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基板にＶ溝と位置決めマークを形成し、該位置決めマークを利用してダイシングすることを特徴とする光導波路デバイスの製造方法。 A method of manufacturing an optical waveguide device, wherein a V-groove and a positioning mark are formed on a substrate, and dicing is performed using the positioning mark.Ｖ溝と位置決めマークを有する基板。A substrate having a V-groove and a positioning mark.光導波路デバイス製造用の請求項２記載の基板。The substrate according to claim 2 for manufacturing an optical waveguide device.位置決めマークが、Ｖ溝の形成と同時に異方性エッチングにより形成された凹部である請求項２または３記載の基板。4. The substrate according to claim 2, wherein the positioning mark is a recess formed by anisotropic etching simultaneously with the formation of the V groove.請求項２〜４のいずれか１項記載の基板上に下部クラッド層、光導波路及び上部クラッド層を形成した光導波路デバイス。An optical waveguide device in which a lower cladding layer, an optical waveguide, and an upper cladding layer are formed on the substrate according to claim 2.
JP2002085309A2002-03-262002-03-26Manufacturing method of light guide device
PendingJP2003279777A
(en)
Substrate comprising two antireflective silicone resin layers between an organic layer and a photoresist layer, method for producing the same and patterning process using the same