JP2003228821A - Method for manufacturing master for magnetic disk transfer, and exposure equipment for the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a patterning method hardly being influenced by an error even when the error exists in the real moving distance of a stage for scanning a photomask with respect to a set moving distance, and for performing patterning by using the smaller number of photomasks, and to provide an exposure device for the same. <P>SOLUTION: In manufacturing a master used for the transfer of a magnetic pattern on a magnetic storage medium, the photomask used for the exposure of a resist on an Si substrate as a substrate of the master consists of a photomask for an index sector and a photomask for a non index. The photomask is replaced and exposed corresponding to the rotating angle of the stage holding the Si substrate of the exposure device for exposing the photomask. The moving mechanism of the exposure equipment for the Si substrate has functions for movement and rotation in directions of X and Y. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is used in a magnetic disk transfer device for magnetically writing a positioning servo signal or specific data for a magnetic head for writing / reading on the surface of a magnetic disk by using a transfer technique. The present invention relates to a method of manufacturing a magnetic disk transfer master disk (hereinafter abbreviated as a master disk) in which a positioning servo signal or specific data is embedded as a pattern, and an exposure apparatus used in the method.

[0002]

2. Description of the Related Art Recently, in a hard disk drive which uses a magnetic film as a recording material, which has become a mainstream as an external storage device of a computer, a magnetic recording medium (hereinafter abbreviated as a medium) rotating on the surface of Data is recorded / reproduced while the head is flying at a distance of several tens of nm by a flying mechanism called a slider. The bit information on the medium is stored in concentric data tracks, and the data recording / reproducing head moves and positions at the target data track on the medium at high speed to record / reproduce data. Is going.

A positioning signal (servo signal) for detecting the relative position between the head and the data track is preliminarily written in a concentric pattern on the medium surface, and the head for recording / reproducing data is constant. It detects its position at time intervals. After incorporating the medium in the hard disk drive so that the center of the servo signal does not decenter from the center of the disk (or the center of the head track), the servo signal is written on the medium using a special device called a servo writer. There is.

At present, in this type of magnetic disk, the recording density reaches 60 Gb / in ² at the development stage, and the recording density increases at a rate of 100% or more per year. Along with this, the density of the servo signal for the head to detect its own position is also increasing, and the writing time of the servo signal tends to increase year by year. This increase in the writing time of the servo signal has become one of the major factors leading to a decrease in the productivity of the hard disk device and an increase in the cost. Recently, compared to the method of writing servo signals using the signal writing head of the servo writer described above, the servo signals are collectively written to the medium by magnetic transfer, and the servo information writing time is dramatically increased. Technology is being developed to reduce

12 and 13 are diagrams for explaining this magnetic transfer technique. FIG. 12A shows a state in which the permanent magnets move on the surface of the medium 701 while maintaining a constant interval (1 mm or less). The magnetic layer formed on the medium 701 is not initially magnetized in a fixed direction,
It is magnetized in a certain direction by the magnetic field leaking from the permanent magnet right gap. The arrow on the magnetic layer in the figure indicates the direction of magnetization. This process is called the initial degaussing process.

FIG. 13A is a sectional view showing the initial demagnetization process. The medium 701 includes the substrate 801 and the magnetic layer 8.
02, the magnetization direction of the magnetic layer 802 is opposite to the traveling direction (relative movement direction) of the permanent magnet 803.

FIG. 12B shows a state in which the magnetic transfer master disk 702 is placed on the medium 701 and aligned after the initial demagnetization step.

FIG. 12C shows that after the alignment,
The master disk 702 is brought into close contact with the surface of the medium 701,
The figure shows a state where magnetic transfer is performed by moving a permanent magnet for magnetic transfer along a moving path (shown by an arrow) in the figure.

FIG. 13B is a sectional view showing the magnetic transfer pattern writing process. The master disk 702 has a structure in which a soft magnetic film (Co-based soft magnetic film in the figure) 805 is embedded on the surface side in contact with the surface of the silicon substrate 804, as shown in FIG.

The permanent magnet 803 and the magnetic layer 80 of the medium 701.
When a master disk 702 having a pattern of a soft magnetic film 805 embedded therein is inserted between the two, a magnetic field leaking from the permanent magnet 803 and transmitted to the silicon substrate 804 (the direction of the magnetic field for writing the transfer signal is The direction opposite to the degaussing magnetic field) allows the magnetic layer 802 to be magnetized by penetrating silicon again at the position where the soft magnetic film 805 does not exist, but at the portion where the pattern of the soft magnetic film 805 exists, the magnetic layer having a small magnetic resistance It passes through the soft magnetic film 805 so as to form a path. Therefore, at the position where the soft magnetic layer 805 exists, the magnetic field leaking from the silicon substrate 804 becomes small, and new writing of magnetization is not performed. The magnetic transfer of the servo signal is performed on the medium 701 by the mechanism as described above.

FIG. 14 illustrates the step of embedding the soft foundation layer 805 in the master disk 702. First step (resist pattern forming step of FIG. 14A): A resist (thickness 1 μm) is applied to the surface of a silicon substrate 804 (thickness: approximately 500 μm) using a spin coater, and then the resist is usually Patterning is performed by using the same optical lithography method as the manufacturing method of the silicon semiconductor described above. Second step (silicon substrate etching step of FIG. 14B): The silicon substrate 804 is approximately 500 by using a reactive plasma etching method (reactive gas: methane trichloride).
nm dry etching is performed. Third step ((c) Co sputtering step of FIG. 14):
Using the sputtering method, leaving the resist, C
An o-based soft magnetic film is formed to a thickness of 500 nm. Fourth step (lift-off step of FIG. 14D): immersing the silicon substrate in a solvent that dissolves the resist after forming the Co soft magnetic film (while using ultrasonic waves as necessary),
The resist between the Co soft magnetic film 805 and the silicon substrate 804 is dissolved and removed.

FIG. 15 shows a pattern of the soft magnetic film 805 embedded in the 3.5-inch master disk 702. FIG. 15 (a) shows the entire size, and FIG. 15 (b).
Is a partial enlargement so that the embedded size can be seen.

The width of the pattern of the soft magnetic film 805 is 0.52 to 0.65 μm on the inner circumference and 0.98 to 1.4 on the outer circumference.
The size is 9 μm, which is close to submicron, and the patterning on the silicon substrate 804 requires accuracy of about 1/10 to 1/20 of this size.

[0014]

The above-mentioned silicon substrate 8 is used.
For the patterning to 04, an optical lithography method similar to the method for manufacturing a normal silicon semiconductor is used, but there are two types of methods, a direct drawing method and a photomask method.

1) Direct drawing method As shown in FIG. 16, the laser beam from the laser oscillation tube 1101 is reflected by a reflecting mirror 1102, an acousto-optic reflector (X direction) 1103, and an acousto-optic reflector (Y direction) 1.
By irradiating the resist surface 1105 on the silicon substrate 1106 through 104, patterning is performed on the silicon substrate 1106 (corresponding to the above silicon substrate 804).

By narrowing the laser beam from the laser oscillation tube 1101 with an optical system (not shown),
A beam with a small diameter is created, and the laser beam is scanned with an AOD (acousto-optic deflector) to produce Si.
Irradiation is performed on the resist surface 1105 applied to the substrate 1106. Actually, since it is necessary to scan in the X and Y directions,
Two sets of AOD are required: an acousto-optic reflector 1103 for X-direction scanning and an acousto-optic reflector 1104 for Y-direction scanning. The features and problems of this direct drawing method are described below.

Features-Because no mechanism is used in the laser beam scanning system,
If the temperature of the AOD crystal is controlled, a positional accuracy of about 25 nm can be obtained. -The drawing range is wide and a maximum of about 400 mm is possible.

Problem: It is necessary to draw a pattern for each master disk, and the manufacturing cost is high. The minimum beam diameter is about 0.8 μm, which does not satisfy the resolution required for a pattern with high recording density.

2) Photomask method As shown in FIG. 17A, after a resist is applied to a glass plate on which a Cr film is formed, FIG. 17B,
As shown in (c), the resist is patterned by a drawing device (a device equivalent to the above-mentioned direct drawing device), and as shown in (d) of FIG.
By removing the Cr film in the exposed portion and removing the resist layer as shown in FIG. 17E, a photomask in which the Cr film in the unexposed portion is formed on the glass plate is obtained.

Generally, in the case of a submicron pattern, a photomask is prepared at a scale of 5 times the original size in consideration of the line width of a drawing device at the time of making the photomask and dust at the photoprocess, and then the Si substrate is formed. At the time of patterning, as shown in FIG. 18, an optical system having a reduction magnification of ⅕ is constructed. The size of the photomask 1301 is 5 inches,
Assuming that an optical system 1302 with a reduction ratio of 1/5 is used (note that 1106 is a Si substrate), 44 photomasks are used to form a 3.5-inch medium, as shown in FIG. It is necessary to connect the patterns.
The features and problems of this photomask method are described below.

Features-If a photomask is created, the steps including patterning are equivalent to the steps for creating an IC, so that the master disk manufacturing time is short and the manufacturing cost is low. -Since a reduction optical system is used, a submicron line width can be easily created, and it can be applied to high density media.

Problem: Since the patterns formed by the photomasks are connected to each other as described above, the positioning error of the mask is directly connected to the pattern shift of the connecting portion, and the servo signal cannot be obtained at an accurate position. .

In order to solve the above problems of the photomask method, the inventor of the present application has found that the pattern of one round of the medium is composed of several hundred and ten sectors, and controls the positioning of the magnetic head and the reading / writing of data. Paying attention to the fact that all of them are completed in one sector, the patterns existing in one photomask are set as sector units, so that even if the photomask is displaced, it is less likely to be affected by it. It is believed that, "In the production of a master disk used to transfer a magnetic pattern to a magnetic recording medium, the pattern for exposing a resist on a Si substrate which is a substrate of the master disk is composed of a plurality of photomasks, A method of manufacturing a master disk for magnetic disk transfer in which patterns of individual photomasks are formed in units of sectors "was invented.

Further, when the size of the medium is large and one wedge cannot fit in one photomask, the inventor of the present application divides the wedge in the circumferential direction and the radial direction to divide the wedge into a plurality of photomasks. It is thought that it is possible to deal with this by dividing the mask into masks. “The pattern of each photomask is in sector units in the θ direction with respect to the center of the master disk, and in the R direction the center of the master disk is the origin. A method of manufacturing a master disk for magnetic disk transfer, which is characterized by being divided by an arc.

However, in this manufacturing method according to the invention of the present inventor, it is premised that the stage holding the Si substrate moves only in two directions orthogonal to each other. Therefore, as shown in FIG. In the case of a disc, 59 photomasks are required, and the problem that the photomask cost becomes very expensive remains. Note that FIG.
1 shows the structure of a photomask for a 1-inch master disk in this method.

The present invention has been made in view of the above points, and an object thereof is that in the photomask system, the stage for scanning the photomask has an error in the actual movement amount with respect to the set movement amount. However, the object of the present invention is to provide a method of manufacturing a master disk for magnetic disk transfer by a patterning method which is less susceptible to the influence of the error and is compatible with a smaller number of photomasks, and an exposure apparatus used for the method.

[0027]

In order to achieve the above object, the first embodiment of the method of the present invention is a substrate of a master disk, Si, which is used in the manufacture of a master disk used for transferring a magnetic pattern to a magnetic storage medium. As a photomask for exposing a resist on a substrate, a master disk is manufactured by using one or more photomasks having only index sectors and one or more photomasks having only non-index sectors And

The second embodiment of the method of the present invention is a photomask for exposing a resist on a Si substrate, which is a substrate of a master disk, in the production of a master disk used for transferring a magnetic pattern to a magnetic storage medium. A master disk is manufactured by using one or a plurality of photomasks including index sectors and non-index sectors and one or a plurality of photomasks including only non-index sectors.

Here, preferably, the number of sectors included in each photomask is 1 / n (n is an integer of 2 or more) of all the sectors.

The pattern of each photomask is
The θ direction may be divided into sector units with respect to the center of the mask disk, and the R direction may be separated by an arc whose origin is the center of the master disk.

Further, preferably, the photomask is exchanged for exposure in accordance with the rotation angle of the stage holding the Si substrate of the exposure device for exposing the photomask.

A master disk for magnetic disk transfer manufactured by using the above photomask according to the present invention is within the scope of the present invention.

In order to achieve the above-mentioned object, the first embodiment of the apparatus of the present invention relates to a resist coated on a Si substrate,
In the exposure device that exposes the pattern of the photomask,
The moving mechanism of the stage that holds the Si substrate includes at least a rotating mechanism, and the rotation angle of the stage exceeds ± 180 degrees.

A second mode of the apparatus of the present invention is an exposure apparatus for exposing a resist coated on a Si substrate to a pattern of a photomask, in which the stage moving mechanism for holding the Si substrate has a polar coordinate system. Is included, and at least the rotation angle of the stage exceeds ± 180 degrees.

A third form of the apparatus of the present invention is an exposure apparatus for exposing a resist coated on a Si substrate with a pattern of a photomask, wherein a stage moving mechanism for holding the Si substrate has a rectangular coordinate system. It is characterized in that it includes a function capable of moving in two directions orthogonal to the system and three directions of rotation of the polar coordinate system, and that the rotation angle of at least the stage exceeds ± 180 degrees.

The servo pattern (magnetic pattern) around the circumference of the magnetic recording medium is composed of hundreds of sectors.
Magnetic head positioning control, data read / write,
It is completed in one sector. Further, the sector is composed of one index sector indicating an absolute position and hundreds of tens of non-index sectors, and is basically composed of two types of sectors. The present invention is
With this in mind, the photomask that exposes the resist on the Si substrate, which is the substrate of the master disk, has one or more photomasks containing only index sectors or index sectors, and one photomask containing only non-index sectors. Alternatively, a plurality of photomasks are prepared, and the photomasks are exchanged and exposed in accordance with the rotation angle of the rotary stage that holds the Si substrate of the exposure apparatus. As a result, even if the stage that scans the photomask has an error in the actual transfer amount with respect to the set moving amount, it is not easily affected by the error, and a smaller number of photomasks can be used. be able to.

[0037]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 shows the arrangement of sectors in the magnetic storage medium according to the present invention. This sector has one index sector No-1 indicating the absolute position and N other sectors.
It is composed of 127 non-index sectors denoted by o-2 to No-128.

Each of the index sector and the non-index sector is composed of a region as shown in FIG. 2, and the main one is the VCO (Volt) of the circuit section.
A clock control area 201 of a pattern for generating a reference signal of an age control oscillator, an address area 204 of a pattern for detecting the position of the magnetic head, and a position detect (Position Dete).
ct) Region 205 is included. The clock area 201 is about 4
It is composed of zero magnetic patterns with 50% duty, and when the medium 701 rotates at a constant speed of 7200 rpm, a signal of about 5 MHz is obtained from the clock region 201 as the output of the magnetic head. .

Based on the signal obtained when passing through the clock region 201, the output clock of the VCO inside the circuit is synchronously controlled to generate the clock signal inside the circuit that matches the rotation speed of the medium 701. After passing through the clock domain 201, the VCO is locked and the clock domain 201 is locked.
The clock signal when the synchronization with the signal from is obtained.

Here, as shown in FIG.
In the detect area 205, staggered rectangular patterns (pattern X, pattern Y, pattern A, pattern B) are arranged on the servo track. Therefore, as shown in FIG. 4, the magnetic head 301 reads out the pattern signal of the position / detect region 205, the read signal is amplified by the amplifier 302, and then the low-pass filter 303 is passed through the full-wave rectifier 304. The output waveform is full-wave rectified and then integrated by the integrator 305.

The resulting signal is sampled by the sample and hold device 306, and X, X + Y, A,
Each signal of A + B is extracted, and X-
Calculate the Y, AB values. By doing so, a linear analog signal is obtained over the entire area of one track width, the amount of displacement from the track center is detected, and position correction is performed according to the detected amount to set the head position on the regular servo track. Can be controlled. As described above, in each sector of the magnetic storage medium, the position of the magnetic head is detected, the position control is performed, and then a series of operations for reading and writing data is performed. Therefore, when the magnetic pattern discontinuity occurs in each sector due to the seam of the photomask, data reading by the recording head,
The symptom that writing is not performed normally occurs. this is,
If the shift of the pattern in one sector in the θ direction is changed, for example, when the pattern interval of the clock region 201 changes in the middle, the frequency of the reference clock shifts, and the accuracy of the head position detection in the subsequent stage and the data region. Greatly affect the approval of.

For this reason, the connection portion of the photomask is formed so that the magnetic pattern is not shifted in each sector unit.
In other words, if a photomask for creating a master disk is created in sector units, even if the exposure position of the photomask is slightly deviated, it does not deviate in sector units, which hinders magnetic head position detection, data reading, and writing. It will not happen.

FIG. 5 shows an example of application of the present invention to a 1-inch storage medium. Since the outer diameter of a 1-inch storage medium is 22 mm, the effective exposure area on a Si wafer is 15 mm square when a 5-inch photomask is used for 1/5 reduction exposure. Create two types of photomasks, index photomasks.

This photomask, as shown in FIG.
It is not necessary for the photomask to show only one sector, and the number of sectors that can be exposed at one time is increased. The number may be 1 / n (n is an integer of 2 or more). For example, the sector is, as described above with reference to FIG.
Total of 7 non-index sectors: It consists of 128 sectors, so if 1/5 reduction exposure is performed using a 5 inch photomask for a 1 inch master disk, Thus, it is possible to form a pattern in 16-sector units of 8 divisions of all sectors. In this case, the photomask has one index sector,
There are two types, a photomask A in which 15 non-index sectors are depicted and a photomask B in which 16 non-index sectors are depicted.

The flowchart of FIG. 7 shows a procedure for exposing the photoresist on the Si substrate using these photomasks A and B shown in FIG. The Si substrate is set on the rotary stage so that the position corresponding to the center of the master disk on the Si wafer is aligned with the center of rotation of the rotary stage (not shown) (step 401), and the photomask guide of the stepper is set. The photomask A is attached (step 402), and the resist applied to the Si substrate is exposed (step 403).

Next, the rotary stage is rotated up to 45 degrees and the photomask of the photomask guide of the stepper is replaced with the photomask B for exposure (step 40).
4).

Further, the rotary stage is rotated up to 90 degrees (step 406), and the same photomask B is used for exposure again (step 407). By repeating this operation and rotating the rotary stage up to 360 degrees, one round of sectors is exposed to the photoresist on the Si substrate (step 405).

As a result, with a 1-inch master disk, five photomasks were required when the rotation of the stage holding the Si substrate of the exposure apparatus was not used, but two photomasks were provided according to the present invention. It will be good only.

The case where the present invention is applied to a 3.5-inch photomask will be described below. The outer diameter of a 3.5-inch storage medium is 96 mm. Since the effective exposure area on the Si wafer is 15 mm square when 1/3 reduction exposure is performed with a 3.5-inch photomask, one photomask can be used from the inner edge (inner peripheral portion) of the sector. Outer edge (outer periphery)
Can't cover up. For this reason, it is necessary to connect a plurality of photomasks. The deviation of the servo signal in the θ direction (circumferential direction) in one sector has a great influence on the reading and writing of data, but the R direction of the servo pattern ( The deviation in the radial direction does not occur as much as the degree of influence seen in the θ direction. In addition, if the influence of the joint in the R direction becomes a problem, if the joint in the R direction has the same diameter over the entire circumference, it is set so that only the boundary portion is not used.
Measures can be taken.

FIG. 8 shows an example of the photomask obtained by dividing the pattern of the 3.5-inch master disk in the R direction and the sectors. In this case, a total of 6 photomasks for indexing and 3 photomasks for non-indexing may be used. Here, S of the exposure apparatus
It is assumed that the i-board moving mechanism has the functions of moving and rotating in the X and Y directions.

The exposure procedure for the photomask is almost the same as the exposure for a 1-inch master disk, but the difference is that there are three types of photomasks on the inner peripheral side, the central side, and the outer peripheral side. As shown in the flowchart of FIG. 11, after the exposure of the photomask on the inner circumference side is completed on the entire circumference (step 5
06), move the center of the rotary stage (step 5
09), the photomask on the center side is exposed, and after the exposure has completed the entire circumference (step 513), the center of the rotary stage is moved again (step 516), and the photomask on the outer peripheral side is exposed and exposed. When the entire circumference is completed (step 520), all the sectors for one circumference are exposed to the photoresist on the Si substrate.

As a result, with the 3.5-inch master disk, 44 or 59 photomasks were required when the rotation of the stage holding the Si substrate of the exposure apparatus was not used. Since only 6 photomasks are required, the number of photomasks can be significantly reduced.

Next, a stepper with a rotation function of the exposure apparatus applied to the method for manufacturing the magnetic disk transfer master disk of the present invention described above will be explained.

The conventional semiconductor stepper is shown in FIG.
As shown in FIG. 3, a photomask 1501 and an optical system 15 for projecting the pattern of the photomask on the resist of the Si substrate
03, and X and Y stages 1505 and 1507 for moving the Si substrate to a position for patterning.

However, in the above-described embodiment of the present invention, since it is necessary to expose the same pattern while shifting it in the circumferential direction of the Si substrate, as shown in FIG.
The Y stage 1507 is attached to the moving body 1509 of the X stage, and the rotary stage 1 is attached to the moving body 1511 of the Y stage.
601 is attached. Then, the Si substrate holder 1513 is installed on the rotation stage 1601.
For example, for a 1-inch storage medium, since only the rotation of the Si substrate is necessary, only the rotary stage 1601 is required.
In the case of a 3.5-inch storage medium, it is necessary to move it in the radial direction as well, so either the X or Y stage is essential, and this can be treated as the R direction stage.

[0057]

As described above, according to the present invention,
As a photomask for exposing the resist on the Si substrate, one or more photomasks including index sectors and one or more photomasks only having non-index sectors are created to hold the Si substrate of the exposure apparatus. Since the photomasks are exchanged and exposed in accordance with the rotation angle of the stage to be used, it is possible to reduce the number of photomasks, and the servo patterns existing in one photomask can be reduced. By setting the sector unit,
Even if the photomask is displaced, it can be made less susceptible to the influence.

Further, according to the present invention, when the size of the magnetic storage medium is large and one wedge cannot fit in one photomask, the sector is divided into the circumference and the radial direction, By dividing the photomask into a plurality of photomasks, it is possible to deal with it, and it is possible to manufacture a master disk corresponding to high recording density at low cost.

[Brief description of drawings]

FIG. 1 is a plan view showing a configuration of a sector pattern of a soft magnetic film of a master disk.

FIG. 2 is an enlarged view showing a pattern configuration of the sector of FIG.

FIG. 3 is an enlarged view showing a state of a signal pattern of a position detect area of the sector of FIG.

4 is a block diagram showing a signal flow when a position control signal is detected from a signal pattern of a position detect area of the sector of FIG.

FIG. 5 is a plan view showing a pattern of a 1-inch master disk photomask according to an embodiment of the present invention.

FIG. 6 is a plan view showing another pattern of the 1-inch master disk photomask according to the embodiment of the present invention.

FIG. 7 is a flowchart showing a procedure for exposing a photoresist on a Si substrate using a 1-inch photomask according to an embodiment of the present invention.

FIG. 8 is a plan view showing a pattern of a 3.5-inch master disk photomask according to an embodiment of the present invention.

FIG. 9 is a flowchart showing a first step of the steps of exposing a photoresist on a Si substrate using a 3.5-inch photomask according to an embodiment of the present invention.

FIG. 10 is a flowchart showing a procedure following the procedure of FIG. 9;

FIG. 11 is a flowchart showing a procedure following the procedure in FIG. 10;

FIG. 12 is a schematic perspective view showing a process of magnetic transfer in a magnetic storage medium.

FIG. 13 is a schematic cross-sectional view illustrating the principle of magnetic transfer in a magnetic storage medium.

FIG. 14 is a cross-sectional view showing a step of burying a soft magnetic layer in a master disk.

FIG. 15 is a view showing a pattern of a soft magnetic layer embedded in a 35-inch master disk, (a) is a plan view,
(B) is the elements on larger scale.

FIG. 16 is a schematic diagram showing patterning by a direct drawing method.

FIG. 17 is a cross-sectional view showing manufacturing of a photomask by a photomask method.

FIG. 18 is a side view illustrating patterning by a reduction optical system using a photomask method.

FIG. 19 is a plan view illustrating joining of photomasks in a conventional photomask method.

FIG. 20 is a schematic plan view showing an arrangement configuration of a photomask for a 3.5-inch master disk, which is an object of the present invention.

FIG. 21 is a schematic plan view showing an arrangement configuration of a photomask for a 1-inch master disk, which is a subject of the present invention.

FIG. 22 is a perspective view showing a configuration of a conventional semiconductor device stepper.

FIG. 23 is a perspective view showing a configuration of a stepper with rotation function applied in the present invention.

[Explanation of symbols]

201 clock domain 202 Gray code area 203 Gap 204 address area 205 Position Detect Area 301 magnetic head 302 amplifier 303 Low pass filter 304 full wave rectifier 305 integrator 306 sample and hold device 307 calculator 701 Magnetic recording medium (medium) 702 Master disk 801 substrate 802 magnetic layer 803 permanent magnet 804 Silicon substrate 805 Soft magnetic layer (embedded soft magnetic Co layer) 1101 Laser oscillation tube 1102 Reflector 1103 Acoustic reflector (X direction) 1104 Acoustic reflector (Y direction) 1105 Resist surface 1106 Silicon substrate 1301 photo mask 1302 Micro optical system 1501 photo mask 1503 Optical system 1505 X stage 1507 Y stage 1509 X stage moving body 1511 Moving body of Y stage 1513 Si substrate holder 1601 rotary stage

Claims (9)

[Claims] 1. When manufacturing a master disk used for transferring a magnetic pattern to a magnetic storage medium, one or a plurality of index sectors only is used as a photomask for exposing a resist on a Si substrate which is a substrate of the master disk. A method of manufacturing a master disk for magnetic disk transfer, which comprises manufacturing a master disk using a photomask and one or more photomasks having only non-index sectors. 2. A master disk used for transferring a magnetic pattern to a magnetic storage medium, wherein a photomask for exposing a resist on a Si substrate, which is a substrate of the master disk, includes a sector mask including an index sector and a non-index sector. Alternatively, a method of manufacturing a master disk for magnetic disk transfer is characterized in that a master disk is manufactured by using a plurality of photomasks and one or a plurality of photomasks having only non-index sectors. 3. The master disk for magnetic disk transfer according to claim 1, wherein the number of sectors included in each photomask is 1 / n of all sectors (n is an integer of 2 or more). How to make. 4. The pattern of each of the photomasks is divided from the center of the mask disc in sector units in the θ direction and in an arc in the R direction with the center of the master disc as the origin. 4. The method for producing a master disk for magnetic disk transfer according to claim 1, wherein 5. The exposure is performed by exchanging the photomask according to a rotation angle of a stage that holds a Si substrate of an exposure device that exposes the photomask. A method for producing a master disk for magnetic disk transfer according to. 6. A master disk for magnetic disk transfer manufactured by using the photomask according to claim 1. 7. An exposure apparatus for exposing a resist applied on a Si substrate to expose a pattern of a photomask, wherein a moving mechanism of a stage holding the Si substrate includes at least a rotating mechanism, and a rotation angle of the stage is An exposure apparatus characterized by exceeding ± 180 degrees. 8. An exposure apparatus for exposing a resist applied on a Si substrate to a pattern of a photomask, wherein a moving mechanism of a stage for holding the Si substrate has a polar coordinate system movement (R direction, rotation direction). An exposure apparatus including a function that can be performed and at least a stage rotation angle exceeding ± 180 degrees. 9. An exposure apparatus for exposing a resist coated on a Si substrate to a pattern of a photomask, wherein a moving mechanism of a stage for holding the Si substrate is arranged in two orthogonal directions of a rectangular coordinate system and a polar coordinate system. An exposure apparatus comprising a function capable of moving in three directions of rotation and at least a stage rotation angle exceeding ± 180 degrees.