JP2003286453A - Bonding method, and manufacturing method of optical head system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a bonding method which, even in the case of adhesive- fixing a plurality of members themselves in a state having a space with a UV-curing adhesive without lowering productivity, does not generate releasing and lowering strengths of the adhesive, and to provide a manufacturing method of an optical head system using the bonding method. <P>SOLUTION: In the manufacturing method of the optical head system 1, when an optical element such as a photo-detector 11 and a CD laser diode 5 is adhesive-fixed in a state of a little floating to a frame 3, the UV-curing adhesive R with a regulated viscosity of 20-30 Pa.s at room temperature is used. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for adhering members to each other and a method for manufacturing an optical head device using this adhering method.

[0002]

2. Description of the Related Art CD (Compact Disc) and DVD
In an optical head device used for recording and reproducing on an optical recording medium such as a (digital versatile disk), light emitted from a laser light source element such as a laser diode is guided to an objective lens through a light guide system and is converged by the objective lens. The emitted light is focused on the optical recording medium. Here, the objective lens, a lens driving device that drives the objective lens in the tracking direction and the focusing direction, and the like are mounted on a frame made of metal or resin, and this frame includes a laser light source element, a photodiode, and the like. A light receiving element is also mounted.

To mount an optical element such as a laser diode or a photodiode on a frame, a method of adhering and fixing the optical element to the frame with an adhesive is often used. In such a method, after the adhesive is applied to the optical element or the frame in plural spots, the positional relationship between the optical element and the frame is adjusted, or the positional relationship between the optical element and the frame is adjusted. Then, an adhesive is applied in spots between the optical element and the frame, and then the adhesive is cured.

[0004]

Thus, in order to bond and fix the optical element to the frame, it is necessary to adjust the optical axis position and the focus position of the optical element. Although it will be adhesively fixed after being adjusted originally, in such a case, the optical element is adhesively fixed in a state of being floated from the frame by a predetermined gap.

It is convenient to use an ultraviolet curable adhesive (hereinafter referred to as a UV curable adhesive) that is an immediate curable adhesive as the adhesive used for such adhesive fixing.

[0006] However, if the conventional UV curable adhesive having a quick curing property is used for fixing, there is a problem that the adhesive strength is low or the adhesive is peeled off. As a result of investigating the cause of such a problem, the present inventor has obtained the following findings.

First, if the viscosity of the UV curable adhesive is too high when the optical element is adhered and fixed in a state where it is floated from the frame by a predetermined gap, as shown in FIG. As a result of being applied in a dumpling shape, the contraction stress at the time of curing acts in the direction of peeling the adhesive as shown by the arrow B, peeling off the UV curing adhesive R,
So-called "floating" occurs.

On the other hand, if the viscosity of the UV-curing adhesive is too low when the optical element is adhered and fixed in a state where it is floated from the frame by a predetermined gap, as shown in FIG. The dripping of the agent R is remarkable, the contact area between the UV curable adhesive R and the member is reduced, and the adhesive strength is reduced.

As for peeling which occurs when the viscosity of the UV-curing adhesive is too high, for example, a method of applying a UV-curing adhesive and curing it after a sufficient time, or using a UV-curing adhesive This can be solved by setting the intensity of UV light to be irradiated low and curing it over time, but with such measures, the operating rate of the equipment used to cure the adhesive while adjusting the positions of the members Is significantly reduced, which is not preferable. Further, if the viscosity of the UV curable adhesive is too high, it is possible to eliminate the peeling by reducing the coating amount, but if such a measure is taken, there is a problem that the adhesive strength is lowered.

A method of adjusting the viscosity of the UV-curing adhesive by adjusting the temperature of the UV-curing adhesive or the atmosphere when applying and curing the UV-curing adhesive is also conceivable. Is not preferable because it causes a variation in quality, such as difficulty in controlling the amount of coating because the viscosity varies with temperature variations.

In view of the above problems, the object of the present invention is to
Even when bonding and fixing the members with a gap left between them,
An object of the present invention is to provide a bonding method that does not cause peeling of the adhesive or a decrease in strength, and a method of manufacturing an optical head device using this bonding method.

[0012]

In order to solve the above problems, according to the present invention, when the first member and the second member are bonded and fixed with an adhesive with a predetermined gap, the first member In a state where the adhesive is applied to the member or the second member, the adhesive has a skirt shape.

According to the present invention, when the first member and the second member are bonded and fixed to each other with a predetermined gap, the adhesive is applied in a dumpling shape based on the findings obtained from various studies. Without, the adhesive is applied to have a skirt shape. Therefore, when the adhesive cures, the contraction stress does not act in the direction of peeling the adhesive, so that peeling of the adhesive, so-called "floating" can be prevented.

In the present invention, it is preferable to use an adhesive having a viscosity of 20 Pa · s to 30 Pa · s at room temperature (15 ° C. to 30 ° C.) as the adhesive.

According to the present invention, when the first member and the second member are bonded and fixed to each other through a predetermined gap, the viscosity of the adhesive is 20 Pa based on the findings obtained from various studies.
・ Since it is set from s to 30 Pa ・ s and optimized,
The adhesive does not drip. Therefore, a sufficient contact area can be secured between the adhesive and the member, and the adhesive strength between the members is improved. Furthermore, since the problem can be solved simply by adjusting the viscosity of the adhesive, unlike the method of curing the adhesive over a long period of time, it is possible to maintain high productivity, such as not lowering the operation rate of the device. it can.

The viscosity is from 20 Pa · s to 30 Pa.
It is not limited to the range of s, but the point is that the adhesive can be applied so as to have a skirt shape, and the contact area between the adhesive and the member can be sufficiently secured without sagging. It only needs to have a viscosity.

In the present invention, for example, the adhesive is applied to at least one of the first member and the second member in a plurality of spots at 1 mg or more per location, and then the adhesive is applied. The first member and the second member are bonded and fixed in a state in which the mutual positional relationship is adjusted.

In the present invention, for example, the viscosity of the adhesive is adjusted by adding a filler as a thickener to the adhesive.

In the present invention, the adhesive is, for example,
It is a UV curing adhesive.

The bonding method according to the present invention can be applied, for example, to the manufacture of an optical head device. That is, in the manufacturing process of the optical head device, the frame on which the objective lens for converging the light emitted from the laser light source to the optical recording medium is mounted and the optical element are respectively the first member and the second element.
The present invention is applied to the case where the above-mentioned adhesive is used to bond and fix the member. Here, the optical element is, for example, a laser light source element, a light receiving element, or a mirror. Since such an optical element is often mounted on the frame in a state where the three-dimensional position adjustment is performed, if the present invention is applied to bond and fix these optical elements to the frame,
Since the optical element can be suitably mounted on the frame, the productivity and quality of the optical head device are improved.

[0021]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An optical head device to which the present invention is applied will be described below with reference to the drawings.

(Overall Structure of Optical Head Device) FIG.
FIG. 3 is a plan view of a main part of an optical head device for recording / reproducing D, CD-R, and DVD.

As shown in FIG. 1, the optical head device 1 has a frame 3 made of resin or metal. In this frame 3, two guide shafts 2A and 2B mounted so as to be parallel to each other are connected to a device by a connecting portion 30.
By being passed through 1, 302, 303, it can move along the guide shafts 2A, 2B. An optical system described below is configured on the frame 3.

The optical system of the optical head device 1 comprises a DVD laser diode 4 for emitting a first laser beam L1 and a second laser diode 4 for a DVD.
And a laser diode 5 for CD that emits the laser light L2, and the first laser light emitted from each laser diode 4, 5.
And guide the second laser beams L1 and L2 to the common optical path 6,
Utilizing this common optical path 6, CD, CD-R, and DV
All recording / reproduction of D can be performed.

The common optical path 6 includes a light-receiving element 11 mounted on the frame 3, a sensor lens 10, a light guide system 20, a collimating lens 7, and a rising mirror 8 composed of a total reflection mirror, and above the rising mirror 8. And the objective lens 9 arranged in the.

The DVD laser diode 4 is for recording / reproducing a DVD and emits a first laser beam L1 having a wavelength of 650 nm or 635 nm. On the other hand, the CD laser diode 5 is for recording and reproducing CD and CD-R, and emits the second laser light L2 having a wavelength of 780 to 800 nm. The laser diodes 4 and 5 have mutual optical axes L10 and L20 on the same side of the light guide system 20 of the common optical path 6.
Are arranged in parallel. In the illustrated example, the DVD laser diode 4 is arranged closer to the light receiving element 11 than the CD laser diode 5.

The first laser light L1 emitted from the DVD laser diode 4 directly enters the light guide system 20.
On the other hand, the second laser light L2 emitted from the CD laser diode 5 enters the light guide system 20 via the diffraction grating 12. The diffraction grating 12 is given a predetermined diffraction characteristic, and splits the second laser light L2 emitted from the CD laser diode 5 into three beams.

The DVD laser diode 4 is press-fitted and fixed in a hole 305 opened at the side surface 317 of the frame 3 while being mounted on the circuit board 410, and the circuit board 4 is also provided.
10 is covered with a shield case 60. As a result, the DVD laser diode 4 emits the first laser light L1 to the light guide system 20 through the hole 305.

The heat sink 40, to which the CD laser diode 5 is fixed, has a U shape on the side surface 316 of the frame 3.
It is fixed by V-curing adhesive R. Thereby, C
The D laser diode 5 is arranged at the entrance of a hole 306 formed in the frame 3, and the second laser light L2 is guided through the hole 306 through the diffraction grating 12 to guide the light.
Emit to 0.

Further, the circuit board 110 on which the light receiving element 11 is mounted is fixed to the side surface 311 of the frame 3 by the UV curing adhesive R, so that the light receiving element 11 is mounted on the frame 3.

The light guide system 20 is composed of a half mirror 21 having a partially reflective surface and a prism 22 having a partially reflective surface. The half mirror 21 has a partially reflecting surface that is the first laser light L emitted from the laser diode 4.
It is arranged to be inclined by 45 degrees with respect to the first optical axis L10. The prism 22 has a partially reflecting surface that is the second laser light L2 emitted from the laser diode 5.
Is arranged so as to be inclined by 45 degrees with respect to the optical axis L20.

In the optical head device 1 thus constructed, the objective lens driving device 70 for driving the objective lens 9 in the focusing direction and the tracking direction has a lens holder 71 holding the objective lens 9. The lens holder 71 includes a cylindrical body portion 72 and the body portion 7
2 has a cylindrical bearing portion 73 formed inside. A pair of tracking drive coils 81 and a pair of focusing drive coils 82 are formed on the outer peripheral surface of the body 72.

A support shaft 91 stands upright from the bottom wall of the holder support member 35 held by the frame 3, and the support shaft 91 is inserted inside the bearing portion 73 of the lens holder 71. An outer wall 356 and an inner wall 357 are formed on the holder support member 35, and a pair of tracking drive magnets 83 that face the tracking drive coil 81 and form a tracking magnetic circuit are attached to the outer wall 356. Therefore, the tracking error can be corrected by rotating the lens holder 71 around the support shaft 91.

A pair of focusing drive magnets 84 facing the focusing drive coil 82 and forming a focusing magnetic circuit are attached to the outer wall 356. Therefore, the lens holder 71 is attached to the support shaft 91.
Focusing error correction can be performed by moving in the axial direction of.

The lens holder 71 is connected to a flexible substrate 77 whose middle position is supported by the cut-and-raised portion 359 of the holder support member 35. A cover (not shown) covers the upper surface of the holder support member 35.

(Manufacturing Method / Adhesion Method of Optical Head Device) FIGS. 2 (A), 2 (B) and 2 (C) show the structure of a UV curing device used in the manufacturing method of the optical head device according to the present invention. An explanatory view, an explanatory view showing a state in which the CD laser diode 5 and the light receiving element 11 are bonded and fixed to the frame 3 with a UV curing adhesive R, and the raising mirror 8 (total reflection mirror) is UV-mounted on the frame 3. It is explanatory drawing which shows a mode that the adhesive fixing was carried out with the hardening adhesive agent R. FIG. 3 shows a process for manufacturing the optical head device according to the present invention in which C is applied to the frame 3.
FIG. 6 is a process diagram of an adhering step of adhering and fixing optical elements such as the D laser diode 5 and the light receiving element 11 with a UV curing adhesive R. 4 (A) and 4 (B) respectively show U with an appropriate viscosity.
It is explanatory drawing which shows a mode that V-curing adhesive was applied, and the explanatory view which shows a mode that UV-curing adhesive whose viscosity is too high is applied. 5 (A) and 5 (B) are explanatory views showing a state in which two members are bonded and fixed with a UV curing adhesive having an appropriate viscosity, and two members are bonded and fixed with a UV curing adhesive having a too low viscosity. It is explanatory drawing which shows the mode that it did. Figure 6
Relationship between the viscosity of the UV curing adhesive and the initial floating of the UV curing adhesive, and U when a temperature cycle test was performed
It is a graph which shows the relationship with the float of V hardening adhesives. Figure 7
[Fig. 3] is a graph showing the relationship between the viscosity of a UV curable adhesive and the adhesive strength.

In manufacturing the optical head device 1, in this embodiment, after the DVD laser diode 4 is fixed to the frame 3, the DVD laser diode 4 is caused to emit light and the light receiving element 11 monitors the light received. The circuit board 110 on which the element 11 is mounted is fixed at an optimum position,
Then, the laser diode 5 for CD is turned on, and the heat sink 40 to which the laser diode 5 for CD is fixed is fixed to the optimum position while monitoring the light with the light receiving element 11. Here, the DVD laser diode 4 is fixed by press fitting into the hole 305 of the frame 3,
Circuit board 110 on which light receiving element 11 is mounted, and CD
The heat sink 40 to which the laser diode 5 is fixed is adhered and fixed to the frame 3 by the UV curing adhesive R by applying the adhesion method according to the present invention.

The light receiving element 11 (circuit board 110) and the laser diode 5 for CD (heat sink 40) are set to UV.
In the present embodiment, when adhesively fixing to the frame 3 using the curing adhesive R, in this embodiment, as shown in FIG. 2A, the UV lamp 510, the light control filter 520, the shutter 530, the connector 540, and a plurality of UV irradiations are used. Fiber 550
A UV curing device 500 including the above and a hand 200 for chucking a work are used. Here, the UV curing device 5
00, a power supply circuit 590, a feedback fiber 560 for feeding back the UV irradiation status, U
The V sensor 570 and the control circuit 580 are configured, and the control circuit 580 controls the dimming filter 520, the shutter 530, and the power supply circuit 5 based on the monitoring result via the feedback fiber 560 or a command from the outside.
90 is controlled to adjust the irradiation intensity of UV emitted from the UV irradiation fiber 550.

In order to bond and fix the light receiving element 11 to the frame 3 by using the UV curing device 500 thus constructed,
First, an acrylic UV-curable adhesive R having a viscosity at room temperature (15 ° C to 30 ° C) adjusted from 20 Pa · s to 30 Pa · s by blending a filler made of silicon oxide as a thickener prepare. Then, in step ST1 of FIG. 3, the frame 3 is set on the jig, and in step ST2, the circuit board 110 holding the light receiving element 11 is chucked by the hand 200. next,
In this state, in step ST3, the DVD laser diode 4 is caused to emit light, and the hand 200 is moved while monitoring it by the light receiving element 11, and the position of the circuit board 110 on which the light receiving element 11 is mounted is adjusted three-dimensionally. . In this state, between the frame 3 and the circuit board 110, as shown in FIG.
As shown in (B), there is a gap G of about 1 mm or less.

Next, in step ST4, as shown in FIG.
As shown in (B), a plurality of locations, for example, four locations, between the circuit board 110 and the frame 3 can be separated from the dispenser by U.
The V-curing adhesive R is applied in spots. At this time, the amount of the UV curable adhesive R per location is 1 mg or more, for example, 1.5 mg.

Next, in step ST5, the UV curing adhesive R applied to each position is irradiated with UV from the irradiation fiber 550 of the UV curing device 500 to cure the UV curing adhesive R, and thereafter, In step ST6, the hand 200 releases the circuit board 110 and removes the frame 3 from the jig.

Also, when the heat sink 40 to which the laser diode 5 for CD is fixed is adhered and fixed to the frame 3, first, like the case where the light receiving element 11 is adhered and fixed, first, a filler made of silicon oxide as a thickening material. The acrylic UV curing adhesive R whose viscosity at room temperature (15 ° C. to 30 ° C.) is adjusted to 20 Pa · s to 30 Pa · s by blending And step S in FIG.
At T1, the frame 3 is set on the jig, and at step ST2, the heat sink 40 to which the CD laser diode 5 is fixed is chucked by the hand 200.
Next, in this state, in step ST3, the laser diode 5 for CD is caused to emit light, and the hand 200 is moved while monitoring it by the light receiving element 11 to three-dimensionally position the heat sink 40 to which the laser diode 5 for CD is fixed. Adjust accordingly. In this state, between the frame 3 and the heat sink 40, as shown in FIG. 2B, the heat sink 40 is moved in the optical axis direction so that the position of the CD laser diode 5 in the optical axis direction can be adjusted. There is a gap G of about 1 mm or less.

Next, in step ST4, as shown in FIG.
As shown in (B), the UV curable adhesive R is applied in spots from a dispenser to a plurality of locations, for example, four locations between the heat sink 40 and the frame 3. At this time, 1
The amount of the UV curable adhesive R per location is 1 mg or more, for example, 1.5 mg.

Next, in step ST5, the UV curing adhesive R applied to each position is irradiated with UV from the irradiation fiber 550 of the UV curing device 500 to cure the UV curing adhesive R, and thereafter, In step ST6, the hand 200 releases the heat sink 40,
Remove the frame 3 from the jig.

As shown in FIG. 2C, even when the raising mirror 8 is mounted on the frame 3, after the position of the raising mirror 8 is three-dimensionally adjusted, the UV curing adhesive R
This method is the same as the step of bonding and fixing the light receiving element 11 (circuit board 110) and the CD laser diode 5 (heat sink 40) to the frame 3 by using the UV curing adhesive R. , Description is omitted.

In this bonding step, in this embodiment, the UV curable adhesive R whose viscosity at room temperature is adjusted to 30 Pa · s or less is used. Therefore, when the UV curable adhesive R is applied, the UV curable adhesive R is not applied in a dumpling shape as shown in FIG.
As shown in (A), it is applied so as to have a skirt shape. Therefore, when the UV curable adhesive R is cured, the contraction stress acts only in the direction of the arrow A, and does not act in the direction of peeling the UV curable adhesive R. It is possible to prevent the occurrence of so-called "floating".

That is, FIG. 6 shows the relationship between the viscosity of the UV curable adhesive R and the initial occurrence rate of floating of the UV curable adhesive R by a dotted line L1, and the viscosity of the UV curable adhesive R 20 temperature cycles at 70 ° C / -30 ° C,
As shown by the solid line L2, the viscosity of the UV curing adhesive R is 3 when the relationship with the floating occurrence rate of the UV curing adhesive R is shown.
When it is 0 Pa · s or less, the floating of the UV curable adhesive R does not occur initially, and the occurrence rate is extremely low even when the temperature cycle test is performed.

In this embodiment, the viscosity at room temperature is 20P.
As shown in FIG. 5 (A), unlike the case of applying a high-viscosity UV curing adhesive as shown in FIG. 5 (B), the UV curing adhesive R adjusted to a · s or more is used. , UV
The curing adhesive does not sag, and a sufficient contact area can be secured between the UV curing adhesive R and the member. Therefore, the adhesive strength is high.

That is, as shown by the solid line L3 in FIG. 7, the relationship between the viscosity of the UV curing adhesive R and the adhesive strength is UV.
When the viscosity of the cured adhesive R is 20 Pa · s or more, the adhesive strength is high.

As described above, in this embodiment, the UV curing adhesive R
Since the viscosity of is adjusted to the optimum condition of 20 Pa · s to 30 Pa · s, the UV curable adhesive R does not float,
Moreover, since the adhesive strength is high, the reliability of the adhesive portion is high.

Further, according to the present embodiment, the problem can be solved only by adjusting the viscosity of the UV curable adhesive R, and therefore, unlike the method of curing the adhesive over a long period of time, the operation rate of the device can be improved. It is possible to maintain high productivity such as no decrease.

(Other Embodiments) In the above embodiment, after adjusting the position of the optical element such as the light receiving element 11, the UV curable adhesive R is spotted at a plurality of positions between the optical element and the frame 3. Although the UV curable adhesive R is applied in a spot shape on the optical element or at a plurality of positions of the frame 3, the position of the optical element is adjusted, and then the UV curable adhesive R may be cured. .

[0053]

As described above, according to the present invention, the first
In adhering and fixing the first member and the second member with a predetermined gap, in the state where the adhesive is applied to the first member or the second member, the adhesive is
Since it has a skirt shape, the adhesive will not be applied in a dumpling shape. Therefore, when the adhesive cures, the contraction stress does not act in the direction of peeling the adhesive, so that peeling of the adhesive, so-called "floating" can be prevented.

The viscosity of the adhesive at room temperature is 20 Pa.
Since it has been optimized by setting it from s to 30 Pa · s, the viscosity of the adhesive is optimized, so that the adhesive does not sag. Therefore, since a sufficient contact area can be secured between the adhesive and the member, the adhesive strength is improved. Furthermore, since the problem can be solved simply by adjusting the viscosity of the adhesive, unlike the method of curing the adhesive over a long period of time, it is possible to maintain high productivity, such as not lowering the operation rate of the device. it can.

[Brief description of drawings]

FIG. 1 is a plan view of a main part of an optical head device to which the present invention is applied.

2 (A), (B), and (C) are explanatory views showing the configuration of a UV curing device used in the method of manufacturing an optical head device according to the present invention, a laser diode for CD and a frame, respectively. FIG. 5 is an explanatory view showing a state where the light receiving element is adhered and fixed with a UV curing adhesive, and a state where a rising mirror (total reflection mirror) is adhered and fixed to the frame with a UV curing adhesive.

FIG. 3 is a view showing a manufacturing process of an optical head device according to the present invention.
FIG. 7 is a process diagram of an adhering step for adhering and fixing optical elements such as a CD laser diode and a light receiving element to a frame with a UV curing adhesive.

4 (A) and (B) are UV with an appropriate viscosity.
It is explanatory drawing which shows the mode that the hardening adhesive agent was applied, and the signs that the UV hardening adhesive agent whose viscosity is too high was applied.

FIG. 5 (A) and (B) are UV with an appropriate viscosity.
It is explanatory drawing which shows a mode that the two members were adhered and fixed by the curing adhesive, and the two adhesive members were fixed and fixed by the UV curing adhesive whose viscosity is too low.

FIG. 6 shows the relationship between the viscosity of the UV-curable adhesive and the initial occurrence of floating of the UV-curing adhesive, and the relationship between the occurrence of floating of the UV-curing adhesive when a temperature cycle test is performed. It is a graph shown.

FIG. 7 is a graph showing the relationship between the viscosity of a UV curable adhesive and the adhesive strength.

[Explanation of symbols]

1 Optical head device 3 frames 4 DVD laser diode (optical element) 5 Laser diode for CD (optical element) 8 launch mirror 9 Objective lens 11 Light receiving element 70 Objective lens driving device 71 lens holder 200 hands 500 UV curing device R UV curing adhesive

   ─────────────────────────────────────────────────── ─── Continued front page    F term (reference) 4J040 DF001 FA081 HA306 JB08                       KA42 MB11 NA17 NA21 PA32                 5D117 AA02 CC07 HH01 HH05 HH10                       KK23                 5D119 AA32 BA01 FA34 JA57 JC03                       KA40 NA02

Claims (7)

[Claims] 1. When adhering and fixing a first member and a second member with an adhesive with a predetermined gap left between them,
The bonding method, wherein the adhesive has a skirt shape in a state where the adhesive is applied to the first member or the second member. 2. The adhesive according to claim 1, wherein:
An adhesive method characterized by using an adhesive having a viscosity of 20 Pa · s to 30 Pa · s at room temperature. 3. The adhesive according to claim 1, wherein at least one member of the first member and the second member is coated with the adhesive in a spot shape at 1 mg or more, and at a plurality of positions. A bonding method, wherein the first member and the second member are bonded and fixed with an adhesive in a state in which the mutual positional relationship is adjusted. 4. The method according to any one of claims 1 to 3,
A bonding method characterized in that the viscosity of the adhesive is adjusted by blending a filler as a thickener with the adhesive. 5. The method according to claim 1 or 4,
An adhesive method, wherein the adhesive is an ultraviolet curable adhesive. 6. A method of manufacturing an optical head device using the bonding method as defined in any one of claims 1 to 5, wherein an objective lens for converging light emitted from a laser light source onto an optical recording medium is mounted. The frame and the optical element are respectively the first
A method for manufacturing an optical head device, wherein the member and the second member are bonded and fixed by the adhesive. 7. The method of manufacturing an optical head device according to claim 6, wherein the optical element is any one of a laser light source element, a light receiving element, and a mirror.