JP2003130889A - Semiconductor device inspection device and method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve problems in a conventional device that as the application of high voltage is performed from an inspection electrode to an electronic part in inspecting the characteristic of the electronic components, the discharging is generated between the inspection electrodes, between the lands of the electronic components and the like, but the discharging can be prevented only by coating a part of the inspection electrode with an insulating film, and further the discharging can not be sufficiently prevented during inspection, as a result, the inspection is performed again, or the failure of the electronic parts and the like is generated. SOLUTION: An electronic part inspection device capable of performing the application of high voltage from the inspection electrode to the electronic parts in the insulating liquid, is utilized to prevent the discharging during the inspection of the characteristic of the electronic parts, whereby the problems in the conventional device can be solved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component inspection apparatus or an electronic component inspection method for inspecting characteristics of electronic components by applying a high voltage.

[0002]

BACKGROUND OF THE INVENTION Electronic components are inspected at various stages of the manufacturing process. Especially for electronic components used at a high voltage, an inspection is performed by applying a high voltage equivalent to that during actual use.

As one of the inspections of such electronic parts, there is a method of inspecting the characteristics of the electronic parts by abutting the inspection electrodes on the electronic parts and applying a high voltage through the abutting inspection electrodes. The applied voltage may be a high voltage of about 5000 to 10000 V in some cases.

However, since this inspection has been performed in the atmosphere, discharge may occur between the inspection electrodes.

[0005]

As described above, discharge may occur between the inspection electrodes during the inspection. In this case, a part of the electric current is not applied to the electronic component due to the discharge, so that an accurate inspection result cannot be obtained. Therefore, when it was found that a discharge had occurred, the inspection was repeated. However, there is a problem in that the redone of the examination makes the examination inefficient. Also,
Part of electronic components may be destroyed by electric discharge.

In view of the above problems, it is an object of the present invention to prevent discharge during inspection.

[0007]

In order to solve the above-mentioned problems, an electronic component inspection apparatus is used in which an electronic component is immersed in an insulating liquid to prevent electric discharge from an inspection electrode.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

First, the concept of the electronic component inspection apparatus according to the present invention will be described.

As described above, the present electronic component inspection apparatus is an apparatus for inspecting the characteristics of electronic components. The inspection of the electronic component is usually performed by applying electricity from the inspection electrode to the electronic component. However, discharge easily occurs between the test electrodes using high voltage, and in order to prevent this, an insulating film is applied to the test electrodes. However, since a high voltage is applied to the contact portion with the electronic component, an insulating film cannot be applied, so that discharge can still occur. Further, not only between the inspection electrodes, but also between the lands of the electronic component, a discharge may occur, or between the inspection electrode and the land of the electronic component. in this way,
As long as the test is performed in air, the above-mentioned discharge can occur. Therefore, a high voltage is applied from an inspection electrode in an insulating liquid in order to prevent a discharge that is likely to occur in the air while enabling a high voltage to be applied to an electronic component for inspection. As a result, it is possible to prevent discharge between the inspection electrodes and between the lands of the electronic component. The "land" is an electrode formed on the electronic component, and is generally electrically connected to an electrode of a case for housing the electronic component by connecting a thin conductive wire with a wire bonding device. The "electronic component" includes a semiconductor device, a semiconductor wafer, a fluorescent display tube, a plasma display element, and the like. Further, “high voltage” refers to a voltage at which electric discharge occurs in the air. For example, in the case of electric discharge between inspection electrodes, it cannot be unconditionally defined because it changes depending on the distance between inspection electrodes. The distance between the test electrodes is 50 to 300μ.
In m, it means a voltage with a potential difference of 1000 V or more.

Next, each component will be described.

First, the overflow cup and the chamber will be described.

As shown in FIG. 1, the overflow cup 101 is a tank for filling an insulative liquid at a certain height and overflowing and storing it. The overflow cup 101 is configured so as to be surrounded by the walls 101a and 101a, and may have a shape in which four sides are surrounded by walls or a shape in which the walls are cylindrically surrounded. It should be noted that "overflow" refers to a state in which the liquid continues to flow into a tank with an open upper part to fill and overflow, and a tank with an upper closed part is filled with liquid and either of the wall surfaces of the tank is filled. A hole is provided in the portion to allow a certain amount of liquid to flow out, and a state in which the liquid always flows into the tank is included so that the inside of the tank is filled with the liquid. The chamber 102 is a tank for receiving the insulating liquid that has flowed out of the overflow cup 101 due to overflow. The chamber 102 has a wall 102a,
It is configured to be surrounded by 102a. Overflow cup 101 is arranged to fit within chamber 102. Further, the chamber 102 can be moved, so that the electronic component 105 held by the electronic component holding portion 103 fixed in the chamber 102 or the land of the electronic component 105 can be moved relative to the inspection electrode 104. It is possible to bring them into contact with each other.

Next, the electronic component holder will be described.

As shown in FIG. 1, the electronic component holder 103
Holds the electronic component 105 to be inspected and holds the insulating liquid 1
It is a base for fixing in 06 and can move in the XYZ directions. As a result, the electronic component 10
5 can be held and can be held in a state of being positioned in the overflow cup 101 at a position where it can contact the inspection electrode 104.

The electronic component holder 103 holds the electronic component 105 by vacuum chuck means 113.
May be provided, or may be provided with mechanical chuck means.

The electronic component holder 103 can also serve as an electrode. Furthermore, the electronic component holder can move in the XYZ directions in the insulating liquid. It is also possible to prevent electric discharge between the electronic component holding portion serving as an electrode and the inspection electrode while the electronic component holding portion and the inspection electrode are relatively moved. Discharge is likely to occur between the electronic component holding portion serving as an electrode and the inspection electrode, or between the electronic component held by the electronic component holding portion and the inspection electrode. Therefore,
In order to move the inspection electrode to a different land of the electronic component (while the electronic component holder and the inspection electrode are relatively moved), conventionally, the power supply to the inspection electrode is turned off each time. However, in the present invention, since it moves in an insulating liquid, discharge is unlikely to occur, and it is convenient that the inspection electrode does not need to be turned off.

Next, the inspection electrode will be described.

As shown in FIG. 1, the inspection electrode 104 is a needle-shaped metal for applying high voltage electricity to the electronic component 105 in order to inspect the characteristics of the electronic component. It may be composed of one electrode or three or more electrodes. The material of the inspection electrode 104 may be tungsten or the like. Also, the inspection electrode 104
Is used by directly contacting the electronic component 105. In addition, the inspection electrode 104 may be provided with elasticity so that it can appropriately contact the land of the electronic component 105 according to the height of the electronic component 105 to be inspected. Further, the inspection electrode can be moved so that the inspection electrode can be brought relatively close to and brought into contact with the electronic component or the land of the electronic component.

Next, the insulating liquid will be described.

The insulating liquid 106 shown in FIG. 1 is intended to prevent the discharge of electricity in the air, and may be, for example, a fluorine-based liquid or a silicone-based liquid. To be

Next, the flow of processing will be described.

First, the electronic component 1 is attached to the electronic component holder 103 so that the inspection electrode 104 can contact the electronic component 105.
Position 05. Furthermore, by the steps above,
In the positioned state, the insulating liquid 106 is caused to flow into the overflow cup 101 and overflowed so that the electronic component 105 is immersed in the insulating liquid 106. Further, the electronic component 105 or the land of the electronic component 105 dipped in the insulating liquid 106 in the above step is brought closer to and brought into contact with the inspection electrode. Further, in the insulating liquid 106, the inspection electrode 104,
Alternatively, a high voltage is applied to the electronic component 105 from the inspection electrode 104 and the electronic component holder 103 to inspect the characteristics of the electronic component.

(Embodiment 1)

In the first embodiment, an overflow cup capable of overflowing and filling an insulating liquid, and an electronic component holder for holding an electronic component by immersing it in the insulating liquid in the overflow cup are held. And an inspection electrode for inspecting the characteristics of the electronic component immersed in the insulating liquid in the electronic component holder by applying a high voltage thereto.

FIG. 2 shows the configuration of the first embodiment.

The electronic component 205 is stored in the electronic component holder 203.
Are positioned so that they can contact the inspection electrodes 204.

The insulating liquid 206 flows in from the lower part of the overflow cup 201, fills it, and the wall 201a
Overflow. The insulating liquid 206 that has overflowed the wall 201 a is absorbed by the wall 202 a of the chamber 202.
Flows into the chamber 202 surrounded by the wall 201a,
The overflow cup 201 contains a liquid 2
Insulating liquid 206 that keeps filled with 06
The height of the water surface is kept at the height of the inner wall (height of the lowest part of the inner wall). Further, an inside sensor 208 is installed on the side surface of the wall 201a, and the overflow cup 2
The outside sensor 209 is installed on the side surface of the wall 202a to detect whether or not the insulating liquid 206 has accumulated in 01 to a height to be filled, and the insulating liquid 206 flowing out beyond the wall 201a is discharged. Senses whether or not the insulating liquid has accumulated to a certain height in the chamber 202 surrounded by the walls 201a and 202a. The insulating liquid 206 is circulated by the circulation pump 207 so that the insulating liquid 206 is detected by the inside sensor 208 and the outside sensor 209, so that the insulating liquid 206 flows into the overflow cup 201 and the wall 201a. 2 surrounded by wall and wall 202a
The insulating liquid 206 accumulated in 02 is discharged. As a result, the insulating liquid 206 is transferred to the chamber 2
The inside of the overflow cup 201 is constantly filled with the height at which the insulating liquid 206 overflows without leaking from the wall 202a of 02. Also,
The insulating liquid 2 discharged from the chamber 202
06 circulates in the electronic component inspection device 200 and flows into the overflow cup 201 again.

The electronic component 205 or the electronic component 205 which is positioned and immersed in the insulating liquid 206.
The land of (3) is brought relatively close to the inspection electrode 204 and brought into contact therewith.

With the electronic component in contact with the inspection electrode 204, the entire electronic component 205 and the inspection electrode 20
Insulating liquid 2 is the uncovered part of insulating film 4
It will be immersed in 06.

Further, a high voltage electricity is applied to the electronic component 205 dipped in the insulating liquid 206 from the inspection electrode 204 dipped in the insulating liquid 206 to inspect the characteristics of the electronic component 205. In this way, by applying a high voltage to the electronic component in the overflowing insulating liquid to inspect the characteristic of the electronic component, it is possible to perform the inspection under constant conditions. If the electronic component is immersed in the insulation liquid and the inspection is performed without overflowing the insulation liquid, the amount of the insulation liquid in the overflow cup changes due to evaporation of the insulation liquid, for example. The change in the electric capacity realized by the liquid may make it impossible to perform an inspection under constant conditions.

FIG. 3 shows that the electrical conditions change when the amount of insulating liquid is different. Figure (a)
Shows that a high voltage is applied from the inspection electrode to the electronic component in a state where the container holding the electronic component is completely filled with the insulating liquid. Further, FIG. 6B shows a state in which a high voltage is applied from the inspection electrode to the electronic component in a state where the insulating liquid is filled in the same container to the extent that the amount of α is not filled. As described above, when the amount of the insulating liquid in which the electronic component is dipped is different, the electric capacity with respect to the inspection electrode is also different, and FIG. (B) is different from FIG. , Each meter shows how the electrical characteristics change. In the meter, voltage, current,
Various other parameters change.

(Embodiment 2)

The second embodiment is based on the configuration of the first embodiment and has a temperature adjusting section for adjusting the temperature of the insulating liquid. As a result, the temperature of the insulating liquid can be kept constant during inspection and can be set to a specific temperature, and as a result, the temperature of the electronic component itself immersed in the insulating liquid can be kept constant. In addition to being able to perform, inspection can be performed by setting a specific temperature. For example, in the case of an electronic component whose actual use temperature is 100 ° C. and 5 KV, it is possible to set the temperature to 100 ° C. and apply 5 KV rather than applying 5 KV at room temperature, so that inspection in a state closer to actual use is possible. Become.

A chamber capable of overflowing and filling an insulative liquid, an electronic component holder for immersing and holding an electronic component in the insulating liquid in the chamber, and the electronic component holder Since the inspection electrode for inspecting the characteristics by applying a high voltage to the electronic component immersed in the insulating liquid is the same as that of the first embodiment, the description thereof will be omitted.

As shown in FIG. 4, the temperature adjusting unit 411 for adjusting the temperature includes a pipe heater 411a and a cooling coil 4.
11b, an agitator 411c, and a temperature sensor 411d. An overflow cup temperature sensor 412 is installed on the side surface of the wall 401a of the overflow cup 401 to keep the insulating liquid 406 in the overflow cup 401 at a constant temperature.
02, the temperature of the insulating liquid 406 discharged by the circulation pump 407 is adjusted by the temperature adjusting unit 411.
To adjust the temperature, the temperature sensor 411d adjusts the pipe heater 411a and the cooling coil 411b,
This is performed by making the insulative liquid in the temperature adjusting section nearly uniform by the stirrer 411c. Then, the temperature-controlled insulating liquid 406 is caused to flow into the overflow cup 401 again by the pump 407. As a result, as described above, the temperature of the electronic component 405 itself can be maintained and adjusted through the maintenance and adjustment of the temperature of the insulating liquid, and the electronic component 40 at a constant temperature condition or a specific temperature can be obtained.
It is possible to inspect the characteristics of item 5. In addition, in order to overflow the insulating liquid 406 into the overflow cup 401, the inside liquid is detected by the inside sensor 408 and the outside sensor 409, and the insulating liquid is circulated by the circulation pump 407. It is similar to the first embodiment. It is also possible to adjust the insulating liquid to zero degrees or less by the cooling coil 411b.

(Embodiment 3)

The third embodiment is based on the configuration of the first embodiment, and is an electronic component inspection apparatus characterized in that the electronic component holder has a vacuum chuck.

In order to inspect the characteristics by applying a high voltage to the overflow cup capable of overflowing and filling the insulating liquid and the electronic component immersed in the insulating liquid in the electronic component holder. The inspection electrodes of
The description is omitted because it is the same as that of the first embodiment.

As shown in FIG. 5, in this embodiment, an electronic component holding portion 502 for holding an electronic component by immersing it in an insulating liquid in an overflow cup 501, a suction port 503, a suction device 504, It is composed of a suction passage 505.

The air in the suction passage 505 is sucked from the suction port 503 by the suction device 504 of the vacuum chuck, so that the electronic component 506 is sucked by the electronic component holding portion 502 and is fixed to the electronic component holding portion 502. It Thereby, when inspecting the electronic component immersed in the insulating liquid, it is possible to prevent the displacement of the electronic component.

(Embodiment 4)

The embodiment 4 relates to a method for inspecting characteristics of electronic parts.

Regarding the structure of the electronic component inspection device, an overflow cup capable of overflowing and filling an insulating liquid, and an electronic component for immersing and holding the electronic component in the overflow cup are held. Embodiment 1 is that it has an electronic component holder and an inspection electrode for inspecting its characteristics by applying a high voltage to the electronic component immersed in an insulating liquid in the electronic component holder.
Since it is the same as, the description will be omitted.

The processing flow of this embodiment will be described with reference to FIG. First, the electronic component is positioned in the electronic component holder at the position where the inspection electrode is relative to the electronic component (step S601). Further, in the positioned state by the above step, the insulating liquid is caused to flow into the overflow cup to immerse the electronic component in the insulating liquid (step S602). Further, the electronic component or the land of the electronic component dipped in the insulating liquid in the above step is brought relatively close to and brought into contact with the inspection electrode (step S603). Furthermore, in the insulating liquid,
High voltage electricity is applied to the electronic component from the inspection electrode to inspect the characteristic of the electronic component (step S604).

(Embodiment 5)

The embodiment 5 relates to a method for inspecting characteristics of electronic parts. The difference of this embodiment from the fourth embodiment is that the inspection electrode is brought into contact with the electronic component before the electronic component is immersed in the insulating liquid. This may facilitate the contact of the inspection electrode with the electronic component.

Regarding the configuration of the electronic component inspection apparatus, an overflow cup capable of overflowing and filling an insulating liquid, and an electronic component for immersing and holding the electronic component in the overflow cup are held. Embodiment 1 is that it has an electronic component holder and an inspection electrode for inspecting its characteristics by applying a high voltage to the electronic component immersed in an insulating liquid in the electronic component holder.
Since it is the same as, the description will be omitted.

The processing flow of this embodiment will be described with reference to FIG. First, the electronic component is positioned in the electronic component holder at the position where the inspection electrode is relative to the electronic component (step S701). Further, the electronic component or the land of the electronic component positioned at the predetermined position in the above step is brought relatively close to and brought into contact with the inspection electrode (step S70).
2). Further, according to the above step, while the electronic component is in contact with the inspection electrode, an insulating liquid is caused to flow into the overflow cup, and the overflow cup is caused to overflow so that the inspection electrode is immersed in a predetermined position. Then, the electronic component and the inspection electrode are immersed in an insulating liquid (step S703). Further, high voltage electricity is applied to the electronic component from the inspection electrode to inspect the characteristic of the electronic component (step S704).

(Embodiment 6)

This embodiment is an electronic component inspection apparatus based on the structure of embodiment 1 and characterized in that the insulating liquid is a fluorine-based liquid or a silicone-based liquid.

An overflow cup capable of overflowing and filling an insulative liquid, an electronic component holder for immersing and holding an electronic component in the insulative liquid in the overflow cup, and the electronic component The inspection electrodes for inspecting the characteristics by applying a high voltage to the electronic component immersed in the insulating liquid in the holding unit are the same as those in the first embodiment, and thus the description thereof will be omitted.

The "fluorine-based liquid" is an inert solution, which has an insulating property as an electrical property and a large heat transfer coefficient as a thermal property, and is, for example, a fluorocarbon solution.

The term "silicone liquid" refers to silicone oil. Of the polysiloxanes, those having an organic group such as an alkyl group are called silicones, and the silicones have excellent electrical insulation due to their molecular structure. Among the silicones, silicone oil that has a low degree of polymerization and has fluidity at room temperature is silicone oil.

An example of the implementation of the present invention will be described.

FIG. 1 shows an example of the configuration of an electronic component inspection apparatus. As shown in the figure, the electronic component inspection device 100 according to the present embodiment is capable of overflowing and filling the insulating liquid 106 with the overflow cup 1.
01, an electronic component holding portion 103 for holding the electronic component 105 by immersing it in the insulating liquid 106 in the overflow cup 101, and an electron immersed in the insulating liquid 106 by the electronic component holding portion 103. An inspection electrode 104 for inspecting the characteristics of the component 105 by applying a high voltage, and an insulating liquid are caused to flow into the chamber 102,
Further, a circulation pump 107 for discharging, an inside sensor 108 and an outside sensor 109 for detecting an insulating liquid, and a lift for moving up and down an electronic component holding unit for holding an electronic component for taking in and out an electronic component in and out of the insulating liquid. This is an electronic component inspection device having a basic structure of the up mechanism 110. As a result, the electronic component can be inspected with the insulating liquid, and the discharge between the inspection electrodes to which a high voltage is applied can be prevented. Also, by keeping the insulating liquid in an overflowed state, the amount of insulating liquid is kept constant, and the inspection of electronic components is performed under certain conditions without changing the electric capacity realized by the insulating liquid. It can be performed.

Further, the present electronic component inspection apparatus 100 has a temperature adjusting section 111 for adjusting the temperature of the insulating liquid and an overflow cup temperature sensor 112 for detecting the temperature inside the overflow cup 101. As a result, the temperature of the insulating liquid can be kept constant and can be adjusted to a specific temperature. As a result, the temperature of the electronic component itself can be kept constant, and by adjusting it to a specific temperature Can be inspected.

The electronic component holder 103 has an electronic component 105.
Has a vacuum chuck 113 for holding. Thereby, the electronic component can be fixed to the electronic component holder in the insulating liquid.

Further, it has a manipulator 114 for supporting the inspection electrode, and a camera 115 for confirming whether or not the inspection electrode is in contact with the electronic component at a predetermined position. As a result, the inspection electrode and the electronic component can be brought into contact with each other by a fine operation of the inspection electrode. A probe card may be used instead of the manipulator, and other electrodes may be installed on the probe guard.

Further, the liquid recovery cooling coil 116 for recovering the liquid evaporation during high temperature circulation, and the liquid recovery cooling coil 116.
It has a cooler 117 for cooling the air, a recovery fan 118 for recovering the vapor, and a water separator 119 for separating the insulating liquid 106 and the water. As a result, when the insulating liquid is circulated at a high temperature, even if the insulating liquid 106 evaporates, the insulating liquid 106 is recovered and liquefied, and is separated from the water in the air. In the state of keeping the insulating liquid 106, the insulating liquid 106 is used again for the electronic component inspection apparatus 100.
You can circulate inside.

[0061]

As described above, by applying a high voltage from the inspection electrode to the electronic component in the insulating liquid, it is possible to prevent electric discharge between the inspection electrodes which is likely to occur in the air. Since it is not necessary to redo the inspection due to the electric discharge, it is possible to efficiently inspect the characteristics of the electronic component.

[Brief description of drawings]

FIG. 1 is a configuration diagram of an embodiment.

FIG. 2 is a configuration diagram of the first embodiment.

FIG. 3 is a diagram showing changes in electrical characteristics when the amount of insulating liquid is different.

FIG. 4 is a configuration diagram of a second embodiment.

FIG. 5 is a configuration diagram of a vacuum chuck according to a third embodiment.

FIG. 6 is a diagram showing a flow of processing according to a fourth embodiment.

FIG. 7 is a diagram showing a flow of processing according to a fifth embodiment.

[Explanation of symbols]

100 electronic parts inspection equipment 101 overflow cup 101a wall 102 chambers 102a wall 103 electronic component holder 104 inspection electrode 105 electronic components 106 Insulating liquid 107 Circulation pump 108 Inside sensor 109 Outside sensor 110 Lift-up mechanism 111 Temperature control unit 112 Overflow cup temperature sensor 113 vacuum chamber 114 Manipulator 115 cameras 116 Liquid recovery cooling coil 117 Cooler 118 Collection fan 119 Moisture Separator 200 Electronic component inspection system 201 overflow cup 201a wall 202 chamber 202a wall 203 electronic component holder 204 inspection electrode 205 electronic components 206 Insulating liquid 207 Circulation pump 208 Inside sensor 209 Outside sensor 210 Lift-up mechanism 400 Electronic component inspection device 401 overflow cup 401a wall 402 chamber 402 wall 403 Electronic component holder 404 inspection electrode 405 electronic components 406 Insulating liquid 407 Circulation pump 408 Inside sensor 409 Outside sensor 410 Lift-up mechanism 411 Temperature control unit 411a Pipe heater 411b Cooling coil 411c stirrer 411d temperature sensor 412 Overflow cup temperature sensor 501 overflow cup 502 Electronic component holder 503 suction port 504 suction machine 505 suction path 506 electronic components

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Shigeru Yoshizawa             1-9-3 Kitakase, Saiwai-ku, Kawasaki-shi, Kanagawa             Inside Kuta Semicon Co., Ltd. (72) Inventor Takaya Oe             2-7-3 Kanda-Jinbocho, Chiyoda-ku, Tokyo               Tosky Co., Ltd. (72) Inventor Kiyoshi Komatsu             2-5-6 Ogibashi, Koto-ku, Tokyo             -In the test system F-term (reference) 2G003 AA07 AA10 AB01 AD01 AE09                       AG03 AG16 AG20 AH04                 2G011 AA16 AB10 AC06 AC14 AE01                       AE02 AE03                 4M106 AA01 BA01 BA14 DD30

Claims (6)

[Claims] 1. An overflow cup capable of overflowing and filling an insulating liquid, an electronic component holding portion for immersing and holding an electronic component in the insulating liquid in the overflow cup, An electronic component inspection device, comprising: an inspection electrode for inspecting the characteristics of an electronic component immersed in an insulating liquid in an electronic component holder to apply a high voltage thereto. 2. The electronic component inspection apparatus according to claim 1, further comprising a temperature adjusting unit for adjusting the temperature of the insulating liquid. 3. The electronic component inspection apparatus according to claim 1, wherein the electronic component holder has a vacuum chuck means for holding the electronic component by immersing it in an insulating liquid. 4. An electronic component inspection method for applying a high voltage to an electronic component through an inspection electrode to inspect its characteristics, which comprises a positioning step of determining a relative position between the electronic component and the inspection electrode, and the positioning. An immersion step of immersing the electronic component positioned in the step in an overflowing insulating liquid, and an inspection electrode relatively to the electronic component or the land of the electronic component immersed in the insulating liquid in the immersion step. A method of inspecting an electronic component, comprising: a contacting step of bringing the components closer to each other and bringing them into contact with each other; and an applying step of applying a high voltage to the electronic component contacted with the inspection electrode in the contacting step through the inspection electrode . 5. An electronic component inspection method for applying a high voltage to an electronic component through an inspection electrode to inspect its characteristics, which comprises a positioning step of determining a relative position between the electronic component and the inspection electrode, and the positioning. The inspection electrode is relatively brought close to the electronic component or the land of the electronic component positioned in the step, and the step of bringing the inspection electrode into contact with the land is held in the insulating liquid that overflows the electronic component in which the inspection electrode is brought into contact in the contact step. An electronic component inspection method comprising: an immersion step of immersing, and an applying step of applying a high voltage to an electronic component immersed in an insulating liquid overflowing in the immersion step through an inspection electrode. 6. The insulating liquid is a fluorine-based liquid,
Alternatively, the semiconductor device inspecting apparatus and method according to any one of claims 1 to 5, which is a silicone-based liquid.