JP2003283038A - Light emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light emitting device, maintaining a light emitting element in water-tight and efficiently radiating heat generated by the light emitting element. <P>SOLUTION: The light source part 14 of the light emitting device 10 is provided with a supporting body 22, equipped with long radiating fins 24 extended into the longitudinal direction thereof, a plurality of semiconductor laser elements 12 arranged along the longitudinal direction of the supporting body 22 and thermally connected to the supporting body 22, a light transmitting window 38, through which laser beams emitted out of the semiconductor laser elements 12 are transmitted, and a resin part 44, provided on the supporting body 22 so as to surround the semiconductor laser elements 12 and supporting the light transmitting window 38 while tightly sealing the semiconductor laser elements 12. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting device used for cultivating plants and the like, and more particularly to a light emitting device using a light emitting element.

[0002]

2. Description of the Related Art A conventional light emitting device using a light emitting element is described in Japanese Patent Application Laid-Open No. 2000-207933 (hereinafter referred to as "Reference 1") and Japanese Patent Application Laid-Open No. 2001-44517 (hereinafter referred to as "Reference 2"). There is something.

In Reference 1, a plurality of light emitting diodes are arranged in a matrix on the surface of a rectangular base, and
There is described a lighting panel in which a cover having the same shape as the base is installed by providing a gap between the surface of the base and a light emitting diode is hermetically sealed by interposing a sealing material at the peripheral portions of the base and the cover. In this lighting panel, a pipe through which a refrigerant flows or a radiation fin is provided on the back surface of the base.

Further, Document 2 describes a light emitting device in which a board on which a plurality of light emitting diodes are mounted is provided with heat radiation fins which are thermally connected to lead portions of the light emitting diodes, and these are housed in a main body case. There is.

Japanese Patent Laid-Open No. 2001-358398 describes a semiconductor laser device unit provided with a photodiode for monitoring the light emitting state of the semiconductor laser device, and Japanese Patent Laid-Open No. 2000-207933 discloses it. , A laser processing apparatus provided with a temperature sensor for controlling the temperature state of a semiconductor laser element.

[0006]

However, the illumination panel described in Document 1 and the light emitting device described in Document 2 described above have the following problems.

That is, the lighting panel described in Document 1 is constructed as a rectangular panel as a whole.
Since a large number of light emitting diodes are arranged in the airtight space formed between the base and the cover, heat generated by the light emitting element may be trapped in the airtight space.

Further, in the light-emitting device described in Document 2, the light-emitting diode and the radiation fin are thermally connected through the lead portion, and the radiation fin is housed in the main body case. Therefore, the heat generated by the light emitting diode may not be efficiently dissipated.

Further, in recent years, it has been desired to apply a light emitting device using a light emitting element to culturing phytoplankton in a culture solution. However, in the lighting panel described in Document 1 and the light emitting device described in Document 2, None of them adopts a structure that takes waterproofness into consideration.

Therefore, the present invention has been made in view of such circumstances, and provides a light emitting device capable of keeping the light emitting element in a watertight state and efficiently radiating the heat generated by the light emitting element. The purpose is to

[0011]

In order to achieve the above object, a light emitting device according to the present invention is a long-sized support having a radiation fin extending in the longitudinal direction, and a support of the support. A plurality of light emitting elements arranged along the longitudinal direction and thermally connected to the support, a light transmitting member through which light emitted from the light emitting element is transmitted, and provided on the support so as to surround the light emitting element, And a cover for supporting the light transmitting member and sealing the light emitting element.

According to this light emitting device, since the light emitting element is placed on the support and covered with the light transmitting member and the cover, the light emitting element can be kept watertight. Further, since the light emitting element is arranged along the longitudinal direction of the elongated support body and is thermally connected to the support body, and the support body has a radiation fin extending in the longitudinal direction, the light emitting element is The heat generated by can be efficiently dissipated. Moreover, since it is configured as a long shape as a whole, the amount of heat stored in the cover can be remarkably reduced as compared with the case where the panel is configured as a rectangular panel as in the conventional configuration.

In the light emitting device according to the present invention, the light emitting element is preferably a semiconductor laser element. This is because the semiconductor laser device has a high luminous efficiency, a small amount of heat generation per light output, and is a light emitting device capable of emitting pure color light having a high light intensity.

Further, in the light emitting device according to the present invention, the support may have a plurality of rows of radiation fins, or may be a tubular body, and a part of the tubular body may be a radiation fin. . This is because the surface area of the radiating fins increases, and a higher heat radiating effect can be obtained.

Further, it is preferable that the light emitting device according to the present invention includes a cooling pipe which is in contact with the heat radiation fin and through which the refrigerant flows. By providing such a cooling pipe, it is possible to significantly improve the heat dissipation efficiency.

In the light emitting device according to the present invention, the temperature measuring means for measuring the temperature of the support to obtain temperature data, and the internal light amount for measuring the light amount inside the light transmitting member to obtain the internal light amount data. Based on at least one of the temperature data, the internal light intensity data, and the external light intensity data, the light emitting output and the light emission of the light emitting element based on the measuring means and the external light intensity measuring means for measuring the light intensity outside the cover to obtain the external light intensity data. It is preferable to provide a control means for controlling at least one of time and light emission pattern. According to such a configuration, the light emitting state of the light emitting element can be controlled according to the external conditions of the light emitting device.

Further, in the light emitting device according to the present invention, the cover is preferably molded with resin. This is because by molding with a resin, a cover that supports the light transmitting member and seals the light emitting element can be formed easily and reliably.

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of the present invention will be described in detail below with reference to the drawings. In the description of the drawings, the same or corresponding parts will be denoted by the same reference symbols, without redundant description. In the light source unit of the light emitting device described later, the side from which the laser light is emitted is referred to as “front” and the opposite side is referred to as “back”.

The overall configuration of the light emitting device 10 according to this embodiment will be described with reference to FIG. FIG. 1 is a diagram showing an overall configuration of the light emitting device 10.

The light emitting device 10 has a long light source section 14 in which a plurality of semiconductor laser elements 12 are arranged in a row along the longitudinal direction, and a control connected to the light source section 14 via an input / output cable 16. And a device (control means) 18.

The control device 18 supplies electric power to the light source unit 14 and, based on measurement data (at least one of temperature data, internal light amount data and external light amount data) acquired by the light source unit 14 described later, The light emission state (light emission output, light emission time (timer), light emission pattern (pulse pattern), etc.) of the semiconductor laser device 12 of the section 14 can be feedback-controlled. That is, the light source unit 1
The light emitting state of the semiconductor laser device 12 can be controlled according to the external conditions of the semiconductor laser device 12.

The light source section 14 is provided at both ends in the longitudinal direction,
A mounting portion 20 such as a screw hole is provided. This mounting part 2
As shown in FIG. 2 and FIG. 3, the connection member 21 is attached to 0 by a screw or the like, and the light source unit 14 can take various layouts. FIG. 2 is a diagram showing a state in which the light source units 14 are arranged in parallel and fixed by the connecting member 21, and the light source unit 14 constitutes a panel, and FIG.
It is a figure which shows the state which arranged the light source part 14 in an elevated shape, using as a leg. The input / output cable 16 is used for the light source unit 1.
4 is thinned so as not to hinder the layout of No. 4, and is drawn out from the end portion on the back side of the light source unit 14.

Next, the internal structure of the light source section 14 will be described with reference to FIGS. FIG. 4 is a diagram showing the internal structure of the light source unit 14 as seen from the longitudinal direction, and FIG.
4 is a diagram showing an internal structure viewed from the front side of FIG. 4, and FIG. 6 is a diagram showing an internal structure viewed from the back side of the light source unit 14.

The light source section 14 is provided with an elongated support 22 made of a material having a high thermal conductivity including, for example, Al, and the support 22 has a radiation fin 24 protruding from the back surface thereof. is doing. The radiating fins 24 extend in the longitudinal direction of the support 22, and in the present embodiment, two rows are integrally formed on the back surface of the support 22. When the support 22 is integrally formed of Al or an alloy containing Al as a main component, the support 22 having both heat conductivity, strength and light weight can be obtained at low cost.

On the surface of the support 22, a plurality of semiconductor laser elements 12 are arranged in a row along the longitudinal direction of the support 22, and the semiconductor laser elements 12 are supported by the support 22 via the stem portion. Is thermally connected to. The plurality of semiconductor laser elements 12 may be arranged in a plurality of rows along the longitudinal direction of the support 22. Further, since the semiconductor laser element 12 is used because it can emit pure color light with high luminous efficiency and high light intensity, the semiconductor laser element 12 has different light wavelengths or a plurality of light wavelengths depending on the application. One having a wavelength may be used, or a light emitting diode may be used instead of part of the semiconductor laser element 12.

A substrate 26 is installed on a portion of the back surface of the support 22 sandwiched by the radiation fins 24, and a circuit portion 28 is formed on the back surface of the substrate 26. The circuit portion 28 includes lead pins 30 penetrating the support 22 and the substrate 26.
The semiconductor laser device 12 is electrically connected via. Further, the circuit section 28 has a forward protection diode 32 and a reverse protection diode 34, which controls the current flowing through the circuit section 28 and protects the semiconductor laser element 12.

On the front side of the support 22, a thermometer (temperature measuring means) 36 for measuring the temperature of the support 22 and obtaining temperature data, and a light transmission through which the laser light emitted from the semiconductor laser element 12 is transmitted. A window (light transmitting member) 38, an internal light meter (internal light amount measuring means) 40 for measuring the light amount inside the light transmitting window 38 to obtain internal light amount data, and the light source unit 14.
And an external light meter (external light amount measuring means) 42 for measuring the amount of light outside the device to obtain external light amount data.
If the light transmission window 38 has a lens effect or a diffusion effect, the light emission pattern can be adjusted as necessary.

The components of the light source section 14 described above are covered with a resin section 44. The resin portion 44 is molded with a resin having an insulating property and a corrosion resistance, and the support member 22 surrounds the semiconductor laser element 12.
And functions as a cover for supporting the light transmitting window 38 and sealing the semiconductor laser element 12. By molding with resin, such a cover can be easily and surely formed. Then, the resin part 44 seals the components of the light source part 14 including the semiconductor laser device 12 from the external environment, so that water, corrosion, impact,
It will be protected from pressure and leakage.

The heat radiation fin 24 covering portion of the resin portion 44 has a necessary minimum thickness capable of maintaining the environmental resistance in order to prevent the heat radiation effect from decreasing. Further, the light transmitting window 38 and the light receiving portion of the external light meter 42 are not coated with the resin portion 44, or have such a thickness that a desired light transmittance can be obtained even if they are coated. Resin part 4
The resin forming 4 is preferably an epoxy resin or the like having both sufficient strength and workability.

As shown in FIGS. 5 and 6, in the input / output cable 16, a thermometer 36, an internal light meter 40, and an external light meter 42 are respectively connected to a thermometer input / output terminal 46 and an internal light meter input / output terminal. The terminal 48 and the external light meter input / output terminal 50 are extended, and the thermometer 36, the internal light meter 40, and the external light meter 42 can exchange information regarding each measurement data with the control device 18. Further, the circuit unit 28 is supplied with electric power from the control device 18 via the electric power supply line 52 in the input / output cable 16. The thermometer input / output terminal 46, the internal light meter input / output terminal 48, the external light meter input / output terminal 50, and the power supply line 52 are protected by the input / output cable 16 from water immersion, corrosion, impact, and the like.

Here, the internal light meter 40 and the external light meter 4
The function 2 will be described with reference to FIG.

The internal light meter 40 is composed of the semiconductor laser device 12
The laser light emitted from the laser and scattered in the light transmitting window 38 is detected. That is, the light output of the light source unit 14 can be monitored by the internal light meter 40. On the other hand, the external light meter 42
Detects light that enters the external light meter 42 from outside the light source unit 14. By changing the detection wavelength characteristic of the external light meter 42, the light emitting device 10 can be provided with various environment measuring functions.

For example, when the detection wavelength characteristic of the external light meter 42 is matched with the wavelength of the laser light emitted from the semiconductor laser device 12, the external light meter 42 outputs the laser light emitted from the light transmission window 38 to the outside. Therefore, the absorbance between the light transmission window 38 and the external light meter 42 can be measured by comparing with the measurement data of the internal light meter 40. Thereby, when the light source unit 14 is used in a phytoplankton culture solution or the like, the absorbance of the culture solution or the light transmission window 38
It is possible to monitor the dirt adhesion state of the surface of the.

The detection wavelength characteristic of the external light meter 42 is
When the fluorescence wavelength from a plant or a phytoplankton phytopigment to be the object of laser light irradiation by the light source unit 14 is matched, the external light meter 42 outputs the light from the outside of the light source unit 14 to the plant. It is possible to measure fluorescence information generated by laser light irradiation, such as fluorescence from a chlorophyll dye, which is a dye, and fluorescence from a phycovir dye. As a result, it is possible to monitor the concentration and growth state of plants and phytoplankton which are the objects of laser light irradiation by the light source unit 14.

Further, the detection wavelength characteristic of the external light meter 42 is set to a general photosynthetic effective wavelength of a plant, and the light incident on the external light meter 42 from the outside of the light source unit 14 when the laser light of the light source unit 14 is turned off is measured. Alternatively, if the detection wavelength characteristic of the external light quantity meter 42 is set to a photosynthetic effective wavelength other than the emission wavelength of the laser light of the light source unit 14, the external light intensity can be simply monitored. This is, at night, cloudy weather, etc., the laser light irradiation is performed only when the amount of external light falls below a predetermined value,
This is effective when enhancing the effect as supplementary light.

It is more effective to use the internal light meter 40 and the external light meter 42 having a plurality of specifications according to the application. The internal light meter 40 and the external light meter 4
The selection of the detection wavelength characteristic 2 can be easily realized by using a filter or the like built in each photometer.

Next, the circuit section 28 of the light source section 14 will be described with reference to FIGS. 7 and 8. FIG. 7 shows the circuit section 2
8 is a circuit diagram showing a minimum unit of 8, and FIG. 8 is a circuit diagram of a circuit unit 18 in which a plurality of circuits shown in FIG. 7 are combined.

As shown in FIG. 7, for one semiconductor laser element 12, a forward protection diode 32 is connected in parallel in the forward direction with respect to the current direction of the semiconductor laser element 12.
And the reverse protection diode 34 connected in parallel in the reverse direction with respect to the current direction of the semiconductor laser device 12 is the minimum unit of the circuit unit 28. Actual circuit part 28
Is configured in accordance with the number of semiconductor laser elements 12 used, and as shown in FIG. 8, the circuit shown in FIG. 7 can be combined in series or in parallel. Note that the circuit shown in FIG. 8 is an example, and the circuit unit 28 is not limited to this unless the purpose of the circuit for driving the semiconductor laser element 12 is basically exceeded.

When a plurality of semiconductor laser devices 12 are arranged in series, one reverse protection diode 34 can be provided for each series circuit. The forward protection diode 32 has a function of preventing an excessive voltage from being applied to the semiconductor laser element 12 in the forward direction, and the forward voltage Vd1 of the forward protection diode 32 is equal to or higher than the drive voltage Vld of the semiconductor laser element 12. Need to be The reverse protection diode 34 has a function of preventing a reverse voltage from being applied to the semiconductor laser element 12, and the forward voltage Vd2 of the reverse protection diode 34 is higher than the reverse withstand voltage Vrld of the semiconductor laser element 12. Must be low enough. Generally, the value of Vd2 is preferably 0.6v to 0.8v.

The structure of the light emitting device 10 according to the present embodiment has been described above. As shown in FIG.
Between the two rows of heat radiation fins 24 provided in the zero light source unit 14, a cooling pipe 54 that abuts the heat radiation fins 24 can be further attached. When the light source unit 14 irradiates the laser light, a coolant such as water flows into the cooling pipe 54.
Although the cooling pipe 54 can be attached to and detached from the light source unit 14, since the input / output cable 16 is thinned and pulled out from the end portion on the back side of the light source unit 14 as described above, the input / output cable 16 is It does not hinder the attachment and detachment of the cooling pipe 54.

Next, the operation and effect of the above-described light emitting device 10 will be described.

When the light emitting device 10 is used for cultivating animals and plants, the light source section 1 including the semiconductor laser element 12 is used.
Although the component 4 is exposed to a harsh external environment, the component of the light source unit 14 is covered with the resin portion 44 and sealed from the external environment as shown in FIG. It will be protected from inundation, corrosion, shock, pressure and leakage.

Further, as shown in FIG. 4, in the light source section 14 of the light emitting device 10, the semiconductor laser element 12 is elongated in a long-sized support 22 made of a material having a high thermal conductivity such as Al. The semiconductor laser device 12 is arranged along the direction and is thermally connected to the support 22 through the stem portion. Since the support 22 has the heat radiation fins 24 extending in the longitudinal direction, the semiconductor laser element 12 is irradiated with the laser light. The heat generated by the heat radiation fins 24 can be efficiently radiated. Moreover, since the light source unit 14 is formed in a long shape, it is possible to remarkably reduce the amount of heat stored in the resin unit 44 as compared with the case where the light source unit 14 is formed as a rectangular panel as in the conventional structure. it can. Therefore, it is possible to prevent the light output from decreasing due to the temperature rise of the semiconductor laser element 12, and to irradiate the laser light from the light source unit 14 with a stable light output.

It should be noted that the elongated light source section 14 has an advantage that the handling is improved as compared with the case where the light source section 14 is formed as a rectangular panel as in the conventional configuration. is doing.

Further, in the light source section 14 of the light emitting device 10,
As shown in FIG. 9, the cooling pipe 5 that abuts the heat radiation fins 24.
4 can be attached. When the light source unit 14 irradiates the laser light, a coolant such as water flows in the cooling pipe 54, so that the heat radiation efficiency of the heat radiation fins 24 can be further improved. If the cooling pipe 54 is connected to a temperature control device or the like having a temperature control function, the light source unit 14 can be cooled and the temperature of the external environment can be controlled at the same time. Effective when used inside.

Next, an application example of the above-described light emitting device 10 will be described with reference to FIGS.

FIG. 10 is a diagram showing a state in which the light emitting device 10 is applied to culturing phytoplankton. As shown in the figure, the light source unit 14 of the light emitting device 10 is arranged in the culture medium filled in the culture tank 56, and the phytoplankton and the like in the culture medium are irradiated with laser light from the light source unit 14. Light source 1
4, a cooling pipe 54 is attached to the cooling pipe 54.
Is connected to a temperature control device 58 capable of actively controlling the temperature.

The culture tank 56 has a heat insulating effect, and its inner surface is configured to reflect the laser light emitted from the light source section 14 of the light emitting device 10. Culture tank 5
The broth in 6 contains phytoplankton to be cultivated and nutrients necessary for the growth of phytoplankton and the like. Gas exchange such as carbon dioxide and oxygen in the liquid and agitation of the culture liquid are attempted. An exhaust port 62 for degassing the inside of the culture tank 56 is provided on the top plate portion of the culture tank 56. The intake air agitator 60 is provided with an air supply pump or the like equipped with a dustproof filter for preventing contamination of foreign bacteria and the like from the outside air.

FIG. 11 is a diagram showing a state in which the light emitting device 10 is applied to cultivation of agricultural products. As illustrated, the light source unit 14 of the light emitting device 10 is elevated above the agricultural product by the connecting member 21, and the light emitting device 10 is used as an illumination / light supplement device for the agricultural product. The light source unit 14 has a cooling pipe 5
4 is attached, and the cooling pipe 54 is connected to the cooling liquid tank 64 via a pipe 66. Cooling pipe 5
4, a cooling liquid serving as a refrigerant is circulated through the cooling liquid tank 64 and the pipe 66. The temperature of the cooling liquid is controlled by a temperature control device 58 provided in the cooling liquid tank 64. The cooling liquid tank 64 may be eliminated and well water, river water, or the like may be directly used as the cooling liquid.

Finally, the light source unit 1 of the light emitting device 10 described above.
The effect of cooling 4 with the cooling pipe 54 will be described with reference to FIGS. 12 and 13.

FIG. 12 is a diagram showing the transition of the optical output of the light source unit 14 after the laser light is turned on when the cooling pipe 54 is attached to the light source unit 14 of the light emitting device 10 and the temperature of the light source unit 14 is maintained at 20 ° C. Is. Here, ten semiconductor laser elements 12 were provided in series in the light source section 14 and rated energization was performed. The temperature was 25 ° C., and the photosynthetic effective photon density was measured at a position 15 cm from the light source unit 14 as the light amount. According to this, as shown in the figure, the light output of the light source unit 14 can be obtained in a stable state.

FIG. 13 shows that the light source unit 14 of the light emitting device 10 is turned on by laser light due to a temperature rise inside the light source unit 14 when the light source unit 14 is made to emit light under rated energization under the conditions of “in air / with cooling pipe” and “underwater” It is a figure which shows the transition afterward. here,
Under the "underwater" condition, the light source unit 14 is placed in the water tank containing tap water.
Under the condition of “in air / with cooling pipe”, the cooling pipe 54 was attached to the light source unit 14 and tap water was circulated through the cooling pipe 54. The temperature is 25 ℃, and the temperature of tap water is 16 ℃.
Was -18 ° C. According to this, under the condition of “in air / with cooling pipe”, it is possible to prevent the temperature rise of the light source unit 14 more than under the condition of “underwater”.
It is possible to stabilize the temperature rise of the light source unit 14 within the range of 1 to 2 ° C.

The preferred embodiment of the present invention has been described above in detail, but it goes without saying that the present invention is not limited to the above embodiment.

For example, in the above-described embodiment, the support 22 in the light source section 14 of the light emitting device 10 has two rows of heat radiation fins 24 extending in the longitudinal direction. However, in the present invention, the support is provided. 22 is a radiation fin 24 of various modes
Can have. 14A and 14B are views showing another embodiment of the support 22 in the light source section 14, in which FIG. 14A shows an L-shaped cross section viewed from the longitudinal direction, and FIG. 14B shows a cross section viewed from the longitudinal direction. A U-shaped one is shown, and (c) shows a cylindrical cross-section viewed from the longitudinal direction. As shown in FIG. 14C, when the support 22 is a tubular body and a part of the tubular body is used as the heat radiation fins 24, or the support 22 has a larger number of rows (three or more rows). When the heat radiation fins 24 are provided, the surface area of the heat radiation fins 24 is increased, so that a higher heat radiation effect can be obtained.

The light emitting device according to the present invention is applicable not only to cultivation of plants but also to various uses.

[0056]

As described above, according to the present invention,
Since the light emitting element is placed on the support and covered with the light transmitting member and the cover, the light emitting element is sealed, so that the light emitting element can be kept watertight. Further, since the light emitting element is arranged along the longitudinal direction of the elongated support body and is thermally connected to the support body, and the support body has a radiation fin extending in the longitudinal direction, the light emitting element is The heat generated by can be efficiently dissipated. Moreover, since it is configured as a long shape as a whole, the amount of heat stored in the cover can be remarkably reduced as compared with the case where the panel is configured as a rectangular panel as in the conventional configuration.

[Brief description of drawings]

FIG. 1 is a diagram showing an overall configuration of a light emitting device.

FIG. 2 is a diagram showing a state in which a panel is configured by a light source unit of a light emitting device.

FIG. 3 is a diagram showing a state in which a light source unit of a light emitting device is arranged in an elevated shape.

FIG. 4 is a diagram showing an internal structure of the light source unit of the light emitting device when viewed from the longitudinal direction.

FIG. 5 is a diagram showing an internal structure of the light source unit of the light emitting device as viewed from the front side.

FIG. 6 is a diagram showing the internal structure of the light emitting device as seen from the back side of the light source unit.

FIG. 7 is a circuit diagram showing a minimum unit of a circuit unit of a light source unit.

8 is a circuit diagram of a circuit unit in which a plurality of circuits shown in FIG. 7 are combined.

FIG. 9 is a diagram showing a state in which a cooling pipe is attached to a light source unit of the light emitting device.

FIG. 10 is a diagram showing a state in which the light emitting device is applied to culturing phytoplankton.

FIG. 11 is a diagram showing a state in which the light emitting device is applied to cultivation of agricultural products.

FIG. 12 is a diagram showing a transition of the optical output of the light source unit after the laser light is turned on.

FIG. 13 is a diagram showing a transition of temperature rise inside the light source unit after the laser light is turned on.

14A and 14B are views showing another embodiment of the support in the light source section of the light emitting device, wherein FIG. 14A shows an L-shaped cross section as viewed in the longitudinal direction, and FIG. 14B as viewed in the longitudinal direction. A U-shaped cross section is shown, and (c) shows a cylindrical cross section viewed from the longitudinal direction.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 ... Light emitting device, 12 ... Semiconductor laser element, 14 ... Light source part, 22 ... Support body, 24 ... Radiating fin, 38 ... Light transmission window, 44 ... Resin part.

Claims (7)

[Claims] 1. A support, which is elongated and has heat dissipation fins extending in the longitudinal direction, is arranged along the longitudinal direction of the support, and is thermally connected to the support. A plurality of light emitting elements, a light transmitting member through which light emitted from the light emitting element is transmitted, and a cover that is provided on the support so as to surround the light emitting element, supports the light transmitting member, and seals the light emitting element And a light-emitting device. 2. The light emitting device according to claim 1, wherein the light emitting element is a semiconductor laser element. 3. The light emitting device according to claim 1, wherein the support has a plurality of rows of the heat radiation fins. 4. The light emitting device according to claim 1, wherein the support is a tubular body, and a part of the tubular body serves as a radiation fin. 5. The light emitting device according to claim 1, further comprising a cooling pipe that is in contact with the heat radiation fin and through which a coolant flows. 6. A temperature measuring unit for measuring temperature of the support to obtain temperature data, an internal light amount measuring unit for measuring light amount inside the light transmitting member to obtain internal light amount data, and the cover. External light quantity measuring means for measuring the external light quantity to obtain external light quantity data, and based on at least one of the temperature data, the internal light quantity data and the external light quantity data, the light emission output of the light emitting element and the light emission time. And a control means for controlling at least one of the light emission patterns, the light emitting device according to claim 1. 7. The light emitting device according to claim 1, wherein the cover is molded with resin.