JP2003260406A - Film formation method and device produced by employing the method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a film formation method capable of giving excellent adhesion properties between the surface of an object member to be treated having either characteristic of hydrophilicity or oleophilicity, and a coating material solution having the other characteristic. <P>SOLUTION: The method is for forming a coating of a prescribed pattern by applying a coating material solution containing an organic solvent to the surface of an object member to be treated showing hydrophilicity, and involves successive steps of carrying out liquid-repelling treatment against the coating material solution in portions other than the pattern formation parts of the object member to be treated (S182); radiating UV rays to the pattern formation parts of the surface of the object to be treated (S184a); applying an aqueous solution of a coupling agent (S184b); carrying out treatment for affinity with the coating material solution (S184); and applying the coating material solution to the surface of the object to be treated (S188). <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a film forming method and a device manufactured by using the method, and particularly when manufacturing devices, a pattern is generated in the vicinity of atmospheric pressure without requiring a reduced pressure environment. The present invention relates to a film forming method for forming a film and a device manufactured by this method.

[0002]

2. Description of the Related Art Conventionally, when manufacturing a semiconductor device, elements are formed on the surface of a substrate and then a wiring pattern is formed on the upper layer side of these elements. Specifically, plasma C is formed on the entire surface of the semiconductor wafer on which the insulating film is formed.
A wiring layer is formed by VD or the like. Next, a photoresist is applied to the entire surface of the wiring layer to form a resist film, which is introduced into a photolithography process and a photoetching process to perform patterning. Next, the semiconductor wafer is introduced into a dry etching process, and the wiring layer is etched using the patterned resist film as a mask. After leaving the wiring layer only in the lower layer of the resist film in this way, the resist film located in the upper layer of the wiring layer is removed by a solvent. Through these steps, the wiring pattern can be formed on the surface of the semiconductor wafer.

[0003]

On the other hand, the applicant of the present invention has filed a patent application 2 regarding the newly invented pattern forming method.
A patent application has been filed in 001-311184. 8 and 9 are explanatory views of a pattern forming method according to Japanese Patent Application No. 2001-311184. Here, FIG.
As shown in (1), a member to be processed 310 such as an interlayer insulating film.
A case where a wiring pattern is formed on the surface 312 of will be described. First, a photoresist 316 is applied to the surface of the member to be processed 310, and exposure / development is performed. As a result, as shown in FIG.
18 is formed. Next, as shown in FIG. 8C, a liquid repellent treatment is performed by forming a fluororesin polymer film on the entire surface of the member to be treated 310. Next, lyophilic treatment is performed by irradiating the groove 318 with ultraviolet rays to decompose and remove the fluororesin polymer film in that portion.

Next, a coating material solution is applied to the surface of the member to be processed 310. Specifically, the coating material solution is made into mist and sprayed from above the member to be processed 310. Here, since the surface of the resist 316 is provided with liquid repellency and the surface of the processed member 310 that is the bottom surface of the groove 318 is provided with lyophilic property, as shown in FIG. The coating material solution is deposited only on the groove 318. Then, the coating 320 is obtained by drying the coating material solution. Next, as shown in FIG. 9B, the resist and the fluororesin polymer film on the surface thereof are removed. After that, the film is annealed if necessary. As described above, as shown in FIG. 9C, the wiring pattern 31 is formed on the surface of the member to be processed 310.
4 is formed.

The above-mentioned pattern forming method is changed from the conventional method of removing a part of the coating film formed on the surface of the member to be processed by etching to the method of applying / filling the coating material solution in the groove. The pattern formation process can be performed at or near atmospheric pressure. As a result, it is not necessary to provide a vacuum facility for etching, and it is possible to reduce energy for operating the facility. Therefore, the manufacturing cost can be reduced.

As described above, Japanese Patent Application No. 2001-3111
In the pattern forming method of No. 84, the lyophilic treatment is performed by irradiating the groove for pattern formation with ultraviolet rays. Here, when the member to be processed that constitutes the bottom surface of the groove is an inorganic material, it becomes hydrophilic by irradiation with ultraviolet rays. Therefore, when a coating material solution containing an organic solvent is used, it is desired to improve the adhesion of the inorganic material to the member to be treated.

Therefore, the present invention provides good adhesion between the surface of the member to be treated, which mainly exhibits either hydrophilicity or lipophilicity, and the coating material solution, which mainly exhibits either other property. It is an object of the present invention to provide a film forming method capable of achieving high performance.

In addition, it is an object of the present invention to provide a film forming method capable of reducing the manufacturing cost, improving the patterning accuracy, and forming various kinds of films. It is also an object of the present invention to provide a device manufactured by using the above film forming method.

[0009]

In order to achieve the above-mentioned object, a film forming method according to the present invention comprises a surface of a member to be treated which mainly exhibits either hydrophilicity or lipophilicity. Is a method of forming a coating film having a predetermined pattern by applying a coating material solution mainly showing the property of the above, a solution of a lyophilic treatment agent having a hydrophilic group and a lipophilic group in the same molecule, It is configured to include a step of performing a lyophilic treatment on the coating material solution by applying the coating material solution to the pattern forming portion on the surface of the processing member, and a step of applying the coating material solution to the surface of the processing target member.

Further, a coating material solution mainly showing the other property is applied to the surface of the member to be treated which mainly shows either the hydrophilic property or the lipophilic property to form a film having a predetermined pattern. A method of applying a liquid repellent treatment to the coating material solution to a portion other than a pattern forming portion on the surface of the member to be treated, and a lyophilic treatment having a hydrophilic group and a lipophilic group in the same molecule. Applying a solution of the agent to the pattern forming portion of the surface of the member to be processed, thereby performing a lyophilic treatment on the film material solution; and a step of applying the film material solution to the surface of the member to be processed. It is configured to have ,.

By applying a solution of the lyophilic treatment agent,
Either the hydrophilic group or the lipophilic group in the molecule adheres to the surface of the member to be treated, and the other adheres to the coating material solution. Therefore, it is possible to realize good adhesion between the surface of the member to be treated which mainly exhibits one of the hydrophilic property and the lipophilic property and the coating material solution which mainly exhibits the other property. it can.

The lyophilic treatment agent may be a coupling agent. The lyophilic treatment agent may be a surfactant. The coupling agent has an organic functional group and a hydrolysis group, and the surfactant has a hydrophobic group and a hydrophilic group. Thereby, between the surface of the member to be treated mainly having one of the properties of hydrophilicity or lipophilicity, and the coating material solution mainly having the other property of the other,
Good adhesion can be realized. Further, the coating material solution can be spread and spread over the entire pattern forming portion, and the patterning accuracy can be improved.

The application of the lyophilic treatment agent solution is performed by discharging the lyophilic treatment agent solution from the slit of the liquid supply means.
A configuration may be adopted in which the liquid supply means is moved along the surface of the member to be processed while the discharged lyophilic processing agent solution is in contact with the surface of the member to be processed. Thereby, the lyophilic treatment agent solution having a desired thickness can be applied to only the surface of the member to be treated in a short time.

The lyophilic treatment agent solution may be applied by immersing the member to be treated in the lyophilic treatment agent solution tank and pulling it up. This allows the lyophilic treatment agent solution to be applied in a short time,
Manufacturing costs can be reduced.

The application of the lyophilic treatment agent solution may be carried out by ejecting the lyophilic treatment agent solution by a droplet ejection means such as an ink jet. Thereby, it becomes possible to apply many kinds of lyophilic treatment agent solutions, and it is possible to form many kinds of films.

The lyophilic treatment step may be performed after irradiating the pattern forming portion on the surface of the member to be treated with electromagnetic waves. The electromagnetic waves may be ultraviolet rays. By irradiating the pattern-formed portion on the surface of the member to be treated with an electromagnetic wave, the member to be treated mainly exhibits one of the inherent hydrophilicity and lipophilicity, so that good adhesion can be realized. In the liquid repellent treatment step, liquid repellent treatment may be performed on the coating material solution and the lyophilic treatment agent solution. Thereby, the manufacturing process can be simplified and the manufacturing cost can be reduced.

Further, the liquid repellent treatment may be performed by forming a film of a fluorine compound.
The film of the fluorine compound may be a fluororesin polymer film. The fluororesin polymer film has liquid repellency against all liquids, but can be easily decomposed and removed by irradiation with electromagnetic waves, so that the manufacturing cost can be reduced.

In the step of applying the coating material solution, the coating material solution is discharged from the slit of the liquid supply means,
A configuration may be adopted in which the liquid supply unit is moved along the surface of the member to be processed while the discharged coating material solution is in contact with the surface of the member to be processed. Thereby, the coating material solution having a desired thickness can be applied to only the surface of the member to be processed in a short time.

The coating material solution applying step may be performed by immersing the member to be treated in the coating material solution tank and pulling it up. Thereby, the coating material solution can be applied in a short time, and the manufacturing cost can be reduced.

The coating material solution applying step may be carried out by ejecting the coating material solution by a droplet discharge means such as an ink jet. Thereby, it becomes possible to apply many kinds of coating material solutions, and it is possible to form many kinds of coatings.

The film forming method according to any one of claims 1 to 13 may be performed, and then the step of drying the coating material solution may be performed. After carrying out the film forming method according to any one of claims 1 to 13,
A configuration may be employed in which the step of removing the mask formed on the portion other than the pattern formation portion is performed. After carrying out the film forming method according to any one of claims 1 to 13,
A configuration may be employed in which a step of annealing the coating material is performed. Thereby, a desired film can be obtained.

The coating material solution may be a resist. The coating material solution may be polyimide. The coating material solution is
The liquid crystal may be configured. The coating material solution may be a sealant. For the sealant,
UV curable epoxy or the like can be used.
Then, by patterning the sealant on the surface of one glass substrate, applying liquid crystal to the inside thereof, and adhering the other glass substrate, a liquid crystal display device can be integrally formed.

The coating material solution may be an organic solvent solution of the raw material of the color filter. The coating material solution may be an organic solvent solution of an organic EL raw material. Thereby, each functional thin film can be formed with each effect mentioned above.

The coating material solution may be a solution of an ITO raw material in an organic solvent. As a raw material for ITO coating, dibutyltin diacetate (DBTD
A) and indium acetylacetonate (InAA)
It is possible to use a mixed material of, or a fine powder of ITO.

The coating material solution may be an organic solvent solution of a raw material of polysilicon. A cyclic silane compound represented by the general formula Si _n X _m can be used as a raw material for the polysilicon film. Particularly, X is preferably chlorine or bromine, and n is preferably 5 or 6. Specifically, 1,1'-biscyclopentasilane, spiro [4,4] nonasilane, spiro [4,5] decasilane, spiro [5,5] undecasilane, spiro [5,6] dodecasilane, and these A silicon compound having a SiH ₃ group in the skeleton is particularly preferable. If necessary, the above silane compound modified with a Group 3 or Group 5 element such as boron or phosphorus can also be used.

The coating material solution may be an organic solvent solution of the raw material of the aluminum coating. As a raw material for the aluminum coating, aluminum alkoxide such as poxide, aluminum ethoxide, or aluminum butoxide, aluminum acetylacetonate, or aluminum chelate such as aluminum ethylacetoacetate can be used.

The coating material solution may be an organic solvent solution of the copper coating raw material. As a raw material for the copper coating, bis (4-t-butyl-1,2-dithiophenolate) copper-tetra-n-butylammonium,
A copper chelate, an organic copper compound, etc. can be used. The coating material solution may be an organic solvent solution of a silicon dioxide raw material.

The coating material solution may be an organic solvent solution of the raw material of the low dielectric constant coating. As a raw material of the low dielectric constant film, a low dielectric constant material such as a thermosetting fluororesin or a thermosetting silicon resin, or a material capable of increasing the depletion rate of the insulating film such as SiO ₂ fine powder can be used.

On the other hand, the device according to the present invention comprises:
A structure manufactured by using the film forming method according to any one of claims 28 to 28. The device may be a semiconductor device, an electric circuit, a display module, a color filter, a light emitting element, or the like. Thus, the device can be manufactured with the above effects.

[0030]

BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of a film forming method according to the present invention and a device manufactured by using the method will be described in detail with reference to the accompanying drawings. It should be noted that what is described below is only one aspect of the embodiment of the present invention, and the present invention is not limited thereto.

The film forming method according to the present embodiment is a method of forming a film having a predetermined pattern by applying a film material solution containing an organic solvent on the surface of a member to be processed having hydrophilicity. On the part other than the pattern forming part on the surface of the member,
A step of applying a lyophobic treatment to the coating material solution and irradiating the pattern forming portion on the surface of the member to be treated with ultraviolet rays, and further applying an aqueous solution of a lyophilic treatment agent having a hydrophilic group and a lipophilic group in the same molecule By doing so, the step of performing the lyophilic treatment on the coating material solution and the step of applying the coating material solution to the surface of the member to be treated are sequentially performed. In the present embodiment, a case of forming a pattern of the light emitting layer of the organic EL element will be described as an example.

FIG. 1 shows a typical organic EL (electrolumines)
cence) element is shown. The organic EL element 11 includes an anode 18, a hole transport layer 16, a light emitting layer 14, and a cathode 12.
Are sequentially laminated. When a voltage is applied to the organic EL element 11, holes are injected from the anode toward the hole transport layer, electrons are injected from the cathode toward the light emitting layer, and the holes and electrons are recombined in the light emitting layer. As a result, light is emitted.

A transparent conductive film such as ITO is used for the anode 18, and a metal such as magnesium is used for the cathode 12. Further, for the hole transport layer 16, a phthalocyanine-based compound such as copper phthalocyanine, an aromatic amine-based compound, or the like is used. On the other hand, for the light emitting layer 14, a vapor deposition thin film material of a low molecular compound or a polymer thin film material of high molecular type is used. The low molecular weight compound is an aromatic ring compound,
It is roughly classified into a heterocyclic compound or a compound containing a special element.
Conventionally, low molecular weight materials have been superior to high molecular weight materials in device characteristics such as luminous efficiency and durability. However, recently, research and development of polymer organic EL devices have been remarkable, and characteristics and durability are catching up with low molecular materials. In this embodiment, the case where the pattern of the light emitting layer is formed of a polymer material will be described as an example.

Further, in this embodiment, an aqueous solution of a lyophilic treatment agent having a hydrophilic group and a lipophilic group in the same molecule is applied to the pattern forming portion. A coupling agent or a surfactant can be used as the lyophilic agent.

Coupling agents include silane-based, titanate-based, and aluminate-based coupling agents. Among these, the silane coupling agent has one organic functional group such as an amino group, a vinyl group or an epoxy group, and two or three hydrolyzable groups such as RO (R is a methyl group or an ethyl group) or Cl. , Bound to a silicon atom. As described above, the silane coupling agent has a hydrolyzable group having an affinity for an inorganic substance and an organic functional group having an affinity for an organic substance in the same molecule. Therefore, the silane coupling agent should be interposed between the inorganic substance and the organic substance. Due to
The adhesion between the two can be improved.

On the other hand, the surfactant changes the properties of the interface with a hydrophobic group and a hydrophilic group in the same molecule,
It exhibits various effects such as solubilization, emulsification, hydration, dispersion and wetting. Surfactants are anionic (anionic), nonionic (nonionic), cationic (cationic), cationic (cationic), depending on the ionicity of the hydrophobic group when dissolved in water.
And zwitterionic system.

In the liquid repellent treatment of this embodiment, a fluororesin polymer film having liquid repellent property against the coating material solution is formed. As the raw material liquid, a liquid organic substance composed of a linear PFC such as Fluorinert (C ₈ F ₁₈ ) is used. When the straight-chain PFC gas is turned into plasma, a part of the main chain is cut and activated, and the active P that has reached the surface of the member to be treated is activated.
The FC gas is polymerized to form a fluororesin polymer film on the surface of the member to be treated.

Since it is difficult to maintain discharge with a PFC having a large molecular weight, the discharge can be maintained easily by adding a rare gas such as Ar. Further, when activated CF ₄ having a smaller molecular weight than that of the raw material liquid is added, active fluorine is incorporated into the polymer film even if part of the fluorine of the fluorocarbon is released, so that the liquid repellency of the polymer film is improved. be able to.

Besides the fluororesin polymer film, a liquid-repellent film such as a silicone resin polymer film may be formed. However, it is preferable to form a coating film that is volatile to electromagnetic waves such as ultraviolet rays and that can be easily subjected to lyophilic treatment.

The following liquid repellent treatment device is used to form the fluororesin polymer film. FIG. 2 shows an explanatory view of the liquid repellent treatment device. The liquid repellent treatment device 130 has a treatment chamber 131, and the member to be treated 10 is arranged on a treatment stage 132 provided in the treatment chamber 131. Further, high-frequency electrodes 134 are provided above and below the processing chamber 131,
It is connected to a high frequency power supply 135.

Further, in the processing chamber 131, the flow rate control valve 112
Via the supply pipe 102 provided with
4 is connected. The processing gas supply unit 104 is C ₈
It has a container 108 for storing a liquid organic substance 106 composed of a linear PFC such as F ₁₈ . Further, the container 108 is provided with a heater 110 which serves as a heating unit, so that the liquid organic substance 106 can be heated and vaporized. Further, on the downstream side of the flow control valve 112 of the supply pipe 102,
A carrier gas supply unit 118 is connected via a carrier pipe 116 having a flow rate control valve 114. A rare gas such as Ar is used as the carrier gas. Figure 2
As shown by the broken line in FIG. 2, the supply pipe 102 may be connected to the second processing gas supply unit 124 via the pipe 122 having the flow rate control valve 120. In this case, the second
CF ₄ is added to the vapor of the liquid organic substance 106 as the second processing gas from the processing gas supply unit 124. And the processing chamber 1
In 31, the Ar gas is first activated by the high frequency power,
Further, the raw material gas or the like is turned into plasma to form a fluororesin polymer film on the surface of the member to be treated 10.

By the way, in the above-mentioned liquid repellent treatment apparatus, the fluororesin polymer film is also formed on the pattern forming portion on the surface of the member to be treated. Therefore, in order to remove the fluororesin polymer film in the pattern formation portion, ultraviolet rays are irradiated. The ultraviolet rays break the bonds of the fluororesin polymer film to decompose it, and also decompose and remove organic substances such as resist adhering to the portion. As a result, the member to be treated, which is an inorganic substance, is exposed at the portion irradiated with ultraviolet rays, and the portion becomes hydrophilic. Since only the pattern forming portion is irradiated with ultraviolet rays, an ultraviolet irradiation mask is used in which the portion corresponding to the pattern forming portion is the light transmitting portion and the portion other than the wiring pattern forming portion is the light shielding portion.

On the other hand, to apply the coating material solution onto the surface of the member to be treated, the liquid supply means shown in FIG. 3 is used. The liquid supply means 5 has a slit-shaped liquid supply port 5a at the tip thereof.
Is formed so that the coating material solution can be continuously supplied from the liquid supply port 5a. The liquid supply port 5a
The opening width is about 0.3 mm, and the opening length is about 150 to 500 mm.

Next, a specific procedure of the film forming method according to this embodiment will be described. FIG. 4 shows a flowchart of the film forming method according to this embodiment. 5 and 6 are process diagrams of the film forming method according to this embodiment. It should be noted that description of portions having the same configurations as those of the present embodiment will be omitted.

First, a surface treatment such as cleaning of the member to be treated is carried out if necessary (S180). Next, as shown in FIG. 5A, the liquid repellent treatment is applied to the entire surface of the member to be treated 10 (S182). Specifically, the fluororesin polymer film 22 having liquid repellency is formed on the entire surface of the member to be processed 10.
For example, C ₈ F ₁₈ as a source gas is supplied at 24 ccm,
Further, Ar and CF4 are supplied at 150 ccm each. Then, high frequency power of 27.13 MHz is applied to turn the source gas into plasma. By performing this for about 1 minute, the fluororesin polymer film 2 of about 100 angstroms is formed.
2 is formed.

Next, as shown in FIG. 5B, the organic EL
A lyophilic treatment is applied to the pattern forming portion of the element (S18).
4). Specifically, the fluororesin polymer film 22 is irradiated with ultraviolet rays through a mask whose portion corresponding to the pattern forming portion is a light transmitting portion. (S184a). For example, wavelength 17
Irradiate with 2 nm ultraviolet light for 5 minutes. As a result, the fluororesin polymer film 22 formed on that portion is decomposed and removed. Further, the impurities attached to the relevant portion are decomposed and removed, and the hydrophilic property of the member to be processed 10 which is an inorganic substance is exhibited.

Next, as shown in FIG. 5C, the lyophilic treatment agent solution 24 is applied to the entire surface of the member 10 to be treated (S).
184b). The coupling agent, aminosilane, is used as the solute of the lyophilic treatment agent solution, and water is used as the solvent. This lyophilic treatment agent solution 24 is applied to the entire surface of the member to be treated 10 by the liquid supply means 5 shown in FIG. Specifically, the liquid supply port 5a of the liquid supply means 5 is connected to the member 10 to be processed.
, The lyophilic treatment agent solution 24 is discharged from the liquid supply port 5a, and its tip is brought into contact with one end of the surface of the member to be treated 10. The distance between the liquid supply port 5a of the liquid supply means 5 and the surface of the member to be processed is 0.5 m, for example.
m. Then, with the tip of the lyophilic treatment agent solution 24 in contact with the surface of the member to be processed, the liquid supply means 5 is moved to the other end of the surface of the member to be processed. The moving speed is, eg, 5 mm / s.

Here, since the surface of the member to be processed 10 in the pattern forming portion exhibits hydrophilicity by irradiation with ultraviolet rays, the lyophilic processing agent solution 24 adheres to the surface of the member to be processed 10 by its hydrophilic group. At the same time, it spreads over the entire wiring pattern formation portion. On the other hand, since the fluororesin polymer film 22 formed on the portion other than the wiring pattern forming portion has liquid repellency to the lyophilic treatment agent solution 24, the lyophilic treatment agent solution 24 does not adhere to the portion.

In addition to the application of the lyophilic treatment agent solution by the liquid supply means, the lyophilic treatment agent solution may be applied by immersing and pulling up the member to be treated in the lyophilic treatment agent solution tank. Further, the lyophilic treatment agent solution may be applied by a droplet discharge means such as an inkjet.

Here, the droplets of the lyophilic treatment agent solution existing in the portion other than the wiring pattern forming portion are removed (S18).
5). Since the fluororesin polymer film 22 having liquid repellency is formed on the portion other than the wiring pattern forming portion, the droplets of the lyophilic treatment agent solution existing on the portion can be easily removed. Specifically, the droplets may be removed by rotating the member 10 to be processed. Besides that,
Droplets can be removed by inclining the member 10 to be processed and by blowing gas onto the surface of the member 10 to be processed.

Next, as shown in FIG. 6A, the coating material solution 26 is applied (S188). A polymer light emitting layer material is used as the solute of the coating material solution 26, and trimethylbenzene (aromatic) is used as the solvent. Then, the coating material solution is discharged onto the pattern forming portion by a droplet discharging means such as an inkjet. Here, the lyophilic treatment agent solution 24 applied to the pattern forming portion is in close contact with the surface of the member to be treated due to the hydrophilic group thereof, so the lyophilic treatment agent solution 2
A lipophilic group appears on the surface of No. 4. Therefore, the coating material solution 26 containing the organic solvent adheres to the surface of the lyophilic treatment agent solution 24 and spreads over the entire pattern formation portion. On the other hand, since the fluororesin polymer film 22 formed on the portion other than the wiring pattern forming portion has liquid repellency to the coating material solution 26, the coating material solution 26 is formed on the portion.
Does not adhere.

Note that the coating material solution may be applied by immersing the member to be treated in a coating material solution tank and pulling it up, instead of applying the coating material solution by a droplet discharging means such as an inkjet. Further, the coating material solution may be applied by slit coating using the liquid supply means 5 of FIG. Here, the droplets of the lyophilic treatment agent solution existing in the portion other than the pattern formation portion are removed (S190). The specific method is the same as step 185.

Next, as shown in FIG. 6B, the coating material solution is dried (S192). Specifically, the coating material solution is heated to evaporate the organic solvent. For example, 100
Dry at 0 ° C for 10 minutes. Next, as shown in FIG. 6C, the fluororesin polymer film 22 is removed (S194). Specifically, as in the case of lyophilic treatment, electromagnetic waves such as ultraviolet rays are irradiated to decompose and remove the fluororesin polymer film. For example, ultraviolet rays having a wavelength of 172 nm are irradiated for 5 minutes. As described above, the light emitting layer 28 of the organic EL element is formed.

In the film forming method according to this embodiment described above,
A method of forming a film having a predetermined pattern by applying a coating material solution mainly showing the other property to the surface of a member to be treated which mainly shows either the hydrophilic property or the lipophilic property, A step of subjecting the surface of the member to be treated other than the pattern forming portion to a liquid repellent treatment for the coating material solution, and irradiating the pattern forming portion of the member to be treated with electromagnetic waves,
Further, a step of applying a lyophilic treatment to the coating material solution by applying an aqueous solution of a lyophilic treatment agent having a hydrophilic group and a lipophilic group in the same molecule, and applying the coating material solution to the surface of the member to be treated. The step of performing and the step of performing are sequentially performed.

By irradiating the pattern forming portion on the surface of the member to be treated with electromagnetic waves, the member to be treated exhibits either the inherent hydrophilic property or the lipophilic property. By applying an aqueous solution of a lyophilic treatment agent, either the hydrophilic group or the lipophilic group in the molecule adheres to the surface of the member to be treated and the other adheres to the coating material solution. Therefore, it is possible to realize good adhesion between the surface of the member to be treated which mainly has one of the hydrophilic property and the lipophilic property and the coating material solution which mainly has the other property. it can.

The coupling agent as the lyophilic treatment agent has an organic functional group and a hydrolyzable group. The surfactant as the lyophilic treatment agent has a hydrophobic group and a hydrophilic group. Therefore, it is possible to realize good adhesion between the surface of the member to be treated which mainly exhibits one of the hydrophilic property and the lipophilic property and the coating material solution which mainly exhibits the other property. it can. In addition, the coating material solution is spread and spread over the entire pattern forming portion, so that highly accurate patterning can be realized.

The film forming method of the present invention is used in a device manufacturing process, and a structure having a functional thin film formed on a substrate by the method is, for example, a semiconductor device, an electric circuit, a display module, a light emitting element, or the like. Applies to devices. An example thereof is shown in FIG. FIG. 7 is a schematic diagram of, for example, a semiconductor device, an electric circuit, a display module, and a light emitting element. In FIG. 7, the functional thin film 214 of the semiconductor device and the electric circuit is, for example, a metal thin film of a wiring pattern, and the functional thin film 214 of the display body module is
For example, it is an organic molecular film of a color filter. Although FIG. 7 shows an example of the color filter, there is no difference in forming another functional thin film using the film forming method of the present invention.
The functional thin film 214 of the light emitting element is, for example, a thin film of organic EL used for the light emitting layer. Needless to say, each electrode of the organic EL can be formed by using the film forming method of the present invention. The thickness of each functional thin film is arbitrary depending on the intended use of the fine structure, but is preferably 0.02 to 4 μm. The films to which the film forming method of the present invention is applied have high quality, and are superior to the conventional methods in terms of simplification of the manufacturing process and manufacturing cost.

[0058]

EFFECT OF THE INVENTION A coating material solution mainly showing the other property is applied to the surface of a member to be treated which mainly shows either the hydrophilic property or the lipophilic property to form a film having a predetermined pattern. In the method, a solution of a lyophilic treatment agent having a hydrophilic group and a lipophilic group in the same molecule is applied to the pattern forming portion on the surface of the member to be treated, thereby providing a hydrophilic material for the coating material solution. Since it is configured to have a step of performing a liquid treatment and a step of applying the coating material solution to the surface of the member to be treated, the member to be treated mainly showing either one of hydrophilicity and lipophilicity. Good adhesion can be realized between the surface and the coating material solution mainly showing the other property.

[Brief description of drawings]

FIG. 1 is an explanatory diagram of an organic EL element.

FIG. 2 is an explanatory diagram of a liquid repellent treatment device.

FIG. 3 is an explanatory diagram of a liquid supply unit.

FIG. 4 is a flowchart of a film forming method according to an embodiment.

FIG. 5 is a first explanatory diagram of a film forming method according to an embodiment.

FIG. 6 is a second explanatory view of the film forming method according to the embodiment.

FIG. 7 is an explanatory diagram of a fine structure.

FIG. 8 is a first explanatory diagram of a pattern forming method according to Japanese Patent Application No. 2001-311184.

FIG. 9 is a second explanatory view of the pattern forming method according to Japanese Patent Application No. 2001-311184.

[Explanation of symbols]

5 ... Liquid supply means 5a ... Liquid supply port 10 ......... Processed member 11 ... Organic EL element 12 ………… Cathode 14 ... Light-emitting layer 16 ... Hole transporting layer 18 ... Anode 22 ... Fluorine resin polymer film 24 ………… Lyophilic treatment agent solution 26 ... Coating solution 28: Light emitting layer 102 ... Supply piping 104 ... Processing gas supply unit 106 ... Liquid organic matter 108 ………… Container 110 ... Heater 112 ... Flow control valve 114 ......... Flow control valve 116 ... Carrier piping 118 ... Carrier gas supply unit 120 ... Flow control valve 122 ………… Piping 124 ... Second processing gas supply unit 130 ... Repellent treatment device 131 ... Processing room 132 ... Processing stage 134 ... High-frequency electrode 135 ……… High frequency power supply 211 ... substrate 214 ... Functional thin film 220 ... Fine structure 310 ......... Processed member 312 ……… Surface 314 ... Wiring pattern 316 ... Photoresist film 318 ... Groove 320 ......... Coating

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Claims (29)

[Claims] 1. A coating film solution having a predetermined pattern is formed by applying a coating material solution mainly having the other property on the surface of a member to be treated which has one of the hydrophilic property and the lipophilic property. A method of applying a solution of a lyophilic treatment agent having a hydrophilic group and a lipophilic group in the same molecule to the pattern forming portion of the surface of the member to be treated, thereby lyophilic to the coating material solution A film forming method comprising: a step of applying a treatment; and a step of applying the coating material solution to the surface of the member to be treated. 2. A coating material solution mainly exhibiting the other property is applied to the surface of a member to be treated which mainly exhibits either the hydrophilic property or the lipophilic property to form a film having a predetermined pattern. The method, wherein the portion other than the pattern forming portion on the surface of the member to be treated,
A step of subjecting the coating material solution to a liquid repellent treatment, and applying a solution of a lyophilic treatment agent having a hydrophilic group and a lipophilic group in the same molecule to the pattern forming portion on the surface of the member to be treated. A film forming method comprising: a step of performing a lyophilic treatment on the coating material solution; and a step of applying the coating material solution to a surface of the member to be processed. 3. The film forming method according to claim 1, wherein the lyophilic treatment agent is a coupling agent. 4. The film forming method according to claim 1, wherein the lyophilic treatment agent is a surfactant. 5. The application of the lyophilic treatment agent solution is performed by discharging the lyophilic treatment agent solution from a slit of a liquid supply means and bringing the discharged lyophilic treatment agent solution into contact with the surface of the member to be treated. 5. The film forming method according to claim 1, wherein the liquid supply means is moved along the surface of the member to be processed in this state. 6. The method according to claim 1, wherein the lyophilic treatment agent solution is applied by immersing the member to be treated in a lyophilic treatment agent solution tank and pulling it up. Film forming method. 7. The composition according to claim 1, wherein the application of the lyophilic treatment agent solution is performed by ejecting the lyophilic treatment agent solution by a droplet ejection means. Membrane method. 8. The lyophilic treatment step is performed after irradiating the pattern-formed portion on the surface of the member to be treated with an electromagnetic wave.
The film forming method as described in any one of 1. 9. The film forming method according to claim 2, wherein in the liquid repellent treatment step, liquid repellent treatment is performed on the coating material solution and the lyophilic treatment agent solution. 10. The film forming method according to claim 2, wherein the liquid repellent treatment is performed by forming a film of a fluorine compound. 11. The coating material solution applying step comprises discharging the coating material solution from a slit of a liquid supply means, and contacting the discharged coating material solution with the surface of the member to be treated. The film forming method according to any one of claims 1 to 10, which is performed by moving the liquid supply unit along the surface of the member to be processed. 12. The coating material solution applying step is performed by immersing the member to be treated in a coating material solution tank and pulling it up.
0. The film forming method as described in 0. 13. The film forming method according to claim 1, wherein the coating material solution applying step is performed by discharging the coating material solution by a droplet discharging means. 14. A film forming method comprising performing the film forming method according to claim 1 and then performing a step of drying the film material solution. 15. A film forming method, comprising: performing the film forming method according to claim 1, and then performing a step of removing a mask formed on a portion other than the pattern forming portion. 16. A film forming method comprising performing a film forming method according to claim 1, and then performing a step of annealing the film material. 17. The film forming method according to claim 1, wherein the coating material solution is a resist. 18. The film forming method according to claim 1, wherein the coating material solution is polyimide. 19. The film forming method according to claim 1, wherein the coating material solution is liquid crystal. 20. The film forming method according to claim 1, wherein the coating material solution is a sealant. 21. The film forming method according to claim 1, wherein the coating material solution is an organic solvent solution of a raw material of a color filter. 22. The film forming method according to claim 1, wherein the coating material solution is an organic solvent solution of a raw material of an organic EL. 23. The film forming method according to claim 1, wherein the coating material solution is an organic solvent solution of a raw material of ITO. 24. The film forming method according to claim 1, wherein the coating material solution is an organic solvent solution of a raw material of polysilicon. 25. The coating material solution is an organic solvent solution of an aluminum coating raw material.
17. The film forming method according to any one of 1 to 16. 26. The film forming method according to claim 1, wherein the film material solution is an organic solvent solution of a raw material of a copper film. 27. The film forming method according to claim 1, wherein the coating material solution is an organic solvent solution of a raw material of silicon dioxide. 28. The film forming method according to claim 1, wherein the film material solution is an organic solvent solution of a raw material of the low dielectric constant film. 29. A device manufactured by using the film forming method according to claim 1. Description: