JP2003122030A - Device and method for multiple exposure drawing - Google Patents

Abstract

PROBLEM TO BE SOLVED: To connect circuit patterns which are drawn by individual exposure units with high precision with a simple constitution by using an exposure unit which has many modulating elements arranged in matrix. SOLUTION: A plurality of exposure units each having many modulating elements arrayed in matrix are used to draw specific patterns on a drawing surface through multiple exposure. Then FIFO memories 56201 , 56202 , etc., corresponding to the respective exposure units are provided, and the readout timing of exposure data from those FIFO memories 56201 , 56202 , etc., is adjusted to cancel positional shifts of the circuit patterns due to differences in fitting positions of the exposure unit.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a drawing apparatus and a drawing method for drawing a predetermined pattern on a drawing surface using an exposure unit having a large number of modulators arranged in a matrix.

[0002]

2. Description of the Related Art A drawing apparatus as described above is generally used for optically drawing a fine pattern or a symbol such as a character on the surface of an appropriate object to be drawn. A typical example of use is drawing a circuit pattern when manufacturing a printed circuit board by a photolithography method. In this case, the object to be drawn is a photosensitive film for a photomask or a photomask on the board. It is a resist layer.

In recent years, a series of processes from the circuit pattern design process to the drawing process have been integrated into a system, and the drawing apparatus plays a role in such an integrated system. In addition to the drawing device, the integrated system
CAD (Computer Aided) for designing circuit patterns
Design) station, CAM that edits vector data of circuit patterns obtained at this CAD station
(Computer Aided Manufacturing) Station etc. are provided. The vector data created by the CAD station or the vector data edited by the CAM station is transferred to the drawing device, where it is converted into raster data and then stored in the bitmap memory.

As one type of exposure unit, for example, D
MD (Digital Micromirror Device) or LCD (Li
quid Crystal Display) An array or the like is known. As is well known, micromirrors are arranged in a matrix on the reflecting surface of the DMD, and the reflecting directions of the individual micromirrors are independently controlled. Therefore, the entire reflecting surface of the DMD is covered. The introduced luminous flux is split as a luminous flux reflected by each micromirror, and therefore each micromirror functions as a modulation element. In the LCD array,
Liquid crystal is sealed between a pair of transparent substrates, and a large number of pairs of fine transparent electrodes aligned with each other are arranged in a matrix on both transparent substrates, and whether or not a voltage is applied to each pair of transparent electrodes. Thus, the transmission and non-transmission of the light flux is controlled, so that each pair of transparent electrodes functions as a modulation element.

For the drawing device, a suitable light source device according to the photosensitivity of the object to be drawn, such as an ultra-high pressure mercury lamp, a xenon lamp, a flash lamp, an LED (Light Emitting Diod) is used.
e), a laser and the like are provided, and an imaging optical system is incorporated in the exposure unit. The light flux emitted from the light source device is introduced into the exposure unit through the illumination optical system, and the individual modulation elements of the exposure unit modulate the light flux incident thereon according to the raster data of the circuit pattern, whereby the circuit pattern is formed on the object. And is optically drawn.

Normally, the drawing area of the circuit pattern to be drawn on the drawing object is much larger than the exposure area by the exposure unit. Therefore, in order to draw the entire circuit pattern on the drawing object, the drawing object is drawn. It is necessary to scan the body with the exposure unit. That is, it is necessary to partially draw the circuit pattern while moving the exposure unit relative to the object to be drawn to obtain the entire circuit pattern. Therefore, conventionally, the drawing apparatus is provided with, for example, a drawing table movable along a predetermined scanning direction, and the exposure unit is arranged at a fixed position above the moving path of the drawing table. The object to be drawn is positioned at a predetermined position on the drawing table, and the circuit pattern is partially sequentially drawn and added while intermittently moving the drawing table along the scanning direction, so that the entire circuit pattern is Will be obtained. Such an exposure method is called a step & repeat method.

Since an exposure unit including a DMD or LCD array is generally limited to an area of a few cm square that can be exposed, a plurality of exposure units are arranged in a direction perpendicular to the moving direction of the drawing table, and several exposure units are arranged at a time. The area of 10 cm is exposed.

[0008]

In the conventional drawing apparatus as described above, it is necessary to accurately position the exposure position with respect to the drawing surface of each exposure unit. This is because the positional deviation of each exposure unit directly results in the deviation of the drawing area, that is, the positional deviation of the circuit pattern.

Conventionally, in order to connect circuit patterns drawn by such individual exposure units with high accuracy, the mounting position of the exposure unit has been finely adjusted using a dedicated tool.

However, the work for finely adjusting the mounting position of the exposure unit is a very complicated and time-consuming work, and it has been desired to improve the efficiency.

Therefore, an object of the present invention is a drawing apparatus which draws a predetermined pattern on a drawing surface by using a plurality of exposure units having a large number of modulation elements arranged in a matrix, and has a simple structure. It is an object of the present invention to provide a multiple-exposure drawing apparatus and a multiple-exposure drawing method capable of joining circuit patterns drawn by individual exposure units with high accuracy.

[0012]

A multiple-exposure drawing apparatus according to the present invention uses an exposure unit having a large number of modulators arranged in a matrix to draw a predetermined pattern on a drawing surface by multiple exposure. An exposure drawing apparatus, which comprises an arraying means for arranging a plurality of exposure units along a first direction, and a moving means for moving a drawing surface relative to the exposure unit along a second direction different from the first direction. A timing adjusting means for adjusting the exposure timing of each exposure unit, and when the drawing surface is relatively moved with respect to the exposure unit by the moving means along the second direction It is characterized in that the drawing start positions along the first direction are matched.

In the above multiple exposure drawing apparatus, it is preferable that the timing adjusting means matches the exposure timing of the other exposure unit with the exposure unit of the earliest exposure timing.

In the multiple exposure drawing apparatus, the exposure units may be arranged at different positions in the second direction.

The multiple-exposure drawing apparatus includes exposure data generating means for generating exposure data corresponding to a predetermined pattern for each of the exposure units, and the timing adjusting means specifically for the exposure data to be given to the exposure unit. FIFO (First In First O
ut) has a memory, and adjusts the exposure timing by thinning out a read pulse for this FIFO memory for a predetermined time. This FIFO memory is preferably provided in the same number as the number of exposure units.

In the above multiple exposure drawing apparatus, the exposure units are arranged in a two-row zigzag pattern, and the exposure units in the first row are predetermined with respect to the relative movement direction of the drawing surface with respect to the exposure units in the second row. They may be arranged rearward by a distance.

The multiple-exposure drawing apparatus includes raster data generating means for generating raster data corresponding to a predetermined pattern, and the timing adjusting means further includes a pattern having a length corresponding to at least a predetermined distance in the raster data of the predetermined pattern. Has a buffer memory for temporarily storing the raster data of the second column, and generates the exposure data to be given to the exposure unit of the first column based on the raster data directly obtained from the raster data generating means. The exposure timing is adjusted by generating the exposure data to be given to the exposure unit based on the raster data obtained via the buffer memory.

Further, the multiple exposure drawing apparatus according to the present invention is
A multiple-exposure drawing apparatus that draws a predetermined pattern on a drawing surface by multiple exposure using an exposure unit having a large number of modulation elements arranged in a matrix, wherein a plurality of exposure units are arranged along a first direction. Arranged in a staggered array of rows,
Arrangement means for arranging the exposure unit in the first row rearward from the exposure unit in the second row by a predetermined distance in the second direction different from the first direction, and a drawing surface along the second direction. Is provided relative to the exposure unit, and exposure timing adjusting means for adjusting the exposure timing of at least one of the exposure units in the first row or the second row. When the drawing surface is relatively moved in the second direction, the exposure timing adjusting means matches the drawing start positions of the exposure units in the first and second columns on the drawing surface in the first direction. Is characterized by. In this multiple-exposure drawing apparatus, the exposure timing adjusting means advances the exposure timing of the exposure unit in the second row by a predetermined distance in the second direction between the exposure units in the first and second rows. You may delay by time.

Further, the multiple exposure drawing method of the present invention has a predetermined pattern by using a plurality of exposure units which have a large number of modulation elements arranged in a matrix and are arranged along the first direction. A multiple-exposure drawing method of drawing by multiple exposure on a drawing surface, wherein when the drawing surface is relatively moved along a second direction different from the first direction, by adjusting the exposure timing of each exposure unit, It is characterized in that the drawing start positions along the first direction are matched.

[0020]

BEST MODE FOR CARRYING OUT THE INVENTION Next, an embodiment of a multiple exposure drawing apparatus according to the present invention will be described with reference to the accompanying drawings.

FIG. 1 is a perspective view schematically showing an embodiment of a multiple exposure drawing apparatus according to the present invention. This multiple-exposure drawing apparatus is configured to directly draw a circuit pattern on a photoresist layer formed on a substrate for manufacturing a printed circuit board.

As shown in FIG. 1, the multiple exposure drawing apparatus 10 is shown.
Has a base 12 that is installed on the floor. Base 12
A pair of guide rails 14 are laid in parallel on the top, and a drawing table 16 is mounted on the guide rails 14. The drawing table 16 is driven by a suitable driving mechanism (not shown), such as a ball screw, by a motor such as a stepping motor, so that the drawing table 16 is relatively moved along the pair of guide rails 14 in the longitudinal direction, that is, the X direction. A substrate having a photoresist layer is placed on the drawing table 16 as the drawing target 30, and at this time, the drawing target 30 is appropriately fixed on the drawing table 16 by an appropriate clamp means (not shown).

A pair of guide rails 14 are provided on the base 12.
The gate-like structure 18 is fixedly installed so as to straddle the gate.
A plurality of exposure units are provided on the upper surface of the structure 18 for drawing.
In the Y direction, which is perpendicular to the movement direction (X direction) of the bull 16.
It is arranged in two columns. Eight exposure units arranged in the first row
20 in order from the left side of the figure₀₁, 20₀₃, 20₀₅,
20₀₇, 20₀₉, 20₁₁, 20₁₃And 20₁₅Indicated by
Illustration of 7 exposure units in the 2nd row arranged behind
20 from the left side of₀₂, 20₀₄, 20₀₆, 20 ₀₈, 20
_Ten, 20₁₂And 20₁₄It shows with.

First row exposure unit 20₀₁, 20₀₃,
20₀₅, 20₀₇, 20₀₉, 20₁₁, 20₁₃And 20₁₅
And the exposure unit 20 in the second row₀₂, 20₀₄, 20₀₆,
20 ₀₈, 20_Ten, 20₁₂And 20₁₄Is so-called staggered
Will be placed. That is, the distance between two adjacent exposure units
The separation is set to be approximately equal to the width of one exposure unit.
Exposure unit 20 in the second row₀₂, 20₀₄, 20₀₆,
20₀₈, 20_Ten, 20₁₂And 20₁₄The array pitch of
First row exposure unit 20₀₁, 20₀₃, 20₀₅Two
0₀₇, 20₀₉, 20₁₁, 20₁₃And 20₁₅Array of
It is shifted by half a pitch with respect to Ji.

In the first embodiment, the 15 exposure units 20 _{01 to} 20 ₁₅ are each configured as a DMD unit, and the reflection surface of each exposure unit is, for example, 1024 ×.
It is formed from 1310720 micromirrors arranged in a matrix of 1280. Each exposure unit 20
_{01 to} 20 ₁₅ are installed so that 1024 micromirrors are arranged along the X direction and 1280 micromirrors are arranged along the Y direction.

An appropriate place on the upper surface of the gate structure 18,
For example, the light source device 22 is provided on the left side of the first exposure unit _{20001 in} the drawing. The light source device 22 includes a plurality of LEDs (Light Emitting Diodes) (not shown), and the light emitted from these LEDs is condensed and emitted from the emission port of the light source device 22 as a parallel light flux. The light source device 22 has LE
In addition to D, a laser, an ultra-high pressure mercury lamp, a xenon lamp, a flash lamp or the like may be used.

[0027] The exit of the light source device 22 is connected an optical fiber bundle of cables 15 present, each optical fiber cable 24 is extended to each of the fifteen exposure units 20 ₀₁ to 20 _15, thereby the illumination light is introduced from the light source device 22 to the respective exposure units 20 ₀₁ to 20 _15. Each of the exposure units 200 _{1 to} 20 ₁₅ modulates the illumination light from the light source device 22 according to the circuit pattern to be drawn, and advances on the drawing table 16 below the drawing, that is, inside the gate-shaped structure 18 on the drawing table 30. It emits toward. As a result, only the portion of the photoresist layer formed on the upper surface of the object 30 to be exposed is illuminated with the illumination light.

[0028] Figure 2, main components of the first exposure unit 20 ₀₁ is conceptually illustrated. The other 14 exposure units 20 _{02 to} 20 ₁₅ have the same configuration and function as the first exposure unit 20 _1, and the description thereof will be omitted here.
An illumination optical system 26 and an imaging optical system 28 are incorporated in the first exposure unit 20 ₁ , and DM is provided on the optical path between them.
The D element 27 is provided. The DMD element 27 is a device for operating a square micro mirror having a high reflectance, which is formed by aluminum sputtering on a wafer, by an electrostatic field action. The micro mirror has a size of 1024 × 1280 on a silicon memory chip. 1310720 pieces are spread in a matrix. Each micro mirror can be rotated and tilted about a diagonal line and can be positioned in two stable postures.

The illumination optical system 26 includes a convex lens 26A and a collimating lens 26B, and the convex lens 26A is optically coupled to the optical fiber cable 24 extended from the light source device 22. Such illumination optical system 26, the light beam emitted from the optical fiber cable 24 is formed into a parallel beam LB such as to illuminate the entire reflecting surface of the DMD element 27 of the first exposure unit 20 _01. The image forming optical system 28 includes two convex lenses 28A and 28C and two convex lenses 28A and 28C.
A reflector 28B disposed between A and 28C is included, and the magnification of the imaging optical system 28 is, for example, 1 × (magnification 1).
Is set to.

The individual micromirrors included in the first exposure unit 20 ₀₁ first reflecting position for reflecting the light beam incident on each imaging optical system 28 (hereinafter referred to as a exposure position) and the light beam Is operated so as to be rotationally displaced between a second reflection position (hereinafter, referred to as a non-exposure position) that reflects the light so as to deviate from the imaging optical system 28.
Any micromirror M (m, n) (1 ≦ m ≦ 102
4, 1 ≦ n ≦ 1280) is positioned at the exposure position, the spot light incident thereon is reflected toward the imaging optical system 28 as indicated by the alternate long and short dash line LB ₁ , and the micromirror M (m , N) are positioned in the non-exposure position, the spot light is reflected toward the light absorbing plate 29 and diverted from the image forming optical system 28 as shown by the chain line LB ₂ .

The spot light LB ₁ reflected from the micromirror M (m, n) is guided by the imaging optical system 28 onto the drawing surface 32 of the object 30 to be drawn placed on the drawing table 16. For example, the size of each micro mirror M (m, n) included in the first exposure unit ₂₀₀₀₁ is C × C.
Then, since the magnification of the imaging optical system 28 is equal, the reflecting surface of the micromirror M (m, n) is the drawing surface 32.
An image is formed as the upper C × C exposure area U (m, n).
C is, for example, 20 μm.

One micro mirror M (m, n)
The C × C exposure area obtained by the above is referred to as a unit exposure area U (m, n) in the following description, and is obtained by all the micromirrors M (1,1) to M (1024,1280) (C ×). The exposure area of (1024) × (C × 1280) is referred to as the overall exposure area Ua ₀₁ .

The micromirror M (1,
The unit exposure area U (1,1) corresponding to 1) is located in the lower left corner of the entire surface exposure area Ua ₀₁ , and the micromirror M in the lower left corner.
A unit exposure area U (102
4, 1) is located in the upper left corner of the entire exposure area Ua ₀₁ . Further, the unit exposure area U (1,1280) corresponding to the micro mirror M (1,1280) in the upper right corner is the entire surface exposure area U.
It is located in the lower right corner of a _{01, and} the micromirror M (1
024, 1280) corresponding to the unit exposure area U (102
4, 1280) is located in the upper right corner of the entire exposure area Ua ₀₁ .

In the first exposure unit ₂₀₀₀₁ , the individual micro mirrors M (m, n) are normally positioned at the non-exposure position, but during exposure, they are pivotally displaced from the non-exposure position to the exposure position. The control of the rotational displacement of the micro mirror M (m, n) from the non-exposure position to the exposure position is performed based on the raster data of the circuit pattern, as described later. The spot light LB ₂ diverted from the image forming optical system 28 is prevented from reaching the drawing surface 32 by the light absorbing plate 29.
Absorbed by

[0035] 131 contained in the first exposure unit 20 ₀₁
When all 0720 micromirrors are placed at the exposure position, all the spot lights reflected from all the micromirrors are made incident on the imaging optical system 28, and the first exposure unit 20 ₀₁ is placed on the drawing surface 32. Thus, the entire surface exposure area Ua ₀₁ is formed. Regarding the size of the entire surface exposure area Ua ₀₁ , if the side length C of the unit exposure area U (m, n) is 20 μm, it is 25.6 mm (= 1024 × 20 μm) × 20.4.
It becomes 8 mm (= 1280 × 20 μm), and the total number of pixels included therein is of course 1024 × 1280.

The drawing process in the multiple exposure drawing apparatus will be described with reference to FIGS. Figure 3
(A)-(c) is a figure which shows a change with time of drawing processing in steps, and is a top view of drawing surface 32 of to-be-drawn object 30. For the sake of convenience of the following description, X-Y is on the plane including the drawing surface 32.
A Cartesian coordinate system is defined. Rectangular area surrounded by a broken line 15 of the exposure unit 20 _{01-20 15} entire exposure area Ua ₀₁ obtained on the X-Y plane by each ~U
a ₁₅ . 1st row whole surface exposure area Ua ₀₁ , Ua ₀₃ , U
a ₀₅ , Ua ₀₇ , Ua ₀₉ , Ua ₁₁ , Ua ₁₃ and Ua ₁₅ are arranged so that the lower side in the figure coincides with the Y axis, and the entire surface exposure regions Ua ₀₂ , Ua ₀₄ , Ua ₀₆ , Ua ₀₈ ,
Ua ₁₀ , Ua ₁₂ and Ua ₁₄ are arranged so that the lower side in the figure coincides with a straight line separated from the Y axis by a distance S on the negative side.

The X-axis of the XY Cartesian coordinate system is the exposure unit 2
It is perpendicular to the arrangement direction of _{01 01 to} 20 ₁₅ and therefore 13107 in each exposure unit 20 _{01 to} 20 ₁₅ respectively.
20 (1024 x 1280) micromirrors are also X-
They are arranged in a matrix along the X and Y axes of the Y orthogonal coordinate system.

In FIG. 3, the coordinate origin of the XY Cartesian coordinate system is
First exposure unit 20 in the first row₀₁All obtained by
Surface exposure area Ua₀₁Figure as it matches the lower left corner in the figure
Although shown, to be exact, the coordinate origin is the first exposure unit.
20₀₁The first line of the micromirror along the Y axis of the
Obtained by the first micromirror M (1,1)
Is located at the center of the unit exposure area U (1,1). Above
As described above, in the present embodiment, the unit exposure area U (1,1)
The size is 20μm × 20μm, so the Y-axis is the first dew
Overall exposure area Ua by the optical unit 20₀₁From the boundary of
Only 0 μm has entered the inside. In other words
For example, the eight exposure units 20 in the first row ₀₁, 20₀₃Two
0₀₅, 20₀₇, 20₀₉, 20₁₁, 20₁₃And 20₁₅of
1280 micros included in each first line
All centers of mirror M (1, n) (1 ≦ n ≦ 1280)
Is on the Y-axis.

Since the drawing surface 32 is moved in the negative direction along the X axis by the drawing table 16 as indicated by the white arrow, the entire surface exposure areas Ua _{01 to} Ua ₁₅ are relative to the drawing surface 32. It will move relative to the positive direction of the X axis.

Drawing start position SL set on the drawing surface 32
Is the Y axis, that is, the eight exposure units 20 in the first row₀₁Two
0₀₃, 20₀₅, 20₀₇, 20₀₉, 20₁₁, 20₁₃and
20 ₁₅The entire surface exposure area Ua of the first column corresponding to₀₁, Ua
₀₃, Ua₀₅, Ua₀₇, Ua₀₉, Ua₁₁, Ua₁₃And U
a₁₅If it coincides with the boundary of, the exposure unit of the first row
20₀₁, 20₀₃, 20₀₅, 20₀₇, 20₀₉, 20₁₁Two
0₁₃And 20₁₅The exposure of the drawing surface 32 is started by
It As shown in FIG. 3A, the entire surface exposure area in the first column
Ua₀₁, Ua₀₃, Ua₀₅, Ua₀₇, Ua₀₉, Ua₁₁, U
a₁₃And Ua₁₅Corresponding to the part that has not reached the Y-axis
The micro mirror was positioned in the non-exposure position
No exposure is performed as it is, and the entire surface exposure area Ua in the second row is
₀₂, Ua₀₄, Ua₀₆, Ua₀₈, Ua_Ten, Ua₁₂And U
a₁₄Also does not reach the Y-axis, the exposure unit 20₀₂,
20₀₄, 20₀₆, 20₀₈, 20_Ten, 20₁₂And 20₁₄
The exposure by is also stopped. In FIG. 3, the first column
8 exposure units 20₀₁, 20₀₃, 20₀₅Two
0₀₇, 20₀₉, 20₁₁, 20₁₃And 20₁₅By dew
The illuminated area is indicated by hatching that rises to the right.

When the drawing surface 32 moves further and the boundaries of the entire surface exposure areas Ua ₀₂ , Ua ₀₄ , Ua ₀₆ , Ua ₀₈ , Ua ₁₀ , Ua ₁₂ and Ua ₁₄ coincide with the Y-axis, seven pixels in the second row Exposure units 20 ₀₂ , 20 ₀₄ , 20 ₀₆ , 20 ₀₈ , 2
The exposure with 0 ₁₀ , 20 ₁₂ and 20 ₁₄ is started. Figure 3 (b), the second column of the exposure unit 20 _02,
20 ₀₄ , 20 ₀₆ , 20 ₀₈ , 20 ₁₀ , 20 ₁₂ and 20 ₁₄
The exposure by means of the exposure unit ₂₀₀₀₁ , 2
0 _03, 20 _05, 20 _07, 20 _09, 20 _11, 20 ₁₃ and proceeds with a delay always a distance S than the exposure by 20 _15. In FIG. 3, the exposure units 20 ₀₂ , 2
The areas exposed by 0 ₀₄ , 20 ₀₆ , 20 ₀₈ , 20 ₁₀ , 20 ₁₂ and 20 ₁₄ are indicated by hatching to the lower right.

Further, the drawing surface 32 moves relatively, and FIG.
As shown in (c), the entire surface exposure area Ua of the first column₀₁, U
a₀₃, Ua₀₅, Ua₀₇, Ua₀₉, Ua₁₁, Ua₁₃and
Ua₁₅When the border of reaches the drawing end position EL, the first column
Exposure unit 20₀₁, 20₀₃, 20₀₅, 20₀₇, 20
₀₉, 20₁₁, 20₁₃And 20₁₅Stop the exposure by
To be Strictly speaking, the unit that reaches the drawing end position EL
Micromirror M corresponding to exposure area U (m, n)
It is stopped at the non-exposure position in order from (m, n). Figure 3
The drawing surface 32 further advances by the distance S from the state of (c).
And the entire surface exposure area Ua in the second column₀₂, Ua₀₄, Ua₀₆,
Ua₀₈, Ua_Ten, Ua₁₂And Ua₁₄Ends the drawing
Reaching the position EL, the exposure unit 20 in the second row₀₂, 20
₀₄, 20₀₆, 20 ₀₈, 20_Ten, 20₁₂And 20₁₄By
Exposure is stopped.

As described above, 15 exposure units 20
_{01-20 15} each exposing a band-shaped area in the X-axis, the width of the strip-like regions each entire exposure area Ua ₀₁ ~
Substantially matches the width of Ua ₁₅ . The boundary portion between two adjacent strip-shaped regions is overlapped by a small amount. In addition,
In order to match the circuit patterns to be drawn on the same line, the exposure units 20 ₀₁ , _{200 3} , 20 in the first column
_05, 20 _07, 20 _09, 20 _11, 20 when ₁₃ and 20 exposure data corresponding to the circuit pattern of the predetermined line ₁₅ is provided, the second column of the exposure unit 20 _02, 20 _04, 2
The exposure data of the same line is given to 0 ₀₆ , 20 ₀₈ , 20 ₁₀ , 20 ₁₂ and 20 ₁₄ at a timing delayed by the time when the drawing surface 32 moves the distance S.

As the exposure method, an operation of intermittently moving the drawing table 16 along the scanning direction and an operation of partially and sequentially drawing the circuit pattern when the drawing table 16 is stopped are alternately repeated, A step-and-repeat (Step & Repeat) method may be adopted in which drawing areas are added to obtain the entire circuit pattern, or a method of simultaneously performing drawing operations while moving the drawing table 16 at a constant speed. Good. In the first embodiment, a step-and-repeat method is adopted to facilitate the explanation. That is, the multiple-exposure drawing apparatus 10 employs a drawing method of drawing the circuit pattern by multiple exposure according to the raster data of the circuit pattern while intermittently moving the drawing table 16 at a predetermined movement interval. The principle of such a multiple-exposure drawing method will be described below.

[0045] Figure 4 is a part of the entire exposure area Ua ₀₁ projected onto the drawing surface 32 by the first exposure unit 20 ₀₁ is shown, the entire exposure area Ua ₀₁ each micromirror M (m, n ) From the unit exposure area U (m, n). Here, the parameter m is the first exposure unit 20.
Indicates ₀₁ in the X-axis direction along the line number, the parameter n is a line number along the Y-axis direction of the first exposure unit 20 _01, in the first embodiment 1 ≦ m ≦ 1024 and 1 ≦ n ≦
It becomes 1280.

In short, the unit exposure areas U (1,1), U
(1,2), U (1,3), U (1,4), U (1,
5), ..., U (1,1280) is the first exposure unit 20.
_The unit exposure areas U (2,1) and U (2,2) are obtained from 1280 micromirrors M (1,1) to M (1,1280) of the first line along the Y axis of _01. ), U
(2,3), U (2,4), U (2,5), ..., U
(2,1280) is 1280 micro mirrors M (2 of the second line along the Y-axis of the first exposure unit 20 _01,
1) to M (2,1280), and unit exposure areas U (3,1), U (3,2), U (3,2).
3), U (3,4), U (3,5), ..., U (3,12)
80) micromirror M of the third line along the Y-axis of the first exposure unit _{20 01 (3,1) ~M (3,1280} )
It is obtained from.

For example, the sum of the distance A (for example, A = 4C) and the distance a (0 ≦ a <C) in which the moving distance per exposure is an integral multiple of the size C of one unit exposure area. To explain one case, the drawing table 16 is moved to the negative side along the X axis, that is, the first exposure unit 2
When _{01 01} moves relative to the drawing table 16 toward the positive side of the X-axis and the unit exposure area Ua ₀₁ reaches the drawing start position SL on the drawing surface 32, it is temporarily stopped there and the first exposure unit 20 of ₀₁ of the first line 1280 of the micro-mirror M (1,1) ~M (1,1280) is the first exposure to be operated in accordance with a raster data of a predetermined circuit pattern is carried out. The relative position of the drawing surface 32 at this time is defined as the first exposure position.

When the first exposure is completed, the first exposure unit ₂₀₀₀₁ again moves relative to the positive side along the X-axis, and the movement amount of the unit exposure area Ua ₀₁ becomes (A + a). , The first exposure unit ₂₀₀₀₁ is judged to have reached the second exposure position, and is stopped.
0 ₀₁ 1st to 5th lines of micromirror M (1, 1)
.About.M (5,1280) are operated according to the raster data of a predetermined circuit pattern to perform the second exposure.

When the second exposure is completed, the first exposure unit ₂₀₀₀₁ further moves to the positive side along the X axis (A
+ A) only be stopped at the third exposure position is moved, the first exposure unit 20 ₀₁ of the first to ninth lines micromirror M (1,1) ~M (9,1280) of a predetermined circuit pattern And the third exposure is performed.

In this way, each time the first exposure unit ₂₀₀₀₁ is moved to the positive side along the X axis by the movement amount (A + a), the exposure operation is repeated and the drawing surface 32 is repeated.
That is, the same area is subjected to multiple exposure by the first exposure unit ₂₀₀₀₁ multiple times. For example, a = 0, the first exposure unit 20 ₀₁ is moved to its positive side along the X-axis A (= 4C) by the unit exposure area U (m, n) center is always on the same point of Match. Therefore, the C × C area exposed by the leading micromirror M (1,1) in the first column is further exposed by the (4k + 1) th leading micromirror M (4k + 1,1) ( However, 1 ≦ k ≦ 255, a total of 256 times (= 1024C)
/ A) will be subjected to multiple exposure. On the other hand, when a ≠ 0, the centers of the overlapping unit exposure areas U (m, n) are gradually displaced by the distance a, and therefore the same area is not always subjected to multiple exposure 256 times. Therefore, the predetermined area is set to 25
In order to expose 6 times, 256 centers of each unit exposure area U (m, n) are evenly arranged in this predetermined area,
Substantially 256 times of multiple exposure is performed.

In FIG. 3, the movement direction of the object 30 to be drawn is parallel to the X axis, but it may be moved with a slight angle α with respect to the X axis. At this time, the first exposure unit 20
₀₁ indicates that the unit exposure area U (m, n) is relatively shifted along the Y axis by a predetermined distance every time the unit exposure area U (m, n) is moved by the amount of movement (A + a) along the X axis. It will be.

FIG. 5 shows a unit exposure area U (m, when the object 30 to be drawn is sequentially moved while being inclined with respect to the X axis.
It is a figure which shows the displacement of n) with time. Referring to FIG. 5, a part of the entire surface exposure area Ua ₀₁ at the first exposure position is shown by a broken line, and the entire surface exposure area Ua at the second exposure position is shown.
A part of ₀₁ is shown by a dot-dash line, and a part of the entire surface exposure area Ua ₀₁ at the third exposure position is shown by a solid line, and it follows the negative side of the Y axis of each unit exposure area U (m, n). The distance traveled is indicated by b.

[0053] The first time the first exposure unit 20 ₀₁ of the first line micromirror M in the exposure position (1, 1) to
Unit exposure area U obtained by M (1,1280)
Focusing on (1,1), U (1,2), ... U (1,1280), these unit exposure regions U (1,1), U (1,2)
2), ... with respect to U (1,1280), units obtained by the first exposure unit 20 ₀₁ of the fifth line micromirrors M in the second exposure position (5,1) ~M (5,1280) Exposure areas U (5,1), U (5,2), ...
U (5,1280) overlaps each other with (+ a) and (-b) offset along the X and Y axes, respectively.
Further, at the third exposure position, the first exposure unit 2
0 ₀₁ 9th line micromirrors M (9,1) to M
Unit exposure area U obtained by (9,1280)
(9,1), U (9,2), ... U (9,1280) are
(+ 2a) and (-) in the X-axis direction and the Y-axis direction, respectively.
2b) and will overlap each other. In addition,
In FIG. 5, three unit exposure areas U that overlap each other
(1,1), U (5,1) and U (9,1) are exemplarily shown by a broken line, a one-dot chain line and a solid lead line, respectively.

Here, the relative position of each unit exposure region U (m, n) is represented by the position of the exposure point CN (m, n) which is the center of the unit exposure region U (m, n).
(5, 1) is the exposure point CN at the first exposure position
The exposure point CN (9,1) at the third exposure position is (+ 2a)-(+ 2a) apart from (1,1) at the first exposure position. ，
-2b) will exist. The distance between adjacent exposure points on each line matches the size C (= 20 μm) of the unit exposure area U (m, n).

As described above, when the moving distance is the sum of four times the side length C of the unit exposure area U (m, n) and the distance a, the distances a and b are appropriately selected. , An area C × C of the same size as each unit exposure region U (m, n)
The exposure points can be evenly distributed within.

For example, as shown in FIG. 6, an area C × C (= 20 μm ×) having the same size as the unit exposure region U (m, n).
In order to distribute 256 exposure points within 20 μm), 16 centers of 256 unit exposure areas should be arranged along the X-axis and the Y-axis, respectively.
The distances a and b are defined by the following calculation formulas. a = C / 16 = 20 μm / 16 = 1.25 μm b = C / 256 = 20 μm / 256 = 0.078125
μm

Needless to say, the distance b is 0.0
Setting to 78125 μm means that when the drawing table 16 is moved to the negative side of the X-axis by a distance (A + a = 81.25 μm), each unit exposure area U (m, n) becomes Y.
The inclination angle α of the drawing table 16 (about 1.68 × 10) so as to shift 0.078125 μm to the negative side of the axis.
^-5 degrees) is nothing but setting.

In FIG. 6, the exposure point indicated by reference numeral CN (1,1) is, for example, the first exposure position at the first exposure position.
Units obtained by the beginning of the micro-mirror M of the first line of the exposure unit 20 ₀₁ (1,1) exposure area U (1,
When those of 1), as is clear from the foregoing description, the exposure point CN (5,1) is the top of the micromirror M of the fifth line of the first exposure unit 20 ₀₁ in the second exposure position ( 5, 1) unit exposure area U obtained by
(5, 1), and the exposure point CN (9, 1) is the third
Becomes round eyes exposed first exposure unit at position 20 ₀₁ of the ninth line of the top of the micromirror M (9,1) unit exposure regions obtained by U (9,1).

Further, the exposure point CN (61, 61, distant from the exposure point CN (1, 1) by a distance (+ 16a, -16b)).
1) is the center of the unit exposure area U (61,1) obtained by the micromirror M (61,1) at the head of the 61st line at the 16th exposure position, and the exposure point CN
Exposure point CN distant from (1,1) by a distance (0, -a)
(65,1) is the center of the unit exposure area U (65,1) obtained by the micromirror M (65,1) at the head of the 65th line at the 17th exposure position. Similarly, the exposure point CN (65,1), which is separated from the exposure point CN (1,1) by the distance (0, -15a), is the first micromirror M of the 961th line at the 241st exposure position.
(961,1) unit exposure area U (96
The exposure point CN (102
1, 1) is the center of the unit exposure area U (1021,1) obtained by the micromirror M (1021,1) at the head of the 1021st line at the 256th exposure position.

Thus, 15 exposure units 20 _01-
20 ₁₅ for the drawing table 16 X
When the negative side of the axis is moved intermittently, their exposure unit 20 _{01-20 15} individual micromirrors M (m,
n) the center of the unit exposure area U (m, n) obtained by
That is, the exposure points CN (m, n) are arranged over the entire drawing surface 32 at the pitches a and b along the X axis and the Y axis, respectively. 256 exposure points are uniformly distributed in a region C × C (20 μm × 20 μm) having the same size as each unit pixel region.

Of course, it is also possible to distribute the individual exposure points in the exposure units 20 _{01 to} 20 ₁₅ in a higher density over the entire drawing surface 32.
When the centers of 512 unit exposure areas are uniformly arranged in an area of 0 μm × 20 μm, the distance A is set to twice the size C of the unit exposure area (40 μm), and the distances a and b are 1 respectively. 0.25 μm / 2, 0.078125
It is set to μm / 2.

Further, in the example shown in FIG. 6, 16 exposure points are arranged in parallel along the Y-axis, but the exposure points can be changed to the Y-axis by slightly changing the values of the distances a and b. It is also possible to arrange them diagonally.

As described above, in the multiple-exposure drawing apparatus 10 of the first embodiment, when the circuit pattern is drawn based on the raster data of the circuit pattern, what is the pixel size of the circuit pattern data? Even
It is possible to draw the circuit pattern. In other words, it can be said that the concept of a pixel for a circuit pattern to be drawn does not exist on the side of the multiple exposure drawing apparatus 10.

For example, the pixel size of raster data is 20
In the case of setting to 1 μm × 20 μm, if “1” is given to any 1-bit data, one pixel area (20 μm × 20
.mu.m) corresponding to each exposure point CN (m, n) corresponding to each micromirror M (m, n) is operated by the 1-bit data to rotate from the non-exposure position to the exposure position. One pixel area (20μm × 20μ
m) will receive multiple exposures a total of 256 times.

As another example, when the pixel size of the raster data is set to 10 μm × 10 μm, if “1” is given to any 1-bit data, the 1-bit data will be added to the 1-bit data during the exposure operation. Individual exposure points CN included in the corresponding one pixel area (10 μm × 10 μm)
The micromirror M (m, n) corresponding to (m, n) is operated by the 1-bit data to be rotated from the non-exposure position to the exposure position, whereby the one pixel area (1
0 μm × 10 μm) will be subjected to multiple exposure a total of 64 times.

The exposure time, that is, the time during which the individual micromirrors M (m, n) remain at the exposure position is determined by the number of exposures within one pixel area on the drawing surface 32 and the object 30 (first embodiment). In the form, it is determined based on the sensitivity of the photoresist layer), the light intensity of the light source device 22, and the like, and is set so as to obtain a desired exposure amount for each one-pixel exposure region.

FIG. 7 is a block diagram of the multiple exposure drawing apparatus 10. As shown in the figure, the multiple exposure drawing apparatus 10 is provided with a system control circuit 34 including a microcomputer. More specifically, the system control circuit 34 includes a central processing unit (CPU),
A read-only memory (ROM) for storing programs and constants for executing various routines, a writable / readable memory (RA) for temporarily storing operation data, etc.
M) and an input / output interface (I / O), and controls the overall operation of the multiple exposure drawing apparatus 10.

The drawing table 16 is driven by the drive motor 36 along the X-axis direction. The drive motor 36 is configured as, for example, a stepping motor, and its drive control is performed according to the drive pulse output from the drive circuit 38. A drive mechanism including a ball screw or the like is interposed between the drawing table 16 and the drive motor 36, as described above.
Is symbolically indicated by a dashed arrow.

The drive circuit 38 is a drawing table control circuit 40.
This drawing table control circuit 4 is operated under the control of
0 is connected to the drawing table position detection sensor 42 provided in the drawing table 16. The drawing table position detection sensor 42 detects an optical signal from the linear scale 44 installed along the movement path of the drawing table 16 to detect the position of the drawing table 16 in the X-axis direction. In FIG. 7, detection of an optical signal from the linear scale 44 is symbolically shown by a broken line arrow.

While the drawing table 16 is moving, the drawing table position detection sensor 42 sequentially detects a series of optical signals from the linear scale 44 and outputs them as a series of detection signals (pulses) to the drawing table control circuit 40. The drawing table control circuit 40 appropriately processes the series of detection signals input thereto, and creates a series of control clock pulses based on the detection signals. Drawing table control circuit 40
Outputs a series of control clock pulses to the drive circuit 38, and the drive circuit 38 creates drive pulses for the drive motor 36 in accordance with the series of control clock pulses. In short, the drawing table 16 can be moved along the X-axis direction with accuracy according to the accuracy of the linear scale 44. Note that such a drawing table 16
The movement control itself is well known.

As shown in FIG. 7, the drawing table control circuit 40 is connected to the system control circuit 34, so that the drawing table control circuit 40 is controlled by the system control circuit 34. On the other hand, a series of detection signals (pulses) output from the drawing table position detection sensor 42 are also input to the system control circuit 34 via the drawing table control circuit 40, whereby the system control circuit 34 causes the system control circuit 34 to display the X-axis of the drawing table 16. The position of movement along can be constantly monitored.

The system control circuit 34 is a LAN
It is connected to a CAD station or a CAM station via (Local Area Network), and the vector data of the circuit pattern created there is transferred to the system control circuit 34 from the CAD station or the CAM station. System control circuit 34
A hard disk device 46 is connected as a data storage means to the HDD, and when the vector data of the circuit pattern is transferred from the CAD station or the CAM station to the system control circuit 34, the system control circuit 34 once outputs the vector data of the circuit pattern to the hard disk device 46. Write to and store. The system control circuit 34 has a keyboard 48 as an external input device.
Are connected, and various command signals, various data, and the like are input to the system control circuit 34 via the keyboard 48.

The raster conversion circuit 50 is operated under the control of the system control circuit 34. Prior to the drawing operation, the vector data of the circuit pattern is read from the hard disk device 46 and output to the raster conversion circuit 50. This vector data is read by the raster conversion circuit 50.
It is converted into a bit data string consisting of 0'and '1', that is, raster data, and this raster data is stored in the bit map memory 5
Written to 2. In short, the bitmap memory 52 stores the raster data of the circuit pattern. For the data conversion processing in the raster conversion circuit 50 and the data writing processing to the bitmap memory 52, the keyboard 48 is used.
It is started by a command signal input via.

An exposure data generation circuit 54 is connected to the subsequent stage of the bit map memory 52. Exposure data generation circuit 5
Reference numeral 4 denotes each of the exposure units 20 _{01 to} 20 ₁₅ based on the raster data sequentially read from the bitmap memory 52.
Exposure data to be supplied to the exposure timing adjusting circuit 56 is output. The exposure data is binary data for positioning the individual micromirrors of each exposure unit 20 _{01-20 15} to the exposure position or unexposed position, the exposure unit 20 _{01-20 15} every exposure operation is repeated by Can be rewritten as

The exposure timing adjusting circuit 56 will be described later.
Each exposure unit 20₀₁~ 20 ₁₅Give exposure data to
Output timing to the DMD drive circuit 58.
It The DMD drive circuit 58 is the exposure timing adjustment circuit 56.
15 exposure units based on the exposure data obtained from
20₀₁~ 20₁₅Drive and control independently,
Each exposure unit 20₀₁~ 20₁₅Individual micromi
The laser will selectively perform the exposure operation. Note that FIG.
Then, the exposure operation of the individual micromirrors is indicated by the dashed arrow.
It is schematically shown. Also, in FIG. 7, avoiding complication of the drawing.
Only one exposure unit is shown to avoid
Actually 15 (20₀₁~ 20₁₅) Existence and DMD drive
It goes without saying that each is driven by the circuit 58.
Absent.

In the above-described first embodiment, during the drawing operation,
Drawing table 16 is stopped each time it reaches the exposure position, it is carried out exposure operation by the exposure unit 20 _{01-20 15} at its stop position. However, during drawing operation,
While continuously moving at a constant speed without moving the drawing table 16 intermittently, it is also possible to perform the exposure operation by the exposure unit 20 _{01-20 15} under predetermined conditions.

More specifically, the drawing table 16 displays the distance (A
+ A) every time the unit moves, exposure units 20 _{01 to} 20 ₁₅
The exposure operation is started in the same manner as in the above-described first embodiment, but with respect to the exposure time, the drawing table 16 has a size (20 μm) of the unit exposure region obtained by the individual micromirrors of each exposure unit. The time taken to travel a smaller distance d. By setting the exposure time in this way, not only the circuit pattern can be drawn in the same manner as in the above case, but also the drawing time required for drawing the circuit pattern can be shortened. Further, as another advantage of continuously moving the drawing table 16 at a constant speed during the drawing operation, the drawing table 1
It can also be mentioned that the drive system of 6 is unlikely to fail.

FIG. 8 shows the exposure data generating circuit 54 and the exposure.
A block showing a part of the optical timing adjustment circuit 56 in detail.
It is a figure. The exposure data generation circuit 54 has 15 exposures.
Unit 20₀₁~ 20₁₅Data generation corresponding to each
Although there is a timing adjustment circuit,
1, 2nd exposure unit 20₀₁And 20₀₂Corresponding to
First and second data generation circuit 54₀₁And 54₀₂Only shown
The remaining 13 data generation circuits have the same configuration.
Therefore, it is omitted. Also, the exposure timing adjustment circuit
Exposure unit 20 for 56₀₁~ 20₁₅Corresponding to
15 timing adjustment circuits are provided.
In 8, the first and second timing adjustment circuits 56 ₀₁And 56
₀₂Only shown.

The first data generation circuit 54 ₀₁ corresponds to the raster data corresponding to the area to be exposed of the corresponding first exposure unit ₂₀₀₀₁ , strictly speaking, the first divided area having a width larger than the area actually exposed. Is obtained from the bit map memory 52 and stored in the exposure data memory 542 ₀₁ . Then, the read address control circuit 544 ₀₁ selectively reads the raster data from the exposure data memory 542 ₀₁ to generate the exposure data to be given to the first exposure unit 20 ₀₁ , and outputs it to the first timing adjustment circuit 56 ₀₁ . . When performing coordinate transformation or the like, read address data sent from the read address control circuit 544 ₀₁ is changed.

The first timing adjustment circuit 54 ₀₁ has a FIF.
O (First In First Out) memory 562 ₀₁ is provided,
The FIFO memory 562 ₀₁ micromirrors arranged in a matrix of 1024 × 1280 to M (m, n)
Exposure data of 1310720 corresponding to is temporarily stored. The writing to the FIFO memory 562 ₀₁ is performed in synchronization with the control clock pulse CLK0 output from the system control circuit 34, and the exposure data output from the first data generation circuit 54 ₀₁ is sequentially FIFO-read in the order of reading. It is written to memory 562 _01. The read from the FIFO memory 542 ₀₁ is the read clock pulse CLK output from the pulse control circuit 564 _01.
The exposure data is read in order from the exposure data input in the FIFO memory 562 ₀₁ in synchronism with the first data.

The pulse control circuit 564 ₀₁ controls the control clock pulse C input from the system control circuit 34.
The read clock pulse CLK1 is generated based on LK0, the exposure clock pulse E_CLK, and the pulse data N ₀₁ . The control clock pulse CLK0 is 13107
The exposure clock pulse E_CL is a pulse for controlling the timing of sequentially operating each of the 20 micromirrors.
K is a pulse for unifying the exposure timing of all the exposure units 20 _{01 to} 20 ₁₅ . The period t _e of the exposure clock pulse E_CLK is the control clock pulse CLK0.
The period is 1310720 times or more. The pulse data N ₀₁ will be described later in detail.

[0082] In the first embodiment, and adjusts the output timing of the exposure data from the FIFO memory 562 ₀₁ by controlling the read clock pulse CLK1, thereby exposing the timing of the first exposure unit 20 _01, namely drawing The relative position of the entire exposure area Ua _{01 with} respect to the surface 32 can be adjusted.

The second timing adjusting circuit 56 ₀₂ and the remaining 13 timing adjusting circuits also have the same structure as the first timing adjusting circuit 56 _01, and the output timing of the exposure data can be adjusted independently. Therefore, even if the mounting position of the exposure unit 20 _{01-20 15} is deviated in the X direction, the read clock pulses so as to cancel the deviation (CLK1, CLK2, ...) by adjusting the drawing surface 32 on It is possible to accurately match the exposure areas in the same line on the same line, and draw the circuit pattern so that the joints are inconspicuous.

In FIG. 8, the second data generation circuit 5
4 ₀₂ exposure data memory and read address control each of the circuits code 542 _02, 544 ₀₂ are attached, respectively code 562 ₀₂ and 564 ₀₂ are assigned the FIFO memory and the pulse control circuit of the second timing adjusting circuit 56 ₀₂ ing.

FIG. 9 shows three exposure units 20 ₀₁ , 20.
And ₀₂ and 20 ₀₃ of the relative position is a schematic view showing the relative position of each entire exposure area Ua _01, Ua ₀₂ and Ua ₀₃ on drawing surface 32. FIG. 10 shows the exposure clock pulse E_
CLK, exposure number, pulse data, control clock pulse CLK0, each read clock pulse CLK1, CLK2
3 is a timing chart showing CLK3 and CLK3, respectively. The other exposure units 20 _{04 to} 20 ₁₅ are omitted here.

Originally, the first exposure unit ₂₀₀₀₁ and the third exposure unit ₂₀₀₀₃ must be accurately positioned on the same line, but in reality, each exposure unit 2
A mounting error may occur when mounting _{01 to} 20 ₁₅ on the gate-shaped structure 18. For example, as shown in FIG.
If the third exposure unit 20 ₀₃ is attached to the positive side only X axis distance T from the first exposure unit 20 _01, the exposure operation at the same timing when the drawing surface 32 is moving to the negative side of the X-axis Is executed, the entire surface exposure area Ua ₀₃ is displaced from the entire surface exposure area Ua ₀₁ by the distance T to the positive side of the X axis.

Therefore, both whole surface exposure areas Ua₀₁And Ua
₀₃In order to align the positions in the X direction, as shown in FIG.
First exposure unit 20₀₁The exposure start timing by
The number of exposures performed while the drawing surface 32 advances by the distance T
Only the third exposure unit 20 ₀₃Start exposure by
I'm behind it. Make this exposure timing the earliest
Exposure unit 20₀₃The delay in the number of exposures based on
It is defined as pulse data, and this pulse data is 14
Individual exposure unit 20₀₁, 20₀₂, 20₀₄, ... 20₁₅To
The system control circuit 34
Calculated for each individual pulse control circuit 544₀₁, 54
Four₀₂, ...

The pulse data will be described in detail. The displacement amount of the entire surface exposure region Ua _{01 in} the X direction with respect to the entire surface exposure region Ua ₀₃ is the distance T, and the movement amount per exposure is (A +
if it was a), pulse data N ₀₁ for determining the exposure start timing with the first exposure unit 20 ₀₁ is calculated by the following equation (1). N ₀₁ = INT [T / (A + a)] (1) Generally, when the division e / f is performed, the operator INT [e / f] represents the quotient of the division e / f. , 0 ≦ e <f
, INT [e / f] = 0 is defined.

Here, the number of exposure clock pulses E_CLK is defined as an exposure number. When the read clock pulse CLK3 is output in synchronization with the first rising edge of the exposure clock pulse E_CLK, the read clock pulse CLK1 is output in synchronization with the (1 + N ₀₁ ) th rising edge of the exposure clock pulse E_CLK.
Thus, reading of the exposure data from the FIFO memory 542 _01, than the FIFO memory 542 ₀₃ Time (t _e ×
N ₀₁ ) will be delayed. In other words, if the third exposure unit 20 ₀₃ by starting the exposure operation from the exposure number "1", the first exposure unit 20 ₀₁ exposure operation from the time (t _e × N ₀₁₎ delayed by exposure number "1 + N _01" Will start.

In this way, the system control circuit 3
Reference numeral 4 calculates pulse data for delaying and outputting the control clock pulse CLK0 having a predetermined cycle, and outputs the pulse data to the pulse control circuit 544. The pulse control circuit 544 delays the input control clock pulse CLK0 by the time when the number of exposures of the pulse data is completed and outputs it as the read clock pulse CLK1.

In addition, the remainder (T-
If N ₀₁ × (A + a)) is not 0, the raster data to be read from the bitmap memory 52 of FIG. 7 may be shifted by the number of pixels corresponding to the remainder. As a result, the exposure position of the first exposure unit ₂₀₀₀₁ with respect to the X direction can be more closely matched to the exposure position of the third exposure unit ₂₀₀₀₃ .

[0092] Similarly, for the second exposure unit 20 _02,
If mounted at a distance S on the negative side of the X-axis than the first exposure unit 20 _01, a distance from the third exposure unit 20 ₀₃ is the (S + T). Thus, the pulse data N ₀₂ indicating the exposure start timing of the second exposure unit 20 ₀₂ is determined by the following equation (2). N ₀₂ = INT [(S + T) / (A + a)] (2)

Therefore, the read clock pulse CLK2 is output in synchronization with the (1 + N ₀₂ ) th rising edge of the exposure clock pulse E_CLK, and the FIFO memory 562 ₀₂ is output.
The exposure data can be read from the FIFO memory 562.
It will only delay that time also (t _e × N ₀₂₎ than _03. In other words, the second exposure unit ₂₀₀₂ has the exposure number "1+".
The exposure operation starts from N ₀₂ ″. Similarly, the remainder ((S + T) −N ₀₂ ×
If (A + a)) is not 0, the position where the raster data is read from the bitmap memory 52 in FIG. 7 is shifted by the number of pixels corresponding to the remainder. As a result, on the drawing surface 32, the exposure start position of the second exposure unit _{2000 in} the X direction and the exposure start position of the first exposure unit ₂₀₀₀₁ become the same.

As described above, in the multiple-exposure drawing apparatus 10 of the first embodiment, the exposure timing adjusting circuit 56 adjusts the timing of sending the exposure data to each exposure unit, so that the overall exposure area Ua in the X-axis direction is obtained. _It is configured to cancel the positional deviation of _{01 to} Ua ₁₅ , so that even if the exposure units 200 _{1 to} 20 ₁₅ are mounted while being displaced in the X-axis direction, fine adjustment for matching the individual exposure start positions can be performed. Easy to do. The exposure number set in the pulse control circuit of each timing adjustment circuit is calculated in advance based on the actual measurement value of the relative position of each entire surface exposure area.

Next, a second embodiment of the multiple exposure drawing apparatus according to the present invention will be described with reference to FIGS. 11 and 12. FIG. 11 is a block diagram of the multiple exposure drawing apparatus, and FIG. 12 is a block diagram showing the exposure timing adjusting circuit in detail together with a part of the exposure data generating circuit. In the multiple-exposure drawing apparatus of the first embodiment, while the configuration is such that the deviation of the exposure timing of each exposure unit is adjusted,
The multiple-exposure drawing apparatus of the second embodiment differs from that of the first embodiment in that the exposure timing deviations of the exposure units in the first and second columns are adjusted, and other configurations are the same as those in the first embodiment. It is the same. Here, the same components as those in the first embodiment are designated by the same reference numerals and the description thereof will be omitted.

The multiple exposure drawing apparatus of the second embodiment is provided with an exposure timing adjusting circuit 156 between the raster conversion circuit 50 and the exposure data generating circuit 54, and this exposure timing adjusting circuit 156 has one buffer memory. 157
Is provided. The raster data of the circuit pattern output from the raster conversion circuit 50 to the exposure timing adjustment circuit 156 is directly sent to the exposure data generation circuit 54, while it is delayed by a predetermined time in the buffer memory 157 and indirectly exposed by the exposure data generation circuit 54. Sent to.

In the exposure data generation circuit 54, the data generation circuits (only the first data generation circuit 54 ₀₁ is shown in FIG. 12) corresponding to the exposure units ₂₀₀₀₁ , ₂₀₀₃ , ..., 20 ₁₅ in the first column are delayed. each generates exposure data based on the raster data sent without the second row of the exposure unit 20 _02, 20 _04, ..., the data generation circuit corresponding to 20 ₁₄ (FIG. 12, the second data generating circuit (Only 54 ₀₂ is shown)
Generates the exposure data based on the raster data delayed by the buffer memory 157 and sent. The delay time of the raster data by the buffer memory 157, the first column of the exposure unit 20 _01, 20 _03, ..., the second column of the exposure unit for 20 ₁₅ 20 _02, 20 _04, ..., 20
Drawing surface 3 by the amount of deviation T of _{14 in} the X direction (see FIG. 9)
It corresponds to the time when 2 advances.

[0098] More specifically the configuration and functions of the buffer memory 157, the buffer memory 157 is the first column of the exposure unit 20 _01, 20 _03, ..., 20 ₁₅ and the second row of the exposure unit 20 _02, 20 _04, .., 20 _14, and has a capacity for storing raster data corresponding to the amount T of displacement in the X direction of the mounting position. The write operation and read operation of the buffer memory 157 are controlled by the system control circuit 34.

[0099] Thus, according to the multi-exposure drawing apparatus of the second embodiment, the exposure unit 20 _01, 20 _02, ..., 20
_{When 15s} are arranged in two rows at different positions in the X direction, the buffer memory 157 causes the exposure unit 20 in the second row located in front of the drawing surface 32 in the traveling direction.
The exposure timings of ₀₂ , 20 ₀₄ , ..., 20 ₁₄ are delayed so that the exposure units 2000 ₁ , _{200 2} ,
The drawing start positions of 20 ₁₅ can be matched.
In particular, since it suffices to provide only one buffer memory 157, the positional shift between the two columns can be eliminated with a simple configuration.

Note that one buffer memory used in the second embodiment may be applied to the first embodiment. That is, for example, a buffer memory may be provided between the bitmap memory (52) and the exposure data generation circuit (54). According to this configuration, one buffer memory roughly adjusts the positional deviation of the second column with respect to the first column, and
With the five FIFO memories, it is possible to finely adjust the positional deviation in the exposure units in the same column. By adding the buffer memory, each FIFO memory only needs to have a memory capacity for adjustment between the exposure units in the same column, so that the memory capacity can be much smaller than that in the first embodiment.

[0101]

As is apparent from the above description, according to the present invention, it is possible to properly draw a predetermined pattern regardless of the size of the pixel data of the pattern data. A CAD station or CA can be prepared by preparing only one multiple exposure drawing apparatus according to the present invention.
The degree of freedom in designing the circuit pattern at the M station can be greatly increased.

Further, in the multiple exposure drawing apparatus according to the present invention, the error of the mounting position of each exposure unit is canceled by adjusting the output timing of the exposure data, and thus high-precision positioning is not necessary. , The complicated installation work can be made much more efficient.

Further, as one of the characteristic effects obtained by the present invention, even if some of the modulation elements in the exposure unit do not function normally, pattern drawing can be performed without causing pixel defects. There is also the point that it can be done properly. Because the drawing pattern area is obtained by multiple exposure over multiple exposure operations, the total exposure amount of the drawing pattern area is sufficient even if the exposure operation of several times is not normally performed. This is because it can be obtained.

As another effect obtained from the multiple exposure drawing apparatus according to the present invention, even if there is exposure unevenness due to the imaging optical system incorporated in each exposure unit,
Another effect is that the effect of uneven exposure is reduced due to multiple exposure.

As a further effect obtained from the multiple exposure drawing apparatus according to the present invention, a sufficient exposure amount for multiple exposure can be secured even if the output of the light source device is low.
Another point is that the light source device can be constructed at low cost.

[Brief description of drawings]

FIG. 1 is a schematic perspective view of a multiple exposure drawing apparatus according to the present invention.

FIG. 2 is a schematic conceptual diagram for explaining a function of an exposure unit used in the multiple exposure drawing apparatus according to the present invention.

3 is a plan view for explaining a drawing surface of an object to be drawn on a drawing table of the multiple-exposure drawing device shown in FIG. 1 and an exposure area by each exposure unit.

FIG. 4 is a schematic diagram for explaining the principle of a multiple-exposure drawing method executed by the multiple-exposure drawing apparatus according to the present invention, in which exposure units are provided at a plurality of exposure positions along the X axis of the XY coordinate system. It is a figure which shows the state moved sequentially.

FIG. 5 is a schematic view similar to FIG. 4, in which the exposure unit is moved a predetermined distance along the Y axis when the exposure unit is sequentially moved to a plurality of exposure positions along the X axis of the XY coordinate system. It is a figure which shows the state displaced only by time.

FIG. 6 shows how the center of a unit exposure area obtained by a predetermined micromirror of the exposure unit when the exposure unit is sequentially moved to a plurality of exposure positions according to the multiple exposure method of the present invention is distributed within the predetermined area. It is explanatory drawing which shows whether it does.

FIG. 7 is a block diagram of a multiple exposure drawing apparatus according to the present invention.

8 is a block diagram showing a part of the exposure data generation circuit and the exposure timing adjustment circuit shown in FIG. 7 in detail.

FIG. 9 is a perspective view schematically showing the relative relationship between the three exposure units and the overall exposure area.

FIG. 10 is a timing chart showing the read pulses for three FIFO memories of the exposure data generation circuit in time series.

FIG. 11 is a block diagram showing a second embodiment of a multiple exposure drawing apparatus according to the present invention.

FIG. 12 is a block diagram showing in detail the exposure timing adjustment circuit shown in FIG. 11 together with a part of an exposure data generation circuit.

[Explanation of symbols]

10 multi-exposure drawing device 20 _01, 20 _02, ... 20 ₁₅ exposure unit M (1,1), ... M ( 1024,1280) micromirror (modulation element) 32 drawing surface 34 system controller 50 raster converter 54 exposure data Generation circuit 56, 156 Exposure timing adjustment circuit 58 DMD drive circuit 562 ₀₁ , 562 ₀₂ FIFO memory 157 Buffer memory

Claims (10)

[Claims] 1. A multiple-exposure drawing apparatus that draws a predetermined pattern on a drawing surface by multiple exposure using an exposure unit having a large number of modulation elements arranged in a matrix, wherein a plurality of the exposure units are provided. Arrangement means arranged along one direction, moving means for moving the drawing surface relative to the exposure unit along a second direction different from the first direction, and exposure timing of each of the exposure units. Exposure timing adjusting means for adjusting, and when the drawing surface is moved relative to the exposure unit along the second direction by the moving means, the exposure timing adjusting means individually adjusts the drawing surface on the drawing surface. 2. The multiple exposure drawing apparatus, wherein the drawing start positions of the exposure unit along the first direction are made to coincide with each other. 2. The multiple exposure drawing apparatus according to claim 1, wherein the exposure timing adjusting unit adjusts the exposure timing of another exposure unit with reference to the exposure unit having the earliest exposure timing. 3. The multiple-exposure drawing apparatus according to claim 1, wherein the exposure units are arranged at different positions in the second direction. 4. An exposure data generation unit for generating exposure data corresponding to the predetermined pattern for each of the exposure units, and the exposure timing adjustment unit temporarily stores the exposure data to be given to the exposure unit. 4. A multiple exposure drawing apparatus according to claim 3, further comprising a FIFO (First In First Out) memory for adjusting the exposure timing by thinning out a read pulse for the FIFO memory for a predetermined time. 5. The number of the FIFO memories provided is the same as the number of the exposure units.
The multiple-exposure drawing apparatus according to item 1. 6. The exposure units are arranged in a two-row zigzag pattern, and the first-row exposure units are behind a second-row exposure unit by a predetermined distance in a relative movement direction of the drawing surface. The multiple-exposure drawing apparatus according to claim 1, wherein the multiple-exposure drawing apparatus is arranged separately. 7. A raster data generating means for generating raster data corresponding to the predetermined pattern is provided, and the timing adjusting means further includes a pattern having a length corresponding to at least the predetermined distance of the raster data of the predetermined pattern. A buffer memory for temporarily storing raster data is provided, and the exposure data to be given to the exposure unit in the first column is generated based on the raster data directly obtained from the raster data generating means, and the second column is also generated. 7. The multiple-exposure drawing apparatus according to claim 6, wherein the exposure timing is adjusted by generating the exposure data to be given to the exposure unit based on the raster data obtained via the buffer memory. 8. A multiple-exposure drawing apparatus that draws a predetermined pattern on a drawing surface by multiple exposure using an exposure unit having a large number of modulation elements arranged in a matrix, wherein a plurality of the exposure units are provided. A second row of zigzag patterns arranged in a zigzag pattern along the first direction, wherein the first row exposure unit is different from the first row exposure unit in the first direction.
Arranging means arranged rearward by a predetermined distance with respect to the direction, moving means for moving the drawing surface relative to the exposure unit along the second direction, and the first row or the second row. Exposure timing adjusting means for adjusting the exposure timing of at least one of the exposure units, and the exposure timing adjusting means when the drawing surface is moved relative to the exposure unit along the second direction by the moving means. A multiple-exposure drawing apparatus, characterized in that the drawing start positions of the exposure units in the first and second rows on the drawing surface are aligned in the first direction by means. 9. The exposure timing adjusting means draws the exposure timing of the exposure unit in the second row and the predetermined distance in the second direction between the exposure units in the first and second rows. 9. The multiple-exposure drawing apparatus according to claim 8, wherein the time for advancing the surface is delayed. 10. A predetermined pattern is drawn on a drawing surface by multiple exposure using a plurality of exposure units having a large number of modulators arranged in a matrix and arranged in the first direction. A multiple-exposure drawing method, wherein when the drawing surface is relatively moved along a second direction different from the first direction, the exposure timing of each of the exposure units is adjusted so as to follow the first direction. A multiple-exposure drawing method, characterized in that the drawing start positions are matched.