JP2003231158A - Injection molding die - Google Patents

Injection molding die

Info

Publication number
JP2003231158A
JP2003231158A JP2002032355A JP2002032355A JP2003231158A JP 2003231158 A JP2003231158 A JP 2003231158A JP 2002032355 A JP2002032355 A JP 2002032355A JP 2002032355 A JP2002032355 A JP 2002032355A JP 2003231158 A JP2003231158 A JP 2003231158A
Authority
JP
Japan
Prior art keywords
pin
mold
embossing
cavity
die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002032355A
Other languages
Japanese (ja)
Inventor
Tomio Tanigawa
富夫 谷川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Hitachi High Tech Instruments Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Hitachi High Tech Instruments Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd, Hitachi High Tech Instruments Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP2002032355A priority Critical patent/JP2003231158A/en
Publication of JP2003231158A publication Critical patent/JP2003231158A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065Positioning or centering articles in the mould
    • B29C2045/14163Positioning or centering articles in the mould using springs being part of the positioning means

Abstract

<P>PROBLEM TO BE SOLVED: To realize an injection molding die which can dispense with the manual labor and extra time to cut the embossing part of a molding die to the three-dimensional curved surface and unload the die from an injection molding machine and disassemble the die each time an injection shot is made during test molding. <P>SOLUTION: In this injection molding die 200, an embossing pin 6 is fitted into a fixed half 1 of the die 200 in such a way that the pin 6 moves forward/ backward in the vertical direction, while the pin 6 is urged by means of a coil spring 8, and a semi-spherical part 18 formed at the tip of the embossing pin 6 urged by a coil spring 8 is moved back and forth to a cavity 3 by moving forward/backward the semi-spherical part 18 while an adjusting pin 7 is screwed into a truncated-core-shaped hole 19 from the side face of the fixed half 1 and also by advancing/retreating the truncated-core-shaped part 24 formed at the tip of the adjusting pin 7 while sliding the truncated-core-shaped part 24 to the truncated-core-shaped hole 19 of the embossing pin 6. Thus it is possible to achieve the advancing/receding action of the semi-spherical part 18 at the tip part of the embossing pin 6, to a cavity 3. <P>COPYRIGHT: (C)2003,JPO

Description

【発明の詳細な説明】 【発明の属する技術分野】本発明は、フィルムを一体成
形した樹脂成形品のフィルムにエンボス加工を施す射出
成形金型に関する。 【従来の技術】製品の外観を被う樹脂ケースには表示あ
るいはスイッチ操作等の目的ために軟質プラスチックフ
ィルム(以下フィルムという。)の銘板が樹脂ケースに
一体成形されている。このフィルムを介してスイッチの
操作を行う場合、スイッチ部にクリック感を持たせるた
めに、一体成形の際にフィルムを金型に形成した凹部と
突部に挟み込み、フィルムに円弧状の突起(以下エンボ
スという。)を形成している。従来の射出成形金型10
0は、図3に示すように、101は固定型、102は可
動型、103はキャビティ、Aは可動型に装着されたフ
ィルム、104は可動型に形成された凹部、105は固
定型に形成された突部により構成されている。上記構成
を有する射出成形金型100の動作を説明すると、フィ
ルムAが可動型102に装着され、固定型101と可動
型102が閉じられる過程において、可動型102の凹
部104に対して固定型の突部105がフィルムAを突
き上げ、フィルムAが凹部104と突部105に挟み込
まれて、フィルムAの所定箇所に半円球状のエンボスB
が形成される。その後、溶融樹脂Cがキャビティ103
内に射出注入され、フィルムAと溶融樹脂を一体化さ
せ、図4に示すような成形品Dが成形される。 【発明が解決しようとする課題】前記構成の従来の射出
成形金型において前述したエンボス加工を行う場合、フ
ィルムにシワや傷が発生した場合、固定型に形成された
円弧状の突部の高さ(t)を調整している。しかし、突
起の高さ(t)の微調整は、テスト成形をしながら成形
品を確認しながら行い、成形機に金型を取りつけた状態
で調整を行う場合には、固定型と可動型の間に身体を潜
り込ませ、ダイヤモンドヤスリで突部の切削を行うか、
それができない場合は、一旦成形機から金型を降ろし、
分解した状態で、手作業にて突起部の先端部の3次元曲
面を切削しなければならなかった。そのため、前者にお
いては調整は非常に困難で、危険が伴う作業であった。
また、後者においては、非常に多くの時間と手間がかか
っていた。本発明は、このような問題を解決するために
なされたもので、テスト成形において、成形機に取り付
けた状態で金型の突部の切削作業を行うような危険な作
業が不要で、また、成形のショット毎に金型を射出成形
機から降ろして分解する手間と労力が不要な、金型調整
作業の安全性と省力化を図ることができる射出成形金型
を実現することを課題とする。 【課題を解決するための手段】本発明による射出成形金
型は、固定型と、固定型に対して進退自在に固定された
可動型と、固定型と可動型とで形成されたキャビティ
と、可動型に装着されたフィルムと、可動型に形成され
た凹部と、固定型に形成された突部とを有し、固定型と
可動型が閉じることにより、凹部と突部にフィルムが挟
み込まれ、フィルムの所定位置にエンボスが形成される
射出成形金型において、固定型に、キャビティに対して
進退自在に嵌合されたエンボスピンと、エンボスピンの
キャビテイ面に形成された突部と、エンボスピンの側面
に穿設された円錐台状穴と、固定型の側面から円錐台状
穴に対して螺刻されたネジ穴と、ネジ穴に螺合し、円錐
台状の先端部が円錐台状穴に対してくさび状に嵌合する
円錐台状ピンと、エンボスピンをキャビティに対して付
勢する付勢手段とを有し、円錐台状ピンを回転させ、円
錐台状穴に対して進退させることにより、エンボスピン
をキャビテイに対して進退させることを特徴とする。 【発明の実施の形態】図1は本発明の射出成形金型20
0の一実施形態の要部構成を示す断面図であり、エンボ
スを加工するための突部の高さ(t)を調整する機構を
説明したものである。この射出成形金型200は、以下
のように構成されている。本発明の射出成形金型200
は、図1に示すように、1は固定型、2は可動型、3は
キャビティ、Aは可動型に装着されたフィルム、4は可
動型に形成された凹部、5は固定型1に設けられたエン
ボス高さ調整機構とから構成されている。固定型1は、
図示していない射出成形機に固定され、可動型2は、射
出成形機に、固定型1に対して進退自在に固定されてお
り、可動型2が固定型1に向かって進出し、固定型1と
可動型2が閉じて対峙する空間にキャビティが形成され
る。フィルムAは、可動型2のキャビティ面に装着され
る。また、可動型2には、フィルムAの所定位置にエン
ボスBを形成するための凹部4が形成されている。次
に、エンボス高さ調整機構5の構成を説明すると、エン
ボス高さ調整機構5は、エンボスピン6、調整ピン7、
コイルスプリング8、ホロセット9より構成されてい
る。固定型1には、キャビティ3面に対して略垂直に段
付き穴10が貫通している。段付き穴10には、キャビ
ティ3面から順次下方に向かって小内径部11、中内径
部12、大内径部13が夫々形成され、小内径部11、
中内径部12及び大内径部13の夫々内径部に至る接合
面には段付き穴10の中心線に対して垂直にフランジ1
4、15が形成されている。また、前記大内径部13に
は、大内径部13の下方の開口から所定の長さの雌ネジ
が螺刻され、該雌ネジにホロセット9が螺合する。ま
た、前記段付き穴10にはエンボスピン6が摺動自在に
嵌合されている。エンボスピン6は、前記小内径部11
に摺動自在に嵌合する軸部16と前記大内径部13に挿
通する頭部17とから構成され、軸部16の先端部は半
円球状(以下、半円球状部18という。)に加工されて
いる。頭部17は、前記大内径部13の雌ネジにホロセ
ット9が螺合されることにより、大内径部13内を所定
距離移動することができる。前記頭部17の移動距離
は、エンボスピン6の先端の半円球状部18がキャビテ
イ内に進退することにより、(フィルムAに加工され
る)エンボス高さを微調整するために必要とする移動距
離(s)である。(図2に示すように、キャビティ面か
ら半円球状部18の先端までの最適高さを(t)とし、
tの前後の微調整幅をsとする。)エンボスピン6の先
端の半円球状部18は、固定型1と可動型2が閉じられ
たとき、フィルムAを介して可動型1に形成された凹部
4と対峙して、半円球部18と凹部4の間にフィルムA
を挟み込み、圧接することにより、エンボスBを加工す
る。また、エンボスピン6の軸部16の前記中内径部1
2の位置に挿入され、前記段付き穴10のフランジ14
とエンボスピン6の頭部17の上面との間に挟持された
コイルスプリング8は、エンボスピン6の頭部17を下
方へ付勢している。従って、エンボスピン6の頭部17
は、前記段付き穴10のフランジ15とホロセット上面
との間を、コイルスプリング8に付勢されながら移動す
ることができる。また、エンボスピン6の軸部16の側
面には、エンボスピン6の軸心に垂直に円錐台状穴19
が形成されている。また、固定型1には、固定型1の側
面から、前記円錐台状穴19と同軸上に段付き穴20が
穿設されている。該段付き穴20は、前記段付き穴10
の小内径部11の内壁に開口し、該内壁開口部から順に
左方へ、小内径部21と大内径部22が穿設され、大内
径部22は、固定型1の側面に開口している。また、大
内径部22の内周には、雌ネジが螺刻してある。前記段
付き穴20には調整ピン7が螺合している。調整ピン7
は有頭ピンで、ピン部23は、前記小内径部21に挿通
され、ピン先端部には、前記エンボスピン6の円錐台状
穴19に嵌合する円錐台状部24を有する。調整ピン7
の頭部25の外周には雄ネジが螺刻してあり、前記段付
き穴20の大内径部22の雌ネジに螺合する。図2に示
すように、調整ピン7の頭部25を回転させることによ
り、大内径部22の空間を所定距離左右に移動すること
ができ、調整ピン7のピン先端の円錐台状部24が前記
エンボスピン6の円錐台状穴19に対してくさび状に摺
動しながら左右に移動する。前記調整ピン7が段付き穴
20の中を進退することにより、常にコイルスプリング
8にて下方に付勢されたエンボスピン6の円錐台状穴1
9の内壁が、調整ピン7の円錐台状部24に摺動しなが
ら上下方向に移動し、エンボスピン6の先端部の半円球
状部18がキャビティ3に対して上下方向に移動する。
前記構成による本発明の射出成形金型の成形動作を説明
する。射出成形金型200が開放状態にあるときに、可
動型2にフィルムAを装着する。次に、可動型2が固定
型1に対して前進することにより金型が閉じる。金型が
閉じると同時に、可動型2の凹部4と、固定型1の半円
球状部18との間でフィルムAが挟み込まれ、フィルム
AにエンボスBが加工される。次に、キャビティ3に、
図示していない射出成形機から溶融樹脂Cが射出され、
エンボスB以外の部分に溶融樹脂Cが充填される。次
に、溶融樹脂Cが冷却固化すると、可動型2が固定型1
から退出し、金型が開放し、図4に示すように、フィル
ムAが一体成形された成形品Dが型外へ取り出される。
前述した射出成形動作の際に、フィルムAのエンボスB
にシワや傷が発生した場合には、調整ピン7を回転させ
て円錐台状部24を左方に後退させ、エンボスピン6の
先端部の半円球状部18を若干下げることにより、(例
えば、調整ピン7が1回転すると半円球状部18は約
0.1mm移動する。)シワや傷をとることができる。
前記シワは放射状にフィルムAがよじれたようなライン
となって現れ、それがより進むと傷となり、極端に進む
とそこから破れが生じる。また、シワにならなくともフ
ィルムが最適高さ(t)でプレスされないと、製品を使
用中にエンボスを繰り返し操作していくうちに亀裂が生
じることもある。また、プラスッチックの材質や材厚に
よってもフィルムAを突き上げる半円球状部18の最適
高さ(t)が微妙に異なってくる。従って、本発明は前
述したような調整ピン7による微調整を、テスト成形を
繰り返しながら、金型を射出成形機に取り付けたまま
で、シワの発生しない半円球状部18の最適の高さ
(t)を調整することができる。また、エンボスBはス
イッチ等の操作を行うためのものであり、その操作感
(クリック感)がエンボス高さにより異なり、成形品の
エンボスのクリック感を確かめながらテスト成形を行
い、最適のクリック感のエンボス高さを調整することも
できる。また、本実施例においては、エンボスピン6を
固定型に直接設けたが、固定型の内部に別途キャビティ
型を入れ子にして、キャビティ型に設けることもでき
る。 【発明の効果】本発明の上述したような構成であるか
ら、テスト成形において、成形機に取り付けた状態で金
型の間に身体を入り込ませての突部の切削作業を行うよ
うな危険な作業が不要となり、また、前述するような危
険な作業を回避するために、成形のショット毎に金型を
射出成形機から降ろして分解して突部の切削作業をする
労力と時間が不要となり、少ない労力で短時間でエンボ
スの突部の金型調整作業を行うことができ、金型調整作
業の安全と省力化を図ることができる射出成形金型を実
現することができる。
Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an injection mold for embossing a film of a resin molded product obtained by integrally molding a film. 2. Description of the Related Art A name plate of a soft plastic film (hereinafter, referred to as a film) is integrally formed on a resin case for display, switch operation, and the like on a resin case covering the appearance of a product. When the switch is operated through this film, the film is sandwiched between a concave portion and a projecting portion formed in a mold at the time of integral molding, so that the switch portion has a click feeling, and an arc-shaped projection (hereinafter, referred to as a film) is formed on the film. Embossing). Conventional injection mold 10
0, as shown in FIG. 3, 101 is a fixed mold, 102 is a movable mold, 103 is a cavity, A is a film mounted on the movable mold, 104 is a recess formed in the movable mold, and 105 is a fixed mold. It is constituted by the projected part. The operation of the injection mold 100 having the above configuration will be described. In the process in which the film A is mounted on the movable mold 102 and the fixed mold 101 and the movable mold 102 are closed, the fixed mold 101 is The protruding portion 105 pushes up the film A, and the film A is sandwiched between the concave portion 104 and the protruding portion 105.
Is formed. After that, the molten resin C
Then, the film A and the molten resin are integrated to form a molded product D as shown in FIG. When the above-described embossing process is performed on the conventional injection mold having the above-described structure, when the film is wrinkled or flawed, the height of the arc-shaped protrusion formed on the fixed mold is increased. (T) is adjusted. However, fine adjustment of the height (t) of the projection is performed while checking the molded product while performing test molding, and when the adjustment is performed with the mold attached to the molding machine, the adjustment of the fixed mold and the movable mold is performed. Squeeze the body in between and cut the protrusion with a diamond file,
If that is not possible, once lower the mold from the molding machine,
In the disassembled state, the three-dimensional curved surface at the tip of the projection had to be cut manually. Therefore, in the former case, the adjustment was very difficult and involved a dangerous operation.
In the latter case, much time and effort was required. The present invention has been made in order to solve such a problem, and in test molding, a dangerous operation such as cutting a protrusion of a mold while being attached to a molding machine is unnecessary, and It is an object of the present invention to provide an injection molding die that does not require the labor and labor of unloading and disassembling the die from an injection molding machine for each molding shot, and can achieve safety and labor saving in die adjustment work. . According to the present invention, there is provided an injection mold, comprising: a fixed mold, a movable mold fixed to the fixed mold so as to advance and retreat, a cavity formed by the fixed mold and the movable mold, It has a film mounted on a movable die, a concave portion formed on the movable die, and a protrusion formed on the fixed die, and the film is sandwiched between the concave portion and the protrusion by closing the fixed die and the movable die. An embossing pin, which is fitted into a fixed mold so as to be able to advance and retreat with respect to a cavity, a projection formed on a cavity surface of the embossing pin, and an embossing pin. Frusto-conical hole drilled on the side of the screw, and a screw hole threaded from the fixed side to the frusto-conical hole, and screwed into the screw hole, the frusto-conical tip is frusto-conical A frusto-conical pin that wedges into the hole, Having a biasing means for biasing the boss pin against the cavity, rotating the frustum-shaped pin, and moving the embossed pin forward and backward with respect to the cavity by moving the frustum-shaped hole toward and away from the cavity. I do. FIG. 1 shows an injection mold 20 according to the present invention.
0 is a cross-sectional view illustrating a configuration of a main part of an embodiment of the present invention, illustrating a mechanism for adjusting a height (t) of a protrusion for processing an emboss. The injection mold 200 is configured as follows. Injection Mold 200 of the Present Invention
As shown in FIG. 1, 1 is a fixed mold, 2 is a movable mold, 3 is a cavity, A is a film mounted on the movable mold, 4 is a recess formed in the movable mold, and 5 is provided on the fixed mold 1. And an emboss height adjustment mechanism provided. Fixed type 1
The movable mold 2 is fixed to an injection molding machine (not shown), and is fixed to the injection molding machine so as to be able to advance and retreat with respect to the fixed mold 1. A cavity is formed in a space where the mold 1 and the movable mold 2 are closed and opposed to each other. The film A is mounted on the cavity surface of the movable mold 2. Further, the movable die 2 is formed with a concave portion 4 for forming an emboss B at a predetermined position of the film A. Next, the configuration of the embossing height adjusting mechanism 5 will be described. The embossing height adjusting mechanism 5 includes an embossing pin 6, an adjusting pin 7,
It comprises a coil spring 8 and a holo set 9. A stepped hole 10 penetrates through the fixed die 1 substantially perpendicular to the surface of the cavity 3. In the stepped hole 10, a small inner diameter portion 11, a middle inner diameter portion 12, and a large inner diameter portion 13 are respectively formed in order from the surface of the cavity 3 downward, and the small inner diameter portion 11,
A flange 1 is formed perpendicularly to the center line of the stepped hole 10 on the joint surface reaching the inner diameter portion of the middle inner diameter portion 12 and the inner diameter portion 13.
4 and 15 are formed. Further, a female screw having a predetermined length is screwed into the large-diameter portion 13 from an opening below the large-diameter portion 13, and the horo set 9 is screwed into the female screw. An embossing pin 6 is slidably fitted in the stepped hole 10. The embossing pin 6 is provided with the small inner diameter portion 11.
The shaft portion 16 is slidably fitted to the head portion 17 and the head portion 17 is inserted into the large-diameter portion 13. The tip of the shaft portion 16 has a semi-spherical shape (hereinafter, referred to as a semi-spherical portion 18). It has been processed. The head 17 can be moved within the large-diameter portion 13 by a predetermined distance by screwing the horo set 9 into the female screw of the large-diameter portion 13. The moving distance of the head 17 is the movement required for finely adjusting the emboss height (processed into the film A) by moving the semi-spherical portion 18 at the tip of the embossing pin 6 into and out of the cavity. Distance (s). (As shown in FIG. 2, the optimal height from the cavity surface to the tip of the hemispherical portion 18 is (t),
The fine adjustment width before and after t is s. The semi-spherical portion 18 at the tip of the embossing pin 6 faces the concave portion 4 formed in the movable die 1 via the film A when the fixed die 1 and the movable die 2 are closed, and 18 between the recess 18 and the recess 4
The emboss B is processed by sandwiching and pressing. Further, the middle inner diameter portion 1 of the shaft portion 16 of the embossing pin 6 is formed.
2 and the flange 14 of the stepped hole 10
The coil spring 8 sandwiched between the head of the embossing pin 6 and the upper surface of the head 17 of the embossing pin 6 urges the head 17 of the embossing pin 6 downward. Therefore, the head 17 of the embossing pin 6
Can move while being urged by the coil spring 8 between the flange 15 of the stepped hole 10 and the upper surface of the horo set. Further, on the side surface of the shaft portion 16 of the embossing pin 6, a truncated conical hole 19 perpendicular to the axis of the embossing pin 6 is provided.
Is formed. The fixed die 1 is provided with a stepped hole 20 coaxially with the truncated conical hole 19 from the side surface of the fixed die 1. The stepped hole 20 is provided with the stepped hole 10.
The small inner diameter portion 11 is opened to the inner wall of the small inner diameter portion 11, and a small inner diameter portion 21 and a large inner diameter portion 22 are bored in order from the inner wall opening to the left. I have. A female screw is threaded on the inner periphery of the large inner diameter portion 22. The adjustment pin 7 is screwed into the stepped hole 20. Adjusting pin 7
Is a headed pin, and the pin portion 23 is inserted through the small inner diameter portion 21, and has a frusto-conical portion 24 at the tip of the pin that fits into the frusto-conical hole 19 of the embossing pin 6. Adjusting pin 7
A male screw is threaded on the outer periphery of the head 25, and is screwed into a female screw of the large inner diameter portion 22 of the stepped hole 20. As shown in FIG. 2, by rotating the head 25 of the adjustment pin 7, the space of the large inner diameter portion 22 can be moved right and left by a predetermined distance, and the truncated conical portion 24 at the tip end of the adjustment pin 7 can be moved. The embossing pin 6 moves right and left while sliding in a wedge shape with respect to the truncated conical hole 19 of the embossing pin 6. The adjusting pin 7 advances and retreats in the stepped hole 20, so that the truncated conical hole 1 of the embossing pin 6 always urged downward by the coil spring 8.
The inner wall 9 moves vertically while sliding on the truncated conical portion 24 of the adjustment pin 7, and the semi-spherical portion 18 at the tip of the embossing pin 6 moves vertically with respect to the cavity 3.
The molding operation of the injection molding die of the present invention having the above-described configuration will be described. When the injection mold 200 is in the open state, the film A is mounted on the movable mold 2. Next, the movable mold 2 is advanced with respect to the fixed mold 1 to close the mold. Simultaneously with the closing of the mold, the film A is sandwiched between the concave portion 4 of the movable mold 2 and the semi-spherical portion 18 of the fixed mold 1, and the emboss B is formed on the film A. Next, in cavity 3,
Molten resin C is injected from an injection molding machine not shown,
A portion other than the emboss B is filled with the molten resin C. Next, when the molten resin C is cooled and solidified, the movable mold 2 is moved to the fixed mold 1.
Then, the mold is opened, and as shown in FIG. 4, a molded product D integrally formed with the film A is taken out of the mold.
In the above-described injection molding operation, the emboss B of the film A is used.
In the case where wrinkles or scratches occur, the adjusting pin 7 is rotated to retreat the frustoconical portion 24 to the left and the semi-spherical portion 18 at the tip of the embossing pin 6 is slightly lowered (for example, When the adjustment pin 7 makes one rotation, the semi-spherical portion 18 moves about 0.1 mm.) Wrinkles and scratches can be taken.
The wrinkles appear radially as kinked lines of the film A, and when the wrinkles are further advanced, they are flaws, and when they are extremely advanced, tears are generated therefrom. Also, if the film is not pressed at the optimum height (t) without wrinkling, cracks may occur during repeated use of embossing while using the product. Also, the optimum height (t) of the semi-spherical portion 18 that pushes up the film A slightly differs depending on the material and thickness of the plastic. Therefore, according to the present invention, the fine adjustment by the adjustment pin 7 as described above is repeated while performing the test molding, and the optimum height (t) of the semi-spherical portion 18 where no wrinkles are generated while the mold is attached to the injection molding machine. ) Can be adjusted. Emboss B is used to operate switches and the like, and the operation feeling (click feeling) varies depending on the emboss height. Test molding is performed while confirming the click feeling of the emboss of the molded product, and the optimum click feeling is obtained. You can also adjust the emboss height. In this embodiment, the embossing pin 6 is provided directly on the fixed mold. However, the embossed pin 6 may be provided on the cavity mold by separately nesting the cavity mold inside the fixed mold. According to the above-described structure of the present invention, in test molding, there is a danger of cutting a protruding part by inserting a body between dies while being attached to a molding machine. This eliminates the need for work, and eliminates the labor and time required to remove the mold from the injection molding machine for each molding shot and disassemble it to cut the protrusions in order to avoid dangerous work as described above. In addition, it is possible to perform an operation of adjusting the die of the embossed protrusion in a short time with a small amount of labor, and to realize an injection molding die that can achieve safety and labor saving of the die adjusting operation.

【図面の簡単な説明】 【図1】本発明の一実施例である射出成形金型のエンボ
ス高さ調整機構において調整ピンを右方へ押し込んだ状
態説明する断面図である。 【図2】同じく、調整ピン左方へ後退させた状態を示す
断面図である。 【図3】従来における射出成形金型の断面図である。 【図4】エンボスを有するフィルム一体成形品の断面図
である。 【符号の説明】 1 固定型 2 可動型 3 キャビティ A フィルム 4 凹部 6 エンボスピン 18 半円球状部(突部) 19 円錐台状穴 20 段付き穴(ネジ穴) 24 円錐台状部(円錐台状ピン) 8 コイルスプリング(付勢手段) 10 シワ押え圧力調整機構
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view illustrating a state in which an adjustment pin is pushed rightward in an emboss height adjustment mechanism of an injection mold according to an embodiment of the present invention. FIG. 2 is a cross-sectional view showing a state in which the adjustment pin is retracted to the left. FIG. 3 is a sectional view of a conventional injection mold. FIG. 4 is a cross-sectional view of a film-integrated molded product having an emboss. [Description of Signs] 1 Fixed mold 2 Movable mold 3 Cavity A Film 4 Recess 6 Emboss pin 18 Semicircular part (projection) 19 Truncated conical hole 20 Stepped hole (screw hole) 24 Truncated conical part (Truncated cone) 8) Coil spring (biasing means) 10 Wrinkle presser pressure adjustment mechanism

───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 4F202 AD08 AG21 CA11 CB01 CB13 CK82 CK90 CQ01 4F206 AD08 AG21 JA07 JB13 JN25 JQ81    ────────────────────────────────────────────────── ─── Continuation of front page    F term (reference) 4F202 AD08 AG21 CA11 CB01 CB13                       CK82 CK90 CQ01                 4F206 AD08 AG21 JA07 JB13 JN25                       JQ81

Claims (1)

【特許請求の範囲】 【請求項1】固定型と、固定型に対して進退自在に固定
された可動型と、固定型と可動型とで形成されたキャビ
ティと、可動型に装着されたフィルムと、可動型に形成
された凹部と、固定型に形成された突部とを有し、前記
固定型と可動型とが閉じることにより、前記凹部と突部
にフィルムが挟み込まれ、フィルムの所定位置にエンボ
スが形成される射出成形金型において、前記固定型に、
前記キャビティに対して進退自在に嵌合されたエンボス
ピンと、該エンボスピンのキャビテイ面に形成された突
部と、前記エンボスピンの側面に穿設された円錐台状穴
と、前記固定型の側面から前記円錐台状穴に対して螺刻
されたネジ穴と、前記ネジ穴に螺合し、円錐台状の先端
部が前記円錐台状穴に対してくさび状に嵌合する円錐台
状ピンと、前記エンボスピンをキャビティに対して付勢
する付勢手段とを有し、前記円錐台状ピンを回転させ、
前記円錐台状穴に対して進退させることにより、前記エ
ンボスピンを前記キャビテイに対して進退させることを
特徴とする射出成形金型。
Claims: 1. A fixed mold, a movable mold fixed to the fixed mold so as to advance and retreat, a cavity formed by the fixed mold and the movable mold, and a film mounted on the movable mold. And a recess formed in a movable mold, and a protrusion formed in a fixed mold, and when the fixed mold and the movable mold are closed, a film is sandwiched between the recess and the protrusion, and a predetermined In an injection mold in which an emboss is formed at a position, in the fixed mold,
An embossing pin fitted to the cavity so as to be able to advance and retreat, a projection formed on a cavity surface of the embossing pin, a truncated conical hole formed in a side surface of the embossing pin, and a side surface of the fixed mold. A threaded hole threaded to the frusto-conical hole, and a frusto-conical pin screwed into the threaded hole and having a frusto-conical tip fitted wedge-shaped with respect to the frusto-conical hole. Having biasing means for biasing the embossing pin against the cavity, rotating the frustoconical pin,
An injection molding die, wherein the embossing pin is advanced and retracted with respect to the cavity by being advanced and retracted with respect to the truncated conical hole.
JP2002032355A 2002-02-08 2002-02-08 Injection molding die Pending JP2003231158A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002032355A JP2003231158A (en) 2002-02-08 2002-02-08 Injection molding die

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002032355A JP2003231158A (en) 2002-02-08 2002-02-08 Injection molding die

Publications (1)

Publication Number Publication Date
JP2003231158A true JP2003231158A (en) 2003-08-19

Family

ID=27775504

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002032355A Pending JP2003231158A (en) 2002-02-08 2002-02-08 Injection molding die

Country Status (1)

Country Link
JP (1) JP2003231158A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005233996A (en) * 2004-02-17 2005-09-02 Matsushita Electric Ind Co Ltd Display panel and control indicator panel
US7598926B2 (en) 2004-02-17 2009-10-06 Panasonic Corporation Display panel, control display panel and method for integrally molding insert material
CN102873829A (en) * 2012-10-15 2013-01-16 勋龙精密模具(昆山)有限公司 Mold with novel touch-breaking insert

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005233996A (en) * 2004-02-17 2005-09-02 Matsushita Electric Ind Co Ltd Display panel and control indicator panel
US7598926B2 (en) 2004-02-17 2009-10-06 Panasonic Corporation Display panel, control display panel and method for integrally molding insert material
CN102873829A (en) * 2012-10-15 2013-01-16 勋龙精密模具(昆山)有限公司 Mold with novel touch-breaking insert

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