JP2003258466A - Power converter - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a small-sized power converter which improves heat sink characteristics and to provide the power converter which has a simple manufacturing sequence. <P>SOLUTION: The power converter comprises a power converting circuit 20 having a conductor structure via a conductive pattern and a metal board 31 for mounting a terminal 34 for electrically connecting in recesses of a heat sink fin 1 having the recesses on the upper part of a fin having a plurality of fins, a printed circuit board 2a mounting an electronic component such as a control circuit 21 for controlling the circuit 20, a terminal block 37, a through hole 35 for connecting the terminal 34, and a resin filling hole 3 for filling a resin disposed to block the upper surface of the recess of the fin 1 so that the board 2a is electrically connected to the board 31 via the terminal 34 and a space formed of the recess of the fin 11 and the board 2a is fully filled with a filling resin 38 having high insulation. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a power conversion device.

[0002]

2. Description of the Related Art FIG. 7 is a diagram showing a configuration of a conventional power converter. In the figure, 20 is a power conversion circuit for converting DC power into AC power, S1 to S6 are semiconductor elements in a three-phase bridge connection, D1 to D6 are arranged in pairs with the semiconductor elements S1 to S6, and the semiconductor elements S1 to S6 are A freewheeling diode that returns a current when turned off, and 21 is a gate drive circuit including a circuit that controls on / off of the semiconductor elements S1 to S6 of the power conversion circuit 20, a power supply circuit, and the like. P and N are DC input terminals for connecting a DC power supply (not shown), U and
V and W are AC output terminals. The conventional power converter is
A direct current power supply is connected to the direct current input terminals P and N, and a drive signal for controlling on / off of the semiconductor elements S1 to S6 of the power conversion circuit 20 is supplied from the gate drive circuit 21 to perform a switching operation to obtain a desired frequency and voltage. It is converted into AC power and output from AC output terminals U, V, W.

FIG. 8 is a diagram showing a cross-sectional structure of a conventional power converter. In the figure, 30 is a radiating fin, 31 is a metal substrate, and 32 is an insulating paint (not shown) on the metal substrate 31.
A conductive pattern formed of copper foil or the like on the top, 33 a printed wiring board, 34 a terminal for electrically connecting the metal board 31 and the printed wiring board 33, 35 a through hole for the terminal 34, and 36 a gate An electronic component such as a circuit IC and a capacitor, 37 is a terminal block for connecting an input line and an output line to the power conversion circuit 20 shown in FIG. 7, 38 is an insulating performance of the power conversion circuit 20 shown in FIG. An injection resin such as an epoxy resin to be used, 39 is an insulator frame that serves as a case portion.
Further, S1 to S6 are semiconductor elements, and D1 to D6 are freewheeling diodes arranged in pairs with the semiconductor elements S1 to S6.

The structure of a conventional power converter will be described with reference to FIGS. As the printed wiring board 33, an insulating base wiring plate in which a conductive pattern such as copper foil is formed on an insulating base such as a glass / epoxy copper clad laminate or a paper / phenol copper clad laminate has been put to practical use. Further, as the metal substrate 31, a metal base substrate having excellent heat dissipation, in which an insulating paint or the like is applied to a metal base such as aluminum and a conductive pattern such as a copper foil is formed on the upper surface thereof, has been put into practical use. The components that constitute the power conversion circuit 20, such as the semiconductor elements S1 to S6 and the freewheeling diodes D1 to D6 that generate a large amount of heat during operation, are mounted on the metal substrate 31 having good heat dissipation, and the gate drive circuit 21 including the electronic components 36 and the terminal block. 37 is mounted on the printed wiring board 33.

A procedure for manufacturing a conventional power converter will be described. (1) The insulator frame 39 is bonded near the outer periphery of the metal substrate 31. (2) Align the terminals 34 mounted on the metal board 31 with the through holes 35 of the printed wiring board 33,
The terminal 34 serves as a guide and the printed wiring board 33 serves as the insulator frame 3.
The metal substrate 31 and the printed wiring board 33 are electrically connected to each other by mounting them on the upper surface of 9 and soldering the terminals 34. (3) From the small opening (not shown) of the printed wiring board 33, the injection resin 38 is filled into the case portion constituted by the metal substrate 31, the insulating frame 39 and the printed wiring board 33 to almost the upper edge of the insulating frame 39. Fill and resin seal. (4) An integral power conversion circuit including the metal substrate 31, the insulator frame 39, and the printed wiring board 33 is attached to the radiation fin 30.
Install on.

[0006]

The conventional power conversion device has a problem in that the heat radiation is only from one direction from the radiation fin that contacts the bottom of the metal substrate, and the heat radiation characteristic is not good. Further, also in the manufacture of the power conversion device, after arranging the printed wiring board on which the electronic component is mounted via the insulating frame over the metal substrate on which the components of the power conversion circuit are mounted, and configuring the case portion, Since the injection resin is injected from the small opening of the printed wiring board, there is a problem that the insulating frame bonding process is troublesome, and it takes time to fill the gel injection resin. .

The present invention has been made to solve the above problems, and an object thereof is to obtain a small-sized power conversion device with improved heat dissipation characteristics. Moreover, it aims at obtaining the power converter device with a simple manufacturing procedure.

[0008]

SUMMARY OF THE INVENTION A power converter according to the present invention is a power converter having a fin having a plurality of fins provided with a recess in the upper portion of the fin, and an insulated metal base having a conductor structure having a conductive pattern. A metal board on which a circuit and terminals for electrical connection are mounted, electronic parts such as a control circuit for controlling the power conversion circuit, a terminal block, and the like are mounted, and a through hole for connecting to the terminal and resin injection A printed wiring board having a resin injection hole for the heat radiation fin, the metal substrate is arranged in the concave portion of the heat radiation fin, and the printed wiring board is arranged so as to close the upper surface of the concave portion of the heat radiation fin, The printed wiring board and the metal board are electrically connected via the terminals, and the space formed by the recess of the heat radiation fin and the printed wiring board is insulative. It is obtained to meet at a high injection resin.

Further, for a heat dissipation fin having a plurality of fins and a concave portion provided on an upper portion of the fin portion, a power conversion circuit having a conductor structure with an electrically conductive pattern on an insulated metal base, and a terminal and a terminal block for electrical connection. A metal board on which a metal piece is mounted, an electronic component such as a control circuit that controls the power conversion circuit, and a printed wiring board having a through hole for connecting to the terminal, and the terminal block metal piece. And a terminal block insulator that forms a terminal block having a size larger than the depth of the recess of the heat dissipation fin, the metal substrate being disposed in the recess of the heat dissipation fin, and the insulation for the terminal block. An object is arranged on the metal substrate and on one side surface side of the recess of the heat dissipation fin,
The printed wiring board is arranged so as to close the upper surface of the recess of the heat dissipation fin excluding the terminal block insulator, and the printed wiring board and the metal substrate are electrically connected via the terminals, A space formed by the recess of the heat dissipation fin except the terminal block insulator and the printed wiring board is filled with an injection resin having a high insulating property.

Also, after dissipating the heat dissipating fins having a recessed portion above the fin portion having a plurality of fins and the recesses of the heat dissipating fins and arranging the conductors of the conductive pattern, the power conversion circuit is placed on the conductors. And a board part on which terminals for electrical connection are mounted, electronic parts such as a control circuit for controlling the power conversion circuit, a terminal block, etc. are mounted, and through holes for connecting to the terminals, and resin injection A printed wiring board having a resin injection hole of, and arranging the printed wiring board so as to close the upper surface of the concave portion of the heat dissipation fin, the printed wiring board and the board portion via the terminal. By electrically connecting, the space formed by the concave portion of the heat radiation fin and the printed wiring board is filled with the injection resin having a high insulating property.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiment 1. 1 is a diagram showing a sectional structure of a power conversion device according to a first embodiment of the present invention. In the figure, 31, 32, 34 to 38, S1 to S
6, D1 to D6 are the same as those in FIG. 8, and the description thereof will be omitted. Further, 1 is a radiating fin having a recess having a depth of several millimeters above a fin portion having a plurality of fins, 2a is a printed wiring board, and 3 is an injection for injecting an injection resin 38 provided on the printed wiring board 2a. It is a resin injection hole.

On the metal substrate 31, semiconductor elements S1 to S6,
The freewheeling diodes D1 to D6 are mounted, and the power conversion circuit 20
Make up. Further, the electronic component 36 and the terminal block 37 are mounted on the printed wiring board 2a to form the gate drive circuit 21.

A procedure for manufacturing the power conversion device according to the first embodiment will be described. (1) The metal substrate 31 on which the power conversion circuit 20 is mounted is
After applying silicone grease (not shown) on the back side,
It is fixed to the recess of the upper part of the radiation fin 1 with a screw (not shown). (2) Align the terminals 34 mounted on the metal board 31 with the through holes 35 of the printed wiring board 2a,
The printed wiring board 2a is fixed to the upper ends of the radiation fins 1 by using the terminals 34 as guides, and the terminals 34 are soldered to electrically connect the metal board 31 and the printed wiring board 2a. (3) Resin injection hole 3 provided in the printed wiring board 2a
The injection resin 38 is injected into the inside by a nozzle or the like, and the heat radiation fin 1
The injection resin 38 fills the space between the concave portion and the printed wiring board 2a.

Since the radiating fin wall formed on the side surface of the concave portion of the radiating fin is used as an enclosure for the injected resin, the insulator frame in the conventional power converter is not required, and the cost of the insulator frame is reduced. In addition to saving money, the step of attaching the insulator frame can be omitted. Further, since the metal substrate is fixed to the heat radiation fin concave portion, in addition to the heat radiation from the back surface of the metal substrate, the heat radiation from the lateral direction is possible through the wall of the heat radiation fin formed on the side surface of the heat radiation fin concave portion. Therefore, the heat dissipation efficiency is improved, and the power converter can be downsized.

Embodiment 2. 2 is a diagram showing a cross-sectional structure of a power conversion device according to a second embodiment of the present invention. In the figure, 31, 32, 34 to 36, 38, S1 to S
6, D1 to D6 are the same as those in FIG. 8, and the description thereof will be omitted. Further, 1 is a radiating fin having a recess having a depth of several millimeters above a fin portion having a plurality of fins, 2b is a printed wiring board, 4 is a metal piece for a terminal block adhered to a metal board 31,
Reference numeral 5 is an insulator for the terminal block.

FIG. 3 is a perspective view of the terminal block of the power converter according to the second embodiment of the present invention. In the figure, 31 is a metal substrate, 4 is a metal piece for a terminal block which is mounted and bonded to the end of the metal substrate 31, and 5 is an insulator for the terminal block. In the first embodiment, an example in which the terminal block 37 is mounted on the printed wiring board 2a has been shown, but in the second embodiment, the terminal block metal piece 4 and the terminal block insulator 5 adhered to the metal substrate 31 are provided. The terminal block was formed by combining them.

FIG. 4 is a diagram showing a cross-sectional structure of a power conversion device according to a second embodiment of the present invention during manufacture. In the figure, 31, 32, 34 to 36, 38, S1 to S6, D
1 to D6 are the same as those in FIG. 8, and the description thereof will be omitted. Further, 1 is a radiating fin having a recess having a depth of several millimeters above the fin portion having a plurality of fins, 2b is a printed wiring board, 4 is a metal piece for a terminal block adhered to a metal board 31, and 6 is an opening. is there.

In the second embodiment, since the terminal block is formed on the metal substrate 31, the printed wiring board 2b is
The mounting area can be made smaller than the printed wiring board 2a on which the terminal block 37 shown in the first embodiment is mounted, and the size is reduced in the lateral direction. Further, an opening 6 (a space into which the terminal block insulator 5 is inserted) between the printed wiring board 2b and the wall of the heat dissipation fin formed on the side surface of the recess of the heat dissipation fin 1.
Is used as an injection resin injection hole for injecting the injection resin 38.

A manufacturing procedure of the power converter according to the second embodiment will be described with reference to FIGS. (1) After applying silicon grease or the like (not shown) on the back surface of the metal substrate 31 on which the power conversion circuit 20 and the metal piece 4 for the terminal block are mounted, screws or the like (not shown) are provided in the recesses above the heat radiation fins 1. Fixed). (2) Align the terminals 34 mounted on the metal board 31 with the through holes 35 of the printed wiring board 2b,
The printed wiring board 2b is fixed to the upper ends of the radiation fins 1 by using the terminals 34 as guides, and the terminals 34 are soldered to electrically connect the metal board 31 and the printed wiring board 2b (FIG. 3). (3) The injection resin 38 is injected from the opening 6 into which the terminal block insulator 5 is inserted by a nozzle or the like. (4) After filling the injection resin 38 with a predetermined amount, the terminal block insulator 5 is inserted. (5) Pass a screw through the screw hole of the terminal block metal piece 4 and fix it in the screw hole (not shown) provided in the terminal block insulator 5.

In the manufacture of the power converter according to the second embodiment, the radiator fin wall formed on the side surface of the recess of the radiator fin is used as an enclosure for the injected resin. The insulating frame in step 1 is not required, the cost of the insulating frame can be saved, and the step of mounting the insulating frame can be omitted. In addition, since the resin is injected from the opening obtained by making the printed wiring board 2b small in the lateral direction, a large amount of injected resin can be injected in a short time, until the injected resin is filled. The time can be shortened.

Embodiment 3. FIG. 5 is a diagram showing a cross-sectional structure of a power conversion device according to a third embodiment of the present invention. In the figure, 32, 34 to 38, S1 to S6, D1 to D6
Is the same as that in FIG. 8, and the description thereof is omitted. Further, 1 is a radiating fin having a recess having a depth of several millimeters above a fin portion having a plurality of fins, 2a is a printed wiring board, and 3 is an injection for injecting an injection resin 38 provided on the printed wiring board 2a. The resin injection hole 7 is an insulating paint. In the power conversion device according to the third embodiment, the insulating paint 7 is directly applied to the concave portion of the heat dissipation fin 1, and the power conversion device is formed thereon.

FIG. 6 is a view showing the assembly of the power conversion device according to the third embodiment of the present invention. In the figure, 1, 2
a, 3, 7, 32, 34 to 37, S1 to S6, D1 to D
6 is the same as that in FIG. 5, and the description thereof is omitted.

A manufacturing procedure of the power converter according to the third embodiment will be described with reference to FIGS. (1) The insulating paint 7 is directly applied to the concave portion on the upper part of the radiation fin 1. (2) A conductor made of a conductive pattern 32 such as copper foil is adhered to the upper portion of the insulating layer formed by the insulating paint 7. The power conversion circuit 20 including the terminals 34, the semiconductor elements S1 to S6, and the free wheeling diodes D1 to D6 is formed on the conductor formed of the conductive pattern 32 such as copper foil. (3) The electronic components 36 and the terminal block 37 are mounted on the printed wiring board 2a to form the gate drive circuit 21. (4) The position of the through hole 35 for the terminal 34 of the printed wiring board 2a is aligned, the printed wiring board 2a is fixed to the end of the heat radiation fin 1 using the terminal 34 as a guide, the terminal 34 is soldered, and the heat radiation fin 1 is attached. The power conversion circuit 20 formed in the recess is electrically connected to the printed wiring board 2a. (5) The injection resin 38 is injected into the injection resin injection hole 3 provided in the printed wiring board 2a by a nozzle or the like, and the concave portion of the heat radiation fin 1 is filled with the injection resin 38.

In the power conversion device according to the third embodiment, since the radiating fin wall formed on the side surface of the concave portion of the radiating fin is used as an enclosure for the injected resin,
The insulator frame in the conventional power converter is not required, the cost of the insulator frame can be saved, and the step of attaching the insulator frame can be omitted. In addition, since the power conversion circuit is directly formed in the radiating fin recess, the compound applied to the base plate of the metal substrate and the back surface of the metal substrate, which is disposed between the power conversion circuit and the radiating fin, can be omitted. The heat resistance is reduced, and the heat radiation efficiency in the vertical direction is further improved.

[0025]

Since the present invention is constructed as described above, it has the following effects.

The power conversion device of the present invention is a fin having a plurality of fins and a radiating fin provided with a recess in the upper portion of the fin.
A metal substrate on which a power conversion circuit having a conductor structure of a conductive pattern and terminals for electrical connection are mounted on an insulated metal base, and electronic parts such as a control circuit for controlling the power conversion circuit and a terminal block are mounted. At the same time, a printed wiring board having a through hole for connecting to the terminal and a resin injection hole for resin injection is provided, and the metal board is disposed in the recess of the heat dissipation fin, and the printed wiring board is provided. It is arranged so as to close the upper surface of the recess of the heat radiation fin, electrically connects the printed wiring board and the metal substrate via the terminal, and is formed by the recess of the heat radiation fin and the printed wiring board. Since the space is filled with injection resin with high insulation, the heat dissipation fin wall formed on the side surface of the recess of the heat dissipation fin can be used as an enclosure for injection resin. Insulator frame becomes unnecessary in the conventional power conversion apparatus, it is possible to save the cost of the insulator frame, it can be omitted the step of attaching the insulator frame. Further, since the metal substrate is fixed to the heat radiation fin concave portion, in addition to the heat radiation from the back surface of the metal substrate, the heat radiation from the lateral direction is possible through the wall of the heat radiation fin formed on the side surface of the heat radiation fin concave portion. Therefore, the heat dissipation efficiency is improved, and the power converter can be downsized and the output can be increased.

Further, for a heat radiating fin having a plurality of fins and a concave portion provided above the fin portion, a power conversion circuit having a conductor structure with an electrically conductive pattern on an insulated metal base, and terminals and terminal blocks for electrical connection. A metal board on which a metal piece is mounted, an electronic component such as a control circuit that controls the power conversion circuit, and a printed wiring board having a through hole for connecting to the terminal, and the terminal block metal piece. And a terminal block insulator that forms a terminal block having a size larger than the depth of the recess of the heat dissipation fin, the metal substrate being disposed in the recess of the heat dissipation fin, and the insulation for the terminal block. An object is arranged on the metal substrate and on one side surface side of the recess of the heat dissipation fin,
The printed wiring board is arranged so as to close the upper surface of the recess of the heat dissipation fin excluding the terminal block insulator, and the printed wiring board and the metal substrate are electrically connected via the terminals, Since the space formed by the recess of the heat dissipation fin excluding the terminal block insulator and the printed wiring board is filled with injection resin having a high insulating property, the space is formed on the side surface of the recess of the heat dissipation fin. Further, the heat radiation fin wall can be used as an enclosure for the injected resin, the insulator frame in the conventional power converter is not required, the cost of the insulator frame can be saved, and the step of attaching the insulator frame can be omitted. In addition, since the resin is injected from the opening obtained by making the printed wiring board 2b small in the lateral direction, a large amount of injected resin can be injected in a short time, until the injected resin is filled. The time can be shortened.

In addition, after dissipating the heat dissipating fin having a recessed portion above the fin portion having a plurality of fins and the recessed portion of the heat dissipating fin and arranging the conductor by the conductive pattern, the power conversion circuit is arranged on the conductor. And a board part on which terminals for electrical connection are mounted, electronic parts such as a control circuit for controlling the power conversion circuit, a terminal block, etc. are mounted, and through holes for connecting to the terminals, and resin injection A printed wiring board having a resin injection hole of, and arranging the printed wiring board so as to close the upper surface of the concave portion of the heat dissipation fin, the printed wiring board and the board portion via the terminal. Since the space formed between the recess of the heat radiation fin and the printed wiring board is electrically connected to the resin by injection resin having a high insulating property, The heat radiating fin wall portion formed on the surface,
It can be used as an enclosure for injected resin, the insulator frame in the conventional power converter is not required, the cost of the insulator frame can be saved, and the step of attaching the insulator frame can be omitted. In addition, since the power conversion circuit is directly formed in the radiating fin recess, the compound applied to the base plate of the metal substrate and the back surface of the metal substrate, which is disposed between the power conversion circuit and the radiating fin, can be omitted. The heat resistance is reduced, and the heat radiation efficiency in the vertical direction is further improved.

[Brief description of drawings]

FIG. 1 is a diagram showing a cross-sectional structure of a power conversion device according to a first embodiment of the present invention.

FIG. 2 is a diagram showing a cross-sectional structure of a power conversion device according to a second embodiment of the present invention.

FIG. 3 is a perspective view of a terminal block of a power conversion device according to a second embodiment of the present invention.

FIG. 4 is a diagram showing a cross-sectional structure of a power conversion device according to a second embodiment of the present invention during manufacture.

FIG. 5 is a diagram showing a cross-sectional structure of a power conversion device according to a third embodiment of the present invention.

FIG. 6 is a diagram showing an assembly of a power conversion device according to a third embodiment of the present invention.

FIG. 7 is a diagram showing a configuration of a conventional power conversion device.

FIG. 8 is a diagram showing a cross-sectional structure of a conventional power conversion device.

[Explanation of symbols]

1 heat dissipation fin, 2a, 2b printed wiring board,
3 injection resin injection holes, 4 terminal block metal pieces, 5 terminal block insulators, 6 openings, 7 insulating paint, 20
Power conversion circuit, 21 gate drive circuit, 30 radiating fins, 31 metal substrate, 32 conductive pattern,
33 printed wiring board, 34 terminals, 35 through holes, 36 electronic parts, 37 terminal block, 38
Injection resin, 39 Insulator frame, S1 to S6 semiconductor elements, D1 to D6 reflux diode, P, N DC input terminal, U, V, W AC output terminal.

Continued front page    (72) Inventor Masakatsu Oue             2-3 2-3 Marunouchi, Chiyoda-ku, Tokyo             Inside Ryo Electric Co., Ltd. F-term (reference) 5E322 AA01 AB06 AB08 FA06                 5E344 AA01 AA22 AA23 BB06 CC05                       CD14 DD02 EE02 EE21                 5H007 AA00 CA01 CB02 CB05 HA05                       HA07

Claims (3)

[Claims] 1. A metal mounting a radiation fin having a recess on the top of a fin portion having a plurality of fins, a power conversion circuit having a conductor structure of a conductive pattern on an insulated metal base, and a terminal for electrical connection. A printed wiring board having a board, a through hole for connecting electronic parts such as a control circuit for controlling the power conversion circuit, a terminal block, and the like, and a resin injection hole for resin injection. And disposing the metal substrate in the recess of the heat dissipation fin, and disposing the printed wiring board so as to close the upper surface of the recess of the heat dissipation fin, and connecting the printed wiring board and the metal substrate to the terminal. And a space formed between the concave portion of the heat radiation fin and the printed wiring board is filled with injection resin having high insulation properties. Power converter. 2. A heat radiating fin having a plurality of fins and a concave portion provided on an upper portion of the fin portion, a power conversion circuit having a conductor structure with an electrically conductive pattern on an insulated metal base, and a terminal and a terminal block for electrical connection. A metal board on which a metal piece is mounted, an electronic component such as a control circuit that controls the power conversion circuit, and a printed wiring board having a through hole for connecting to the terminal, and the terminal block metal piece. And a terminal block insulator that forms a terminal block having a size larger than the depth of the recess of the heat dissipation fin, the metal substrate being disposed in the recess of the heat dissipation fin, and the insulation for the terminal block. An object is arranged on the metal substrate and on one side surface of the concave portion of the heat radiation fin, and the printed wiring board is formed by removing the terminal block insulator in the concave portion of the heat radiation fin. The printed wiring board is arranged so as to close the upper surface, the printed wiring board and the metal substrate are electrically connected to each other through the terminals, and the concave portion of the heat radiation fin except the terminal block insulator is removed from the printed wiring board. A power conversion device characterized in that a space formed by and is filled with injection resin having high insulation. 3. A radiating fin having a recess on the upper portion of a fin portion having a plurality of fins, and a radiating fin having a concave portion insulated from the radiating fin, and a conductor having a conductive pattern is disposed on the radiating fin. And a board part on which terminals for electrical connection are mounted, electronic parts such as a control circuit for controlling the power conversion circuit, a terminal block, etc. are mounted, and through holes for connecting to the terminals, and resin injection A printed wiring board having a resin injection hole of, and arranging the printed wiring board so as to close the upper surface of the concave portion of the heat dissipation fin, the printed wiring board and the board portion via the terminal. A power conversion device, which is electrically connected to fill a space formed between the concave portion of the heat radiation fin and the printed wiring board with injection resin having a high insulating property.