JP2003122611A - Data providing method and server device - Google Patents

Data providing method and server device

Info

Publication number
JP2003122611A
JP2003122611A JP2001313621A JP2001313621A JP2003122611A JP 2003122611 A JP2003122611 A JP 2003122611A JP 2001313621 A JP2001313621 A JP 2001313621A JP 2001313621 A JP2001313621 A JP 2001313621A JP 2003122611 A JP2003122611 A JP 2003122611A
Authority
JP
Japan
Prior art keywords
data
update
providing
updated
utilization
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001313621A
Other languages
Japanese (ja)
Inventor
Ken Watanabe
謙 渡辺
Masato Kutsuzawa
正人 沓澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP2001313621A priority Critical patent/JP2003122611A/en
Publication of JP2003122611A publication Critical patent/JP2003122611A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To provide a data providing method and a server device for allowing a data using device to autonomously update data in order to synchronize data. SOLUTION: In this data providing method for providing a plurality of kinds of data pieces under the control of update processing to a data using device, those data pieces are grouped and held for every data using device, and a device identifier corresponding to the data using device to which the updated data pieces belong is held according to the update of the data pieces, and the held device identifier is retrieved according to an instruction from the outside, and the corresponding data using device is informed of the update of the data pieces. The updated data pieces are provided according to a request from the data using device. The data providing server device executes the data providing method.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、データ利用装置に
データを提供するデータ提供方法及び装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a data providing method and device for providing data to a data utilizing device.

【0002】[0002]

【従来の技術】データをネットワークの複数のノードに
分散して利用する形態が広く行われている。かかる形態
が採られるのは、データを1つのノードに集中設置して
多数の使用者の要求全てに応えることは、処理能力及び
通信能力の面で不利だからである。利用者からのデータ
要求のトラヒックが分散される分散形態は、利用者に円
滑なデータ提供をなし得ると期待される。しかし、かか
る分散形態では一方で、ネットワークに分散配置された
データを維持管理するシステムが必要となり、データの
元本となるべきデータを保持し各DBサーバのデータを
適宜更新する機能が求められる。その場合、元のデータ
に更新があった場合に複数のDBサーバ上のデータの同
期、即ち、各分散データベースにある同一のデータを如
何に等しく且つ時機に遅れることなく更新するかが問題
となる。
2. Description of the Related Art A form in which data is distributed to a plurality of nodes of a network and used is widely used. This form is adopted because it is disadvantageous in terms of processing capability and communication capability to centrally install data in one node and meet all the requests of many users. The distributed form in which the traffic of data requests from users is distributed is expected to provide smooth data provision to users. However, on the other hand, in such a distributed mode, a system for maintaining and managing data distributed and arranged in a network is required, and a function of holding data to be a principal of data and appropriately updating data of each DB server is required. In that case, when the original data is updated, the problem is how to synchronize the data on multiple DB servers, that is, how to update the same data in each distributed database equally and without delay. .

【0003】そこで、特開2000−105744号
は、データの同期を図る分散型データベースシステムを
開示している。かかるシステムでは、管理ホストがDB
サーバへの通信路の状態及び更新が必要か否かの情報を
含むサーバ更新管理情報テーブルを有する。そして、各
DBサーバのデータを更新する際に、該管理ホストが該
サーバ更新管理情報テーブルを参照して、通信が可能且
つ更新が必要なDBサーバに向けてのみ更新に必要な情
報を送信する。
Therefore, Japanese Patent Laid-Open No. 2000-105744 discloses a distributed database system for synchronizing data. In such a system, the management host is a DB
It has a server update management information table including information on the state of the communication path to the server and whether or not update is necessary. Then, when updating the data of each DB server, the management host refers to the server update management information table and transmits the information necessary for updating only to the DB server that can communicate and needs updating. .

【0004】しかし、かかる技術では、各DBサーバの
データの更新が管理ホストの主導によりなされて、DB
サーバ、即ちデータ利用装置側の処理サイクルからして
更新が望ましくない場合にも更新が強制されてしまう問
題があった。例えば、更新データをデータ利用者装置側
において何時何分から従来のものから切り替えたい等の
個別の要請が有る場合に不都合が存在した。
However, in this technique, the management host takes the initiative in updating the data in each DB server, and
There is a problem that the update is forced even when the update is not desirable from the processing cycle of the server, that is, the data utilization device side. For example, there is an inconvenience when there is an individual request for switching the update data from the conventional one on the data user device side.

【0005】[0005]

【発明が解決しようとする課題】そこで、本発明の目的
は、データ利用装置が自律的にデータの更新をなすこと
を可能としてデータの同期をなすデータ提供方法及びサ
ーバ装置を提供することである。
SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a data providing method and a server apparatus that enable a data utilizing apparatus to autonomously update data and synchronize the data. .

【0006】[0006]

【課題を解決するための手段】本発明によるデータ提供
方法は、更新処理の管理下にある複数種類のデータ片を
データ利用装置に提供するデータ提供方法であり、該複
数種類のデータ片を該データ利用装置毎に群分けして保
持するデータ保持ステップと、該データ片の更新に応じ
て、更新後データ片が属する該データ利用装置に対応す
る装置識別子を保持する装置識別子保持ステップと、外
部からの指示に応じて、該保持された装置識別子を検索
して、対応するデータ利用装置に更新通知をなす通知ス
テップと、該データ利用装置からの要求に応じて、該更
新後データ片を提供する提供ステップとを含むことを特
徴とする。
A data providing method according to the present invention is a data providing method for providing a data utilization apparatus with a plurality of types of data pieces under the control of update processing. A data holding step of grouping and holding each data using apparatus; a device identifier holding step of holding a device identifier corresponding to the data using apparatus to which the updated data piece belongs in accordance with the update of the data piece; In response to an instruction from the device, retrieves the held device identifier and notifies the corresponding data utilization device of the update, and provides the updated data piece in response to a request from the data utilization device. And a providing step of

【0007】本発明によるデータ提供サーバ装置は、更
新処理の管理下にある複数種類のデータ片をデータ利用
装置に提供するデータ提供サーバ装置であり、該複数種
類のデータ片を該データ利用装置毎に群分けして保持す
るデータ保持手段と、該データ片の更新に応じて、更新
後データ片が属する該データ利用装置に対応する装置識
別子を保持する装置識別子保持手段と、外部からの指示
に応じて、該保持された装置識別子を検索して、対応す
るデータ利用装置に更新通知をなす通知手段と、該デー
タ利用装置からの要求に応じて、該更新後データ片を提
供する提供手段とを含むことを特徴とする。
A data providing server device according to the present invention is a data providing server device that provides a plurality of types of data pieces under the control of update processing to a data utilization device, and the plurality of types of data fragments are provided for each data utilization device. Data holding means for grouping and holding the data pieces, a device identifier holding means for holding a device identifier corresponding to the data utilizing apparatus to which the updated data piece belongs in response to the update of the data piece, and an external instruction. Accordingly, a notification means for searching the held device identifier and making an update notification to the corresponding data utilizing device, and a providing means for providing the updated data piece in response to a request from the data utilizing device. It is characterized by including.

【0008】[0008]

【発明の実施の形態】本発明の実施例について添付の図
面を参照して詳細に説明する。図1は、本発明の実施例
であり、データ提供装置を含むシステム構成を示してい
る。ここで、データ提供装置1とデータ利用装置3a乃
至3cがTCP/IP網2を介して接続される。データ
提供装置1とデータ利用装置3a乃至3cとの通信は、
TCP/IP網2の通信プロトコルにおける所定のコマ
ンドを用いて行う。データ提供装置1と、データ利用装
置3a乃至3cの各々とは、コンピュータハードウェア
及びソフトウェアにより実現され得る。
Embodiments of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is an embodiment of the present invention and shows a system configuration including a data providing device. Here, the data providing apparatus 1 and the data utilizing apparatuses 3a to 3c are connected via the TCP / IP network 2. The communication between the data providing device 1 and the data using devices 3a to 3c is
It is performed using a predetermined command in the communication protocol of the TCP / IP network 2. The data providing device 1 and each of the data utilizing devices 3a to 3c can be realized by computer hardware and software.

【0009】データ提供装置1は、データベースを形成
するデータ4a乃至4cと更新通知テーブル5とを含
み、これらは、磁気記憶装置等の記憶装置(図示せず)
に記憶され保持される。データ提供装置1は、通常、デ
ータ利用装置3a乃至3cからのデータ要求に随時応じ
て、該要求に対応するデータ4a乃至4cを提供する。
データ提供装置1は、又、外部からの指示、例えば操作
者の指令に基づいてデータの更新を行う機能を有し、更
に、同様に外部からの指示に基づいてデータ利用装置3
a乃至3cへ更新通知を一括して送信する機能を有す
る。
The data providing apparatus 1 includes data 4a to 4c forming a database and an update notification table 5, which are storage devices (not shown) such as a magnetic storage device.
Stored and retained in. The data providing device 1 normally provides the data 4a to 4c corresponding to the data request from the data using devices 3a to 3c at any time.
The data providing device 1 also has a function of updating data based on an instruction from the outside, for example, a command from an operator, and similarly, the data using device 3 based on the instruction from the outside.
It has a function of collectively transmitting update notifications to a to 3c.

【0010】データ利用装置3a乃至3cの各々は、デ
ータ提供装置1により提供されるデータ4a乃至4cを
各々取り込み、それぞれに要求される業務処理を実行す
る。この場合、データ4a乃至4cの各々は、磁気記憶
装置等の記憶装置(図示せず)に保存されて利用され
る。図2は、図1に示されるデータ提供装置において用
いられるデータ管理構造を示している。データ4a乃至
4cの各々は、複数のデータ利用装置3a乃至3cの各
々に対応して別々に管理される。即ち、データ利用装置
3a乃至3cのそれぞれに群分けされて保有され、例え
ば、データ利用装置3cについて見ると、対応するデー
タ4cには、複数種類からなるデータ項目名に対応して
複数のデータが各々1対1の関係で格納される。先頭の
項目名を「装置識別子」とし、対応するデータにはデー
タ利用装置3cの装置識別子が格納される。かかる装置
識別子は、TCP/IP網2においてデータ利用装置3
a乃至3cを一意に識別可能な情報であれば良く、例え
ば、TCP/IP網におけるノードアドレスをそのまま
用いても良い。本実施例においては図1及び2に示され
るように、データ提供装置1をserver.xxx.or.jpとし、
データ利用装置3a乃至3cの各々を、client_a.xxx.o
r.jp、client_b.xxx.or.jp及びclient_c.xxx.or.jpとし
ている。
Each of the data utilizing devices 3a to 3c fetches the data 4a to 4c provided by the data providing device 1 and executes the business processing required for each. In this case, each of the data 4a to 4c is stored and used in a storage device (not shown) such as a magnetic storage device. FIG. 2 shows a data management structure used in the data providing apparatus shown in FIG. Each of the data 4a to 4c is separately managed corresponding to each of the plurality of data utilization devices 3a to 3c. That is, each of the data use devices 3a to 3c is grouped and held. For example, regarding the data use device 3c, the corresponding data 4c includes a plurality of data items corresponding to data item names of a plurality of types. Each is stored in a one-to-one relationship. The head item name is "device identifier", and the device identifier of the data utilizing device 3c is stored in the corresponding data. The device identifier is used by the data utilization device 3 in the TCP / IP network 2.
Any information that can uniquely identify a to 3c may be used, and for example, the node address in the TCP / IP network may be used as it is. In this embodiment, as shown in FIGS. 1 and 2, the data providing device 1 is server.xxx.or.jp,
Client_a.xxx.o for each of the data use devices 3a to 3c
r.jp, client_b.xxx.or.jp and client_c.xxx.or.jp.

【0011】一方、項目名には「データA」、「データ
B」の如くデータの名称が設定され、対応するデータに
各々、例えば、1111、2222の如く格納される。
従って、データ4a乃至4cに格納されるデータは、デ
ータ利用者装置の装置識別子及び項目名をキーとした更
新処理される。又、利用者装置の識別子がキーとして用
いられることから、項目名に格納されるべきデータの名
称は複数の利用者装置に亘って重複した設定ができる。
On the other hand, data names such as "data A" and "data B" are set in the item names, and the corresponding data are stored as 1111 and 2222, respectively.
Therefore, the data stored in the data 4a to 4c is updated using the device identifier and item name of the data user device as keys. Further, since the identifier of the user device is used as a key, the name of the data to be stored in the item name can be set to be duplicated among a plurality of user devices.

【0012】更新通知テーブル5は、更新されたデータ
の項目名に関係付けられて、更新通知対象となるデータ
利用装置の装置識別子が格納される。ここでは、「デー
タA」が更新されたとして、それを通知すべきデータ利
用装置3cの装置識別子client_c.xxx.or.jpが設定され
ている。同様に、「データD」についてデータ利用装置
3aの装置識別子client_a.xxx.or.jpとデータ利用装置
3cの装置識別子client_c.xxx.or.jpの2つが設定され
ている。即ち、データ名称「データD」のデータが、デ
ータ利用装置3a及び3cの両方について重複して利用
されていて、且つ、更新されていることを示している。
以後、かかる更新通知テーブル5が保持されていること
から、データ提供装置1は、更新通知をなすべきデータ
利用装置がどれであるかを更新通知時に一括して認識す
ることができる。
The update notification table 5 is associated with the item name of the updated data and stores the device identifier of the data utilizing device to be the update notification target. Here, assuming that "data A" has been updated, the device identifier client_c.xxx.or.jp of the data using device 3c to be notified of it is set. Similarly, for "data D", two device identifiers client_a.xxx.or.jp of the data utilizing device 3a and device identifier client_c.xxx.or.jp of the data utilizing device 3c are set. That is, it is indicated that the data of the data name “data D” is used in duplicate for both the data use devices 3a and 3c and is updated.
After that, since the update notification table 5 is held, the data providing apparatus 1 can collectively recognize which data utilization apparatus should perform the update notification at the time of the update notification.

【0013】図3は、図1に示されるデータ提供装置に
おける処理手順を示している。通常、データ利用装置3
a乃至3c、例えばデータ利用装置3cがデータ提供装
置1に対して目的のデータを要求すると(ステップS
1)、これに応じてデータ提供装置1は、当該データを
データ4cから読み出してデータ利用装置3cに送信す
る(ステップS2)。データ利用装置3cはこれを受信
して、自身のデータ記憶媒体に保存して利用する(ステ
ップS3)。
FIG. 3 shows a processing procedure in the data providing apparatus shown in FIG. Normally, the data utilization device 3
a to 3c, for example, the data utilization device 3c requests the target data from the data providing device 1 (step S
1) In response to this, the data providing apparatus 1 reads the data from the data 4c and transmits it to the data using apparatus 3c (step S2). The data use device 3c receives this, stores it in its own data storage medium, and uses it (step S3).

【0014】次にデータの更新要求が発生した場合、例
えば、操作者から指令入力等の外部からの指示に基づい
て、データ提供装置1は、データ4a乃至4cのうちの
更新対象データを更新処理する(ステップS4)。この
場合、データの更新指示は、キー情報として、装置識別
子及びデータの項目名を指定して行う。そして、更新通
知テーブル5における更新済みのデータの項目名に更新
通知を要するデータ利用装置の識別子を関係付ける(ス
テップS5)。この場合、図2のデータ管理構造に示さ
れるように当該更新後データに関係付けられている全て
のデータ利用装置(データ利用装置3a乃至3cの何れ
か又は複数)が更新通知対象のデータ利用装置になる。
When a data update request is generated next, the data providing apparatus 1 updates the update target data of the data 4a to 4c, for example, based on an instruction from the outside such as a command input from the operator. Yes (step S4). In this case, the data update instruction is performed by designating the device identifier and the item name of the data as the key information. Then, the item name of the updated data in the update notification table 5 is associated with the identifier of the data using device requiring the update notification (step S5). In this case, as shown in the data management structure of FIG. 2, all the data utilization devices (any or a plurality of the data utilization devices 3a to 3c) associated with the updated data are the data utilization devices subject to update notification. become.

【0015】次に、データ提供装置1は、例えば、操作
者の指令入力等の外部からの指示に応じて、更新通知を
すべきデータ利用装置の装置識別子を更新通知テーブル
5から検索する(ステップS6)。次いで、検索された
データ利用装置、この例ではデータ利用装置3cに向け
て更新通知を送信する(ステップS7)。次に、更新通
知を受信したデータ利用装置3cは、自身の処理の進捗
に応じて、適宜のタイミングにおいて、データ要求をデ
ータ提供装置1に発信する(ステップS8)。これに応
じて、データ提供装置1は、当該更新後データをデータ
利用装置3cに向けて送信する(ステップS9)。この
データを受信したデータ利用装置3cは、自身が前から
保持していたデータを当該更新後データに置き換えて、
即ち更新して利用する(ステップS10)。
Next, the data providing device 1 searches the update notification table 5 for the device identifier of the data using device to which the update notification is to be issued, for example, in response to an external instruction such as a command input by the operator (step). S6). Next, the update notification is transmitted to the retrieved data use device, in this example, the data use device 3c (step S7). Next, the data utilization device 3c that has received the update notification transmits a data request to the data providing device 1 at an appropriate timing according to the progress of its processing (step S8). In response to this, the data providing apparatus 1 transmits the updated data to the data utilizing apparatus 3c (step S9). Upon receiving this data, the data utilization device 3c replaces the data it previously held with the updated data,
That is, it is updated and used (step S10).

【0016】以上のように、本実施例によれば、データ
提供装置におけるデータ更新と各データ利用装置におけ
るデータ更新との同期は、更新通知を契機としてなされ
る。この更新通知は、更新されたデータに関係付けられ
た複数のデータ利用装置に対して一括して送信可能であ
る。従って、データの同期にかかわるデータ提供装置と
データ利用装置との間でより少ないトラヒックによりデ
ータの同期が達成される。そして、データ利用装置側
は、かかる更新通知を受領後に、更新データに切り替え
るべき利用開始時間に応じたタイミングでデータをデー
タ提供装置から取り込み利用することが可能となる。
As described above, according to this embodiment, the synchronization of the data update in the data providing apparatus and the data update in each data utilizing apparatus is triggered by the update notification. This update notification can be collectively transmitted to a plurality of data utilization devices associated with the updated data. Therefore, data synchronization is achieved with less traffic between the data providing device and the data utilizing device involved in data synchronization. Then, after receiving the update notification, the data utilizing apparatus side can fetch and utilize the data from the data providing apparatus at a timing corresponding to the utilization start time at which the data should be switched to the updated data.

【0017】尚、本実施例におけるデータ提供装置は、
インターネット等のネットワークを介したサーバシステ
ムとして、データ利用装置を通常のパーソナルコンピュ
ータによるクライアントとした構成でも良い。又、デー
タ提供装置が管理及び提供するデータの構成は、図2に
示される如き単純なデータ構造に限られず、関係データ
ベース(RDMS)の如きに多様なデータベースが使用
可能であり、データ利用装置の装置識別子がキーとして
データに関係付けられていれば良い。又、データ利用装
置の数は、本実施例に限られず、多数のデータ利用装置
が用いられ得る。
The data providing apparatus in this embodiment is
As a server system via a network such as the Internet, the data utilization device may be a client using a normal personal computer. Further, the structure of data managed and provided by the data providing apparatus is not limited to the simple data structure shown in FIG. 2, and various databases such as a relational database (RDMS) can be used, The device identifier may be associated with the data as a key. Further, the number of data utilization devices is not limited to this embodiment, and a large number of data utilization devices can be used.

【0018】[0018]

【発明の効果】以上のように、本発明のよるデータ提供
方法及びサーバ装置によれば、複数のデータ利用装置に
一括して送信されるデータ更新通知に応じて、データ利
用装置が自律的にデータの更新をすることが可能とな
る。即ち、データ利用装置側は、自身の処理の進捗に応
じて適宜の時点でデータ更新が可能となる。
As described above, according to the data providing method and the server device of the present invention, the data utilization device autonomously operates in response to the data update notification collectively transmitted to the plurality of data utilization devices. It becomes possible to update the data. That is, the data utilizing apparatus side can update the data at an appropriate time according to the progress of its processing.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施例であり、データ提供装置を含む
システム構成を示しているブロック図である。
FIG. 1 is a block diagram showing a system configuration including a data providing apparatus according to an embodiment of the present invention.

【図2】図1に示されるデータ提供装置において用いら
れるデータ管理構造を示しているブロック図である。
2 is a block diagram showing a data management structure used in the data providing apparatus shown in FIG. 1. FIG.

【図3】図1に示されるデータ提供装置における処理手
順を示しているフローチャートである。
FIG. 3 is a flowchart showing a processing procedure in the data providing apparatus shown in FIG.

【符号の説明】[Explanation of symbols]

1 データ提供装置(DBサーバ) 2 TCP/IP網 3a乃至3c データ利用装置 4a乃至4c データ 5 更新通知テーブル 1 Data providing device (DB server) 2 TCP / IP network 3a to 3c data utilization device 4a to 4c data 5 Update notification table

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 更新処理の管理下にある複数種類のデー
タ片をデータ利用装置に提供するデータ提供方法であっ
て、 前記複数種類のデータ片を前記データ利用装置毎に群分
けして保持するデータ保持ステップと、 前記データ片の更新に応じて、更新後データ片が属する
前記データ利用装置に対応する装置識別子を保持する装
置識別子保持ステップと、 外部からの指示に応じて、前記保持された装置識別子を
検索して、対応するデータ利用装置に更新通知をなす通
知ステップと、 前記データ利用装置からの要求に応じて、前記更新後デ
ータ片を提供する提供ステップと、 を含むことを特徴とするデータ提供方法。
1. A data providing method of providing a plurality of types of data pieces under the control of an update process to a data utilization apparatus, wherein the plurality of types of data pieces are grouped and held for each data utilization apparatus. A data holding step, a device identifier holding step of holding a device identifier corresponding to the data utilization device to which the updated data piece belongs in response to the update of the data piece, and the held in response to an external instruction A notification step of retrieving a device identifier and making an update notification to the corresponding data utilizing device; and a providing step of providing the updated data piece in response to a request from the data utilizing device. How to provide data.
【請求項2】 更新処理の管理下にある複数種類のデー
タ片をデータ利用装置に提供するデータ提供サーバ装置
であって、 前記複数種類のデータ片を前記データ利用装置毎に群分
けして保持するデータ保持手段と、 前記データ片の更新に応じて、更新後データ片が属する
前記データ利用装置に対応する装置識別子を保持する装
置識別子保持手段と、 外部からの指示に応じて、前記保持された装置識別子を
検索して、対応するデータ利用装置に更新通知をなす通
知手段と、 前記データ利用装置からの要求に応じて、前記更新後デ
ータ片を提供する提供手段と、 を含むことを特徴とするデータ提供サーバ装置。
2. A data providing server device for providing a data utilization device with a plurality of types of data fragments under the control of update processing, wherein the plurality of types of data fragments are grouped and retained for each data utilization device. Data holding means, a device identifier holding means for holding a device identifier corresponding to the data utilization device to which the updated data piece belongs in response to the update of the data piece, and the held in accordance with an instruction from the outside. And a notification unit that notifies the corresponding data utilization device of an update, and a providing unit that provides the updated data piece in response to a request from the data utilization device. Data providing server device.
JP2001313621A 2001-10-11 2001-10-11 Data providing method and server device Pending JP2003122611A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001313621A JP2003122611A (en) 2001-10-11 2001-10-11 Data providing method and server device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001313621A JP2003122611A (en) 2001-10-11 2001-10-11 Data providing method and server device

Publications (1)

Publication Number Publication Date
JP2003122611A true JP2003122611A (en) 2003-04-25

Family

ID=19132064

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001313621A Pending JP2003122611A (en) 2001-10-11 2001-10-11 Data providing method and server device

Country Status (1)

Country Link
JP (1) JP2003122611A (en)

Cited By (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8058101B2 (en) 2005-12-23 2011-11-15 Tessera, Inc. Microelectronic packages and methods therefor
US8404520B1 (en) 2011-10-17 2013-03-26 Invensas Corporation Package-on-package assembly with wire bond vias
US8482111B2 (en) 2010-07-19 2013-07-09 Tessera, Inc. Stackable molded microelectronic packages
US8525314B2 (en) 2004-11-03 2013-09-03 Tessera, Inc. Stacked packaging improvements
US8623706B2 (en) 2010-11-15 2014-01-07 Tessera, Inc. Microelectronic package with terminals on dielectric mass
US8835228B2 (en) 2012-05-22 2014-09-16 Invensas Corporation Substrate-less stackable package with wire-bond interconnect
US8878353B2 (en) 2012-12-20 2014-11-04 Invensas Corporation Structure for microelectronic packaging with bond elements to encapsulation surface
US8883563B1 (en) 2013-07-15 2014-11-11 Invensas Corporation Fabrication of microelectronic assemblies having stack terminals coupled by connectors extending through encapsulation
US8975738B2 (en) 2012-11-12 2015-03-10 Invensas Corporation Structure for microelectronic packaging with terminals on dielectric mass
US9023691B2 (en) 2013-07-15 2015-05-05 Invensas Corporation Microelectronic assemblies with stack terminals coupled by connectors extending through encapsulation
US9034696B2 (en) 2013-07-15 2015-05-19 Invensas Corporation Microelectronic assemblies having reinforcing collars on connectors extending through encapsulation
US9082753B2 (en) 2013-11-12 2015-07-14 Invensas Corporation Severing bond wire by kinking and twisting
US9087815B2 (en) 2013-11-12 2015-07-21 Invensas Corporation Off substrate kinking of bond wire
US9093435B2 (en) 2011-05-03 2015-07-28 Tessera, Inc. Package-on-package assembly with wire bonds to encapsulation surface
US9159708B2 (en) 2010-07-19 2015-10-13 Tessera, Inc. Stackable molded microelectronic packages with area array unit connectors
US9214454B2 (en) 2014-03-31 2015-12-15 Invensas Corporation Batch process fabrication of package-on-package microelectronic assemblies
US9224717B2 (en) 2011-05-03 2015-12-29 Tessera, Inc. Package-on-package assembly with wire bonds to encapsulation surface
US9324681B2 (en) 2010-12-13 2016-04-26 Tessera, Inc. Pin attachment
US9349706B2 (en) 2012-02-24 2016-05-24 Invensas Corporation Method for package-on-package assembly with wire bonds to encapsulation surface
US9391008B2 (en) 2012-07-31 2016-07-12 Invensas Corporation Reconstituted wafer-level package DRAM
US9412714B2 (en) 2014-05-30 2016-08-09 Invensas Corporation Wire bond support structure and microelectronic package including wire bonds therefrom
US9502390B2 (en) 2012-08-03 2016-11-22 Invensas Corporation BVA interposer
US9583411B2 (en) 2014-01-17 2017-02-28 Invensas Corporation Fine pitch BVA using reconstituted wafer with area array accessible for testing
US9601454B2 (en) 2013-02-01 2017-03-21 Invensas Corporation Method of forming a component having wire bonds and a stiffening layer
US9646917B2 (en) 2014-05-29 2017-05-09 Invensas Corporation Low CTE component with wire bond interconnects
US9659848B1 (en) 2015-11-18 2017-05-23 Invensas Corporation Stiffened wires for offset BVA
US9685365B2 (en) 2013-08-08 2017-06-20 Invensas Corporation Method of forming a wire bond having a free end
US9691679B2 (en) 2012-02-24 2017-06-27 Invensas Corporation Method for package-on-package assembly with wire bonds to encapsulation surface
US9728527B2 (en) 2013-11-22 2017-08-08 Invensas Corporation Multiple bond via arrays of different wire heights on a same substrate
US9735084B2 (en) 2014-12-11 2017-08-15 Invensas Corporation Bond via array for thermal conductivity
US9761554B2 (en) 2015-05-07 2017-09-12 Invensas Corporation Ball bonding metal wire bond wires to metal pads
US9812402B2 (en) 2015-10-12 2017-11-07 Invensas Corporation Wire bond wires for interference shielding
US9842745B2 (en) 2012-02-17 2017-12-12 Invensas Corporation Heat spreading substrate with embedded interconnects
US9852969B2 (en) 2013-11-22 2017-12-26 Invensas Corporation Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects
US9888579B2 (en) 2015-03-05 2018-02-06 Invensas Corporation Pressing of wire bond wire tips to provide bent-over tips
US9911718B2 (en) 2015-11-17 2018-03-06 Invensas Corporation ‘RDL-First’ packaged microelectronic device for a package-on-package device
US9935075B2 (en) 2016-07-29 2018-04-03 Invensas Corporation Wire bonding method and apparatus for electromagnetic interference shielding
US9984992B2 (en) 2015-12-30 2018-05-29 Invensas Corporation Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces
US10008469B2 (en) 2015-04-30 2018-06-26 Invensas Corporation Wafer-level packaging using wire bond wires in place of a redistribution layer
US10008477B2 (en) 2013-09-16 2018-06-26 Invensas Corporation Microelectronic element with bond elements to encapsulation surface
US10026717B2 (en) 2013-11-22 2018-07-17 Invensas Corporation Multiple bond via arrays of different wire heights on a same substrate
US10181457B2 (en) 2015-10-26 2019-01-15 Invensas Corporation Microelectronic package for wafer-level chip scale packaging with fan-out
US10299368B2 (en) 2016-12-21 2019-05-21 Invensas Corporation Surface integrated waveguides and circuit structures therefor
US10332854B2 (en) 2015-10-23 2019-06-25 Invensas Corporation Anchoring structure of fine pitch bva
US10381326B2 (en) 2014-05-28 2019-08-13 Invensas Corporation Structure and method for integrated circuits packaging with increased density
US10460958B2 (en) 2013-08-07 2019-10-29 Invensas Corporation Method of manufacturing embedded packaging with preformed vias
US10490528B2 (en) 2015-10-12 2019-11-26 Invensas Corporation Embedded wire bond wires
CN115497221A (en) * 2021-06-18 2022-12-20 富士电机株式会社 Communication terminal unit and vending machine system

Cited By (102)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8927337B2 (en) 2004-11-03 2015-01-06 Tessera, Inc. Stacked packaging improvements
US9570416B2 (en) 2004-11-03 2017-02-14 Tessera, Inc. Stacked packaging improvements
US9153562B2 (en) 2004-11-03 2015-10-06 Tessera, Inc. Stacked packaging improvements
US8531020B2 (en) 2004-11-03 2013-09-10 Tessera, Inc. Stacked packaging improvements
US8525314B2 (en) 2004-11-03 2013-09-03 Tessera, Inc. Stacked packaging improvements
US8093697B2 (en) 2005-12-23 2012-01-10 Tessera, Inc. Microelectronic packages and methods therefor
US8058101B2 (en) 2005-12-23 2011-11-15 Tessera, Inc. Microelectronic packages and methods therefor
US8728865B2 (en) 2005-12-23 2014-05-20 Tessera, Inc. Microelectronic packages and methods therefor
US9984901B2 (en) 2005-12-23 2018-05-29 Tessera, Inc. Method for making a microelectronic assembly having conductive elements
US9218988B2 (en) 2005-12-23 2015-12-22 Tessera, Inc. Microelectronic packages and methods therefor
US8482111B2 (en) 2010-07-19 2013-07-09 Tessera, Inc. Stackable molded microelectronic packages
US9570382B2 (en) 2010-07-19 2017-02-14 Tessera, Inc. Stackable molded microelectronic packages
US10128216B2 (en) 2010-07-19 2018-11-13 Tessera, Inc. Stackable molded microelectronic packages
US9159708B2 (en) 2010-07-19 2015-10-13 Tessera, Inc. Stackable molded microelectronic packages with area array unit connectors
US9553076B2 (en) 2010-07-19 2017-01-24 Tessera, Inc. Stackable molded microelectronic packages with area array unit connectors
US8907466B2 (en) 2010-07-19 2014-12-09 Tessera, Inc. Stackable molded microelectronic packages
US9123664B2 (en) 2010-07-19 2015-09-01 Tessera, Inc. Stackable molded microelectronic packages
US8623706B2 (en) 2010-11-15 2014-01-07 Tessera, Inc. Microelectronic package with terminals on dielectric mass
US8957527B2 (en) 2010-11-15 2015-02-17 Tessera, Inc. Microelectronic package with terminals on dielectric mass
US8659164B2 (en) 2010-11-15 2014-02-25 Tessera, Inc. Microelectronic package with terminals on dielectric mass
US8637991B2 (en) 2010-11-15 2014-01-28 Tessera, Inc. Microelectronic package with terminals on dielectric mass
US9324681B2 (en) 2010-12-13 2016-04-26 Tessera, Inc. Pin attachment
US10062661B2 (en) 2011-05-03 2018-08-28 Tessera, Inc. Package-on-package assembly with wire bonds to encapsulation surface
US9224717B2 (en) 2011-05-03 2015-12-29 Tessera, Inc. Package-on-package assembly with wire bonds to encapsulation surface
US9093435B2 (en) 2011-05-03 2015-07-28 Tessera, Inc. Package-on-package assembly with wire bonds to encapsulation surface
US11424211B2 (en) 2011-05-03 2022-08-23 Tessera Llc Package-on-package assembly with wire bonds to encapsulation surface
US9691731B2 (en) 2011-05-03 2017-06-27 Tessera, Inc. Package-on-package assembly with wire bonds to encapsulation surface
US10593643B2 (en) 2011-05-03 2020-03-17 Tessera, Inc. Package-on-package assembly with wire bonds to encapsulation surface
US11735563B2 (en) 2011-10-17 2023-08-22 Invensas Llc Package-on-package assembly with wire bond vias
US11189595B2 (en) 2011-10-17 2021-11-30 Invensas Corporation Package-on-package assembly with wire bond vias
US9761558B2 (en) 2011-10-17 2017-09-12 Invensas Corporation Package-on-package assembly with wire bond vias
US9041227B2 (en) 2011-10-17 2015-05-26 Invensas Corporation Package-on-package assembly with wire bond vias
US9252122B2 (en) 2011-10-17 2016-02-02 Invensas Corporation Package-on-package assembly with wire bond vias
US8836136B2 (en) 2011-10-17 2014-09-16 Invensas Corporation Package-on-package assembly with wire bond vias
US10756049B2 (en) 2011-10-17 2020-08-25 Invensas Corporation Package-on-package assembly with wire bond vias
US9105483B2 (en) 2011-10-17 2015-08-11 Invensas Corporation Package-on-package assembly with wire bond vias
US8404520B1 (en) 2011-10-17 2013-03-26 Invensas Corporation Package-on-package assembly with wire bond vias
US9842745B2 (en) 2012-02-17 2017-12-12 Invensas Corporation Heat spreading substrate with embedded interconnects
US9349706B2 (en) 2012-02-24 2016-05-24 Invensas Corporation Method for package-on-package assembly with wire bonds to encapsulation surface
US9691679B2 (en) 2012-02-24 2017-06-27 Invensas Corporation Method for package-on-package assembly with wire bonds to encapsulation surface
US9953914B2 (en) 2012-05-22 2018-04-24 Invensas Corporation Substrate-less stackable package with wire-bond interconnect
US10170412B2 (en) 2012-05-22 2019-01-01 Invensas Corporation Substrate-less stackable package with wire-bond interconnect
US8835228B2 (en) 2012-05-22 2014-09-16 Invensas Corporation Substrate-less stackable package with wire-bond interconnect
US10510659B2 (en) 2012-05-22 2019-12-17 Invensas Corporation Substrate-less stackable package with wire-bond interconnect
US9391008B2 (en) 2012-07-31 2016-07-12 Invensas Corporation Reconstituted wafer-level package DRAM
US9917073B2 (en) 2012-07-31 2018-03-13 Invensas Corporation Reconstituted wafer-level package dram with conductive interconnects formed in encapsulant at periphery of the package
US9502390B2 (en) 2012-08-03 2016-11-22 Invensas Corporation BVA interposer
US10297582B2 (en) 2012-08-03 2019-05-21 Invensas Corporation BVA interposer
US8975738B2 (en) 2012-11-12 2015-03-10 Invensas Corporation Structure for microelectronic packaging with terminals on dielectric mass
US8878353B2 (en) 2012-12-20 2014-11-04 Invensas Corporation Structure for microelectronic packaging with bond elements to encapsulation surface
US9615456B2 (en) 2012-12-20 2017-04-04 Invensas Corporation Microelectronic assembly for microelectronic packaging with bond elements to encapsulation surface
US9095074B2 (en) 2012-12-20 2015-07-28 Invensas Corporation Structure for microelectronic packaging with bond elements to encapsulation surface
US9601454B2 (en) 2013-02-01 2017-03-21 Invensas Corporation Method of forming a component having wire bonds and a stiffening layer
US9633979B2 (en) 2013-07-15 2017-04-25 Invensas Corporation Microelectronic assemblies having stack terminals coupled by connectors extending through encapsulation
US8883563B1 (en) 2013-07-15 2014-11-11 Invensas Corporation Fabrication of microelectronic assemblies having stack terminals coupled by connectors extending through encapsulation
US9023691B2 (en) 2013-07-15 2015-05-05 Invensas Corporation Microelectronic assemblies with stack terminals coupled by connectors extending through encapsulation
US9034696B2 (en) 2013-07-15 2015-05-19 Invensas Corporation Microelectronic assemblies having reinforcing collars on connectors extending through encapsulation
US10460958B2 (en) 2013-08-07 2019-10-29 Invensas Corporation Method of manufacturing embedded packaging with preformed vias
US9685365B2 (en) 2013-08-08 2017-06-20 Invensas Corporation Method of forming a wire bond having a free end
US10008477B2 (en) 2013-09-16 2018-06-26 Invensas Corporation Microelectronic element with bond elements to encapsulation surface
US9082753B2 (en) 2013-11-12 2015-07-14 Invensas Corporation Severing bond wire by kinking and twisting
US9893033B2 (en) 2013-11-12 2018-02-13 Invensas Corporation Off substrate kinking of bond wire
US9087815B2 (en) 2013-11-12 2015-07-21 Invensas Corporation Off substrate kinking of bond wire
US10290613B2 (en) 2013-11-22 2019-05-14 Invensas Corporation Multiple bond via arrays of different wire heights on a same substrate
US9728527B2 (en) 2013-11-22 2017-08-08 Invensas Corporation Multiple bond via arrays of different wire heights on a same substrate
US10629567B2 (en) 2013-11-22 2020-04-21 Invensas Corporation Multiple plated via arrays of different wire heights on same substrate
US10026717B2 (en) 2013-11-22 2018-07-17 Invensas Corporation Multiple bond via arrays of different wire heights on a same substrate
US9852969B2 (en) 2013-11-22 2017-12-26 Invensas Corporation Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects
US10529636B2 (en) 2014-01-17 2020-01-07 Invensas Corporation Fine pitch BVA using reconstituted wafer with area array accessible for testing
US9583411B2 (en) 2014-01-17 2017-02-28 Invensas Corporation Fine pitch BVA using reconstituted wafer with area array accessible for testing
US9837330B2 (en) 2014-01-17 2017-12-05 Invensas Corporation Fine pitch BVA using reconstituted wafer with area array accessible for testing
US11404338B2 (en) 2014-01-17 2022-08-02 Invensas Corporation Fine pitch bva using reconstituted wafer with area array accessible for testing
US9812433B2 (en) 2014-03-31 2017-11-07 Invensas Corporation Batch process fabrication of package-on-package microelectronic assemblies
US9214454B2 (en) 2014-03-31 2015-12-15 Invensas Corporation Batch process fabrication of package-on-package microelectronic assemblies
US9356006B2 (en) 2014-03-31 2016-05-31 Invensas Corporation Batch process fabrication of package-on-package microelectronic assemblies
US10381326B2 (en) 2014-05-28 2019-08-13 Invensas Corporation Structure and method for integrated circuits packaging with increased density
US10475726B2 (en) 2014-05-29 2019-11-12 Invensas Corporation Low CTE component with wire bond interconnects
US10032647B2 (en) 2014-05-29 2018-07-24 Invensas Corporation Low CTE component with wire bond interconnects
US9646917B2 (en) 2014-05-29 2017-05-09 Invensas Corporation Low CTE component with wire bond interconnects
US9947641B2 (en) 2014-05-30 2018-04-17 Invensas Corporation Wire bond support structure and microelectronic package including wire bonds therefrom
US9412714B2 (en) 2014-05-30 2016-08-09 Invensas Corporation Wire bond support structure and microelectronic package including wire bonds therefrom
US9735084B2 (en) 2014-12-11 2017-08-15 Invensas Corporation Bond via array for thermal conductivity
US10806036B2 (en) 2015-03-05 2020-10-13 Invensas Corporation Pressing of wire bond wire tips to provide bent-over tips
US9888579B2 (en) 2015-03-05 2018-02-06 Invensas Corporation Pressing of wire bond wire tips to provide bent-over tips
US10008469B2 (en) 2015-04-30 2018-06-26 Invensas Corporation Wafer-level packaging using wire bond wires in place of a redistribution layer
US9761554B2 (en) 2015-05-07 2017-09-12 Invensas Corporation Ball bonding metal wire bond wires to metal pads
US11462483B2 (en) 2015-10-12 2022-10-04 Invensas Llc Wire bond wires for interference shielding
US10490528B2 (en) 2015-10-12 2019-11-26 Invensas Corporation Embedded wire bond wires
US10115678B2 (en) 2015-10-12 2018-10-30 Invensas Corporation Wire bond wires for interference shielding
US9812402B2 (en) 2015-10-12 2017-11-07 Invensas Corporation Wire bond wires for interference shielding
US10559537B2 (en) 2015-10-12 2020-02-11 Invensas Corporation Wire bond wires for interference shielding
US10332854B2 (en) 2015-10-23 2019-06-25 Invensas Corporation Anchoring structure of fine pitch bva
US10181457B2 (en) 2015-10-26 2019-01-15 Invensas Corporation Microelectronic package for wafer-level chip scale packaging with fan-out
US10043779B2 (en) 2015-11-17 2018-08-07 Invensas Corporation Packaged microelectronic device for a package-on-package device
US9911718B2 (en) 2015-11-17 2018-03-06 Invensas Corporation ‘RDL-First’ packaged microelectronic device for a package-on-package device
US9659848B1 (en) 2015-11-18 2017-05-23 Invensas Corporation Stiffened wires for offset BVA
US10325877B2 (en) 2015-12-30 2019-06-18 Invensas Corporation Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces
US9984992B2 (en) 2015-12-30 2018-05-29 Invensas Corporation Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces
US10658302B2 (en) 2016-07-29 2020-05-19 Invensas Corporation Wire bonding method and apparatus for electromagnetic interference shielding
US9935075B2 (en) 2016-07-29 2018-04-03 Invensas Corporation Wire bonding method and apparatus for electromagnetic interference shielding
US10299368B2 (en) 2016-12-21 2019-05-21 Invensas Corporation Surface integrated waveguides and circuit structures therefor
CN115497221A (en) * 2021-06-18 2022-12-20 富士电机株式会社 Communication terminal unit and vending machine system

Similar Documents

Publication Publication Date Title
JP2003122611A (en) Data providing method and server device
EP0955761B1 (en) Method and server for accessing a network directory
US6247017B1 (en) Server-client communication over a network
US7103712B2 (en) iSCSI storage management method and management system
US9239767B2 (en) Selective database replication
KR20080068110A (en) A method for processing data synchronization and client terminal, server and data synchronization system thereof
WO2015006970A1 (en) Switching device, controller, and method and system for switching device configuration and packet processing
CN114448686B (en) Cross-network communication device and method based on micro-service
WO2007103405A2 (en) Synchronization of metadata in a distributed file system
CN112328685A (en) Full-peer distributed database data synchronization method
US20060179081A1 (en) Data Synchronisation Across Multiple Data Storages When Processing Transactions Received on a Network
JPH06259308A (en) Method and system for management of decentralized data base
CN106657360A (en) Synchronization method and system for NIS servers under Linux system
JP4272105B2 (en) Storage group setting method and apparatus
CN116346834A (en) Session synchronization method, device, computing equipment and computer storage medium
KR20100026496A (en) The sever, the system and the method for providing dynamic domain name service
JP2002366381A (en) Dynamic exchange processing method for object
JPH1198162A (en) Method for continuously accessing data
TW201715389A (en) Network system and software updating method
CN117390078B (en) Data processing method, device, storage medium and computer equipment
CN115840862B (en) Rapid target query method and system in large-scale scene of network target range
JP2000250918A (en) Distributed data base system, retrieval method and recording medium recording processing program of the method
JP2004096421A (en) Telephone set managing system and program therefor
JP2023532352A (en) Data redistribution method and apparatus
JPWO2019221170A1 (en) Information management system and information management method

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20040916

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20080125

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080205

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20080603