.
【請求項3】 微小粒体が、ガラス、ステンレス、セラ
ミックの中から選ばれた材料からなる請求項1のチップ
型インダクタの製造方法。
3. The method for producing a chip-type inductor according to claim 1, wherein the fine particles are made of a material selected from glass, stainless steel, and ceramics.
【請求項4】 高圧容器内の圧粉体の表面を薄膜シート
で被い、微小粒体と薄膜シートを介して圧粉体を加圧す
るようにした請求項1のチップ型インダクタの製造方
法。
4. The method for producing a chip-type inductor according to claim 1, wherein the surface of the powder compact in the high-pressure container is covered with a thin film sheet, and the powder compact is pressed through the fine particles and the thin film sheet.
JP2002117761A 2002-04-19 2002-04-19 Method of producing chip type inductor Pending JP2003306702A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002117761A JP2003306702A (en) 2002-04-19 2002-04-19 Method of producing chip type inductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002117761A JP2003306702A (en) 2002-04-19 2002-04-19 Method of producing chip type inductor

Publications (1)

Publication Number Publication Date
JP2003306702A true JP2003306702A (en) 2003-10-31

Family

ID=29397227

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002117761A Pending JP2003306702A (en) 2002-04-19 2002-04-19 Method of producing chip type inductor

Country Status (1)

Country Link
JP (1) JP2003306702A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013098282A (en) * 2011-10-31 2013-05-20 Toko Inc Plane mounting inductor
JP2013098283A (en) * 2011-10-31 2013-05-20 Toko Inc Manufacturing method for plane mounting inductor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013098282A (en) * 2011-10-31 2013-05-20 Toko Inc Plane mounting inductor
JP2013098283A (en) * 2011-10-31 2013-05-20 Toko Inc Manufacturing method for plane mounting inductor

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