JP2003288570A - Contactless ic media and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To lower the cost and to improve the durability as to a contactless IC medium which sends and receives information without contacting and a manufacturing method therefor. <P>SOLUTION: A transfer RF-ID module 13 which has an antenna part 31 and an IC Module 32 is interposed between a heat-sensitive sheet 12 and a base material sheet 21 of a double coated adhesive sheet 14 across an adhesive 22. In this case, at least the antenna part 31 is formed on a peeling function sheet and transferred to the double coated adhesive sheet 14. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact type IC medium for exchanging information in a non-contact manner and a manufacturing method thereof.

[0002]

2. Description of the Related Art In recent years, RF-ID (Radio Fre
A technique relating to a non-contact type IC medium (such as a non-contact type IC card) referred to as a "quency identification" has been rapidly advancing, and its use is also diverse. Such non-contact type IC media is
Cost reduction is desired, and on the other hand, it is necessary to have excellent durability depending on the use environment.

Conventionally, a non-contact type IC medium is produced by forming a coiled antenna on a base material by a printing process or the like, and mounting an IC module (including an IC bare chip alone) on both ends of this antenna. It Further, in order to improve the sensitivity of data exchange with the outside, it is desirable that the area of the antenna part is as large as possible,
The antenna is shaped so as to orbit a plurality of times when it is formed. Therefore, since it is necessary to form a short-circuit line that leads by avoiding one of the land parts where the IC module is mounted in the antenna part, an insulating member is interposed between the antenna part and the short-circuit line. That is, the conventional non-contact type IC medium is manufactured by forming an antenna, forming an insulating member in a predetermined portion, forming a short-circuit line on the insulating member, and mounting an IC module. .

[0004]

In the production of the conventional non-contact type IC media as described above, since the steps of heating and pressure application are included, the substrate and conductive ink used are not affected by the heating and pressure. There is a problem in that it is necessary to endure it, resulting in high cost. In addition, the produced non-contact type IC
When used in a medium usage environment, for example, an air baggage IC tag used as an air baggage tag, physical and mechanical stress may be applied, which may impair the function of the IC tag. is there.

Therefore, the present invention has been made in view of the above problems, and an object of the present invention is to provide a non-contact type IC medium and a method of manufacturing the same which can reduce the cost and improve the durability.

[0006]

In order to solve the above-mentioned problems, according to the invention of claim 1, an antenna portion is formed and an IC is formed.
A non-contact type IC medium including an RF-ID module in which a module is mounted, the information display sheet on which information related to the information stored in the IC module is printed by a predetermined printing unit, and the information display sheet. And a base material sheet laminated with an adhesive, and interposed between the information display sheet and the base material sheet, at least the antenna part is formed on another member, and the pressure sensitive adhesive is applied to the information display sheet or the base material sheet. R is transferred by
And a transfer RF-ID module that constitutes an F-ID module.

According to the second and third aspects of the present invention, there is provided a structure in which a release sheet is provided on the back surface of the surface of the base sheet on the side of the information display sheet via an adhesive, and the "memory in the IC module is stored. And the information printed on the information display sheet is at least the information for consignment of luggage. "

According to a fourth aspect of the present invention, there is provided a non-contact type IC medium manufacturing method comprising an RF-ID module having an antenna portion and an IC module mounted thereon, wherein the object to be formed is peelable. Above, a step of forming the antenna part by the conductive ink, a step of forming the RF-ID module by mounting the IC module on the antenna part, and an adhesive on at least one surface. The coated base sheet, or the above I
The peeling is performed by adhering the RF-ID module with the adhesive to a transfer sheet of an information display sheet coated with an adhesive, in which information related to the information stored in the C module is printed by a predetermined printing unit. A step of peeling and transferring from the functional sheet, and on the transfer sheet, on the side to which the RF-ID module is transferred, when the transfer sheet is the base material sheet, the information display sheet,
Alternatively, when the transfer sheet is the information display sheet, a step of adhering the base material sheet is included.

According to a fifth aspect of the present invention, there is provided a non-contact type IC medium manufacturing method comprising an RF-ID module having an antenna part formed therein and having an IC module mounted thereon, wherein the object to be formed is peelable. A step of forming the antenna part with the conductive ink, a base sheet having an adhesive applied on at least one side thereof, or information related to information stored in the IC module is a predetermined printing means. In the transfer sheet of the information display sheet coated with the adhesive to be printed by, the step of transferring by peeling from the release function sheet by adhering the antenna section with the adhesive, and transferring on the transfer sheet. A step of forming the RF-ID module by mounting the IC module on the formed antenna part; A step of adhering the information display sheet when the transfer sheet is the base material sheet, or the base material sheet when the transfer sheet is the information display sheet, to the side to which the RF-ID module is transferred. The configuration includes and.

According to the sixth and seventh aspects of the invention, the base sheet has a structure in which a release sheet is adhered to the back surface of the surface coated with the pressure-sensitive adhesive through a pressure-sensitive adhesive.
The configuration is such that “the information stored in the IC module and printed on the information display sheet is at least the information for consignment of luggage”.

As described above, the transfer RF-ID module having the antenna section and the IC module is interposed between the information display sheet and the base sheet. That is, at least the information display sheet and the base material sheet can increase the strength against physical and mechanical stress and improve the durability. In addition, at least the antenna portion is formed on the peeling function sheet and is transferred to the transfer sheet. That is, since the heating and pressure applying steps in the manufacturing process are performed on the release functional sheet, the base material used does not need to consider the heating and pressure, and the cost can be reduced.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of the present invention will be described below with reference to the drawings. In the present embodiment, the case where the present invention is applied to a non-contact type IC tag as the non-contact type IC medium, but the present invention is not limited to this, and a card provided with a non-contact type IC module capable of storing and erasing data by data transfer ,
It can also be applied to labels, forms, postcards and envelopes.

FIG. 1 is a block diagram of a non-contact type IC medium according to the present invention. 1A is a vertical cross-sectional view of a non-contact type IC medium as a non-contact type IC tag as an example, and FIG. 1B is a configuration diagram of an RF-ID module mounted. In FIG. 1A, the non-contact type IC medium 11 includes a heat sensitive sheet 12 which is an information display sheet, and an RF.
-The ID module 13, the double-sided adhesive sheet 14, and the release sheet 15 are laminated and configured. Double-sided adhesive sheet 1
Reference numeral 4 denotes a base sheet 21 on both sides of which adhesives 22 and 23 are applied. The RF-ID module 13 is adhered to the adhesive 22 and is interposed between the adhesive sheet 22 and the heat sensitive sheet 12. .

The release sheet 15 is attached to the backside of the base sheet 21 of the double-sided pressure-sensitive adhesive sheet 14 on the side of the heat-sensitive sheet 12 via the pressure-sensitive adhesive 23. A form in which the release sheet 15 is provided on the double-sided pressure-sensitive adhesive sheet 14 becomes a transfer sheet described later. In the case of using the single-sided pressure-sensitive adhesive sheet, when a release sheet is provided later via the pressure-sensitive adhesive, the single-sided pressure-sensitive adhesive sheet becomes the transfer sheet described later.

The heat-sensitive sheet 12 is one in which information related to information stored in an IC module described later is printed by a heat-sensitive printing means, and a heat-sensitive coloring layer is formed on a base material such as paper or resin film. It is a thing. As the information display sheet, paper, film or the like may be used in addition to the heat sensitive sheet 12. In this case, the information may be printed by an ink jet printer as a printing means.

The base sheet 21 of the double-sided pressure-sensitive adhesive sheet 14 is formed of, for example, a resin base material such as polyester, non-woven fabric, and various inorganic or organic fibers (glass fiber, alumina fiber, polyester fiber, polyamide fiber, etc.). Woven cloth, paper, or a sheet combining these,
Alternatively, it is formed of a composite base material sheet or the like formed by impregnating these sheets with a resin varnish. This base sheet 2
When 1 is made of a material that does not allow water to permeate particularly, the durability of the medium as a whole can be improved. As the adhesives 22 and 23, known adhesives are sufficient, and those which are adhered when the final product form is used are used.

Paper is most preferable as the sheet base material for the release sheet 15 in terms of economy, but a polyester film such as polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, or a known resin film is used. These are double-sided PSA sheet 1
Since it is adhered to the adhesive 23 of the base sheet 21 of No. 4, it is easy to peel off later, and the RF-ID module 14
A release agent such as a silicone agent is applied to the surface so as not to hinder the formation.

The RF-ID module 13 is shown in FIG.
As shown in (B), the antenna section 31 is formed of conductive ink and the IC module 32 is mounted. The antenna part 31 is, for example, an antenna pattern formed by winding a predetermined number of turns in a plane coil shape, and both ends thereof are land parts 31A and 31B. This land part 31A
The insulating agent layer 33 is formed on the antenna pattern inwardly from, and the short circuit line 34 is formed from the land portion 31A via the insulating agent layer 33. This short circuit line 34
The end portion of becomes the land portion 35.

That is, the antenna pattern 31 (including the land portions 31A and 31B), the insulating agent layer 33, the short-circuit line 34 and the land portion 35 constitute the antenna portion 31. The antenna pattern is designed appropriately according to the IC module used and the usage as a non-contact IC medium, and the distance between the land portions 31A and 31B matches the distance between the terminals of the IC module 32, The insulating agent layer 33 and the short-circuit line 34 (land portion 35) may be formed depending on the designed pattern such as the case where the circuit is made only once.
Can be omitted.

The antenna part 31 has the antenna pattern, the short-circuit line 34 and the land part 35 formed by screen printing using conductive ink, and the same screen as described above using an insulating member (insulating ink). The insulating agent layer 33 is formed by printing. This conductive ink is solidified by heat, infrared rays, ultraviolet rays, electron beams, etc. after printing. For example, LS-411AW (trade name) manufactured by Asahi Chemical Laboratory, FA-353 manufactured by Fujikura Kasei.
(Trade name) and Toyobo Co., Ltd. DWP-026 (trade name) can be used. As the formation of the insulating agent layer 33, an insulating film, paper or insulating tape may be attached on the corresponding antenna pattern.

An IC module (structure is shown in FIG. 7) 32 is mounted between the land portion 31B and the land portion 35 by being electrically connected at least in a close contact state.
The land portions 31B and 35 can be brought into close contact with each other.
And an anisotropic conductive film between the terminals of the IC module 32 and
There is a method of interposing an anisotropic conductive paste, an insulating resin, a double-sided adhesive tape, or the like. As a method of applying these,
Although there are a dispensing method, a printing method, a spray method and the like, when an anisotropic conductive paste or an insulating resin is used, it is preferable to apply by the dispensing method.

On the other hand, bumps are formed on the connection terminal portions of the IC module 32 by metal electrolytic plating, studs, electroless metal plating, fixing of conductive resin, etc., if necessary. When mounting the IC module 32, necessary pressure may be applied, or when mounting with an adhesive tape, energy such as heat, light, electromagnetic waves, or ultrasonic waves may be applied depending on the material. Good. Further, post-curing may be performed in order to sufficiently fix the bonded portion after mounting. In order to protect the mounted IC module 32, the whole or part of the mounted portion may be covered and protected with a glove top material or an underfill material.

Therefore, FIG. 2 shows a conceptual diagram of manufacturing the non-contact type IC media of FIG. FIG. 2 shows a non-contact IC media manufacturing system 41, which includes a release function sheet 42.
Are transported endlessly, for example. The peeling function sheet 42 includes a resin film or a non-woven fabric coated with a releasable member such as a fluororesin base material, a fluororesin, or silicone, a non-woven fabric, and various inorganic or organic fibers (glass fiber, alumina fiber, polyester). Woven cloth, paper, or a sheet in which these are combined and coated with a releasable resin is appropriately used. Considering that the conductivity can be improved by treating the antenna portion 31 of the RF-ID module 13 at a high temperature, the sheet base material of the release function sheet 42 is made of a heat-resistant fluororesin base material, a silicone-coated polyimide base material. It is desirable to use a glass cloth containing fluorocarbon resin. The peeling function sheet 42 can form a new antenna portion 31 after transfer, which contributes to cost reduction.

Above the transported peeling function sheet 42, conductive ink printing means 43, solidifying means (heating in this case) 44, insulating ink printing means 45, and solidifying means (here, in the order of the carrying direction). 46), conductive ink printing means 47, solidifying means (here, heating)
48 are arranged. The conductive ink printing means 43 is for printing and forming the antenna pattern with the conductive ink, and the solidifying means 44 is for heating and solidifying the printed antenna pattern.

The insulating ink printing means 45 is for forming the insulating agent layer 33 by printing the insulating agent layer 33 on a predetermined portion of the antenna pattern with the insulating ink, and the solidifying means 46 is the printed insulating agent. It is for heating the layer 33 to solidify it. Further, the conductive ink printing means 47 is for forming a short circuit line 34 (land portion 35) on the insulating agent layer 33 by printing with the conductive ink, and the solidifying means 48 is a printed short circuit. The line 34 (land portion 35) is heated and solidified.

An IC module mounting means 49 is arranged above the peeling function sheet 42 to be conveyed and behind the solidifying means 48 in the conveying direction. The IC module mounting means 49 corresponds to the mounting method of the IC module 32. For example, when the connection terminal is a bump, the IC module 32 is connected to the land portion 31B of the antenna portion 31 and the short-circuit line 34. It is mounted by pressing on the land portion 35 to make electrical connection. Note that, as described above, the RF-I in which the IC module 32 is mounted
When forming a protective film on the D module 13,
A protective coating material printing means and a solidifying means are further arranged as needed after the IC module mounting means 49.

On the other hand, the transfer sheet (double-sided adhesive sheet 1
4 and the release sheet 15) are continuously supplied from the transfer sheet continuum supply unit 50 so that the continuous body of the release function sheet 42 and the release function sheet 42 overlap each other in the transport direction.
After the transfer of the F-ID module 13, the continuous body of the heat-sensitive sheet 12 is supplied from the heat-sensitive sheet continuous body supply unit 51 so as to overlap the transfer side. Then, the continuous body of the non-contact type IC media 11 to which the heat sensitive sheet 12 is laminated and adhered is wound and stored by the non-contact type IC media continuous body storage portion 52.

Therefore, FIG. 3 shows a flow chart of manufacturing the non-contact type IC medium of FIG. 1, and FIGS.
FIG. 3 is an explanatory diagram of each stage in manufacturing the non-contact type IC media of FIG. 4 and 5 are shown as a single body or as a part. In FIG. 3, first, in FIG.
An antenna pattern (lands 31A, 31B) forming a part of the antenna unit 31 as shown in FIG. 4B is printed on the peeling function sheet 42 shown in FIG. And is solidified by the solidifying means 44 (step (S) 1).

Subsequently, the insulating ink printing means 45 prints an insulating agent layer 33 constituting a part of the antenna portion 31 as shown in FIG. 4C on a predetermined portion of the antenna pattern and solidifies it. It is solidified by the means 46 (S
2). Further, the conductive ink printing means 47 allows the short-circuit line 34 and the land portion 3 as shown in FIG.
5 is printed and solidified by the solidifying means 48 (S3).
As a result, the antenna part 31 is formed. Then, as shown in FIG. 4E, the land portion 3 of the antenna portion 31 formed in the IC module mounting means 49.
The RF-ID module 13 is formed by mounting the IC module 32 between 1B and 35 (S4).

Subsequently, the RF-ID module 13 formed on the peeling function sheet 42 as shown in FIG. 5 (A).
Is adhered to the pressure-sensitive adhesive layer 22 of the transfer sheet (14, 15) supplied from the transfer sheet continuum supply unit 50 to remove the RF-ID module 13 as shown in FIG. 5 (B). The sheet 42 is peeled off and transferred to the transfer sheet (14, 15) (S5). And
As shown in FIG. 5C, the continuous heat-sensitive sheet supply unit 51 supplies the RF-ID module (transfer RF-ID module) 13 onto the transfer sheet (14, 15) on the transfer side. The heat-sensitive sheets 12 are laminated and adhered to each other to form a continuous body of the non-contact type IC media 11, which is then wound around the non-contact type IC media continuous body storage portion 52 (S6). After that, the non-contact type IC medium 11 is cut into a single piece or a predetermined plurality of pieces according to the usage pattern.

As described above, since the antenna portion 31 is formed by forming it on the peeling function sheet 42 and transferring it to the transfer sheet (14, 15), the heating and pressure applying steps in the manufacturing process are peeled off. It can be performed on the sheet, and the transfer sheet (14, 15) and the heat-sensitive sheet 12 to be used do not need to consider heating and pressure, and the cost can be reduced. Then, the non-contact type IC medium 11 thus manufactured is the transfer sheet (14, 15).
The heat-sensitive sheet 12 increases strength against physical and mechanical stress and improves durability.

In the above embodiment, the case where the IC module 32 is mounted before transfer by the transfer sheets (14, 15) is shown, but after transfer and before superposition of the heat sensitive sheets 12. May be implemented. In this case, I
In addition to the above method, the C module 32 may be fixed by utilizing the adhesiveness of the adhesive 22 of the double-sided adhesive sheet 14.

On the other hand, when manufacturing the non-contact IC medium 11 in the above-mentioned embodiment, the thermal sheet 12 having one surface coated with the adhesive is transferred from the transfer sheet continuum supplying section 50 in FIG. Instead of the heat-sensitive sheet continuous body supply part 51, the base material sheet 21 may be supplied as a continuous body supply part of the base material sheet 21 to which the release sheet 15 is appropriately adhered. In this case, it is preferable that the IC module 32 be mounted before the transfer.

Next, FIG. 6 shows a non-contact type I according to the present invention.
The explanatory view of one usage example of C media is shown. The non-contact type IC medium 11 shown in FIG. 6 (A) is produced as described above as a baggage IC tag which is attached to, for example, consignment luggage when boarding at an airport or luggage when boarding. In the non-contact type IC medium 11 as described above, of the information regarding the consigned luggage stored in the RF-ID module 13 included therein, for example, the destination, the number of flights, the passenger number, etc. are printed on the thermal sheet 12 by the thermal printer. It
Then, the release sheet 15 is peeled off from the non-contact type IC medium 11, and the adhesive 23 is adhered to and attached to the target consignment luggage in a loop shape.

Therefore, FIG. 7 shows a block diagram of a reader / writer for using the non-contact type IC medium according to the present invention. The reader / writer 61 shown in FIG. 7 is an RF-I of a non-contact type IC medium (baggage IC tag) 11.
The D-module 13 is made to store the information regarding the consigned package, and at least the predetermined information stored in the RF-ID module 13 is read during the transportation. Further, the reader / writer 61 is connected to the printing means 62 and the input means 63.

The non-contact type IC medium (baggage IC tag) 11 is composed of an IC module 32 including a processing unit 71, a memory 72 and a demodulation unit 73, and an antenna unit 31. The antenna unit 31 is wound in a coil shape on the plane as described above, receives a signal from the reader / writer 61, or the reader / writer 6 from the non-contact type IC medium (baggage IC tag) 11.
1 to send data.

In the IC module 32, the memory 72 is for storing various information as the card. The demodulation unit 73 demodulates a control signal and data from the radio wave received by the antenna unit 31, and performs code conversion as appropriate. Then, the processing unit 71 causes the memory 72 to store the received control signal and data and transmits the data stored in the memory according to the program.

The reader / writer 61 comprises a control section 81 and a data memory 82, a data conversion section 83 and a modulation section 8.
4, a transmitter 85, a power amplifier 86, a detector 87, an antenna 88, a display 89 and an interface (IF) 90. The control unit 81 uses the reader / writer 6
It controls the whole of 1 and a program corresponding to this is set. The data memory 83 stores various data relating to the input consignment package. The various data include, for example, the name, address, and
There are telephone numbers, passenger numbers, flight numbers, destinations, seat numbers, etc.

The data conversion unit 83 is connected to the non-contact type I.
When information is transmitted to the C media (baggage IC tag) 11, the information is converted into, for example, "1" or "0",
Further, the transmission data from the non-contact type IC medium (baggage IC tag) 11 is converted into, for example, "1" or "0". The modulator 84 modulates the information converted by the data converter 83 into, for example, an FSK (frequency shift keying) modulated wave based on the transmission output from the transmitter 85. The power amplifier 86 power-amplifies the modulated wave modulated by the modulator 84, and the amplified modulated wave is transmitted to the antenna 8
8 is transmitted. Then, the detection unit 87
Radio waves transmitted from the non-contact type IC medium (baggage IC tag) 11 received by the antenna 88 are detected and demodulated.

The display unit 89 is provided appropriately and displays the data to be handled. In addition, the IF unit 90
Is for transmitting print data to the printing section 62 and for acquiring input data from the input means 63.

If the reader / writer 61 performs communication with the target non-contact type IC medium (baggage IC tag) 11 and printing by the printing unit 62 on the same line, first, it is sent from the input means 63. The name, address, telephone number, passenger number of the above-mentioned luggage owner regarding luggage,
The data such as the boarding flight name, the destination, and the seat number are input and stored in the data memory 82. Then, out of the stored data, predetermined data (for example, passenger number, boarding flight name, destination) is transmitted to the non-contact type IC medium (baggage IC tag) 11 to be stored in the memory 72, and the printing section 62. Also outputs the same data and causes the heat-sensitive sheet 12 of the non-contact type IC medium (baggage IC tag) 11 to print the destination, flight number, and passenger number (see FIG. 6).

As described above, even in the environment used by the baggage IC tag, which is susceptible to mechanical and physical stress, the heat-sensitive sheet 12 and the double-sided adhesive sheet (transfer sheet) 1 are used.
The base sheet 21 of No. 4 can increase the strength and can improve the durability.

[0043]

As described above, according to the present invention, the transfer RF-ID module having the antenna section and the IC module is physically interposed between the information display sheet and the base sheet. Further, the strength is increased against mechanical stress and the durability can be improved. In addition, by forming at least the antenna part on the release function sheet and transferring it to the transfer sheet to perform the heating and pressure applying steps in the manufacturing process on the release function sheet, the base material used is heated or pressed. It is not necessary to consider the above, and the cost can be reduced.

[Brief description of drawings]

FIG. 1 is a configuration diagram of a non-contact type IC medium according to the present invention.

FIG. 2 is a conceptual diagram of manufacturing the non-contact type IC media of FIG.

FIG. 3 is a flowchart of manufacturing the non-contact type IC media of FIG.

FIG. 4 is an explanatory diagram (1) of each stage in manufacturing the non-contact type IC medium of FIG.

5A and 5B are explanatory views (2) of each stage in manufacturing the non-contact type IC medium of FIG.

FIG. 6 is an explanatory diagram of a usage example of the non-contact type IC medium according to the present invention.

FIG. 7 is a block diagram of a reader / writer for using the non-contact type IC medium according to the present invention.

[Explanation of symbols]

11 Non-contact IC Media 12 Thermal Sheet 13 RF-ID Module 14 Double-sided Adhesive Sheet 15 Release Sheet 21 Base Sheet 31 Antenna Part 32 IC Module 33 Insulating Agent Layer 34 Short Circuit Line 41 Non-contact IC Media Manufacturing System 42 Release Function Sheet 43, 47 Conductive ink printing means 44, 46, 48 Solidifying means 45 Insulating ink printing means 49 IC module mounting means 50 Transfer sheet continuous body supply section 51 Thermal sheet continuous body supply section 52 Non-contact type IC media continuous body storage section 61 Reader / Writer

Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) G06K 19/07 G09F 3/02 F G09F 3/00 3/10 H G06K 19/00 K 3/02 H 3/10 J QF term (reference) 2C005 MA07 MA18 MB06 NA08 NA36 NB13 PA03 PA18 PA27 RA03 5B035 AA07 BA03 BA05 BB09 BB11 BC00 CA01 CA02 CA06 CA23 5B058 CA15 KA01 KA04 KA05 YA20

Claims (7)

[Claims] 1. A non-contact type IC including an RF-ID module having an antenna portion and an IC module mounted thereon.
An information display sheet, which is a medium, on which information related to the information stored in the IC module is printed by a predetermined printing unit, a base material sheet laminated with the information display sheet and an adhesive, and the information display. A transfer which is interposed between a sheet and the base sheet, at least the antenna portion is formed on another member, and is transferred to the information display sheet or the base sheet with an adhesive to form the RF-ID module. An RF-ID module, and a non-contact type IC medium characterized by the following. 2. The non-contact type IC medium according to claim 1, wherein a release sheet is provided on the back surface of the surface of the base sheet on the side of the information display sheet via an adhesive. Non-contact type IC media. 3. The non-contact type IC medium according to claim 1 or 2, wherein the information stored in the IC module and printed on the information display sheet is at least baggage delivery information. Non-contact type IC media. 4. A non-contact type IC including an RF-ID module having an antenna portion and an IC module mounted thereon.
A method of manufacturing a medium, comprising: a step of forming the antenna section with the conductive ink on a release functional sheet from which an object to be formed can be released; and the IC module being mounted on the antenna section. A step of forming the RF-ID module, a base sheet having an adhesive applied on at least one surface, or an adhesive having information related to the information stored in the IC module printed by a predetermined printing means. A step of adhering the RF-ID module to the transfer sheet of the applied information display sheet with the pressure-sensitive adhesive so that the RF-ID module is peeled off from the release functional sheet and transferred; and the RF-ID on the transfer sheet. When the transfer sheet is the base material sheet, the information display sheet or the transfer sheet displays the information on the side where the module is transferred. In the case of a sheet, a step of adhering the base sheet, the method for producing a non-contact type IC medium. 5. A non-contact type IC including an RF-ID module having an antenna portion and an IC module mounted thereon.
A method of manufacturing a medium, comprising: a step of forming the antenna part by the conductive ink on a peeling function sheet on which an object to be formed is peelable, and a base material sheet having an adhesive applied on at least one surface thereof, Alternatively, the peeling is performed by adhering the antenna section to the transfer sheet of the information display sheet coated with an adhesive, on which information related to the information stored in the IC module is printed by a predetermined printing means, by the adhesive. A step of peeling and transferring from the functional sheet; a step of forming the RF-ID module by mounting the IC module on the transferred antenna part on the transfer sheet; If the transfer sheet is the base material sheet, the information display sheet or the transfer sheet is provided on the side to which the RF-ID module is transferred. When the sheet is the information display sheet, a step of adhering the base material sheet is included, and a method for producing a non-contact type IC medium. 6. The method for manufacturing a non-contact type IC medium according to claim 4, wherein the base sheet is a release sheet on the back surface of the surface coated with the pressure-sensitive adhesive with a pressure-sensitive adhesive interposed therebetween. Non-contact type IC characterized in that
Media manufacturing method. 7. The method for manufacturing a non-contact type IC medium according to claim 4, wherein the information stored in the IC module and printed on the information display sheet is at least for luggage consignment. A method for manufacturing a non-contact type IC medium, which is information.