JP2003230533A - Imaging apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent invasion of moisture that passes through an adhesive agent for fixing a lens exposing to an objective side for observation to a lens frame, and to release the moisture invaded not permitting to stay. <P>SOLUTION: A ring-shaped member 26 is installed between an anterior inner periphery 23 of a lens frame 21 and an outer periphery of a group of lens 20, and a space 30 being surrounded by a bottom portion 29 of the ring-shaped member 26, the inner periphery 23 of the lens frame 21 and the outer periphery of the group of lens 20 is provided to fill the space with an adhesive agent to secure a water tightness and fixation therein. A protrusion 27 is provided with the ring-shaped member 26 in a direction of an internal diameter of a leading edge thereof. The protrusion 27 has a taper 28 that becomes smaller toward a direction of an inner diameter, which nearly comes in contact with a chamfer 25 of the forefront outer periphery of the first lens 11. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image pickup device used in an endoscope having an objective optical system.

[0002]

2. Description of the Related Art In recent years, by inserting an elongated insertion portion into a body cavity, a living body tissue is sampled by observing organs in the body cavity or the like and using forceps inserted into a forceps channel as necessary. Medical endoscopes for making detailed diagnoses are widely used.

As an example of such a medical endoscope, in the endoscope disclosed in Japanese Patent Laid-Open No. 9-234183, an image pickup device having an objective optical system is arranged at the end of the endoscope. The lens exposed on the observation target surface side of the objective optical system is housed in a lens frame and is watertightly fixed by applying an adhesive to the outer periphery of the lens.

In the case of a medical endoscope, it is essential to surely sterilize the used endoscope in order to prevent infections and the like. When disinfecting or sterilizing with a cleaning liquid, the disinfection work is complicated, and there is a disadvantage that a large amount of cost is required for treating the waste liquid of the cleaning liquid.

Therefore, recently, high-pressure high-temperature steam sterilization (autoclave, etc.) without complicated work is becoming the mainstream in endoscopic equipment.

On the other hand, as the electronic endoscope, there is a side-viewing electronic endoscope for observing the side with respect to the longitudinal axis of the insertion portion as a type other than the front-viewing type.

FIG. 32 is a sectional view showing the tip of the insertion portion of such a conventional side-view electronic endoscope. As shown in FIG. 32, the distal end portion 901 of the insertion portion of the side-view electronic endoscope includes a metallic distal end member 911, a prism unit 921, and an imaging unit 931.

The tip member 911 is a prism unit 92.
1 and the imaging unit 931 are stored.

The image pickup unit 931 is composed of an objective lens unit 932 and an element unit 941.

The objective lens unit 932 is composed of a plurality of lenses 933 and 934 and a lens frame 935. The lens frame 935 is formed in a tubular shape and houses and fixes the plurality of lenses 933 and 934.

The element unit 941 includes a holding frame 942,
It is composed of a tube 943, a cover glass 944, a solid-state image sensor 945, a circuit board 946, and a signal cable 947.

The holding frame 942 houses a cover glass 944 and a solid-state image sensor 945 with the center of the cover glass 944 and the effective pixel center of the solid-state image sensor 945 aligned. A circuit board 946 for signal processing is connected to the back surface of the solid-state image sensor 945 in a substantially vertical direction.

The signal cable 947 includes a plurality of signal lines 948.
It is composed of a bundle. A plurality of signal lines 94 of a signal cable 947 are provided on the solid-state image sensor 945 and the circuit board 946.
8 are connected.

The cover glass 944 and the solid-state image pickup element 94
5, the circuit board 946, and the tip end side of the signal cable 947 are covered with a holding frame 942 and a tube 943.

An adhesive 949 is filled inside the holding frame 942 and the tube 943. The holding frame 942, the tube 943, the cover glass 944, and the solid-state image sensor 945 are integrally fixed with an adhesive 949. The imaging unit 931 is formed by inserting and holding the holding frame 942 of the element unit 941 in the lens frame 935 of the objective lens unit 932.

The prism unit 921 includes a first lens 9
22 and a prism 923.

The first lens 922 is the prism unit 9
It is arranged on the surface side of 21 and is exposed on the observation target surface side outside the tip member 911.

The prism 923 is a prism unit 92.
The optical path of the optical path from the first lens 922 is arranged on the back surface side of the first lens 922.

At the tip portion 901, when the prism unit 921 is housed in the tip member 911, the image pickup unit 93 is used.
In order to align the optical axis center with No. 1, the position of the prism unit 921 is adjusted to obtain the optical performance.

At the tip portion 901, the prism unit 921 and the image pickup unit 931 are assembled to form an image pickup apparatus for a side-view electronic endoscope.

[0021]

[Patent Document 1] Japanese Unexamined Patent Publication No. 9-23418
Since the endoscope described in Japanese Patent No. 3 is watertightly fixed only with an adhesive, moisture is transmitted by the disinfection / sterilization treatment of an autoclave or the like and stays inside the objective optical system to cause clouding of the visual field.

In particular, in the image pickup apparatus, even if a small amount of water such as humidity penetrates into the tip portion of the image pickup apparatus, the objective optical system is fogged from the inside, or the solid-state image pickup element or an electronic component for processing a signal from the solid-state image pickup element. There is a risk of corroding or short-circuiting the substrate mounted with, and the image quality of the endoscopic image obtained in such a state will be remarkably deteriorated.

Further, at the tip portion 901 of the side-view electronic endoscope shown in FIG. 32, the prism unit 921 and the image pickup unit 931 are arranged in series in the longitudinal direction of the endoscope insertion portion, so that the image pickup apparatus is provided. Was long and large. Further, at the tip portion 901, the centering adjustment of the prism unit 921 and the image pickup unit 931 by the optical path conversion of the prism 923 is required, which makes the assembly complicated.

The present invention has been made in view of the above circumstances, and prevents moisture that has penetrated through an adhesive that fixes the lens exposed on the surface to be observed to the lens frame from entering and retains the moisture that has entered. It is an object of the present invention to provide an imaging device having a fixing structure that can be opened without opening.

Another object of the present invention is to provide an image pickup apparatus capable of improving the assembling property and downsizing of the endoscope distal end portion of the side-view electronic endoscope.

[0026]

In order to achieve the above object, an image pickup device according to claim 1 is housed in a distal end portion of an insertion portion of an endoscope, and a plurality of lenses for observing an observation object and these. Between the outer peripheral portion of the lens arranged at the tip on the observation target side of the plurality of lenses and the inner peripheral portion of the lens frame. While disposing a ring-shaped member in, to provide a space surrounded by the bottom surface of the ring-shaped member, the inner peripheral portion of the lens frame, and the outer peripheral portion of the lens at the tip,
It is characterized in that the space is filled with an adhesive.

An image pickup apparatus according to a second aspect of the present invention is an optical axis of an objective optical system which is arranged at a distal end portion of an endoscope of a side-view electronic endoscope and which is tilted toward a hand side from a right angle with respect to an endoscope insertion portion. A solid-state image pickup element having an image pickup surface arranged perpendicularly to the solid-state image pickup element, and the solid-state image pickup element is arranged on the back surface side of the solid-state image pickup element of the endoscope tip portion, and is electrically connected to the solid-state image pickup element; A circuit board to which a signal cable extending to the rear end side is connected.

[0028]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. (First Embodiment) FIG. 1 is a sectional view showing a distal end side of an observation objective optical system of an image pickup apparatus according to a first embodiment of the present invention.

(Structure) In FIG. 1, an image pickup apparatus 1 according to the first embodiment is provided at a distal end portion of an insertion portion of an endoscope and has a plurality of lenses 11 and 1 for observing an observation target.
The objective optical system 10 is provided with a lens frame 21 for holding the lenses 11, 12, 13 ... The lenses 11 and 12 are the front lens group 20.

The lens frame 21 is formed in a cylindrical shape, and a protrusion 22 in the inner diameter direction is formed in the inner middle portion. The front side of the projection 22 of the lens frame 21 is a front inner peripheral portion 23 that houses the lens group 20, and the lens frame 21
The rear side of the protruding portion 22 is a rear side inner peripheral portion 24 that houses the lenses 13 of the rear group.

The surface of the first lens 11 of the lens group 20 is exposed to the outside, and a chamfer 25 is provided on the outer peripheral portion on the surface side. The second lens 12 is in contact with the back surface of the first lens 11.

A ring-shaped member 26 is arranged between the front inner peripheral portion 23 of the lens frame 21 and the outer peripheral portion of the lens group 20,
A space 30 surrounded by the bottom surface portion 29 of the ring-shaped member 26, the inner peripheral portion 23 of the lens frame 21, and the outer periphery of the lens group 20 is provided. The space 30 is filled with an adhesive 31 for ensuring water tightness and fixing.

The ring-shaped member 26 is provided with a protrusion 27 in the inner diameter direction on the tip side. A taper 28 is formed on the tip end side of the protrusion 27 so as to decrease in the inner diameter direction. The taper 28 is substantially in contact with the chamfer 25 on the outer circumference of the tip of the first lens 11.

As the adhesive 31, an adhesive having elasticity, heat resistance and chemical resistance, for example, a silicone resin adhesive is used. The ring-shaped member 26 is made of, for example, metal or rubber.

With such a structure, between the outer peripheral portions of the lenses 11, 12 and the inner peripheral portion 23 of the lens frame 21 arranged at the tip of the observation target side among the plurality of lenses 11, 12, 13 ,. While arranging the ring-shaped member 26 in
A space 3 surrounded by a bottom surface portion 29 of the ring-shaped member 26, an inner peripheral portion 23 of the lens frame 21, and outer peripheries of the lenses 11 and 12 at the tips.
0 is provided and filled with the adhesive 31.

(Operation) When a pressing process such as an autoclave is performed on the endoscope using the image pickup apparatus 1 of the first embodiment, the ring-shaped member 26 moves in the pressing direction. The chamfer 25 of the first lens 11 that is pushed and is in contact with the taper 28 is pushed, and the first lens 11 and the second lens 1 are pushed.
The degree of close contact between the projection 2 and the projection 2 is strengthened, which prevents moisture from entering the inside of the objective optical system 10. When the depressurizing step is performed on the endoscope using the image pickup apparatus 1, the ring-shaped member 26 is pulled in the pulling direction, and the first lens 11 and the second lens 1 are pulled.
The close contact between 2 and the protrusion 22 is relaxed, and the water that has entered due to the pressure difference with the outside is released to the outside. In each of the above steps, the adhesive 31 improves the movement of the ring-shaped member 26.

(Effect) As described above, according to the first embodiment, the moisture that has permeated through the adhesive 31 for fixing the lens 11 exposed on the observation surface side to the lens frame 21 is prevented from entering the inside. Since it is possible to prevent the moisture that has entered from opening without retaining it, it is possible to prevent fogging from the inside of the objective optical system 10 and to mount a solid-state imaging device or a substrate on which an electronic component for processing signals from the solid-state imaging device is mounted. It is possible to prevent the corrosion and short circuit of the electronic parts, and prevent the deterioration of the image quality of the endoscopic image.

(Second Embodiment) FIG. 2 shows a second embodiment of the present invention.
FIG. 3 is a cross-sectional view showing a front end side of an observation objective optical system of the image pickup apparatus according to the embodiment. In FIG. 2, the same components as those in the first embodiment shown in FIG. 1 are designated by the same reference numerals and the description thereof is omitted.

(Structure) In FIG. 2, the objective optical system 40 of the image pickup apparatus 4 according to the second embodiment differs from that of the second embodiment only in the ring-shaped member 46.

The ring-shaped member 46 is provided with a protrusion 47 in the inner diameter direction on the distal end side. The protrusion 47 is formed in a flange shape having the same thickness in the inner diameter direction. An edge portion 48 of the protruding portion 47 on the rear end side of the endoscope is the first lens 1
1 is almost in contact with the chamfer 45 on the outer circumference of the tip.

(Operation) With the above configuration, when the pressurizing process such as the autoclave is performed on the endoscope using the image pickup apparatus 4, the ring-shaped member 46 is projected by the protrusion 47 to the first lens 11. By pressing the chamfer 25, the degree of adhesion between the first lens 11 and the second lens 12 is strengthened. Further, when the depressurizing step is performed on the endoscope using the image pickup apparatus 1, the ring-shaped member 46 is pulled in the pulling direction and the first lens 11 and the second lens 11 are pulled.
The adhesion of the lens 12 is reduced.

(Effect) As described above, according to the second embodiment, the ring-shaped member 46 applies the same force as that of the first embodiment to the first lens 11, so that the first embodiment is different from the first embodiment. You can get the same effect.

(Third Embodiment) FIG. 3 shows a third embodiment of the present invention.
FIG. 3 is a cross-sectional view showing a front end side of an observation objective optical system of the image pickup apparatus according to the embodiment. In FIG. 3, the same components as those in the first embodiment shown in FIG. 1 are designated by the same reference numerals and the description thereof is omitted.

(Structure) In FIG. 3, in the objective optical system 50 of the image pickup apparatus 5 according to the third embodiment, a lens frame 51 is provided.
Is formed in a cylindrical shape, and a protrusion 52 in the inner diameter direction is formed near the inner tip. The front side of the protrusion 52 of the lens frame 51 is a front inner peripheral portion 53 that houses the first lens 11, and the rear side of the protrusion 52 of the lens frame 51 is the second lens 12, the diaphragm 14, and the third. Lens 13
It is a rear side inner peripheral portion 54 for accommodating ...

With such a structure, the protrusion 5 of the first lens 11 and the second lens 12 toward the inner peripheral surface of the lens frame 51 is formed.
2 is sandwiched.

A ring-shaped member 56 is disposed between the front inner peripheral portion 53 of the lens frame 51 and the outer peripheral portion of the first lens 11, and the bottom surface portion 59 of the ring-shaped member 56 and the inner peripheral portion of the lens frame 51 are arranged. A space 60 surrounded by the outer periphery of the portion 53 and the lens group 50 is provided. The space 60 is filled with the adhesive 31.

The ring-shaped member 56 is provided with a protrusion 27 similar to that shown in FIG.

(Operation) With the above configuration, when the pressurizing process such as the autoclave is performed on the endoscope using the image pickup device 5, the ring-shaped member 56 is pushed in the pressurizing direction,
Chamfer 25 of the first lens 11 which is in close contact with the taper 28
Is pushed, the closeness of contact between the first lens 11 and the protrusion 52 is strengthened, and water is prevented from entering the inside of the objective optical system 50. When the depressurizing step is performed on the endoscope using the image pickup device 5, the ring-shaped member 56 is pulled in the pulling direction.
The close contact between the lens 11 and the protrusion 52 is relaxed, and the water that has entered due to the pressure difference with the outside is released to the outside.

(Effect) As described above, according to the third embodiment, even when the projection 52 on the inner peripheral surface side of the lens frame 21 is sandwiched between the first lens 11 and the second lens 12. The same effect as the first embodiment can be obtained.

(Fourth Embodiment) FIG. 4 shows a fourth embodiment of the present invention.
FIG. 3 is a cross-sectional view showing a front end side of an observation objective optical system of the image pickup apparatus according to the embodiment. In FIG. 4, the same components as those in the first embodiment shown in FIG. 1 are designated by the same reference numerals and the description thereof is omitted.

(Structure) In FIG. 4, in the objective optical system 70 of the image pickup apparatus 7 according to the fourth embodiment, a lens frame 71 is provided.
Is formed in a cylindrical shape, and a protrusion 72 in the inner diameter direction is formed near the inner tip. The front side of the protrusion 72 of the lens frame 71 is the first lens 11, the diaphragm 15,
The front inner peripheral portion 73 for accommodating the second lens 12 is formed, and the rear side of the lens frame 71 with respect to the protrusion 72 is the lens 13 of the rear group.
It is a rear side inner peripheral portion 24 for accommodating ...

With this structure, the diaphragm 15 is sandwiched between the first lens 11 and the second lens 12.

The ring-shaped member 7 is provided between the front inner peripheral portion 73 of the lens frame 71 and the outer peripheral portions of the first lens 11 and the diaphragm 15.
6 are provided to provide a space 80 surrounded by the bottom surface portion 79 of the ring-shaped member 76, the inner peripheral portion 73 of the lens frame 71, and the outer periphery of the lens group 70. The space 80 is filled with the adhesive 31.

The ring-shaped member 76 is provided with a protrusion 27 similar to that shown in FIG.

(Operation) With the above configuration, when the pressurizing process such as the autoclave is performed on the endoscope using the image pickup device 7, the ring-shaped member 76 is pushed in the pressurizing direction,
Chamfer 25 of the first lens 11 which is in close contact with the taper 28
Is pressed, the first lens 11, the diaphragm 15, and the second lens 1 are pressed.
The degree of contact between the projection 2 and the projection 72 is enhanced, and the objective optical system 7
0 Prevents moisture from entering the inside. When the depressurizing step is performed on the endoscope using the image pickup apparatus 1, the ring-shaped member 76 is pulled in the pulling direction, and the first lens 11 and the diaphragm 1 are pulled.
5, the close contact between the second lens 12 and the protrusion 72 is relaxed,
The moisture that has entered due to the pressure difference with the outside is released to the outside.

(Effect) As described above, according to the fourth embodiment, even when the diaphragm 15 is sandwiched between the first lens 11 and the second lens 12, it is the same as the first embodiment. The effect of is obtained.

The adhesive 31 of the first to fourth embodiments shown in FIGS. 1 to 4 can be variously applied as long as it is a soft resin. Further, the ring-shaped members 26, 46, 56, 76 of the first to fourth embodiments shown in FIGS.
Various types can be applied as long as they are made of metal or rubber.

(Fifth Embodiment) FIG. 5 shows a fifth embodiment of the present invention.
FIG. 9 is a cross-sectional view showing the tip of the insertion portion of the side-view electronic endoscope using the imaging device according to the embodiment of the present invention.

(Structure) As shown in FIG. 5, the distal end portion 101 of the insertion portion of the side-view electronic endoscope has a metallic distal end member 111.
And a tip cover 121 and an image pickup device 131.

The tip member 111 and the tip cover 121 house the image pickup device 131. The imaging device 131 includes an objective lens unit 132 and an element unit 141.

The objective lens unit 132 is composed of first to third lenses 133, 134 and 135 and a lens frame 136. The lens frame 136 is formed in a tubular shape, and houses and fixes the first to third lenses 133, 134, 135. The first lens 133 is exposed in the rearward perspective direction.

The element unit 141 includes a holding frame 142,
The cover glass 143, the solid-state image sensor 144, the circuit board 146, and the tip side of the signal cable 147 are included.

The distal end member 111 has an opening 1 in the direction of the axis 112 which is inclined by θ from the right angle with respect to the longitudinal direction of the insertion portion.
13 are provided. θ is a rear perspective angle.

The cover glass 143 is adhesively fixed to the image pickup surface of the solid-state image pickup device 144 in a state where the center of the cover glass 143 and the effective pixel center of the solid-state image pickup device 144 are aligned.

The holding frame 142 is assembled with the solid-state image sensor 144 by inserting the cover glass 143 from the rear end side, and the objective lens unit 132 is fitted from the front end side.
It is stored.

Objective lens unit 132 and holding frame 14
2 is inserted and fixed in the opening 113 of the tip member 111.

A terminal 150 for inputting and outputting a signal is provided on the rear end side of the insertion portion on the chip surface 149 of the solid-state image pickup device 144. The circuit board 146 mounts the electronic component 151. The circuit board 146 is arranged on the back surface side of the solid-state imaging device 144 so that the electronic component 151 does not contact the back surface of the solid-state imaging device 144.

The circuit board 146 is connected to the terminal 150 on the chip surface 149 of the solid-state image pickup device 144 and the circuit board 146.
The bump bonding with the inner lead 152 extending from the rear end side of the insertion part is used.

The signal cable 147 is for transmitting signals, and is formed by bundling a plurality of signal lines 148. Lands are provided on the back side of the electronic component 151 mounting surface of the circuit board 146. A plurality of signal lines 148 of the signal cable 147 are electrically connected to this land.

An adhesive 145 is injected and cured between the solid-state image pickup device 144 and the circuit board 146.

The solid-state image pickup device 144 and the circuit board 146 are integrally fixed with an adhesive 145. Tip cover 12
1 is attached to the tip member 111 to form a space 153 in which the solid-state image sensor 144, the adhesive 145, the circuit board 146, and the signal cable 147 are housed in an airtight state.

With such a configuration, the solid-state image pickup device 14
Reference numeral 4 denotes the first to third lenses 133, 134, 135 of the objective optical system which is arranged at the endoscope tip portion 101 of the side-view electronic endoscope and is tilted toward the hand side from the right angle with respect to the endoscope insertion portion. The image pickup surface is arranged perpendicular to the optical axis of.

The circuit board 146 is the end portion 10 of the endoscope.
No. 1 is disposed on the back surface side of the solid-state image sensor 144, electrically connected to the solid-state image sensor 144, and connected to a signal signal cable 147 extending to the rear end side of the endoscope insertion portion.

(Operation) The order of assembling the distal end portion 101 of the insertion portion of the side-view electronic endoscope will be described. First, the first
In the step of, the first to third lenses 13 are attached to the lens frame 136.
Objective lens unit 1 by assembling 3,134,135
32 is formed.

Next, in the second step, the solid-state image sensor 14
The cover glass 143 fixed to the imaging surface of the No. 4 holding frame 14
2 is inserted and attached from the rear end side, the solid-state imaging device 144 is assembled to the holding frame 142, and the objective lens unit 132 is assembled to the front end side of the holding frame 142.

Next, in the third step, the solid-state image sensor 14
The terminals 150 on the chip surface 149 of No. 4 and the inner leads 152 extending from the circuit board 146 are bump-bonded, and a plurality of signal lines 148 of the signal cable 147 are mounted on the land on the back side of the circuit board 146 on which the electronic component 151 is mounted. Connect.

The image pickup device 131 of the present embodiment is formed through the above steps, and the image pickup device 131 is attached to the tip member 111.
The opening 113 is assembled from the side of the central axis 154 of the insertion portion and fixed by adhesion or screws.

After that, the circuit board 146 is positioned by a jig so as to be substantially parallel to the central axis 154 of the insertion portion, and the position of the circuit board 146 with respect to the solid-state image pickup element 144 is fixed by the adhesive 145.

Then, the tip cover 12 is attached to the tip member 111.
1 is assembled to form the tip portion 101.

(Effect) As described above, according to the fifth embodiment, the adjustment work with the prism is eliminated, and the alignment of the objective lens unit 132 and the solid-state image sensor 144 is performed only by fitting the holding frame 142. Since it is performed in step 3, the assembling property of the imaging device 131 can be improved.

According to the fifth embodiment, the solid-state image sensor 144 is assembled perpendicularly to the optical axis 112 of the objective lens unit 132, and the circuit board 146 is arranged substantially parallel to the back surface of the solid-state image sensor 144. Then signal cable 147
By inserting and fixing the image pickup device 131 connected to the front end member 111 in the visual field direction, the objective lens unit 132, the solid-state image pickup element 144, and the circuit board 146 are substantially perpendicular to the longitudinal direction of the endoscope insertion portion. Therefore, the rigid length 156 of the image pickup device 131 can be shortened to reduce the size.

FIG. 6 is an explanatory diagram of an element unit 141 and its peripheral portion showing a modification of the fifth embodiment shown in FIG.

As shown in FIG. 6, in this modification, a terminal 150 for inputting and outputting a signal is provided on the tip side of the insertion portion on the chip surface 149 of the solid-state image pickup device 144.

The circuit board 14 is connected to the terminal 150 on the chip surface 149 of the solid-state image pickup device 144 and the circuit board 146.
The bump bonding with the inner lead 152 extending from the tip side of the insertion portion 6 is used.

Thus, the chip surface 14 for signal input / output
The position of the terminal 150 on the 9 may be on the tip side of the insertion portion.

7 and 8 are explanatory views showing the effect of the shape of the tip member 111 of the fifth embodiment shown in FIG. 5, and FIG. 7 is an internal view of the opening 113 provided in the tip member 111. Shows a case where the outer peripheral surface side of the mirror insertion portion is formed into a substantially flat shape,
FIG. 8 shows a case where a step is formed on the outer peripheral surface side of the endoscope insertion portion of the opening 113 provided in the tip member 111.

As shown in FIG. 7, when the outer peripheral surface side of the endoscope insertion portion of the opening 113 provided in the distal end member 111 is formed as a notch 161 having a substantially flat shape, it is assembled by inclining by a rear perspective angle. A part 162 of the tip of the objective lens unit 132 projects.

In order to prevent the objective lens unit 132 from projecting, as shown in FIG. 8, the projecting portion of the objective lens unit 132 is filled in the outer peripheral surface side of the endoscope insertion portion of the opening 113 provided in the tip member 111. A step 163 is provided, and the step 163 is connected by a smooth slope 164 so that the objective lens unit 132 does not project.

With the shape shown in FIG. 8, it is possible to prevent the objective lens unit 132 from protruding and obstructing the insertion into the body cavity.

Further, in order to prevent the objective lens unit 132 from projecting as shown in FIG.
May be provided on the tip cover 121 and a slope connecting the steps may be provided on the tip cover 121.

(Sixth Embodiment) FIGS. 9 to 11 relate to a sixth embodiment of the present invention, and FIG. 9 is a sectional view showing a distal end of an insertion portion of a side-view electronic endoscope using an image pickup apparatus. FIG. 10 is a perspective view of a first substrate used in the image pickup apparatus, and FIG. 11 is a perspective view of a second substrate used in the image pickup apparatus. 9 to 11
5, the same components as those in the fifth embodiment shown in FIG. 5 are designated by the same reference numerals and the description thereof will be omitted.

As shown in FIG. 9, the distal end portion 171 of the insertion portion of the side-view electronic endoscope in the sixth embodiment has a metallic distal end member 111, a distal end cover 121, and an image pickup apparatus 1.
And 72. The imaging device 172 includes an objective lens unit 132 and an element unit 173.

In the element unit 173, a circuit board 181 and a second board 182 are used instead of the circuit board 146 of the fifth embodiment shown in FIG. Then, instead of the land on the back surface side of the circuit board 146 shown in FIG. 5, the land for electrically connecting the plurality of signal lines 148 of the signal cable 147 to the land on the front surface side of the second board 182 shown in FIG. The land 185 shown in FIG.

As shown in FIG. 10, the circuit board 181 is
The electronic component 151 is mounted, and the inner lead 152 extends from the rear end side of the insertion portion. Further, the circuit board 181
Has a connection land 183 formed by, for example, a side through hole on the front end side of the insertion portion on the surface.

As shown in FIG. 11, a board connecting land 184, a cable connecting land 185, and a wiring pattern 186 are formed on one surface of the second board 182. The wiring pattern 186 connects the board connecting land 184 and the cable connecting land 185.

As shown in FIG. 9, the second board 182 and the circuit board 181 are superposed on each other. 10 and 1
The board connection lands 184 of the second board 182 shown in FIG. 1 and the connection lands 183 of the circuit board 181 are connected by solder 187 shown in FIG. 9, for example.

(Operation) Circuit board 181 and second board 1
The order of connection 82 will be described. First, a unit in which the signal line 148 of the signal cable 147 is connected to the cable connection land 185 of the second substrate 182 is created.

Next, the board connecting lands 184 of the second board 182 and the connecting lands 183 of the circuit board 181 are aligned and electrically connected to each other on the distal end side of the endoscope. This allows
As shown in FIG. 9, without directly connecting the signal cable 147 to the circuit board 181 connected to the solid-state imaging device 144,
The signal cable 147 is directly connected to the circuit board 181 via the second board 182.

(Effects) As described above, according to the sixth embodiment, a unit in which the signal line 148 is connected to the second substrate 182 in advance is prepared, and the circuit substrate 181 and the second substrate 182 are connected. Since the lands are connected, it is not necessary to connect the signal lines 148 one by one to the circuit board 181 held in an unstable manner, which can reduce the troublesome work in the manufacturing process and reduce the manufacturing cost.

(Seventh Embodiment) FIG. 12 is a sectional view showing a distal end of an insertion portion of a side-view electronic endoscope using an image pickup apparatus according to a seventh embodiment of the present invention. In FIG. 12,
The same components as those in the fifth embodiment shown in FIG. 5 are designated by the same reference numerals and the description thereof will be omitted.

(Structure) In FIG. 12, a front end portion 201 of the insertion portion of the side-view electronic endoscope is a metal front end member 211.
And a tip cover 221 and an imaging device 231.

The tip member 211 and the tip cover 221 house the image pickup device 231. The imaging device 231 includes an objective lens unit 132 and an element unit 241.

In the element unit 241, the circuit board 246
Is inclined so that the rear side of the insertion portion is higher than the front side, and is arranged so as to be within the range of the projection surface 260 where the solid-state image sensor 144 is projected in the optical axis direction.
It is fixed at.

The opening 213 of the tip member 211 is machined to have substantially the same size as the outer shape of the holding frame 142 at all positions.

Opening 213 and objective lens unit 132
A space 261 surrounded by the holding frame 142 is filled with a flexible adhesive 262.

Next, the rear end 263 of the front end cover 221 is
In order not to disturb the connection work of the signal cable 147, the land of the circuit board 246 is cut off at a position where it does not interfere with the land.

(Operation) The order of assembling the distal end portion 201 of the insertion portion of the side-view electronic endoscope will be described. First, from the outer peripheral surface side of the endoscope insertion portion of the opening 213, the signal cable 14
The image pickup device 231 to which 7 is not connected is inserted, and thereafter,
The signal line 148 of the signal cable 147 is connected to the circuit board 246.

Next, a space 261 surrounded by the opening 213, the objective lens unit 132 and the holding frame 142 after the insertion of the image pickup device is filled with a flexible adhesive 262 and cured.

(Effect) As described above, according to the seventh embodiment, by tilting the circuit board 246, the land of the circuit board 246 is directed to the rear side of the insertion portion, so that the tip cover 221 is removed. Cable can be attached / removed in the assembled state.

By tilting the circuit board 246, the cable connection position can be surely confirmed from the rear end side of the front end cover 221.

Further, the circuit board 246 is connected to the solid-state image pickup device 1
Since it is housed within the projection plane 260 in the direction of the 45 optical axis, the opening 2 of the tip member 211 to which the tip cover 221 is assembled is attached.
The imaging device 231 to which the cable is not connected can be taken in and out from the outer peripheral surface side of the endoscope insertion portion 13 of the endoscope.

As a result, the cable replacement and the image pickup device replacement work, which were conventionally performed by removing the tip cover and taking out the image pickup device, can be performed without removing the tip cover, and the cost and time required for these works can be reduced. .

(Eighth Embodiment) FIG. 13 is a sectional view showing a distal end of an insertion portion of a side-view electronic endoscope using an image pickup apparatus according to an eighth embodiment of the present invention. In FIG. 13,
The same components as those in the fifth embodiment shown in FIG. 5 are designated by the same reference numerals and the description thereof will be omitted.

(Structure) In FIG. 13, the distal end portion 271 of the insertion portion of the side-view electronic endoscope is a metallic tip member 272.
And a tip cover 273 and an image pickup device 274.

The tip member 272 and the tip cover 273 house the image pickup device 274. The image pickup device 274 includes an objective lens unit 132 and an element unit 281.

In the element unit 281, a wedge lens 283 is provided instead of the cover glass 143 of the fifth embodiment shown in FIG. The wedge lens 283 bends the optical axis 112 near the solid-state image sensor 144 in a direction substantially perpendicular to the insertion section central axis 154 to form an optical axis 292.

The solid-state image sensor 144 has a bent optical axis 292.
Then, the effective pixel centers are aligned with each other and assembled into the wedge lens 283 so as to be arranged substantially parallel to the insertion portion central axis 154.

As a result, the wedge lens 283 serves as a lens of the objective optical system for assembling the solid-state image pickup device 114 with the objective optical system.

The circuit board 146 is positioned on the back surface side of the solid-state image sensor 144 at a position where the electronic component does not come into contact with the back surface of the solid-state image sensor 144 with the jig and positioned substantially parallel to the central axis 154 of the insertion portion, and fixed with the adhesive 285. is doing.

The solid-state image sensor 144 and the circuit board 146 are
It is integrally solidified with an adhesive 285. (Operation) In the eighth embodiment as described above, the wedge lens 283 is used to bend the optical axis 112 of the objective optical system substantially perpendicular to the central axis 154 of the insertion portion, so that the solid-state imaging device 144 and the circuit board are Since the 246 moves toward the insertion portion near the hand, the hard length 291 of the imaging device 274 is smaller than the hard length 156 in the fifth embodiment, and the imaging device 274 is downsized.

(Effect) As described above, according to the eighth embodiment, the same effect as that of the fifth embodiment can be obtained, and the hard length 291 of the image pickup device 274 can be changed to the fifth embodiment. Can be made shorter than the hard length 156 in FIG. 1, and the tip portion 271 of the side-view electronic endoscope can be further downsized.

(Ninth Embodiment) FIGS. 14 to 16 relate to a ninth embodiment of the present invention, and FIG. 14 is a cross-sectional view showing the distal end of the insertion portion of the side-view electronic endoscope using the image pickup apparatus. Figure, Figure 1
5 is a view on arrow A in FIG. 14, and FIG. 16 is a sectional view taken along line BB in FIG. 14 to 16, the same components as those in the fifth embodiment shown in FIG. 5 are designated by the same reference numerals and the description thereof will be omitted.

(Structure) As shown in FIG. 14, the distal end portion 301 of the insertion portion of the side-view electronic endoscope has a metallic distal end member 31.
1 and an imaging device 331.

The tip member 311 houses the image pickup device 331. The imaging device 331 includes the objective lens unit 13
2 and an element unit 341.

The element unit 341 includes a holding frame 342,
It is composed of a cover glass 343, a solid-state image sensor 344, a circuit board 346, and a signal cable 147.

The tip member 311 is provided with an opening 313 in the direction of the axis 312 which is perpendicular to the longitudinal direction of the insertion portion.

The solid-state image pickup device 344 and the circuit board 346 are arranged substantially parallel to the insertion portion longitudinal direction. The circuit board 346 has the electronic component 351 mounted thereon. A glass lid 371 is provided on the imaging surface of the solid-state imaging device 344.

The circuit board 346 has an electronic component mounting surface 361.
And a surface 362 on which a land for connecting the signal line 148 for signal transmission is arranged.

The circuit board 346 is arranged closer to the distal end side of the endoscope insertion portion than the solid-state image pickup element 344. The holding frame 342 and the objective lens unit 132 are assembled in a substantially vertical direction with respect to the light receiving portion of the solid-state image sensor 344.

A terminal 350 for inputting and outputting a signal is provided on the tip side of the insertion portion on the chip surface 349 of the solid-state image pickup element 344.

The circuit board 346 is connected to the terminal 350 on the chip surface 349 of the solid-state image pickup device 344 and the circuit board 346.
The bump bonding with the inner lead 352 extending from the rear end side of the insertion part is used.

The signal line 148 is connected to the land of the circuit board 346 from the proximal side of the endoscope insertion portion through the side surface of the holding frame 342.

At this time, in order to prevent the signal line 148 and the side surface of the holding frame 342 from interfering with each other, as shown in FIGS. 15 and 16, a cutout 363 is provided on the side surface of the holding frame 342 to accommodate the signal line 148, and an adhesive is used. Fix at 345.

(Operation) In the ninth embodiment, the cover glass 343 and the glass lid 371 of the solid-state image pickup device 344 are the same as the chip surface 34 of the solid-state image pickup device 344.
Since it is smaller than 9, space is generated on the side surface of the holding frame 342. A notch 363 is provided in that portion and the signal line 148
The tip portion 301 can be miniaturized by passing through.

(Effect) As described above, according to the eighth embodiment, the same effect as that of the fifth embodiment can be obtained, and the notch 363 on the side surface of the holding frame 342 is provided to connect the signal line 148. By passing it through, the tip portion 301 of the insertion portion of the side-view electronic endoscope can be further downsized.

(Tenth Embodiment) FIGS. 17 to 19
FIG. 17 relates to a tenth embodiment of the present invention, and FIG. 17 is a cross-sectional view showing a distal end of an insertion portion of a side-view electronic endoscope using an imaging device,
18 is a view taken in the direction of arrow C in FIG. 17, and FIG. 19 is a perspective view of the holding frame.

(Structure) As shown in FIG. 17, the distal end portion 401 of the insertion portion of the side-view electronic endoscope is provided with a metallic distal end member 41.
1 and an imaging device 431.

The tip member 411 houses the image pickup device 431. The image pickup device 431 includes an objective lens unit 43.
2 and an element unit 441.

The objective lens unit 432 includes the first to third lenses 433, 434, 435 and the lens frame 436.
And diaphragms 437 and 438, and a spacer ring 439. The lens frame 436 is formed in a tubular shape, and the third lens 433 and the diaphragm 43 are sequentially arranged from the outside of the insertion portion.
7, the second lens 434, the spacer ring 439, the diaphragm 438, and the third lens 435 are housed and fixed. The first lens 433 is exposed in the side view direction.

The element unit 441 includes a holding frame 442 and
A cover glass 443, a solid-state image sensor 444, a circuit board 446, a signal cable 147, a shielding frame 448,
It is composed of a tube 449.

The tip member 411 is provided with an opening 413 in the direction of the axis 412 which is perpendicular to the longitudinal direction of the insertion portion.

As shown in FIGS. 17 to 19, the holding frame 4
42 includes an objective lens unit 432 and a solid-state image sensor 4
An opening 450 for assembling 44 is provided.

The holding frame 442 has a solid-state image sensor 444 arranged substantially parallel to the longitudinal direction of the insertion section, a circuit board 446 having an electronic component 451 mounted thereon, and an objective lens unit 432 arranged substantially perpendicular to the solid-state image sensor 444. Is assembled.

The shielding frame 448 is provided with a U groove 451 that avoids the opening 450 of the holding frame 442. Shielding frame 4
48 covers the outer periphery of the holding frame 442 while avoiding the opening 450.

The cover glass 444 and the solid-state image pickup element 44
5, the circuit board 446, and the tip side of the cable 447 are
It is covered with a holding frame 442, a shielding frame 448, and a tube 449.

An adhesive 445 is filled inside the holding frame 442, the shielding frame 448 and the tube 449.

(Operation) In the tenth embodiment as described above, the holding frame 442, the shielding frame 448 and the tube 44.
9, the objective lens unit 432, the solid-state image sensor 44
4, the circuit board 446 and the signal line 148 are integrally housed, so that the imaging device 431 has a compact and strong structure.

(Effect) As described above, according to the tenth embodiment, the same effect as that of the fifth embodiment can be obtained, and the image pickup device 431 can be made compact and have a strong structure.

(Eleventh Embodiment) FIGS. 20 to 21.
FIG. 20 relates to an eleventh embodiment of the present invention, and FIG. 20 is a cross-sectional view showing a distal end of an insertion portion of a side-view electronic endoscope using an imaging device,
FIG. 21 is a sectional view showing the rear end side of the imaging device when the spiral tube 551 contracts due to the heat of the autoclave process.

As shown in FIGS. 20 and 21, the tip end portion 501 of the insertion portion of the side-view electronic endoscope is a metal tip member 5.
11, an imaging device 131 having the same configuration as in FIG. 5, and an illumination optical system 571.

The tip member 511 houses the image pickup device 131. Inside the tip member 511, the imaging device 1
The 31 element units 141 are covered with a shielding frame 548. The shield frame 548 and the tip end side of the signal cable 147 are covered with a heat shrink tube 549.

Tube 550 (for example, PVC tube)
Is larger than the outer shape of the heat-shrinkable tube 549.

The tube 550 covers the distal end side of the signal cable 147 and also covers a part of the heat-shrinkable tube 549.

A spiral tube 551 made of a shape memory alloy is attached to the outer circumference of the tube 550.

The tip member 511 is used for the image pickup device 131.
The illumination optical system 571 is arranged at the position on the rear end side. The illumination optical system 571 is a combination of an illumination lens 572 and a prism 573 that performs optical path conversion on the back surface of the illumination lens. The illumination lens 572 and the prism 573 are the lens frame 5
It is fixed to the tip member 511 while being housed in 74.

The prism 573 changes the optical path of the optical axis 575 of the illumination optical system between the longitudinal direction of the endoscope insertion portion and the observation target surface direction.

The light guide fiber 576 is routed from the rear side of the endoscope insertion section along the insertion section central axis 554, and the tip end thereof is abutted on the prism 573.

The light guide fiber 576 guides the illumination light from the proximal side of the insertion section to the distal side of the insertion section.

The prism 573 changes the optical path of the illumination light from the light guide fiber 576.

The illumination lens 572 is the prism 573.
Illumination light from illuminates the observation target. (Operation) In such an eleventh embodiment, as shown in FIG.
As shown in FIG. 1, when heat from a process such as an autoclave is applied to the endoscope, the spiral tube 551 contracts and the tube 550 is tightened, and the signal cable 147 and the heat-shrink tube 549 are tightly attached. Due to this close contact, the entry path of water vapor into the image pickup device 131 is sandwiched, the amount of water vapor entry is reduced, and the moisture resistance of the image pickup device 131 is improved.

Further, the light guide fiber 576 along the central axis 554 of the insertion portion has less loss due to bending and has better light and transmission efficiency than the conventional light guide fiber bent without forming a prism.

(Effects) As described above, according to the eleventh embodiment, the same effects as those of the fifth embodiment can be obtained, and heat generated by a process such as autoclave is applied to the endoscope. Since the path of water vapor entering the imaging device 131 is sandwiched between the two, the amount of water vapor entering is reduced and the moisture resistance of the imaging device 131 is improved.

Also, stable illumination performance can be secured by using the prism 573 and the light guide fiber 576. Further, a space for accommodating the bent portion of the light guide fiber is not required, and the tip portion of the endoscope can be downsized.

(Twelfth Embodiment) FIG. 22 is a cross-sectional view showing an edge lens-processed objective lens unit of an image pickup apparatus according to a twelfth embodiment of the present invention, and FIG. 23 is an objective without edge processing. It is sectional drawing which shows a lens unit.

In FIG. 22 and FIG. 23, the objective lens unit 611 of the image pickup apparatus is attached to the metallic tip member 601. The objective lens unit 611 is the first
Through third lens 133, 134, 135 and lens frame 61
2 and. The lens frame 612 is formed in a tubular shape and houses and fixes the first to third lenses 133, 134 and 135.

Here, similarly to the case of FIG. 7, the tip member 601 is inclined by the rear perspective angle when the outer peripheral surface side of the opening 602 of the endoscope insertion portion is made into a notch 603 on a substantially flat surface. Part 61 of the tip of the objective lens unit 611 assembled by
3 is protruding.

The protruding portion 61 of the lens frame 612 shown in FIG.
Edge processing is performed on No. 3 by chamfering 614.
The protrusion 613 of the lens frame 612 shown in FIG. 23 is not subjected to edge processing.

(Operation) In the twelfth embodiment as described above, as shown in FIG. 22, the lens frame 1 of the protrusion 613 is formed.
A chamfer 614 is formed for 36 edges. Here, since the lens frame 136 is thinned by the chamfering 614, the impact to the first lens 133 is easily transmitted. Therefore, a flange 615 is provided on the inner side of the front end side of the lens frame 136 to thicken the first lens 133. Relieves shock.
This can prevent the objective lens unit 612 from being a hindrance to the insertion into the body cavity due to the shape shown in FIG.

(Effect) As described above, according to the twelfth embodiment, even when the outer peripheral surface side of the opening 602 of the endoscope insertion portion is formed into the substantially flat notch 603, the inside of the body cavity is reduced. It is possible to prevent the objective lens unit 611 from being caught by the objective lens unit 611 when it is inserted into the optical disk, and to prevent the objective lens unit 611 from being a hindrance to the insertion and insertion.

(Thirteenth Embodiment) FIG. 24 is a sectional view showing an objective lens unit of an image pickup apparatus for a side-view electronic endoscope according to a thirteenth embodiment of the present invention.

As shown in FIG. 24, when the first lens 133 of the objective lens unit 621 and the lens frame 622 are assembled, if the lens frame 622 cannot be chamfered due to its thin wall, the protrusion 623 is covered with the adhesive 630 and projected. Part 623
Is smoothly connected to the substantially flat cutout portion 603 so that the edge of the lens frame 622 is not exposed.

(Operation) In the thirteenth embodiment, the projection 623 is smoothly connected to the substantially flat cutout 603 by the adhesive 630, so that the objective lens unit 621 is inserted into the body cavity. You can prevent it from getting in the way.

(Effect) As described above, according to the thirteenth embodiment, the outer peripheral surface side of the endoscope insertion portion of the opening 602 is made into a notch 603 on a substantially flat surface, and the lens frame 622 is provided. Even when chamfering cannot be performed due to its thin wall, it is possible to prevent the objective lens unit 621 from being caught by the objective lens unit 621 when it is inserted into the body cavity, and prevent the objective lens unit 621 from interfering with the insertion.

(Fourteenth Embodiment) FIG. 25 is a sectional view showing an image pickup apparatus for a side-view electronic endoscope according to a fourteenth embodiment of the present invention.

As shown in FIG. 25, the image pickup device 631 is
It is composed of an objective lens unit 132 and an element unit 632.

An air layer 634 is provided between the cover glass 143 and the solid-state image sensor 144 incorporated in the holding frame 633 of the element unit 632.

The air layer 634 is formed by sandwiching the solid-state image pickup element 144 and the cover glass 143 with a donut-shaped spacing ring 635.

(Operation) In the fourteenth embodiment as described above, by providing the air layer 634, peeling due to the stress generated in the adhesive structure between the solid-state image pickup element 144 and the cover glass 143 and the use environment. Is eliminated, and the durability of the imaging device 631 is improved.

(Effects) As described above, according to the fourteenth embodiment, the durability of the image pickup device 631 can be improved and the life of the endoscope can be extended.

(Fifteenth Embodiment) FIG. 26 is a sectional view showing an image pickup apparatus for a side-view electronic endoscope according to a fifteenth embodiment of the present invention.

As shown in FIG. 26, the image pickup device 641 is
It is composed of an objective lens unit 132 and an element unit 642.

An air layer 644 is provided between the solid-state image sensor 144 incorporated in the holding frame 643 of the element unit 642 and the cover glass 143. A flange 645 is formed on the holding frame 643 on the inner diameter side.

The air layer 644 is formed by sandwiching the flange 645 between the solid-state image pickup element 144 and the cover glass 143.

(Operation) In the fifteenth embodiment as described above, by providing the air layer 644, the peeling due to the stress generated in the adhesive structure between the solid-state image pickup element 144 and the cover glass 143 or the use environment. Is eliminated, and the durability of the imaging device 641 is improved.

(Effect) As described above, according to the fifteenth embodiment, the same effect as that of the fourteenth embodiment of FIG. 25 can be obtained.

(Sixteenth Embodiment) FIG. 27 is a sectional view showing the distal end of the insertion portion of the side-view electronic endoscope using the imaging apparatus according to the sixteenth embodiment of the present invention.

(Structure) As shown in FIG. 27, the distal end portion 701 of the insertion portion of the side-view electronic endoscope has a metallic distal end member 71.
1 and an imaging device 731.

The tip member 711 houses the image pickup device 731. The imaging device 731 includes the objective lens unit 13
2 and an element unit 741.

In the element unit 741, the solid-state image pickup element 74
4 is arranged substantially parallel to the longitudinal direction of the insertion portion of the tip portion 701.

The objective lens unit 132 is arranged substantially perpendicular to the solid-state image pickup device 744.

Inner leads 751, respectively, from the front end side and the rear end side of the endoscope on the solid-state imaging device chip surface 749.
752 is extended.

The circuit board 746 is arranged substantially parallel to the solid-state image pickup device 744 on the rear end side of the endoscope of the solid-state image pickup device 744.

The tip-side inner lead 751 is bent to the back surface side of the solid-state image pickup device 744 and then to the circuit board 746 to be connected to the surface on the circuit board 746 opposite to the objective lens unit 131. The rear end side inner lead 752 extends in the direction of the circuit board 746.
Connected to the surface of the objective lens unit side 131 on 46.

In this embodiment, after the signal line 148 is connected to the circuit board 746, the holding frame 742 and the solid-state image sensor 7 are connected.
44, the circuit board 746, and the signal line 148 are sealed with an adhesive 753 and covered with a heat-shrinkable tube 754 to cover the image pickup device 731.
Is formed.

(Operation) In the sixteenth embodiment as described above, the image pickup device 731 includes the inner leads 751 and 752 and the circuit board 746 extending from a plurality of locations on the chip surface 749 of the solid-state image pickup element 744. Hard length 7 by connecting
Since 02 is shortened, the image pickup device 731 is downsized.

(Effect) As described above, according to the sixteenth embodiment, the image pickup device 731 can be downsized.

(Seventeenth Embodiment) FIG. 28 is a sectional view showing a distal end of an insertion portion of a side-view electronic endoscope using an image pickup apparatus according to a seventeenth embodiment of the present invention.

(Structure) As shown in FIG. 28, the element unit 7 of the image pickup device 771 of the distal end portion 761 of the side-view electronic endoscope.
In FIG. 81, the circuit board 786 is arranged on the rear end side of the solid-state image sensor 744 and substantially at right angles to the solid-state image sensor 744.
The other configuration is the same as that of FIG.

(Operation) In the seventeenth embodiment, the hard length 762 of the image pickup device 771 has a structure in which the circuit board and the solid-state image pickup element are arranged substantially in parallel in the longitudinal direction of the insertion portion and arranged in series (FIG. 27). It becomes shorter, and the image pickup device 771 can be further downsized.

(Effect) As described above, according to the seventeenth embodiment, the image pickup device 771 can be further downsized.

(Eighteenth Embodiment) FIGS. 29 to 31
29 relates to an eighteenth embodiment of the present invention, and FIG. 29 is a cross-sectional view showing a distal end of an insertion portion of a side-view electronic endoscope using an imaging device,
30 is a cross-sectional view taken along the line D-D of FIG. 29, and FIG. 31 is a cross-sectional view showing the effect in a conventional comparison.

(Structure) As shown in FIG. 29, the tip portion 801 of the insertion portion of the side-view electronic endoscope is a metal tip member 81.
1, a tip cover 821, an image pickup device 831, a light guide fiber 841, and an illumination lens 842.

The tip member 811 and the tip cover 821 house the image pickup device 831, the illumination lens 842, and the light guide fiber 841.

Imaging device 8 housed in tip member 811
An illumination lens 842 is arranged on the tip side of 31, and a bent light guide fiber 841 is arranged below the illumination lens 842 to extend the light guide fiber 841 to the rear side of the insertion portion.

The light guide fiber 841 is used for the image pickup device 8.
31 and a distal end cover 821, and extends to the rear side of the insertion portion through a space 843 on the side surface of the imaging device 831.

At this time, the light guide fiber 841 is molded into a shape (for example, a crescent shape) to be accommodated in the space 843.

(Operation) Here, as shown in FIG. 31, heretofore, the light guide fiber 84 has been provided at the tip 851.
Since No. 1 was located in series in the outer diameter direction of the image pickup device 831, the tip member 871 and the tip cover 881 were large, and the tip portion 851 of the insertion portion had a large diameter. However, FIG.
In the eighteenth embodiment shown in (4), the light guide fiber 841 is arranged on the side surface of the image pickup device 831 so that the tip portion 801 is downsized.

(Effects) As described above, according to the eighteenth embodiment, the distal end portion 80 of the insertion portion of the side-view electronic endoscope is used.
1 can be miniaturized.

The circuit boards 146, 181, 246, ... Used in the fifth to seventeenth embodiments are TAB (Ta
pe Automated Bonding) substrate.

[Additional Notes] According to the above-described embodiment of the present invention as described in detail above, the following configuration can be obtained.

(Additional Item 1) Imaging provided with an objective optical system housed in the distal end of the insertion portion of an endoscope and having a plurality of lenses for observing an observation target and a lens frame holding these lenses. In the device, a ring-shaped member is provided between the outer peripheral portion of the lens disposed at the tip on the observation target side of the plurality of lenses and the inner peripheral portion of the lens frame, and the bottom surface portion of the ring-shaped member is provided. And a space surrounded by the inner peripheral portion of the lens frame and the outer peripheral portion of the lens at the tip,
An image pickup device characterized in that the space is filled with an adhesive.

(Additional Item 2) The additional item 1 is characterized in that the ring-shaped member is provided with a protrusion in the inward direction on the front end side.
The imaging device according to.

(Additional Item 3) The image pickup apparatus according to Additional Item 1 or 2, wherein the protrusion has a flange shape or a taper whose thickness decreases in the inner diameter direction.

(Additional Item 4) The image pickup device according to any one of additional items 1 to 3, wherein the adhesive is a soft resin.

(Additional Item 5) The additional items 1 to 4, wherein the ring-shaped member is made of metal or rubber.
The imaging device according to any one of 1.

(Additional Item 6) It is arranged at the tip of the endoscope of the side-viewing electronic endoscope and is perpendicular to the optical axis of the objective optical system tilted to the hand side from the right angle with respect to the endoscope insertion portion. A solid-state image sensor having an image-sensing surface and a rear surface side of the endoscope front end portion of the solid-state image sensor are electrically connected to the solid-state image sensor and extend to the rear end side of the endoscope insertion section. And a circuit board to which a signal cable to be installed is connected.

(Additional Item 7) The circuit board should be arranged substantially parallel to the longitudinal direction of the endoscope insertion portion, or the tip side should be above the rear end side of the endoscope insertion portion. 7. The image pickup device according to appendix 6, wherein the image pickup device has a different inclination.

(Additional Item 8) Additional Item 6 or 7 characterized in that a terminal for connecting to the circuit board is arranged on the front end side or the rear end side of the endoscope insertion portion on the chip surface of the solid-state imaging device. The imaging device according to.

(Additional Item 9) The image pickup according to any one of Additional Items 6 to 8, wherein the arrangement of the circuit board is set within a range projected in the optical axis direction of the outer shape of the solid-state imaging device. apparatus.

(Additional Item 10) Any one of Additional Items 6 to 9 is characterized in that it has a second substrate to which the signal cable is connected, and the second substrate and the circuit board are connected to each other. The imaging device according to.

(Additional Item 11) The image pickup apparatus according to any one of additional items 6, 7 and 9, wherein the lens of the objective optical system for assembling the solid-state image pickup element to the objective optical system is a wedge lens. .

(Additional Item 12) The image pickup device according to any one of additional items 7 to 11, wherein the circuit board is a TAB substrate.

(Additional Item 13) A shield frame that covers the solid-state imaging device and the circuit board, a heat-shrink tube that covers the shield frame and the tip side of the signal cable, and a tip side of the signal cable. In addition, the heat-shrinkable tube is covered with a tube, and a spiral tube made of a shape memory alloy attached to the outer circumference of the tube is provided. The imaging device described.

(Additional Item 14) An image pickup device, comprising an objective optical system housed in the distal end portion of an insertion portion, the objective optical system having a plurality of lenses for observing an observation target and a lens frame holding these lenses, A light guide fiber that is housed in the insertion portion and guides the illumination light from the proximal side of the insertion portion to the distal end side of the insertion portion, a prism that performs optical path conversion of the illumination light from this light guide fiber, and illumination light from this prism. An illumination lens that irradiates an object to be observed with the endoscope.

(Additional Item 15) It has a tip cover provided at the tip of the insertion portion, a plurality of lenses for accommodating the observation object, which are housed in the tip cover, and a lens frame for holding these lenses. An imaging device having an objective optical system, a light guide fiber for guiding illumination light from the proximal side of the insertion section to the distal side of the insertion section, and illumination for illuminating an observation target with the illumination light from the light guide fiber An endoscope, comprising: a lens, wherein the light guide fiber extends to a rear side of the insertion portion through a space on a side surface of the imaging device surrounded by the imaging device and a tip cover.

[0226]

As described above, according to the image pickup device of the first aspect, it is possible to prevent the moisture that has permeated through the adhesive for fixing the lens exposed on the observation surface side to the lens frame from entering the inside. Since the invading water can be released without staying, fogging is prevented from the inside of the objective optical system, and an electronic component such as a solid-state image sensor or a substrate on which an electronic component for processing a signal from the solid-state image sensor is mounted. It is possible to prevent the corrosion and the short circuit, and to prevent the deterioration of the image quality of the endoscopic image.

According to the image pickup device of the second aspect, the image pickup surface of the solid-state image pickup element is arranged perpendicular to the optical axis of the objective optical system tilted to the hand side from the right angle with respect to the endoscope insertion portion. Therefore, it is possible to improve the assembling property and reduce the size.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a distal end side of an observation objective optical system of an image pickup apparatus according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view showing a distal end side of an observation objective optical system of an image pickup apparatus according to a second embodiment of the present invention.

FIG. 3 is a cross-sectional view showing a distal end side of an observation objective optical system of an image pickup apparatus according to a third embodiment of the present invention.

FIG. 4 is a cross-sectional view showing a distal end side of an observation objective optical system of an image pickup apparatus according to a fourth embodiment of the present invention.

FIG. 5 is a sectional view showing a distal end of an insertion portion of a side-view electronic endoscope using an imaging device according to a fifth embodiment of the present invention.

FIG. 6 is an explanatory diagram of an element unit and its peripheral portion showing a modification of the fifth embodiment shown in FIG.

FIG. 7 is a first explanatory diagram showing the effect of the shape of the tip member of the fifth embodiment shown in FIG.

FIG. 8 is a second explanatory view showing the effect of the shape of the tip member of the fifth embodiment shown in FIG.

FIG. 9 is a cross-sectional view showing a distal end of an insertion portion of a side-view electronic endoscope using an image pickup device according to a sixth embodiment of the present invention.

FIG. 10 is a perspective view of a first substrate used in an imaging device according to a sixth embodiment of the present invention.

FIG. 11 is a perspective view of a second substrate used in the imaging device according to the sixth embodiment of the present invention.

FIG. 12 is a cross-sectional view showing a distal end of an insertion portion of a side-view electronic endoscope using an image pickup device according to a seventh embodiment of the present invention.

FIG. 13 is a cross-sectional view showing a distal end of an insertion portion of a side-view electronic endoscope using an imaging device according to an eighth embodiment of the present invention.

FIG. 14 is a cross-sectional view showing a distal end of an insertion portion of a side-view electronic endoscope using an imaging device according to a ninth embodiment of the present invention.

FIG. 15 is a view on arrow A in FIG.

16 is a cross-sectional view taken along the line BB of FIG.

FIG. 17 is a cross-sectional view showing a distal end of an insertion portion of a side-view electronic endoscope using an imaging device according to a tenth embodiment of the present invention.

18 is a view on arrow C of FIG.

FIG. 19 is a perspective view of the holding frame in FIG.

FIG. 20 is a cross-sectional view showing a distal end of an insertion portion of a side-view electronic endoscope using an imaging device according to an eleventh embodiment of the present invention.

FIG. 21 is a sectional view showing a rear end side of an imaging device according to an eleventh embodiment of the present invention.

FIG. 22 is a sectional view showing an edge-processed objective lens unit of an image pickup apparatus according to a twelfth embodiment of the present invention.

FIG. 23 is a cross-sectional view showing an objective lens unit that is not subjected to edge processing of a comparative example with respect to the twelfth embodiment of the present invention.

FIG. 24 is a sectional view showing an objective lens unit of an image pickup apparatus for a side-view electronic endoscope according to a thirteenth embodiment of the present invention.

FIG. 25 is a sectional view showing an image pickup device of a side-view electronic endoscope according to a fourteenth embodiment of the present invention.

FIG. 26 is a sectional view showing an image pickup device of a side-view electronic endoscope according to a fifteenth embodiment of the present invention.

FIG. 27 is a cross-sectional view showing the distal end of the insertion portion of the side-view electronic endoscope using the imaging device according to the sixteenth embodiment of the present invention.

FIG. 28 is a cross-sectional view showing the distal end of the insertion portion of the side-view electronic endoscope using the imaging device according to the seventeenth embodiment of the present invention.

FIG. 29 is a cross-sectional view showing the distal end of the insertion portion of the side-view electronic endoscope using the imaging device according to the eighteenth embodiment of the present invention.

30 is a cross-sectional view taken along line DD of FIG. 29.

FIG. 31 is an explanatory diagram showing the effect of the eighteenth embodiment in comparison with the related art.

FIG. 32 is a cross-sectional view showing a tip of an insertion portion of a conventional side-view electronic endoscope.

[Explanation of symbols]

1 ... Imaging device 10 ... Objective optical system 11, 12, 13 ... Lens 20 ... Lens group 21 ... Lens frame 22 ... Projection 23 ... Front inner circumference 24 ... Rear side inner peripheral portion 24 25… Chamfer 26… Chamfer 27 ... Projection 28 ... Taper 29 ... Bottom part 31 ... Adhesive

Claims (2)

[Claims] 1. An imaging device comprising an objective optical system, which is housed in a distal end portion of an insertion portion of an endoscope and has a plurality of lenses for observing an observation target and a lens frame holding these lenses, Among the plurality of lenses, a ring-shaped member is arranged between the outer peripheral portion of the lens arranged at the tip on the observation target side and the inner peripheral portion of the lens frame, and the bottom surface portion of the ring-shaped member and the lens An image pickup apparatus comprising: a space surrounded by an inner peripheral portion of a frame and an outer peripheral portion of the lens at the tip, and filling the space with an adhesive. 2. An image pickup surface is arranged perpendicularly to an optical axis of an objective optical system which is arranged at a distal end portion of an endoscope of a side-viewing electronic endoscope and is tilted toward a hand side from a right angle with respect to an endoscope insertion portion. A signal that is arranged on the arranged solid-state image pickup device and on the rear surface side of the solid-state image pickup device of the endoscope front end portion, electrically connects to the solid-state image pickup device, and extends to the rear end side of the endoscope insertion portion An image pickup apparatus comprising: a circuit board to which a cable is connected;