JP2003301258A - Vacuum film forming device - Google Patents
Vacuum film forming deviceInfo
- Publication number
- JP2003301258A JP2003301258A JP2002110581A JP2002110581A JP2003301258A JP 2003301258 A JP2003301258 A JP 2003301258A JP 2002110581 A JP2002110581 A JP 2002110581A JP 2002110581 A JP2002110581 A JP 2002110581A JP 2003301258 A JP2003301258 A JP 2003301258A
- Authority
- JP
- Japan
- Prior art keywords
- vacuum chamber
- film thickness
- heater
- vacuum
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Physical Vapour Deposition (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、真空成膜装置に関
する。TECHNICAL FIELD The present invention relates to a vacuum film forming apparatus.
【０００２】[0002]
【従来の技術】一般の真空成膜装置では、真空チャンバ
の内部の所定位置に、基板ホルダに支持される基板，成
膜される膜の原料を蒸発させるための蒸発源などが設け
られている。そして、真空ポンプ等の排気手段によって
真空チャンバ内の空間が所定の圧力を有する真空雰囲気
とされる。真空雰囲気とされた真空チャンバ内では、電
子銃などを用いて蒸発源に置かれた膜の原料を蒸発させ
ることにより、飛散した前記原料を基板上に析出させて
成膜が行われる。2. Description of the Related Art In a general vacuum film forming apparatus, a substrate supported by a substrate holder, an evaporation source for evaporating a raw material of a film to be formed, and the like are provided at predetermined positions inside a vacuum chamber. . Then, the space inside the vacuum chamber is made into a vacuum atmosphere having a predetermined pressure by an exhaust means such as a vacuum pump. In a vacuum chamber having a vacuum atmosphere, the raw material of the film placed on the evaporation source is evaporated by using an electron gun or the like to deposit the scattered raw material on the substrate to form a film.
【０００３】また、成膜された膜の性質に影響を及ぼす
１つのパラメータとして、基板の温度がある。従って、
基板の近傍にヒータ発熱部（ヒータ）を配設し、成膜を
行う際に真空チャンバの外部から前記電熱線へ電力供給
ケーブルを介して電力を供給することにより、基板若し
くは基板周辺を加熱する場合がある。Further, the temperature of the substrate is one parameter that affects the properties of the formed film. Therefore,
A heater heating unit (heater) is arranged near the substrate, and when the film is formed, power is supplied from the outside of the vacuum chamber to the heating wire through a power supply cable to heat the substrate or the periphery of the substrate. There are cases.
【０００４】基板上に成膜された膜は、用途に応じて所
望される膜厚が異なる。従って、成膜を行っている間
に、基板上に成膜された膜の膜厚を監視すべく測定する
必要がある。近年では、その測定精度の高さから、光モ
ニタ（膜厚センサ）が膜厚の測定に用いられつつある。The film formed on the substrate has different desired film thickness depending on the application. Therefore, it is necessary to measure the film thickness of the film formed on the substrate while monitoring the film formation. In recent years, an optical monitor (film thickness sensor) is being used for film thickness measurement because of its high measurement accuracy.
【０００５】前記光モニタは、光モニタ投光部及び光モ
ニタ受光部を備えている。該光モニタ投光部は、基板上
の膜の原料が析出される個所へ光を照射する。照射され
た光は、基板を通過し、又は基板にて反射し、通過した
光又は反射した光を前記光モニタ受光部が検出する。こ
のようにして、光モニタ投光部から照射した光と、光モ
ニタ受光部にて検出した光との位相差等に基づき、基板
上に成膜されている膜の膜厚を測定することができる。The optical monitor includes an optical monitor light projecting section and an optical monitor light receiving section. The light monitor light projecting unit irradiates light on a portion of the substrate where the raw material of the film is deposited. The radiated light passes through the substrate or is reflected by the substrate, and the light monitor light receiving unit detects the passed light or the reflected light. In this way, the film thickness of the film formed on the substrate can be measured based on the phase difference between the light emitted from the light monitor light projecting unit and the light detected by the light monitor light receiving unit. it can.
【０００６】[0006]
【発明が解決しようとする課題】ところで、近年、膜厚
センサとして用いられている光モニタは、光モニタ受光
部にて光信号を電気信号に変換せず、受光した光をその
まま外部へ伝送している。この場合、光モニタから真空
チャンバの外部へ光を伝送するケーブルとして光ファイ
バ（信号伝送ケーブル）が用いられている。By the way, an optical monitor used as a film thickness sensor in recent years transmits the received light as it is to the outside without converting the optical signal into an electric signal in the optical monitor light receiving portion. ing. In this case, an optical fiber (signal transmission cable) is used as a cable for transmitting light from the optical monitor to the outside of the vacuum chamber.
【０００７】しかしながら、光ファイバは耐熱性が比較
的乏しく、前記ヒータ発熱部が放熱する熱により光ファ
イバが劣化する恐れがある。また、光ファイバ及び電力
供給ケーブルは、共に真空チャンバに設けられたポート
と呼ばれる開口部を通して真空チャンバ内に設けられ
る。従って、光ファイバ及び電力供給ケーブルは互いに
近接して配設されている。そして該電力供給ケーブル
は、外面を金属材料性の防護カバーにより被われた非発
熱体であるシースにより被覆され、その先端は接続部材
を介してヒータ発熱部に接続されている。しかし、ヒー
タ発熱部にて放たれた熱は前記電力供給ケーブルを被覆
する金属材料性のカバーに伝わるため、ヒータ発熱部か
ら直接放たれる熱の他、前記防護カバーからも熱が放た
れることとなり、光ファイバは比較的高熱に晒されてし
まう。However, the heat resistance of the optical fiber is relatively poor, and the heat radiated by the heater heating portion may deteriorate the optical fiber. The optical fiber and the power supply cable are both provided in the vacuum chamber through an opening called a port provided in the vacuum chamber. Therefore, the optical fiber and the power supply cable are arranged close to each other. The outer surface of the power supply cable is covered with a sheath which is a non-heat generating body covered with a protective cover made of a metallic material, and its tip is connected to the heater heat generating portion via a connecting member. However, since the heat radiated by the heater heating portion is transferred to the metallic cover covering the power supply cable, heat is radiated not only from the heater heating portion but also from the protective cover. As a result, the optical fiber is exposed to relatively high heat.
【０００８】そこで本発明は、光モニタに接続される光
ファイバを、ヒータが放つ熱と、金属材料性の防護カバ
ーに伝熱されて放たれる熱とから保護することができる
構造を有する真空成膜装置を提供することを目的とす
る。Therefore, the present invention provides a vacuum having a structure capable of protecting the optical fiber connected to the optical monitor from the heat radiated by the heater and the heat radiated by the heat transfer to the protective cover made of a metallic material. An object is to provide a film forming apparatus.
【０００９】[0009]
【課題を解決するための手段】本発明は上記のような事
情に鑑みてなされたものであり、基板に成膜される膜の
膜厚を検出するための膜厚センサと、前記基板を加熱す
るためのヒータとを収容し、内部の空間の真空雰囲気を
保持するための成膜用の真空チャンバを備え、前記膜厚
センサにて検出される膜厚を示す信号を前記真空チャン
バの外部へ伝送すべく一端が前記膜厚センサに接続され
た信号伝送ケーブルと、前記真空チャンバの外部から前
記ヒータへ電力を供給すべく一端が前記ヒータに接続さ
れた電力供給ケーブルとが、前記真空チャンバに設けら
れた開口部を通じて前記真空チャンバの内外に渡って設
けられている真空成膜装置において、内部に冷却用媒体
を流通させる冷却管と、該冷却管が内側を挿通すべく略
管状に設けられた冷却部材とを備え、前記電力供給ケー
ブルは、前記冷却部材の内側を挿通して配設され、前記
信号伝送ケーブルは、前記冷却部材の外側に配設されて
いる。The present invention has been made in view of the above circumstances, and a film thickness sensor for detecting the film thickness of a film formed on a substrate, and a heating device for heating the substrate. A vacuum chamber for film formation for holding a vacuum atmosphere in an internal space, and a signal indicating the film thickness detected by the film thickness sensor to the outside of the vacuum chamber. A signal transmission cable whose one end is connected to the film thickness sensor for transmission, and a power supply cable whose one end is connected to the heater for supplying electric power to the heater from the outside of the vacuum chamber are connected to the vacuum chamber. In a vacuum film forming apparatus provided inside and outside the vacuum chamber through an opening provided therein, a cooling pipe through which a cooling medium is circulated, and the cooling pipe are provided in a substantially tubular shape so as to pass through the inside. Was A 却部 material, the power supply cable is arranged as it is inserted into the inside of the cooling member, the signal transmission cable is disposed outside the cooling member.
【００１０】このような構成とすることにより、電力供
給ケーブルは、冷却管の内部を流通する冷却水等により
冷却され、また、略管状をなして前記電力供給ケーブル
が内側を挿通すると共に前記冷却水等により冷やされる
冷却部材によっても冷却されるため、前記電力供給ケー
ブルを被覆する金属材料性の防護カバーに伝熱して放た
れる熱のうち、前記冷却部材の外側へ漏洩する熱を大幅
に抑制することができる。そして、前記冷却部材の外側
に信号伝送ケーブル（光ファイバ）を配設するため、該
信号伝送ケーブルが熱により劣化することを防止するこ
とができる。With this structure, the power supply cable is cooled by the cooling water flowing through the inside of the cooling pipe, and the power supply cable is formed in a substantially tubular shape so that the power supply cable is inserted inside and the cooling is performed. Since it is also cooled by a cooling member that is cooled by water or the like, of the heat that is transferred to and released from the metallic material protective cover that covers the power supply cable, the heat that leaks to the outside of the cooling member is greatly reduced. Can be suppressed. Since the signal transmission cable (optical fiber) is arranged outside the cooling member, it is possible to prevent the signal transmission cable from being deteriorated by heat.
【００１１】また、本発明は、前記冷却部材と信号伝送
ケーブルとの間に遮熱部材が介装されている。Further, according to the present invention, a heat shield member is interposed between the cooling member and the signal transmission cable.
【００１２】このような構成とすることにより、仮に冷
却部材の外側へ電力供給ケーブルを被覆する防護カバー
から放たれた熱が漏洩した場合であっても、前記遮熱部
材により遮られ、信号伝送ケーブルが加熱されることが
ない。With this structure, even if the heat radiated from the protective cover for covering the power supply cable leaks to the outside of the cooling member, the heat is shielded by the heat shielding member and the signal transmission is performed. The cable will not heat up.
【００１３】また、本発明は、前記遮熱部材が、金属材
料製の板状部材であり、表面が鏡面仕上げされている。Further, according to the present invention, the heat shield member is a plate member made of a metal material, and the surface thereof is mirror-finished.
【００１４】このような構成とすることにより、遮熱部
材の遮熱性をより高めることができ、信号伝送ケーブル
へ放たれる熱をより効果的に遮ることができる。With such a structure, the heat-shielding property of the heat-shielding member can be further enhanced, and the heat radiated to the signal transmission cable can be shielded more effectively.
【００１５】また、本発明に係る真空成膜装置は、基板
に成膜される膜の膜厚を検出するための膜厚センサと、
前記基板を加熱するためのヒータとを収容し、内部の空
間の真空雰囲気を保持するための成膜用の真空チャンバ
を備え、前記膜厚センサにて検出される膜厚を示す信号
を前記真空チャンバの外部へ伝送すべく一端が前記膜厚
センサに接続された信号伝送ケーブルと、前記真空チャ
ンバの外部から前記ヒータへ電力を供給すべく一端が前
記ヒータに接続された電力供給ケーブルとが、前記真空
チャンバに設けられた開口部を通じて前記真空チャンバ
の内外に渡って設けられている真空成膜装置において、
前記膜厚センサは、前記ヒータの近傍における所定の位
置決め範囲内にて予め位置決め可能に設けられており、
前記ヒータと信号伝送ケーブルとの間を遮蔽すべく前記
位置決め範囲を囲んで設けられる第１遮蔽部材と、該第
１遮蔽部材及び前記膜厚センサの間の空隙を塞ぐ第２遮
蔽部材とを備え、前記ヒータから前記信号伝送ケーブル
への放熱を遮蔽すべくなしてある。Further, the vacuum film forming apparatus according to the present invention comprises a film thickness sensor for detecting the film thickness of a film formed on a substrate,
A vacuum chamber for film formation for accommodating a heater for heating the substrate and for maintaining a vacuum atmosphere in an internal space is provided, and a signal indicating a film thickness detected by the film thickness sensor is applied to the vacuum. A signal transmission cable having one end connected to the film thickness sensor for transmission to the outside of the chamber, and a power supply cable having one end connected to the heater for supplying power to the heater from the outside of the vacuum chamber, In a vacuum film forming apparatus provided inside and outside the vacuum chamber through an opening provided in the vacuum chamber,
The film thickness sensor is provided so that it can be positioned in advance within a predetermined positioning range near the heater,
A first shielding member provided to surround the positioning range so as to shield between the heater and the signal transmission cable; and a second shielding member for closing a gap between the first shielding member and the film thickness sensor. The heat radiation from the heater to the signal transmission cable is shielded.
【００１６】このような構成とすることにより、ヒータ
から直接的に放たれる熱によって信号伝送ケーブルが加
熱されるのを防止することができる。更に、膜厚センサ
が所定の位置決め範囲内にて設置された位置に応じて、
前記膜厚センサと第１遮蔽部材との間にできる空隙を第
２遮蔽部材により塞ぐため、ヒータから放たれる熱から
信号伝送ケーブルをより効果的に保護することができ
る。With this structure, it is possible to prevent the signal transmission cable from being heated by the heat directly emitted from the heater. Furthermore, depending on the position where the film thickness sensor is installed within the predetermined positioning range,
Since the second shielding member closes the gap formed between the film thickness sensor and the first shielding member, the signal transmission cable can be more effectively protected from the heat emitted from the heater.
【００１７】[0017]
【発明の実施の形態】以下に、本発明の実施の形態につ
いて、図面を参照して説明する。図１は、本発明の実施
の形態に係る真空成膜装置１００の構成を示す一部断面
正面図である。図１に示す真空成膜装置１００は、成膜
の方式として所謂真空蒸着によって真空チャンバ１内に
配置される基板４に成膜することができるように構成さ
れているものである。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a partial sectional front view showing the configuration of a vacuum film forming apparatus 100 according to an embodiment of the present invention. The vacuum film forming apparatus 100 shown in FIG. 1 is configured to be capable of forming a film on a substrate 4 arranged in the vacuum chamber 1 by so-called vacuum deposition as a film forming method.
【００１８】前記真空成膜装置１００は、内部に密閉可
能な空間を有する真空チャンバ１を備えており、該真空
チャンバ１の内底部には、成膜する膜の原料物質を真空
チャンバ１内の空間に蒸発させるための２つの蒸発源１
４，１４が備えられている。また、真空チャンバ１の内
底部には、真空チャンバ１内を覗くことができるポート
と称される開口部Ｐ2が設けられ、成膜された膜の膜厚
を測定するための膜厚モニタの一部を構成する光モニタ
投光部１２が、その投光ヘッド１２ａを真空チャンバ１
の内部（図１における上方）へ向けた状態で設けられて
いる。更に、真空チャンバ１の内底部には、蒸発源１４
が有するルツボ上に置かれた膜の原料を加熱して蒸発さ
せるための電子銃（図示せず）等が設けられている。The vacuum film forming apparatus 100 is provided with a vacuum chamber 1 having a space which can be hermetically sealed therein. At the inner bottom portion of the vacuum chamber 1, a raw material for a film to be formed is stored in the vacuum chamber 1. Two evaporation sources for evaporating into space 1
4, 14 are provided. Further, an opening P 2 called a port through which the inside of the vacuum chamber 1 can be seen is provided at the inner bottom of the vacuum chamber 1, and a film thickness monitor for measuring the film thickness of the film formed is provided. The optical monitor light-projecting unit 12 which constitutes a part of the light-projecting head 12a is connected to the vacuum chamber
Is provided so as to face the inside (upward in FIG. 1). Further, at the inner bottom of the vacuum chamber 1, the evaporation source 14
Is provided with an electron gun (not shown) for heating and evaporating the raw material of the film placed on the crucible of the.
【００１９】また、前記真空チャンバ１の天井部分に
は、前記膜厚モニタの他の一部を構成する光モニタ受光
部１１及び基板４をその下端にて保持する基板回転装置
３が備えられている。なお、前記光モニタ受光部１１が
有する受光ヘッド１１ａは、真空チャンバ１の内部（図
１における下方）へ向けられており、前記投光ヘッド１
２ａ及び受光ヘッド１１ａは光軸を一致させて互いに向
かい合う構成となっている。また、基板回転装置３は、
前記真空チャンバ１の天井部分に設けられた開口部Ｐ1
を通じ、真空チャンバ１の内外に渡って設けられている
ため、前記基板回転装置３の下端に保持される基板４
は、真空チャンバ１の内部に位置することとなる。Further, the ceiling portion of the vacuum chamber 1 is provided with an optical monitor light receiving portion 11 which constitutes another part of the film thickness monitor and a substrate rotating device 3 which holds a substrate 4 at its lower end. There is. The light receiving head 11a included in the light monitor light receiving unit 11 is directed to the inside of the vacuum chamber 1 (downward in FIG. 1), and
2a and the light receiving head 11a are configured to face each other with their optical axes aligned. Further, the substrate rotating device 3 is
An opening P 1 provided in the ceiling of the vacuum chamber 1
Substrate 4 which is held at the lower end of the substrate rotating device 3 since it is provided inside and outside the vacuum chamber 1 through
Will be located inside the vacuum chamber 1.
【００２０】このような真空チャンバ１を用いて基板４
に成膜する場合、特に図示されない真空ポンプによって
内部の空間を排気し、所要の真空雰囲気とする。そし
て、電子銃により蒸発源１４のルツボに置かれた膜の原
料へ電子を照射し、蒸発された前記原料を基板４の表面
（図１における下面）に析出させて成膜を行う。また、
光モニタ投光部１２から照射された光は基板４を通過し
て光モニタ受光部１１にて検出され、該光モニタ受光部
１１にて検出された光信号は外部へ伝送される。伝送さ
れた光信号の位相の変化等に基づき、基板４の表面に析
出された膜の膜厚を算出することができる。The substrate 4 is manufactured by using the vacuum chamber 1 as described above.
In the case of forming a film, the internal space is evacuated by a vacuum pump (not shown) to create a required vacuum atmosphere. Then, an electron gun is used to irradiate the raw material of the film placed in the crucible of the evaporation source 14 with electrons, and the evaporated raw material is deposited on the surface (lower surface in FIG. 1) of the substrate 4 to form a film. Also,
The light emitted from the light monitor light projecting unit 12 passes through the substrate 4 and is detected by the light monitor light receiving unit 11, and the optical signal detected by the light monitor light receiving unit 11 is transmitted to the outside. The thickness of the film deposited on the surface of the substrate 4 can be calculated based on the change in the phase of the transmitted optical signal and the like.
【００２１】また、真空チャンバ１は設置用架台２０に
設置され、実験室等の強固な床面に載置されている。該
設置用架台２０は、前記真空チャンバ１を載置するため
の上板をなす架台２３と、該架台２３の下側にて光モニ
タ投光部１２を設置するための下板をなす光モニタ用架
台２４とを備えている。Further, the vacuum chamber 1 is installed on an installation stand 20 and is placed on a strong floor surface such as a laboratory. The installation base 20 is an upper plate 23 on which the vacuum chamber 1 is placed, and an optical monitor which is a lower plate on which the optical monitor projector 12 is installed below the base 23. And a stand 24.
【００２２】次に、本実施の形態に係る真空成膜装置１
を特徴付ける構成部分について説明する。図２及び図３
は、真空成膜装置１００を特徴付ける構成部分を説明す
るための図面であり、図２は、図１に示した真空成膜装
置１００の上部正面を拡大して示した部分拡大正面図、
図３は、図１に示した真空成膜装置１００の上部側面を
拡大して示した部分拡大側面図である。Next, the vacuum film forming apparatus 1 according to the present embodiment.
A description will be given of the constituent parts that characterize. 2 and 3
FIG. 2 is a drawing for explaining constituent parts that characterize the vacuum film forming apparatus 100, and FIG. 2 is a partially enlarged front view showing an enlarged upper front surface of the vacuum film forming apparatus 100 shown in FIG.
FIG. 3 is a partially enlarged side view showing an enlarged upper side surface of the vacuum film forming apparatus 100 shown in FIG.
【００２３】図２及び図３に示すように、基板回転装置
３は、主として基板支持体３０と、該基板支持体３０の
内側に設けられたセンサ等支持体４０と、前記基板支持
体３０及びセンサ等支持体４０を囲むケーシング５０と
によって構成されている。As shown in FIGS. 2 and 3, the substrate rotating device 3 mainly includes a substrate support 30, a support 40 such as a sensor provided inside the substrate support 30, the substrate support 30, and the like. It is configured by a casing 50 that surrounds the support body 40 such as a sensor.
【００２４】このうち基板支持体３０は、真空チャンバ
１の開口部Ｐ1の中心を貫く仮想軸Ｃの回りに回転対称
の形状であり、上部に比して下部の径が大きい段付き円
筒形状をなしている。該基板支持体３０は、大径をなす
下部が基板取付部３１をなしており、該基板取付部３１
の下端（即ち、基板支持体３０の下端）にて内側に突設
された爪状の基板ホルダ３２により基板４を保持してい
る。Of these, the substrate support 30 has a shape that is rotationally symmetric about an imaginary axis C that passes through the center of the opening P 1 of the vacuum chamber 1, and has a stepped cylindrical shape in which the diameter of the lower portion is larger than that of the upper portion. Is doing. The lower portion of the substrate support 30 having a large diameter forms a substrate mounting portion 31, and the substrate mounting portion 31
The substrate 4 is held by a claw-shaped substrate holder 32 that is provided inward at the lower end (that is, the lower end of the substrate support 30).
【００２５】また、開口部Ｐ1の周縁部には、前記ケー
シング５０の一部をなして略筒形状をなす第１ケーシン
グ５１が、その中心軸を前記仮想軸Ｃに一致させて立設
されている。前記基板支持体３０は、前記第１ケーシン
グ５１の内部を挿通して設けられており、更に、基板支
持体３０は複数の磁気シール５４，５５を間に挟んで第
１ケーシング５１により支持されている。該磁気シール
５４，５５は、前記基板支持体３０及び第１ケーシング
５１間を封止しているため、真空チャンバ１内部の気圧
を維持することができる。A first casing 51, which is a part of the casing 50 and has a substantially cylindrical shape, is erected on the peripheral edge of the opening P 1 with its central axis aligned with the virtual axis C. ing. The substrate support 30 is provided so as to pass through the inside of the first casing 51, and the substrate support 30 is supported by the first casing 51 with a plurality of magnetic seals 54 and 55 interposed therebetween. There is. Since the magnetic seals 54 and 55 seal between the substrate support 30 and the first casing 51, the air pressure inside the vacuum chamber 1 can be maintained.
【００２６】また、第１ケーシング５１は、内部にダイ
レクトドライブモータ５３を有し、該ダイレクトドライ
ブモータ５３の駆動部は基板支持体３０の外側面に摺接
すべくなしてある。従って、該ダイレクトドライブモー
タ５３を駆動することにより、基板支持体３０を仮想軸
Ｃの回りに回転駆動させることができる。Further, the first casing 51 has a direct drive motor 53 inside, and the drive portion of the direct drive motor 53 is adapted to be in sliding contact with the outer surface of the substrate support 30. Therefore, by driving the direct drive motor 53, the substrate support 30 can be rotationally driven around the virtual axis C.
【００２７】前記基板支持体３０の内部には、該基板支
持体３０と同様に、仮想軸Ｃの回りに回転対称の形状で
あり上部に比して下部の径が大きい段付き円筒形状をな
す前記センサ等支持体４０が設けられている。該センサ
等支持体４０の上端部は、径方向の外側へ延設され、仮
想軸Ｃを中心として該中心に開口を有する円板形状とな
っており、その下面は、前記第１ケーシング５１の上端
面と接合されている。また、センサ等支持体４０の上端
部には、有底筒状の第２ケーシング５２がその開口端を
下向きにして被せられている。Like the substrate support 30, the substrate support 30 has a stepped cylindrical shape that is rotationally symmetrical about the virtual axis C and has a larger diameter at the lower portion than at the upper portion. A support 40 such as the sensor is provided. The upper end portion of the support body 40 for sensors and the like has a disk shape extending outward in the radial direction and having an opening at the center around the virtual axis C, and the lower surface of the support body 40 of the first casing 51. It is joined to the top surface. A second casing 52 having a cylindrical shape with a bottom is placed on the upper end of the support member 40 such as a sensor with its open end facing downward.
【００２８】他方、センサ等支持体４０の下開口部（即
ち、センサ等取付部４１の下開口部）には、一部に切り
欠き部を有する円板形状をなす銅製の第１冷却部材（第
１遮蔽部材）４２が、前記下開口部を塞ぐようにして設
けられている。図４は、センサ等支持体４０の下開口部
近傍の構成を示すべく、図２において上方から前記下開
口部近傍を見た場合のIV-IV矢視図であり、図５は、下
方から前記開口部近傍を見た場合のV-V矢視図である。
図４及び図５に示すように、前記第１冷却部材４２は略
円板形状をなし、その周上の一部分から中心部分にかけ
て切り欠かれた切り欠き部４４を有している。また、該
第１冷却部材４２は、後述するように、内部に冷却水が
循環するための空間が設けられており、冷却水を該空間
へ出入させるべく冷却水管を接続するための冷却水管取
り付け孔４２ａ，４２ｂが設けられている。On the other hand, in the lower opening of the support 40 for sensors and the like (that is, the lower opening of the mounting portion 41 for sensors and the like), a first cooling member made of copper and having a disk shape having a notch in a part ( A first shielding member) 42 is provided so as to close the lower opening. 4 is a IV-IV arrow view when the vicinity of the lower opening is viewed from above in FIG. 2 to show the configuration of the vicinity of the lower opening of the support 40 such as a sensor, and FIG. FIG. 6 is a view as seen from the direction of arrow VV when the vicinity of the opening is viewed.
As shown in FIGS. 4 and 5, the first cooling member 42 has a substantially disc shape, and has a notch portion 44 that is notched from a portion on the circumference to a central portion. The first cooling member 42 has a space for circulating cooling water therein, as will be described later, and a cooling water pipe attachment for connecting a cooling water pipe to let the cooling water flow in and out of the space. Holes 42a and 42b are provided.
【００２９】該切り欠け部４４には、受光ヘッド１１ａ
が真空チャンバ１の中心部（図２及び図３における下
方）を望むようにして、光モニタ受光部１１が取り付け
られている。従って、該光モニタ受光部１１は、真空チ
ャンバ１の内底部に設けられた光モニタ投光部１２と向
かい合うようになしてある。光モニタ受光部１１は、前
記切り欠け部４４として形成される範囲内で、予め任意
に位置を決めて取り付けることができる。The light receiving head 11a is formed in the cutout portion 44.
The optical monitor light receiving portion 11 is attached so that the central portion of the vacuum chamber 1 (downward in FIGS. 2 and 3) is desired. Therefore, the optical monitor light receiving unit 11 faces the optical monitor light projecting unit 12 provided on the inner bottom of the vacuum chamber 1. The optical monitor light receiving portion 11 can be arbitrarily positioned and attached in advance within the range formed as the cutout portion 44.
【００３０】また、光モニタ受光部１１が位置決めされ
た後に、前記第１冷却部材４２及び光モニタ受光部１１
の間に形成される空隙箇所には、長方板状をなす銅製の
第１遮蔽板（第２遮蔽部材）４３が取り付けられてい
る。このように、前記第１冷却部材４２及び第１遮蔽板
４３を設けることにより、センサ等取付部４１の下端部
は、上側と下側とに区分けされている。Further, after the optical monitor light receiving unit 11 is positioned, the first cooling member 42 and the optical monitor light receiving unit 11 are placed.
A first shielding plate (second shielding member) 43 made of copper and having a rectangular plate shape is attached to a void portion formed between the two. As described above, by providing the first cooling member 42 and the first shielding plate 43, the lower end of the sensor mounting portion 41 is divided into an upper side and a lower side.
【００３１】また、前記第１遮蔽板４３の下側には、基
板４を加熱するためのヒータ線Ｈが配設されている。該
ヒータ線Ｈは、真空成膜装置１の外部から電力が供給さ
れることにより、基板４の周辺温度を数百度（例えば、
７００度）まで加熱することができる。A heater wire H for heating the substrate 4 is arranged below the first shield plate 43. The heater wire H is supplied with electric power from the outside of the vacuum film-forming apparatus 1, so that the peripheral temperature of the substrate 4 is several hundred degrees (for example,
It can be heated up to 700 degrees.
【００３２】ところで、図２及び図３に示すように、前
記第１冷却部材４２の上側におけるセンサ等支持体４０
の内部には、長寸の樋形状をなす銅製の第２冷却部材６
１、長寸板状の銅製の第３冷却部材６２、及び、該第３
冷却部材６２と同様に長寸板状をなすステンレススチー
ル（サス）製の第２遮蔽板６３が立設されている。By the way, as shown in FIG. 2 and FIG. 3, the support member 40 for sensors and the like on the upper side of the first cooling member 42.
Inside the chamber, there is a second cooling member 6 made of copper and having a long gutter shape.
1, a long plate-shaped copper third cooling member 62, and the third
Like the cooling member 62, a second shielding plate 63 made of stainless steel (suspension) and having a long plate shape is provided upright.
【００３３】図６は、センサ等支持体４０の内部の構成
を示すべく、図２においてセンサ等支持体４０の上端部
側から下方を見た場合のVI-VI矢視図である。図６に示
すように、前記第２冷却部材６１は、その長手方向に交
差する断面がチャネル形状をなし、該断面における開口
部を塞ぐように前記第３冷却部材６２は設けられてい
る。また、前記第２遮蔽板６３は、第３冷却部材６２に
対して第２冷却部材６１と反対側にて、前記第３冷却部
材６２と並列に設けられている。従って、センサ等支持
体４０の内部は、第２冷却部材６１及び第３冷却部材６
２によりその内部に形成される空間（以下、第１空間、
という）Ｓ1と、第２遮蔽板６３に対して前記第３冷却
部材６２と反対側に形成される空間（以下、第２空間、
という）Ｓ 2とに区分けされている。なお、前記第２遮
蔽板６３は、少なくとも第３冷却部材６２に対する面が
鏡面仕上げされている。FIG. 6 shows the internal structure of the support 40 such as a sensor.
2 shows the upper end portion of the support member 40 such as a sensor.
FIG. 6 is a VI-VI arrow view when looking downward from the side. Shown in Figure 6
As described above, the second cooling member 61 intersects in the longitudinal direction.
The cross-sections that intersect form a channel shape, and the openings in the cross-sections
The third cooling member 62 is provided so as to close the portion.
It In addition, the second shielding plate 63 is attached to the third cooling member 62.
On the other hand, on the side opposite to the second cooling member 61, the third cooling unit
It is provided in parallel with the material 62. Therefore, support for sensors etc.
Inside the body 40, the second cooling member 61 and the third cooling member 6
The space formed by the inside of 2 (hereinafter, the first space,
Say) S1And the third cooling for the second shielding plate 63
A space formed on the side opposite to the member 62 (hereinafter referred to as a second space,
Say) S 2It is divided into and. The second shield
At least the surface of the shielding plate 63 with respect to the third cooling member 62 is
It is mirror-finished.
【００３４】また、センサ等支持体４０の内部には、周
辺の温度上昇を抑制すべく冷却水管が配設されている。
次に、基板回転装置３の内部に配設される冷却水管の配
管形態について、図７を用いて説明する。基板回転装置
３の外部から、第２ケーシング５２を貫通して設けられ
た第１冷却水管Ｌ1は、第２空間Ｓ2を通じてセンサ等支
持体４０内部の下方へ延設され、第１冷却部材４２が内
部に有する空間に通じる冷却水管取り付け孔４２ａに接
続される。A cooling water pipe is arranged inside the support member 40 such as a sensor in order to suppress a temperature rise in the surrounding area.
Next, the piping form of the cooling water pipe arranged inside the substrate rotating device 3 will be described with reference to FIG. 7. The first cooling water pipe L 1 provided from the outside of the substrate rotating device 3 so as to penetrate the second casing 52 extends below the inside of the support body 40 such as the sensor through the second space S 2 , and the first cooling member. 42 is connected to a cooling water pipe mounting hole 42a leading to a space inside.
【００３５】第１冷却部材４２が有する前記冷却水管取
り付け孔４２ａとは別の冷却水管取り付け孔４２ｂには
第２冷却水管Ｌ2が接続され、該第２冷却水管Ｌ2は、仮
想軸Ｃの近傍まで延設されている。更に、該第２冷却水
管Ｌ2から続く第３冷却水管Ｌ3は、第１空間Ｓ1を通じ
てセンサ等支持体４０内部の上方へ延設されている。セ
ンサ等支持体４０の上端に達した第３冷却水管Ｌ3は、
該上端にて折り返されて第４冷却水管Ｌ4に続く。第４
冷却水管Ｌ4は、センサ等支持体４０の上端から第１空
間Ｓ1を通じて下方へ延設され、前記センサ等支持体４
０の下端近傍まで達し、第５冷却水管Ｌ5へと続く。A second cooling water pipe L 2 is connected to a cooling water pipe mounting hole 42b different from the cooling water pipe mounting hole 42a of the first cooling member 42, and the second cooling water pipe L 2 has a virtual axis C. It is extended to the vicinity. Furthermore, the third cooling water pipe L 3 continuing from the second cooling water pipe L 2 is extended above the inside of the support body 40 such as the sensor through the first space S 1 . The third cooling water pipe L 3 reaching the upper end of the support body 40 such as a sensor is
It is folded back at the upper end and continues to the fourth cooling water pipe L 4 . Fourth
The cooling water pipe L 4 extends downward from the upper end of the support member 40 for sensors and the like through the first space S 1 , and
It reaches near the lower end of 0 and continues to the fifth cooling water pipe L 5 .
【００３６】第５冷却水管Ｌ5は、センサ等支持体４０
の下端部にて光モニタ受光部１１まで延設され、該光モ
ニタ受光部１１の内部に配管された第６冷却水管Ｌ6へ
と続く。該第６冷却水管Ｌ6は、受光ヘッド１１ａの周
囲を囲むように配設され、更に第７冷却水管Ｌ7へ続い
ている。該第７冷却水管Ｌ7はセンサ等支持体４０内部
の第２空間Ｓ2を通じ、該センサ等支持体４０の上方へ
延設され、第２ケーシング５２を外部へ貫通している。The fifth cooling water pipe L 5 is provided with a support member 40 such as a sensor.
At the lower end of the optical monitor light receiving unit 11 and continues to the sixth cooling water pipe L 6 which is piped inside the optical monitor light receiving unit 11. The sixth cooling water pipe L 6 is arranged so as to surround the periphery of the light receiving head 11a, and further continues to the seventh cooling water pipe L 7 . The seventh cooling water pipe L 7 extends above the sensor supporting body 40 through the second space S 2 inside the sensor supporting body 40 and penetrates the second casing 52 to the outside.
【００３７】ところで、光モニタ受光部１１にて検出さ
れた光信号を真空成膜装置１００の外部へ伝送するた
め、前記光モニタ受光部１１には光ファイバＬSの一端
が接続されている。該光ファイバＬSは、第２空間Ｓ2に
おいて前記第１冷却水管Ｌ1及び第７冷却水管Ｌ7に沿っ
て配設され、第２ケーシング５２を外部へ貫通してい
る。By the way, in order to transmit the optical signal detected by the optical monitor light receiving unit 11 to the outside of the vacuum film forming apparatus 100, one end of the optical fiber L S is connected to the optical monitor light receiving unit 11. The optical fiber L S is arranged along the first cooling water pipe L 1 and the seventh cooling water pipe L 7 in the second space S 2 , and penetrates the second casing 52 to the outside.
【００３８】また、ヒータ線Ｈへ電力を供給すべく、該
ヒータ線Ｈに一端が接続されている電送ケーブルＬ
P1は、第１空間Ｓ1において前記第３冷却水管Ｌ3及び第
４冷却水管Ｌ4に沿って配設され、第２ケーシング５２
を外部へ貫通している。更に、基板４の周辺温度を測定
するための熱電対ＬDが前記第１空間Ｓ1を通じて配設さ
れ、温接点が基板４の近傍に設けられている。なお、前
記電送ケーブルＬP1は、第２ケーシング５２を貫通して
取り付けられる接続部材ＬP2によって前記第２ケーシン
グ５２に接続されている。また、電送ケーブルＬP1にお
ける前記接続部材Ｌ P2より前記一端側は、表面を金属材
料製の防護カバーによって被われたシースＬ P3により被
覆されている。そして、電送ケーブルＬP1と前記ヒータ
線Ｈとは、ヒータ線接続部材ＬP4を介して接続されてい
る。In order to supply electric power to the heater wire H,
Transmission cable L, one end of which is connected to the heater wire H
P1Is the first space S1In the third cooling water pipe L3And the
4 cooling water pipe LFourIs disposed along the second casing 52.
Through the outside. Furthermore, measure the ambient temperature of the substrate 4.
Thermocouple L forDIs the first space S1Arranged through
The hot junction is provided near the substrate 4. In addition, before
Power transmission cable LP1Penetrates the second casing 52
Connection member L to be attachedP2By the second casein
Connected to the switch 52. Also, the transmission cable LP1To
The connecting member L P2From the one end side, the surface is a metal material
Sheath L covered by a protective cover made of material P3Due to
It is overturned. And the transmission cable LP1And the heater
The wire H is a heater wire connecting member LP4Connected through
It
【００３９】上述したような構成をなす真空成膜装置１
００による場合、ヒータ線Ｈと光ファイバＬSとの間に
は、第１冷却部材４２及び第１遮蔽板４３が設けられて
いる。従って、ヒータ線Ｈにて基板４の周辺が数百度に
加熱された場合であっても、光ファイバＬSへ伝わる熱
を低減させることができる。The vacuum film forming apparatus 1 having the above-mentioned structure
In the case of 00, the first cooling member 42 and the first shielding plate 43 are provided between the heater wire H and the optical fiber L S. Therefore, even when the periphery of the substrate 4 is heated to several hundred degrees by the heater wire H, the heat transmitted to the optical fiber L S can be reduced.
【００４０】また、切り欠き部４４により形成される範
囲内にて決定された光モニタ受光部１１の位置に応じて
第１遮蔽板４３を取りつけることにより、前記光モニタ
受光部１１の設定位置に関らず、上述したのと同様の効
果を得ることができる。Further, by mounting the first shield plate 43 in accordance with the position of the optical monitor light receiving unit 11 determined within the range formed by the notch 44, the setting position of the optical monitor light receiving unit 11 is set. Regardless, the same effect as described above can be obtained.
【００４１】また、第１冷却部材４２の内部空間に冷却
水を循環させることにより、上述した効果をより一層有
効なものとすることができる。By circulating the cooling water in the internal space of the first cooling member 42, the above-mentioned effects can be made more effective.
【００４２】また、上述した真空成膜装置１００による
場合、電送ケーブルＬP1は、第２冷却部材６１及び第３
冷却部材６２により形成される第１空間Ｓ1内にて、第
３冷却水管Ｌ3及び第４冷却水管Ｌ4と共に配設され、光
ケーブルＬSは、電送ケーブルＬP1との間に第３冷却部
材６２及び第２遮蔽板６３を挟む第２空間Ｓ2内にて、
第１冷却水管Ｌ1及び第７冷却水管Ｌ7と共に配設されて
いる。In the case of the above vacuum film forming apparatus 100, the transmission cable L P1 includes the second cooling member 61 and the third cooling member 61.
In the first space S 1 formed by the cooling member 62, the third cooling water pipe L 3 and the fourth cooling water pipe L 4 are arranged, and the optical cable L S and the transmission cable L P1 are cooled by the third cooling water. In the second space S 2 sandwiching the member 62 and the second shielding plate 63,
It is arranged together with the first cooling water pipe L 1 and the seventh cooling water pipe L 7 .
【００４３】従って、ヒータ線Ｈの温度上昇に伴い、該
ヒータ線Ｈの周辺の熱が電送ケーブルＬP1を被覆するシ
ースＬP3表面の金属材料製の防護カバーに伝えられる場
合であっても、光ケーブルＬSが加熱されることが殆ど
なくなり、温度上昇に起因する該光ケーブルＬSの劣化
を防止することができる。Therefore, even when the temperature of the heater wire H rises and the heat around the heater wire H is transferred to the protective cover made of metal material on the surface of the sheath L P3 that covers the transmission cable L P1 . The optical cable L S is hardly heated, and deterioration of the optical cable L S due to the temperature rise can be prevented.
【００４４】また、第２遮蔽板６３における少なくとも
第３冷却部材６２側の面を鏡面仕上げとしてあるため、
第１空間Ｓ1から熱が漏れた場合であっても、この熱を
有効に反射することができ、漏れ出した熱により光ファ
イバＬSが加熱されるのを防止することができる。Further, since at least the surface of the second shielding plate 63 on the third cooling member 62 side is mirror-finished,
Even if heat leaks from the first space S 1 , this heat can be effectively reflected, and it is possible to prevent the leaked heat from heating the optical fiber L S.
【００４５】なお、以上の説明では、真空成膜装置１０
０として真空蒸着により成膜する装置を例に説明してい
るが、成膜の方式としてイオンプレーティング等の他の
方式が採用される真空成膜装置であっても本発明を実施
することにより同様の効果を得ることができる。In the above description, the vacuum film forming apparatus 10 is used.
Although an apparatus for forming a film by vacuum vapor deposition has been described as 0 as an example, even if it is a vacuum film forming apparatus in which another method such as ion plating is adopted as a method of forming a film, the present invention can be used. The same effect can be obtained.
【００４６】また、第１冷却部材４２，第１遮蔽板４
３，第２冷却部材６１，第３冷却部材６２として銅製の
ものについて説明しているが、これに限られず、熱伝導
率が比較的高い他の材料を用いてこれらを構成してもよ
い。また、第２遮蔽板６３としてステンレススチールを
用いたものについて説明しているが、これに限られず、
熱伝導率が比較的低く、熱を遮蔽するのに適した他の材
料を用いて構成してもよい。Further, the first cooling member 42 and the first shielding plate 4
Although the third cooling member 61 and the third cooling member 62 made of copper have been described, the material is not limited to this, and other materials having a relatively high thermal conductivity may be used to configure them. Further, although the case where stainless steel is used as the second shielding plate 63 has been described, the present invention is not limited to this,
Other materials having a relatively low thermal conductivity and suitable for shielding heat may be used.
【００４７】[0047]
【発明の効果】本発明によれば、光モニタに接続される
光ファイバを、ヒータ及び電力供給ケーブルが放つ熱か
ら保護することができる構造を有する真空成膜装置を提
供することができる。According to the present invention, it is possible to provide a vacuum film forming apparatus having a structure capable of protecting the optical fiber connected to the optical monitor from the heat emitted by the heater and the power supply cable.
【図１】本発明の実施の形態に係る真空成膜装置の構成
を示す一部断面正面図である。FIG. 1 is a partial cross-sectional front view showing the configuration of a vacuum film forming apparatus according to an embodiment of the present invention.
【図２】図１に示した真空成膜装置の上部正面を拡大し
て示した部分拡大正面図である。FIG. 2 is a partially enlarged front view showing an enlarged upper front surface of the vacuum film forming apparatus shown in FIG.
【図３】図１に示した真空成膜装置の上部側面を拡大し
て示した部分拡大側面図である。3 is a partially enlarged side view showing an enlarged upper side surface of the vacuum film forming apparatus shown in FIG.
【図４】センサ等支持体の下開口部近傍の構成を示すべ
く、図２において上方から前記下開口部近傍を見た場合
のIV-IV矢視図である。FIG. 4 is a IV-IV arrow view when the vicinity of the lower opening is viewed from above in FIG. 2 to show the configuration near the lower opening of the support such as a sensor.
【図５】センサ等支持体の下開口部近傍の構成を示すべ
く、図２において下方から前記開口部近傍を見た場合の
V-V矢視図である。5 is a view of the vicinity of the lower opening of a support such as a sensor as viewed from below in FIG.
It is a VV arrow line view.
【図６】センサ等支持体の内部の構成を示すべく、図２
においてセンサ等支持体の上端部側から下方を見た場合
のVI-VI矢視図である。6 is a view showing an internal structure of a support such as a sensor shown in FIG.
FIG. 6 is a view taken in the direction of arrows VI-VI when viewed downward from the upper end side of the support such as a sensor in FIG.
【図７】基板回転装置の内部に配設される冷却水管の配
管形態を説明するための模式的説明図である。FIG. 7 is a schematic explanatory view for explaining a piping form of a cooling water pipe arranged inside the substrate rotating device.
１ 真空チャンバ ３ 基板回転装置 ４ 基板 １１ 光モニタ受光部 １１ａ 受光ヘッド １２ 光モニタ投光部 １２ａ 投光ヘッド １４ 蒸発源 ２０ 設置用架台 ２３ 架台 ２４ 光モニタ用架台 ３０ 基板支持体 ３１ 基板取付部 ３２ 基板ホルダ ４０ センサ等支持体 ４１ センサ等取付部 ４２ 第１冷却部材（第１遮蔽部材） ４２ａ，４２ｂ 冷却水管取り付け孔 ４３ 第１遮蔽板（第２遮蔽部材） ４４ 切り欠き部 ５０ ケーシング ５１ 第１ケーシング ５２ 第２ケーシング ５３ ダイレクトドライブモータ ５４，５５ 磁気シール ６１ 第２冷却部材 ６２ 第３冷却部材 ６３ 第２遮蔽板 １００ 真空成膜装置 Ｈ ヒータ線 Ｌ1 第１冷却水管 Ｌ2 第２冷却水管 Ｌ3 第３冷却水管 Ｌ4 第４冷却水管 Ｌ5 第５冷却水管 Ｌ6 第６冷却水管 Ｌ7 第７冷却水管 ＬD 熱電対 ＬP1 電送ケーブル ＬP2 接続部材 ＬP3 シース ＬP4 ヒータ線接続部材 ＬS 光ファイバ Ｐ1，Ｐ２ 開口部 Ｓ1 第１空間 Ｓ2 第２空間1 Vacuum Chamber 3 Substrate Rotating Device 4 Substrate 11 Optical Monitor Receiving Unit 11a Light Receiving Head 12 Optical Monitor Projecting Unit 12a Projecting Head 14 Evaporating Source 20 Installation Stand 23 Stand 24 Optical Monitor Stand 30 Substrate Support 31 Substrate Attachment 32 Substrate holder 40 Supports for sensors 41 Mounting parts for sensors 42 First cooling members (first shielding members) 42a, 42b Cooling water pipe mounting holes 43 First shielding plate (second shielding member) 44 Cutouts 50 Casing 51 First Casing 52 Second casing 53 Direct drive motors 54, 55 Magnetic seal 61 Second cooling member 62 Third cooling member 63 Second shielding plate 100 Vacuum film forming apparatus H Heater wire L 1 First cooling water pipe L 2 Second cooling water pipe L 3 3rd cooling water pipe L 4 4th cooling water pipe L 5 5th cooling water pipe L 6 6th cooling water pipe L 7 7th cooling water pipe L D Thermocouple L P1 Transmission cable L P2 connection member L P3 sheath L P4 heater wire connection member L S optical fibers P 1 and P2 opening S 1 first space S 2 second space
Claims (4)
めの膜厚センサと、前記基板を加熱するためのヒータと
を収容し、内部の空間の真空雰囲気を保持するための成
膜用の真空チャンバを備え、前記膜厚センサにて検出さ
れる膜厚を示す信号を前記真空チャンバの外部へ伝送す
べく一端が前記膜厚センサに接続された信号伝送ケーブ
ルと、前記真空チャンバの外部から前記ヒータへ電力を
供給すべく一端が前記ヒータに接続された電力供給ケー
ブルとが、前記真空チャンバに設けられた開口部を通じ
て前記真空チャンバの内外に渡って設けられている真空
成膜装置において、 内部に冷却用媒体を流通させる冷却管と、該冷却管が内
側を挿通すべく略管状に設けられた冷却部材とを備え、 前記電力供給ケーブルは、前記冷却部材の内側を挿通し
て配設され、前記信号伝送ケーブルは、前記冷却部材の
外側に配設されていることを特徴とする真空成膜装置。1. A film thickness sensor for detecting a film thickness of a film formed on a substrate and a heater for heating the substrate are housed, and a component for maintaining a vacuum atmosphere in an internal space. A vacuum chamber for the film, a signal transmission cable having one end connected to the film thickness sensor for transmitting a signal indicating the film thickness detected by the film thickness sensor to the outside of the vacuum chamber, and the vacuum chamber And a power supply cable whose one end is connected to the heater to supply power to the heater from the outside of the vacuum chamber, provided inside and outside the vacuum chamber through an opening provided in the vacuum chamber. The device includes a cooling pipe for circulating a cooling medium therein, and a cooling member provided in a substantially tubular shape so that the cooling pipe is inserted through the inside, and the power supply cable is inserted through the inside of the cooling member. Disposed Te, the signal transmission cable, a vacuum deposition apparatus, characterized in that disposed on the outside of the cooling member.
に遮熱部材が介装されていることを特徴とする請求項１
に記載の真空成膜装置。2. A heat shield member is interposed between the cooling member and the signal transmission cable.
The vacuum film forming apparatus according to.
であり、表面が鏡面仕上げされていることを特徴とする
請求項２に記載の真空成膜装置。3. The vacuum film forming apparatus according to claim 2, wherein the heat shield member is a plate-shaped member made of a metal material and has a mirror-finished surface.
めの膜厚センサと、前記基板を加熱するためのヒータと
を収容し、内部の空間の真空雰囲気を保持するための成
膜用の真空チャンバを備え、前記膜厚センサにて検出さ
れる膜厚を示す信号を前記真空チャンバの外部へ伝送す
べく一端が前記膜厚センサに接続された信号伝送ケーブ
ルと、前記真空チャンバの外部から前記ヒータへ電力を
供給すべく一端が前記ヒータに接続された電力供給ケー
ブルとが、前記真空チャンバに設けられた開口部を通じ
て前記真空チャンバの内外に渡って設けられている真空
成膜装置において、 前記膜厚センサは、前記ヒータの近傍における所定の位
置決め範囲内にて予め位置決め可能に設けられており、 前記ヒータと信号伝送ケーブルとの間を遮蔽すべく前記
位置決め範囲を囲んで設けられる第１遮蔽部材と、該第
１遮蔽部材及び前記膜厚センサの間の空隙を塞ぐ第２遮
蔽部材とを備え、 前記ヒータから前記信号伝送ケーブルへの放熱を遮蔽す
べくなしてあることを特徴とする真空成膜装置。4. A film thickness sensor for detecting a film thickness of a film formed on a substrate, and a heater for heating the substrate are housed, and a component for maintaining a vacuum atmosphere in an internal space. A vacuum chamber for the film, a signal transmission cable having one end connected to the film thickness sensor for transmitting a signal indicating the film thickness detected by the film thickness sensor to the outside of the vacuum chamber, and the vacuum chamber And a power supply cable whose one end is connected to the heater to supply power to the heater from the outside of the vacuum chamber, provided inside and outside the vacuum chamber through an opening provided in the vacuum chamber. In the apparatus, the film thickness sensor is provided in advance so as to be positionable within a predetermined positioning range in the vicinity of the heater, and is provided so as to shield between the heater and the signal transmission cable. A first shielding member that surrounds the positioning range and a second shielding member that closes a gap between the first shielding member and the film thickness sensor are provided to shield heat radiation from the heater to the signal transmission cable. A vacuum film forming apparatus characterized by being made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002110581A JP4014918B2 (en) | 2002-04-12 | 2002-04-12 | Vacuum deposition system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002110581A JP4014918B2 (en) | 2002-04-12 | 2002-04-12 | Vacuum deposition system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003301258A true JP2003301258A (en) | 2003-10-24 |
| JP4014918B2 JP4014918B2 (en) | 2007-11-28 |
Family
ID=29393676
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002110581A Expired - Fee Related JP4014918B2 (en) | 2002-04-12 | 2002-04-12 | Vacuum deposition system |
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| Country | Link |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008120445A1 (en) * | 2007-03-29 | 2008-10-09 | Shinmaywa Industries, Ltd. | Sensor fixing structure and vacuum film deposition apparatus |
| KR20140113598A (en) * | 2013-03-15 | 2014-09-24 | 인피콘, 인크. | High capacity monitor crystal exchanger utilizing an organized 3d storage structure |
-
2002
- 2002-04-12 JP JP2002110581A patent/JP4014918B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008120445A1 (en) * | 2007-03-29 | 2008-10-09 | Shinmaywa Industries, Ltd. | Sensor fixing structure and vacuum film deposition apparatus |
| KR20140113598A (en) * | 2013-03-15 | 2014-09-24 | 인피콘, 인크. | High capacity monitor crystal exchanger utilizing an organized 3d storage structure |
| KR102055460B1 (en) | 2013-03-15 | 2019-12-12 | 인피콘, 인크. | High capacity monitor crystal exchanger utilizing an organized 3d storage structure |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4014918B2 (en) | 2007-11-28 |
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