JP2003183598A - Adhesion method of wood - Google Patents

Adhesion method of wood

Info

Publication number
JP2003183598A
JP2003183598A JP2002333335A JP2002333335A JP2003183598A JP 2003183598 A JP2003183598 A JP 2003183598A JP 2002333335 A JP2002333335 A JP 2002333335A JP 2002333335 A JP2002333335 A JP 2002333335A JP 2003183598 A JP2003183598 A JP 2003183598A
Authority
JP
Japan
Prior art keywords
vinyl acetate
emulsion
weight
eva
polymerization
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002333335A
Other languages
Japanese (ja)
Other versions
JP3681122B2 (en
Inventor
Hiroaki Yoshikawa
洋明 吉川
Kazuaki Yamazaki
一昭 山崎
Shigeru Nagasawa
滋 永沢
Hiroko Takeshita
裕子 竹下
Hiroki Yamamoto
広記 山本
Kazuhiro Kote
和洋 小手
Masami Higure
正美 日暮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Konishi Co Ltd
Denka Co Ltd
Original Assignee
Konishi Co Ltd
Denki Kagaku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konishi Co Ltd, Denki Kagaku Kogyo KK filed Critical Konishi Co Ltd
Priority to JP2002333335A priority Critical patent/JP3681122B2/en
Publication of JP2003183598A publication Critical patent/JP2003183598A/en
Application granted granted Critical
Publication of JP3681122B2 publication Critical patent/JP3681122B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Adhesives Or Adhesive Processes (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide an adhesion method of wood to wood, using an adhesive that excels in film formability, workability and adhesion strength without addition of a plasticizer. <P>SOLUTION: This adhesion method using the adhesive which contains a vinyl acetate resin emulsion not containing the plasticizer. The emulsion is obtained by polymerization of vinyl acetate in the presence of a poly(vinyl alcohol) in an ethylene-vinyl acetate copolymer emulsion having an ethylene content of 15-35 wt.%, where the content of the ethylene-vinyl acetate copolymer resin makes 15-40 wt.% in the whole resin. <P>COPYRIGHT: (C)2003,JPO

Description

【発明の詳細な説明】 【0001】 【発明の属する技術分野】本発明は、作業性、耐熱性、
耐水性、貯蔵安定性、接着性などの特性においてすぐ
れ、かつまた従来必要とされていた可塑剤をその成分と
して本質的に含まない酢酸ビニル樹脂系エマルジョンを
含む木工用接着剤を用いて、木と木を接着する木工接着
方法に関する。 【0002】 【従来の技術】ポリビニルアルコールを保護コロイドと
して用いて、酢酸ビニルモノマーを乳化重合して得られ
る酢酸ビニル樹脂エマルジョンは、従来、接着剤、塗
料、紙加工、繊維加工などに広く使用されている。特に
木工用接着剤として広く使用されている。 【0003】 【発明が解決しようとする課題】このように接着剤、塗
料等に広く用いられている酢酸ビニル樹脂エマルジョン
も種々の欠点を有している。すなわち、粘度の温度依存
性が大きく、冬期などの低温時に粘度が著しく上昇して
作業性が悪くなる。特に、低温における造膜性が悪く、
フタル酸ジブチル(DBP)などの可塑剤の添加が必要
である。従って得られた皮膜は可塑剤の添加により可と
う性になるが、強度が弱くなり、耐熱性が低下する。特
に冬期用として使用する場合にはDBPの添加量が多く
なり、この傾向が顕著になる。また、高濃度にすると粘
度上昇が著しく、作業性が悪く取り扱いが不便である。
逆に、低粘度にすると分離沈降し、貯蔵安定性が悪くな
る。また、保護コロイドにポリビニルアルコール(PV
A)を用いるので、得られた皮膜は耐水性が悪いことな
どがあげられる。 【0004】本発明は前記の酢酸ビニル樹脂エマルジョ
ンが有する欠点を除去し、作業性、耐熱性、耐水性、貯
蔵安定性、接着性などの特性において優れた酢酸ビニル
樹脂系エマルジョンを含む木工用接着剤を用いて、木と
木を接着する木工接着方法を提供することを目的とする
ものである。 【0005】 【課題を解決するための手段】即ち、本発明は、エチレ
ン含有量が15〜35重量%であるエチレン酢酸ビニル
共重合体系樹脂エマルジョンに酢酸ビニルをポリビニル
アルコールの存在下で、エチレン酢酸ビニル共重合体系
樹脂の含有量が全樹脂中で15〜40重量%となる割合
でシード重合して得られる、可塑剤を含まない酢酸ビニ
ル樹脂系エマルジョンを含有する木工用接着剤を用い
て、木と木を接着することを特徴とする木工接着方法で
ある。 【0006】本発明においては、エチレン酢酸ビニル共
重合体系樹脂の含有量が全樹脂中で15〜40重量%で
あることを特徴とする。また、本発明の木工用接着剤
は、可塑剤を含まないことを特徴とする。 【0007】 【発明の実施の形態】以下、本発明を詳細に説明する。
本発明で使用する木工用接着剤は、エチレン酢酸ビニル
共重合体系樹脂(以下、EVAと記す)エマルジョンに
酢酸ビニルをシード重合してなる酢酸ビニル樹脂系エマ
ルジョンを含む樹脂組成物からなることを特徴とする。 【0008】このような酢酸ビニル樹脂系エマルジョン
を得るには、EVAエマルジョンをシード(種)とし、
酢酸ビニルモノマーをシード重合するとよい。具体的に
はEVAエマルジョンに酢酸ビニルモノマーを添加し重
合するとよい。 【0009】使用する一方の成分のEVAエマルジョン
については特に限定されないが、10重量%以下の低い
固形分では工業的に不利となる。EVA中のエチレン含
有量は15〜35重量%のものが好ましく、特に23〜
29重量%のものが好ましい。また、エチレン含有量が
その範囲にあれば市販のEVAを使用することができ
る。エチレン含有量が15重量%未満では酢酸ビニルモ
ノマーをシード重合して生成した酢酸ビニル樹脂系エマ
ルジョンの成膜温度が0℃を越えて高くなり好ましくな
い。また、エチレン含有量が35重量%を越えると木工
用接着剤とし接着強度が低下しやはり好ましくない。 【0010】シード重合をする際に生成するエマルジョ
ンの安定性を保つために、乳化剤、界面活性剤、あるい
はPVAを添加することが好ましい。なかでもとくにP
VAが好適に使用される。 【0011】添加されるPVAの量は、生成する酢酸ビ
ニル樹脂系エマルジョンの固形分中にPVAが2〜20
重量%となる程度が好ましい。この場合EVAエマルジ
ョンに既にPVAが含まれている場合はそれと合計した
量となる。PVAの添加量が2重量%より少ないとシー
ド重合の際の重合安定性が低下し、また20重量%より
多くしても重合安定性はそれ以上向上しない。 【0012】使用されるPVAは特に限定されず、一般
に酢酸ビニルエマルジョン、或いはEVAエマルジョン
を重合する際に用られているPVAを使用することがで
きる。部分鹸化品、完全鹸化品を単独であるいは併用し
て用いることができる。また、分子量の異なるPVAを
併用することもできる。 【0013】シード重合に使用する他方の成分には、酢
酸ビニルモノマーを用いるが、該酢酸ビニル以外にプロ
ピオン酸ビニル、バーサチック酸ビニル、アクリル酸エ
ステル等の酢酸ビニルと共重合することが可能な公知の
モノマーを少量酢酸ビニルに併用して重合することも木
工用接着剤としての物性を損なわない範囲で行うことが
できる。 【0014】また、EVA樹脂の含有量は、シード重合
される酢酸ビニル樹脂、EVA樹脂及びPVAの合計
(全樹脂)に対して、15〜40重量%となることが好
ましい。EVA樹脂が15重量%より少ないと、生成す
る酢酸ビニル樹脂系エマルジョンの成膜温度が0℃以上
となるばかりでなく、粘度が高くなりすぎる。EVA樹
脂の割合が40重量%を越えると木工用接着剤としての
接着強度が低下して好ましくない。 【0015】シード重合して生成する酢酸ビニル樹脂系
エマルジョン中に含まれる樹脂の含有量は、固形分とし
て25〜65重量%、好ましくは40〜60重量%であ
ることが望ましい。25重量%未満では粘度が低すぎ、
逆に65重量%を越えると粘度が高くなりすぎたり、あ
るいは重合が円滑に進まなくなる。そのような割合にな
るようEVAエマルジョン、重合する酢酸ビニルモノマ
ー、および水の量を調整するとよい。 【0016】シード重合を行うには、重合容器に水およ
びEVAエルジョンを入れ、通常のラジカル重合に使用
される重合開始剤を用いて、酢酸ビニルモノマーを添加
しながら重合するとよい。この場合、酢酸ビニルモノマ
ーの一部或いは全部を重合開始前に水およびEVAエル
ジョンと一緒に重合容器に添加してもよいし、またはそ
の一部或いは全量を重合中、連続的に或いは断続的に添
加してもよい。 【0017】重合温度は使用する反応開始剤の種類によ
り異なる。例えば過硫酸アンモニウム、過硫酸カリウム
などを用い、反応開始剤が熱分解することにより重合を
進めるような場合は60℃以上が適当である。或いは過
酸化物と還元剤の組み合わせにより重合を進める場合は
60℃より低い温度が適当である。 【0018】このようにしてEVAエマルジョンに酢酸
ビニルをシード重合して得られる酢酸ビニル樹脂系エマ
ルジョンは木工用接着剤として使用することができる。
この酢酸ビニル樹脂系エマルジョンは0℃においても可
塑剤なしで成膜し、低温における粘度上昇が小さく、ま
た木工用接着剤として優れた常態接着性、耐熱接着性、
及び耐水接着性を示す。 【0019】本発明の酢酸ビニル樹脂系エマルジョン
は、作業環境や被接着材の木工材料に悪影響を及ぼす可
塑剤を添加せずそのままでも木工用接着剤として使用す
ることができるが、必要に応じて、充填材、溶剤、顔
料、染料、防腐剤、消泡剤、水溶性ポリマー等を添加し
て使用することもできる。 【0020】本発明の酢酸ビニル樹脂系エマルジョンを
含む木工用接着剤は、0℃において成膜する。この様に
本発明のエチレン含有量が15〜35重量%であるEV
Aエマルジョンに酢酸ビニルをシード重合して得られた
酢酸ビニル樹脂系エマルジョンは、木工用接着剤として
可塑剤なしで優れた成膜性、接着性を示すと共に、低温
での粘度上昇が少なく、冬期においても作業性において
優れている。 【0021】 【実施例】以下、実施例をもって本発明を更に具体的に
説明する。EVAエマルジョンは市販のものを使用する
ことができるが、以下の製造例に示す様に製造すること
もできる。 【0022】製造例1 撹拌器つきの高圧反応缶にPVA(電気化学工業社製、
商品名B−05およびB−17を併用、重量比:B−0
5/B−17=1/1)2061gとロンガリット22
9gを溶解した純水45.8kgと酢酸ビニル30.1
8kgを仕込んだ。系内の温度を55℃としエチレンを
11.45kg導入して加圧した。系内の圧力は53k
gG/cm2 となった。5%の過硫酸アンモニウムおよ
び酢酸ビニル15.6kgを連続的に添加し重合を行っ
た。圧力は重合2時間目に60kgG/cm2 まで上昇
した後、減少していった。約8時間の後、重合は終了
し、EVAエマルジョンを得た。 【0023】エマルジョンの固形分は55.8%、粘度
は4400mPa・sであった。樹脂中のエチレン含有
量は20%であった。物性を表1に示す。 【0024】製造例2 重合開始後断続的にエチレンを5.73kg追加した以
外は製造例1と同様に重合しEVAエマルジョンを得
た。樹脂中のエチレン含量は26%であった。物性を表
1に示す。 【0025】製造例3 最初に添加したエチレンの量を14.6kgとし、重合
開始後断続的に添加したエチレンの量を7.95kgと
した以外は製造例1と同様に重合しEVAエマルジョン
を得た。樹脂中のエチレン含量は31%であった。物性
を表1に示す。 【0026】本発明において、使用するEVAエマルジ
ョンのエチレン含量は15〜35重量%が好ましいが、
エチレン含量がここからはずれた場合の比較のため、次
にエチレン含量の少ないEVAエマルジョンの製造例を
示す。 【0027】製造例4 最初に添加したエチレンの量を6.25kgとした以外
は製造例1と同様に重合しEVAエマルジョンを得た。
樹脂中のエチレン含量は12%であった。物性を表1に
示す。 【0028】 【表1】【0029】(注) 1)粘度は、BM型粘度計を用いて、30℃で30回転
で測定した値を示す。 2)平均粒子径は、レーザー法により測定した値を示
す。 3)最低造膜温度は、JIS K 6804 7.6
最低造膜温度により測定した値を示す。 4)ガラス転移温度は、DSCにより測定した値を示
す。 5)市販品Aは、電気化学工業社製、商品名デンカEV
Aテックス#55のEVAエマルジョンを示す。 6)市販品Bは、電気化学工業社製、商品名デンカEV
Aテックス#56のEVAエマルジョンを示す。 【0030】次に製造例1〜3、製造例4で得られたE
VAエマルジョン、及び市販品A,BのEVAエマルジ
ョンをシード(種)エマルジョンとし酢酸ビニルをシェ
ルとするために行うシード重合の実施例を示す。 【0031】実施例1 撹拌器付きの反応容器に水344重量部をとり、PVA
(電気化学工業社製、商品名B−17)50重量部を加
え、80℃迄加熱した。PVAが完全に溶解した後、製
造例1のEVAエマルジョン200重量部を添加した。
系内の温度が80℃迄上がったところで触媒(過硫酸ア
ンモニウムと炭酸水素ナトリウムそれぞれ1重量部を水
20重量部に溶解させた溶液)と、酢酸ビニルを滴下し
重合を行った。酢酸ビニルの添加量は384重量部であ
った。 【0032】生成したエマルジョンの成膜温度を、測定
したところ0℃であった。BM型粘度計を用いて5℃の
粘度を測定したところ110Pa・sであった。また、
23℃の粘度は52Pa・sであった。23℃の粘度に
対する5℃の粘度の割合は2.1倍であり、低温におけ
る粘度の上昇は小さかった。 【0033】次に実施例1で製造した酢酸ビニル樹脂系
エマルジョンを木工用接着剤として用いた場合の接着強
度を測定した。試験は、JIS K 6852に基づ
き、圧縮せん断接着強度を測定した。使用試験片は、カ
バ材・カバ材の組み合わせを用いた。常態試験、耐熱試
験(60℃、1時間)、耐水試験(30℃、3時間)を
行った。 【0034】試験結果を表2に示すが、市販の可塑剤を
含む酢ビエマルジョン系(参考例1,2)と比較して遜
色のない接着性を示した。 【0035】比較例1 製造例4で製造したEVAエマルジョンを使用した以外
は実施例1と同様にしてシード重合を行った。生成した
エマルジョンの23℃の粘度に対する5℃の粘度の割合
は2.6倍と良好であり、接着試験結果も市販品と遜色
なかったが、成膜温度が5℃と高かった。 【0036】実施例2〜5 実施例2では市販品AのEVAエマルジョン(電気化学
工業社製、商品名デンカEVAテックス#55)を用
い、実施例1と同様にシード重合を行った。 【0037】実施例3では製造例2で製造したEVAエ
マルジョンを、実施例4では市販品BのEVAエマルジ
ョン(電気化学工業社製、商品名デンカEVAテックス
#56)を、実施例5では製造例3で製造したEVAエ
マルジョンをそれぞれ用いて、実施例1と同様にシード
重合を行った。 【0038】生成したエマルジョンについて造膜温度、
粘度、接着強度を実施例1と同様に測定した、測定結果
を表2に示すが、いずれも良好な結果であった。 【0039】比較例2 添加する水の量を386重量部、使用するEVAエマル
ジョンを市販品BのEVAエマルジョン(電気化学工業
社製、商品名デンカEVAテックス#56)としその添
加量を100重量部、及び酢酸ビニルの量を442重量
部とした以外は実施例1と同様にシード重合し、生成し
たエマルジョンについて成膜温度、粘度および接着強度
を実施例1と同様に測定した。測定結果を表2に示す。 【0040】このエマルジョンはEVAエマルジョンの
量を少なくしたものであるが接着性は良好であった。し
かし、0℃では成膜せず、また、5℃の粘度が520P
a・sと高く作業性に問題があった。 【0041】比較例3 添加する水の量を218重量部、使用するEVAエマル
ジョンを市販品BのEVAエマルジョン(電気化学工業
社製、商品名デンカEVAテックス#56)としその添
加量を500重量部、及び酢酸ビニルの量を210重量
部とした以外は実施例1と同様にシード重合し、生成し
たエマルジョンについて成膜温度、粘度および接着強度
を実施例1と同様に測定した。測定結果を表2に示す。 【0042】このエマルジョンはEVAを多くしたもの
であり、0℃で成膜した。しかし、5℃の粘度が15P
a・sと若干高かった。また、接着性が低下し、常態接
着強度、耐熱および耐水接着強度ともに大幅に低下し、
市販品(参考例1,2)に比較しても低い数値となっ
た。 【0043】比較例4 EVAエマルジョンを使用しないで、水の量を498重
量部、PVAを100重量部、及び酢酸ビニルの量を3
80重量部として重合を行い、生成したエマルジョンに
ついて成膜温度および粘度を実施例1と同様に測定し
た。測定結果を表2に示す。 【0044】このエマルジョンはEVAエマルジョンを
使用しないものであり、0℃で成膜した。しかし、5℃
の粘度が2000Pa・sと、23℃の粘度100Pa
・sと比較し粘度上昇が激しく、また低温における作業
性も悪かった。 【0045】 【表2】 【0046】(注) 1)EVA含有量は、{EVA/(EVA+VA+PV
A)}×100(固形分)を示す。 2)参考例1は、コニシ社製、商品名ボンドCH150
0のホモ酢酸ビニル樹脂系エマルジョンを示す。 3)参考例2は、コニシ社製、商品名ボンドCH18の
ホモ酢酸ビニル樹脂系エマルジョンを示す。 【0047】 【発明の効果】以上説明した様に、本発明におけるエチ
レン含有量が15〜35重量%であるエチレン酢酸ビニ
ル共重合体系樹脂エマルジョンに酢酸ビニルをシード重
合してなる酢酸ビニル樹脂系エマルジョンを含む接着剤
は、可塑剤を添加しなくとも、成膜性、作業性、接着強
度に優れた木工用接着剤であり、本発明は該木工用接着
剤を用いて、木と木を接着する木工接着方法を提供する
ことができる。
Description: BACKGROUND OF THE INVENTION [0001] The present invention relates to workability, heat resistance,
Using a woodworking adhesive containing a vinyl acetate resin-based emulsion that is excellent in properties such as water resistance, storage stability, and adhesiveness, and that does not essentially contain a plasticizer that has been conventionally required, Wood bonding method for bonding wood to wood. [0002] Vinyl acetate resin emulsions obtained by emulsion polymerization of vinyl acetate monomers using polyvinyl alcohol as a protective colloid have been widely used for adhesives, paints, paper processing, textile processing and the like. ing. In particular, it is widely used as an adhesive for woodworking. [0003] As described above, vinyl acetate resin emulsions widely used for adhesives, paints and the like also have various disadvantages. In other words, the viscosity has a large temperature dependency, and the viscosity is significantly increased at a low temperature such as in winter, so that the workability is deteriorated. In particular, poor film formation at low temperatures,
It is necessary to add a plasticizer such as dibutyl phthalate (DBP). Therefore, the obtained film becomes flexible by the addition of a plasticizer, but the strength is weakened and the heat resistance is reduced. In particular, when used for winter, the amount of DBP added becomes large, and this tendency becomes remarkable. Further, when the concentration is high, the viscosity rises remarkably, the workability is poor, and the handling is inconvenient.
On the other hand, if the viscosity is reduced, sedimentation and sedimentation occur, and storage stability deteriorates. In addition, polyvinyl alcohol (PV)
Since A) is used, the resulting film has poor water resistance. [0004] The present invention eliminates the disadvantages of the above-mentioned vinyl acetate resin emulsion and provides an adhesive for woodwork containing a vinyl acetate resin emulsion excellent in workability, heat resistance, water resistance, storage stability and adhesiveness. It is an object of the present invention to provide a woodworking bonding method for bonding wood to wood using an agent. [0005] That is, the present invention provides an ethylene-vinyl acetate copolymer resin emulsion having an ethylene content of 15 to 35% by weight by adding vinyl acetate to ethylene acetate in the presence of polyvinyl alcohol. Using a woodworking adhesive containing a plasticizer-free vinyl acetate resin-based emulsion obtained by seed polymerization at a ratio of 15 to 40% by weight of the total resin in the total resin, This is a woodworking bonding method characterized by bonding wood to wood. [0006] The present invention is characterized in that the content of the ethylene-vinyl acetate copolymer resin is 15 to 40% by weight in the whole resin. Further, the woodworking adhesive of the present invention is characterized by not containing a plasticizer. Hereinafter, the present invention will be described in detail.
The woodworking adhesive used in the present invention comprises a resin composition containing a vinyl acetate resin-based emulsion obtained by seed-polymerizing an ethylene-vinyl acetate copolymer-based resin (hereinafter referred to as EVA) emulsion with vinyl acetate. And In order to obtain such a vinyl acetate resin emulsion, an EVA emulsion is used as a seed.
The vinyl acetate monomer may be seed polymerized. Specifically, it is preferable to add a vinyl acetate monomer to the EVA emulsion and polymerize it. The EVA emulsion of one component used is not particularly limited, but a low solid content of 10% by weight or less is industrially disadvantageous. The ethylene content in EVA is preferably from 15 to 35% by weight, particularly from 23 to 35% by weight.
Preferably it is 29% by weight. If the ethylene content is within the range, commercially available EVA can be used. If the ethylene content is less than 15% by weight, the film-forming temperature of a vinyl acetate resin-based emulsion produced by seed polymerization of a vinyl acetate monomer is higher than 0 ° C., which is not preferable. On the other hand, when the ethylene content exceeds 35% by weight, the adhesive becomes a woodworking adhesive, and the adhesive strength is undesirably lowered. [0010] In order to maintain the stability of the emulsion formed during the seed polymerization, it is preferable to add an emulsifier, a surfactant or PVA. Especially P
VA is preferably used. [0011] The amount of PVA to be added is such that PVA is 2 to 20 in the solid content of the vinyl acetate resin emulsion to be formed.
% Is preferred. In this case, when PVA is already contained in the EVA emulsion, the total amount is added. If the amount of PVA is less than 2% by weight, the polymerization stability during seed polymerization is reduced, and if it is more than 20% by weight, the polymerization stability is not further improved. The PVA used is not particularly limited, and PVA generally used when polymerizing a vinyl acetate emulsion or an EVA emulsion can be used. A partially saponified product or a completely saponified product can be used alone or in combination. Further, PVAs having different molecular weights can be used in combination. As the other component used for the seed polymerization, a vinyl acetate monomer is used. In addition to the vinyl acetate, a known component capable of copolymerizing with vinyl acetate such as vinyl propionate, vinyl versatate and acrylic acid ester is used. Polymerization using a small amount of the monomer in combination with vinyl acetate can also be carried out within a range that does not impair the physical properties of the adhesive for woodworking. The content of the EVA resin is preferably 15 to 40% by weight based on the total (all resins) of the vinyl acetate resin, the EVA resin and the PVA to be subjected to seed polymerization. If the amount of the EVA resin is less than 15% by weight, not only the film forming temperature of the resulting vinyl acetate resin-based emulsion becomes 0 ° C. or higher, but also the viscosity becomes too high. If the proportion of the EVA resin exceeds 40% by weight, the adhesive strength as a woodworking adhesive is undesirably reduced. The content of the resin contained in the vinyl acetate resin-based emulsion formed by the seed polymerization is desirably 25 to 65% by weight, preferably 40 to 60% by weight as a solid content. If it is less than 25% by weight, the viscosity is too low,
Conversely, if it exceeds 65% by weight, the viscosity becomes too high or the polymerization does not proceed smoothly. It is preferable to adjust the amounts of the EVA emulsion, the vinyl acetate monomer to be polymerized, and the water so as to have such a ratio. In order to perform seed polymerization, water and EVA elusion are charged into a polymerization vessel, and polymerization is preferably carried out using a polymerization initiator used for ordinary radical polymerization while adding a vinyl acetate monomer. In this case, part or all of the vinyl acetate monomer may be added to the polymerization vessel together with water and EVA elution before the start of the polymerization, or part or all of the vinyl acetate monomer may be continuously or intermittently added during the polymerization. It may be added. The polymerization temperature depends on the type of the initiator used. For example, when using ammonium persulfate, potassium persulfate, or the like, and the polymerization is promoted by thermal decomposition of the reaction initiator, a temperature of 60 ° C. or more is appropriate. Alternatively, when the polymerization is promoted by a combination of a peroxide and a reducing agent, a temperature lower than 60 ° C. is appropriate. The vinyl acetate resin emulsion obtained by subjecting vinyl acetate to the EVA emulsion in this manner can be used as an adhesive for woodworking.
This vinyl acetate resin-based emulsion forms a film without a plasticizer even at 0 ° C., has a small increase in viscosity at low temperatures, and has excellent normal-state adhesiveness, heat-resistant adhesiveness as an adhesive for woodworking,
And water-resistant adhesion. The vinyl acetate resin emulsion of the present invention can be used as a woodworking adhesive as it is without adding a plasticizer which adversely affects the working environment and the woodworking material to be bonded. , A filler, a solvent, a pigment, a dye, a preservative, an antifoaming agent, a water-soluble polymer and the like can be used. The woodworking adhesive containing the vinyl acetate resin emulsion of the present invention is formed at 0 ° C. Thus, the EV of the present invention having an ethylene content of 15 to 35% by weight.
A vinyl acetate resin emulsion obtained by seed polymerization of vinyl acetate to emulsion A exhibits excellent film-forming properties and adhesiveness without a plasticizer as a woodworking adhesive, and has a small increase in viscosity at low temperatures. Is also excellent in workability. The present invention will be described below more specifically with reference to examples. A commercially available EVA emulsion can be used, but it can also be produced as shown in the following production examples. Production Example 1 PVA (manufactured by Denki Kagaku Kogyo Co., Ltd.) was placed in a high-pressure reactor with a stirrer.
Combined use of trade names B-05 and B-17, weight ratio: B-0
5 / B-17 = 1/1) 2061 g and Rongalit 22
45.8 kg of pure water in which 9 g was dissolved and 30.1 vinyl acetate
8 kg was charged. The temperature in the system was 55 ° C., and 11.45 kg of ethylene was introduced and pressurized. The pressure in the system is 53k
gG / cm 2 . Polymerization was carried out by continuously adding 5% ammonium persulfate and 15.6 kg of vinyl acetate. The pressure increased to 60 kgG / cm 2 in the second hour of polymerization and then decreased. After about 8 hours, the polymerization was completed, and an EVA emulsion was obtained. The solid content of the emulsion was 55.8%, and the viscosity was 4,400 mPa · s. The ethylene content in the resin was 20%. Table 1 shows the physical properties. Production Example 2 An EVA emulsion was obtained by polymerization in the same manner as in Production Example 1 except that 5.73 kg of ethylene was added intermittently after the start of polymerization. The ethylene content in the resin was 26%. Table 1 shows the physical properties. Production Example 3 EVA emulsion was obtained by polymerization in the same manner as in Production Example 1 except that the amount of ethylene initially added was 14.6 kg and the amount of ethylene intermittently added after the start of polymerization was 7.95 kg. Was. The ethylene content in the resin was 31%. Table 1 shows the physical properties. In the present invention, the ethylene content of the EVA emulsion used is preferably from 15 to 35% by weight.
For comparison in the case where the ethylene content deviates from this, an example of the production of an EVA emulsion having a low ethylene content is shown below. Production Example 4 Polymerization was carried out in the same manner as in Production Example 1 except that the amount of ethylene initially added was changed to 6.25 kg to obtain an EVA emulsion.
The ethylene content in the resin was 12%. Table 1 shows the physical properties. [Table 1] (Note) 1) The viscosity is a value measured at 30 ° C. and 30 rotations using a BM type viscometer. 2) The average particle diameter indicates a value measured by a laser method. 3) The minimum film formation temperature is JIS K 6804 7.6.
The value measured by the minimum film formation temperature is shown. 4) The glass transition temperature indicates a value measured by DSC. 5) Commercial product A is manufactured by Denki Kagaku Kogyo Co., Ltd., trade name: Denka EV
3 shows an EVA emulsion of Atex # 55. 6) Commercial product B is manufactured by Denki Kagaku Kogyo Co., Ltd., trade name Denka EV
3 shows an EVA emulsion of Atex # 56. Next, E obtained in Production Examples 1 to 3 and Production Example 4 was obtained.
An example of seed polymerization in which a VA emulsion and an EVA emulsion of commercially available products A and B are used as a seed (seed) emulsion and vinyl acetate is used as a shell will be described. Example 1 344 parts by weight of water was placed in a reaction vessel equipped with a stirrer, and PVA was added.
50 parts by weight (trade name: B-17, manufactured by Denki Kagaku Kogyo Co., Ltd.) were added, and the mixture was heated to 80 ° C. After the PVA was completely dissolved, 200 parts by weight of the EVA emulsion of Production Example 1 was added.
When the temperature in the system was raised to 80 ° C., a catalyst (a solution in which 1 part by weight of ammonium persulfate and 20 parts by weight of sodium hydrogen carbonate were dissolved in 20 parts by weight of water) and vinyl acetate were added dropwise to carry out polymerization. The amount of vinyl acetate added was 384 parts by weight. When the film formation temperature of the produced emulsion was measured, it was 0 ° C. When the viscosity at 5 ° C. was measured using a BM viscometer, it was 110 Pa · s. Also,
The viscosity at 23 ° C. was 52 Pa · s. The ratio of the viscosity at 5 ° C. to the viscosity at 23 ° C. was 2.1 times, and the rise in viscosity at low temperatures was small. Next, the adhesive strength when the vinyl acetate resin emulsion produced in Example 1 was used as an adhesive for woodworking was measured. In the test, the compressive shear adhesive strength was measured based on JIS K 6852. The test piece used was a combination of birch wood and birch wood. A normal test, a heat resistance test (60 ° C., 1 hour) and a water resistance test (30 ° C., 3 hours) were performed. The test results are shown in Table 2. The results showed that the adhesiveness was comparable to that of a commercially available vinyl acetate emulsion containing a plasticizer (Reference Examples 1 and 2). Comparative Example 1 Seed polymerization was carried out in the same manner as in Example 1 except that the EVA emulsion produced in Production Example 4 was used. The ratio of the viscosity at 5 ° C. to the viscosity at 23 ° C. of the produced emulsion was as good as 2.6 times, and the results of the adhesion test were not inferior to those of commercial products, but the film formation temperature was as high as 5 ° C. Examples 2 to 5 In Example 2, seed polymerization was carried out in the same manner as in Example 1 using an EVA emulsion of a commercially available product A (trade name: Denka EVA Tex # 55, manufactured by Denki Kagaku Kogyo KK). In Example 3, the EVA emulsion produced in Production Example 2 was used. In Example 4, an EVA emulsion of a commercial product B (manufactured by Denki Kagaku Kogyo Co., Ltd., trade name: Denka EVA Tex # 56) was used. Seed polymerization was carried out in the same manner as in Example 1 by using each of the EVA emulsions produced in Example 3. The film forming temperature of the produced emulsion,
The viscosity and adhesive strength were measured in the same manner as in Example 1. The measurement results are shown in Table 2, and all were good results. Comparative Example 2 The amount of water to be added was 386 parts by weight, and the EVA emulsion to be used was EVA emulsion of a commercial product B (manufactured by Denki Kagaku Kogyo Co., Ltd., trade name: Denka EVA Tex # 56), and the added amount was 100 parts by weight. Seed polymerization was carried out in the same manner as in Example 1 except that the amount of vinyl acetate was changed to 442 parts by weight, and the film formation temperature, viscosity and adhesive strength of the resulting emulsion were measured in the same manner as in Example 1. Table 2 shows the measurement results. This emulsion was obtained by reducing the amount of the EVA emulsion, but had good adhesion. However, no film was formed at 0 ° C, and the viscosity at 5 ° C was 520P.
a · s, which was problematic in workability. Comparative Example 3 The amount of water to be added was 218 parts by weight, and the EVA emulsion to be used was EVA emulsion of commercial product B (Denka EVA Tex # 56, manufactured by Denki Kagaku Kogyo Co., Ltd.), and the added amount was 500 parts by weight. Seed polymerization was carried out in the same manner as in Example 1 except that the amounts of vinyl acetate and vinyl acetate were changed to 210 parts by weight, and the film formation temperature, viscosity and adhesive strength of the resulting emulsion were measured in the same manner as in Example 1. Table 2 shows the measurement results. This emulsion had a high EVA content and was formed at 0 ° C. However, the viscosity at 5 ℃ is 15P
a · s was slightly higher. In addition, the adhesiveness is reduced, the normal adhesive strength, heat and water resistant adhesive strength are significantly reduced,
The value was lower than that of the commercially available products (Reference Examples 1 and 2). Comparative Example 4 Without using the EVA emulsion, the amount of water was 498 parts by weight, the amount of PVA was 100 parts by weight, and the amount of vinyl acetate was 3 parts.
Polymerization was carried out at 80 parts by weight, and the film formation temperature and viscosity of the resulting emulsion were measured in the same manner as in Example 1. Table 2 shows the measurement results. This emulsion did not use an EVA emulsion, and was formed at 0 ° C. However, 5 ° C
Viscosity is 2000 Pa · s and viscosity at 23 ° C is 100 Pa
-Viscosity increased sharply compared to s, and workability at low temperature was poor. [Table 2] (Note) 1) The EVA content is expressed by ΔEVA / (EVA + VA + PV)
A) Indicates Δ × 100 (solid content). 2) Reference Example 1 is manufactured by Konishi Co., Ltd., trade name: Bond CH150.
0 shows a homovinyl acetate resin emulsion. 3) Reference Example 2 shows a homovinyl acetate resin-based emulsion having a trade name of Bond CH18 manufactured by Konishi Corporation. As described above, a vinyl acetate resin emulsion obtained by seed-polymerizing vinyl acetate with an ethylene vinyl acetate copolymer resin emulsion having an ethylene content of 15 to 35% by weight according to the present invention. Is an adhesive for woodworking having excellent film-forming properties, workability and adhesive strength without adding a plasticizer, and the present invention uses the woodworking adhesive to bond wood to wood. Woodworking bonding method can be provided.

───────────────────────────────────────────────────── フロントページの続き (72)発明者 永沢 滋 埼玉県蓮田市椿山4−27−3 (72)発明者 竹下 裕子 千葉県船橋市本中山4−3−3−808 (72)発明者 山本 広記 千葉県市原市五井南海岸6番地 電気化学 工業株式会社千葉工場内 (72)発明者 小手 和洋 千葉県市原市五井南海岸6番地 電気化学 工業株式会社千葉工場内 (72)発明者 日暮 正美 千葉県市原市五井南海岸6番地 電気化学 工業株式会社千葉工場内 Fターム(参考) 4J040 DD022 DL081 JA03 LA05 LA06 LA07 MA08 NA12    ────────────────────────────────────────────────── ─── Continuation of front page    (72) Inventor Shigeru Nagasawa             4-27-3 Tsubakiyama, Hasuda City, Saitama Prefecture (72) Inventor Yuko Takeshita             4-3-3-808 Motonakayama, Funabashi-shi, Chiba (72) Inventor Hiroki Yamamoto             6 Goi south coast, Ichihara city, Chiba prefecture Electrochemistry             Industrial Co., Ltd. Chiba Plant (72) Inventor Kazuhiro Ote             6 Goi south coast, Ichihara city, Chiba prefecture Electrochemistry             Industrial Co., Ltd. Chiba Plant (72) Inventor Masami Higurashi             6 Goi south coast, Ichihara city, Chiba prefecture Electrochemistry             Industrial Co., Ltd. Chiba Plant F term (reference) 4J040 DD022 DL081 JA03 LA05                       LA06 LA07 MA08 NA12

Claims (1)

【特許請求の範囲】 【請求項1】 エチレン含有量が15〜35重量%であ
るエチレン酢酸ビニル共重合体系樹脂エマルジョンに酢
酸ビニルをポリビニルアルコールの存在下で、エチレン
酢酸ビニル共重合体系樹脂の含有量が全樹脂中で15〜
40重量%となる割合でシード重合して得られる、可塑
剤を含まない酢酸ビニル樹脂系エマルジョンを含有する
木工用接着剤を用いて、木と木を接着することを特徴と
する木工接着方法。
Claims: 1. An ethylene-vinyl acetate copolymer resin containing an ethylene-vinyl acetate copolymer in the presence of polyvinyl alcohol in an ethylene-vinyl acetate copolymer resin emulsion having an ethylene content of 15 to 35% by weight. The amount is 15 ~
A woodwork bonding method, comprising bonding wood to wood using a woodworking adhesive containing a vinyl acetate resin-based emulsion containing no plasticizer and obtained by seed polymerization at a ratio of 40% by weight.
JP2002333335A 2002-11-18 2002-11-18 Woodworking bonding method Expired - Fee Related JP3681122B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002333335A JP3681122B2 (en) 2002-11-18 2002-11-18 Woodworking bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002333335A JP3681122B2 (en) 2002-11-18 2002-11-18 Woodworking bonding method

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP27035897A Division JP3420920B2 (en) 1997-09-18 1997-09-18 Woodworking adhesive

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2005013204A Division JP4131868B2 (en) 2005-01-20 2005-01-20 Manufacturing method for woodworking adhesive

Publications (2)

Publication Number Publication Date
JP2003183598A true JP2003183598A (en) 2003-07-03
JP3681122B2 JP3681122B2 (en) 2005-08-10

Family

ID=27606795

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002333335A Expired - Fee Related JP3681122B2 (en) 2002-11-18 2002-11-18 Woodworking bonding method

Country Status (1)

Country Link
JP (1) JP3681122B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010126592A (en) * 2008-11-26 2010-06-10 Mei Clean:Kk Jointing structure in ancient object
CN102994032A (en) * 2012-11-26 2013-03-27 洪仁作 Antiseptic adhesive used for wood
CN112778941A (en) * 2021-01-20 2021-05-11 华威粘结材料(上海)股份有限公司 Long-open-time bi-component plate alignment adhesive composition capable of being placed for long time and preparation method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010126592A (en) * 2008-11-26 2010-06-10 Mei Clean:Kk Jointing structure in ancient object
CN102994032A (en) * 2012-11-26 2013-03-27 洪仁作 Antiseptic adhesive used for wood
CN112778941A (en) * 2021-01-20 2021-05-11 华威粘结材料(上海)股份有限公司 Long-open-time bi-component plate alignment adhesive composition capable of being placed for long time and preparation method thereof

Also Published As

Publication number Publication date
JP3681122B2 (en) 2005-08-10

Similar Documents

Publication Publication Date Title
JP2004285143A5 (en)
JPH0770533A (en) Adhesive for woodworking and preparation thereof
JP4488561B2 (en) Synthetic resin emulsion type adhesive
CA2707131C (en) Cross-linkable vinylester-copolymers and use thereof as low-profile-additives
JP3420920B2 (en) Woodworking adhesive
JP2003183598A (en) Adhesion method of wood
JP3299920B2 (en) Vinyl acetate resin emulsion and adhesive
JP4131868B2 (en) Manufacturing method for woodworking adhesive
JP2001335763A (en) Two-part adhesive composition and adhesion method
JP3874859B2 (en) Fast-curing two-component fractional application type adhesive composition
JP3626579B2 (en) Fast-curing two-component adhesive composition
JP2004300193A (en) Aqueous emulsion
JP4151950B2 (en) Adhesive composition
JP2001107006A (en) Aqueous adhesive
JP2010084106A (en) Acrylic emulsion and method for manufacturing the same
JP2004189891A (en) Method for preparing aqueous emulsion, and adhesive
JP2015034197A (en) Dispersant for emulsion polymerization and vinyl acetate-based resin emulsion using the same, and adhesive agent
JP3877072B2 (en) Paper processed products
JP2002003806A (en) Adhesive
JP3979657B2 (en) Adhesive composition
JP2000160126A (en) Adhesive composition and production thereof
JP3526567B2 (en) Adhesive composition
JP2757113B2 (en) Adhesive for paper tube
JP3065255B2 (en) Adhesive composition and paper tube using the same
US20040082705A1 (en) One-pot water-resistant polyvinyl acetate copolymer aqueous emulsion and it preparation

Legal Events

Date Code Title Description
A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20041112

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A132

Effective date: 20041124

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20050120

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20050318

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20050322

TRDD Decision of grant or rejection written
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20050322

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20050511

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20050513

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090527

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100527

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110527

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130527

Year of fee payment: 8

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140527

Year of fee payment: 9

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees