JP2003168651A - Apparatus and method for feeding liquid source material - Google Patents

Apparatus and method for feeding liquid source material

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Publication number
JP2003168651A
JP2003168651A JP2001368796A JP2001368796A JP2003168651A JP 2003168651 A JP2003168651 A JP 2003168651A JP 2001368796 A JP2001368796 A JP 2001368796A JP 2001368796 A JP2001368796 A JP 2001368796A JP 2003168651 A JP2003168651 A JP 2003168651A
Authority
JP
Japan
Prior art keywords
liquid
raw material
cvd raw
material supply
cvd
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001368796A
Other languages
Japanese (ja)
Inventor
Yukichi Takamatsu
勇吉 高松
Gakuo Yoneyama
岳夫 米山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Pionics Ltd
Original Assignee
Japan Pionics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Pionics Ltd filed Critical Japan Pionics Ltd
Priority to JP2001368796A priority Critical patent/JP2003168651A/en
Publication of JP2003168651A publication Critical patent/JP2003168651A/en
Pending legal-status Critical Current

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Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus and a method for feeding a liquid source material capable of easily feeding a CVD liquid source material to a vaporizing/ feeding apparatus without discontinuing feeding of the vaporized CVD liquid source material to a CVD apparatus in feeding the vaporized CVD liquid source material. <P>SOLUTION: This apparatus for feeding a liquid source material is a portable liquid-source-material feeding apparatus, which comprises a CVD liquid-source- material container and a cleaning-liquid container. The CVD liquid-source- material container is provided with a heating means, a CVD liquid-source- material feeding tube for feeding the CVD liquid source material to the outside, and an inlet tube for compressed gas for transportation. The cleaning-liquid container is provided with a cleaning-liquid feeding tube for feeding the cleaning liquid to the CVD liquid-source-material feeding tube and an inlet tube for compressed gas for transportation. Besides, to the CVD liquid-source-material feeding tube, a discharge tube for discharging residual cleaning liquid to the outside is connected. The CVD liquid source material is fed to the vaporizing/ feeding apparatus by using the portable liquid-source-material feeding apparatus. <P>COPYRIGHT: (C)2003,JPO

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、液体CVD原料
を、気化供給装置の液体CVD原料容器に供給するため
の装置及び方法に関する。さらに詳細には、液体CVD
原料を大気に接触させることなく、容易に気化供給装置
の液体CVD原料容器に供給するための装置及び方法に
関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus and a method for supplying a liquid CVD raw material to a liquid CVD raw material container of a vaporization supply device. More specifically, liquid CVD
The present invention relates to an apparatus and a method for easily supplying a raw material to a liquid CVD raw material container of a vaporization supply device without contacting the atmosphere.

【0002】[0002]

【従来の技術】近年、半導体工業の発展とともに、半導
体デバイスの高性能化、高集積化が進み、従来から使用
されてきた水素化物ガスやハロゲン化物ガスに代わり、
種々の液体の有機金属化合物がCVD原料として使用さ
れるようになってきた。半導体デバイスの絶縁薄膜に
は、ゲート絶縁膜としてSiO、キャパシタ絶縁膜と
してSi、層間絶縁膜としてPSG(リン・シリ
コン・ガラス)、BPSG(ボロン・リン・シリコン・
ガラス)があるが、例えばSiO膜のCVD原料とし
てはテトラエトキシケイ素(Si(OC
が、BPSG膜のCVD原料としてはトリメトキシホウ
素(B(OCH)、トリメトキシリン(PO(O
CH)等が使用されている。
2. Description of the Related Art In recent years, along with the development of the semiconductor industry, the performance and integration of semiconductor devices have advanced, and in place of the hydride gas and halide gas that have been used conventionally,
Various liquid organometallic compounds have come to be used as CVD raw materials. The insulating thin film of a semiconductor device includes SiO 2 as a gate insulating film, Si 3 N 4 as a capacitor insulating film, PSG (phosphorus silicon glass) as an interlayer insulating film, and BPSG (boron phosphorus silicon silicon).
Glass), for example, tetraethoxysilicon (Si (OC 2 H 5 ) 4 ) is used as a CVD raw material for the SiO 2 film.
However, trimethoxyboron (B (OCH 3 ) 3 ) and trimethoxyphosphorus (PO (O
CH 3 ) 3 ) and the like are used.

【0003】また、半導体デバイスの金属膜において
は、アルミニウム膜のCVD原料としてはジメチルアル
ミニウムハイドライド(Al(CHH)、銅膜の
CVD原料としてはヘキサフルオロアセチルアセトン銅
ビニルトリメチルシラン((CF3CO)2CHCu・C
2CHSi(CH33)、ルテニウム膜のCVD原料
としてはビス(エチルシクロペンタジエニル)ルテニウ
ム(Ru(C)等が使用されてい
る。
In a metal film of a semiconductor device, dimethyl aluminum hydride (Al (CH 3 ) 2 H) is used as a CVD raw material for an aluminum film, and hexafluoroacetylacetone copper vinyltrimethylsilane ((CF 3 CO) 2 CHCu · C
H 2 CHSi (CH 3 ) 3 ) and bis (ethylcyclopentadienyl) ruthenium (Ru (C 5 H 4 C 2 H 5 ) 2 ) are used as a CVD raw material for the ruthenium film.

【0004】これらの液体の有機金属化合物は半導体製
造において不可欠な材料であるが、そのほとんどが毒性
が高いかあるいは安全性が確認されていないものであ
り、しかも有機アルミニウム等は空気、水と爆発的に反
応するために極めて危険性が高いものである。これらの
液体CVD原料は、通常は内容量が数十g〜数百gのよ
うな比較的小型で気密性の高い金属容器内に充填されて
おり、半導体薄膜を製造する際には、例えば圧送ガスの
圧力によりマスフローコントローラーを経由して気化器
に供給され、気化器でガス状にされた後、CVD装置に
供給されている。
These liquid organometallic compounds are indispensable materials in semiconductor manufacturing, but most of them are highly toxic or have not been confirmed to be safe. Moreover, organoaluminum and the like explode with air, water and explosion. It is extremely dangerous because it reacts dynamically. These liquid CVD raw materials are usually filled in a relatively small and highly airtight metal container having an internal capacity of several tens to several hundreds of g. It is supplied to the vaporizer via the mass flow controller by the pressure of the gas, made into a gas state in the vaporizer, and then supplied to the CVD apparatus.

【0005】[0005]

【発明が解決しようとする課題】液体CVD原料は前述
の通り毒性、反応性の高いものが多く、また、液体CV
D原料が気化器に供給される前に、液体CVD原料と水
分等の反応物が生成し粉末化したり配管内に固着する
と、気化供給、気相成長反応、あるいは半導体薄膜の品
質に悪影響を与えるので、使用済の液体CVD原料容器
を新規の液体CVD原料容器と交換する際には、これら
が同種類の液体CVD原料であっても、配管から液体C
VD原料容器を取外す前に、配管内壁に残存する液体C
VD原料を洗浄して除去する必要があり、交換した後に
は配管内部にキャリアガスを供給し空気を完全に除去し
て気密性及び安全性を確保する必要がある。
As described above, many liquid CVD raw materials are highly toxic and highly reactive, and liquid CV
If the reactants such as the liquid CVD raw material and water are generated and powdered or adhered in the pipe before the raw material D is supplied to the vaporizer, the vaporization supply, the vapor phase growth reaction, or the quality of the semiconductor thin film is adversely affected. Therefore, when replacing a used liquid CVD raw material container with a new liquid CVD raw material container, even if these are liquid CVD raw materials of the same type, the liquid C
Liquid C remaining on the inner wall of the pipe before removing the VD raw material container
It is necessary to wash and remove the VD raw material, and after the replacement, it is necessary to supply a carrier gas to the inside of the pipe to completely remove air and ensure airtightness and safety.

【0006】そのため従来の液体CVD原料の気化供給
においては、液体CVD原料容器の交換のために気化供
給を中断しなければならないほか、気化供給の再開まで
に手間がかかるという不都合があった。従って、本発明
が解決しようとする課題は、液体CVD原料の気化供給
において、CVD装置への気化供給を中断することな
く、容易に液体CVD原料を気化供給装置に補充するこ
とができる液体原料供給装置及び液体原料供給方法を提
供することである。
Therefore, in the conventional vaporization supply of the liquid CVD raw material, the vaporization supply must be interrupted in order to replace the liquid CVD raw material container, and there is a disadvantage that it takes time to restart the vaporization supply. Therefore, the problem to be solved by the present invention is to provide a liquid raw material supply capable of easily replenishing the liquid CVD raw material to the vaporization supply device without interrupting the vaporization supply to the CVD device in the vaporization supply of the liquid CVD raw material. An apparatus and a liquid raw material supply method are provided.

【0007】[0007]

【課題を解決するための手段】本発明者らは、これらの
課題を解決すべく鋭意検討した結果、液体CVD原料容
器及び洗浄液容器を備えた可搬式の液体原料供給装置を
用いて、この液体原料供給装置から気化供給装置の液体
CVD原料容器に液体CVD原料を供給するとともに、
液体CVD原料の供給が終了した後の後処理は、前記可
搬式の液体原料供給装置内の配管を洗浄することにより
行なう構成とすることにより、気化供給を中断すること
なく、容易に液体CVD原料を気化供給装置に補充でき
ることを見い出し本発明に到達した。
As a result of intensive studies to solve these problems, the inventors of the present invention used a portable liquid raw material supply device equipped with a liquid CVD raw material container and a cleaning liquid container to obtain this liquid. While supplying the liquid CVD raw material from the raw material supply device to the liquid CVD raw material container of the vaporization supply device,
Since the post-treatment after the supply of the liquid CVD raw material is completed is performed by cleaning the pipe in the portable liquid raw material supply device, it is possible to easily perform the liquid CVD raw material without interrupting the vaporization supply. It has been found that the vaporization supply device can be supplemented with the present invention, and the present invention has been completed.

【0008】すなわち本発明は、液体CVD原料容器及
び洗浄液容器が具備されて成り、該液体CVD原料容器
には加熱手段を有し外部に液体CVD原料を供給するた
めの液体CVD原料供給管と圧送ガス導入管が接続され
ており、該洗浄液容器には洗浄液を該液体CVD原料供
給管に供給するための洗浄液供給管と圧送ガス導入管が
接続されており、さらに該液体CVD原料供給管には洗
浄残液を外部に排出するための排出管が接続されて成る
ことを特徴とする可搬式の液体原料供給装置である。
That is, the present invention comprises a liquid CVD raw material container and a cleaning liquid container, and the liquid CVD raw material container has a heating means and a liquid CVD raw material supply pipe for supplying the liquid CVD raw material to the outside and pressure feeding. A gas introducing pipe is connected, a cleaning liquid supply pipe for supplying a cleaning liquid to the liquid CVD raw material supply pipe and a pressure-feeding gas introducing pipe are connected to the cleaning liquid container, and the liquid CVD raw material supply pipe is further connected to the liquid CVD raw material supply pipe. A portable liquid raw material supply device characterized in that a discharge pipe for discharging the residual cleaning liquid to the outside is connected.

【0009】また、本発明は、液体CVD原料が充填さ
れた液体CVD原料容器及び洗浄液が充填された洗浄液
容器が具備されて成る可搬式の液体原料供給装置から、
該液体原料供給装置以外の液体CVD原料容器に液体C
VD原料を供給した後、液体CVD原料を供給するため
に使用した該液体原料供給装置の液体CVD原料供給管
内に、該洗浄液容器から洗浄液を供給して残存する液体
CVD原料を洗い流し、次に該液体CVD原料供給管内
を加熱及び/または減圧して該液体CVD原料供給管内
に残存する洗浄残液を除去することを特徴とする液体原
料供給方法でもある。
The present invention also provides a portable liquid source supply device comprising a liquid CVD source container filled with a liquid CVD source and a cleaning liquid container filled with a cleaning liquid.
Liquid C in a liquid CVD raw material container other than the liquid raw material supply device
After supplying the VD raw material, the cleaning liquid is supplied from the cleaning liquid container into the liquid CVD raw material supply pipe of the liquid raw material supply device used for supplying the liquid CVD raw material to wash away the remaining liquid CVD raw material, and then the The liquid raw material supply method is also characterized in that the cleaning residual liquid remaining in the liquid CVD raw material supply pipe is removed by heating and / or decompressing the inside of the liquid CVD raw material supply pipe.

【0010】[0010]

【発明の実施の形態】本発明は、気化供給装置の液体C
VD原料容器に、この液体CVD原料容器に充填されて
いる液体CVD原料と同種類の液体CVD原料を供給す
る装置及び方法に適用される。本発明の液体原料供給装
置は、液体CVD原料容器及び洗浄液容器が備えられ、
液体CVD原料容器には加熱手段を有し外部に液体CV
D原料を供給するための液体CVD原料供給管と圧送ガ
ス導入管が接続されており、洗浄液容器には洗浄液を液
体CVD原料供給管に供給するための洗浄液供給管と圧
送ガス導入管が接続されており、さらに液体CVD原料
供給管には洗浄残液を外部に排出するための排出管が接
続されている可搬式の液体原料供給装置である。
BEST MODE FOR CARRYING OUT THE INVENTION The present invention relates to a liquid C of a vaporization and supply device.
The present invention is applied to an apparatus and a method for supplying a liquid CVD raw material of the same type as the liquid CVD raw material filled in the liquid CVD raw material container to the VD raw material container. The liquid raw material supply device of the present invention includes a liquid CVD raw material container and a cleaning liquid container,
The liquid CVD raw material container has a heating means and has a liquid CV outside.
The liquid CVD raw material supply pipe for supplying the D raw material and the pressurized gas introduction pipe are connected, and the cleaning liquid container is connected with the cleaning liquid supply pipe and the pressurized gas introduction pipe for supplying the cleaning liquid to the liquid CVD raw material supply pipe. Further, the liquid CVD raw material supply device is a portable liquid raw material supply device in which a discharge pipe for discharging the cleaning residual liquid to the outside is connected to the liquid CVD raw material supply pipe.

【0011】また、本発明の液体原料供給方法は、前記
のような可搬式の液体原料供給装置から、この液体原料
供給装置以外の液体CVD原料容器に、液体CVD原料
を供給した後、液体CVD原料を供給するために使用し
た液体原料供給装置の液体CVD原料供給管内に、洗浄
液を供給して残存する液体CVD原料を洗い流し、次に
液体CVD原料供給管内を加熱及び/または減圧して液
体CVD原料供給管内に残存する洗浄残液を除去する液
体原料供給方法である。
In the liquid raw material supply method of the present invention, the liquid CVD raw material is supplied from the portable liquid raw material supply device to the liquid CVD raw material container other than the liquid raw material supply device, and then the liquid CVD is performed. A cleaning liquid is supplied into the liquid CVD raw material supply pipe of the liquid raw material supply device used to supply the raw material to wash away the remaining liquid CVD raw material, and then the liquid CVD raw material supply pipe is heated and / or depressurized to perform liquid CVD. This is a liquid raw material supply method for removing the residual cleaning liquid remaining in the raw material supply pipe.

【0012】本発明の液体原料供給装置及び液体原料供
給方法に適用できる液体CVD原料としては、常温で液
体であってもまた固体を溶媒に溶解したものであって
も、液状を保持し得るものであれば特に制限はなく、用
途に応じて適宜選択、使用される。例えばテトラiso-プ
ロポキシチタン(Ti(OCH(CH324)、テト
ラn-プロポキシチタン(Ti(OC374)、テトラt
ert-ブトキシジルコニウム(Zr(OC(C
334)、テトラn-ブトキシジルコニウム(Zr
(OC494)、テトラメトキシバナジウム(V(O
CH34)、トリメトキシバナジルオキシド(VO(O
CH33)、ペンタエトキシニオブ(Nb(OC25
5)、ペンタエトキシタンタル(Ta(OC255)、
トリメトキシホウ素(B(OCH33)、トリiso-プロ
ポキシアルミニウム(Al(OCH(CH32 3)、
テトラエトキシケイ素(Si(OC254)、テトラ
エトキシゲルマニウム(Ge(OC254)、テトラ
メトキシスズ(Sn(OCH34)、トリメトキシリン
(P(OCH33)、トリメトキシホスフィンオキシド
(PO(OCH33)、トリエトキシヒ素(As(OC
253)、トリエトキシアンチモン(Sb(OC
253)等の常温で液体のアルコキシドを挙げること
ができる。
Liquid raw material supply device and liquid raw material supply of the present invention
Liquid CVD raw materials applicable to the feeding method are liquid at room temperature.
Even the body is a solid dissolved in a solvent
Also, there is no particular limitation as long as it can maintain a liquid state.
It is appropriately selected and used depending on the way. For example Tetra Iso-P
Ropoxy titanium (Ti (OCH (CH3)2)Four), Tet
La n-propoxy titanium (Ti (OC3H7)Four), Tetra t
ert-butoxy zirconium (Zr (OC (C
H3)3)Four), Tetra-n-butoxyzirconium (Zr
(OCFourH9)Four), Tetramethoxy vanadium (V (O
CH3)Four), Trimethoxyvanadyl oxide (VO (O
CH3)3), Pentaethoxyniobium (Nb (OC2HFive)
Five), Pentaethoxy tantalum (Ta (OC2HFive)Five),
Trimethoxyboron (B (OCH3)3), Tri iso-pro
Poxyaluminum (Al (OCH (CH3)2) 3),
Tetraethoxy silicon (Si (OC2HFive)Four), Tetra
Ethoxy germanium (Ge (OC2HFive)Four), Tetra
Methoxy tin (Sn (OCH3)Four), Trimethoxyphosphorus
(P (OCH3)3), Trimethoxyphosphine oxide
(PO (OCH3)3), Triethoxyarsenic (As (OC
2HFive)3), Triethoxy antimony (Sb (OC
2HFive)3) And other liquid alkoxides at room temperature
You can

【0013】また、前記のほかに、トリメチルアルミニ
ウム(Al(CH33)、ジメチルアルミニウムハイド
ライド(Al(CH32H)、トリiso-ブチルアルミニ
ウム(Al(iso-C493)、ヘキサフルオロアセチ
ルアセトン銅ビニルトリメチルシラン((CF3CO)2
CHCu・CH2CHSi(CH33)、ヘキサフルオ
ロアセチルアセトン銅アリルトリメチルシラン((CF
3CO)2CHCu・CH2CHCH2Si(CH33)、
ビス(iso-プロピルシクロペンタジエニル)タングステ
ンジハライド((iso-C37552WH2)、テトラ
ジメチルアミノジルコニウム(Zr(N(C
324)、ペンタジメチルアミノタンタル(Ta
(N(CH325)、ペンタジエチルアミノタンタル
(Ta(N(C2525)、テトラジメチルアミノチ
タン(Ti(N(CH324)、テトラジエチルアミ
ノチタン(Ti(N(C2524)等の常温で液体の
原料を例示することができる。
In addition to the above, trimethyl aluminum (Al (CH 3 ) 3 ), dimethyl aluminum hydride (Al (CH 3 ) 2 H), tri-iso-butyl aluminum (Al (iso-C 4 H 9 ) 3 ), Hexafluoroacetylacetone copper vinyl trimethylsilane ((CF 3 CO) 2
CHCu.CH 2 CHSi (CH 3 ) 3 ), hexafluoroacetylacetone copper allyltrimethylsilane ((CF
3 CO) 2 CHCu.CH 2 CHCH 2 Si (CH 3 ) 3 ),
Bis (an iso-propyl cyclopentadienyl) tungsten dihalide ((iso-C 3 H 7 C 5 H 5) 2 WH 2), tetradimethylamino zirconium (Zr (N (C
H 3 ) 2 ) 4 ), pentadimethylamino tantalum (Ta
(N (CH 3) 2) 5), penta diethylamino tantalum (Ta (N (C 2 H 5) 2) 5), tetra dimethylamino titanium (Ti (N (CH 3) 2) 4), tetra diethylamino titanium ( A raw material that is liquid at room temperature, such as Ti (N (C 2 H 5 ) 2 ) 4 ) can be exemplified.

【0014】さらに、ヘキサカルボニルモリブデン(M
o(CO)6)、ジメチルペントオキシ金(Au(C
32(OC57))、ビス(2,2,6,6,-テトラメチル-
3,5ヘプタンジオナイト)バリウム(Ba((C(C
3323HO22)、ビス(2,2,6,6,-テトラメチ
ル-3,5ヘプタンジオナイト)ストロンチウム(Sr
((C(CH3323HO22)、テトラ(2,2,6,6,
-テトラメチル-3,5ヘプタンジオナイト)チタニウム
(Ti((C(CH3323HO24)、テトラ(2,
2,6,6,-テトラメチル-3,5ヘプタンジオナイト)ジルコ
ニウム(Zr((C(CH3 323HO24)、ビス
(2,2,6,6,-テトラメチル-3,5ヘプタンジオナイト)鉛
(Pb((C(CH3323HO22)、(ジターシ
ャリーブトキシドビス)(2,2,6,6,-テトラメチル-3.5.
ヘプタンジオナイト)チタニウム、(ジ-イソプロポキ
シ)(2,2,6,6,-テトラメチル-3,5,-ヘプタンジオナイ
ト)チタニウム、テトラキス(イソブチリルピバロイル
メタナート)ジルコニウム、または(イソプロポキシ)
トリス(2,2,6,6,-テトラメチル-3,5,-ヘプタンジオナ
イト)ジルコニウム等の常温で固体の原料を例示するこ
とができる。ただし、これらは通常0.1〜1.0mo
l/L程度の濃度で有機溶媒に溶解して使用する必要が
ある。
Further, hexacarbonyl molybdenum (M
o (CO)6), Dimethyl pentoxy gold (Au (C
H3)2(OCFiveH7)), Bis (2,2,6,6, -tetramethyl-
3,5 heptane dionite) barium (Ba ((C (C
H3)3)2C3HO2)2), Bis (2,2,6,6, -tetramethy
Le-3,5 heptane dionite) strontium (Sr
((C (CH3)3)2C3HO2)2), Tetra (2,2,6,6,
-Tetramethyl-3,5 heptandionite) Titanium
(Ti ((C (CH3)3)2C3HO2)Four), Tetra (2,
2,6,6, -Tetramethyl-3,5 heptane dionite) Zirco
Nium (Zr ((C (CH3 )3)2C3HO2)Four),Screw
(2,2,6,6, -Tetramethyl-3,5 heptandionite) Lead
(Pb ((C (CH3)3)2C3HO2)2), (Jittersi
Arybutoxide bis) (2,2,6,6, -tetramethyl-3.5.
Heptane dionite) titanium, (di-isopropoxy
Si) (2,2,6,6, -tetramethyl-3,5, -heptanedionai
G) Titanium, tetrakis (isobutyryl pivaloyl)
Methanate) zirconium, or (isopropoxy)
Tris (2,2,6,6, -tetramethyl-3,5, -heptane diona
For example, a raw material that is solid at room temperature, such as zirconium
You can However, these are usually 0.1 to 1.0 mo
It is necessary to dissolve it in an organic solvent at a concentration of about 1 / L before use.
is there.

【0015】固体CVD原料の溶媒として用いられる前
記有機溶媒は、通常はその沸点温度が40℃〜140℃
の有機溶媒である。それらの有機溶媒として、例えば、
プロピルエーテル、メチルブチルエーテル、エチルプロ
ピルエーテル、エチルブチルエーテル、酸化トリメチレ
ン、テトラヒドロフラン、テトラヒドロピラン等のエー
テル、メチルアルコール、エチルアルコール、プロピル
アルコール、ブチルアルコール等のアルコール、アセト
ン、エチルメチルケトン、iso-プロピルメチルケトン、
iso-ブチルメチルケトン等のケトン、プロピルアミン、
ブチルアミン、ジエチルアミン、ジプロピルアミン、ト
リエチルアミン等のアミン、酢酸エチル、酢酸プロピ
ル、酢酸ブチル等のエステル、ヘキサン、ヘプタン、オ
クタン等の炭化水素等を挙げることができる。
The organic solvent used as a solvent for the solid CVD raw material usually has a boiling point of 40 ° C to 140 ° C.
Is an organic solvent. As those organic solvents, for example,
Ethers such as propyl ether, methyl butyl ether, ethyl propyl ether, ethyl butyl ether, trimethylene oxide, tetrahydrofuran, tetrahydropyran, alcohols such as methyl alcohol, ethyl alcohol, propyl alcohol, butyl alcohol, acetone, ethyl methyl ketone, iso-propyl methyl ketone ,
ketones such as iso-butyl methyl ketone, propylamine,
Examples thereof include amines such as butylamine, diethylamine, dipropylamine and triethylamine, esters such as ethyl acetate, propyl acetate and butyl acetate, and hydrocarbons such as hexane, heptane and octane.

【0016】以下、本発明の液体原料供給装置及び液体
原料供給方法を、図1及び図2に基づいて詳細に説明す
るが、本発明はこれらにより限定されるものではない。
図1及び図2は各々本発明の液体原料供給装置の一例を
示す構成図である。本発明の液体原料供給装置は、図1
に示すように、液体CVD原料容器2及び洗浄液容器4
が具備されて成る可搬式の液体原料供給装置である。ま
た、液体CVD原料容器2には加熱手段5を有し外部に
液体CVD原料1を供給するための液体CVD原料供給
管6と圧送ガス導入管7が接続され、洗浄液容器4には
洗浄液3を液体CVD原料供給管6に供給するための洗
浄液供給管8と圧送ガス導入管7が接続される。さら
に、液体CVD原料供給管6には洗浄残液を外部に排出
するための排出管9が接続されて成る構成である。
The liquid raw material supply apparatus and the liquid raw material supply method of the present invention will be described below in detail with reference to FIGS. 1 and 2, but the present invention is not limited thereto.
1 and 2 are configuration diagrams showing an example of the liquid raw material supply device of the present invention. The liquid raw material supply device of the present invention is shown in FIG.
As shown in FIG.
Is a portable liquid raw material supply device. Further, the liquid CVD raw material container 2 is connected to a liquid CVD raw material supply pipe 6 for supplying the liquid CVD raw material 1 to the outside and a pressure-feeding gas introduction pipe 7, and the cleaning liquid container 4 is filled with the cleaning liquid 3. A cleaning liquid supply pipe 8 for supplying the liquid CVD raw material supply pipe 6 and a pressure-feeding gas introduction pipe 7 are connected. Further, the liquid CVD raw material supply pipe 6 is connected to a discharge pipe 9 for discharging the residual cleaning liquid to the outside.

【0017】尚、本発明の液体原料供給装置において
は、好ましくは図2に示すように、洗浄液供給管8に残
存した洗浄液の外部への排出を容易にするための洗浄液
排出管10、及び液体CVD原料供給管6に残存した洗
浄残液の外部への排出を容易にするためのバイパス管1
1が設けられる。また、加熱手段は液体CVD原料供給
管の内部を加熱し洗浄残液を除去しやすくするために設
けられるが、好ましくは図2に示すように洗浄液供給管
の一部及び排出管の一部にも設けられる。尚、加熱手段
としては、配管の外側にリボンヒーターを巻き付ける方
法、配管の形状に合せたブロックヒーターで覆う方法、
あるいは熱風循環や液体熱媒循環させる方法等がある。
加熱温度は液体CVD原料、洗浄液の蒸気圧によっても
異なるが通常は40〜250℃程度である。
In the liquid raw material supply apparatus of the present invention, preferably, as shown in FIG. 2, the cleaning liquid discharge pipe 10 for facilitating the discharge of the cleaning liquid remaining in the cleaning liquid supply pipe 8 to the outside, and the liquid. Bypass pipe 1 for facilitating the discharge of the cleaning residual liquid remaining in the CVD raw material supply pipe 6 to the outside
1 is provided. Further, the heating means is provided to heat the inside of the liquid CVD raw material supply pipe to facilitate removal of the residual cleaning liquid, but preferably it is provided in a part of the cleaning liquid supply pipe and a part of the discharge pipe as shown in FIG. Is also provided. As the heating means, a method of winding a ribbon heater on the outside of the pipe, a method of covering with a block heater matching the shape of the pipe,
Alternatively, there is a method of circulating hot air or a liquid heat medium.
The heating temperature varies depending on the vapor pressure of the liquid CVD raw material and the cleaning liquid, but is usually about 40 to 250 ° C.

【0018】本発明の液体原料供給装置における液体C
VD原料容器は、圧送ガス供給管から供給される圧送ガ
スの圧力により、液体CVD原料が液体CVD原料供給
管に供給される構成である。また、洗浄液容器も同様
に、圧送ガス供給管5から供給される圧送ガスの圧力に
より、洗浄液が液体CVD原料供給管に供給される構成
である。本発明における圧送ガスとしては、通常はヘリ
ウム、窒素、アルゴン等の不活性ガスが用いられる。圧
送ガス供給管は、液体CVD原料の供給の際に、通常は
外部の不活性ガス配管あるいは不活性ガスボンベに接続
される。
Liquid C in the liquid raw material supply apparatus of the present invention
The VD raw material container has a structure in which the liquid CVD raw material is supplied to the liquid CVD raw material supply pipe by the pressure of the pressurized gas supplied from the pressurized gas supply pipe. Similarly, the cleaning liquid container is also configured such that the cleaning liquid is supplied to the liquid CVD raw material supply pipe by the pressure of the compressed gas supplied from the compressed gas supply pipe 5. As the pressure-feeding gas in the present invention, an inert gas such as helium, nitrogen or argon is usually used. The pressurized gas supply pipe is usually connected to an external inert gas pipe or an inert gas cylinder when supplying the liquid CVD raw material.

【0019】本発明の液体原料供給方法により、液体C
VD原料を気化供給装置の液体CVD原料容器に供給す
る際には、予め圧送ガス供給管から圧送ガスを供給し
て、液体CVD原料供給管内部及び洗浄液供給管内部を
圧送ガス雰囲気下とした後、液体CVD原料供給管が外
部の気化供給装置の液体CVD原料容器に接続される。
その後、圧送ガス供給管から供給される圧送ガスの圧力
により、液体CVD原料が液体CVD原料供給管を経由
して外部の気化供給装置の液体CVD原料容器に供給さ
れる。
By the liquid raw material supply method of the present invention, liquid C
When the VD raw material is supplied to the liquid CVD raw material container of the vaporization supply device, after the pressure-feeding gas is supplied from the pressure-feeding gas supply pipe in advance, the inside of the liquid CVD raw material supply pipe and the inside of the cleaning liquid supply pipe are under the pressure-feeding gas atmosphere. The liquid CVD raw material supply pipe is connected to the liquid CVD raw material container of the external vaporization supply device.
Then, the pressure of the pressure-fed gas supplied from the pressure-fed gas supply pipe causes the liquid CVD raw material to be supplied to the liquid CVD raw material container of the external vaporization supply device via the liquid CVD raw material supply pipe.

【0020】本発明の液体原料供給方法においては、液
体CVD原料の供給が終了した後、液体CVD原料供給
管が外部の気化供給装置の液体CVD原料容器から切離
され、液体CVD原料供給管の洗浄が行われる。本発明
における液体CVD原料供給管の洗浄は、洗浄液容器か
ら洗浄液を供給して残存する液体CVD原料を洗い流す
ことにより行われる。液体CVD原料及び洗浄液は排出
管から外部に排出される。次に液体CVD原料供給管内
を加熱及び/または減圧して液体CVD原料供給管内に
残存する洗浄残液が除去される。減圧する場合は、通常
は真空ポンプ等の減圧手段が冷却トラップを経由させて
排出管に接続される。
In the liquid raw material supply method of the present invention, after the supply of the liquid CVD raw material is completed, the liquid CVD raw material supply pipe is separated from the liquid CVD raw material container of the external vaporization supply device, Cleaning is performed. The cleaning of the liquid CVD raw material supply pipe in the present invention is performed by supplying the cleaning liquid from the cleaning liquid container to wash away the remaining liquid CVD raw material. The liquid CVD raw material and the cleaning liquid are discharged from the discharge pipe to the outside. Next, the inside of the liquid CVD raw material supply pipe is heated and / or depressurized to remove the cleaning residual liquid remaining in the liquid CVD raw material supply pipe. When reducing the pressure, a pressure reducing means such as a vacuum pump is usually connected to the discharge pipe via a cooling trap.

【0021】尚、本発明の液体原料供給方法を、図2に
示すような構成の液体原料供給装置を用いて行なう場合
は、洗浄液を液体CVD原料供給管に供給する前に圧送
ガス供給管から圧送ガスを供給し、液体CVD原料供給
管に残存している液体CVD原料を液体CVD原料容器
に押し戻すこともできる。また、洗浄液を供給して液体
CVD原料を洗い流した後、液体CVD原料供給管内を
加熱しながら圧送ガスを流して洗浄残液を除去すること
もできる。
When the liquid raw material supply method of the present invention is carried out by using the liquid raw material supply device having the structure shown in FIG. 2, the cleaning liquid is supplied from the pressurized gas supply pipe before the liquid CVD raw material supply pipe. It is also possible to supply a pressure-feeding gas and push back the liquid CVD raw material remaining in the liquid CVD raw material supply pipe to the liquid CVD raw material container. Further, after the cleaning liquid is supplied to wash away the liquid CVD raw material, it is possible to remove the residual cleaning liquid by flowing the pressure-fed gas while heating the inside of the liquid CVD raw material supply pipe.

【0022】本発明の液体原料供給方法における洗浄液
としては、通常は沸点温度が40℃〜140℃であるエ
ーテル類、アルコール類、ケトン類、アミン類、エステ
ル類、炭化水素類等が用いられる。このような洗浄液と
しては、例えば、プロピルエーテル、メチルブチルエー
テル、エチルプロピルエーテル、エチルブチルエーテ
ル、酸化トリメチレン、テトラヒドロフラン、テトラヒ
ドロピラン等のエーテル、メチルアルコール、エチルア
ルコール、プロピルアルコール、ブチルアルコール等の
アルコール、アセトン、エチルメチルケトン、iso-プロ
ピルメチルケトン、iso-ブチルメチルケトン等のケト
ン、プロピルアミン、ブチルアミン、ジエチルアミン、
ジプロピルアミン、トリエチルアミン等のアミン、酢酸
エチル、酢酸プロピル、酢酸ブチル等のエステル、ヘキ
サン、ヘプタン、オクタン等の炭化水素等を挙げること
ができる。
As the cleaning liquid in the liquid raw material supply method of the present invention, ethers, alcohols, ketones, amines, esters, hydrocarbons and the like having a boiling point of 40 ° C. to 140 ° C. are usually used. Examples of such cleaning liquid include propyl ether, methyl butyl ether, ethyl propyl ether, ethyl butyl ether, trimethylene oxide, tetrahydrofuran, ethers such as tetrahydropyran, methyl alcohol, alcohols such as ethyl alcohol, propyl alcohol and butyl alcohol, acetone, Ketones such as ethyl methyl ketone, iso-propyl methyl ketone, iso-butyl methyl ketone, propylamine, butylamine, diethylamine,
Examples thereof include amines such as dipropylamine and triethylamine, esters such as ethyl acetate, propyl acetate and butyl acetate, and hydrocarbons such as hexane, heptane and octane.

【0023】[0023]

【実施例】次に、本発明を実施例により具体的に説明す
るが、本発明がこれらにより限定されるものではない。
EXAMPLES Next, the present invention will be specifically described by way of examples, but the present invention is not limited to these.

【0024】実施例1 図2に示すような構成の液体原料供給装置を製作した。
液体CVD原料容器は内径300mm高さ610mmの
電解研摩仕様のステンレス製容器であり、液体CVD原
料としてテトラエトキシケイ素が充填されている。ま
た、洗浄液容器は内径150mm高さ300mmの電解
研摩仕様のステンレス製容器であり、洗浄液としてヘキ
サンが充填されている。また、配管、継手、及びバルブ
も電解研摩仕様のステンレス製のものを使用した。加熱
手段としては、配管の形状に合ったブロックヒーターを
用いた。
Example 1 A liquid raw material supply device having a structure as shown in FIG. 2 was manufactured.
The liquid CVD raw material container is an electrolytic polishing specification stainless steel container having an inner diameter of 300 mm and a height of 610 mm, and is filled with tetraethoxysilicon as a liquid CVD raw material. The cleaning liquid container is an electrolytic polishing specification stainless steel container having an inner diameter of 150 mm and a height of 300 mm, and is filled with hexane as a cleaning liquid. The pipes, joints, and valves used were made of stainless steel with electrolytic polishing specifications. A block heater suitable for the shape of the pipe was used as the heating means.

【0025】次に、圧送ガス供給管を外部のヘリウムガ
ス配管に接続し圧送ガス供給管からヘリウムを供給し
て、液体CVD原料供給管内部及び洗浄液供給管内部を
ヘリウムガス雰囲気下とした後、液体CVD原料供給管
を外部の液体CVD原料容器に接続した。その後、圧送
ガス供給管から液体CVD原料容器にヘリウムを供給
し、その圧力により10Lのテトラエトキシケイ素を、
液体CVD原料供給管を経由させて外部の液体CVD原
料容器に供給した。
Next, after connecting the pressure-feeding gas supply pipe to an external helium gas pipe and supplying helium from the pressure-feeding gas supply pipe to make the inside of the liquid CVD raw material supply pipe and the inside of the cleaning liquid supply pipe under a helium gas atmosphere, The liquid CVD raw material supply pipe was connected to an external liquid CVD raw material container. After that, helium was supplied from the pressure-feeding gas supply pipe to the liquid CVD raw material container, and 10 L of tetraethoxysilicon was supplied by the pressure.
It was supplied to an external liquid CVD raw material container via a liquid CVD raw material supply pipe.

【0026】テトラエトキシケイ素の供給が終了した
後、液体CVD原料供給管を外部の液体CVD原料容器
から切離し、液体CVD原料供給管内のテトラエトキシ
ケイ素を重力により液体CVD原料容器に落下させた
後、さらにバイパス配管を経由させてヘリウムを供給し
液体CVD原料容器に押し戻した。次に、バイパス管の
バルブを閉、排出管のバルブを開にした後、洗浄液容器
から液体CVD原料供給管内に100mLのヘキサンを
供給して残存するテトラエトキシケイ素を排出管へ洗い
流した。さらに、液体CVD原料供給管内を70℃に加
熱するとともにバイパス配管を経由させてヘリウムを3
0分間供給し、液体CVD原料供給管内に残存する洗浄
残液を除去した。
After the supply of tetraethoxysilicon is completed, the liquid CVD raw material supply pipe is separated from the external liquid CVD raw material container, and tetraethoxysilicon in the liquid CVD raw material supply pipe is dropped by gravity into the liquid CVD raw material container. Further, helium was supplied via a bypass pipe and pushed back into the liquid CVD raw material container. Next, after closing the valve of the bypass pipe and opening the valve of the discharge pipe, 100 mL of hexane was supplied from the cleaning liquid container into the liquid CVD raw material supply pipe to wash away the remaining tetraethoxysilicon into the discharge pipe. Further, the inside of the liquid CVD raw material supply pipe is heated to 70 ° C., and helium is added to
The liquid was supplied for 0 minutes to remove the cleaning residual liquid remaining in the liquid CVD raw material supply pipe.

【0027】液体CVD原料容器を液体CVD原料供給
管から取り外した後、液体CVD原料供給管の内部を調
べた結果、液体CVD原料であるテトラエトキシケイ
素、その反応物、及び洗浄液であるヘキサンは検出され
ず、液体CVD原料供給管内が充分に洗浄されているこ
とが確認できた。
After the liquid CVD raw material container was removed from the liquid CVD raw material supply pipe, the inside of the liquid CVD raw material supply pipe was examined. As a result, tetraethoxysilicon which is the liquid CVD raw material, its reaction product, and hexane which is the cleaning liquid were detected. However, it was confirmed that the inside of the liquid CVD raw material supply pipe was sufficiently cleaned.

【0028】実施例2 液体CVD原料としてテトラiso-プロポキシチタン、洗
浄液としてiso-プロピルアルコールを用いた以外は実施
例1と同様にして液体原料供給装置を製作した。この液
体原料供給装置を用いて実施例1と同様にしてiso-プロ
ポキシチタンを外部の液体CVD原料容器に供給した。
iso-プロポキシチタンの供給が終了した後、液体CVD
原料供給管を外部の液体CVD原料容器から切離し、真
空ポンプを液体窒素冷却トラップを経由させて排出管に
接続した。
Example 2 A liquid raw material supply apparatus was manufactured in the same manner as in Example 1 except that tetra iso-propoxy titanium was used as the liquid CVD raw material and iso-propyl alcohol was used as the cleaning liquid. Using this liquid raw material supply device, iso-propoxy titanium was supplied to an external liquid CVD raw material container in the same manner as in Example 1.
After completion of supply of iso-propoxy titanium, liquid CVD
The raw material supply pipe was separated from the external liquid CVD raw material container, and the vacuum pump was connected to the discharge pipe via the liquid nitrogen cooling trap.

【0029】液体CVD原料供給管内のiso-プロポキシ
チタンを重力により液体CVD原料容器に落下させた
後、さらにバイパス管を経由させてヘリウムを供給し液
体CVD原料容器に押し戻した。次に、バイパス管のバ
ルブを閉、排出管のバルブを開にした後、洗浄液容器か
ら液体CVD原料供給管内に300mLのiso-プロピル
アルコールを供給して残存するiso-プロポキシチタンを
排出管へ洗い流した。さらに、液体CVD原料供給管内
を70℃に加熱するとともに真空ポンプを30分間稼動
して、液体CVD原料供給管内に残存する洗浄残液を除
去した。
After iso-propoxy titanium in the liquid CVD raw material supply pipe was dropped into the liquid CVD raw material container by gravity, helium was further supplied through the bypass pipe and pushed back into the liquid CVD raw material container. Next, after closing the valve of the bypass pipe and opening the valve of the discharge pipe, 300 mL of iso-propyl alcohol was supplied from the cleaning liquid container into the liquid CVD raw material supply pipe to wash away the residual iso-propoxytitanium to the discharge pipe. It was Further, the inside of the liquid CVD raw material supply pipe was heated to 70 ° C. and the vacuum pump was operated for 30 minutes to remove the cleaning residual liquid remaining in the liquid CVD raw material supply pipe.

【0030】液体CVD原料容器を液体CVD原料供給
管から取り外した後、液体CVD原料供給管の内部を調
べた結果、液体CVD原料であるiso-プロポキシチタ
ン、その反応物、及び洗浄液であるiso-プロピルアルコ
ールは検出されず、液体CVD原料供給管内が充分に洗
浄されていることが確認できた。
After removing the liquid CVD raw material container from the liquid CVD raw material supply pipe, the inside of the liquid CVD raw material supply pipe was examined. As a result, iso-propoxytitanium as the liquid CVD raw material, its reaction product, and iso- Propyl alcohol was not detected, and it was confirmed that the inside of the liquid CVD raw material supply pipe was sufficiently washed.

【0031】[0031]

【発明の効果】本発明の液体原料供給装置及び液体原料
供給方法により、CVD装置への気化供給を中断するこ
となく、容易に液体CVD原料を気化供給装置に補充す
ることができるようになった。
According to the liquid raw material supply apparatus and the liquid raw material supply method of the present invention, the liquid CVD raw material can be easily replenished to the vaporization supply apparatus without interrupting the vaporization supply to the CVD apparatus. .

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の液体原料供給装置の一例を示す構成図FIG. 1 is a configuration diagram showing an example of a liquid raw material supply device of the present invention.

【図2】本発明の図1以外の液体原料供給装置の一例を
示す構成図
FIG. 2 is a configuration diagram showing an example of a liquid raw material supply apparatus other than FIG. 1 of the present invention.

【符号の説明】[Explanation of symbols]

1 液体CVD原料 2 液体CVD原料容器 3 洗浄液 4 洗浄液容器 5 加熱手段 6 液体CVD原料供給管 7 圧送ガス導入管 8 洗浄液供給管 9 排出管 10 洗浄液排出管 11 バイパス管 1 Liquid CVD raw material 2 Liquid CVD raw material container 3 cleaning liquid 4 Cleaning liquid container 5 heating means 6 Liquid CVD raw material supply pipe 7 Compressed gas introduction pipe 8 Cleaning liquid supply pipe 9 discharge pipe 10 Cleaning liquid discharge pipe 11 Bypass pipe

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 液体CVD原料容器及び洗浄液容器が具
備されて成り、該液体CVD原料容器には加熱手段を有
し外部に液体CVD原料を供給するための液体CVD原
料供給管と圧送ガス導入管が接続されており、該洗浄液
容器には洗浄液を該液体CVD原料供給管に供給するた
めの洗浄液供給管と圧送ガス導入管が接続されており、
さらに該液体CVD原料供給管には洗浄残液を外部に排
出するための排出管が接続されて成ることを特徴とする
可搬式の液体原料供給装置。
1. A liquid CVD raw material container and a cleaning liquid container are provided, and the liquid CVD raw material container has a heating means and a liquid CVD raw material supply pipe for supplying the liquid CVD raw material to the outside and a pressurized gas introduction pipe. And a cleaning liquid supply pipe for supplying a cleaning liquid to the liquid CVD raw material supply pipe and a pressure-feeding gas introduction pipe are connected to the cleaning liquid container,
Further, the liquid CVD raw material supply pipe is connected to a discharge pipe for discharging the cleaning residual liquid to the outside, which is a portable liquid raw material supply device.
【請求項2】 さらに洗浄液供給管と排出管を接続する
洗浄液排出管が具備されて成る請求項1に記載の液体原
料供給装置。
2. The liquid raw material supply device according to claim 1, further comprising a cleaning liquid discharge pipe connecting the cleaning liquid supply pipe and the discharge pipe.
【請求項3】 さらに液体CVD原料供給管と圧送ガス
導入管を接続するバイパス管が具備されて成る請求項1
に記載の液体原料供給装置。
3. A bypass pipe for connecting the liquid CVD raw material supply pipe and the pressure-feeding gas introduction pipe is further provided.
The liquid raw material supply device according to.
【請求項4】 液体CVD原料が充填された液体CVD
原料容器及び洗浄液が充填された洗浄液容器が具備され
て成る可搬式の液体原料供給装置から、該液体原料供給
装置以外の液体CVD原料容器に液体CVD原料を供給
した後、液体CVD原料を供給するために使用した該液
体原料供給装置の液体CVD原料供給管内に、該洗浄液
容器から洗浄液を供給して残存する液体CVD原料を洗
い流し、次に該液体CVD原料供給管内を加熱及び/ま
たは減圧して該液体CVD原料供給管内に残存する洗浄
残液を除去することを特徴とする液体原料供給方法。
4. A liquid CVD in which a liquid CVD raw material is filled.
A liquid CVD raw material is supplied from a portable liquid raw material supply device including a raw material container and a cleaning liquid container filled with a cleaning liquid to a liquid CVD raw material container other than the liquid raw material supply device, and then a liquid CVD raw material is supplied. The cleaning liquid is supplied from the cleaning liquid container into the liquid CVD raw material supply pipe of the liquid raw material supply device used for washing away the remaining liquid CVD raw material, and then the liquid CVD raw material supply pipe is heated and / or depressurized. A method for supplying a liquid raw material, characterized in that the residual cleaning liquid remaining in the liquid CVD raw material supply pipe is removed.
【請求項5】 洗浄液が、沸点温度として40℃〜14
0℃であるエーテル類、アルコール類、ケトン類、アミ
ン類、エステル類及び炭化水素類から選ばれる一種以上
である請求項4に記載の液体原料供給方法
5. The cleaning liquid has a boiling point of 40 ° C. to 14 ° C.
The liquid raw material supply method according to claim 4, which is one or more selected from ethers, alcohols, ketones, amines, esters, and hydrocarbons at 0 ° C.
JP2001368796A 2001-12-03 2001-12-03 Apparatus and method for feeding liquid source material Pending JP2003168651A (en)

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Publications (1)

Publication Number Publication Date
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Country Link
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009038168A1 (en) * 2007-09-21 2009-03-26 Tokyo Electron Limited Film forming apparatus and film forming method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009038168A1 (en) * 2007-09-21 2009-03-26 Tokyo Electron Limited Film forming apparatus and film forming method
JPWO2009038168A1 (en) * 2007-09-21 2011-01-06 東京エレクトロン株式会社 Film forming apparatus and film forming method

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