JP2003218062A - Cutting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cutting device which can prevent the occurrence pitching by maintaining relation between the rotational speed and the cutting feed speed of a cutting blade to prescribed levels. <P>SOLUTION: The cutting device has a chuck table for holding a work piece, a cutting mechanism, having a cutting blade for cutting a work piece held by the chuck table, a cutting feed means for relatively moving the chuck table and the cutting blade in a cutting feed direction, a rotational speed detecting means for detecting the rotational speed of the cutting blade, and a control means for controlling the cutting feed means, based on the rotational speed of the cutting blade detected by the rotational speed detecting means. The control means controls the cutting feed means for maintaining a relation between the rotational speed and the cutting feed speed of the cutting blade to the prescribed levels, based on the rotational speed of a cutting blade which is detected by a rotation velocity detection means. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cutting device equipped with a cutting blade for cutting a workpiece such as a semiconductor wafer.

[0002]

2. Description of the Related Art For example, in a semiconductor device manufacturing process, circuits such as ICs and LSIs are formed in a large number of regions arranged in a lattice on the surface of a substantially disk-shaped semiconductor wafer, and the circuits are formed. Individual semiconductor chips are manufactured by dicing each area along a predetermined street (cutting line). As a device for dicing a semiconductor wafer in this way, a cutting device is generally used. A cutting device for dicing a semiconductor wafer includes a chuck table that holds a work piece, and a cutting mechanism that includes a cutting blade that cuts the work piece held by the chuck table. In such a cutting device, a cutting action is performed by relatively moving a high-speed rotating cutting blade and a workpiece in a cutting feed direction.

[0003]

When cutting is performed by the above-described cutting device, pitching is performed on both sides of the cutting groove in a range in which a predetermined amount of cutting is fed after the cutting blade comes into contact with the workpiece to start the cutting action. Occurs. The present inventors examined the cause of this pitching and found that it was caused by a change in the relationship between the cutting blade rotation speed and the cutting feed speed. That is, the rotational speed of the cutting blade starts to decrease after the workpiece comes into contact with the workpiece to start the cutting action, and reaches a minimum at the time when a predetermined amount of cutting is fed, and then gradually recovers. Therefore, it was found that in the range where the rotation speed of the cutting blade is lower than the set rotation speed, the relationship between the rotation speed of the cutting blade and the cutting feed speed changes and pitching occurs.

The present invention has been made in view of the above facts, and its main technical problem is to prevent the occurrence of pitching by maintaining the relationship between the rotational speed of the cutting blade and the cutting feed speed in a predetermined relationship. The present invention provides a cutting device that can be used.

[0005]

In order to solve the above-mentioned main technical problems, according to the first aspect of the present invention, a chuck table for holding a workpiece and a workpiece held by the chuck table are cut. A cutting mechanism equipped with a cutting blade; and a cutting feed means for moving the chuck table and the cutting blade relatively in the cutting feed direction,
In a cutting device that cuts a workpiece by moving the cutting blade relative to the chuck table in a cutting feed direction at a predetermined cutting feed speed, a rotation speed detection for detecting the rotation speed of the cutting blade. Means and control means for controlling the cutting feed means on the basis of the rotation speed of the cutting blade detected by the rotation speed detection means, the control means comprising the cutting blade detected by the rotation speed detection means. A cutting device is provided which controls the cutting feed means so as to maintain the relationship between the cutting blade rotation speed and the cutting feed speed in a predetermined relationship based on the rotation speed.

In order to solve the above-mentioned main technical problem, according to the second aspect of the present invention, a chuck table for holding a workpiece having a plurality of streets and a workpiece held on the chuck table are provided. A cutting mechanism provided with a cutting blade for cutting along the street, and a cutting feed means for relatively moving the chuck table and the cutting blade in the cutting feed direction, and the chuck while rotating the cutting blade. In a cutting device that cuts a workpiece by moving relative to a table in a cutting feed direction at a predetermined cutting feed speed, a rotation speed detection unit that detects a rotation speed of the cutting blade, and a rotation speed detection unit And a control means for controlling the cutting feed means based on the detected rotation speed of the cutting blade, the control means comprising a cutting feed stroke. Corresponding to the position of the cutting blade, the cutting feed speed is obtained by which the relationship between the cutting blade rotation speed and the cutting feed speed is a predetermined relationship based on the rotation speed of the cutting blade detected by the rotation speed detection means. A cutting device is provided which stores the cutting feed means and controls the cutting feed means based on the stored cutting feed speed corresponding to a cutting feed stroke position when cutting the next street.

The control means obtains the cutting feed speed by multiplying the set feed speed by a value obtained by dividing the cutting blade rotation speed by the target rotation speed.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of a cutting device constructed according to the present invention will be described in detail below with reference to the accompanying drawings.

FIG. 1 shows a perspective view of a cutting device constructed according to the present invention. The cutting device shown in FIG. 1 includes a substantially rectangular parallelepiped device housing 10.
In the device housing 10, the stationary base 2 shown in FIG.
A chuck table mechanism 3 which is movably arranged on the stationary base 2 in a direction indicated by an arrow X, which is a cutting feed direction, and holds a workpiece, and an arrow Y, which is an indexing feed direction on the stationary base 2. A spindle support mechanism 4 movably arranged in a direction (a direction perpendicular to a direction indicated by an arrow X which is a cutting feed direction), and a spindle feed mechanism 4 which moves in a direction indicated by an arrow Z which is a cut feed direction in the spindle support mechanism 4. A spindle unit 5, which is arranged so as to be possible, is arranged.

The chuck table mechanism 3 has two guide rails 31 and 32 arranged in parallel on the stationary base 2 along a direction indicated by an arrow X, and an arrow X on the guide rails 31 and 32. The chuck table 33 is provided as a workpiece holding means arranged so as to be movable in the direction indicated by.
The chuck table 33 includes a suction chuck support base 331 movably arranged on the guide rails 31 and 32,
An adsorption chuck 332 mounted on the adsorption chuck support base 331, and a support table 333 arranged below the upper surface of the adsorption chuck 332 by a predetermined height are provided.
A workpiece, for example, a disk-shaped semiconductor wafer, is held on the suction chuck 332 by suction means (not shown).

The chuck table mechanism 3 in the illustrated embodiment includes a chuck table 33 and two guide rails 3.
Drive means 34 for moving in the cutting feed direction indicated by the arrow X along 1, 32 is provided. Drive means 34
Includes a male screw rod 341 arranged in parallel between the two guide rails 31 and 32, and a drive source such as a servo motor 342 (M1) for rotationally driving the male screw rod 341. One end of the male screw rod 341 is rotatably supported by a bearing block 343 fixed to the stationary base 2, and the other end is rotatably supported by the servo motor 3.
The output shaft of 42 (M1) is transmission-coupled via a reduction gear device (not shown). The male screw rod 341 is the suction chuck support base 331 that constitutes the chuck table 33.
Is screwed into a penetrating female screw hole formed in a female screw block (not shown) provided so as to project from the lower surface of the central portion of the. Therefore, by driving the male screw rod 341 in the normal and reverse directions by the servomotor 342 (M1), the chuck table 33 is moved along the guide rails 31 and 32 by the arrow X.
It can be moved in the cutting feed direction indicated by. Therefore, the servo motor 342 (M1), the male screw rod 341, and the bearing block 343 function as a cutting feed unit that relatively moves the chuck table and a spindle unit described below in the direction indicated by the arrow X that is the cutting feed direction. Further, the chuck table mechanism 3 includes a chuck table 33.
It has a rotation mechanism (not shown) for rotating the.

The spindle support mechanism 4 comprises a stationary base 2
Two guide rails 41 and 42, which are arranged in parallel along the indexing feed direction indicated by arrow Y above, and the guide rail 4
A movable support base 43 is provided on the first and the second positions 42 so as to be movable in a direction indicated by an arrow Y. This movable support base 4
Reference numeral 3 includes a moving support portion 431 movably arranged on the guide rails 41 and 42, and a mounting portion 432 attached to the moving support portion 431. The mounting portion 432 is
Two guide rails 4 extending in the direction indicated by arrow Z on one side
32a and 432a are provided in parallel. The spindle support mechanism 4 in the illustrated embodiment is a movable support base 4
It is provided with a drive means 44 for moving 3 along the two guide rails 41, 42 in the indexing feed direction indicated by arrow Y. The driving means 44 includes the two guide rails 4 described above.
Male screw rod 441 arranged in parallel between 1 and 42
And a drive source such as a pulse motor 442 (M2) for rotationally driving the male screw rod 441. One end of the male screw rod 441 is rotatably supported by a bearing block (not shown) fixed to the stationary base 2, and the other end is attached to the output shaft of the pulse motor 442 (M2) through a reduction gear device (not shown). It is connected by transmission.
The male screw rod 441 is screwed into a female screw hole formed in a female screw block (not shown) provided on the lower surface of the central portion of the moving support portion 431 that constitutes the movable support base 43. Therefore, the pulse motor 442 (M2)
By driving the male screw rod 441 to rotate in the normal and reverse directions, the movable support base 43 is moved to the guide rails 42, 42.
Along the arrow Y in the indexing feed direction. Therefore, the pulse motor 442 (M2), the male screw rod 441, and the like move the chuck table and the spindle unit, which will be described later, relatively in the indexing feed direction indicated by the arrow Y perpendicular to the cutting feed direction (arrow X direction). Functions as a means.

The spindle unit 5 in the illustrated embodiment has a unit holder 51 and a unit holder 51.
A spindle housing 52 attached to the spindle housing 52, and a rotary spindle 53 rotatably supported by the spindle housing 52. The unit holder 51 includes two guide rails 432 provided on the mounting portion 432.
Two guided rails 51a and 51a slidably fitted to the a and 432a are provided.
By fitting the guide rails 1a and 51a into the guide rails 432a and 432a, the guide rails 432a and 432a are movably supported in the cutting feed direction indicated by the arrow Z. The rotary spindle 53 is arranged so as to project from the tip of the spindle housing 52, and the cutting blade 6 is attached to the tip of the rotary spindle 53.
Is installed. The rotary spindle 53 equipped with the cutting blade 6 is rotationally driven by a drive source such as a servo motor 54 (M4). A rotary encoder 54 (RE) that detects a rotation speed is attached to a servo motor 54 (M4) that rotationally drives the cutting blade 6. Therefore, this rotary encoder 55 (RE)
The cutting blade 6 functions as a rotation speed detection unit that detects the rotation speed of the cutting blade 6. The servomotor 54 (M4) is drive-controlled so as to maintain a target rotation speed set by a drive circuit described later.

In the spindle unit 5 in the illustrated embodiment, the holder 51 is provided with two guide rails 432a, 43.
It has a drive means 56 for moving it in the direction indicated by arrow Z along 2a. The drive means 56 is similar to the drive means 34 and 44 in that the guide rails 432 a, 432.
A male screw rod (not shown) disposed between a and a pulse motor 562 for rotationally driving the male screw rod.
(M3) drive source is included, pulse motor 562
By driving the male screw rod (not shown) in the forward and reverse directions by (M3), the unit holder 51, the spindle housing 52, and the rotary spindle 53 are moved in the cutting feed direction indicated by the arrow Z along the guide rails 432a and 432a.

Returning to FIG. 1, the illustrated cutting apparatus includes a cassette 12 for stocking a semiconductor wafer 11 which is a workpiece. The semiconductor wafer 11 is
The tape 112 is mounted on the annular frame 111, and is housed in the cassette 12 while being mounted on the frame 111. The cassette 12 is placed on a cassette table 121 which is vertically movable by an elevating means (not shown). Further, the cutting device shown in the drawing carries out a workpiece carrying-out / carrying-in mechanism for carrying out the semiconductor wafer 11 housed in the cassette 12 to the workpiece mounting area 19 and carrying in the semiconductor wafer 11 after the cutting processing to the cassette 12. 13 and the semiconductor wafer 11 carried out to the workpiece mounting area 19 are set on the chuck table 3
3, a workpiece conveying mechanism 14 that conveys the workpiece onto the chuck table 33, a cleaning unit 15 that cleans the semiconductor wafer 11 that has been cut on the chuck table 33, and a cleaning unit 15 that cleans the semiconductor wafer 11 that has been cut on the chuck table 33. A cleaning / transporting mechanism 16 for transporting is provided. Further, the illustrated cutting device includes an image pickup means 17 (AM) including a microscope and a CCD camera for picking up images of streets (cutting lines) formed on the semiconductor wafer 11 held on the chuck table 33, and the like. The display means 18 (DP) for displaying an image and the like picked up by the image pickup means 17 (AM) is provided.

The cutting device in the illustrated embodiment is shown in FIG.
The control means 10 is provided as shown in FIG. Control means 2
00 is composed of a microcomputer,
Central processing unit (C
PU) 201, read only memory (ROM) 202 for storing control programs and the like, and readable and writable random access memory (RAM) 20 for storing operation results and the like.
3 and an input interface 204 and an output interface 205. Detection signals from the rotary encoder 55 (RE) for detecting the rotation speed of the servo motor 54 (M4), the image pickup means 17 (AM), etc. are input to the input interface 204 of the control means 200 thus configured. It Further, from the output interface 205, the servo motor 342 (M1), the pulse motor 442 (M2), and the pulse motor 532 (M
3), each drive circuit (DC) of the servo motor 54 (M4)
1), (DC2), (DC3), and (DC4) while outputting control signals, the display means 18 (DP), the workpiece carry-in / carry-out mechanism 13, the workpiece transport mechanism 14,
A control signal is output to the cleaning means 15, the cleaning / transporting mechanism 16, and the like.

Next, the cutting processing operation of the above cutting device will be briefly described. The semiconductor wafer 11 mounted on the frame 111 housed in a predetermined position of the cassette 12 (hereinafter, the semiconductor wafer 11 mounted on the frame 111 is simply referred to as the semiconductor wafer 11).
Is a cassette table 12 by an elevating means (not shown).
1 is moved up and down to be positioned at the carry-out position.
Next, the workpiece unloading / injecting mechanism 13 moves forward and backward to unload the semiconductor wafer 11 positioned at the unloading position to the workpiece placing area 19. The semiconductor wafer 11 carried out to the workpiece placement area 19 is transported onto the suction chuck 332 of the chuck table 33 by the turning operation of the workpiece transport mechanism 14, and is suction-held by the suction chuck 332. The chuck table 33 that holds the semiconductor wafer 11 by suction in this way is moved along the guide rails 32 and 32 to just below the image pickup means 17. When the chuck table 33 is positioned directly below the image pickup means 17, the image pickup means 17 detects the street (cutting line) formed on the semiconductor wafer 11, and the spindle unit 5 is moved and adjusted in the arrow Y direction which is the indexing direction. Precision alignment work is performed.

After that, the chuck table 33 holding the semiconductor wafer 11 by suction is moved in the cutting feed direction indicated by arrow X (direction orthogonal to the rotation axis of the cutting blade 6) to be held on the chuck table 33. The semiconductor wafer 11 is cut by the cutting blade 6 along a predetermined cutting line. That is, the cutting blade 6 is mounted on the spindle unit 5 which is moved and adjusted in the direction indicated by the arrow Y which is the indexing direction and the direction indicated by the arrow Z which is the cutting direction, and the servo motor 5
4 (M4) for high speed rotation (eg 30,000r
Therefore, the chuck table 33 is held by the chuck table 33 by moving the chuck table 33 along the lower side of the cutting blade 6 in the cutting feed direction indicated by the arrow X at a predetermined speed (for example, 50 mm / sec). The semiconductor wafer 11 is cut by the cutting blade 6 along a predetermined street (cutting line). When the semiconductor wafer 11 is cut along the streets (cutting lines), the semiconductor wafer 11 is divided into semiconductor chips. The divided semiconductor chips are
The action of the tape 112 does not cause the tape to fall apart, and the state of the semiconductor wafer 11 mounted on the frame 111 is maintained. After the cutting of the semiconductor wafer 11 is completed in this way, the chuck table 33 holding the semiconductor wafer 11 is returned to the position where the semiconductor wafer 11 was first sucked and held, and the suction holding of the semiconductor wafer 11 is released here. . Next, the semiconductor wafer 11 is transferred to the cleaning means 15 by the cleaning transfer mechanism 16, where the contaminants generated during the cutting are cleaned and removed. The semiconductor wafer 11 thus cleaned is transported to the workpiece placement area 19 by the workpiece transport mechanism 14. Then, the semiconductor wafer 11 is stored in a predetermined position of the cassette 12 by the workpiece carry-in / carry-out mechanism 13.

In the cutting of the semiconductor wafer 11 by the above-mentioned cutting blade 6, the cutting blade 6 and the semiconductor wafer 11 which is the workpiece are brought into contact with each other in a range in which a predetermined amount is cut and fed after the cutting action is started. Pitching occurs on both sides of the groove. FIG. 5 shows changes in the rotation speed of the cutting blade 6 during cutting. The horizontal axis represents the cutting feed stroke position of the chuck table 33 holding the semiconductor wafer 11, and the vertical axis represents the rotation speed of the cutting blade 6. During the cutting, the cutting blade 6
Of the target rotation speed R1 (for example, 30,000
rpm) and the cutting feed rate of the chuck table 33 is set to V1 (for example, 50 mm / sec). As shown in FIG. 5, the rotation speed of the cutting blade 6 starts to decrease from the stroke position S1 at which the cutting blade 6 and the semiconductor wafer 11 come into contact with each other to start the cutting action, and becomes the lowest at the stroke position S2 after a predetermined amount of cutting feed. , The stroke position S3 recovers after cutting feed
Then, the target rotation speed R1 is restored. The rotation speed of the cutting blade 6 at the stroke position S2 is about 23,000 rpm when the target rotation speed R1 is 30,000 rpm and the cutting feed speed V1 is 50 mm / sec. In this example, the cutting blade 6 has a diameter of 2 inches. It has been found that when the rotation speed of the cutting blade 6 becomes lower than the target rotation speed R1 in this way, the relationship with the cutting feed speed changes and pitching occurs.

The present invention is intended to prevent the occurrence of pitching by maintaining the relationship between the rotational speed of the cutting blade 6 and the cutting feed speed in a predetermined relationship, that is, a direct proportional relationship. Regarding the invention, control means 2 for controlling each of the above-mentioned motors based on the flowchart shown in FIG.
The operation procedure of 00 will be described. As described above, when the alignment work (indexing control) between the predetermined street (cutting line) formed on the semiconductor wafer 11 held on the chuck table 33 and the cutting blade 6 is completed, the control means 200 performs step S1. At, the control signal is output to the drive circuit (DC4) so as to drive the servo motor 54 (M4) that rotationally drives the cutting blade 6 at the target rotation speed R1 (for example, 30,000 rpm). Further, the control means 200 drives the servo motor 342 (M1) of the chuck table mechanism 3 so that the cutting feed speed of the chuck table 33 holding the semiconductor wafer 11 is set at the set feed speed V1 (for example, 50 mm / sec). The control signal is output to the circuit (DC1).

In step S1, the servo motor 54
(M4) drive circuit (DC4) and servomotor 34
When a predetermined control signal is output to the drive circuit (DC1) of 2 (M1), the control means 200 proceeds to step S2 to output from the rotary encoder 55 (RE) that detects the rotation speed of the servo motor 54 (M4). The detection signal is input, and the rotation speed R0 of the servo motor 54 (M4) is set as the actual rotation speed R of the cutting blade 6 in the random access memory (RA
M) temporarily store in 203. Then, the control means 200 proceeds to step S3 to calculate the cutting feed speed VX. The cutting feed speed VX is obtained by multiplying the set feed speed V1 by a value obtained by dividing the actual rotation speed R of the cutting blade 6, that is, the rotation speed R0 of the servo motor 54 (M4) by the target rotation speed R1 (VX = V1 × ( R0 / R1)). For example, in the example described above, the rotation speed R of the servo motor 54 (M4)
When 0 decreases to 23,000 rpm, the cutting feed speed VX is directly proportional to the decrease in the actual rotation speed R of the cutting blade 6 and is 38.3 mm / sec (VX = 50 × (23,
000 / 30,000) = 38.3). When the cutting feed speed VX is obtained in this way, the control means 200 proceeds to step S4 and the chuck table mechanism 3
A control signal is output to the servo motor 342 (M1) of (1) so that the cutting feed rate becomes VX.

Then, the control means 200 advances to step S5 to check whether or not a predetermined stroke cutting feed has been performed. Since the semiconductor wafer 11 which is the workpiece is formed in a circular shape, the street (cutting line)
Since the length of each is different, a cutting feed stroke is set for each street (cutting line), which is the random access memory (RAM) 2 of the control means 200.
It is stored in 03. Therefore, in step S5, the predetermined cutting feed stroke in which the street (cutting line) currently being cut is set is compared with the stroke in which the chuck table 33 of the chuck table mechanism 3 is actually cut and fed, It is confirmed whether or not the stroke of the chuck table 33, which is actually cut and fed, reaches the set predetermined cutting feed stroke. Step S
If the chuck table 33 has not been fed by the predetermined stroke in Step 5, the process returns to Step S2, and Steps S2 to S5 are repeated. When the chuck table 33 is fed by a predetermined stroke in step S5, the control means 200 proceeds to step S6 to perform indexing control in order to align the street (cutting line) to be cut next with the cutting blade 6. Is executed and the process returns to step S1.

Next, the second invention of the present invention will be described. A second aspect of the present invention obtains the cutting feed speed VX (VX = V1 × (R0 / R1)) based on the rotation speed of the cutting blade 6 as described above, corresponding to the cutting feed stroke position, and controls it. It is temporarily stored in the random access memory (RAM) 203 of 200. Then, when cutting the next street (cutting line), the control unit 200 causes the servo motor 342 (M1) of the chuck table mechanism 3 to change the cutting feed speed to a random access memory (RAM) 203 corresponding to the cutting feed stroke position. The control signal is output so that the cutting feed speed VX temporarily stored in the table is obtained. Even in the street (cutting line) currently being cut, the cutting feed speed VX is calculated based on the actual rotation speed R of the cutting blade 6 in correspondence with the cutting feed stroke position, and the random access memory (RAM) 203. The previous cutting feed speed VX temporarily stored in is updated. Then, based on the updated cutting feed speed VX, the cutting feed speed corresponding to the cutting feed stroke position at the time of cutting on the next street (cutting line) is further controlled.

[0024]

Since the cutting device according to the present invention is constructed as described above, it has the following effects. That is, the first
According to the invention, when the rotational speed of the cutting blade is reduced by the cutting load immediately after the start of cutting, the cutting feed rate is decreased to maintain the relationship between the rotational speed of the cutting blade and the cutting feed rate in a predetermined relationship. It is possible to prevent the occurrence of pitching. Further, according to the second aspect of the present invention, the cutting feed speed is obtained corresponding to the cutting feed stroke position based on the rotation speed of the cutting blade so that the relationship between the cutting blade rotation speed and the cutting feed speed is a predetermined relationship. This is stored in memory, and the cutting feed means is controlled based on the stored cutting feed speed corresponding to the cutting feed stroke position when cutting the next street. Therefore, feedback control is performed in accordance with the closest data. Than the time delay.

[Brief description of drawings]

FIG. 1 is a perspective view of a cutting device configured according to the present invention.

FIG. 2 is a perspective view of a main part of the cutting device shown in FIG.

FIG. 3 is a block diagram showing the configuration of control means provided in the cutting device shown in FIG.

FIG. 4 is a flowchart showing an operation procedure of the control means shown in FIG.

FIG. 5 is a diagram showing changes in the rotation speed of the cutting blade during cutting.

[Explanation of symbols]

2: Stationary base 3: Chuck tail mechanism 31, 32: Guide rails for chuck table mechanism 33: Chuck table of chuck table mechanism 34: Driving means for chuck table mechanism 342: Servo motor (M1) 4: Spindle support mechanism 41, 42: Guide rail of chuck table mechanism 43: Movable support base of chuck table mechanism 44: Driving means for chuck table mechanism 442: Pulse motor (M2) 5: Spindle unit 52: Spindle housing of spindle unit 53: rotating spindle 54: Servo motor (M4) 55: Rotary encoder (RE) 56: Driving means 562: Pulse motor (M3) 6: Cutting blade 10: Device housing 11: Semiconductor wafer 12: cassette 13: Workpiece loading / unloading mechanism 14: Workpiece transfer mechanism 15: Cleaning means 16: Cleaning and transporting mechanism 17: Imaging means (AM) 18: Display means (DP) 200: control means

Claims (4)

[Claims] 1. A chuck table that holds a workpiece, a cutting mechanism that includes a cutting blade that cuts the workpiece held by the chuck table, and a chuck table and the cutting blade in a cutting feed direction. A cutting device for cutting a workpiece by relatively moving the cutting blade while relatively moving the cutting blade in the cutting feed direction at a predetermined cutting feed speed while rotating the cutting blade. A control means for controlling the cutting feed means on the basis of the rotation speed of the cutting blade detected by the rotation speed detection means; Is the relationship between the cutting blade rotation speed and the cutting feed speed based on the cutting blade rotation speed detected by the rotation speed detection means. Cutting device for controlling the said cutting feed means so as to maintain a relationship, it is characterized. 2. The cutting device according to claim 1, wherein the control means obtains the cutting feed speed by multiplying the set feed speed by a value obtained by dividing the rotation speed of the cutting blade by the target rotation speed. 3. A chuck table for holding a workpiece having a plurality of streets, a cutting mechanism having a cutting blade for cutting the workpiece held by the chuck table along the streets, and the chuck table. And a cutting feed means for relatively moving the cutting blade in the cutting feed direction, and relatively moving the chuck table in the cutting feed direction at a predetermined cutting feed speed while rotating the cutting blade. In a cutting device for cutting a workpiece by means of: a rotation speed detecting means for detecting the rotation speed of the cutting blade, and the cutting feeding means is controlled based on the rotation speed of the cutting blade detected by the rotation speed detecting means. And a cutting means detected by the rotation speed detecting means in correspondence with the cutting feed stroke position. Based on the rotation speed of the blade, the cutting feed speed, which is the predetermined relationship between the cutting blade rotation speed and the cutting feed speed, is calculated and stored, and corresponds to the cutting feed stroke position when cutting the next street. Then, the cutting feed means is controlled based on the stored cutting feed speed. 4. The cutting device according to claim 3, wherein the control means obtains the cutting feed speed by multiplying the set feed speed by a value obtained by dividing the rotation speed of the cutting blade by the target rotation speed.