JP2003154659A - Ink jet print head, ink jet printer comprising it, and method for manufacturing ink jet print head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To decrease positional shift between a heating resistor and an ink ejection nozzle. SOLUTION: In the method for manufacturing a print head comprising a nozzle sheet 2 having ink ejection nozzles 3 formed therein, a head frame 4 for supporting the nozzle sheet 2, a substrate member 6 having heating resistors 8, and a channel plate 12 for supplying ink wherein the head frame 4 and the substrate member 6 have a substantially equal coefficient of linear expansion, the nozzle sheet 2 has a coefficient of linear expansion larger than that of the head frame 4 and the substrate member 6, and the channel plate 12 is formed of a material having Young's modulus smaller than that of steel, the nozzle sheet 2 and the head frame 4 are bonded at a temperature higher than the room temperature, the nozzle sheet 2 and the substrate member 6 are bonded at a temperature higher than the room temperature but lower than the bonding temperature of the nozzle sheet 2 and the head frame 4, and the channel plate 12 and the nozzle sheet 2, and the head frame 4 and the substrate member 6 are bonded at a temperature lower than the bonding temperature of the nozzle sheet 2 and the head frame 4.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ink jet print head for ejecting ink from an ink ejection nozzle to record an image on a recording medium, an ink jet printer provided with the ink jet print head, and a method for manufacturing the ink jet print head. More specifically, the present invention relates to a technique for minimizing the positional deviation between the heating resistor for ejecting ink from the ink ejection nozzle and the ink ejection nozzle.

[0002]

2. Description of the Related Art Conventionally, ink bubbles are generated by rapidly heating a heating resistor provided in an ink pressurizing chamber by covering one surface of the ink pressurizing chamber with a nozzle sheet having minute ink ejecting nozzles. There is known a print head of a type in which an ink droplet is ejected from an ink ejection nozzle by the force of. As an example of the print head of the above method,
17 and 18 show a serial print head a.

The print head a constitutes (limits) one end face of the ink pressurizing chamber b, and comprises a substrate member d having a heating resistor c and two end faces different from the end face of the ink pressurizing chamber b. And a nozzle sheet g having a plurality of ink ejection nozzles h and forming end faces different from the three end faces of the ink pressurizing chamber b. The substrate member d includes a semiconductor substrate e made of silicon or the like, and a heating resistor c deposited and formed on one surface of the semiconductor substrate e.

The barrier layer f is made of, for example, an exposure hardening type dry film resist, and is laminated on the entire surface of the semiconductor substrate e on which the heating resistor c is formed, and then an unnecessary portion is removed by a photolithography process. By doing
Has been formed. The nozzle sheet g is formed by, for example, an electroforming technique using nickel, and the substrate is arranged so that the position of the ink discharge nozzle h matches the position of the heat generating resistor c, that is, the ink discharge nozzle h faces the heat generating resistor c. It is laminated on the barrier layer f of the member d.

The ink pressurizing chamber b formed by the substrate member d, the barrier layer f and the nozzle sheet g as described above is connected to the ink supply passage i. The heat generating resistor c in the ink pressurizing chamber b is electrically connected to an external circuit via a conductor portion (not shown) formed on the semiconductor substrate e. In general, one print head a has 100
A plurality of heating resistors c in units and the heating resistors c
The ink pressurizing chamber b is provided with, and each of the heat generating resistors c is uniquely selected by a command from the control unit of the printer, and the ink in the ink pressurizing chamber b corresponding to the heat generating resistor c is Ink ejection nozzle h facing the pressure chamber b
Can be discharged from.

That is, in the print head a, an ink tank (not shown) connected to the print head a
Therefore, the ink is filled in the ink pressurizing chamber b through the ink flow path i. Then, for a short time, for example, in the heating resistor c,
The heating resistor c is rapidly heated by passing the pulse current for 1 to 3 microseconds, and as a result, the heating resistor c is heated.
Vapor-phase ink bubbles are generated in the area that contacts with, and the expansion of the ink bubbles displaces a certain volume of ink.
As a result, an ink of the same volume as the displaced ink in the portion in contact with the ink ejection nozzle h is ejected from the ink ejection nozzle h as an ink droplet and adheres (landes) on a recording medium such as paper.

[0007]

In the above-described print head a, the positional relationship between the heating resistor c (ink pressurizing chamber b) and the ink ejection nozzle h affects the ejection characteristics of ink droplets. If the positional displacement between the two becomes large, it may cause a decrease in the ejection speed of the ink droplets, a disturbance in the ejection direction, or the like, and in some cases ejection becomes impossible. Therefore, the positional deviation between the heating resistor c (ink pressurizing chamber b) and the ink discharge nozzle h leads to a reduction in printing quality, which is a serious problem.

In the manufacturing process of the print head a, there is generally a heating process. For example, the nozzle sheet g is laminated (bonded) after the barrier layer f is formed on the semiconductor substrate e. However, in order to cure the barrier layer f and fix the nozzle sheet g (adhesion), the nozzle sheet g is heated at a high temperature. A thermosetting process is performed. Further, the curing step for obtaining the ink resistance of the barrier layer f made of the dry film resist is also performed at a high temperature.

As described above, the heating process is required in the manufacturing process of the print head a. By the way, for example, silicon (the linear expansion coefficient of silicon is about 3.5 × 10 ⁻⁶ [K ⁻¹ ]), which is a material of the semiconductor substrate e, and nickel (the linear expansion coefficient of nickel, which is a material of the nozzle sheet g, for example). Is about 1.3 × 10 ⁻⁵ [K ⁻¹ ]), and the linear expansion coefficient is different by almost one digit. When materials with greatly different linear expansion coefficients are pasted together in the heating process, when the temperature is returned to room temperature after the heating process is completed, the relative position of the two due to the difference in their expansion / contraction ratios (linear expansion coefficients). Misalignment occurs, and in reality, as shown in FIG. 19, the ink ejection nozzles h face the respective heating resistors c and are not in a positional relationship. Then, such a positional deviation becomes larger as the difference in linear expansion coefficient between the members to be bonded is larger.

That is, as shown in FIG. 19, with respect to one substrate member d, in a certain portion (a), the heating resistor c (ink pressurizing chamber b) and the ink ejection nozzle h are in a positional relationship of facing each other. However, at a position (b) apart from that position, a positional deviation occurs between the heating resistor c (ink pressurizing chamber b) and the ink discharge nozzle h, and at a position (c) further away from the position, the ink discharge nozzle h is It is also displaced from the ink pressurizing chamber b. Then, such positional deviation becomes larger as the bonded members become larger.

As described above, as the heat generating resistor c (ink pressurizing chamber b) and the ink ejection nozzle h are displaced from each other (see FIG. 19 (b)), the ejection direction is displaced, and further displaced. When the amount becomes large (see FIG. 19 (c)), ink ejection becomes impossible. In addition to the above-mentioned problems, the print head a may be changed due to a temperature change in the surrounding environment in which the print head a is placed, including the manufacturing of the print head a and the storage and use of the inkjet printer using the print head a. In some cases, the print head a may be deformed or destroyed due to the stress between the constituent members caused by the difference in the coefficient of thermal expansion between the constituent members.

On the other hand, there is a demand in the printer market for increasing the printing speed, and as one means for achieving this, the number of ink ejection nozzles h for ejecting ink may be increased. In this case, when the number of ink ejection nozzles h increases with the same resolution, the size of the print head a increases, and as described above, the heating resistor c (ink pressurization chamber b) due to the difference in linear expansion coefficient is generated. ) And the ink misalignment nozzle h are misaligned. For example, in the case of a large print head a such as a line head, the influence of the positional deviation between the heat generating resistor c (ink pressurizing chamber b) and the ink ejection nozzle h becomes more remarkable and is extremely important. It becomes a problem.

Therefore, the problem to be solved by the present invention is to provide an ink jet print head in which the positional deviation between the heating resistor and the ink ejection nozzle is made as small as possible, an ink jet printer provided with the same, and a method for manufacturing the ink jet print head. Is to provide. Furthermore, the difference in the coefficient of thermal expansion of the constituent members of the inkjet print head is affected by temperature changes in the inkjet print head and the surrounding environment where the inkjet printer using the inkjet print head is placed, including during manufacturing of the inkjet print head. (EN) An inkjet print head capable of preventing deformation or breakage of the inkjet print head due to stresses between the respective constituent members, an inkjet printer including the inkjet print head, and a method for manufacturing the inkjet print head.

[0014]

The present invention solves the above-mentioned problems by the following solving means. According to a first aspect of the present invention, a nozzle sheet that forms an end surface of the ink pressurizing chamber and has a plurality of ink ejection nozzles formed thereon, a head frame that supports the nozzle sheet by adhering the nozzle sheet, The nozzle sheet has an end face different from the end face of the ink pressurizing chamber, has a heating resistor facing the ink ejecting nozzle and ejecting ink in the ink pressurizing chamber from the ink ejecting nozzle, and the nozzle sheet. A substrate member bonded to the ink pressure chamber and an ink channel for supplying ink to the ink pressurizing chamber, and a channel plate bonded to at least one of the nozzle sheet, the head frame or the substrate member. In the inkjet print head, the linear expansion coefficient of the head frame and the substrate member are substantially equal, and the linear expansion coefficient of the nozzle sheet is It said head frame and greater than the linear expansion coefficient of the substrate member, the flow channel plate is characterized in that it is formed of a material having a smaller Young's modulus than the Young's modulus of the steel. Further, the invention of claim 7 is an inkjet printer comprising the inkjet print head having the above-mentioned configuration.

According to a fourth aspect of the present invention, a nozzle sheet that constitutes an end face of the ink pressurizing chamber and has a plurality of ink ejection nozzles is adhered, and the nozzle sheet is adhered to support the nozzle sheet. A head frame and an end surface different from the end surface of the ink pressurizing chamber are formed, and a heating resistor is provided facing the ink ejecting nozzle to eject ink in the ink pressurizing chamber from the ink ejecting nozzle. A substrate member bonded to the nozzle sheet, and an ink flow path for supplying ink to the ink pressurizing chamber, and bonded to at least one of the nozzle sheet, the head frame, or the substrate member. An ink jet print head including a flow path plate, wherein the head frame and the substrate member have substantially the same linear expansion coefficient, Linear expansion coefficient of the over DOO is greater than the linear expansion coefficient of the head frame and the substrate member, the said flow path plate, wherein the cutout portion for facilitating deformation is formed. Further, the invention of claim 10 is an ink jet printer comprising the ink jet print head having the above structure.

According to a thirteenth aspect of the present invention, the nozzle sheet, which constitutes the end face of the ink pressurizing chamber and in which a plurality of ink ejection nozzles are formed, is adhered to the nozzle sheet to support the nozzle sheet. A head frame and an end surface different from the end surface of the ink pressurizing chamber are formed, and a heating resistor is provided facing the ink ejecting nozzle to eject ink in the ink pressurizing chamber from the ink ejecting nozzle. A substrate member bonded to the nozzle sheet, and an ink flow path for supplying ink to the ink pressurizing chamber, and bonded to at least one of the nozzle sheet, the head frame, or the substrate member. An ink jet print head including a flow path plate, wherein the linear expansion coefficients of the head frame and the substrate member are substantially equal to each other. Linear expansion coefficient of the sheet is smaller than the linear expansion coefficient of the head frame and the substrate member, the flow channel plate is characterized in that it is formed of a material having a smaller Young's modulus than the Young's modulus of the steel. Further, the invention of claim 19 is an inkjet printer comprising the inkjet print head having the above-mentioned configuration.

Furthermore, in the sixteenth aspect of the present invention, the nozzle sheet that constitutes the end surface of the ink pressurizing chamber and has a plurality of ink discharge nozzles formed thereon, and the nozzle sheet is adhered to support the nozzle sheet. A head frame and an end surface different from the end surface of the ink pressurizing chamber, and has a heating resistor facing the ink ejecting nozzle and ejecting ink in the ink pressurizing chamber from the ink ejecting nozzle. And a substrate member bonded to the nozzle sheet and an ink flow path for supplying ink to the ink pressurizing chamber, and bonded to at least one of the nozzle sheet, the head frame or the substrate member. An ink jet print head including a flow path plate, wherein the linear expansion coefficients of the head frame and the substrate member are substantially equal to each other. Coefficient of linear expansion of the nozzle sheet is smaller than the linear expansion coefficient of the head frame and the substrate member, the said flow path plate, wherein the cutout portion for facilitating deformation is formed. Further, claim 2
A second aspect of the invention is an ink jet printer including the ink jet print head having the above configuration.

In addition, the invention of claim 25 is characterized in that a nozzle sheet, which constitutes an end face of the ink pressurizing chamber, is formed with a plurality of ink ejection nozzles, a head frame for supporting the nozzle sheet, and the ink pressurizing chamber. And a substrate member having an end face different from the end face and having a heating resistor facing the ink ejection nozzle and ejecting ink in the ink pressurizing chamber from the ink ejecting nozzle, and the ink pressurizing chamber. The head frame and the substrate member have substantially the same linear expansion coefficient, and a linear expansion coefficient of the nozzle sheet is the same as that of the head frame and the flow path plate that forms an ink flow path for supplying ink. The ink jet print head is made of a material having a Young's modulus greater than that of the substrate member and less than that of steel. A first bonding step of bonding the nozzle sheet and the head frame in a temperature environment higher than room temperature, the substrate member and the nozzle sheet being higher than room temperature, and the first method. The second bonding step of bonding under a temperature environment equal to or lower than the temperature in the bonding step, the flow path plate, and at least one of the nozzle sheet, the head frame, or the substrate member, the temperature in the first bonding step. And a third bonding step of bonding under the following temperature environment.

According to a twenty-sixth aspect of the present invention, a nozzle sheet that constitutes an end face of the ink pressurizing chamber and has a plurality of ink ejection nozzles formed thereon, a head frame that supports the nozzle sheet, and the ink pressurizing chamber is provided. A substrate member that forms an end face different from the end face and that has a heating resistor facing the ink ejection nozzle and ejecting the ink in the ink pressurizing chamber from the ink ejecting nozzle; and ink in the ink pressurizing chamber. A head plate and the substrate, the linear expansion coefficient of the head frame and the substrate member being substantially equal, and the linear expansion coefficient of the nozzle sheet. A method of manufacturing an inkjet print head, wherein the flow path plate has a coefficient of linear expansion greater than that of the member, and a cutout portion is formed in the flow path plate to facilitate deformation. A first bonding step of bonding the nozzle sheet and the head frame in a temperature environment higher than room temperature, and a temperature of the substrate member and the nozzle sheet higher than room temperature and lower than the temperature in the first bonding step. The second bonding step of bonding under the temperature environment of, the flow path plate, and at least one of the nozzle sheet, the head frame or the substrate member under a temperature environment of the temperature in the first bonding step or less. And a third bonding step of bonding.

According to a twenty-seventh aspect of the present invention, a nozzle sheet which constitutes an end face of the ink pressurizing chamber and has a plurality of ink ejection nozzles formed thereon, a head frame which supports the nozzle sheet, and the ink pressurizing chamber is provided. A substrate member that forms an end face different from the end face and that has a heating resistor facing the ink ejection nozzle and ejecting the ink in the ink pressurizing chamber from the ink ejecting nozzle; and ink in the ink pressurizing chamber. A head plate and the substrate, the linear expansion coefficient of the head frame and the substrate member being substantially equal, and the linear expansion coefficient of the nozzle sheet. The ink jet print head is made of a material having a Young's modulus smaller than that of steel and smaller than the linear expansion coefficient of the member. A first bonding step of bonding the nozzle sheet and the head frame in a temperature environment lower than room temperature, and the substrate member and the nozzle sheet at a temperature equal to or higher than the temperature in the first bonding step. A second bonding step of bonding in a temperature environment, the flow path plate, and at least one of the nozzle sheet, the head frame, or the substrate member are bonded in a temperature environment equal to or higher than the temperature in the first bonding step. And a third bonding step.

According to a twenty-eighth aspect of the present invention, a nozzle sheet which constitutes an end face of the ink pressurizing chamber and has a plurality of ink ejection nozzles formed thereon, a head frame which supports the nozzle sheet, and the ink pressurizing chamber is provided. A substrate member that forms an end face different from the end face and that has a heating resistor facing the ink ejection nozzle and ejecting the ink in the ink pressurizing chamber from the ink ejecting nozzle; and ink in the ink pressurizing chamber. A head plate and the substrate, the linear expansion coefficient of the head frame and the substrate member being substantially equal, and the linear expansion coefficient of the nozzle sheet. A method for manufacturing an ink jet print head, which has a linear expansion coefficient smaller than that of a member and has a cutout portion formed on the flow path plate for facilitating deformation. A first bonding step of bonding the nozzle sheet and the head frame in a temperature environment lower than room temperature, and a substrate member and the nozzle sheet in a temperature environment equal to or higher than the temperature in the first bonding step. Second to glue
An adhesion step, the flow path plate, at least one of the nozzle sheet, the head frame or the substrate member,
A third bonding step of bonding under a temperature environment equal to or higher than the temperature of the first bonding step.

(Operation) In the ink jet print head according to the present invention, the nozzle sheet, the head frame and the substrate member are bonded together, and the flow path plate and at least one of the nozzle sheet, the head frame and the substrate member are bonded together. It Here, in the inkjet print head, firstly, the linear expansion coefficient of the head frame and the substrate member are substantially equal to each other, and the linear expansion coefficient of the nozzle sheet is larger than the linear expansion coefficients of the head frame and the substrate member. Therefore, since the nozzle sheet and the head frame are bonded to each other, the nozzle sheet follows the expansion and contraction of the head frame having high rigidity when the temperature changes. Therefore, if the nozzle sheet is adhered to the head frame at a high temperature, the nozzle sheet will be stretched under a temperature environment lower than the temperature at the time of adhering the nozzle sheet and the head frame, for example, in the subsequent manufacturing process or use of the inkjet print head. Maintain a good condition.

Further, the ink jet print head is
Secondly, the linear expansion coefficients of the head frame and the substrate member are substantially equal, and the linear expansion coefficient of the nozzle sheet is smaller than the linear expansion coefficients of the head frame and the substrate member. Therefore, since the nozzle sheet and the head frame are bonded to each other, the nozzle sheet follows the expansion and contraction of the head frame having high rigidity when the temperature changes. Therefore, if the nozzle sheet is adhered to the head frame at a low temperature, the nozzle sheet will be stretched under a temperature environment higher than the temperature at the time of adhering the nozzle sheet and the head frame, for example, during the subsequent manufacturing process or use of the inkjet print head. Maintain a good condition.

Furthermore, the flow path plate of the ink jet print head is firstly formed of a material having a Young's modulus smaller than that of steel. Therefore, even if a difference in expansion and contraction occurs between the flow path plate and the member bonded to the flow path plate due to temperature change, the flow path plate is more likely to be deformed than other members. Further, the flow path plate of the inkjet print head has, secondly, a cutout portion for facilitating deformation. Therefore, even if a difference in expansion and contraction occurs between the flow path plate and the member bonded to the flow path plate due to temperature change, the flow path plate is easily deformed due to the deformation of the cutout portion.

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described below. (First Embodiment) FIGS. 1 and 2 are perspective views showing a print head 1 for a full-color bubble inkjet printer. The print head 1 includes a head assembly 11
And a plurality of flow path plates 12. Head assembly 11
Is a combination of the nozzle sheet 2, the head frame 4, and the plurality of substrate members 6.

The nozzle sheet 2 constitutes an end face of the ink pressurizing chamber 9 (see FIGS. 3 and 4), and has a large number of ink ejection nozzles 3 (FIGS. 3 to 4) for cyan, yellow, magenta, and black inks. 5) is formed. Such a nozzle sheet 2 has, for example, a thickness of 15 μm to 20 μm.
The ink discharge nozzles 3 each having a diameter of about 20 μm are formed in an aligned state (see FIGS. 3 to 5).

A large number of substrate members 6 are attached to the nozzle sheet 2 via barrier layers 10 (see FIGS. 2, 3, and 4). The substrate member 6 constitutes an end surface different from the end surface of the ink pressurizing chamber 9, faces the ink ejecting nozzle 3, and generates heat in order to eject the ink in the ink pressurizing chamber 9 from the ink ejecting nozzle 3. The body 8 (see FIG. 4) is formed. The heating resistor 8 is formed by deposition on one surface of the semiconductor substrate 7 made of silicon. The barrier layer 10 is laminated on the surface of the semiconductor substrate 7 on which the heating resistor 8 is formed, and defines (configures) the side surface (end surface) of the ink pressurizing chamber 9, that is, serves as a side wall portion ( (See FIGS. 3 and 4).

The barrier layer 10 is made of, for example, an exposure hardening type dry film resist, and is laminated on the entire surface of the semiconductor substrate 7 on which the heating resistor 8 is formed, and then an unnecessary portion is removed by a photolithography process. It is formed by The thickness of the barrier layer 10 is about 12μ.
m, and the heating resistor 8 has a square shape with one side of about 18 μm. The width of the ink pressurizing chamber 9 is about 25 μm.
m.

A head frame 4 is attached to the nozzle sheet 2. The head frame 4 supports the nozzle sheet 2, and has a thickness of 5 mm, for example.
And three crosspiece members 4b are integrally formed in a bridging manner at equal intervals between the short sides of the outer frame 4a having a rectangular shape. As a result, the head frame 4 is formed in a state where four rectangular spaces 5 are arranged in parallel (see FIG. 2). The length of these spaces 5 is, for example, a length (about 21 cm) corresponding to the width of A4 size.

As an example, in the case of a line printer that uses, for example, A4 size paper by conveying it in the vertical direction, the number of ink ejection nozzles 3 formed on the nozzle sheet 2 in one space 5 of the head frame 4. Is about 5,000, and the number of substrate members 6 (one color) bonded to the nozzle sheet 2 in this range is 16. Therefore, the number of ink ejection nozzles 3 corresponding to one substrate member 6 is three.
It will be around 10. Therefore, it is impossible to accurately represent these numbers and sizes in the drawings whose size is limited. Therefore, in each drawing, they are exaggerated or omitted for easy understanding. .

Furthermore, the nozzle sheet 2 is provided with the flow path plate 1
2 are pasted together. The flow path plate 12 has an ink supply pipe 17 and constitutes an ink flow path 18 for supplying ink to the ink pressurizing chamber 9. The flow path plate 12 is
One ink is provided for each color, and in the present embodiment, four inks are provided.
Four are provided corresponding to the colors. The flow path plate 12 has a chamber portion 13 fitted in the space 5 of the head frame 4.
And a continuous flange portion 14 on one surface of the chamber portion 13 (FIGS. 2 and 4).
reference). The flange portion 14 is formed such that its area in the longitudinal direction is larger than the area of the space 5 of the head frame 4 in the longitudinal direction. The chamber portion 13 has a space 15 opened on the end surface on the side opposite to the side where the flange portion 14 is formed, and the substrate member 6 is positioned on the wall portion that defines both sides of the space 15. Notch recess 16 for
Are formed in communication with the space 15 (see FIGS. 3 and 4).

Further, the chamber portion 13 of the flange portion 14
An ink supply pipe 17 is provided so as to project from the side opposite to the surface where the ink is continuous, and the ink supply pipe 17 communicates with the space 15 (see FIGS. 1, 2, and 4). Flow path plate 12
Is attached to the head frame 4 with the chamber portion 13 fitted in the space 5 of the head frame 4 and the flange portion 14 in contact with the outer frame 4a and the crosspiece portion 4b of the head frame 4 (adhesion). ) It is fixed. Then, the substrate member 6 bonded to the nozzle sheet 2
Is located in the notch recess 16 formed in the chamber portion 13 of the flow path plate 12 and is bonded to the chamber portion 13 (see FIGS. 3 and 4).

As described above, by coupling the flow channel plate 12 to the head assembly 11, a closed space surrounded by the chamber portion 13 of the flow channel plate 12 and the nozzle sheet 2 is formed. Will be communicated with the outside only through the ink supply pipe 17. And the substrate member 6
Is an ink flow path between rows of the substrate members 6 located in the closed space and arranged in a staggered manner while partially overlapping each other when viewed with respect to one closed space. 18 is formed, and the ink pressurizing chamber 9 is in communication with the ink flow path 18 (see FIG. 3).

Ink supply pipe 17 provided on the flow path plate 12
Are separately connected to ink tanks (not shown) that store inks of different colors, respectively, so that each ink flow path 18 and ink pressurizing chamber 9 of the print head 1 can be connected.
Is filled with ink.

When the print head 1 is driven, the heating resistor 8 formed on the substrate member 6 and an external control section (not shown) are connected to the flexible substrate 19 (one color ink in FIGS. 1 and 2). (Only shown) are controlled by being electrically connected. Here, although not shown, the connection piece 19a of the flexible substrate 19 extends to the position of the substrate member 6 through the gap 20 (see FIG. 4) formed between the head frame 4 and the flow path plate 12 to generate heat. It is electrically connected to each of the resistors 8.

In the above print head 1, the head frame 4 and the substrate member 6 have a linear expansion coefficient (temperature 1).
It refers to the amount of expansion and contraction per unit length of an object caused by changes in ° C, and is also called the linear expansion coefficient. same as below. ) Are formed of substantially equal materials. In this embodiment, the substrate member 6 (semiconductor substrate 7), the linear expansion coefficient of about 3.5 × 10 ^{- 6}
It is formed of [K ⁻¹ ] silicon. The head frame 4 has a coefficient of linear expansion of about 3.5 × 10 ⁻⁶ [K
⁻¹ ] of silicon nitride, which is almost the same as silicon.

On the other hand, the nozzle sheet 2 is made of a material having a coefficient of linear expansion larger than that of the head frame 4 and the substrate member 6. In this embodiment, the nozzle sheet 2 is made of nickel having a linear expansion coefficient of about 1.3 × 10 ⁻⁵ [K ⁻¹ ]. The flow path plate 12 is formed of a hard elastomer or resin material having ink resistance. Specifically, when the flow path plate 12 is formed of the hard elastomer, it is formed of NBR (acrylonitrile-butadiene rubber), EPM (ethylene-propylene rubber), EPDM (ethylene-propylene-diene rubber), or the like. It Thus, the thermal expansion coefficient of the channel plate 12 is about 0.1 to 10 × 10 ^- a ^{4 [K -1],} have a very large value when compared to the head frame 4 or the substrate member 6. The Young's modulus of the flow path plate 12 is about 1 to 100 ×.
10 ⁶ [Pa (N / m ² )], which is the Young's modulus of the steel and is approximately 2.05 to 2.1 × 10 ¹¹ [Pa (N / m ² ).
² )] is small.

Further, when the flow path plate 12 is made of a resin material, it is made of PE (polyethylene), PS (polystyrene) or the like having ink resistance. In this case, the coefficient of thermal expansion of the flow path plate 12 is about 1 to 25 × 10.
^-5 [K ^-1 ] and has a large value as compared with the above-described head frame 4 or substrate member 6. The Young's modulus is about 0.1 to 10 × 10 ⁹ [Pa (N / m
² )] and the Young's modulus of steel is 2.05 to 2.1.
It is small when compared with × 10 ¹¹ [Pa (N / m ² )].

In the print head 1 having the above structure,
The heating resistor 8 is rapidly heated by passing a current pulse through the heating resistor 8 which is uniquely selected by a command from the control unit of the printer for a short time, for example, 1 to 3 microseconds.

As a result, gas-phase ink bubbles are generated in the portion in contact with the heating resistor 8, and a certain volume of ink is displaced by the expansion of the ink bubbles, whereby the displacement in the portion in contact with the ink discharge nozzle 3 is pushed out. The ink having the same volume as the ejected ink is ejected as an ink droplet from the ink ejection nozzle 3 and is attached (landed) on a recording medium such as paper. Then, the ink pressurizing chamber 9 from which the ink has been ejected is immediately replenished with the same amount of ink as the amount ejected through the ink flow path 18.

Next, a manufacturing process of the print head 1 having the above structure will be described. 5 to 9 are views for explaining the manufacturing process of the print head 1. First, FIG.
As shown in FIG. 5, the nozzle sheet 2 is formed by electroforming nickel or a material containing nickel, and the nozzle sheet 2 is placed on the support jig 21 having a flat surface. The reason why the nozzle sheet 2 is placed on the support jig 21 is that the nozzle sheet 2 is extremely thin and cannot hold its shape by itself.

Then, as shown in FIG. 6, the head frame 4 is attached to the nozzle sheet 2 mounted on the supporting jig 21 by using a thermosetting type sheet adhesive, for example, an epoxy resin type sheet adhesive. Bonding (first bonding step). In FIG. 6, the portions 2'and 4'indicated by broken lines in the nozzle sheet 2 and the head frame 4 conceptually show the amount of expansion caused by being placed under the temperature environment (high temperature) at the time of bonding. Is.

Next, the supporting jig 21 is removed, and
As shown in, the substrate member 6 is bonded to the nozzle sheet 2 (second bonding step). Since FIG. 7 conceptually shows the process, only seven substrate members 6 are shown for each color. Also, the space for the common channel formed in the center is omitted.

Here, the temperature at the time of bonding in the first bonding step and the second bonding step will be described. Figure 10 is a transition due to temperature change of the formation interval of ink discharge nozzles 3 formed in the nozzle sheet 2 (nozzle spacing) L _A [μm], formation interval of the heating resistor 8 formed on the substrate member 6 ( FIG. 6 is a graph showing a transition between heaters) L _B [μm] due to temperature change. In FIG. 10, the straight line A is
It is those showing a change due to temperature change in the case where the inter-nozzle spacing at room temperature T _R and L _1, line B is at room temperature T _R
Heater spacing shows the changes due to a temperature change in the case of the L ₂ in.

The straight lines A and B respectively have a coefficient of linear expansion of the nozzle sheet 2 of α ₁ (α ₁ is about 1.3 × 10 5).
^-5 [K ⁻¹ ]), the linear expansion coefficient of the substrate member 6 (semiconductor substrate 7) is α ₂ (α ₂ is about 3.5 × 10 5
^{-6 K -1]),} if the temperature is T _{[K], A: L A = L 1} + L 1 α 1 (T-T R) B: L B = L 2 + L 2 α 2 (T- T _{R) (however, L 2> L 1, T} R is represented by RT).

[0045] Therefore, at room temperature (about 15-25 ° C.) _T a temperature higher than _R, the temperature T of intersection between straight lines A and B
= T ₁ (150 ° C. in the present embodiment, that is, 423
At K), the nozzle sheet 2 and the head frame 4 are attached to each other. By bonding the nozzle sheet 2 and the head frame 4 at temperatures T _1, the bonding temperature T ₁ of temperatures below the head frame 4, in order to have sufficient stiffness with a thickness of 5 mm, the nozzle sheet 2 follows the contraction of the head frame 4.

Further, the linear expansion coefficient of the head frame 4 is
Since the coefficient of linear expansion of the nozzle sheet 2 is smaller than that of the nozzle sheet 2, when the temperature of the nozzle sheet 2 decreases from the bonding temperature T ₁ ,
Since the amount of contraction becomes larger than that of the head frame 4, the state becomes tense, that is, tense. The distance between the ink ejection nozzles 3 formed on the nozzle sheet 2 (inter-nozzle distance) follows the contraction of the head frame 4.

That is, the coefficient of linear expansion of the head frame 4 is preferably smaller than that of the nozzle sheet 2. This is because, when the nozzle sheet 2 and the head frame 4 are pasted together at a high temperature (temperature T ₁ ) and then returned to room temperature, the nozzle sheet 2 is
Depending on whether (1) the force is applied in the pulling direction or (2) the force is applied in the contracting direction, if the linear expansion coefficient of the head frame 4 is larger than that of the nozzle sheet 2, Force is applied to the nozzle sheet 2
This is because there is a possibility that irregularities (wrinkles) that may cause the positional deviation between the ink discharge nozzle 3 and the heating resistor 8 may occur.

Further, the nozzle sheet 2 and the head frame 4
It is desirable that the bonding temperature T ₁ for bonding with is higher than the temperature in any subsequent process. Thereby, during the process after the nozzle sheet 2 and the head frame 4 are bonded together, the nozzle sheet 2 is always in a tensioned state, and it is possible to prevent wrinkles from occurring in the nozzle sheet 2.

Next, in the second bonding step, the nozzle sheet 2 is heated at a temperature T = T ₂ which is lower than the temperature T ₁ and higher than the room temperature T _R (105 ° C. in this embodiment, that is, 378 K).
And the substrate member 6 are attached to each other. Since the bonding of the nozzle sheet 2 and the substrate member 6 is performed by thermosetting the barrier layer 10, this bonding temperature is set to the barrier layer 1.
It depends largely on the property of 0 and is not limited to 105 ° C., but it is necessary that the temperature is not higher than the bonding temperature of the nozzle sheet 2 and the head frame 4 described above.

Further, since the linear expansion coefficient of the head frame 4 is substantially the same as the linear expansion coefficient of the substrate member 6 as described above, the nozzle interval and the heater interval are substantially the same under the same temperature. . Therefore, the positional deviation between the heating resistor 8 (ink pressurizing chamber 9) and the ink ejection nozzle 3 does not occur.

When the print head is completed,
The nozzle spacing in the
It depends on the resolution required for the printer
L_Two Is determined as a design value. This
L required in case of₁ Is the linear expansion of the nozzle sheet 2.
Rate α₁ , Linear expansion coefficient of the semiconductor substrate 7 (head frame 4
Is also the coefficient of linear expansion of_Two , Nozzle sheet 2 and head
Bonding temperature T with frame 4₁ , The bonding temperature
Degree T₁ And room temperature T_R Difference ΔT (ΔT = T₁ -T _R )
Then, back calculation from FIG. L₁ = L_Two (Α_Two ΔT + 1) / (α₁ ΔT + 1) Can be obtained from

By the way, in manufacturing variation of the nozzle sheet 2, there may be a nozzle spacing of at room temperature T _R or too or, too long short for L _1. In such a case, the temperature can be adjusted by changing the bonding temperature between the nozzle sheet 2 and the head frame 4.

As described above, the head assembly 11 is formed as shown in FIG. Next, as shown in FIG. 9, the flow path plate assembly 22 assembled in another process is installed in the head assembly 11 under a temperature environment below the bonding temperature (150 ° C.) of the nozzle sheet 2 and the head frame 4. (The flow path plate 12 is bonded to the substrate member 6, the head frame 4, and the nozzle sheet 2; and the third bonding step). The flow channel plate assembly 22 is formed by integrally coupling four flow channel plates 12 and is assembled by a coupling member (not shown).

In the print head 1 described above, the linear expansion coefficient is substantially equal to the linear expansion coefficient of silicon, which is the material of the semiconductor substrate 7 which is the base material of the substrate member 6, and the nozzle sheet 2 has a linear expansion coefficient. A head frame 4 formed of silicon nitride having a linear expansion coefficient smaller than that of the linear expansion coefficient is attached to the nozzle sheet 2 at a temperature T ₁ higher than room temperature, and then a substrate is heated at a temperature T ₂ lower than the temperature T _{1 and} higher than room temperature. Since the member 6 is attached to the nozzle sheet 2, the interval between the ink discharge nozzles 3 formed on the nozzle sheet 2 and the interval between the heating resistors 8 of the substrate member 6 is set to a value equal to or lower than the temperature T _1. It is possible to obtain the print head 1 which can be always matched and has good ink ejection performance.
Then, after the nozzle sheet 2 and the head frame 4 are bonded to each other at a high temperature, when returning to room temperature, the head frame 4
As a result, a force is applied in the direction in which the nozzle sheet 2 is pulled, so that it is possible to prevent unevenness (wrinkles) from occurring in the nozzle sheet 2.

Therefore, even if the size of the substrate member 6 is increased and the number of the heating resistors 8 per one substrate member 6, that is, the number of the ink discharge nozzles 3 per one substrate member 6 is increased, the ink discharge nozzles are also increased. 3 is less likely to be misaligned with the heating resistor 8. Therefore, the size of the print head 1 is easily increased, and it is particularly suitable for forming a print head having a long span such as a print head for a line printer.

In addition, the nozzle sheet 2 and the head frame 4
By bonding and, it is possible to give the nozzle sheet 2 a great rigidity, and as described above, it is possible to form a print head for a line printer by integrating print heads for four colors.

By the way, since the flow path plate 12 is made of the hard elastomer or resin material as described above,
When the temperature changes, it expands and contracts more than other members. However, since the flow path plate 12 is formed of a hard elastomer or a resin material, when the temperature changes, as compared with the nozzle sheet 2, the head frame 4, and the substrate member 6 bonded to the flow path plate 12. , Can be easily transformed. Therefore, when a temperature change occurs, only the flow path plate 12 is deformed, the nozzle sheet 2, the head frame 4, and the substrate member 6 are not distorted, and no stress acts on them. Therefore, it is possible to prevent the nozzle sheet 2 from being distorted and damaging the nozzle sheet 2.

As described above, the flow path plate 12 has the highest bonding temperature T ₁ (15) between the nozzle sheet 2 and the head frame 4 in the bonding process.
Bonding is performed under a temperature environment of 0 ° C. or less. Because
If the nozzle sheet 2 and the head frame 4 are already attached to each other when they are attached in a temperature environment higher than the temperature T ₁ in the attaching step, the nozzle sheet 2 receives a force in a contracting direction, so that the nozzle sheet 2 is wrinkled. This is because if the flow path plate 12 is bonded in such a state, the nozzle sheet 2 will be bonded in the state where wrinkles are generated, and the nozzle position accuracy will be deteriorated. Therefore,
The flow path plate 12 needs to be bonded in a temperature environment of temperature T ₁ or lower in the bonding step.

In this embodiment, the flow path plate 12, the substrate member 6, the head frame 4 and the nozzle sheet 2 are bonded together. However, although the flow path plate 12 is bonded to at least the substrate member 6, the flow path plate 12 and the head frame 4 are bonded to each other as necessary. Also,
The flow channel plate 12 and the nozzle sheet 2 are bonded to each other in a region where the substrate member 6 does not exist, but depending on the arrangement of the substrate member 6, it may not be necessary to bond the flow channel plate 12 and the nozzle sheet 2. .

Further, in the present embodiment, the print head for a full color bubble ink jet printer has been described, but the ink jet print head according to the present invention is also applicable as a mono color printer and for a full color printer. Even when it is applied as the print head of, the print head is not limited to the above-described four-color integrated type, but may be configured as an independent print head for each color.

FIG. 11 shows the configuration of a full-color bubble inkjet type line printer 23 having the four-color integrated print head 1 of this embodiment. The line printer 23 is formed by being housed in a rectangular casing 24 as a whole, and a paper tray 25 accommodating paper 26 as a recording medium is attached from a tray inlet / outlet formed on the front surface of the casing 24. The paper 26 can be fed.

When the paper tray 25 is thus mounted on the line printer 23 from the tray entrance / exit, the paper 26 is pressed against the paper feed roller 27 by a predetermined mechanism, and the rotation of the paper feed roller 27 causes the arrow A to move. As shown in the direction of FIG.
Is sent to the back side of. Line printer 23
A reversing roller 28 is disposed on the paper feeding side, and the feeding direction of the paper 26 is switched to the front direction by the rotation of the reversing roller 28 or the like, as indicated by arrow B.

In the line printer 23, the paper 26 whose paper feed direction is thus switched to the direction indicated by the arrow B is conveyed by the spur roller 29 or the like so as to traverse over the paper tray 25, and is indicated by the arrow C. Then, it is discharged from the discharge port arranged on the front side of the line printer 23. In the line printer 23, as shown by an arrow D, the head cartridge 30 is replaceably arranged between the spur roller 29 and the discharge port.

In the head cartridge 30, the print head 1 in which yellow, magenta, cyan, and black line heads are respectively arranged is arranged on the lower surface side of a holder 31 of a predetermined shape, and yellow, magenta, and Cyan and black ink cartridges Y, M, C and B are arranged and formed. As a result, the line printer 23 can print an image by adhering it to the paper 26 from the line head corresponding to each color ink.

(Second Embodiment) Next, a second embodiment of the present invention will be described. In the second embodiment, the head frame 4, the substrate member 6, and the flow path plate 12 are the same as in the first embodiment, and only the material of the nozzle sheet 2 is different. In the above-described first embodiment, the nozzle sheet 2 is made of a material having a coefficient of linear expansion larger than that of the head frame 4 and the substrate member 6. On the other hand, in the second embodiment, the nozzle sheet 2 is made of a material having a smaller linear expansion coefficient than the head frame 4 and the substrate member 6. In particular,
The nozzle sheet 2 has a coefficient of linear expansion of about 0.13 × 10.
^-6 [K ^-1 ] nickel steel (64Fe, 36Ni).

Next, the manufacturing process in the second embodiment will be described. First, the nozzle sheet 2 and the head frame 4 are attached to each other by, for example, a sheet adhesive (a sheet adhesive such as an epoxy resin type) that is cured by being exposed to air (first adhesive step). Next, the nozzle sheet 2
And the substrate member 6 are bonded together (second bonding step).

Here, the temperature at the time of bonding in the first bonding step and the second bonding step will be described. Figure 12 is a transition due to temperature change of the formation interval of ink discharge nozzles 3 formed in the nozzle sheet 2 (nozzle spacing) L _A [μm], formation interval of the heating resistor 8 formed on the substrate member 6 ( FIG. 11 is a graph showing a transition between heaters) L _B [μm] due to a temperature change, and corresponds to FIG. 10 of the first embodiment. 12, straight line A, at room temperature _{T R}
Are those showing a change due to temperature change when the nozzle spacing was as L ₁ in a straight line B shows a transition due to temperature change in the case where the heater spacing at room temperature T _R and L ₂ .

The straight lines A and B respectively have a coefficient of linear expansion of the nozzle sheet 2 of α ₃ (α ₃ is about 0.13 × 10 5).
^-6 [K ^-1 ]), the linear expansion coefficient of the substrate member 6 (semiconductor substrate 7) is α ₄ (α ₄ is about 3.5 × 10
^{-6 K -1]),} if the temperature is T (K), as in the first _{embodiment, A: L A = L 1} + L 1 α 3 (T-T R) B: L B = L _{2 + L 2 α 4 (T} -T R) ( _{however, L 2> L 1, T} R at room temperature) is represented by.

Therefore, when the temperature is lower than the room temperature T _R and the temperature T = T ₃ at which the straight line A and the straight line B intersect (10 ° C. in the present embodiment, that is, 283 K), the nozzle sheet 2 and the head frame 4 are connected. to paste together. By bonding the nozzle sheet 2 and the head frame 4 at a temperature T _3, the bonding temperature T ₃ above the temperature, the head frame 4, in order to have sufficient stiffness with a thickness of 5 mm, the nozzle sheet 2 follows the contraction of the head frame 4.

That is, the coefficient of linear expansion of the head frame 4 is preferably larger than that of the nozzle sheet 2. This is because when the nozzle sheet 2 and the head frame 4 are attached at a low temperature (temperature T ₃ ) and then returned to room temperature, the nozzle sheet 2 is
Depending on whether (1) the force is applied in the pulling direction or (2) the force is applied in the contracting direction, if the linear expansion coefficient of the head frame 4 is smaller than that of the nozzle sheet 2, Force is applied to the nozzle sheet 2
This is because there is a possibility that irregularities (wrinkles) that may cause the positional deviation between the ink discharge nozzle 3 and the heating resistor 8 may occur.

In addition, the nozzle sheet 2 and the head frame 4
It is desirable that the bonding temperature T ₃ for bonding with and is lower than the temperature in any subsequent process. Thereby, during the process after the nozzle sheet 2 and the head frame 4 are bonded together, the nozzle sheet 2 is always in a tensioned state, and it is possible to prevent wrinkles from occurring in the nozzle sheet 2.

Next, in the second bonding step, the temperature _{T 3} higher than a temperature higher than room _{T R} to a temperature _T = T ₄ (105 ℃ in this embodiment, i.e., 378K), the nozzle sheet 2
And the substrate member 6 are attached to each other. Since the bonding of the nozzle sheet 2 and the substrate member 6 is performed by thermosetting the barrier layer 10, this bonding temperature is set to the barrier layer 1.
It depends largely on the property of 0, and is not limited to 105 ° C., but it is necessary that the temperature is not less than the bonding temperature of the nozzle sheet 2 and the head frame 4 described above.

Further, since the linear expansion coefficient of the head frame 4 is substantially the same as the linear expansion coefficient of the substrate member 6 as described above, the nozzle interval and the heater interval are substantially the same under the same temperature. . Therefore, the positional deviation between the heating resistor 8 (ink pressurizing chamber 9) and the ink ejection nozzle 3 does not occur.

When the print head is completed,
The nozzle spacing in the
It depends on the resolution required for the printer
L_Two Is determined as a design value. This
L required in case of₁ Is the linear expansion of the nozzle sheet 2.
Rate α_Three , Linear expansion coefficient of the semiconductor substrate 7 (head frame 4
Is also the coefficient of linear expansion of_Four , Nozzle sheet 2 and head
Bonding temperature T with frame 4_Three , The bonding temperature
Degree T_Three And room temperature T_R Difference ΔT (ΔT = T_Three -T _R )
Then, by calculating backward from FIG. L₁ = L_Two (Α_Four ΔT + 1) / (α_Three ΔT + 1) Can be obtained from

[0075] Incidentally, in manufacturing variation of the nozzle sheet 2, there may be a nozzle spacing of at room temperature T _R or too or, too long short for L _1. In such a case, the temperature can be adjusted by changing the bonding temperature between the nozzle sheet 2 and the head frame 4.

The manufacturing process of the second embodiment is the same as that described in the first embodiment, and is the same as the contents shown in FIGS. In the second embodiment, the nozzle sheet 2 has a smaller coefficient of linear expansion than the head frame 4, so the relationship between the solid line and the dotted line in FIG. 6 is opposite.

In the print head 1 described above, the linear expansion coefficient is substantially equal to the linear expansion coefficient of silicon, which is the material of the semiconductor substrate 7 which is the base material of the substrate member 6, and the nozzle sheet 2 has a linear expansion coefficient. the head frame 4 formed of silicon nitride having a coefficient of linear expansion larger linear expansion coefficient bonded at a lower temperature T ₃ than the room temperature nozzle sheet 2, then the nozzle sheet substrate member 6 at a temperature T ₃ above the temperature T ₄ Two
Since bonded to a formation interval of the ink ejection nozzles 3 formed in the nozzle sheet 2, a formation interval of the heating resistor 8 of the substrate member 6, it can always be made to coincide at a temperature T ₃ higher temperature environment Therefore, it is possible to obtain the print head 1 having good ink ejection performance. Then, after bonding the nozzle sheet 2 and the head frame 4 at a temperature T ₃ lower than room temperature, when returning to room temperature, the head frame 4
As a result, a force is applied in the direction in which the nozzle sheet 2 is pulled, so that it is possible to prevent unevenness (wrinkles) from occurring in the nozzle sheet 2.

Therefore, even if the size of the substrate member 6 is increased and the number of the heating resistors 8 per one substrate member 6, that is, the number of the ink discharge nozzles 3 per one substrate member 6 is increased, the ink discharge nozzles are also increased. 3 is less likely to be misaligned with the heating resistor 8. Therefore, the size of the print head 1 is easily increased, and it is particularly suitable for forming a print head having a long span such as a print head for a line printer.

In addition, the nozzle sheet 2 and the head frame 4
By bonding and, it is possible to give the nozzle sheet 2 a great rigidity, and as described above, it is possible to form a print head for a line printer by integrating print heads for four colors.

Furthermore, the flow path plate 12 is bonded in a temperature environment at which the bonding temperature between the nozzle sheet 2 and the head frame 4 is T ₃ (10 ° C.) which is the lowest temperature in the bonding process. This is because, if the nozzle sheet 2 and the head frame 4 have already been bonded to each other when the bonding is performed in a temperature environment lower than the temperature T ₃ in the bonding step, the nozzle sheet 2 will be wrinkled. When the flow path plate 12 is attached,
This is because the nozzle sheet 2 is pasted in a wrinkled state, and the nozzle position accuracy is reduced. Therefore, the flow path plate 12 needs to be bonded in a temperature environment of temperature T ₃ or higher in the bonding step.

(Third Embodiment) Next, a third embodiment of the present invention will be described. Flow path plate 12 'of the third embodiment
Is different only in shape from the flow channel plate 12 of the first embodiment. Other points are the same as those in the first embodiment. FIG. 13 is a cross-sectional view showing the print head according to the third embodiment and corresponds to FIG. 4 of the first embodiment. A cutout portion 12a is formed in the flow path plate 12 'in the third embodiment. The cutout portion 12a is provided in the flow path plate 1
The slits are cut inward from the surface of 2 '. In FIG. 13, the cutout portion 12 a of the flow path plate 12 ′ is an example provided on the adhesive surface with the substrate member 6 and the adhesive surface with the nozzle sheet 2.

Next, the formation region of the cutout portion 12a of the flow path plate 12 'will be described. 14 to 16 are views for illustrating the formation region of the cutout portion 12a of the flow path plate 12 ', respectively, and correspond to FIG. 3 of the first embodiment. 14 to 16, the formation region of the cutout portion 12a of the flow path plate 12 'is shown by a grid line. First, FIG. 14 shows an example in which a cutout portion 12a is formed in the area of the outer edge of the space 5 of the head frame 4 on the bonding surface between the flow path plate 12 ′ and the nozzle sheet 2.

In contrast to the example of FIG. 14, FIG. 15 shows an example in which a cutout portion 12a is formed in a region on the ink flow channel 18 side of the bonding surface between the flow channel plate 12 'and the nozzle sheet 2. Is shown. Furthermore, FIG. 16 shows the example of FIG. 14 and FIG.
5 is an example in which the notch 12a is formed in almost the entire area of the bonding surface between the flow path plate 12 'and the nozzle sheet 2.

Since the flow path plate 12 'and the substrate member 6 are adhered to each other with an adhesive, and the adhering surfaces of both are sealed with the adhesive, the adhering surface of the flow path plate 12' to the substrate member 6 is formed. Even if the cutout 12a is formed in the ink, the ink does not leak out of the ink flow path 18 due to the cutout 12a.

In the above structure, when a temperature change occurs, the flow path plate 12 'expands and contracts more than other members as in the first embodiment. However, since the flow path plate 12 'is formed of the hard elastomer or the resin material and the cutout portion 12a is formed, the cutout portion 12a is formed.
It can be easily deformed in the vicinity. Therefore, when the temperature changes, only the flow path plate 12 is easily deformed, and the nozzle sheet 2, the head frame 4, and the substrate member 6 are deformed.
There is no strain in these and no stress acts on them. Therefore, it is possible to prevent the nozzle sheet 2 from being distorted and damaging the nozzle sheet 2.

Although one embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications such as the following are possible. (1) In the third embodiment, the flow path plate 12 'is formed of a hard elastomer or a resin material, and the cutout portion 12 is formed.
a was formed. However, not limited to this, the notch 12a
When it is formed, the flow path plate 12 ′ can be deformed more easily than other members when the temperature changes, and therefore, the flow path plate 12 ′ does not necessarily need to be formed of a hard elastomer or a resin material. If the flow path plate 12 ′ is formed of a material (including both a metal material and a non-metal material) having a Young's modulus smaller than that of steel when the cutout 12a is formed,
It can deform when the temperature changes.

(2) In the third embodiment, the flow path plate 1
The notch 12 a of 2 ′ is formed on the surface of the substrate member 6 and the nozzle sheet 2 that is bonded. However, the present invention is not limited to this, and for example, it may be formed on the bonding surface with the head frame 4. Further, it may be formed on all or part of the bonding surface with the substrate member 6, the nozzle sheet 2 or the head frame 4. Further, the cutout portion 12a of the flow path plate 12 'is
It may be formed on a surface other than the adhesive surface. However, in order to stabilize the ink flow path 18, it is preferable not to form it on the surface of the flow path plate 12 ′ forming the ink flow path 18.

(3) In this embodiment, the flow path plate 12 or 1
2'is NBR, EPM or EPDM, or PE
Alternatively, it is formed from PS or the like. However, not limited to this,
It can be formed from various elastomers (silicone rubber or the like) or resin materials having a Young's modulus smaller than steel. Further, a resin blended with rubber or a resin copolymerized with a rubber component may be used. Further, in order to impart ink resistance as the flow path plate 12 or 12 ′, a material obtained by blending an elastomer or a resin material with a crystalline material may be used.

[0089]

According to the present invention, when a temperature change occurs in the surrounding environment in which the inkjet print head is placed, including the manufacturing of the inkjet print head and the storage / use of the inkjet printer using the inkjet print head. By easily deforming only the flow path plate, it is possible to prevent the inkjet print head from being deformed or destroyed due to the stress between the respective components generated due to the difference in the thermal expansion coefficient of the components of the inkjet print head. Furthermore, by maintaining the state in which the nozzle sheet is stretched, it is possible to prevent the nozzle sheet from forming chicks. Further, the positional deviation between the ink ejection nozzles of the nozzle sheet and the heat generating resistor of the substrate member can be minimized.

[Brief description of drawings]

FIG. 1 is a perspective view showing a configuration of a print head according to the present embodiment.

FIG. 2 is an exploded perspective view showing the configuration of the print head according to the present embodiment.

FIG. 3 is an enlarged view of a main part showing the configuration of the print head according to the first embodiment.

4 is a sectional view taken along line IV-IV in FIG.

FIG. 5 is a perspective view showing a state in which a nozzle sheet is placed on a support jig.

FIG. 6 is an explanatory diagram showing a process of joining the head frame and the nozzle sheet.

FIG. 7 is a plan view showing a state in which a substrate member is joined to a nozzle sheet.

FIG. 8 is a perspective view showing a head assembly in which a head frame, a nozzle sheet, and a substrate member are assembled.

FIG. 9 is an explanatory diagram showing a step of connecting the flow path plate assembly to the head assembly.

FIG. 10 is a graph showing a bonding temperature between a head frame and a nozzle sheet and a bonding temperature at which a substrate member is bonded to a nozzle sheet according to the first embodiment. It is a graph which shows with the expansion-contraction curve of the formation interval of a body.

FIG. 11 is a perspective view showing a configuration of a full-color bubble inkjet type line printer.

FIG. 12 is a view showing a bonding temperature between a head frame and a nozzle sheet and a bonding temperature between a substrate member and a nozzle sheet in the second embodiment, the expansion and contraction curve of the ink discharge nozzle forming interval of the nozzle sheet, and the heat resistance of the substrate member. It is a graph showing with the expansion-contraction curve of the formation interval of a body,
This corresponds to FIG. 10 of the embodiment.

FIG. 13 is a cross-sectional view showing the configuration of the print head of the third embodiment and corresponds to FIG. 4 of the first embodiment.

FIG. 14 is an enlarged view of a principal part showing the configuration of the print head according to the third embodiment, which corresponds to FIG. 3 of the first embodiment.

FIG. 15 is an enlarged view of a main part showing the configuration of the print head according to the third embodiment, which corresponds to FIG. 3 of the first embodiment.

FIG. 16 is an enlarged view of a main part showing the configuration of the print head according to the third embodiment and corresponds to FIG. 3 of the first embodiment.

FIG. 17 is a perspective view showing a configuration of a conventional print head.

FIG. 18 is an exploded perspective view showing the configuration of a conventional print head.

FIG. 19 is a sectional view showing a conventional problem.

[Explanation of symbols]

1 print head 2 nozzle sheet 3 ink ejection nozzles 4 head frame 6 Board member 8 heating resistor 9 Ink pressurizing chamber 11 Head assembly 12, 12 'channel plate 12a Notch 22 Channel plate assembly

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Akihito Miyazaki             6-735 Kita-Shinagawa, Shinagawa-ku, Tokyo Soni             -Inside the corporation (72) Inventor Masato Nakamura             6-735 Kita-Shinagawa, Shinagawa-ku, Tokyo Soni             -Inside the corporation (72) Inventor Shinichi Horii             6-735 Kita-Shinagawa, Shinagawa-ku, Tokyo Soni             -Inside the corporation F-term (reference) 2C057 AF01 AF30 AF43 AF93 AF99                       AG12 AG46 AG99 AN05 AP02                       AP12 AP13 AP14 AP25 AP38                       AP77 AP90 AQ02 BA04 BA13

Claims (28)

[Claims] 1. A nozzle sheet that constitutes an end surface of an ink pressurizing chamber and has a plurality of ink ejection nozzles formed thereon, a head frame that supports the nozzle sheet by adhering the nozzle sheets, and the ink applying unit. An end surface different from the end surface of the pressure chamber is configured,
A substrate member facing the ink discharge nozzle and having a heating resistor for discharging the ink in the ink pressure chamber from the ink discharge nozzle, and a substrate member bonded to the nozzle sheet; An ink jet print head that forms an ink flow path for supplying the ink, and includes at least one of the nozzle sheet, the head frame, or the substrate member, and a flow path plate adhered to the nozzle frame, the head frame and the substrate member. And the linear expansion coefficient of the nozzle sheet are substantially equal to each other, the linear expansion coefficient of the nozzle sheet is larger than the linear expansion coefficient of the head frame and the substrate member, and the flow path plate has a Young's modulus smaller than that of steel. An inkjet print head characterized in that it is formed from. 2. The inkjet printhead according to claim 1, wherein the flow path plate is made of a resin material. 3. The inkjet printhead according to claim 1, wherein the flow path plate is made of an elastomer. 4. A nozzle sheet that constitutes an end surface of an ink pressurizing chamber and has a plurality of ink ejection nozzles formed thereon, a head frame that supports the nozzle sheet by adhering the nozzle sheets, and the ink applying unit. An end surface different from the end surface of the pressure chamber is configured,
A substrate member facing the ink discharge nozzle and having a heating resistor for discharging the ink in the ink pressure chamber from the ink discharge nozzle, and a substrate member bonded to the nozzle sheet; An ink jet print head that forms an ink flow path for supplying the ink, and includes at least one of the nozzle sheet, the head frame, or the substrate member, and a flow path plate adhered to the nozzle frame, the head frame and the substrate member. And the linear expansion coefficient of the nozzle sheet are substantially equal to each other, the linear expansion coefficient of the nozzle sheet is larger than the linear expansion coefficient of the head frame and the substrate member, and the flow path plate has a notch for facilitating deformation. An ink jet print head, wherein an ink jet print head is formed. 5. The inkjet print head according to claim 4, wherein the cutout portion of the flow path plate is formed on a surface other than a surface forming the ink flow path. head. 6. The ink jet print head according to claim 4, wherein the cutout portion of the flow path plate is formed on an adhesive surface with at least one of the nozzle sheet, the head frame, or the substrate member. An inkjet print head characterized in that 7. A nozzle sheet that forms an end surface of an ink pressurizing chamber and has a plurality of ink ejection nozzles formed thereon, a head frame that supports the nozzle sheet by adhering the nozzle sheets, and the ink applying unit. An end surface different from the end surface of the pressure chamber is configured,
A substrate member facing the ink discharge nozzle and having a heating resistor for discharging the ink in the ink pressure chamber from the ink discharge nozzle, and a substrate member bonded to the nozzle sheet; And a flow path plate bonded to at least one of the nozzle sheet, the head frame or the substrate member, and a linear expansion coefficient of the head frame and the substrate member. Are substantially equal to each other, the linear expansion coefficient of the nozzle sheet is larger than the linear expansion coefficient of the head frame and the substrate member, and the flow path plate is formed of a material having a Young's modulus smaller than that of steel. An inkjet printer comprising an inkjet printhead. 8. The inkjet printer according to claim 7, wherein the flow path plate is made of a resin material. 9. The inkjet printer according to claim 7, wherein the flow path plate is made of an elastomer. 10. A nozzle sheet that constitutes an end surface of an ink pressurizing chamber and has a plurality of ink ejection nozzles formed thereon, a head frame that supports the nozzle sheet by adhering the nozzle sheets, and the ink applying unit. An end surface different from the end surface of the pressure chamber is configured,
A substrate member facing the ink discharge nozzle and having a heating resistor for discharging the ink in the ink pressure chamber from the ink discharge nozzle, and a substrate member bonded to the nozzle sheet; And a flow path plate bonded to at least one of the nozzle sheet, the head frame or the substrate member, and a linear expansion coefficient of the head frame and the substrate member. Are substantially equal to each other, the linear expansion coefficient of the nozzle sheet is larger than the linear expansion coefficients of the head frame and the substrate member, and the flow path plate is formed with a notch portion for facilitating deformation. An inkjet printer comprising an inkjet printhead. 11. The inkjet printer according to claim 10, wherein the cutout portion of the flow path plate is formed on a surface other than a surface forming the ink flow path. 12. The inkjet printer according to claim 10, wherein the cutout portion of the flow path plate is formed on an adhesive surface with at least one of the nozzle sheet, the head frame, or the substrate member. Inkjet printer characterized by. 13. A nozzle sheet that constitutes an end surface of an ink pressurizing chamber and has a plurality of ink ejection nozzles formed thereon, a head frame that supports the nozzle sheet by adhering the nozzle sheets, and the ink applying unit. An end surface different from the end surface of the pressure chamber is configured,
A substrate member facing the ink discharge nozzle and having a heating resistor for discharging the ink in the ink pressure chamber from the ink discharge nozzle, and a substrate member bonded to the nozzle sheet; An ink jet print head that forms an ink flow path for supplying the ink, and includes at least one of the nozzle sheet, the head frame, or the substrate member, and a flow path plate adhered to the nozzle frame, the head frame and the substrate member. And the linear expansion coefficient of the nozzle sheet are smaller than the linear expansion coefficients of the head frame and the substrate member, and the flow path plate has a Young's modulus smaller than that of steel. An inkjet print head characterized in that it is formed from. 14. The inkjet printhead according to claim 13, wherein the flow path plate is formed of a resin material. 15. The inkjet printhead according to claim 13, wherein the flow path plate is made of an elastomer. 16. A nozzle sheet that constitutes an end face of an ink pressurizing chamber and has a plurality of ink ejection nozzles formed thereon, a head frame that supports the nozzle sheet by adhering the nozzle sheets, and the ink applying unit. An end surface different from the end surface of the pressure chamber is configured,
A substrate member facing the ink discharge nozzle and having a heating resistor for discharging the ink in the ink pressure chamber from the ink discharge nozzle, and a substrate member bonded to the nozzle sheet; An ink jet print head that forms an ink flow path for supplying the ink, and includes at least one of the nozzle sheet, the head frame, or the substrate member, and a flow path plate adhered to the nozzle frame, the head frame and the substrate member. And the linear expansion coefficient of the nozzle sheet are substantially equal to each other, and the linear expansion coefficient of the nozzle sheet is smaller than the linear expansion coefficient of the head frame and the substrate member. An ink jet print head, wherein an ink jet print head is formed. 17. The inkjet print head according to claim 16, wherein the cutout portion of the flow path plate is formed on a surface other than a surface forming the ink flow path. head. 18. The ink jet print head according to claim 16, wherein the cutout portion of the flow path plate is formed on an adhesive surface with at least one of the nozzle sheet, the head frame, or the substrate member. An inkjet print head characterized in that 19. A nozzle sheet that constitutes an end surface of an ink pressurizing chamber and has a plurality of ink ejection nozzles formed thereon, a head frame that supports the nozzle sheet by adhering the nozzle sheets, and the ink applying unit. An end surface different from the end surface of the pressure chamber is configured,
A substrate member facing the ink discharge nozzle and having a heating resistor for discharging the ink in the ink pressure chamber from the ink discharge nozzle, and a substrate member bonded to the nozzle sheet; And a flow path plate bonded to at least one of the nozzle sheet, the head frame or the substrate member, and a linear expansion coefficient of the head frame and the substrate member. Are substantially equal to each other, the linear expansion coefficient of the nozzle sheet is smaller than the linear expansion coefficient of the head frame and the substrate member, and the flow path plate is formed of a material having a Young's modulus smaller than that of steel. An inkjet printer comprising an inkjet printhead. 20. The inkjet printer according to claim 19, wherein the flow path plate is made of a resin material. 21. The ink jet printer according to claim 19, wherein the flow path plate is made of an elastomer. 22. A nozzle sheet that forms an end face of an ink pressurizing chamber and has a plurality of ink ejection nozzles formed thereon, a head frame that supports the nozzle sheet by adhering the nozzle sheets, and the ink applying unit. An end surface different from the end surface of the pressure chamber is configured,
A substrate member facing the ink discharge nozzle and having a heating resistor for discharging the ink in the ink pressure chamber from the ink discharge nozzle, and a substrate member bonded to the nozzle sheet; And a flow path plate bonded to at least one of the nozzle sheet, the head frame or the substrate member, and a linear expansion coefficient of the head frame and the substrate member. Are substantially equal to each other, the coefficient of linear expansion of the nozzle sheet is smaller than the coefficient of linear expansion of the head frame and the substrate member, and the flow path plate is provided with a notch portion for facilitating deformation. An inkjet printer comprising an inkjet printhead. 23. The inkjet printer according to claim 22, wherein the cutout portion of the flow path plate is formed on a surface other than a surface forming the ink flow path. 24. The ink jet printer according to claim 22, wherein the cutout portion of the flow path plate is formed on a bonding surface with at least one of the nozzle sheet, the head frame, or the substrate member. Inkjet printer characterized by. 25. A nozzle sheet that forms an end surface of the ink pressurizing chamber and has a plurality of ink ejection nozzles formed thereon, a head frame that supports the nozzle sheet, and an end surface that is different from the end surface of the ink pressurizing chamber. Configure
A substrate member facing the ink ejection nozzle and having a heating resistor for ejecting ink in the ink pressure chamber from the ink ejection nozzle, and an ink flow path for supplying ink to the ink pressure chamber And a linear expansion coefficient of the head frame and the substrate member are substantially equal, the linear expansion coefficient of the nozzle sheet is larger than the linear expansion coefficient of the head frame and the substrate member, A flow path plate is a method for manufacturing an inkjet print head, which is formed of a material having a Young's modulus smaller than that of steel, wherein the nozzle sheet and the head frame are bonded to each other in a temperature environment higher than room temperature. A first bonding step, the substrate member and the nozzle sheet, higher than room temperature,
And a second bonding step of bonding in a temperature environment equal to or lower than the temperature in the first bonding step, the flow path plate, and at least one of the nozzle sheet, the head frame, or the substrate member, the first bonding step. A third bonding step of bonding under a temperature environment equal to or lower than the temperature in the step. 26. A nozzle sheet that forms an end surface of the ink pressurizing chamber and has a plurality of ink ejection nozzles formed thereon, a head frame that supports the nozzle sheet, and an end surface that is different from the end surface of the ink pressurizing chamber. Configure
A substrate member facing the ink ejection nozzle and having a heating resistor for ejecting ink in the ink pressure chamber from the ink ejection nozzle, and an ink flow path for supplying ink to the ink pressure chamber And a linear expansion coefficient of the head frame and the substrate member are substantially equal, the linear expansion coefficient of the nozzle sheet is larger than the linear expansion coefficient of the head frame and the substrate member, A method of manufacturing an inkjet printhead, wherein a notch portion for facilitating deformation is formed in a flow path plate, wherein the nozzle sheet and the head frame are bonded in a temperature environment higher than room temperature. A first bonding step, the substrate member and the nozzle sheet, higher than room temperature,
And a second bonding step of bonding in a temperature environment equal to or lower than the temperature in the first bonding step, the flow path plate, and at least one of the nozzle sheet, the head frame, or the substrate member, the first bonding step. A third bonding step of bonding under a temperature environment equal to or lower than the temperature in the step. 27. A nozzle sheet that forms an end surface of the ink pressurizing chamber and has a plurality of ink ejection nozzles formed thereon, a head frame that supports the nozzle sheet, and an end surface that is different from the end surface of the ink pressurizing chamber. Configure
A substrate member facing the ink ejection nozzle and having a heating resistor for ejecting ink in the ink pressure chamber from the ink ejection nozzle, and an ink flow path for supplying ink to the ink pressure chamber And a linear expansion coefficient of the head frame and the substrate member are substantially equal, the linear expansion coefficient of the nozzle sheet is smaller than the linear expansion coefficient of the head frame and the substrate member, A flow path plate is a method for manufacturing an inkjet print head, which is formed of a material having a Young's modulus smaller than that of steel, wherein the nozzle sheet and the head frame are bonded to each other in a temperature environment lower than room temperature. A first bonding step, and a second bonding for bonding the substrate member and the nozzle sheet in a temperature environment equal to or higher than the temperature in the first bonding step. And a third bonding step of bonding the flow path plate and at least one of the nozzle sheet, the head frame, or the substrate member under a temperature environment equal to or higher than the temperature in the first bonding step. A method for manufacturing an inkjet printhead, comprising: 28. A nozzle sheet that forms an end surface of the ink pressurizing chamber and has a plurality of ink ejection nozzles formed thereon, a head frame that supports the nozzle sheet, and an end surface that is different from the end surface of the ink pressurizing chamber. Configure
A substrate member facing the ink ejection nozzle and having a heating resistor for ejecting ink in the ink pressure chamber from the ink ejection nozzle, and an ink flow path for supplying ink to the ink pressure chamber And a linear expansion coefficient of the head frame and the substrate member are substantially equal, the linear expansion coefficient of the nozzle sheet is smaller than the linear expansion coefficient of the head frame and the substrate member, A method of manufacturing an inkjet printhead, wherein a flow path plate is provided with a notch portion for facilitating deformation, wherein the nozzle sheet and the head frame are bonded under a temperature environment lower than room temperature. A first bonding step; a second bonding step of bonding the substrate member and the nozzle sheet in a temperature environment equal to or higher than the temperature in the first bonding step; A third bonding step of bonding the flow path plate and at least one of the nozzle sheet, the head frame, or the substrate member in a temperature environment equal to or higher than the temperature in the first bonding step. Inkjet printhead manufacturing method.