JP2003273547A - Substrate apparatus, substrate-supporting member, and portable electronic equipment - Google Patents

Substrate apparatus, substrate-supporting member, and portable electronic equipment

Info

Publication number
JP2003273547A
JP2003273547A JP2002069220A JP2002069220A JP2003273547A JP 2003273547 A JP2003273547 A JP 2003273547A JP 2002069220 A JP2002069220 A JP 2002069220A JP 2002069220 A JP2002069220 A JP 2002069220A JP 2003273547 A JP2003273547 A JP 2003273547A
Authority
JP
Japan
Prior art keywords
substrate
connector
spacer
metal frame
supporting member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002069220A
Other languages
Japanese (ja)
Inventor
利昭 ▲齊▼藤
Toshiaki Saito
Hiroshi Hamanaka
拓 浜中
Takeshi Sato
健 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2002069220A priority Critical patent/JP2003273547A/en
Publication of JP2003273547A publication Critical patent/JP2003273547A/en
Pending legal-status Critical Current

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Abstract

<P>PROBLEM TO BE SOLVED: To reduce size and weight of a mobile radio, and at the same time to provide a substrate-supporting member having sufficient strength for preventing damage in a connector even if excessive external force is applied. <P>SOLUTION: Upper and lower projections 203 and 204 are provided in a metal frame. Respective projections are fitted into a position control hole 401 provided on an upper substrate 101 and a position control hole 402 provided on a lower substrate 102 to fix the upper and the lower substrates. The metal frame is set to be the minimum size required for opposing force operating on the substrates. As a result, large deformation and damage can be prevented in an insertion section for allowing the connector to insert a resin molding 105 even if an excessive external force is applied to the substrates, and hence damage can be prevented in the connector. <P>COPYRIGHT: (C)2003,JPO

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は基板支持部材に関
し、例えば、複数枚のプリント基板を電気的に接続する
基板接続用コネクタを有する移動無線機等の携帯電子機
器に適用し得る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board supporting member, and can be applied to, for example, a mobile electronic device such as a mobile radio having a board connecting connector for electrically connecting a plurality of printed boards.

【0002】[0002]

【従来の技術】従来、プリント基板間を接続するコネク
タを保持する構造として、コネクタに外力が加わらない
ようにコネクタの周囲に補強枠を設けるか、コネクタ基
板同士の接触を防ぐために設けられた樹脂成形品におい
て、樹脂成形品に設けられた挿通部形状の挿通部にコネ
クタを挿通させ、コネクタが樹脂成型品に保持されるこ
とにより基板と樹脂成形品の位置が規制されると共に、
コネクタに加わる外力を軽減する構造が一般にとられて
いた。
2. Description of the Related Art Conventionally, as a structure for holding a connector for connecting printed boards, a reinforcing frame is provided around the connector so that an external force is not applied to the connector, or a resin provided for preventing contact between the connector boards. In the molded product, the position of the substrate and the resin molded product is regulated by inserting the connector into the insertion part of the insertion part shape provided in the resin molded product and holding the connector in the resin molded product.
A structure that reduces the external force applied to the connector has been generally adopted.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、上記従
来のコネクタを保持する構造においては、落下等により
過度の外力が加わった時には、樹脂成形品に設けられた
挿通部の大変形や破損が生じ、このため基板と樹脂成形
品の位置を規制しているコネクタ自体に直接外力が伝わ
り、コネクタの破損が生じていた。
However, in the above-mentioned conventional structure for holding the connector, when an excessive external force is applied by dropping or the like, the insertion portion provided in the resin molded product is largely deformed or damaged, Therefore, external force is directly transmitted to the connector itself that regulates the positions of the substrate and the resin molded product, and the connector is damaged.

【0004】また、コネクタの破損が生じないまでも、
半田付け部のランド剥離や半田クラック等が生じ、電気
的な接続不良が起こっていた。
Even if the connector is not damaged,
Land peeling or solder cracks at the soldering portion occurred, resulting in poor electrical connection.

【0005】これらの問題を回避するために、樹脂成形
品を金属部材にすることにより、コネクタ保持強度を向
上させることが考えられるが、小型・軽量化が望まれる
移動無線機においては好ましくない。また、半田付け部
の問題を解消するために、半田強度の向上を目的とし
て、端子間ピッチの大きいコネクタを選定することが考
えられるが、基板実装面積の拡大を招き、上記同様、移
動無線機には好ましくない。
In order to avoid these problems, it is conceivable to improve the connector holding strength by using a resin molded product as a metal member, but this is not preferable in a mobile radio device in which miniaturization and weight reduction are desired. Also, in order to solve the problem of the soldering part, it is possible to select a connector with a large pitch between terminals for the purpose of improving the solder strength, but this leads to an increase in the board mounting area, and the mobile radio Not good for

【0006】本発明はかかる点に鑑みてなされたもので
あり、移動無線機の小型・軽量化を図りつつ、過度の外
力が加わったときでもコネクタの破損を防止する十分な
強度を有する基板支持部材を提供することを目的とす
る。
The present invention has been made in view of the above circumstances, and has a substrate support having sufficient strength to prevent damage to the connector even when an excessive external force is applied while reducing the size and weight of the mobile wireless device. It is intended to provide a member.

【0007】[0007]

【課題を解決するための手段】かかる課題を解決するた
めに本発明の基板装置は、略平行に対向して配置され、
それぞれに固定されたコネクタを介して接続される第1
基板及び第2基板と、前記第1基板及び前記第2基板の
間に介挿され、前記第1基板及び前記第2基板の接触を
防止するスペーサと、前記第1基板及び前記第2基板の
間に介挿され、前記第1基板及び前記第2基板を固定す
ると共に前記スペーサを位置決めする支持部材と、を具
備する構成を採る。
In order to solve the above problems, the substrate device of the present invention is arranged so as to face each other in substantially parallel,
First connected via a fixed connector to each
A substrate and a second substrate, a spacer interposed between the first substrate and the second substrate to prevent contact between the first substrate and the second substrate, and a spacer for the first substrate and the second substrate. And a support member which is interposed between and fixes the first substrate and the second substrate and positions the spacer.

【0008】本発明の基板支持部材は、略平行に対向し
て配置され、それぞれに固定されたコネクタを介して接
続される第1基板及び第2基板の間に介挿され、前記第
1基板及び前記第2基板を支持及び固定する基板支持固
定部と、前記第1基板と前記第2基板との間に介挿され
たスペーサを固定するスペーサ固定部と、を具備する構
成を採る。
The substrate supporting member of the present invention is arranged so as to face each other substantially in parallel and is inserted between the first substrate and the second substrate which are connected to each other via the connectors fixed to the first substrate and the first substrate. And a substrate supporting / fixing unit that supports and fixes the second substrate, and a spacer fixing unit that fixes a spacer interposed between the first substrate and the second substrate.

【0009】これらの構成によれば、過度の外力が基板
に加わったとき、基板同士のずれ方向に働く力、基板間
を押しつける力等に対抗することができるので、コネク
タが破損することを防ぐことができる。
According to these structures, when an excessive external force is applied to the substrates, it is possible to counteract the force acting in the direction of displacement of the substrates, the force pressing the substrates, etc., so that the connector is prevented from being damaged. be able to.

【0010】本発明の基板支持部材は、前記スペーサに
インサート成形される構成を採る。
The substrate supporting member of the present invention has a structure in which the spacer is insert-molded.

【0011】この構成によれば、スペーサとコネクタ保
持部材が強固に結合されるため、コネクタを保持するた
めに十分な強度を確保することができる。
According to this structure, since the spacer and the connector holding member are firmly connected, it is possible to secure sufficient strength for holding the connector.

【0012】本発明の基板支持部材は、前記スペーサに
設けられた固定用爪と嵌合する形状を有する爪用凹部を
具備し、前記固定用爪を爪用凹部に嵌合して前記スペー
サを固定する構成を採る。
The substrate supporting member of the present invention comprises a claw recess having a shape for fitting with a fixing claw provided on the spacer, and the fixing claw is fitted into the claw recess to form the spacer. Adopt a fixed structure.

【0013】この構成によれば、スペーサの固定用爪を
爪用凹部に嵌合することができるので、インサート成形
できない場合でも、インサート成形できる場合と同様
に、コネクタを保持するために十分な強度を確保するこ
とができる。
According to this structure, since the fixing claw of the spacer can be fitted into the claw recess, even when the insert molding cannot be performed, the strength sufficient to hold the connector is maintained as in the case where the insert molding can be performed. Can be secured.

【0014】本発明の基板支持部材は、携帯電子機器の
基板装置を内包する筐体に前記基板装置を固定するため
の部材を挿通させ、所定の間隔をおいて複数設けられた
筐体取り付け部を具備する構成を採る。
The board supporting member of the present invention has a plurality of housing mounting portions which are provided at predetermined intervals by inserting a member for fixing the board device into a housing containing the board device of the portable electronic device. The configuration including is adopted.

【0015】この構成によれば、筐体と基板とを基板支
持部材を介して結合することができるので、落下等によ
り筐体に過度の外力が加わっても、基板に加わる外力を
抑えることができる。
According to this structure, since the housing and the substrate can be coupled via the substrate supporting member, even if an excessive external force is applied to the housing due to a drop or the like, the external force applied to the substrate can be suppressed. it can.

【0016】本発明の携帯電子機器は、上記の基板装置
又は基板支持部材を具備する構成を採る。
A portable electronic device of the present invention has a structure including the above-mentioned substrate device or substrate supporting member.

【0017】この構成によれば、過度の外力が基板に加
わったとき、基板同士のずれ方向に働く力、基板間を押
しつける力等に対抗することができるので、コネクタが
破損することを防ぐことができる。
According to this structure, when an excessive external force is applied to the boards, it is possible to counteract the force acting in the direction of displacement between the boards and the force pressing the boards, so that the connector is prevented from being damaged. You can

【0018】本発明の基板配置方法は、略平行に対向し
て配置され、それぞれに固定されたコネクタを介して接
続される第1基板及び第2基板の固定と、前記第1基板
及び前記第2基板の間に介挿され、前記第1基板及び前
記第2基板の接触を防止するスペーサの位置決めと、を
所定の指示部材によって行うようにした。
According to the board arranging method of the present invention, the first board and the second board which are arranged in parallel and face each other and are connected to each other through the connectors fixed thereto, and the first board and the first board are fixed. Positioning of a spacer interposed between the two substrates and preventing contact between the first substrate and the second substrate is performed by a predetermined indicating member.

【0019】この方法によれば、過度の外力が基板に加
わったとき、基板同士のずれ方向に働く力、基板間を押
しつける力等に対抗することができるので、コネクタが
破損することを防ぐことができる。
According to this method, when an excessive external force is applied to the boards, it is possible to counteract the force acting in the direction of displacement between the boards and the force pressing the boards, so that the connector is prevented from being damaged. You can

【0020】[0020]

【発明の実施の形態】本発明の骨子は、金属フレームに
突起部を設け、基板に設けた位置規制穴に嵌入させるこ
とにより両基板を固定し、該金属フレームは、基板に働
く力に対抗できる必要最小限の大きさにすることであ
る。これにより、基板に過度の外力が加わったときで
も、コネクタが樹脂成形品を挿通する挿通部の大変形や
破損を防止することができ、コネクタの破損を防止する
ことができる。
BEST MODE FOR CARRYING OUT THE INVENTION The essence of the present invention is that a metal frame is provided with a protrusion, and both substrates are fixed by being fitted into a position regulating hole provided in the substrate. The metal frame opposes the force acting on the substrate. It is to make the size as small as possible. With this, even when an excessive external force is applied to the substrate, it is possible to prevent large deformation or damage of the insertion portion through which the connector inserts the resin molded product, and it is possible to prevent damage to the connector.

【0021】以下、本発明の実施の形態について、図面
を参照して詳しく説明する。
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

【0022】(実施の形態1)図1は、本発明の実施の
形態1に係る移動無線機内部の基板分解斜視図である。
この図において、上面基板101は、凹型コネクタ10
3を具備する。下面基板102は、凸型コネクタ104
を具備する。凹型コネクタ103と凸型コネクタ104
は接続可能であり、上面基板101と下面基板102と
を略平行に対向して配置し、凹型コネクタ103と凸型
コネクタ104とが接続されると上面基板101と下面
基板102に実装された電子回路が動作可能となる。樹
脂成型品105は、上面基板101と下面基板102に
各々実装された電子回路等の部品が干渉しないように、
一定の間隔を保つために設けられたスペーサである。挿
通部106は、樹脂成形品105に設けられており、凹
型コネクタ103と凸型コネクタ104を挿通させ、両
コネクタを接続するための領域である。金属フレーム1
07は、樹脂成型品105に取り付け可能な構成となっ
ており、上面基板101と下面基板102に設けられた
位置規制穴に挿通する突起部を有している。
(Embodiment 1) FIG. 1 is an exploded perspective view of a substrate inside a mobile radio device according to Embodiment 1 of the present invention.
In this figure, the upper substrate 101 is a concave connector 10
3 is provided. The lower substrate 102 is a convex connector 104.
It is equipped with. Concave connector 103 and convex connector 104
Can be connected, and the upper substrate 101 and the lower substrate 102 are arranged so as to face each other substantially in parallel, and when the concave connector 103 and the convex connector 104 are connected, the electronic devices mounted on the upper substrate 101 and the lower substrate 102 are connected. The circuit is ready for operation. The resin molded product 105 is designed so that components such as electronic circuits mounted on the upper substrate 101 and the lower substrate 102 do not interfere with each other.
It is a spacer provided to keep a constant interval. The insertion portion 106 is provided in the resin molded product 105, and is a region for inserting the concave connector 103 and the convex connector 104 to connect both connectors. Metal frame 1
Reference numeral 07 denotes a structure that can be attached to the resin molded product 105, and has a protrusion that is inserted into the position regulating holes provided in the upper substrate 101 and the lower substrate 102.

【0023】図2は、本発明の実施の形態1に係る金属
フレームの構成を示す斜視図である。図2に示すよう
に、金属フレーム107は、所定の厚みを有するベース
201と、ベース201上に所定の高さを有する基板支
持部202と、基板支持部202上に所定の間隔をおい
て設けられた突起状の2つの上部突起部203と、ベー
ス201下面に所定の間隔をおいて設けられた2つの下
部突起部204(図示せず)と、ベース201の両端に
設けられ、筐体にネジ等で固定するための筐体取り付け
部205等から構成される。
FIG. 2 is a perspective view showing the structure of the metal frame according to the first embodiment of the present invention. As shown in FIG. 2, the metal frame 107 is provided with a base 201 having a predetermined thickness, a substrate support portion 202 having a predetermined height on the base 201, and a predetermined space provided on the substrate support portion 202. Two protruding protrusions 203, two lower protrusions 204 (not shown) provided on the lower surface of the base 201 at a predetermined interval, and both ends of the base 201. It is composed of a housing attachment portion 205 and the like for fixing with screws or the like.

【0024】図3は、移動無線機内部の上面基板側から
見た透視図である。図3は、図1の上面基板101と下
面基板102との間に、樹脂成形品105と金属フレー
ム107を成形した基板Assy301(基板装置)を
示しており、凹型コネクタ103と凸型コネクタ104
が接続されている。この図において、点線で示した位置
を通るように切断した場合の断面図を図4に示す。
FIG. 3 is a perspective view of the inside of the mobile radio as viewed from the top substrate side. FIG. 3 shows a substrate Assy 301 (substrate device) in which a resin molded product 105 and a metal frame 107 are molded between the upper substrate 101 and the lower substrate 102 of FIG. 1, and the concave connector 103 and the convex connector 104 are shown.
Are connected. In this figure, FIG. 4 shows a cross-sectional view taken along a dotted line.

【0025】図4は、本発明の実施の形態1に係るコネ
クタ保持構造の構成を示した断面図である。図4におい
て、図1と共通する部分には、図1と同じ符号を付し、
その詳しい説明は省略する。
FIG. 4 is a sectional view showing the structure of the connector holding structure according to the first embodiment of the present invention. 4, parts common to FIG. 1 are assigned the same reference numerals as in FIG.
The detailed description is omitted.

【0026】金属フレーム107は、上部突起部203
と下部突起部204を有し、上部突起部203は上面基
板101に設けられた位置規制穴401に嵌入され、下
部突起部204は下面基板102に設けられた位置規制
穴402に嵌入される。金属フレーム107に設けられ
た2つの上部突起部203は、所定の間隔をおいて設け
られており、2つの下部突起部204も同様に所定の間
隔をおいて設けられている。また、金属フレーム107
の材質は金属である。これらのことから、金属フレーム
107は、上面基板101と下面基板102のずれ方向
に働く力に十分対抗し得るので、基板同士のずれを抑え
ることができる。
The metal frame 107 has an upper protrusion 203.
The upper protrusion 203 is fitted in the position regulating hole 401 provided in the upper substrate 101, and the lower protrusion 204 is fitted in the position regulating hole 402 provided in the lower substrate 102. The two upper protrusions 203 provided on the metal frame 107 are provided at a predetermined interval, and the two lower protrusions 204 are also provided at a predetermined interval. Also, the metal frame 107
Is made of metal. From these things, the metal frame 107 can sufficiently oppose the force acting in the displacement direction between the upper substrate 101 and the lower substrate 102, so that the displacement between the substrates can be suppressed.

【0027】また、金属フレーム107には、基板支持
部202が設けられており、基板に実装された電子回路
等が干渉しないように設けられた樹脂成形品105と同
様に、基板間の干渉を抑えるために基板間に合わさる高
さを有している。これにより、基板間を押しつける力が
働いたときでも、コネクタの圧壊を防ぐことができると
共に、基板に実装された電子回路等が接触により損壊す
ることを防ぐことができる。
Further, the metal frame 107 is provided with a board supporting portion 202, which prevents interference between the boards in the same manner as the resin molded product 105 provided so that electronic circuits mounted on the boards do not interfere with each other. It has a height that fits between the substrates to hold it down. This makes it possible to prevent the connector from being crushed even when a force pressing between the substrates is exerted, and also to prevent the electronic circuit or the like mounted on the substrates from being damaged by contact.

【0028】また、金属フレーム107のベース201
は、所定の厚みを有し、樹脂成型品105と下面基板1
02との間に隙間なく設置される。これにより、落下等
によって、樹脂成形品105の挿通部が大変形を起こす
ほどの過度の外力が基板に加わったときでも、コネクタ
の損壊を防ぐことができる。
Further, the base 201 of the metal frame 107
Has a predetermined thickness, and the resin molded product 105 and the lower substrate 1
It will be installed without a gap between it and 02. This makes it possible to prevent the connector from being damaged even when an excessive external force is applied to the substrate such that the insertion portion of the resin molded product 105 is largely deformed due to a drop or the like.

【0029】このように、金属フレーム107を設ける
ことにより、従来、コネクタが有していた基板と樹脂成
形品105の位置を規制する機能を金属フレーム107
が担うことになり、同時に、上述したように基板に働く
外力を吸収することができるので、挿通部の大変形や破
損を防ぐことができる。これにより、コネクタの破損を
防止することができる。
As described above, by providing the metal frame 107, the metal frame 107 has a function of restricting the positions of the substrate and the resin molded product 105, which is conventionally provided in the connector.
At the same time, since the external force acting on the substrate can be absorbed as described above, it is possible to prevent large deformation and damage of the insertion portion. This can prevent the connector from being damaged.

【0030】図5は、本発明の実施の形態1に係るイン
サート成形による成形品構造を示す斜視図である。成形
品Assy501は、樹脂成形品105に金属フレーム
107をインサート成形することにより、一体化したも
のである。このように、樹脂成形品105と金属フレー
ム107を一体成形することにより、両者は強固に結合
されるため、さらに十分な強度を有するコネクタ保持構
造を提供することができる。
FIG. 5 is a perspective view showing a structure of a molded product by insert molding according to the first embodiment of the present invention. The molded product Assy 501 is formed by insert-molding the metal frame 107 on the resin molded product 105 to integrate them. By integrally molding the resin molded product 105 and the metal frame 107 as described above, the two are firmly coupled to each other, so that it is possible to provide a connector holding structure having sufficient strength.

【0031】図6は、本発明の実施の形態1に係る移動
無線機の分解斜視図である。カバー筐体601は、表示
部及び操作ボタン等を備えており、ケース筐体602
は、カバー筐体601と組み合わせることにより、移動
無線機の筐体を構成する。基板Assy301は、カバ
ー筐体601とケース筐体602に挟み込まれて取り付
けられ、移動無線機本体を構成する。基板Assy30
1は、金属フレーム107を備えており、金属フレーム
107は、筐体取り付け部205を有している。取り付
けネジ603は、カバー筐体601、基板Assy30
1、ケース筐体602を固定することができる。この様
子を示したのが、図7に示す断面図である。図7では、
取り付けネジ603がケース筐体602に設けられたネ
ジ穴と、金属フレーム107に設けられた筐体取り付け
部205を貫通し、カバー筐体601に設けられたネジ
穴まで達していることがわかる。これにより、カバー筐
体601及びケース筐体602に加わる外力は、金属フ
レーム107に設けられた筐体取り付け部205と両筐
体との結合により吸収されるため、基板Assy301
へ加わる外力を抑えることができる。従って、筐体内で
のコネクタ保持強度を更に向上させることができる。
FIG. 6 is an exploded perspective view of the mobile radio device according to the first embodiment of the present invention. The cover housing 601 includes a display portion, operation buttons, and the like, and a case housing 602.
Forms a mobile radio housing by combining with the cover housing 601. The substrate Assy 301 is attached by being sandwiched between the cover housing 601 and the case housing 602, and constitutes the mobile radio main body. Substrate Assy30
1 includes a metal frame 107, and the metal frame 107 includes a housing attachment portion 205. The mounting screws 603 are used for the cover housing 601 and the substrate Assy 30.
1. The case housing 602 can be fixed. This state is shown in the sectional view of FIG. In Figure 7,
It can be seen that the mounting screw 603 penetrates the screw hole provided in the case housing 602 and the housing mounting portion 205 provided in the metal frame 107 and reaches the screw hole provided in the cover housing 601. As a result, the external force applied to the cover housing 601 and the case housing 602 is absorbed by the connection between the housing mounting portion 205 provided on the metal frame 107 and both housings.
The external force applied to can be suppressed. Therefore, the connector holding strength in the housing can be further improved.

【0032】このように本実施の形態によれば、金属フ
レームに設けた突起部を基板に設けた位置規制穴に嵌入
させ、両基板を固定し、基板に働く力に対抗できる必要
最小限の大きさの金属フレームにすることで、基板に過
度の外力が加わったときでも、コネクタの破損を防止す
る軽量な基板支持部材を提供することができる。
As described above, according to this embodiment, the protrusions provided on the metal frame are fitted into the position regulating holes provided on the substrates to fix both the substrates, and the necessary minimum force that can oppose the force acting on the substrates. By using a metal frame having a size, it is possible to provide a lightweight substrate supporting member that prevents damage to the connector even when an excessive external force is applied to the substrate.

【0033】(実施の形態2)この実施の形態では、イ
ンサート成形できない場合でも、インサート成形できる
場合と同様に、十分な強度を有するコネクタ保持構造に
ついて説明する。
(Embodiment 2) In this embodiment, a connector holding structure having sufficient strength will be described as in the case where insert molding is not possible, just as when insert molding is possible.

【0034】図8は、実施の形態2に係る金属フレーム
及び樹脂成形品の構成を示す斜視図である。この図は、
下面基板側から見た場合を示しており、樹脂成形品80
1に固定爪803を設け、金属フレーム802に爪用凹
部804を設けた。固定爪803は、インサート成形で
きない金属フレーム802を固定するために設けた爪状
の突起である。
FIG. 8 is a perspective view showing the structure of the metal frame and the resin molded product according to the second embodiment. This figure is
Shown is the case viewed from the bottom substrate side.
1, a fixed claw 803 is provided, and a metal frame 802 is provided with a claw recess 804. The fixed claw 803 is a claw-shaped projection provided to fix the metal frame 802 that cannot be insert-molded.

【0035】図9は、本発明の実施の形態2に係る金属
フレーム802の構成を示す斜視図である。
FIG. 9 is a perspective view showing the structure of the metal frame 802 according to the second embodiment of the present invention.

【0036】爪用凹部804は、樹脂成形品801に設
けられた固定爪803が合わさる形状になっている。
The claw recess 804 has a shape in which a fixed claw 803 provided on the resin molded product 801 is fitted.

【0037】図10は、本発明の実施の形態2に係る移
動無線機内部の上面基板側から見た透視図である。図1
0は、図1の上面基板101と下面基板102との間
に、樹脂成形品801と金属フレーム802を成形し、
凹型コネクタ103と凸型コネクタ104で接続した様
子を示している。この図において、点線で示した位置を
通るように切断した場合の断面図を図11に示す。
FIG. 10 is a perspective view seen from the top substrate side inside the mobile radio device according to the second embodiment of the present invention. Figure 1
0 molds a resin molded product 801 and a metal frame 802 between the upper substrate 101 and the lower substrate 102 of FIG.
The state where the concave connector 103 and the convex connector 104 are connected is shown. In this figure, FIG. 11 shows a cross-sectional view taken along a dotted line.

【0038】図11は、本発明の実施の形態2に係るコ
ネクタ保持構造の構成を示した断面図である。図11に
おいて、図4と共通する部分には、図4と同じ符号を付
し、その詳しい説明は省略する。この図において、固定
爪803と爪用凹部804は合わさって一体化してお
り、金属フレーム802が固定されている。これによ
り、インサート成形できない場合でも、十分な強度を有
するコネクタ保持構造を実現できる。
FIG. 11 is a sectional view showing the structure of the connector holding structure according to the second embodiment of the present invention. 11, the same parts as those in FIG. 4 are denoted by the same reference numerals as those in FIG. 4, and detailed description thereof will be omitted. In this figure, the fixed claw 803 and the claw recess 804 are combined and integrated, and the metal frame 802 is fixed. As a result, a connector holding structure having sufficient strength can be realized even when insert molding cannot be performed.

【0039】このように本実施の形態では、金属フレー
ムと樹脂成形品をインサート成形できない場合でも、金
属フレームに爪用凹部を設け、樹脂成形品に固定爪を設
け、両者を合わせることにより、インサート成形できる
場合と同様に十分な強度を有する基板支持部材を提供す
ることができる。
As described above, in the present embodiment, even when the metal frame and the resin molded product cannot be insert-molded, the metal frame is provided with the claw recess, the resin molded product is provided with the fixed claw, and the two are combined to form the insert. It is possible to provide a substrate supporting member having sufficient strength as in the case of being moldable.

【0040】なお、上述した各実施の形態では、移動無
線機を例に挙げ説明したが、本発明はこれに限らず、広
く携帯電子機器に適用し得る。
In each of the above-described embodiments, the mobile radio device is described as an example, but the present invention is not limited to this, and can be widely applied to portable electronic devices.

【0041】また、上述した各実施の形態では、金属フ
レームとして金属を例に挙げ説明したが、本発明はこれ
に限らず、基板に過度の外力が加わった場合の衝撃に耐
え得る材質であれば何でもよい。
Further, in each of the above-described embodiments, the metal frame has been described by using metal as an example, but the present invention is not limited to this, and any material can be used as long as it can withstand an impact when an excessive external force is applied to the substrate. Anything is fine.

【0042】[0042]

【発明の効果】以上説明したように、本発明によれば、
金属フレームに設けた突起部を基板に設けた位置規制穴
に嵌入させ、両基板を固定し、基板に働く力に対抗でき
る必要最小限の大きさの金属フレームにすることによ
り、コネクタに過度の外力が加わったときでも、コネク
タの破損を防止することができる軽量な基板支持部材を
提供することができる。
As described above, according to the present invention,
By inserting the protrusion provided on the metal frame into the position regulation hole provided on the board, fixing both boards, and by making the metal frame of the minimum necessary size that can counteract the force acting on the board, excessive connector It is possible to provide a lightweight substrate support member capable of preventing damage to the connector even when an external force is applied.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施の形態1に係る移動無線機内部の
基板分解斜視図
FIG. 1 is an exploded perspective view of a substrate inside a mobile wireless device according to a first embodiment of the present invention.

【図2】本発明の実施の形態1に係る金属フレームの構
成を示す斜視図
FIG. 2 is a perspective view showing the configuration of the metal frame according to the first embodiment of the present invention.

【図3】本発明の実施の形態1に係る移動無線機内部の
上面基板側から見た透視図
FIG. 3 is a perspective view seen from the top substrate side inside the mobile wireless device according to the first embodiment of the present invention.

【図4】本発明の実施の形態1に係るコネクタ保持構造
の構成を示す断面図
FIG. 4 is a sectional view showing the configuration of the connector holding structure according to the first embodiment of the present invention.

【図5】本発明の実施の形態1に係るインサート成形に
よる成形品構造を示す斜視図
FIG. 5 is a perspective view showing a structure of a molded product by insert molding according to the first embodiment of the present invention.

【図6】本発明の実施の形態1に係る移動無線機の分解
斜視図
FIG. 6 is an exploded perspective view of the mobile wireless device according to the first embodiment of the present invention.

【図7】本発明の実施の形態1に係るコネクタ保持構造
の構成を示す断面図
FIG. 7 is a cross-sectional view showing the configuration of the connector holding structure according to the first embodiment of the present invention.

【図8】本発明の実施の形態2に係る金属フレーム及び
樹脂成形品の斜視図
FIG. 8 is a perspective view of a metal frame and a resin molded product according to the second embodiment of the present invention.

【図9】本発明の実施の形態2に係る金属フレームの構
成を示す斜視図
FIG. 9 is a perspective view showing a configuration of a metal frame according to Embodiment 2 of the present invention.

【図10】本発明の実施の形態2に係る移動無線機内部
の上面基板側から見た透視図
FIG. 10 is a perspective view seen from the top substrate side inside the mobile wireless device according to the second embodiment of the present invention.

【図11】本発明の実施の形態2に係るコネクタ保持構
造の構成を示す断面図
FIG. 11 is a sectional view showing the configuration of a connector holding structure according to a second embodiment of the present invention.

【符号の説明】[Explanation of symbols]

101 上面基板 102 下面基板 103 凹部コネクタ 104 凸部コネクタ 105、801 樹脂成形品 106 挿通部 107、802 金属フレーム 201 ベース 202 基板支持部 203 上部突起部 204 下部突起部 205 筐体取り付け部 301 基板Assy 401、402 位置規制穴 501 成形品Assy 601 カバー筐体 602 ケース筐体 603 取り付けネジ 803 固定爪 804 爪用凹部 101 top substrate 102 bottom substrate 103 recessed connector 104 convex connector 105,801 Resin molded products 106 insertion part 107, 802 Metal frame 201 base 202 substrate support 203 Upper protrusion 204 Lower protrusion 205 Case attachment part 301 Substrate Assy 401, 402 Position restriction hole 501 Molded product Assy 601 cover housing 602 case housing 603 mounting screw 803 Fixed claw 804 Claw recess

───────────────────────────────────────────────────── フロントページの続き (72)発明者 佐藤 健 神奈川県横浜市港北区綱島東四丁目3番1 号 松下通信工業株式会社内 Fターム(参考) 5E348 AA03 AA16 AA32    ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Ken Sato             3-1, Tsunashima-Higashi 4-chome, Kohoku-ku, Yokohama-shi, Kanagawa             Matsushita Communication Industry Co., Ltd. F-term (reference) 5E348 AA03 AA16 AA32

Claims (7)

【特許請求の範囲】[Claims] 【請求項1】 略平行に対向して配置され、それぞれに
固定されたコネクタを介して接続される第1基板及び第
2基板と、前記第1基板及び前記第2基板の間に介挿さ
れ、前記第1基板及び前記第2基板の接触を防止するス
ペーサと、前記第1基板及び前記第2基板の間に介挿さ
れ、前記第1基板及び前記第2基板を固定すると共に前
記スペーサを位置決めする支持部材と、を具備すること
を特徴とする基板装置。
1. A first substrate and a second substrate, which are arranged in parallel and face each other and are connected to each other through connectors fixed to each other, and are interposed between the first substrate and the second substrate. A spacer that prevents contact between the first substrate and the second substrate, and a spacer that is interposed between the first substrate and the second substrate to fix the first substrate and the second substrate together with the spacer. A substrate device, comprising: a supporting member for positioning.
【請求項2】 略平行に対向して配置され、それぞれに
固定されたコネクタを介して接続される第1基板及び第
2基板の間に介挿され、前記第1基板及び前記第2基板
を支持及び固定する基板支持固定部と、前記第1基板と
前記第2基板との間に介挿されたスペーサを固定するス
ペーサ固定部と、を具備することを特徴とする基板支持
部材。
2. A first substrate and a second substrate, which are arranged substantially parallel to each other and are opposed to each other, and are connected to each other via connectors fixed to the first and second substrates, respectively. A substrate supporting member, comprising: a substrate supporting and fixing part for supporting and fixing; and a spacer fixing part for fixing a spacer interposed between the first substrate and the second substrate.
【請求項3】 前記スペーサにインサート成形されるこ
とを特徴とする請求項2に記載の基板支持部材。
3. The substrate supporting member according to claim 2, wherein the spacer is insert-molded.
【請求項4】 前記スペーサに設けられた固定用爪と嵌
合する形状を有する爪用凹部を具備し、前記固定用爪を
爪用凹部に嵌合して前記スペーサを固定することを特徴
とする請求項2に記載の基板支持部材。
4. A claw recess having a shape for fitting with a fixing claw provided on the spacer, wherein the fixing claw is fitted into the claw recess to fix the spacer. The substrate supporting member according to claim 2.
【請求項5】 携帯電子機器の基板装置を内包する筐体
に前記基板装置を固定するための部材を挿通させ、所定
の間隔をおいて複数設けられた筐体取り付け部を具備す
ることを特徴とする請求項2から請求項4のいずれかに
記載の基板支持部材。
5. A housing mounting portion is provided, in which a member for fixing the board device is inserted into a housing that houses the board device of the portable electronic device, and a plurality of housing mounting portions are provided at predetermined intervals. The substrate supporting member according to any one of claims 2 to 4.
【請求項6】 請求項1から請求項5のいずれかに記載
の基板装置又は基板支持部材を具備することを特徴とす
る携帯電子機器。
6. A portable electronic device comprising the substrate device or the substrate support member according to claim 1. Description:
【請求項7】 略平行に対向して配置され、それぞれに
固定されたコネクタを介して接続される第1基板及び第
2基板の固定と、前記第1基板及び前記第2基板の間に
介挿され、前記第1基板及び前記第2基板の接触を防止
するスペーサの位置決めと、を所定の指示部材によって
行うことを特徴とする基板配置方法。
7. The fixing of a first substrate and a second substrate, which are arranged substantially parallel to each other and are connected via connectors fixed to the respective substrates, and the first substrate and the second substrate. A method of arranging a substrate, characterized in that a spacer is inserted and the spacer for preventing contact between the first substrate and the second substrate is positioned by a predetermined pointing member.
JP2002069220A 2002-03-13 2002-03-13 Substrate apparatus, substrate-supporting member, and portable electronic equipment Pending JP2003273547A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002069220A JP2003273547A (en) 2002-03-13 2002-03-13 Substrate apparatus, substrate-supporting member, and portable electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002069220A JP2003273547A (en) 2002-03-13 2002-03-13 Substrate apparatus, substrate-supporting member, and portable electronic equipment

Publications (1)

Publication Number Publication Date
JP2003273547A true JP2003273547A (en) 2003-09-26

Family

ID=29200139

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002069220A Pending JP2003273547A (en) 2002-03-13 2002-03-13 Substrate apparatus, substrate-supporting member, and portable electronic equipment

Country Status (1)

Country Link
JP (1) JP2003273547A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023003440A1 (en) * 2021-07-23 2023-01-26 삼성전자주식회사 Electronic device comprising contact member in contact with conductive portion and substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023003440A1 (en) * 2021-07-23 2023-01-26 삼성전자주식회사 Electronic device comprising contact member in contact with conductive portion and substrate

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