JP2003232337A - Method of manufacturing rod for painting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a rod for painting device where a wear-resistant film is uniformly formed on a base material. <P>SOLUTION: This method comprises: an arranging process for arranging the base material at a setting position in a chamber 18 of an ion plating device 16; a first depositing process for depositing a film 14A by vapor-depositing a depositing material from a vapor-depositing source 20 from an end 12L of the base material 12 to a central part 12M; a replacing process for replacing the replacing position of the end 12L with the other end 12R of the base material 12; and a second depositing process for depositing a film 14B by vapor- depositing a film material from the vapor-depositing source 20 from the other end 12R to the central part 12M of the base material 12M. Therefore, a film of uniform thickness can be obtained as a whole, even if the base material 12 is a long one. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a rod for a coating apparatus, the surface of which is provided with a wear-resistant coating, and more specifically, it is applied to an object to be coated such as a continuously running web. The present invention relates to a method of manufacturing a rod for a coating device, which is most suitable for applying a liquid.

[0002]

2. Description of the Related Art When manufacturing photosensitive materials, photolithographic materials, magnetic recording materials, recording paper materials, photosensitive lithographic printing plates, etc.
It is widely practiced to apply a coating liquid (photosensitive liquid) to one side while continuously running a sheet-shaped or web-shaped substrate (substrate to be coated) made of a thin metal plate, paper, film, etc. in the longitudinal direction. It is being appreciated.

When performing this coating, a coating device rod (bar) is brought into contact with the coated surface of the object to be coated, and the coating liquid is supplied to the surface of the rod while the coating device rod is rotated to apply the coating liquid. Often This coating method is called a bar coating method.

A wear-resistant film is generally formed on the surface of the coating apparatus rod. The film formation is
Although various methods such as plating, physical vapor deposition, and chemical vapor deposition can be used, a vacuum furnace (chamber) is often used to form a film by a physical vapor deposition method such as ion plating. From the viewpoint of abrasion resistance, it is preferable that the film is uniformly formed. Therefore, when forming the film by ion plating, various measures have been taken so that the film can be uniformly formed.

For example, in JP-A-63-192855, the ionization rate is improved in order to coat a large area with a uniform film. In addition, JP-A-01-2406
No. 46 and Japanese Patent Laid-Open No. 01-252764, in order to coat a large area with a uniform film, the ionization rate is improved and the film formation speed is increased.

However, if the columnar base material that is the film-forming target becomes long to a certain extent, this base material cannot be accommodated in a general chamber. Further, in a large-sized chamber that can accommodate such a long film-forming target even if it can be accommodated, a vapor deposition source is often provided at a position away from the center of the chamber. In many cases, the base material cannot be placed directly above the vapor deposition source. For this reason, there has been a problem that a thick film is formed on the base material portion near the vapor deposition source and a thin film is formed on the base material portion far from the vapor deposition source. Even if the center of the base material can be placed directly above the vapor deposition source, if the base material is long, there is a problem that the thickness of the film formed at both ends is smaller than that at the center. Was there.

In Japanese Patent Laid-Open Nos. 02-077753 and 02-079764, an example in which a film is uniformly formed by ion plating while a long object as a film-forming object is continuously run However, it cannot be applied when a film is formed on a discontinuous material such as a base material of a rod for a coating device.

[0008]

In consideration of the above facts, the present invention provides a method for manufacturing a rod for a coating apparatus, in which a wear resistant film is formed on a base material with a uniform film thickness. This is an issue.

[0009]

According to a first aspect of the present invention, there is provided a method for manufacturing a rod for a coating apparatus, comprising a cylindrical base material and a wear-resistant coating film formed on the surface of the base material. A disposing step of disposing the base material in a chamber of the apparatus, a first film forming step of evaporating a coating material from an evaporation source from one end to a central portion of the base material, and one end and the other end of the base material And a second film forming step of depositing a coating material from the vapor deposition source from the other end to the central portion of the base material. And

As the vapor deposition apparatus, a physical vapor deposition apparatus whose deposition range within the chamber is known in advance is usually used.

According to the first aspect of the present invention, it is possible to form a film in the second film forming step on a base material portion that exceeds the film forming possible range in the first film forming step. Further, since the film formation is performed twice, it is possible to further increase the film thickness as compared with the conventional case. If the length of the base material is not more than twice the length of the film forming range, the film can be formed over the entire base material.

In the replacement step, for example, the base material is taken out of the chamber, and the base material is inserted and rearranged in the direction opposite to the direction in which the base material is inserted in the chamber in the arrangement step. Thereby, the replacement process can be easily performed without providing a special mechanism.

According to the second aspect of the present invention, in the first film forming step, the first film tapering portion is formed which is gradually thinned from the one end side of the base material toward the central part side. A film is formed, and in the second film forming step, a second film taper portion which is gradually thinned from the other end portion side to the central portion side of the base material is formed on the first film taper portion. The film is formed as described above.

As a result, even if the base material is long, it is possible to obtain a film having a uniform film thickness as a whole.

According to a third aspect of the invention, in the arranging step, the position of the base material is set on the basis of the boundary of the film-forming range.

This makes it easy to set the position of the base material,
Further, it is easy to find the set position of the base material where the film is formed with a uniform film thickness.

Since the appropriate arrangement position of the base material is different for each vapor deposition apparatus, from the viewpoint of forming a film with a uniform thickness,
Position setting is preferably performed for each vapor deposition device.

According to a fourth aspect of the invention, an ion plating device is used as the vapor deposition device.

This makes it easy to form a film having a strong adhesive force and a uniform film thickness.

[0020]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to embodiments. In the embodiment of the present invention, the coating device rod is simply referred to as a rod for simplification.

In the method of manufacturing a rod according to the embodiment of the present invention, as shown in FIG.
It is a method of manufacturing a rod used for applying.

The rod 10 is a rod in which a wear resistant coating 14 is formed on the surface of a base material 12. The base material 12 is often made of stainless steel. The film 14 is formed by using an ion plating device.

[Structure of Ion Plating Device] FIG. 2
As shown in FIG. 3, the ion plating apparatus 16 for coating a film has a chamber 18 and a vapor deposition source 20 installed in the chamber.

The chamber 18 is formed to have an elongated size capable of accommodating the rod 10.
A plurality of vapor deposition sources 20 are arranged side by side from the vicinity of 2 to an intermediate position (that is, an intermediate position in the longitudinal direction of the chamber 18).

[Production of Product by Forming Film on Base Material] Using the ion plating device 16 described above, a product (rod) having an abrasion resistant film formed thereon is produced. First, the columnar unused base material 12 is installed at a set position in the chamber 18. The installation position of the base material is determined by, for example, the distance between the reference position S in the chamber 18 and the one end 12L of the base material 12 (arrangement step, see FIG. 2A). In this embodiment, the case where the position of the one end portion 12L of the base material 12 is the reference position S will be described.

Then, after vacuuming the inside of the chamber 18, the abrasion-resistant film 14 is formed by ion plating while rotating the base material 12 around its axis (first film forming step. FIG. 2B. )reference). At that time, the film 1 to the desired thickness
The film forming conditions for forming No. 4 (mainly the film forming time and the output of the ion plating apparatus) are set and the film is formed.

As a result, as shown in FIG. 2C, one end portion 12L of the base material 12 which is a half portion close to the vapor deposition source 20.
The wear-resistant coating 14A is formed from the center portion 12M to the center portion 12M. At the central portion 12M, the film end portion 14T has a gradually thin film thickness.

Next, the pressure in the chamber 18 is returned to the atmospheric pressure, the base material 12 is pulled out from the chamber 18, and the chamber 1
The other end portion 12R close to the back of 8 is rearranged so that the other end portion 12R is disposed at the reference position S, that is, the orientation is reversed by 180 ° (replacement step, see FIG. 3A).

Then, after vacuuming the inside of the chamber 18, a film is formed under the same film forming conditions as in the first film forming step (second film forming step; see FIG. 3B).

As a result, as shown in FIG. 3 (C), the other end portion 12R of the base material 12 which is a half portion close to the vapor deposition source 20 is formed.
The wear-resistant coating 14B is formed from the center portion 12M to the center portion 12M. At the central portion 12M, the coating end portion 1 of the coating 14B
4U is gently thinned, and this film end 14U
Overlaps the film edge 14T.

As a result, the thickness of the connecting portion 14V between the coating film 14A and the coating film 14B, that is, the thickness of the portion where the coating end portion 14T and the coating end portion 14U overlap is about the same as the coating thickness at both ends of the rod. There is. Further, no step is formed on the connecting portion 14V.

As a result, the thickness of the coating 14 can be set to a desired value, and the rod 10 having a uniform thickness of the wear-resistant coating 14 can be manufactured. Therefore, when the coating liquid is applied to the traveling web W using this rod 10,
The contact area between the rod 10 and the web W increases, and the rod 1
It is possible to avoid partial wear of 0.

Therefore, it is possible to prevent the occurrence of coating defects such as a decrease in coating accuracy and a coating stripe even when coating is performed at a high speed. Further, when the rod 10 is used, even if a shearing force or a vertical stress is applied to the surface of the rod 10 by the force applied from the traveling web W, the coating 14 is unlikely to be cracked or peeled. Furthermore, since the life of the rod 10 is extended, the number of rods 10 used is reduced, which greatly contributes to cost reduction. Web W
The operating rate of the production line will be significantly improved.

The coating 14 is diamond-like
Carbon film and titanium nitride film are preferred. Other preferred
As the material, TiCN, CrN, TiC, Al₂O₃,
Cr ₂O₃, SiO₃, Ti₂O₃, AlN, ZrN, Si
For example, C.

If the set position in the chamber 18 is not known in advance, the [Experiment for selecting the set position of the base material] to be performed in the embodiment described below can be performed before manufacturing the product. preferable. In this experiment, for example, the arrangement position of the one end portion 12L of the base material 12 and the reference position S in the chamber 18
The distances of and are changed as parameters such as d ₁ and d _{2 in} FIG. 2A, and the arrangement position where the film thickness is uniform is searched for. This makes it possible to find a preferable setting position. When the same type of ion plating device is used, if one ion plating device knows the set position, the other device can set the same position as the set position.

[Example] In this example, an ion plating apparatus was used to manufacture a rod having a wear-resistant film evenly formed on its surface as follows. As shown in FIG. 4, the coatable range of the ion plating device 36 used in this embodiment is L1 = horizontal direction.
It is within the range of 900 mm. The length of the base material used in this example is L2 = 1600 mm.

[Experiment for selecting the set position of the base material] Before manufacturing the product (rod) in which the film is formed on the base material, the position of the base material 42 in the chamber 38 causes the film thickness to change. The setting position selection process (so-called condition setting experiment) for determining whether or not it is preferable from the viewpoint of uniformity is shown in FIG. 1
To No. First, as shown in FIG.
As shown in (A), one end portion 42L of the base material 42 is aligned with the reference position S in the chamber 38, that is, one end portion 42L.
L was arranged from the reference position S to the inner side of the chamber 38 at a position of X = 0 mm (arrangement step). The one end portion 42L is an end portion near the inlet / outlet port 32 of the chamber 38. The base material 42 was made of stainless steel and had a diameter of 10 mmφ.

After vacuum suction of the chamber 38, the base material 42
The film 44A was formed by ion plating while rotating the shaft around the axis (first film forming step of condition setting. FIG. 5).
(See (B) and (C)). The film 44A was made of TiN (the film 44B described later was also made of TiN), and the film formation time was short.

Next, the pressure in the chamber 38 is returned to the atmospheric pressure, the base material 42 is pulled out from the chamber 38, and the other end portion 42R of the base material 42 is switched so that the other end portion 42R is located at the reference position S. It was placed again inside (replacement step for condition setting, see FIG. 6 (A)).

After vacuuming the inside of the chamber 38, a film 44B is formed under the same conditions as when the first film forming step of condition setting is performed (second film forming step of condition setting. FIG. 6).
(See (B) and (C)).

After the completion of the second film forming step of condition setting, the base material 4
2 was taken out from the chamber 38 and the film thickness distribution was examined (see FIG. 7). The film thickness distribution on the vertical axis in FIG. 7 is a value obtained by dividing the “film thickness” by the “intended film thickness”.

Furthermore, an unused base material 52 (see FIG. 4) is used, and it is 10 mm in the depth direction from the reference position S in the chamber 38.
One end portion 52 of the base material 52 is moved to the moved position (X = 10 mm).
L was combined, and film formation was performed under the same film formation conditions as in the first film formation step of condition setting. The dimensions and material of the base material 52 are the same as those of the base material 42.

Next, in the same manner as the condition replacement process,
The orientation of the base material 52 was changed. At that time, the other end 52R of the base material 52 was brought into a state of being aligned with the position of X = 10 mm.

Further, a film was formed in the same manner as in the second film forming step under conditions, and the film thickness distribution of the film was examined (see FIG. 7).

Similarly, when X = 15 mm,
When X = 20 mm, a film was formed and the film thickness distribution was examined (see FIG. 7).

As a result of the above experiment, as can be seen from FIG.
It has been found that the case where X = 15 mm is most preferable, that is, the film thickness is most uniform.

[Production of Product by Forming Film on Base Material] Next,
A rod 60 on which a wear resistant film 64 is formed (FIG. 9C).
Reference), ie the product was manufactured.

First, as shown in FIG. 8A, an unused base material 62 is used, and the left end position of the base material 62 is X =
The base material 62 was arranged in the chamber 38 so as to be 15 mm (arrangement step). The dimensions and material of the base material 62 are the same as those of the base material 42.

After vacuuming the inside of the chamber 38, the abrasion-resistant film 64A is formed by ion plating while rotating the base material 62 around its axis (first film forming step. FIG. 8B. ) And (C)).

As a result, a wear resistant film 64A was formed from one end portion 62L of the base material 62, which is a half portion close to the vapor deposition source 40, to the central portion 62M. Central part 62M
Then, the film edge portion 64T had a gently thin film thickness.

At the time of film formation, a film (TiN film) having a thickness of 2 μm is formed based on the film thickness formed in [Experiment for selecting the set position of the base material], the film formation time, and the like. With that in mind, the film formation time, device output, etc. were set.

Next, the pressure in the chamber 38 is returned to the atmospheric pressure, the base material 62 is pulled out from the chamber 38 and the orientation is reversed, and the other end portion of the base material 62, that is, the other end portion 62R.
Was re-arranged in the chamber 38 so that the position X was 15 mm (replacement step; see FIG. 9A).

Then, after vacuuming the inside of the chamber 38, a film is formed under the same conditions as when the first film forming step was performed (second film forming step; see FIGS. 9B and 9C). .

As a result, a wear-resistant coating 64B was formed on the base material 62 from the other end 62R, which is a half portion near the vapor deposition source 40, to the central portion 62M. Central part 62M
Then, the film end 64U of the film 64B was gently thinned, and the film end 64U overlapped with the film end 64T.

When the film thickness distribution of the film 64 of the rod 60 was examined, the value of (film thickness of film) / (intended film thickness, ie, 2 μm) was 0.
It was suppressed within the range of 8 to 1.1.

Further, in the same manner as the rod 60 is manufactured, an unused base material 72 (the size, the material and the like are the same as the base material 62) is used and a film having a thickness of 3 μm is formed. Then, the arranging step, the first film forming step, the replacing step, and the second film forming step were sequentially performed. As a result, the joint between the film formed in the first film forming step and the film formed in the second film forming step was gentle.

When the film thickness distribution of the film was examined,
As indicated by the mark X in FIG. 10, the value of (film thickness of coating) / (intended film thickness, that is, 2 μm) was suppressed within the range of 0.85 to 1.1.

As a result, the base material 6 having a total length of 1600 mm
2 (72) surface with a thickness of 2 μm or 3 μm (T
When the iN film) is coated by the ion plating device 36, if the replacement step of pulling back the base material (so-called register mark processing) is performed, (film thickness of film) / (intended film thickness) is 0.8 to It was found that the thickness was suppressed to within the range of 1.2, and the film thickness distribution was excellent.

[Production of Products Performed for Comparison] In this example, for comparison, rods were produced by forming a film without performing a replacement process.

First, an unused base material was used, and the base material was placed in the chamber 38 so that the position of one end of the base material was X = 15 mm. Then, after vacuuming the inside of the chamber 38, a wear resistant film was formed by ion plating (first film forming step).

When the film is formed, the thickness of 2 μm is obtained based on the film thickness, the film forming time, and the like formed in [Experiment for selecting the set position of the base material] without performing the above replacement process. Film formation time, with the intention of forming a film (TiN film) of
The device output etc. were set.

When the film thickness distribution of the rod formed by coating the surface of the base material with the film was examined, as shown by the black square marks in FIG. 10, (film thickness of film) / (intended film thickness, The value of 2 μm) was suppressed within the range of 0.8 to 1.15.

Further, a film having a thickness of 1 μm was intended to be formed by using an unused base material, and the film was similarly formed.

Then, when the film thickness distribution was examined, FIG.
As indicated by the black diamond mark, the value of (film thickness of film) / (intended film thickness, ie, 2 μm) is in the range of 0.6 to 1.6, which is larger than that in the case of performing the replacement process. It was scattered.

Therefore, when a film (TiN film) is coated on the surface of the base material having a total length of 1600 mm by the ion plating device 36, the intended film thickness is obtained unless the replacement step of flipping the base material (so-called register mark processing) is performed. It was found that the film thickness distribution fluctuates when is less than 1 μm.

The friction coefficient and the film hardness of the above four rods were measured. Further, using these four rods, the coating liquid was applied to a web traveling at a traveling speed of 60 m / min, and the state of the coated surface was examined. The results are shown in Table 1.

[0067]

[Table 1] As can be seen from Table 1, it was found that the coefficient of friction and the hardness of the coating were the same, and the coating surface conditions were good. Therefore, it was confirmed that even if the rod in which the film was formed in two steps by the replacement step was used, the coated surface of the web was not adversely affected, and therefore the joint was gentle.

Although the embodiments of the present invention have been described above with reference to the embodiments and examples, the above embodiments are merely examples, and various modifications can be made without departing from the scope of the invention. For example, it can be applied as a method of manufacturing a rod 80 of a type (see FIG. 11) in which an excessive amount of the coating liquid applied to the web W is scraped off. Further, it goes without saying that the scope of rights of the present invention is not limited to the above embodiment.

[0069]

Since the present invention has the above-mentioned structure, the following effects can be obtained.

According to the first aspect of the invention, it is possible to form a film in the second film forming step on the base material portion which exceeds the film forming possible range in the first film forming step.

According to the invention described in claim 2, even if the base material is long, it is possible to obtain a film having a uniform film thickness as a whole.

According to the third aspect of the present invention, it is easy to set the position of the base material, and it is easy to find the set position of the base material where the film is formed with a uniform film thickness.

According to the invention described in claim 4, it is easy to form a film having a strong adhesive force and a uniform film thickness.

[Brief description of drawings]

FIG. 1 is a side sectional view showing that a rod for a coating apparatus manufactured according to an embodiment of the present invention is used.

FIGS. 2A to 2C respectively show that a base material disposing step is performed, a first film forming step is performed, and a first film forming step is performed in an embodiment of the present invention. It is a side surface sectional view showing that a film was formed by a film forming process.

3 (A) to 3 (C) are, respectively, one embodiment of the present invention, in which the arrangement position of the base material has been replaced by the replacement process, and the second film formation process has been performed. as well as,
It is a side surface sectional view showing that a film was formed by the 2nd film formation process.

FIG. 4 is a side view showing that the arrangement position of the base material in the chamber is changed as a parameter in the embodiment.

5 (A) to 5 (C) show that a base material arranging step was performed and a first film forming step was performed in [Experiment for selecting a set position of a base material] of Example. FIG. 3 is a side cross-sectional view showing that the above is performed and that a film is formed by the first film forming step.

6 (A) to 6 (C) are, respectively, in the [Experiment for selecting the set position of the base material] of the example, the replacement step was performed, and the second film formation step was performed. It is a side sectional view showing that a film is formed by the second film forming step.

FIG. 7 is a graph showing a film thickness distribution of a film obtained when [Experiment for selecting a set position of a base material] was performed in an example.

8 (A) to 8 (C) respectively show that an arrangement step is performed in manufacturing a product in the example, and FIG.
It is a side surface sectional view showing that a film is formed and a film is formed by the 1st film forming process.

9 (A) to 9 (C) are, respectively, in the Examples, a replacement process was performed, a second film formation process was performed, and a film was formed by the second film formation process. It is a side sectional view showing that it was filmed.

FIG. 10 is a graph showing a film thickness distribution of a film of a coating device rod obtained in an example.

FIG. 11 is a side cross-sectional view showing an example in which the coating device rod is applied as a rod of a type that scrapes off an excessive amount of the coating liquid applied to the web.

[Explanation of symbols]

10 Rod (Coating device rod) 12 Base material 12L One end 12M central part 12R The other end 14 film 14A film 14B film 14T film edge (first film taper) 14U film end (second film tapering part) 16 Ion plating device 18 chambers 20 evaporation source 36 Ion plating device 38 chambers 40 evaporation source 42 Base material 42L One end 42R The other end 44 film 44A film 44B film 52 Base material 52L One end 52R The other end 60 Rod (Coating Equipment Rod) 62 Base material 62L One end 62M central part 62R One end 64 film 64A film 64B film 64T film edge (first film taper) 64U coating edge (second coating tapering portion) 72 Base material 80 Rod (Coating Equipment Rod)

Claims (4)

[Claims] 1. A method of manufacturing a rod for a coating apparatus, in which a wear-resistant film is formed on the surface of a cylindrical base material, the disposing step of disposing the base material in a chamber of a vapor deposition apparatus. And a first film forming step of depositing a coating material from an evaporation source from one end to the center of the base material, and rearranging the base material so that the positions of the one end and the other end of the base material are interchanged. A method for manufacturing a rod for a coating apparatus, comprising: a replacement step; and a second film forming step of depositing a coating material from the vapor deposition source from the other end portion of the base material to a central portion thereof. 2. In the first film forming step, film formation is performed so that a first film tapering portion that is gently thinned from one end side of the base material toward the central part side is formed. In the film forming step, the film is formed so that the second film gradually decreasing portion, which is gradually thinned from the other end side of the base material toward the central portion side, is formed on the first film gradually decreasing portion. The method for manufacturing a rod for a coating apparatus according to claim 1, wherein 3. The method for manufacturing a rod for a coating apparatus according to claim 1, wherein in the arranging step, the position of the base material is set on the basis of a boundary of a film-forming range. 4. The method for manufacturing a rod for a coating apparatus according to claim 1, wherein an ion plating apparatus is used as the vapor deposition apparatus.