JP2003156321A - Apparatus and method for measurement and electron beam irradiation apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus and a method for a measurement wherein the irradiation position of an electron beam can be measured precisely, so as to adjust the height of the irradiation position and to provide an electron beam irradiation apparatus. SOLUTION: In the electron beam irradiation apparatus, an electropneumatic regulator 22 is controlled, in order to move a rotary table 10 in a direction perpendicular to the direction of rotation and the radial direction of a disk master 1, a slide motor 11 is controlled, in order to move a slide table 6 to the direction of rotation and the radial direction of the disk master 1, two measuring parts in a height measuring part 21 are arranged on the fixed table 20 and/or the disk master 1, positions in a direction perpendicular to the direction of rotation and the radial direction of the disk master 1 are measured, on the basis of a value as the difference between measured values by the two measuring parts in the height measuring part 21, and the height of the disk master 1 on the rotary table 10 is adjusted to the height of the fixed table 20.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a measuring device, a measuring method and an electron beam irradiating device used for recording a master disc of an optical disc, for example.

[0002]

2. Description of the Related Art In recent years, there has been a demand for higher recording density in optical discs, and in order to realize this, it is necessary to form recording pits finer. For this reason, in the production of an optical disc master, an apparatus has been proposed which records information by irradiating the master with an electron beam capable of forming finer pits than the conventional laser light.

In the apparatus for recording information by irradiating the master with this electron beam, it is necessary to accurately adjust the height of the irradiation position of the electron beam corresponding to the master in order to enable highly accurate recording of information. There is.

Conventionally, as an electron beam irradiation apparatus provided with this electron beam height adjusting mechanism, there is one as shown in FIG. That is, in this apparatus, the reversing table 41 is rotatably provided in the vacuum container 40 by the reversing mechanism 42, and the motor 4 is provided on one end side of the reversing table 41.
3 is fixed, a master 45 is placed on a rotary table 44 attached to the rotary shaft of the motor 43, and the master 45 is irradiated with an electron beam from an electron beam irradiation means 46 to record information. is there.

In this apparatus, a height for adjusting the height of the irradiation position of the electron beam to the other end of the reversing table 41, that is, the end opposite to the rotating table 44 with the center of rotation of the reversing table 41 interposed therebetween. A matching table 47 is provided.

The height adjusting table 47 has its upper surface set to the same height as the master 45 placed on the rotary table 44. When recording information on the master 45, the height adjusting table 47 is first set. This height adjustment table 47 is provided with 47 attached to the electron beam irradiation means 46.
Electron beam irradiating means 46 by irradiating the upper surface of the
The height of the irradiation position of the electron beam is adjusted by, and then the reversing table 42 is rotated (reversed) by 180 degrees by the reversing mechanism 42 so that the master 45 corresponds to the electron beam irradiating means 46. Was irradiated to record information.

[0007]

However, the above-mentioned conventional electron beam irradiation apparatus having the electron beam height adjusting mechanism has the following problems. That is, since this conventional apparatus has a structure in which the master and the height matching table are inverted and moved, the distance between the master and the height matching table is large, and it is difficult to maintain both of them at exactly the same height. There was an inconvenience.

As described above, since the height adjusting mechanism using the laser light is premised on that the laser light is reflected and there is a return light, the target material having high transparency such as glass or acrylic plate is simply used. Cannot measure for height adjustment. Therefore, in order to measure for height adjustment, it is necessary to perform some work so that the laser light is reflected. Here, materials such as nylon and vinyl have a problem that they are melted or burned by the heat of laser light. Further, in a photoresist used for producing a semiconductor pattern or an optical disc master, there is a problem that only a portion irradiated with laser light is exposed. Further, when the surface of the object is rough, there is a disadvantage that the laser light is diffusely reflected and accurate measurement cannot be performed.

Further, as a means for positioning a substrate using an air micrometer for detecting a distance from a change in air pressure with respect to an object, JP-A-5-326363, JP-A-10-
Although there is No. 209011, the object is a substrate of a fixed semiconductor integrated circuit, and the object of the technology is different from that of the present application.

As a prior application of the applicant, Japanese Patent Application No. 200
There is an electron beam irradiation device and an electron beam irradiation method described in 1-54741.

Therefore, the present invention has been made in view of the above point, and a measuring device, a measuring method, and an electron beam irradiating device capable of performing accurate measurement for adjusting the height of the electron beam irradiation position. The challenge is to provide.

[0012]

A measuring device of the present invention has a reference table for giving a reference position and a measured table for moving a first position or an opposite direction to give a measured position. ,
In a measuring device for measuring a measured position of a measured base, a first control means for controlling the measured base to move in a first direction or an opposite direction, and supporting a reference base and a measured base. A movable table moving in a second direction or an opposite direction perpendicular to the first direction or the opposite direction, and second control means for controlling the movable table to move in the second direction or the opposite direction. The two measuring units are arranged on the reference table and / or the measured table, and the first direction or the opposite direction of the measured table is determined based on the difference between the measured values of the two measuring sections. And a measuring means for measuring the position of.

Further, the measuring method of the present invention has a reference table for giving a reference position and a measurement table for giving a measurement position by moving in the first direction or the opposite direction. In the measuring method for measuring the measured position, the step of moving the measured table in the vicinity of the reference position in the first direction or the opposite direction in advance and the movable table supporting the reference table and the measured table in the first direction. Alternatively, by moving in the second direction or the opposite direction perpendicular to the opposite direction, the two measuring units of the measuring means are arranged on the reference stand, and the difference value between the measured values of the two measuring units is calculated. Measuring the reference position of the reference table in the first direction or the opposite direction, and moving the movable table in the second direction or the opposite direction so that the two measuring units of the measuring means are placed on the reference table. And on the table to be measured to determine the difference between the measured values of the two measuring parts. Measuring the value of the difference between the positions of the reference table and the measured table in the first direction or the opposite direction, and the difference in the position of the reference table and the measured table in the first direction or the opposite direction. Until the value of is no longer present, the step of moving the table to be measured in the first direction or in the opposite direction is performed.

Further, the electron beam irradiation apparatus of the present invention has a support mechanism section having a slide table for rotatably and radially movably supporting an object to be irradiated with an electron beam, and a part on the object to be irradiated. And an electron beam irradiating means for irradiating an electron beam in a vacuum state, and a reference table for giving a reference position, and an object to be irradiated is placed to rotate the object and to rotate in a radial direction perpendicular to the radial direction. In an electron beam irradiation device that has a measured base that moves in a direction and gives a measured position, and measures the position of the irradiated body on the measured base, the measured base is rotated and the radial direction. A first control means for controlling to move in a direction perpendicular to the above, a second control means for controlling the support mechanism portion to rotate in the radial direction of the irradiated body, and two measuring portions as a reference. Place it on the table and / or on the irradiated object The value of the difference between the measured values of the two measurement unit based on those provided with measuring means for measuring the position of the rotational and radial and vertical direction of the irradiated object in the irradiation object.

Further, the electron beam irradiation apparatus of the present invention includes a support mechanism section having a slide table for rotatably and radially movably supporting an object to be irradiated with an electron beam, and a part on the object to be irradiated. And an electron beam irradiating means for irradiating an electron beam in a vacuum state, and a reference table for giving a reference position, and an object to be irradiated is placed to rotate the object and to rotate in a radial direction perpendicular to the radial direction. In the electron beam irradiation apparatus that has a measured base that moves in the direction and gives a measured position, and measures the position of the irradiation target on the measured base to focus the electron beam, First control means for controlling rotation and radial movement of the irradiated body, and second control means for controlling the support mechanism portion for rotation and radial movement of the irradiated body. And two measuring units on the reference stand and Alternatively, it is arranged on the irradiation target and the rotation of the irradiation target and the position of the irradiation target in the direction perpendicular to the radial direction are measured based on the value of the difference between the measurement values of the two measurement units, and the electronic measurement is performed. And a measuring means for focusing the beam.

Therefore, according to the present invention, the following operations are performed. The reference height measuring operation of the height adjusting operation will be described. First, the second control means sets the measuring means to a reference height corresponding to the reference table by an input signal for controlling the movement of the reference table provided on the support mechanism portion and the measured table in the radial direction of the irradiated object. Then, the measuring means measures the difference value between the reference positions of the reference table by measuring the difference value output from the two measuring units.

Next, of the height adjusting operations, an operation during height adjusting will be described. First, the second control means controls the measuring means on the reference table and the measurement table by an input signal for controlling the radial movement of the irradiation object of the reference table and the measurement table provided on the support mechanism section. Move to the height matching position corresponding to the irradiation target. Next, the measuring means measures the value of the difference between the height adjustment positions corresponding to the irradiation target on the reference table and the measured table by measuring the value of the difference detected by the two measuring sections.

Then, the first control means judges whether or not the measurement data of the difference value of the reference position and the measurement data of the difference value of the height adjusting position are equal. When the measurement data of the reference position and the measurement data of the height adjustment position are not equal to each other, the first control means changes the radial direction and the vertical direction of the irradiation target according to the signal of the difference value from the measurement means. The height adjustment input signal that controls the movement adjusts the height adjustment position corresponding to the irradiation target on the measurement base, until the measurement data of the reference position and the measurement data of the height adjustment position become equal,
The above processing and judgment are repeated.

[0019]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. Here, an electron beam irradiating device used for recording a master disc of an optical disc is illustrated, and as shown in FIG. 1, this device irradiates an electron beam b emitted from an electron gun 16 onto a disc master disc 1 as an irradiation target. To record a signal (form a recording bit of a signal pattern).

Further, although a vacuum environment is required for electron beam irradiation here, particularly in this apparatus, a partial vacuum system is used in which only the electron beam irradiation portion is placed in a vacuum state and the other portions are placed in the atmosphere. Has been adopted.

First, the support mechanism section 2 for supporting the master 1 in this apparatus will be described. A guide rail 4 is horizontally arranged on a base 3 of the apparatus, and both left and right ends thereof are fixed by fixing portions 5a and 5b, and a slide table 6 is fixed to the guide rail 4 on left and right leg portions 7a and 7b. It is movably supported by a bearing 8 provided.

Here, by using a hydrostatic air bearing as the bearing 8, it is possible to realize a highly accurate moving mechanism having extremely little frictional resistance when the slide table 6 is moved.

A rotary motor 9 which is a rotating means of the master 1 is fixed to the slide table 6,
The master 1 is horizontally mounted and supported on a rotary table 10 attached to the rotary shaft of the rotary motor 9.

An electromagnetically driven spindle motor is used as the rotary motor 9 for rotating the master disk, and the rotary motor 9 is driven based on a control signal from a control circuit, so that the master table 1 is integrated with the rotary table 10. Is to be rotated.

Here, the rotary motor 9 uses a hydrostatic air bearing as the bearing of the rotary shaft, so that the load due to frictional resistance during rotation is reduced and a highly accurate rotary mechanism with good responsiveness is realized. be able to.

In this apparatus, the chucking means for fixing and holding the master 1 on the rotary table 10 is as follows.
The vacuum adsorption method is adopted.

Further, between the slide table 6 and the base 3, a slide motor 11 as a moving means of the slide table 6 is arranged.

As the slide motor 11 for moving the slide table, an electromagnetic transfer drive type linear motor is used, that is, between the stator 11a on the base 3 side and the mover 11b on the slide table 6 side. In addition, for example, a voice coil type magnetic circuit is configured, and when the slide motor 11 is driven based on a control signal from the control circuit, the slide table 6 horizontally moves along the guide rail 4, The master 1 is moved integrally with this in the radial direction.

The master supporting mechanism 2 having the above-described structure
On the other hand, an electron beam irradiating means 13 for irradiating the electron beam with the master 1 partially in a vacuum state is fixedly arranged above it.

A vacuum chamber 14 is suspended and supported above the master 1. An electron beam column 15 is arranged inside the vacuum chamber 14, and an electron gun which is an electron beam excitation source upstream of the electron beam column 15. The electron beam b is emitted from 16.

An evacuation means consisting of a vacuum pump is connected to the vacuum chamber 14 in which the electron beam column 15 is built, and the evacuation means is used to evacuate the vacuum chamber 14.
The inside of the electron beam column 15 is vacuumed (1 × 10
^-4 [Pa]).

A static pressure levitation pad 18 is attached to the electron beam outlet at the lower end of the vacuum chamber 14 through an expansion and contraction connecting mechanism 17, and the static pressure levitation pad 18 is slightly smaller than the master 1 by about 5 μm. The electron beam b emitted from the electron gun 16 in such a state that it floats in a non-contact manner with a large gap and irradiates the master 1 through the electron beam passage at the center of the static pressure levitation pad 18.

Then, the static pressure levitation pad 18 causes an electron beam b to be emitted to the master 1 while a part of the master 1 is evacuated, and at the same time, the master 1 is rotated by driving the rotary motor 9 of the supporting mechanism 2. At the same time, the master 1 is moved in the radial direction by driving the slide motor 11, so that information is recorded on a predetermined track.

In the electron beam irradiation apparatus constructed as described above, since the partial vacuum system in which only the electron beam irradiation portion is evacuated is adopted, it is not necessary to maintain the vacuum in a large space. Means (vacuum pump)
Can be avoided, and the device can be constructed in a small size and at a low cost.

By the way, in this electron beam irradiation apparatus, in order to record information with high accuracy, it is necessary to accurately adjust the height of the irradiation position of the electron beam corresponding to the master.

As a mechanism for adjusting the height of the irradiation position of the electron beam, particularly in the electron beam irradiation apparatus of this example, FIG.
As shown in FIG. 3, a fixed table (stage 1) 20 for giving a reference position is fixedly arranged on the slide table 6 of the support mechanism portion 2 that supports the master 1. A height measuring unit 21 is arranged at the tip of the static pressure levitation pad 18 on the electron beam irradiation side.

The fixed table (stage 1) 20 is
It is fixed at a position adjacent to the master 1 placed on the rotary table 10 on the slide table 6 with a slight gap in the moving direction of the slide table 6, that is, at a position just to the right of the master 1 in this example. The upper surface serves as a reference surface by the height adjusting mechanism 21, and the upper surface of the master 1 placed on the rotary table (stage 2) 10 serves as a measuring surface by the height measuring unit 21. . Further, the rotary table 10 is controlled by the electropneumatic regulator 22 so that
It is configured to be movable in the radial direction and the vertical direction. Then, the operation of the electropneumatic regulator 22 is controlled according to the value measured by the height measuring unit 21 to move the rotary table 10 in the direction perpendicular to the radial direction of the master 1 so that the height of the upper surface of the master 1 becomes the height of the reference surface. I am trying to match.

As the height measuring section 21, an expansion / contraction mechanism utilizing pressure by gas or fluid, an expansion / contraction mechanism utilizing expansion / contraction by energization of a piezo element, and the like are conceivable. Especially in the former case, an electromagnetic field is generated. Since it does not adversely affect the irradiation of the electron beam, it can be preferably used.

FIG. 2 is a diagram showing the structure of the height adjusting mechanism. In FIG. 2, the height measuring unit 21 includes an air pipe 1 (28) to which an air supply unit is connected, and a nozzle 1 (23) provided at the tip of the air pipe 1 (28) so that air can be discharged.
An air micrometer 24 for detecting the pressure of the air exhausted from the nozzle 1 (23), an air pipe 2 (29) to which an air supply means is connected, and air is exhausted to the tip of the air pipe 2 (29). Nozzle 2 (25) provided so as to be possible, an air micrometer 26 for detecting the pressure of the air exhausted from the nozzle 2 (25), a pressure detected by the air micrometer 24 of the nozzle 1 (23) and the nozzle 2 (25), and a minute differential pressure gauge 27 for detecting a differential pressure voltage DV corresponding to a pressure difference detected by the air micrometer 26.

A fixed table (stage 1) 21 is fixed on the slide table 6, and a rotary table (stage 2) 10 is movable via an electropneumatic regulator 22 in the radial direction of the master 1. It is provided. A disk master 1 on a fixed table (stage 1) 21 and a rotary table (stage 2) 10 provided on the slide table 6 is provided via a slide motor 11 so as to be movable in the radial direction of the master 1.

The control unit 30 also controls the fine differential pressure gauge according to the difference between the pressure detected by the air micrometer 24 of the nozzle 1 (23) and the pressure detected by the air micrometer 26 of the nozzle 2 (25). The differential pressure voltage measuring unit 31 that measures the differential pressure voltage DV output from 27, and the movement of the electropneumatic regulator 22 in the radial direction and the vertical direction of the master 1 according to the differential pressure signal from the differential pressure voltage measuring unit 31. A height adjustment control unit 32 that outputs a height adjustment input signal HI to the electropneumatic regulator 22, and a fixed table (stage 1) 21 and a rotary table (stage 2) 10 provided on the slide table 6. A slide control unit 33 for supplying a slide input signal SI for controlling the radial movement of the master disc 1 to the master disc 1 to the slide motor 11 and the differential pressure voltage measuring unit 31. Composed of Te.

Here, the air micrometers 24, 26
Is for detecting the pressure at the time when the air pressurized at a constant rate is discharged from the tip, and the nozzle 1 (23), the nozzle 2
When the tip of (25) is in close contact with the disk master 1 on the fixed table (stage 1) 21 and the rotary table (stage 2) 10 which are the objects, the detected pressure becomes the same as the applied pressure, Nozzle 1 (23), nozzle 2 (2
When the tip of 5) is completely released, the detected pressure becomes the same as the atmospheric pressure, and during the contact and the release, the detected pressure changes according to the distance between the tip and the object. .

FIG. 3 is a block diagram of the electropneumatic regulator.
FIG. 4 is a block diagram of the electropneumatic regulator. 3 and 4, the electropneumatic regulator 22 includes a solenoid valve 34 for supplying air which is turned on or off to supply the supply pressure SP to the output pressure OP, and an exhaust valve which is turned on or off for discharging the supply pressure SP. In response to the electromagnetic valve 35, the pilot valve 36 that makes a part of the supply pressure SP the output pressure OP, the pressure sensor 37 that detects the output pressure OP, the height adjustment input signal HI and the detection signal from the pressure sensor 37. A control circuit 38 for controlling ON / OFF of the air supply solenoid valve 34 and the exhaust solenoid valve 35, and a pressure display section 39 for displaying the pressure detected by the pressure sensor 37 are configured. The control circuit 38 is supplied with the power supply Vcc.

The electropneumatic regulator 2 configured in this way
The operation of No. 2 will be described. When the height adjustment input signal HI supplied to the control circuit 38 increases, the air supply solenoid valve 34 is turned on and the exhaust solenoid valve 35 is turned off. Therefore, the supply pressure SP is applied to the pilot valve 36 through the air supply solenoid valve 34. And the pilot valve 36
The main valve of is opened, and a part of the supply pressure SP becomes the output pressure OP.

This output pressure OP is fed back to the control circuit 38 via the pressure sensor 37. Here, since the correction operation occurs until the output pressure OP proportional to the height adjustment input signal HI is reached, the output pressure OP proportional to the height adjustment input signal HI is always obtained.

Here, as the supply pressure SP, the supply pressures of the plurality of ranges N are assigned, and the output pressure OP proportional to the height adjustment input signal HI is output for each of the plurality of ranges N. Here, the voltage of the height adjustment input signal HI is, for example, 0 to 5
V, supply pressure SP is, for example, 0.7 Pa, output pressure O
P is, for example, 0 to 0.5 Pa.

FIG. 5 is a flow chart showing the height adjusting operation. FIG. 5 shows the operation of the height adjusting mechanism shown in FIG. In FIG. 5, initialization is performed in step S1. Specifically, each variable of the control unit 30 shown in FIG. 2 is initialized. In step S2, V to the voltage regulator
The bolt 2 outputs the stage 2 to the reference height. Specifically, the height adjustment controller 32 of the controller 30 shown in FIG.
Outputs a height adjustment input signal HI for controlling the movement of the electro-pneumatic regulator 22 in the radial direction and the vertical direction of the master 1 to the electro-pneumatic regulator 22, thereby causing the rotary table (stage 2) 10 to be in the vicinity of the reference position in advance. Move to the middle position.

In step S3, the stage is moved to the reference height measuring position corresponding to the stage 1. Specifically, the slide control unit 33 of the control unit 30 shown in FIG. 2 has a fixed table (stage 1) 21 and a rotary table (stage 2) 10 provided on the slide table 6 in the radial direction of the master 1. By supplying a slide input signal SI for controlling the movement of the table to the slide motor 11 and the differential pressure voltage measuring section 31, the height measuring section 21 is moved to the fixed table (stage 1) 21.
Move to the reference height measurement position corresponding to.

In step S4, the reference voltage is fetched n times. Specifically, the differential pressure / voltage measuring unit 31 of the control unit 30 shown in FIG. 2 is used for the air micrometer 2 of the nozzle 1 (23).
4 and the pressure detected by the air micrometer 26 of the nozzle 2 (25), the differential pressure voltage DV output from the fine differential pressure gauge 27 is measured according to the difference between the pressure and the fixed table (stage 1) The differential pressure voltage DV at the reference position 21 is measured n times.

In step S5, the average of the reference voltages is calculated. Specifically, the differential pressure voltage measuring unit 31 of the control unit 30 shown in FIG. 2 divides the n times measurement data data of the differential pressure voltage DV at the reference position of the fixed table (stage 1) 21 by n to obtain average data. Std (= data / n) is obtained. The reason for obtaining the average is that the differential pressure voltage DV is 0 in the ideal state, but actually the air pipe 1 (28) and the air pipe 2 (2
This is because the applied pressure in 9) does not become zero due to friction and air resistance.

The above-described operations from step S3 to step S5 are operations at the reference height measuring position among the positions of the height adjusting operation shown in FIG. 6A. First, the slide control unit 33 of the control unit 30 shown in FIG. 2 includes a fixed table (stage 1) 2 provided on the slide table 6.
1 and the rotary table (stage 2) 10 by supplying a slide input signal SI for controlling the radial movement of the master 1 to the slide motor 11 and the differential pressure voltage measuring section 31, thereby fixing the height measuring section 21 to the fixed table. Move to the reference height measurement position corresponding to (Stage 1) 21, and then
The differential pressure voltage measuring unit 31 of the control unit 30 shown in FIG. 2 measures the pressure detected by the air micrometer 24 of the nozzle 1 (23) and the pressure detected by the air micrometer 26 of the nozzle 2 (25). By measuring the differential pressure voltage DV output from the fine differential pressure gauge 27 according to the difference, the differential pressure voltage DV at the reference position of the fixed table (stage 1) 21 is set to n.
2, the differential pressure voltage measuring unit 31 of the control unit 30 shown in FIG. 2 divides the n times measurement data data of the differential pressure voltage DV at the reference position of the fixed table (stage 1) 21 by n and averages it. The data Std (= data / n) is obtained.

In step S6, the position is moved to the height matching position corresponding to the stage 1 and the stage 2. Specifically, the slide control unit 33 of the control unit 30 shown in FIG.
A slide input signal S for controlling the radial movement of the master 1 of the fixed table (stage 1) 21 and the rotary table (stage 2) 10 provided on the slide table 6.
By supplying I to the slide motor 11 and the differential pressure voltage measuring unit 31, the height measuring unit 21 is fixed to the fixed table (stage 1) 21 and the rotary table (stage 2).
Move to the height matching position corresponding to the master 1 on 10.

In step S7, the reference voltage is fetched n times. Specifically, the differential pressure / voltage measuring unit 31 of the control unit 30 shown in FIG. 2 is used for the air micrometer 2 of the nozzle 1 (23).
4 and the pressure detected by the air micrometer 26 of the nozzle 2 (25), the differential pressure voltage DV output from the fine differential pressure gauge 27 is measured according to the difference between the pressure and the fixed table (stage 1) 21 and the differential pressure voltage DV at the height matching position corresponding to the master 1 on the rotary table (stage 2) 10 are measured n times.

In step S8, the average of the differential pressure voltages at the height adjustment positions is calculated. Specifically, the control unit 3 shown in FIG.
The differential pressure voltage measuring unit 31 of 0 sets the n times measurement data data of the differential pressure voltage DV at the height matching position corresponding to the master 1 on the fixed table (stage 1) 21 and the rotary table (stage 2) to n. Divide average data Dat (= d
ata / n). Here, the larger the height difference, the higher the voltage. Further, the reason for obtaining the average is that the differential pressure voltage DV is 0 in the ideal state, as described above, but in reality the friction and the air resistance of the air pipe 1 (28) and the air pipe 2 (29) are Because it does not become 0.

In step S9, the average data S of the reference position
It is determined whether td is equal to the average data Dat of the height adjustment positions. Specifically, the control unit 3 shown in FIG.
The differential pressure voltage measuring unit 31 of 0 is the average data Std obtained by dividing the n times measured data data of the differential pressure voltage DV at the reference position by n.
And the measurement data d of the differential pressure voltage DV at the height adjusting position n times
It is determined whether or not the average data Dat obtained by dividing ata by n is equal. Here, since they are not completely equal to each other, a certain degree of error, for example, a voltage corresponding to a height within 1 μm is allowed.

In step S9, the average data St of the reference position
If d is equal to the height adjustment position average data Dat, the process proceeds to step S11, and if the reference position average data Std is not equal to the height adjustment position average data Dat in step S9, the step is performed. The process proceeds to S10. The operation when the average data Std of the reference position is equal to the average data Dat of the height adjustment position in step S9 is an operation at the height adjustment end position among the positions of the height adjustment operation shown in FIG. 6C. .

In step S9, the average data St of the reference position
When d is not equal to the average data Dat of the height adjustment position, the supply voltage of the electropneumatic regulator is adjusted in step S10. Specifically, the height adjustment control unit 32 of the control unit 30 shown in FIG. 2 moves in the direction perpendicular to the radial direction of the master 1 of the electropneumatic regulator 22 in accordance with the differential pressure signal from the differential pressure voltage measuring unit 31. The height adjustment position corresponding to the master 1 on the rotary table (stage 2) 10 is controlled by outputting the height adjustment input signal HI for controlling the movement of the electropneumatic regulator 22 to the electropneumatic regulator 22. After the adjustment, the process returns to step S7, and in step S9 the average data Std of the reference position and the average data D of the height adjustment position
Steps S7 to S1 are performed until at becomes equal.
The process and judgment up to 0 are repeated.

The above-described operations from step S6 to step S10 are operations at the height adjusting position among the positions of the height adjusting operation shown in FIG. 6B. First, the slide control unit 33 of the control unit 30 shown in FIG. 2 includes a fixed table (stage 1) 2 provided on the slide table 6.
1 and the rotary table (stage 2) 10 by supplying a slide input signal SI for controlling the radial movement of the master 1 to the slide motor 11 and the differential pressure voltage measuring section 31, thereby fixing the height measuring section 21 to the fixed table. (Stage 1) 21 and the rotary table (Stage 2) 10 are moved to the height matching position corresponding to the master 1. Next, FIG.
The differential voltage measuring unit 31 of the control unit 30 shown in FIG.
The differential pressure voltage DV output from the fine differential pressure gauge 27 is measured according to the difference between the pressure detected by the air micrometer 24 of (23) and the pressure detected by the air micrometer 26 of the nozzle 2 (25). As a result, the fixed table (stage 1) 21 and the rotary table (stage 2)
Differential pressure voltage D at the height matching position corresponding to master 1 on 10
Measure V n times.

Then, the differential voltage measuring section 31 of the control section 30 shown in FIG. 2 has a difference in height adjustment positions corresponding to the master 1 on the fixed table (stage 1) 21 and the rotary table (stage 2) 10. N times measurement data da of the piezoelectric voltage DV
Average data Dat (= data / n) by dividing ta by n
To get Here, the differential pressure voltage measuring unit 31 of the control unit 30 illustrated in FIG. 2 uses the average data Std obtained by dividing the n times measured data data of the differential pressure voltage DV at the reference position by n, and the differential pressure at the height adjustment position. It is determined whether or not the average data Dat obtained by dividing the measurement data data of the voltage DV n times by n is equal. When the average data Std of the reference position and the average data Dat of the height adjustment position are not equal, the control unit 3 shown in FIG.
The height adjustment control unit 32 of 0 controls the movement of the electropneumatic regulator 22 in the radial direction and the vertical direction of the master 1 according to the differential pressure signal from the differential pressure voltage measuring unit 31.
Is output to the electropneumatic regulator 22 to control the operation of the electropneumatic regulator 22 to adjust the height matching position corresponding to the master 1 on the rotary table (stage 2) 10, and to obtain the average data Std of the reference position. , And the above-described processing and determination are repeated until the average data Dat of the height adjustment positions become equal.

In step S9, the average data St of the reference position
When d and the average data Dat of the height adjustment positions become equal, in step S11, a plurality of ranges N of the reference position
The average data StdN at the applied pressure of is calculated. Specifically, the differential voltage measuring unit 31 of the control unit 30 shown in FIG.
Average data Std (= data / n) N at the boost pressures of a plurality of ranges N is obtained by dividing n times measured data data of the differential pressure voltage DV at the reference position of the fixed table (stage 1) 21 by n.
To get The reason why the average of the applied pressures of the plurality of ranges N is calculated is that the detected values do not change linearly with respect to the applied pressures of all the ranges due to the characteristics of the air micrometers 24 and 26. Therefore, steps S3 to S5 described above are repeated over the pressurization pressures of a plurality of ranges N.

In step S12, it is determined whether or not the average data StdN at the pressurization pressures of the plurality of ranges N at the reference position and the average data DatN at the pressurization pressures of the plurality of ranges N at the height adjustment position are equal. Specifically, the differential pressure voltage measuring unit 31 of the control unit 30 shown in FIG.
Average data S obtained by dividing n times measured data of V by n
It is determined whether or not td is equal to the average data Dat at the supply pressures of the plurality of ranges N obtained by dividing the n times measured data data of the differential pressure voltage DV at the height adjustment position by n.

In step S12, a plurality of ranges N of reference positions
When the average data StdN at the pressurizing pressure and the average data DatN at the pressurizing pressures of the plurality of ranges N at the height adjustment position are equal, the process ends, and in step S12, the average at the pressurizing pressure of the plurality of ranges N at the reference position. When the data StdN and the average data DatN at the pressurization pressures of the plurality of ranges N at the height adjustment position are not equal, the process proceeds to step S13. In step S12, the operation when the average data StdN at the pressurization pressure of the plurality of ranges N at the reference position and the average data DatN at the pressurization pressure of the plurality of ranges N at the height adjustment position are equal to each other,
It is an operation at a height adjustment end position among the respective positions of the height adjustment operation shown in FIG. 6C.

In step S12, a plurality of ranges N of reference positions
When the average data StdN at the pressurizing pressure and the average data DatN at the pressurizing pressures of the plurality of ranges N at the height adjusting positions are not equal to each other, the supply voltage of the electropneumatic regulator is adjusted in step S13. Specifically, the control unit 3 shown in FIG.
The height adjustment control unit 32 of 0 controls the movement of the electropneumatic regulator 22 in the radial direction and the vertical direction of the master 1 according to the differential pressure signal from the differential pressure voltage measuring unit 31.
Is output to the electropneumatic regulator 22 to control the operation of the electropneumatic regulator 22 to adjust the height alignment position corresponding to the master 1 on the rotary table (stage 2) 10, and then the process returns to step S11. In S12, average data StdN at the pressurization pressure of the plurality of ranges N at the reference position
And the average data DatN at the pressurizing pressures of the plurality of ranges N at the height adjustment position become equal to each other, the processes and determinations in steps S11 to S13 are repeated. That is, steps S6 to S10 described above are repeated until the detected values of the air micrometers 24 and 26 for the stage 1 and the stage 2 are within a certain range over the applied pressures of the plurality of ranges N.

Here, an example of the method of controlling the supply voltage of the electropneumatic regulator in the above-mentioned steps S10 and S13 will be described. FIG. 7 is a diagram showing an electropneumatic regulator voltage and height matching points. 7, the horizontal axis represents time T0 to T17, and the right vertical axis represents the control unit 3 shown in FIG.
The voltage V supplied to the electropneumatic regulator 22 via the height adjustment input signal HI supplied from the height adjustment controller 32 of 0.
0 to V17, the left side of the vertical axis is in the direction perpendicular to the radial direction of the master 1 of the electropneumatic regulator 22 according to the height adjustment input signal HI supplied from the height adjustment control unit 32 of the control unit 30 shown in FIG. The height adjustment positions H0 to H17 corresponding to the master 1 on the rotary table (stage 2) 10 by the movement of the.

At time T0, when the voltage supplied to the electropneumatic regulator 22 is the voltage V0, the height of the master 1 on the rotary table (stage 2) becomes the height H0, which is higher than the height adjustment point P. The price is high.

Therefore, from the time T1 to the time T3, the supply voltage of the electropneumatic regulator 22 is lowered by a constant voltage to obtain the voltage V1.
~ Voltage V3. At the time of T1, the electropneumatic regulator 22
When the voltage supplied to V is smaller than the voltage V0, the height of the master 1 on the rotary table (stage 2) 10 is lower than the height H0 but still higher than the height adjustment point P. The height is high. At time T2, when the voltage supplied to the electropneumatic regulator 22 is the voltage V2 smaller than the voltage V1, the master 1 on the rotary table (stage 2) 10
The height H is equal to the height matching point P which is smaller than the height H1 and is the same as the height H2, but the height is about to be lower than the height matching point P because the voltage drop width is large.
At time T3, when the voltage supplied to the electropneumatic regulator 22 is the voltage V3 smaller than the voltage V2, the height of the master 1 on the rotary table (stage 2) 10 becomes the height H3 lower than the height H2. The height is lower than the height matching point P.

Therefore, from the time point T4 to the time point T7, the supply voltage of the electropneumatic regulator 22 is increased by a constant voltage smaller than the falling width of the voltage V1 to the voltage V3 described above to the voltage V4 to the voltage V7. At time T4, when the voltage supplied to the electropneumatic regulator 22 is the voltage V4 which is higher than the voltage V3, the height of the master 1 on the rotary table (stage 2) becomes the height H4 higher than the height H3. The height is still lower than the height matching point P. At time T5, the voltage V5 supplied to the electropneumatic regulator 22 is higher than the voltage V4.
At this time, the height of the master 1 on the rotary table (stage 2) 10 is the same height H5 as the height adjustment point P higher than the height H4, but the height of the height adjustment point is large because the voltage rise width is large. It tries to be taller than P.

At time T6, when the voltage supplied to the electropneumatic regulator 22 is the voltage V6 which is larger than the voltage V5, the height of the master 1 on the rotary table (stage 2) 10 is the height H.
The height H6 is higher than 5, but the height is higher than the height matching point P. At time T7, when the voltage supplied to the electropneumatic regulator 22 is the voltage V7 which is higher than the voltage V6, the height of the master 1 on the rotary table (stage 2) becomes the height H7 higher than the height H6. The height is higher than the height matching point P.

Therefore, from the time T8 to the time T13, the supply voltage of the electropneumatic regulator 22 is lowered by a constant voltage smaller than the rising width of the voltage V4 to the voltage V7 described above, and the voltage V8 to the voltage V8.
The voltage is set to V13. Electropneumatic regulator 22 at T8
When the voltage supplied to V is smaller than the voltage V7, the height of the master 1 on the rotary table (stage 2) 10 is lower than the height H7, but still higher than the height matching point P. The height is high. At time T9, when the voltage supplied to the electropneumatic regulator 22 is a voltage V9 smaller than the voltage V8, the master 1 on the rotary table (stage 2) 10
The height H is lower than the height H8 and is higher than the height matching point P. At time T10, when the voltage supplied to the electropneumatic regulator 22 is a voltage V10 smaller than the voltage V9, the rotary table (stage 2) 1
The height of the master 1 on 0 is a height H10 lower than the height H9, but is still higher than the height matching point P.

At time T11, when the voltage supplied to the electropneumatic regulator 22 is a voltage V11 smaller than the voltage V10, the height of the master 1 on the rotary table (stage 2) 10 is adjusted to be lower than the height H10. Although the height H11 is the same as that of the point P, the height tends to be lower than that of the height-matching point P because the width of the voltage drop is large. T12
At this time, when the voltage supplied to the electropneumatic regulator 22 is the voltage V12 which is smaller than the voltage V11, the height of the master 1 on the rotary table (stage 2) becomes the height H12 which is lower than the height H11, but is high. The height is lower than the matching point P. At time T13, when the voltage supplied to the electropneumatic regulator 22 is the voltage V13 lower than the voltage V12, the height of the master 1 on the rotary table (stage 2) 10 becomes the height H13 lower than the height H12. The height is lower than the height matching point P.

Therefore, from the time point T14 to the time point T17, the supply voltage of the electropneumatic regulator 22 is increased by a constant voltage smaller than the falling width of the voltage V8 to the voltage V13.
14 to voltage V17. At time T14, when the voltage supplied to the electropneumatic regulator 22 is the voltage V14 which is higher than the voltage V13, the height of the master 1 on the rotary table (stage 2) becomes higher than the height H13. The height is still lower than the height matching point P. At time T15, the voltage supplied to the electropneumatic regulator 22 is the voltage V
When the voltage V15 is higher than 14, the height of the master 1 on the rotary table (stage 2) 10 is higher than the height H14, but is still lower than the height adjustment point P. At time T16, when the voltage supplied to the electropneumatic regulator 22 is the voltage V16 which is higher than the voltage V15, the height of the master 1 on the rotary table (stage 2) 10 becomes higher than the height H15. The height is still lower than the height matching point P. At time T17, when the voltage supplied to the electropneumatic regulator 22 is a voltage V17 higher than the voltage V16, the height of the master 1 on the rotary table (stage 2) 10 is the same as the height adjustment point P, that is, the height H1.
It becomes 7.

Here, from the time point T1 to the time point T3, the supply voltage of the electropneumatic regulator 22 is lowered by a constant voltage to obtain the voltage V1.
The voltage V1 is set to the voltage V3, but the decrease width is set to 0.5 V, for example, and the voltage V1 to the voltage V described above is applied from the time T4 to the time T7.
Although the supply voltage of the electropneumatic regulator 22 is increased by a constant voltage smaller than the falling width of 3 to the voltage V4 to the voltage V7,
This rise width is set to 0.3 V, for example, from T8 to T13.
Until the time point, the supply voltage of the electropneumatic regulator 22 was lowered by a constant voltage smaller than the rising width of the voltage V4 to the voltage V7 described above to the voltage V8 to the voltage V13. Up to time T17, the supply voltage of the electropneumatic regulator 22 is increased by a constant voltage smaller than the falling width of the voltage V8 to the voltage V13 described above to obtain the voltage V1
The increase width may be set to 0.1 V, for example, from 4 to V17.

In the above-described embodiment, in the electron beam irradiation apparatus having the height adjusting mechanism, the differential pressure between the air micrometers 24 and 26 for the stage 1 and the stage 2 by the height measuring unit 21 shown in FIG. The voltage DV is measured by the differential pressure voltage measuring unit 31 of the control unit 30 shown in FIG.
The height adjustment control signal 32 is supplied from the height adjustment control unit 32 of the control unit 30 shown in FIG. 2 to the electropneumatic regulator 22, and the electropneumatic regulator 22 supplies the master 1 according to the height adjustment input signal HI.
Although an example in which the height adjustment corresponding to the master 1 on the rotary table (stage 2) 10 is controlled by performing the movement in the radial direction and the vertical direction is shown, the invention is not limited to this, and the height shown in FIG. The measuring unit 21 may be used for focusing in an electron beam irradiation device having a height adjusting mechanism. in this case,
The configuration is similar to that shown in FIG. 2, and the operation is similar to that shown in FIG.

It is needless to say that the present invention is not limited to this embodiment described above, but may be applied to other embodiments within the scope of the present invention.

[0075]

The measuring device of the present invention has a reference table for giving a reference position and a measurement table for giving a measurement position by moving in the first direction or the opposite direction. In the measuring device that measures the measured position of the
Controlling to move in or out of direction 1
Control means, a movable table that supports the reference table and the measured table, and moves in a second direction or an opposite direction perpendicular to the first direction or the opposite direction, and the movable table in the second direction or the opposite direction. Second control means for controlling to move in the direction of
The two measuring units are arranged on the reference table and / or the measured table, and based on the value of the difference between the measured values of the two measuring sections, the first direction or the opposite direction of the measured table is measured. Since the measuring means for measuring the position is provided, the position of the reference table is first measured from the value of the difference between the measured values of the two measuring parts of the measuring means, and then the value of the difference between the reference table and the measured table is measured. However, since the height of the measured table can be adjusted until the difference value disappears,
Reflectance, transmittance (transparent, semi-transparent, opaque) of the measurement target,
It is possible to adjust the height without depending on the temperature, and it is possible to measure even the material that is exposed to light such as resist or the material that is weak to heat. It is possible to adjust the height without knowing the height, and it is possible to adjust the height even if transparent, semi-transparent, or opaque materials are attached. It is not necessary to consider the influence of (air resistance), and the system can be constructed at a lower cost than the height matching system using a laser.

Further, in the above-described measuring apparatus of the present invention, since the table to be measured is rotatable about the rotation axis in the first direction or the opposite direction, the rotating body is placed on the table to be measured. The height can be adjusted in the state.

Further, in the above-described measuring device of the present invention, since the two measuring parts of the measuring means detect the pressure at the time when the constantly pressurized air is discharged from the tip, It is possible to detect the pressure according to the distance between the tip and the object regardless of the material.

Further, the measuring method of the present invention has a reference table for giving a reference position and a measurement table for moving a measurement position in the first direction or the opposite direction to give a measurement position. In the measuring method for measuring the measured position, the step of moving the measured table in the vicinity of the reference position in the first direction or the opposite direction in advance and the movable table supporting the reference table and the measured table in the first direction. Alternatively, by moving in the second direction or the opposite direction perpendicular to the opposite direction, the two measuring units of the measuring means are arranged on the reference stand, and the difference value between the measured values of the two measuring units is calculated. Measuring the reference position of the reference table in the first direction or the opposite direction, and moving the movable table in the second direction or the opposite direction so that the two measuring units of the measuring means are placed on the reference table. And the difference between the measured values of the two measuring units Measuring the value of the difference between the position of the reference table and the measured table in the first direction or the opposite direction based on the value, and the step of measuring the value of the difference between the positions of the reference table and the measured table in the first direction or the opposite direction. The step of moving the measured table in the first direction or the opposite direction until there is no difference value is provided. Therefore, first, the position of the reference table is measured from the difference value between the measured values of the two measurement units, Next, the difference value between the reference table and the measured table can be measured, and the height of the measured table can be adjusted until the difference value disappears. Therefore, the reflectance and transmittance (transparent, semi-transparent, It is possible to adjust the height without depending on (opaque), and it is also possible to measure even materials that are exposed to light, such as resist, or materials that are weak to heat. You can adjust the height without knowing the target thickness. Further, there is a bonding transparent, translucent, opaque material can also be the height adjustment, also - external factors (friction coefficient
There is an effect that it is not necessary to consider the influence of (air resistance) and the system can be constructed more easily than the height matching method using a laser.

Further, the electron beam irradiation apparatus of the present invention is
A support mechanism section having a slide table for rotatably and radially movably supporting an object to be irradiated with an electron beam, and an electron beam irradiating means for irradiating the object with a partially vacuum state on the object to be irradiated with the electron beam. A reference table configured to have a reference position, and a measurement table for mounting the irradiation target and rotating the irradiation target and moving in the direction perpendicular to the radial direction to provide the measurement position. In the electron beam irradiation apparatus for measuring the position of the irradiation target on the measurement target, the first control for rotating the measurement target to rotate the irradiation target and to move in a direction perpendicular to the radial direction. A control means, a second control means for controlling the support mechanism part to rotate and move the irradiation object in the radial direction, and two measuring parts are arranged on the reference table and / or the irradiation object. The irradiation target based on the difference between the measured values of the two measuring units Since the measurement means for rotating and measuring the position of the irradiation target in the direction perpendicular to the radial direction is provided, the measurement values of the two measurement units of the measurement means for measuring the height alignment position for electron beam irradiation are The position of the reference table is first measured from the difference value, then the difference value between the reference table and the irradiated object on the measured table is measured, and the height of the irradiated object on the measured table is measured until the difference value disappears. Since the height can be adjusted, the height can be adjusted without depending on the reflectance and the transmittance (transparent, semi-transparent, opaque) of the irradiated object. It is possible to measure even a material that is liable to heat or a material that is susceptible to heat, and by measuring the absolute distance, you can adjust the height even if you do not know the thickness of the target. Even if the materials are laminated, it is possible to adjust the height. In addition, it is not necessary to consider the influence of external factors (friction coefficient, air resistance),
Further, there is an effect that the system can be constructed at a lower cost than the height matching system using the laser.

Further, the electron beam irradiation apparatus of the present invention is
In the above description, since the two measuring parts of the measuring means detect the pressure at the time when the constantly pressurized air is released from the tip, the tip part and the object are not affected by the material of the irradiated object. It is possible to detect the pressure according to the distance.

Further, the electron beam irradiation apparatus of the present invention is
In the above description, since the two measuring parts of the measuring means are provided at the tip of the electron beam irradiating means, there is an effect that the height of the irradiation position of the electron beam corresponding to the irradiation object can be accurately adjusted.

The electron beam irradiation apparatus of the present invention is
A support mechanism section having a slide table for rotatably and radially movably supporting an object to be irradiated with an electron beam, and an electron beam irradiating means for irradiating the object with a partially vacuum state on the object to be irradiated with the electron beam. A reference table configured to have a reference position, and a measurement table for mounting the irradiation target and rotating the irradiation target and moving in the direction perpendicular to the radial direction to provide the measurement position. In the electron beam irradiation device that has the position of the irradiation target on the measurement target and focuses the electron beam, the measurement target is rotated and moved in a direction perpendicular to the radial direction. Control means for controlling the rotation of the irradiation target object and second control means for controlling the movement of the support mechanism part in the radial direction, and the two measuring parts on the reference table and / or the target part. Two measuring units placed on the irradiation body Based on the value of the difference between the measured values, the rotation of the irradiation target and the measurement means for measuring the position of the irradiation target in the direction perpendicular to the radial direction and the measuring means for focusing the electron beam are provided. First, the position of the reference base is measured from the value of the difference between the measurement values of the two measurement units of the measurement means for measuring the height adjustment position for electron beam focusing, and then on the reference base and the measurement target table. It is possible to measure the difference value of the irradiated object and adjust the height of the irradiated object on the measuring table until the difference value disappears. It is possible to adjust the height without depending on whether it is transparent or opaque), and it is possible to measure even materials that are exposed to light, such as resist, or materials that are weak to heat, and absolute distance measurement. Allows you to adjust the height without knowing the target thickness It is possible to,
In addition, even if transparent, semi-transparent, and opaque materials are laminated, the height can be adjusted, and there is no need to consider the influence of external factors (friction coefficient, air resistance). It is possible to construct the system at a lower cost than a height matching system using a laser.

[Brief description of drawings]

FIG. 1 is a diagram showing a configuration of an electron beam irradiation apparatus provided with a height adjusting mechanism applied to this embodiment.

FIG. 2 is a view showing a height adjusting mechanism.

FIG. 3 is a configuration diagram of an electropneumatic regulator.

FIG. 4 is a block diagram of an electropneumatic regulator.

FIG. 5 is a flowchart showing an operation of height adjustment.

FIG. 6 is a diagram showing each position of the height adjusting operation.
A is the reference height measurement position, FIG. 6B is the height adjustment position, and FIG.
C is the height adjustment end position.

FIG. 7 is a diagram showing a supply voltage of an electropneumatic regulator and height matching points.

FIG. 8 is a diagram showing a configuration of an electron beam irradiation apparatus including a conventional height adjusting mechanism.

[Explanation of symbols]

1 ... Disk master, 2 ... Support mechanism part, 3 ... Base,
4 ... Guide rail, 5 ... Fixed part, 6 ... Slide table, 7 ... Leg part, 8 ... Bearing, 9 ... Rotation motor, 10 ... Rotation table (stage 2), 11 ... Slide motor , 13 ... Electron beam irradiation means, 14 ...
… Vacuum chamber, 15… Electron beam column, 16…
… Electron gun, 17 …… Expansion and expansion coupling mechanism, 18 …… Static pressure floating pad, 20 …… Fixed table (stage 1), 21 ……
Height measuring section, b ... Electron beam, 22 ... Electropneumatic regulator, 23 ... Nozzle 1, 24 ... Air micrometer, 25 ... Nozzle 2, 26 ... Air micrometer,
27 ... Fine differential pressure gauge, 28 ... Air piping 1, 29 ... Air piping 2, 30 ... Control section, 31 ... Differential pressure voltage measuring section, 3
2 ... Height adjustment control unit, 33 ... Slide control unit,

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ identification code FI theme code (reference) G11B 7/26 501 G11B 7/26 501 G21K 5/04 G21K 5/04 CM 5/10 5/10 T H01L 21/027 H01L 21/30 541L 541F F Term (reference) 2F066 AA01 AA28 BB06 CC40 DD03 DD07 DD11 FF06 HH13 JJ11 LL02 LL03 MM03 2F069 AA02 BB40 GG04 HH0909H16 BA08 BA10 BB10 CB22 CB32 CC05 EA14

Claims (8)

[Claims] 1. A reference stage for giving a reference position, and a measured stage for moving a first direction or an opposite direction to give a measured position. The measured position of the measured stage is measured. In the measuring device, the first control means for controlling the measurement base to move in the first direction or the opposite direction, and the first direction supporting the reference base and the measurement base. Or a movable table moving in a second direction or an opposite direction perpendicular to the opposite direction, and a second control means for controlling the movable table to move in the second direction or the opposite direction, One measuring section is arranged on the reference table and / or the measured table, and the first direction of the measured table is measured based on the difference between the measured values of the two measuring sections. A measuring means for measuring the position in the opposite direction, and The measurement device. 2. The measuring device according to claim 1, wherein the measured table is rotatable about a rotation axis in the first direction or the opposite direction. 3. The measuring device according to claim 1, wherein the two measuring units of the measuring unit detect a pressure at the time when the air constantly pressurized is discharged from the tip. Measuring device. 4. A reference stage for giving a reference position, and a measured stage for moving a first direction or an opposite direction to give a measured position. The measured position of the measured stage is measured. In the measuring method described above, the step of moving the measured table in the vicinity of the reference position in the first direction or the opposite direction in advance, and the movable table supporting the reference table and the measured table in the first direction. Alternatively, by moving in the second direction or the opposite direction perpendicular to the opposite direction, the two measuring units of the measuring means are arranged on the reference table, and the difference between the measured values of the two measuring units is measured. Measuring the reference position of the reference table in the first direction or the opposite direction based on the value, and moving the movable table in the second direction or the opposite direction to measure The measuring unit is on the above-mentioned reference stand and above-mentioned measured stand. And measuring the value of the difference between the positions of the reference table and the measured table in the first direction or the opposite direction based on the value of the difference between the measurement values of the two measurement units, Moving the measured table in the first direction or the opposite direction until the value of the difference between the positions of the reference table and the measured table in the first direction or the opposite direction disappears. A measuring method characterized by that. 5. A support mechanism section having a slide table for rotatably and radially movably supporting an object to be irradiated with an electron beam, and a partial vacuum state on the object to be irradiated to generate an electron beam. An electron beam irradiating means for irradiating, a reference table for giving a reference position, the irradiation target is placed, and the irradiation target is rotated and moved in a direction perpendicular to the radial direction. In the electron beam irradiation apparatus having a measurement base for giving a measurement position and measuring the position of the irradiation target on the measurement base, the measurement base is perpendicular to the rotation and radial direction of the irradiation target. The first control means for controlling to move in the direction of, and the second control means for controlling the support mechanism part to rotate and move the irradiation target object in the radial direction, and two measuring parts. On the reference table and / or above the irradiated body And measuring means for measuring the rotation of the irradiated body and the position of the irradiated body in a direction perpendicular to the radial direction based on the value of the difference between the measured values of the two measuring units. An electron beam irradiation device characterized by the above. 6. The electron beam irradiation apparatus according to claim 5, wherein the two measuring units of the measuring unit detect a pressure at which the air which is constantly pressurized is discharged from the tip. Characteristic electron beam irradiation device. 7. The electron beam irradiation apparatus according to claim 5, wherein the two measuring units of the measuring unit are provided at a tip of the electron beam irradiating unit. 8. A support mechanism section having a slide table for rotatably and radially movably supporting an object to be irradiated with an electron beam, and a partial vacuum state on the object to be irradiated to form an electron beam. An electron beam irradiating means for irradiating, a reference table for giving a reference position, the irradiation target is placed, and the irradiation target is rotated and moved in a direction perpendicular to the radial direction. An electron beam irradiation apparatus having a measurement base for giving a measurement position and measuring the position of the irradiation target on the measurement base to focus an electron beam, wherein the measurement base is irradiated with the irradiation target. First control means for controlling rotation of the body and movement in a direction perpendicular to the radial direction, and second control means for controlling the support mechanism portion for rotation and movement of the irradiation target in the radial direction. And two measuring units on the above standard stand And / or is arranged on the irradiation target, and based on the value of the difference between the measurement values of the two measurement units, rotation of the irradiation target and movement of the irradiation target in a direction perpendicular to the radial direction. An electron beam irradiation apparatus comprising: a measuring unit that measures a position to focus an electron beam.