JP2003242891A - Metal barrier rib for plasmas display - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a metal barrier rib for PDP with not only the insulating property but also the high reflective characteristic. <P>SOLUTION: In the metal barrier rib for the plasma display formed of a metal substrate with a large number of through holes, an insulating layer-an Al layer-a reaction preventive layer is formed from the surface side. Preferably, the insulating layer has the composition mainly consisting of, at least one kind of Al<SB>2</SB>O<SB>3</SB>, SiO<SB>2</SB>, ZrO<SB>2</SB>, MgO, TiO<SB>2</SB>, and glass, and more preferably, the thickness of the insulating layer is 0.5 to 10.0 μm, and further more preferably, the thickness of the Al layer is 0.05 to 0.40 μm, and the surface roughness Ra of the Al layer is ≤0.5 μm. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a metal partition used in a plasma display panel (hereinafter abbreviated as PDP).

[0002]

2. Description of the Related Art In a gas discharge type image display device such as a PDP, an insulating partition is required as a partition for forming one discharge space and preventing color interference with adjacent cells. Regarding the manufacturing method of this partition wall for PDP, glass containing lead is used as a material, and it is manufactured by forming a large number of through holes mainly by a sandblast method, but the manufacturing method of such partition wall is complicated in process. Since the yield is poor and the yield is likely to occur, not only is the productivity poor and the cost high, but also the manufactured partition walls and the glass removed by the sandblasting method contain a lot of harmful lead, so It is not preferable.

In terms of performance, there are many cases depending on the structure of the partition wall, and in particular, in order to achieve high definition and high brightness, the width of the partition wall that separates the through holes from each other is reduced to increase the aperture ratio. In addition, it is necessary to form high barrier ribs to widen the discharge space and increase the phosphor coating area, but since the glass barrier ribs are fragile, it is necessary to process the width of the barrier ribs that separate the through holes to be small or to form high barrier ribs. Difficult to do.

[0004]

In order to solve the above problems, JP-A-3-205738 proposes a metal partition wall on the surface of which a dielectric material containing glass is formed by an electrodeposition method.
Further, Japanese Unexamined Patent Publication No. 2000-64027, Al ₂ O ₃ by the inventors
We propose a metal barrier rib formed on the surface by vapor deposition. In these metal partition walls for PDP, since a predetermined through hole is formed in the metal substrate by etching,
It is easy to form a through hole, and it is possible to use a thick material as a raw material to form a metal partition wall for PDP by changing etching processing conditions without discharging harmful lead. However, according to the study by the present inventors, the insulating layer having the composition and structure disclosed in the above-mentioned JP-A-3-205738 and 2000-64027 has the above-mentioned advantages but reflects light. Due to its low rate, a metal partition wall with an insulating layer consisting of these compositions / structures is used.
It was found that when P was manufactured, the brightness was significantly reduced.
An object of the present invention is to provide a metal partition wall for a PDP that has high reflection characteristics as well as insulation properties.

[0005]

Means for Solving the Problems The present inventor has conducted various studies in order to improve the brightness of a metal partition wall for a PDP using a metal substrate. As a result, they have found that this problem can be solved by newly forming an Al layer to be a metal reflection layer on the insulating layer of the metal partition wall for PDP using a conventional metal substrate, and arrived at the present invention. That is, the present invention is a plasma display partition comprising a metal substrate having a large number of through holes, in which an insulating layer-Al layer-reaction prevention layer is formed from the surface side.

An oxide is used as an insulator forming the insulating layer.
, Nitrides, oxynitrides, etc.
The edge layer is an oxide whose composition is Al₂O₃, SiO₂, Zr
O₂, MgO, TiO₂, At least one type of glass
And, more preferably, the thickness of the insulating layer is 0.5 ~ 10.0μm
Is a metal partition wall for PDP. Preferably Al layer thickness
Is 0.10 to 0.40 μm, more preferably the surface roughness R
a: A metal partition wall for PDP having a thickness of 0.5 μm or less. Also like
In other words, the composition of the reaction prevention layer is Al₂O₃, SiO₂, ZrO₂, MgO,
Fe₃O_Four, TiO ₂, Mainly at least one of the glasses
It is a metal partition wall for PDP, more preferably, reaction prevention
A metal partition wall for PDP having a layer thickness of 0.1 to 5.0 μm.

[0007]

An important feature of the present invention is that a reflective layer is formed by forming a multilayer structure in which an insulating layer, an Al layer and a reaction preventive layer are combined from the surface side on a metal substrate to be a metal partition wall for PDP. That is, the characteristics are improved. In the metal partition wall for PDP using the metal substrate of the present invention, a layer is formed on a metal substrate having a large number of through holes formed in a metal plate to form a metal partition wall for PDP. In the partition wall for PDP using this metal substrate, the insulating property is required for the outermost layer, so an insulating layer is arranged on the outermost layer, and an Al layer for improving the reflection characteristics is formed under the insulating layer. A structure in which a reaction preventive layer is formed below the layer is adopted. Hereinafter, these layers will be described.

First, as the insulating layer formed on the outermost layer,
Select a layer that is transparent and allows light to easily pass through and absorbs little light.
It is advisable to select an insulator whose reflectance can be improved by reflecting it on the metal reflective layer below the insulating layer. In the present invention, the combination of this transparent insulating layer and the Al layer described later realizes high reflection characteristics. This is the best possible combination. The term “transparent” here means that the Ag layer is visually confirmed through the insulating layer. And, as the insulator constituting this insulating layer, Al ₂ O ₃ , SiO ₂ , ZrO ₂ , MgO, TiO ₂ , it is good to select at least one kind of glass, and the reason is
This is because these oxides have insulating properties, the raw materials are relatively easily available, and it is easy to form a transparent layer by a vapor deposition method (physical vapor deposition method or chemical vapor deposition method) or a sol-gel method. . Also, a complex oxide may be formed by adding a trace amount of elements mainly to these oxides. For example, for SiO ₂
It is also possible to form a composite film by containing P or B in an amount of several% or less. Note that the insulating layer is shown here as a single layer of the above oxide, but the insulating layer may have a plurality of layers, and the insulating layer referred to in the present invention is a layer intended for insulation, and it is a single layer. Both a layer and a state in which a plurality of layers are stacked are referred to as an insulating layer.

If the thickness of the insulating layer is increased, the aperture ratio is lowered, so that the preferable thickness of the insulating layer is 0.5 to 10
If the thickness is less than 0.5 μm, sufficient insulation cannot be obtained. Also, when the layer thickness exceeds 10 μm, the effect of improving the aperture ratio by applying the metal partition for PDP is reduced, and the insulating layer is easily cracked or peeled off due to the difference in thermal expansion from the metal substrate. Sex decreases. More preferably 1
About 5 μm is good.

Next, in the metal partition wall for PDP of the present invention, the Al layer disposed below the above-mentioned insulating layer is required to have an insulating property on the outermost layer, and therefore these metals are below the insulating layer. The Al layer should improve the reflection characteristics. This Al layer is a metal whose light reflectance exceeds 80% in the wavelength range of 400 to 700 nm when it has a smooth surface state, and is a layer necessary for obtaining high reflection characteristics. And this
The Al layer may be pure Al, but may be used by being alloyed with Cr in a content of about several% in order to improve characteristics such as oxidation resistance.

The Al layer may have a thickness suitable for reflecting light, specifically, 0.05 to 0.40 μm is preferable, and 0.08 to 0.20 μm is preferable. The reason for this is that the layer thickness is 0.0
This is because when the thickness is 5 μm or less, light transmission occurs and the reflectance decreases, and when the layer thickness is 0.40 μm or more, the stress due to the difference in thermal expansion from the metal substrate increases in the heat treatment step, and peeling easily occurs.

Further, if the surface roughness of the Al layer is rough, diffuse reflection occurs, the reflectance is likely to decrease, and the smaller the surface roughness, the better.
In order to set the reflectance to 70% or more, Ra: 0.5 μm or less is preferable, and if Ra: 0.1 μm or less, the reflectance can be set to about 80%. Since the surface roughness of this reflective layer largely depends on the surface roughness of the metal substrate, the conditions are set so that the metal substrate has a smooth surface during etching, or a chemical polishing agent or bright acid is used after the etching. It is effective to apply a smoothing treatment with a washing liquid.

Next, if an Al layer is used as the metal reflection layer and, for example, a Fe-Ni alloy is used as the metal substrate, it reacts easily with the Fe-Ni alloy of the metal substrate in the heat treatment process, and Al-Ni alloy Since it becomes a compound and the reflectance is significantly lowered, a reaction preventive layer is required. The reaction prevention layer is not particularly limited as long as it can prevent the reaction between the Al layer and the metal substrate, but is preferably Al ₂ O ₃ , SiO ₂ , ZrO ₂ , MgO, TiO ₂ , Fe ₃ O ₄ , It is preferable that at least one of the glasses is mainly used. this is,
If it is a layer made of the above oxide, Al, Fe, Ni and 400 ~ 600
This is because the composition is difficult to react at a temperature of ° C. Also,
A complex oxide may be formed by adding a trace amount of elements mainly to these oxides. For example, in the case of SiO ₂ , it is possible to form P by adding B or P by several% or less to form a composite film. The thickness of the reaction-preventing layer is preferably as thin as possible from the viewpoint of aperture ratio, but if the thickness is 0.1 μm or less, a sufficient effect may not be obtained, so the thickness of the reaction-preventing layer is preferably 0.1 to 5.0 μm. .

By the way, the metal partition substrate used in the present invention is formed with a large number of through holes by etching and then covered with at least the above-mentioned three-layer structure layer to form a PDP metal partition. Is used by being sandwiched between the front plate and the back plate. Since the metal partition wall for PDP is subjected to a heat cycle of 450 to 600 ° C. in the panel assembling process, thermal stress is generated when the difference in thermal expansion is large, and the panel is damaged and cannot function as an image display device. In order to prevent this, it is preferable that the partition wall has a thermal expansion coefficient close to that of the front plate and the back plate. At present, for example, soda lime glass or high strain point glass with a thermal expansion coefficient of about 8.5 × 10 ^-6 / ° C is used for the front and back plate glass of PDP, so Ni is used in the metal substrate in a mass% of. In the range of 40 to 52%, it is good to use an Fe-Ni-based alloy consisting of the balance substantially Fe, particularly preferably Ni in the range of 45% to 50% by mass%.
The e-Ni alloy is suitable as a material for metal partition walls because it can have a thermal expansion coefficient close to that of the above glass and can easily form a fine pattern by an etching method.

The above-mentioned 42Ni-Fe alloy, 47Ni-Fe alloy, 50Ni-Fe alloy, etc. are typical, but in addition to these, 42N
Fe-Ni-Cr alloys such as i-6Cr-Fe alloy, or a part of Ni
%, Fe-Ni-Co alloys substituted with Co or less, and further, an element for improving strength may be appropriately added to these alloys.

[0016]

EXAMPLES The present invention will be described in more detail with reference to examples. The material for metal partition walls has a coefficient of thermal expansion of 8.3 × 10 ^-6 / ℃
Using Fe-47mass% Ni alloy thin plate (thickness: 0.20 mm), a large number of through holes were formed by a spray type wet etching method in which a FeCl ₃ aqueous solution was sprayed from a nozzle so as to form a partition wall for PDP. Further, in order to investigate the influence of the surface roughness of the reflective layer, metal substrates having different surface roughness were prepared by chemical polishing and bright pickling after etching.

On this metal substrate, Al ₂ O was used as a reaction preventive layer.
₃ was formed by the sputtering method. However, since the layer formed by the sputtering method has a pinhole-like defect and is not a completely covered layer, further impregnation of this layer with a Si alkoxide solution in a reduced pressure atmosphere is followed by drying-firing. As a SiO ₂ oxide, a sealing treatment was performed. Fe ₃ O ₄ has a dew point of + 40 ° C at 550 ° C with a mixed gas of N ₂ and CO _2.
It was formed by performing an oxidation treatment for 1 hour in a gas atmosphere adjusted to. Since this Fe ₃ O ₄ layer also has pinhole-like defects and is not a completely covered layer, after further impregnating this layer with a Si alkoxide solution in a reduced pressure atmosphere,
The pores were treated as SiO ₂ oxide by drying and firing. Next, on the reaction preventive layer, Al is used as an Al layer with a thickness of about 0.2 μm.
Was formed by the sputtering method. Then Al
Al ₂ O ₃ and MgO as an insulating layer on the layer are about 2 μm and 4 μm, respectively.
Was formed by the sputtering method to a thickness of 1 to obtain a metal partition wall for PDP.

Then, this metal partition wall for PDP was heat treated in the atmosphere at 550 ° C. for 1 hour and then evaluated. The reflectance was measured with a spectrocolorimeter in the wavelength region of 400 to 700 nm. Insulation is based on JIS-C2 after breaking down the coating layer with a grindstone on one side of the flat surface without holes with a metal partition wall.
It was measured according to 110 and summarized as an average value of 10 points. Adhesion was judged visually, and good ones were marked with a circle. The results are shown in Table 1.

[0019]

[Table 1]

From the results of Table 1, from the comparison of Nos. 1, 2 and 3,
It can be seen that the reflectance does not improve without the Al layer-reaction prevention layer under the insulating layer. Further, it can be seen from the comparison between No. 3 and Nos. 5 and 6 that when the thickness of the Al layer is 0.05 μm or less, the decrease in reflectance is large. Next, from No. 3 to 7-9, it can be seen that the reflectance decreases when the surface roughness of the reflective layer is rough, and decreases to 70% or less when the surface roughness Ra: 0.5 μm or more. Also, No. 10 M
It can be seen that in the case where the gO insulating layer is formed, the reflectance is 70% or more and the withstand voltage is 500 V or more.
From the above results, it is understood that the metal partition wall for PDP formed with the layer of the present invention can have both high reflection characteristics and excellent insulation properties.

[0021]

According to the present invention, it becomes possible to provide a metal partition wall having both insulating properties and high reflection characteristics.
Greatly contributes to higher brightness.

Claims (7)

[Claims] 1. A plasma display partition comprising a metal substrate having a large number of through holes, wherein an insulating layer, an Al layer and a reaction preventive layer are formed from the surface side. . 2. The composition of the insulating layer is Al ₂ O ₃ , SiO ₂ , ZrO ₂ , M
The metal partition wall for plasma display according to claim 1, which is mainly composed of at least one of gO, TiO ₂ , and glass. 3. The metal partition wall for a plasma display according to claim 1, wherein the insulating layer has a thickness of 0.5 to 10.0 μm. 4. The metal partition wall for a plasma display according to claim 1, wherein the Al layer has a thickness of 0.05 to 0.40 μm. 5. The metal partition wall for a plasma display according to claim 1, wherein the surface roughness of the Al layer is Ra: 0.5 μm or less. 6. The composition of the reaction prevention layer is Al₂O₃, SiO₂, ZrO
₂, MgO, TiO₂, Fe₃O _Four, At least one of the glasses
6. The method according to claim 1, characterized in that
A metal partition for a plasma display according to item 1. 7. The metal partition wall for a plasma display according to claim 1, wherein the reaction prevention layer has a thickness of 0.1 to 5.0 μm.