JP2003226967A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2003226967A5 JP2003226967A5 JP2002028112A JP2002028112A JP2003226967A5 JP 2003226967 A5 JP2003226967 A5 JP 2003226967A5 JP 2002028112 A JP2002028112 A JP 2002028112A JP 2002028112 A JP2002028112 A JP 2002028112A JP 2003226967 A5 JP2003226967 A5 JP 2003226967A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002028112A JP4101524B2 (en) | 2002-02-05 | 2002-02-05 | Deposition equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002028112A JP4101524B2 (en) | 2002-02-05 | 2002-02-05 | Deposition equipment |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003226967A JP2003226967A (en) | 2003-08-15 |
| JP2003226967A5 true JP2003226967A5 (en) | 2005-08-11 |
| JP4101524B2 JP4101524B2 (en) | 2008-06-18 |
Family
ID=27749431
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002028112A Expired - Fee Related JP4101524B2 (en) | 2002-02-05 | 2002-02-05 | Deposition equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4101524B2 (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010116605A (en) * | 2008-11-13 | 2010-05-27 | Fujikura Ltd | Target-holding device, and film-forming apparatus and film-forming method using the same |
| JP5995419B2 (en) * | 2011-09-01 | 2016-09-21 | 株式会社東芝 | Sputtering target and magnetic memory manufacturing method using the same |
| CN103987873B (en) * | 2011-12-12 | 2016-10-05 | 佳能安内华股份有限公司 | Sputtering unit, target and guard shield |
| JP5708472B2 (en) * | 2011-12-21 | 2015-04-30 | 住友金属鉱山株式会社 | Magnetron sputtering cathode and sputtering apparatus equipped with the same |
| KR102190319B1 (en) * | 2013-04-08 | 2020-12-14 | 외를리콘 서피스 솔루션즈 아게, 페피콘 | Centering of a plate in a holder both at room temperatures and higher temperatures |
| JP6339871B2 (en) * | 2014-06-19 | 2018-06-06 | 東京エレクトロン株式会社 | Plate member fixing mechanism, PVD processing apparatus, and plate member fixing method |
| JP6508774B2 (en) * | 2015-06-09 | 2019-05-08 | 株式会社高純度化学研究所 | Sputtering target assembly |
| TWI788618B (en) * | 2019-01-25 | 2023-01-01 | 美商應用材料股份有限公司 | Physical vapor deposition target assembly |
-
2002
- 2002-02-05 JP JP2002028112A patent/JP4101524B2/en not_active Expired - Fee Related