JP2003233324A - Flat panel display and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a user friendly flat panel display advantageously in terms of a cost without hampering downsizing of electronic apparatus. <P>SOLUTION: The flat panel display 1 is provided with a substrate 2B set with a non-display region 4, wiring 40 formed in this non-display region 4 and a driving IC 41 packaged in the non-display region 4, in which electronic parts 43 conducting with the wiring 40 are further packaged in the non-display region 4 and the electronic parts 43 are fixed to the substrate 2B by utilizing an anisotropic conductive adhesive 45. More preferably, the electronic parts 43 are directly fixed to the substrate 2B by means of the adhesive 45. The electronic parts 43 and the driving IC 41 are packaged by, for example, the same anisotropic conductive adhesive. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a liquid crystal display device,
The present invention relates to a flat panel display such as an LED display device, an organic EL display device or an inorganic EL display device.

[0002]

2. Description of the Related Art As an example of a flat panel display, there is a liquid crystal display device shown in FIG. The liquid crystal display device 9 has liquid crystal (not shown) held between a pair of substrates 90 and 91, and has a display area 92.
And a non-display area 93. A plurality of pixels (not shown) are arranged in a matrix in the display area 92, while a drive IC 94 for selecting light transmission / non-transmission in each pixel is mounted in the non-display area 93. The drive IC 94 is electrically connected to, for example, a signal line and a scanning line forming a plurality of pixels via a wiring (not shown). Image signals and electric power are supplied to the drive IC 94 through the wiring 95 and the flexible cable 96.

In the liquid crystal display device 9, in addition to the signal lines and the scanning lines, wirings connected to the signal lines and the scanning lines are formed, and noise is likely to occur. Therefore, as a measure against noise, a chip capacitor 98 may be mounted on the wiring 97 formed on the flexible cable 96 as shown in FIG. In addition to noise countermeasures, electronic components such as chip capacitors and chip resistors are mounted on the wiring 97 of the flexible cable 96 for the purpose of smoothing the power supply and boosting the voltage. Such an electronic component may be mounted on a circuit board separately provided with a circuit board electrically connected to the wiring 95 in the non-display area 93.

[0004]

Generally, the liquid crystal display device 9 is used by incorporating it in an electronic device. However, it is not preferable to mount the electronic components on the flexible cable 96, because the flexible cable 96 becomes large and the compactness of the electronic device is hindered.
On the other hand, the method of mounting electronic components on a circuit board is disadvantageous in cost because it is necessary to separately provide a circuit board. Moreover, it is necessary to mount the electronic components on the flexible cable 96 and the circuit board when the liquid crystal display device 9 is incorporated into an electronic device. Therefore, a user who purchases the liquid crystal display device 9 and installs it in an electronic device needs to mount electronic components, and the liquid crystal display device 9 is inconvenient for such a user.
These problems can occur not only in the liquid crystal display device 9 but also in all flat panel displays on which electronic components are mounted for the same purpose.

The present invention has been conceived under such circumstances, and provides a flat panel display which is cost-effective and easy to use without inhibiting the compactness of electronic equipment. Is an issue.

[0006]

DISCLOSURE OF THE INVENTION In order to solve the above problems, the present invention takes the following technical means.

That is, in the flat panel display provided by the first aspect of the present invention, the substrate in which the non-display area is set, the wiring formed in the non-display area, and the wiring that is electrically connected to the wiring are formed. A flat panel display comprising: a drive IC mounted in a non-display area, wherein an electronic component is further mounted in the non-display area so as to be electrically connected to the wiring. It is characterized in that it is fixed to the substrate by using an anisotropic conductive adhesive.

In this flat panel display, electronic components are fixed to the flat panel display in advance. Therefore, when incorporating a flat panel display into an electronic device, it is not necessary to mount electronic components on a flexible cable or a circuit board. Therefore, first, even if the flexible cable is used to supply signals and power, the flexible cable does not become large due to the use of the electronic component. Secondly, the electronic component is Since a circuit board for mounting is unnecessary, it is cost-effective. Thirdly, it is convenient for users who purchase a flat panel display and install it in an electronic device because the mounting of electronic components is unnecessary. Become.

The electronic component may be directly fixed to the substrate via, for example, an anisotropic conductive adhesive, or may be fixed to the substrate via a supporting electrode in addition to the anisotropic conductive adhesive. Good.

According to a second aspect of the present invention, there is provided a method of manufacturing a flat panel display according to the first aspect of the present invention, which comprises a first step of placing an anisotropic conductive film on the substrate, A second step of thermocompression-bonding a plurality of mounting objects including the driving IC on the same anisotropic conductive film is provided, and a method for manufacturing a flat panel display is provided.

In this manufacturing method, a plurality of mounting objects are
Thermocompression bonded onto two anisotropic conductive films. for that reason,
It is not necessary to cut the anisotropic conductive film into a desired size and then place (or temporarily fix) this on the board, and it is possible to cut multiple anisotropically conductive films before mounting. This is advantageous in work efficiency because the work of 1 need only be performed once.

In the second step, it is preferable that a plurality of objects to be mounted are thermocompression bonded in the ascending order of thickness.

The thermocompression bonding of the mounting object is performed by pressing the mounting object with the pressing member while heating the anisotropic conductive film. At this time, if the thickness of the mounting object that has been thermocompression-bonded first is larger than the thickness of the mounting object that is to be thermocompression-bonded later, the pressing member interferes with the mounting object that has been thermocompression-bonded first, and the subsequent pressing is appropriate. It may not be possible to do it. On the other hand, by performing thermocompression bonding in order from the mounting object having the smallest thickness, the mounting object can be appropriately pressed by the pressing member without being hindered by the mounting object that has been thermocompression bonded first. .

Examples of the plurality of objects to be mounted include electronic components, support electrodes for supporting the electronic components, and electronic components to which the support electrodes are connected.

The mounting work using the anisotropic conductive film is as follows.
This can be performed by a simple work called thermocompression bonding. Therefore, with regard to the electronic component as the mounting object, the effect described in the first aspect of the present invention described above can be enjoyed by a simple operation. Further, the electronic components include a chip capacitor, a chip resistor, etc., but these electronic components are usually mounted by soldering. On the other hand, in flat panel displays, the wiring is often formed of ITO,
Since ITO has poor wettability, it is difficult to solder electronic parts. Therefore, if the electronic component is mounted by thermocompression bonding, even if the wiring is made of a material unsuitable for soldering, the electronic component or the like can be properly mounted. And without soldering
If all the mounting objects are mounted by thermocompression bonding, the working process is simplified, which is advantageous in working efficiency.

According to a third aspect of the present invention, there is provided a flat panel display according to the first aspect of the present invention,
In a method of manufacturing a flat panel display in which an electronic component is connected to a substrate via a supporting electrode, a first step of mounting the drive IC on the substrate, and the supporting electrode performed after the first step. And a second step of thermocompression bonding the electronic component connected to the substrate onto the substrate via an anisotropic conductive film, the flat panel display manufacturing method being provided.

In this manufacturing method, even if the thickness dimension of the electronic component is smaller than that of the drive IC, the support electrode is fixed to the electronic component to form a structure, so that the size of the entire structure is smaller than that of the drive IC. Can also be larger.
As a result, an electronic component originally having a small thickness dimension can be thermocompression-bonded without trouble after a drive IC having a larger thickness dimension than this. As a result, the range of selection of the mounting order becomes large, and it becomes possible to mount a plurality of mounting objects with good work efficiency.

On the other hand, according to a fourth aspect of the present invention, there is provided a method for producing a flat panel display according to the first aspect of the present invention, in which electronic components are connected to a substrate through supporting electrodes. In step of mounting the drive IC on the substrate, thermocompression-bonding the support electrode on the substrate via the anisotropic conductive film, and connecting the electronic component on the support electrode And a method for manufacturing a flat panel display, characterized in that the one of the driving IC and the supporting electrode having a smaller thickness dimension is first mounted or thermocompression-bonded to the substrate. To be done.

In this manufacturing method, when a supporting electrode having a thickness smaller than that of the driving IC is used, the supporting electrode is thermocompression bonded before mounting the driving IC, while a supporting electrode having a larger thickness than the driving IC is used. When used, the support electrodes are thermocompression bonded after mounting the drive IC. In any case,
The support electrode can be thermocompression bonded without being hindered by the drive IC. Then, an electronic component can be connected to the support electrode by a method other than thermocompression bonding (for example, soldering).
Therefore, even if the thickness dimension of the electronic component is smaller than that of the drive IC, by fixing the support electrode prior to the electronic component, the electronic component can be fixed after the drive IC. As a result, the range of selection of the mounting order becomes large, and there is an advantage that a plurality of mounting objects can be mounted with high work efficiency. Further, when the wiring is formed of a material unsuitable for soldering such as ITO, it is difficult to directly mount an electronic component on the wiring by soldering, but a supporting electrode having good solder wettability. By previously providing, the electronic component can be soldered.

In the third and fourth aspects of the present invention, the drive IC is mounted by thermocompression bonding using, for example, an anisotropic conductive film.

Other advantages and characteristics of the present invention will be more apparent from the following description of the embodiments of the invention.

[0022]

BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of the present invention will be specifically described below with reference to FIGS. 1 and 2. 1 is an overall perspective view of a liquid crystal display device (an example of a flat panel display) according to a first embodiment of the present invention, and FIG. 2 is a sectional view taken along line II-II of FIG.

The liquid crystal display device 1 shown in FIGS. 1 and 2.
Holds the liquid crystal 20 between the first and second substrates 2A and 2B and has a display region 3 and a non-display region 4. The second substrate 2B faces the first substrate 2A, and a part of the second substrate 2B projects laterally of the first substrate 2A. The display area 3 is set in a portion where the first and second substrates 2A and 2B overlap each other, and the non-display area 4 is set in the second substrate 2
It is set on the protruding portion of B.

As shown clearly in FIG. 2, a plurality of strip electrodes 21a, 21b and these strip electrodes 21 are provided on the facing surfaces 20a, 20b of the first and second substrates 2A, 2B.
Alignment films 22a and 22b are formed to cover a and 21b. On the other hand, the non-opposing surface 2 of the first and second substrates 2A and 2B
Polarizing films 24a and 24b are formed on 3a and 23b. The plurality of strip-shaped electrodes 21a and the plurality of strip-shaped electrodes 21b are orthogonal to each other as expected from FIG. 2, and intersections thereof are pixels. That is, a plurality of pixels are arranged in a matrix in the display area 3, and passive driving is possible. By forming the above-described elements on the first and second substrates 2A and 2B in this manner, the display region 3 is set as a portion where the first and second substrates 2A and 2B overlap. Of course, the display area 3 may have a configuration capable of active driving. The display area 3 shown in FIG. 1 and FIG.
Has not only an area where an image is actually displayed, but also an area (a peripheral portion of the display area 3) where only wiring is formed and an image is not actually displayed. In the form, for convenience of explanation, the whole of them is used as the display area 3.

In the non-display area 4, a plurality of wirings 40 are patterned. Further, the drive I
C41, flexible cable 42 and electronic component 43
Are mounted so as to be electrically connected to the plurality of wirings 40.

The drive IC 41 is for selecting light transmission / non-transmission in each pixel, and a plurality of electrodes 41b protruding downward are formed on the lower surface 41a. The flexible cable 42 is for supplying an image signal and electric power to the driving IC 41, and has a plurality of wirings 42b formed on an insulating film 42a. Electronic component 4
3 is used for the purpose of, for example, reducing noise generated in the wiring 40, smoothing the power source, boosting the voltage, etc., and electrodes 43b are formed at both ends 43a.
Examples of the electronic component 43 used for such a purpose include a chip capacitor and a chip resistor. The number of electronic components 43 is not limited to two as in the illustrated example, and one or three or more may be mounted depending on the purpose.

Drive IC 41, flexible cable 42
The electronic component 43 is fixed to the second substrate 2B via the anisotropic conductive films 44 and 45. Anisotropic conductive film 44,
45 is an insulating component such as epoxy resin 44a, 45a
Conductive components 44b and 45b are dispersed therein. The conductive components 44b and 45b are, for example, granular as well shown in FIG. 2, and may be configured to have conductivity as a whole by metal particles or the like, or the surface of resin particles can be made conductive by plating or the like. A film may be formed. Of course, the conductive component may be formed into a needle shape or the like.

The components 41 to 43 are mounted on the second substrate 2B in the following manner, for example. However, it is assumed that the thickness dimension T2 of the drive IC 41 is smaller than the thickness dimension T1 of the electronic component 43, and the thickness dimension T3 of the flexible cable 42 is the smallest as compared with these.

First, as shown in FIG. 3A, the structure including the second substrate 2B is placed on the stage 60 so that the second substrate 2B is in close contact, and then the edge in the non-display area 4 is placed. The anisotropic conductive film 50 is temporarily fixed to the portion. This temporary fixing is performed by heating the anisotropic conductive film 50 at a temperature lower than thermocompression bonding described later, for example, 90 ° C.

Next, as shown in FIG. 3B, the flexible cable 42 is thermocompression bonded to the second substrate 2B. In this thermocompression bonding, the wiring 40 of the second substrate 2B and the wiring 42b of the flexible cable 42 are aligned with each other, and the insulating component 51 of the anisotropic conductive film 50 is heated, while the pressing head 61 is used to form the flexible cable 42. By pressing. Since the wiring 40 and the wiring 42b are aligned with each other, the wiring 4 and
Conductive component 52 is interposed between 0 and 42b to connect wirings 40 and 4
2b becomes conductive. On the other hand, when the insulating component 51 is cured, the flexible cable 42 is fixed to the second substrate 2B.

The insulation component 51 can be heated by, for example, heat from a heater incorporated in the stage 60 or heat from a heater incorporated in the pressing head 61. The heating condition of the insulating component 51 is determined according to the type of material forming the insulating component 51. For example, when the insulating component 51 is made of epoxy resin, the heating temperature is 250 to 300 ° C. and the heating time is 15 ~
It is set to 30 seconds.

Subsequently, the driving IC 4 is mounted on the second substrate 2B.
1 is implemented. In this mounting, as clearly shown in FIG. 4A, the anisotropic conductive film 53 is first temporarily fixed to the central portion of the non-display area 4. The method of temporarily fixing the anisotropic conductive film 53 is the same as that of the anisotropic conductive film 50 described above, and the anisotropic conductive film 53 may be the same kind as the anisotropic conductive film 50. You can use it. However, it is preferable that the anisotropic conductive film 53 is also covered with one anisotropic conductive film 53 at the same time in a region where the electronic component 43 is mounted later.

Then, as shown in FIG. 4B, the drive I
The electrode 41b of C41 and the wiring 40 are aligned with each other, and the drive IC 41 is placed on the anisotropic conductive film 53. The driving IC 41 can be placed using a known chip mounter (not shown) having a suction collet. Subsequently, as shown in FIG. 4C, the drive IC 41 is thermocompression bonded. This thermocompression bonding can be performed by a method similar to that of the flexible cable 42 described above. That is, the heating is performed by pressing the driving IC 41 using the pressing head 61 while heating the insulating component 54 of the anisotropic conductive film 53. The heating conditions for the insulating component 54 are
This is similar to the case where the anisotropic conductive film 50 is used.

Subsequently, the electronic component 4 is attached to the second substrate 2B.
3 is implemented. In this mounting, as clearly shown in FIG. 5A, first, the electrodes 43b and the wiring 4 of the electronic component 43 are connected.
The electronic component 43 is placed on the same anisotropic conductive film 53 as that used for mounting the drive IC 41 by aligning 0 with 0. The mounting of the electronic component 43 can also be performed using a known chip mounter (not shown). Subsequently, as shown in FIG. 4B, while heating the insulating component 54 of the anisotropic conductive film 53, the electronic component 43 is pressed using the pressing head 61, and the electronic component 43 is thermocompression bonded. As a result, the electrode 43b of the electronic component 43 and the wiring 40 are electrically connected via the conductive component 55, and the electronic component 43 is connected to the second substrate 2B.
Fixed against.

In the liquid crystal display device 1 described above, the electronic component 43 is fixed to the liquid crystal display device 1 in advance. Therefore, when the liquid crystal display device 1 is incorporated into an electronic device, it is not necessary to mount the electronic component 43 on the flexible cable 42 or the circuit board. Therefore, the first
In addition, the flexible cable 42 does not increase in size due to the use of the electronic component 43. Secondly, the circuit board for mounting the electronic component is not required, which is advantageous in terms of cost. For a user who purchases the liquid crystal display device 1 and incorporates the liquid crystal display device 1 into an electronic device, the usability is improved because the electronic component 43 is not required to be mounted.

In the mounting method described above, a plurality of mounting objects (driving IC 41 and electronic component 43) are thermocompression bonded onto one anisotropic conductive film 53. Therefore, it is not necessary to cut the anisotropic conductive film 53 into a desired size and then place (or temporarily fix) the anisotropic conductive film 53 on the second substrate 2B for each mounting object, and a plurality of mounting objects can be mounted. The previous work need only be performed once on the object, which is advantageous in work efficiency.

When the pressing IC is used to press the drive IC 41 and the electronic component 43, if the thickness of the mounting object to be thermocompression bonded first is larger than the thickness of the mounting object to be thermocompression bonded later, There is a possibility that the pressing head interferes with the mounting object that has been thermocompression-bonded and the subsequent pressing cannot be performed properly. On the other hand, if the objects to be mounted (driving IC 41) having the smallest thickness are thermocompression-bonded sequentially as in the mounting method described above, the objects to be mounted (driving IC 41) thermocompression-bonded first are obstructed. It becomes possible to appropriately press the mounting object (electronic component 43) without using the pressing head.

As mentioned above, the electronic component 43 may be a chip capacitor or a chip resistor.
These electronic components 43 are usually mounted by soldering. On the other hand, in the liquid crystal display device 1, the wiring 40 is often formed of ITO, but ITO has poor wettability, and it is difficult to solder the electronic component 43. for that reason,
If the electronic component 43 is mounted by thermocompression bonding, the electronic component 43 and the like can be properly mounted even when the wiring 40 is made of a material unsuitable for soldering. If all of the mounting objects (driving IC 41 and electronic component 43) are mounted by thermocompression bonding without soldering, the work process is simplified and the work efficiency is improved. .

Next, a liquid crystal display device (an example of a flat panel display) according to a second embodiment of the present invention.
Will be described with reference to FIG. Note that FIG. 6 is a cross-sectional view showing a main part of the liquid crystal display device. Further, in the drawings referred to below, the same or equivalent members or elements as those in the drawings referred to above are designated by the same reference numerals, and the description thereof will be omitted here.

In the liquid crystal display device 1'of FIG. 6, the liquid crystal display device 1 described above with reference to FIG.
The mounting structure of 3 is different. The electronic component 43 is mounted on the second substrate 2B in a state of being lifted upward by the plurality of support electrodes 7.

Each support electrode 7 has, for example, a cylindrical or prismatic appearance. Such a support electrode 7 is formed by plating the surface of a conductor such as copper with Ni and Au. The support electrode 7 has one end electrically connected to the electrode 43b of the electronic component 43 via the solder H, and the other end electrically connected to the wiring 40 via the anisotropic conductive film 45 (strictly speaking, the conductive component 45b). It is connected.

Such a mounting structure can be achieved by the procedure described below with reference to FIG. 7 or 8. When the thickness T4 of the support electrode 7 is larger than the thickness T2 of the drive IC 41, first, the drive IC 41 is mounted according to the procedure described with reference to FIG. 4, and the state shown in FIG. Then, as shown in FIG.
The plurality of support electrodes 7 are fixed to the second substrate 2B using the anisotropic conductive film 53. The fixing of the supporting electrode 7 is performed by driving I
Similar to the mounting of C41, the supporting electrode 7 is placed on the anisotropic conductive film 53 and thermocompression bonding is performed. Finally, as shown in FIG. 7C, the supporting electrode 7 and the electrode 43b of the electronic component 43 are formed by using a conductive adhesive such as solder.
Fix between and. The connection between the electronic component 43 and the support electrode 7 is preferably made manually. Electronic component 43
Mounting is usually performed after the polarizing plates 24a and 24b (see FIG. 2) are provided on the first and second substrates 2A and 2B, so that even the polarizing plates 24a and 24b are heated by solder reflow. This is because the method of causing it is not preferable.

On the other hand, the thickness T4 of the supporting electrode 7 is determined by the driving IC4.
If the thickness is smaller than the thickness T2 of 1 (FIG. 8A), the drive electrode 41 is mounted (FIG. 8A) after fixing the support electrode 7 (FIG. 8A).
(B)) Finally, the electronic component 43 may be fixed to the support electrode 7 (FIG. 8C).

In the mounting method described with reference to FIGS. 7 and 8, even when the thickness dimension T1 of the electronic component 43 is smaller than the thickness T2 of the drive IC 41, the second substrate 2B precedes the electronic component 43. By fixing the support electrode 7 to the electronic component 43, the electronic component 43 can be fixed after the driving IC 41. As a result, the range of selection of the mounting order becomes large, and there is an advantage that a plurality of mounting objects can be mounted with high work efficiency. Also, the wiring 40 is I
Even if it is made of a material such as TO that is not suitable for soldering, the electronic component 43 can be mounted by soldering by thermocompressing the support electrode 7 first.

The mounting structure shown in FIG. 6 is achieved by fixing the support electrode 7 to the electronic component 43 in advance as shown in FIG. 9 and thermocompressing this structure to the second substrate 2B. You may. In this method, even if the thickness dimension T1 of the electronic component 43 is smaller than the thickness T2 of the driving IC 41, by fixing the support electrode 7 to the electronic component 43, the overall dimension T5 can be reduced to the thickness T2 of the driving IC. Can be greater than. As a result, the electronic component 43 originally having a small thickness dimension T1 is replaced with the electronic component 43 having a thickness dimension T2 smaller than that.
After the driving IC 41 having a large size, thermocompression bonding can be performed without trouble. As a result, the range of selection of the mounting order becomes large, and it becomes possible to mount a plurality of mounting objects with good work efficiency.

Although the liquid crystal display device has been described as an example in the above embodiments, the present invention is not limited to the liquid crystal display device. The technical idea of the present invention is that in a flat panel display (including a liquid crystal display device, an LED display device and an organic (or inorganic) EL display device, etc.), it is electrically connected to a wiring provided in a non-display area to be an electronic component. It can be applied when a chip capacitor or a chip resistor is provided.

[Brief description of drawings]

FIG. 1 is an overall perspective view of a liquid crystal display device according to a first embodiment of the present invention.

FIG. 2 is a sectional view taken along line II-II in FIG.

FIG. 3 is a main-portion cross-sectional view for explaining a fixing operation of a flexible cable.

FIG. 4 is a main-portion cross-sectional view for explaining a mounting operation of the drive IC.

FIG. 5 is a main-portion cross-sectional view for explaining a mounting operation of an electronic component.

FIG. 6 is a perspective view showing a main part of a liquid crystal display device according to a second embodiment of the present invention.

FIG. 7 is a main-portion cross-sectional view for explaining a mounting operation of an electronic component.

FIG. 8 is a main-portion cross-sectional view for explaining another example of the mounting work of the electronic component.

FIG. 9 is a main-portion cross-sectional view for explaining another example of the mounting work of the electronic component.

FIG. 10 is an overall perspective view showing an example of a conventional liquid crystal display device.

11 is a sectional view taken along line XI-XI of FIG.

[Explanation of reference numerals] 1,1 'Liquid crystal display device (flat panel display) 2B Second substrate 4 Non-display area 40 Wiring 41 Drive IC 43 Electronic parts 44, 45 Anisotropic conductive film 50, 53 Anisotropic conductive film 7 Support electrode

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Claims (9)

[Claims] 1. A flat panel comprising: a substrate in which a non-display area is set; wiring formed in the non-display area; and a drive IC which is electrically connected to the wiring and is mounted in the non-display area. In the display, an electronic component is further mounted in the non-display area so as to be electrically connected to the wiring, and the electronic component is fixed to the substrate by using an anisotropic conductive adhesive material. A flat panel display characterized by being 2. The electronic component is directly fixed to the substrate via the anisotropic conductive adhesive.
The flat panel display according to claim 1. 3. A support electrode, which is electrically connected to the wiring and fixed via the anisotropic conductive adhesive, is provided on the substrate, and the electronic component is connected to the support electrode. The flat panel display according to claim 1, wherein the flat panel display is provided. 4. The method for manufacturing a flat panel display according to claim 1, wherein the first step of placing an anisotropic conductive film on the substrate, and the same anisotropic conductive film are performed. A second step of thermocompression-bonding a plurality of objects to be mounted including the drive IC, and a method for manufacturing a flat panel display, the method comprising: 5. The method for manufacturing a flat panel display according to claim 4, wherein in the second step, the plurality of mounting objects are thermocompression bonded in ascending order of thickness. 6. The mounting object according to claim 4, wherein the plurality of mounting objects include at least one of an electronic component, a support electrode for supporting the electronic component, and an electronic component to which the support electrode is fixed. The flat panel display according to item 5. 7. A method of manufacturing a flat panel display according to claim 3, wherein a first step of mounting the drive IC on the substrate, and a step performed after the first step, and A second step of thermocompression-bonding an electronic component to which a supporting electrode is connected onto the substrate through an anisotropic conductive film, the flat panel display manufacturing method. 8. The method for manufacturing a flat panel display according to claim 3, wherein the step of mounting the drive IC on the substrate, and the support on the substrate via the anisotropic conductive film. A step of thermocompression-bonding the electrodes, and a step of connecting the electronic component on the supporting electrode, and the one of the driving IC and the supporting electrode having a small thickness dimension, for the substrate. A method for manufacturing a flat panel display, which comprises first mounting or thermocompression bonding. 9. The mounting of the drive IC is performed by thermocompression bonding using an anisotropic conductive film.
A method for manufacturing a flat panel display according to.