JP2003119590A - Method and apparatus for forming electroplating layer on substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To apply an electroplating layer composed as a contour layer or a formed layer on a conductive substrate surface having an arbitrarily formed contour shape, without inconvenience of performing processed manufacturing steps. SOLUTION: In a method for forming the electroplating layer having a predetermined three-dimensional spread on the conductive substrate surface 2 having the arbitrarily formed contour, this method includes applying an electrolyte jet 7 onto the substrate face 2 through a nozzle 6, passing an electric current between the nozzle 6 and the substrate surface 2 primarily through the electrolyte jet 7, and enabling a layout of the nozzle and the substrate surface to be changed in the depositing process.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for forming an electroplated layer having a predetermined three-dimensional extent on a conductive substrate surface having an arbitrarily shaped contour.

[0002]

BACKGROUND OF THE INVENTION Generally, electroplated layers that are precisely deposited on a limited area of a substrate surface are referred to as partial precision layers. The electroplating layer, which has a limited spatial extent, is a known type of diaphragm for the flow of current in the electrolyte between the anode and the substrate to be deposited (coating), by means of a diaphragm or orifice. Is formed by exerting the desired effect on.

Furthermore, in the known mask technology,
For example, a photo rack is provided on the surface of the substrate to be attached,
This photorack blocks the flow of current between the anode and the substrate in this region, preventing deposition of the deposited material.

However, the known devices for carrying out the electroplating deposition process are subdivided into the geometrical shapes of the respective substrates to be deposited, in order to deposit other substrates or structural types. Has the disadvantage that the device must be replaced or reassembled. Fixing the device to form electroplating on a substrate with a given spatial structure makes the deposition process inflexible and the layer thickness of the partial precision layer depends on the process of the deposition process. By changing the parameters, the whole thing is affected each time.

In such known apparatus, one contour layer having a constant layer thickness is mainly deposited by the actually known apparatus and method for forming an electroplated layer on the surface of a substrate. In this case, the surface contour of the substrate surface is formed identically by means of an electroplating contouring device, and the molding layer with a variable layer thickness in spatial extent only comes with very high equipment costs. It has the drawback of being formed.

German Patent Publication No. 197363
According to document 40, a device and a method for forming an electroplating layer on a conductive substrate are known. This known device has been used both for producing an integral unstructured electroplated layer and for producing a structured electroplated layer, in which case it was structured. The electroplated layer can be formed by the above method.

German Patent Publication No. 197363
The device according to 40 has a pan for the electrolyte, in which the holder of the substrate and the anode connected to the voltage source are immersed. The holder is open 2
It consists of a cylindrical housing with one end and a closure, which is screwed onto the end of the casing, which end is closed. The interior of the casing consists of three concentrically arranged cylindrical sections. A stirrer is provided to ensure sufficient movement of the electrolyte on the metal layer or substrate. Alternatively, the electrolyte may be sucked up from the casing, thereby obtaining the desired movement of the electrolyte to homogenize the concentration of the electrolyte.

To form a structured electroplating layer on a conductive substrate surface, first by photolithography or by excimer-laser ablation on a dielectric substrate surface which is metallized on one side. A mask pattern of the formed polymer rack is applied. This mask pattern is identical to the negative of the structured electroplating layer to be manufactured. A Netz is disposed between the stirrer and the substrate surface and is provided to form a structured electroplated layer having a uniform thickness.

However, such devices known from the prior art attempt to form the substrate to be coated or its surface or the periphery of the substrate, ie the device itself, before forming the structured electroplating layer. It has the disadvantage of having to be pretreated depending on the layer to be processed. The pretreatment corresponds to the application of a photo rack or the placement of corresponding orifices for guiding the electric field in the electrolyte. However, this type of processed manufacturing stage is very expensive and adds to the cost of manufacturing the substrate or component to be coated.

[0010]

[Patent Document 1] German Patent Publication No. 19736
340 Specification

[0011]

SUMMARY OF THE INVENTION An object of the present invention is to eliminate the above-mentioned drawbacks of the prior art.

[0012]

According to the means of the method of the present invention which has solved this problem, an electric field having a predetermined three-dimensional spread is formed on a conductive substrate surface having an arbitrarily shaped contour. In a method for forming a plating layer, an electrolyte jet is applied onto a substrate surface by a nozzle so that current flows mainly between the nozzle and the substrate surface through the electrolyte jet, and the nozzle is formed during the deposition process. The layout of the board surface can be changed.

[0013]

According to the method of the present invention, a contour layer (Konturs) is formed on a conductive substrate surface having an arbitrarily shaped contour shape without tedious process-treated manufacturing steps.
It has the advantage that the electroplating layer can be applied either as a chicht) or as a shaping layer (Profils chicht).

This is to apply an electrolyte jet onto the surface of the substrate by means of a nozzle so that a current mainly flows between the nozzle and the surface of the substrate via the electrolyte jet, so that during the deposition process the nozzle and the surface of the substrate are This is achieved by making it possible to change the arrangement of. Thereby it is necessary to arrange means or orifices or nets for masking the component or substrate surface, both for producing structured contoured electroplated layers and for producing shaped electroplated layers. Absent. This is because the deposition is mainly carried out only in the area of the substrate surface where the electrolytic solution jet impinges.

According to the method of the invention, which is a "jet-deposition technique", it is possible to deposit a substrate of high quality independently of the structural parts and to adapt it quickly to new conditions. This allows, for example, mask technology and / or
Or, compared to known deposition techniques such as orifice technology, jet-deposition techniques can have very high flexibility.

The device according to the invention having the features of claim 12 is capable of forming any desired contour of the substrate to be deposited or its surface, without having to reassemble the device, and almost any of them. A shaped electroplated layer can be applied to the substrate.

For this reason, the apparatus for forming the electroplating layer having a predetermined three-dimensional spread on the surface of the electrically conductive substrate having an arbitrarily shaped contour, removes the electrolytic solution from the electrolytic solution tank. A pump for forming an electrolytic solution jet directed to the nozzle and directed to the surface of the substrate, a reactor accommodating the substrate to be deposited and the nozzle, and a direct current source, A DC source is connected to the substrate and nozzle. Furthermore, it is possible to change the arrangement of the nozzle and / or the substrate in the reactor during the deposition process so that the electrolyte jet or nozzle can be guided in relation to the substrate surface like a pin. . Therefore, the electroplated layer can be applied to a desired area of the substrate surface having a predetermined contour or a predetermined profile.

The electroplating layer can also be applied in a simple manner to any surface structure, for example a substrate with a rotationally symmetrical body, a substrate with grooves or depressions, or a flat plate. In this case, it is not necessary to rearrange the device according to the invention when changing the substrate type. This is because the nozzles can be moved along arbitrary surface structures. "Substrate type" as used herein refers to each different geometrical structure of the substrate to be deposited.

Other advantages and embodiments of the invention are set forth in the description of the examples, the drawings and the claims.

[0020]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of an apparatus according to the present invention will be described below with reference to the drawings.

FIG. 1 shows a device 1 for forming an electroplating layer having a defined spatial extension on a conductive substrate surface 2, which device 1 contains an electrolyte solution 4. It has a pump 3 for pumping from the electrolytic solution tank 5 to the nozzle 6 and for generating an electrolytic solution jet 7 directed to the substrate surface 2. Furthermore, the device 1 has a reactor 8 in which a substrate 9 to be coated and a nozzle 6 are arranged, in which case the substrate 9 and the nozzle 6 are respectively connected to a DC source 10. There is.

The reactor 8 has a protective container 11 and a substrate holder 12 or a work holder arranged in the protective container 11. Further, between the nozzle 6 and the pump 3, a valve 13 that controls the transport amount of the electrolytic solution 4 is provided. A conduit 15 is provided in parallel with the connecting conduit 14 between the pump 3 and the valve 13, which conduit 1
5 starts from the electrolyte tank 5 and opens in the connecting conduit 14 in front of the valve 13 and is provided with a further valve 16. As a result, the amount of the electrolytic solution conveyed to the nozzle 6 is controlled by the valve
And via a further valve 16 and via the pump delivery output of the pump 3.

The protective container 11 is connected to the electrolytic solution tank 5 through another connecting conduit 17, and the other connecting conduit 1
7 can be shut off via a shutoff valve 18 and serves to return the electrolyte 4 to the electrolyte tank 5.

In order to ensure the impeccable functioning of the device 1, the electrolyte tank 5 is a device 19 for adjusting the temperature of the electrolyte 4.
With the result that the deposition process is substantially independent of ambient temperature. A collecting pan 20 is arranged below the reactor 8 and the electrolyte tank 5 so that, in the event of a leak in the reactor 8, the electrolyte tank 5 and the conduit system of the device 1, it will be removed from the closed system. It is possible to collect the outflowing electrolyte solution and, in some cases, to avoid environmental pollution due to the electrolyte solution containing substances that have a health or environmental impact.

The device 1 is constructed as follows: the device 1 can be operated in so-called free jet operation (Freistrahlbetrieb) or in so-called submerged jet operation (Tauchstrahlbetrieb).

During the free jet operation of the device 1 shown in FIG.
The nozzle 6 and the substrate 9 arranged in the protective container 11 are not immersed in the electrolytic solution 4. The electrolytic solution jet 7 flowing out from the nozzle 6 is brought to the substrate 9 as a free jet in the empty protective container 11. In this case, the electrolyte jet 7
It has a diameter corresponding to the nozzle diameter, which diameter increases only slightly as the distance from the nozzle 6 increases. In the region of the collision point 21 on the substrate surface 2, the electrolyte 4 flows “outward” on the substrate surface 2, ie outwards from the electrolyte jet 7 when viewed in the radial direction and is protected. It is collected in the bottom region of the container 11. From the bottom region of the protective container 11 the electrolyte 4 returns via a further connecting conduit 17 to the electrolyte tank 5, in which case the shut-off valve 18 is open.

The shutoff valve 18 is closed during the immersion jet operation of the apparatus 1, so that the electrolytic solution 4 is blocked in the protective container 11 and returned to the electrolytic solution tank 5 through the overflow portion 22. That is, in the immersion jet operation of the apparatus 1, the substrate 9 and the nozzle 6 are immersed in the electrolytic solution 4, the protection container 11 is completely filled with the electrolytic solution 4, and the electrolytic solution jet 7 is in the electrolytic solution 4. It is formed as a linear flow (Stroemungsfaden). In this case, the electrolyte jet 7 becomes wider as the distance from the nozzle 6 increases, that is, the diameter of the electrolyte jet 7 gradually increases. From the collision area 21 on the substrate surface 2, the electrolytic solution jet 7 is directed radially outward and flows out along the substrate surface 2.

The course of the electrolyte jet 7 during the free jet operation and the immersion jet operation of the apparatus 1 is schematically shown in FIG. 2 or 3. As can be seen from both principle diagrams, the collision region of the electrolytic solution jet 7 in the free jet operation of the device 1 is
It has a smaller diameter than in submerged jet operation.

In the method according to the invention of forming an electroplated layer having a defined spatial extension on the surface of the substrate with an optionally shaped contour, the nozzle 6 is mainly of a conductive or metallic substrate 9. Faced to the surface. The electrolytic solution 4 flows out as a liquid jet through the nozzle 6, and collides with the substrate surface 2 or the surface of the work to be adhered. Nozzle 6
Are in this case formed as electrodes, so that current can flow to the substrate 9 via the electrolyte 4 or the electrolyte jet 7, and the impingement region 21 or the electrolyte jet 7
Metal deposition occurs in a narrowly confined area around the Staupunkt of the.

The deposition point is called spot 25 in the illustrated embodiment, and the diameter of this spot 25 is the flow shape, the nozzle diameter of the electrolytic solution jet, the flow velocity of the electrolytic solution jet 7, and the nozzle 6 and the substrate 9. It is defined by the distance or distance between them. The flow shape of the electrolytic solution 4 means here whether the electrolytic solution 4 is brought to the substrate surface 2 in the form of an immersion jet or a free jet.

By changing or increasing the distance in the vertical direction of the nozzle 6 from the substrate surface 2, the layer shape (Schichtp
rofil) becomes increasingly flatter and the diameter of the gap 25 increases, and such a tendency is more pronounced in free jet operation than in submerged jet operation.

The height of the spot 25 or the deposition layer is adjusted in relation to the time when the electrolyte jet flows between the nozzle 6 and the substrate surface 2. Another parameter of the deposition process that influences the height of the spot 25 is the magnitude of the applied current strength, in which case a higher current strength results in enhanced deposition, the height of the spot 25 being higher. Becomes larger, and the diameters of the spots 25 remain approximately equal.

FIG. 4 schematically shows the substrate 9 on which the spots 25 have been applied. In order to evenly spread the metal plating layer on the substrate surface 2, a plurality of individual spots 25 are arranged in contact with each other. Multiple spots are overlapped to create a molding layer, and this overlap (Ueberlagerung)
Is called Superposition.

In order to carry out the superposition, the workpiece to be deposited, ie the substrate 9 and / or the nozzle 6 is adapted to be movable during the deposition process, and in this way it is of a simple type. The contour layer or the forming layer on the substrate 9
Can be raised above. This allows general mask technology (Maskentechni
k) and orifice technology (Blendentechnik) can be omitted. Furthermore, preparatory manufacturing steps, such as the application of a lacquer layer on the substrate surface 2 or the modification of the coating device, are dispensed with.

By moving the substrate 9 or the nozzle 6, it is possible to change the vertical distance between the two 9 and 6 so that, for example, the molding layer 23 shown in FIG. You can Further, the movement of the nozzle 6 and / or the substrate 9 can be performed for the purpose of changing the collision region 21 of the electrolyte jet 7 on the substrate surface 2, whereby a uniform layer pressure is applied to the substrate surface 2. It is possible to produce a contour layer provided.

Of course, in contrast, it is the expert's discretion to combine and carry out the individual movements of the nozzle 6 and the substrate 6. That is, the vertical gap between the nozzle 6 and the substrate surface 2 and the collision region 21 of the electrolyte jet 7 on the substrate surface 2 can be changed appropriately. As a result, the electroplating layer can be applied to the substrate surface 2 precisely and with a defined spatial extension, and can be constructed with an arbitrarily shaped contour. Such a contour layer 24 is shown on the right side of FIG. 5, where the contour layer 24 has a constant layer thickness,
The surface structure of the substrate 9 is traced identically by the contour layer 24.

In order to move the nozzle 6 and the substrate 9,
A traveling unit is provided for each of the nozzle 6 and the substrate 9 or the substrate holder 12. The traveling unit is not shown, but can be configured as a robot similar to that used in the lacquer technology, for example. By configuring the apparatus 1 in this way, it is possible to enter the nozzle into a groove or other recess in the substrate surface 2 and to form an electroplating layer with the desired contour or shape there. One possible use is, for example, deposition on valve components. In this case, the disc edge (Tell
It is possible to apply a ring along the errand) and in this way the ring is provided only on the edges,
It is not mounted on the entire area of the disc in the valve seat.

An electroplated layer arbitrarily structured by such a jet-deposition technique (Jet-Beschichtungstechnik), in which the metal layer is deposited in the form of spots 25 by the impingement of the electrolyte jet 7 on the substrate surface 2. Can be formed on the substrate surface as a contour layer or a shaping layer. This is because the deposits in the impingement area 21 in the form of spots 25 do not come into contact with air or oxygen, even during free jet operation of the device 1. This avoids the formation of passive surface layers on already coated metal layers. This is because the liquid film or the electrolyte film permanently flows on the spot 25. Based on this, it is possible to form another spot on the deposited spot 25 or to arrange another spot next to the deposited spot, and the individual spots deposited on each other. Form a strong joint.

As can be seen from the various measuring lines, in the free jet operation of the device 1, a high spot 25 formed with a small diameter is formed on the substrate surface 2. In the submerged jet operation of device 1, a lower or flat spot 21 formed with a large diameter
Are formed on the substrate surface 2. This is because in this case, the electrolyte jet 7 becomes wider as the distance from the nozzle 6 increases, due to the large flow resistance of the electrolyte 4 surrounding the electrolyte jet 7.

Even in the immersion jet operation of the apparatus 1, the current is
It flows from a nozzle 6 formed as an anode to a substrate 9 via an electrolyte jet 7. This is because the electrolytic solution 4 surrounding the electrolytic solution jet 7 has extremely high electric resistance. The strength of the electric current is preferably as follows in the deposition process or in the immersion jet operation of the device 1, ie, so that the metal deposition on the substrate surface 2 occurs only at the damming point of the electrolyte jet 7. Adjusted. That is, the electrolytic solution 4 or the electrolytic solution jet 7 is discharged from the nozzle 6
Only in the region in the vicinity of 1 has a low resistance such that the deposition threshold is exceeded, and points further away from the substrate surface 2 are below the deposition threshold.

The deposited electroplating layer is, for example, a chrome layer or a copper layer in the illustrated embodiment. However, of course, if desired, it is also possible to deposit other metal layers on the substrate using the method according to the invention and corresponding devices.

In order to be able to form a plurality of spots in one working step, the device 1 can be constructed with a plurality of nozzles which produce a plurality of electrolyte jets 7. The nozzles can be arranged in any way in the protective vessel of the reactor and can be arranged to be movable independently of one another via the travel unit relative to the substrate.

[Brief description of drawings]

FIG. 1 is a schematic view showing an apparatus or equipment for forming an electroplating layer on a substrate surface.

FIG. 2 is a diagram showing a nozzle and a substrate when the substrate is loaded by an electrolyte jet which is a free jet.

FIG. 3 is a diagram showing a nozzle and a substrate when an electrolyte jet is an immersion jet.

FIG. 4 is a diagram showing a substrate on which a locally restricted electroplating layer is deposited and the superposition of individual spots formed by electroplating.

FIG. 5 is a view showing a forming layer applied to a substrate and a contour layer applied to the substrate in contrast.

[Explanation of symbols]

1 device, 2 substrate surface, 3 pump, 4 electrolytic solution, 5 electrolytic solution tank, 6 nozzle, 7 electrolytic solution jet, 8 reactor, 9 substrate, 10 DC source,
11 protective container, 12 substrate holder, 13 valve,
14, 17 connecting conduit, 15 conduit, 16 valve, 18 shutoff valve, 19 device, 20 collecting pan,
21 collision points, 22 overflow parts,
23 forming layer, 24 contour layer, 25 spots

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Joseph Weber             Federal Republic of Germany Oberlique Singe             N Ents Park 31 F-term (reference) 4K024 BB11 CB09 CB13 CB14 CB16

Claims (18)

[Claims] 1. A method for forming an electroplated layer having a predetermined three-dimensional extent on a conductive substrate surface (2) having an arbitrarily shaped contour, wherein an electrolyte jet (7) is provided. Is applied onto the substrate surface (2) by means of a nozzle (6) so that a current mainly flows between the nozzle (6) and the substrate surface (2) via the electrolyte jet (7), during the deposition process. A method for forming an electroplating layer on a substrate surface, characterized in that the arrangement of the nozzle and the substrate surface can be changed. 2. The method according to claim 1, wherein the electrolyte jet (7) is a free jet. 3. A method as claimed in claim 1, wherein the electric liquid jet (7) is a submerged jet. 4. The parameters of the deposition process are set such that the deposition of the substrate surface (2) takes place on the substrate surface (2) approximately in the region of the damming point of the electrolyte jet (17). Item 4. A method according to any one of items 1 to 3. 5. The diameter of the area (25) to be deposited is related to the diameter of the nozzle (6) and / or to the flow-through rate of the electrolyte (4) and / or the nozzle. (6)
5. Method according to claim 4, characterized in that the adjustment is made in relation to the vertical distance between the substrate surface (2). 6. The height of the deposit (25) is related to the time during which the current flows between the nozzle (6) and the substrate surface (2) and / or to the strength of the current. The method according to any one of claims 1 to 5, wherein 7. The method according to claim 1, wherein the nozzle (6) and / or the substrate (9) are moved during deposition. 8. Movement of the nozzle (6) and / or of the substrate (9) is carried out in order to change the vertical spacing between the nozzle (6) and the substrate (9), the vertical direction being 8. Method according to claim 7, characterized in that the spacing of the layers is varied, in particular so that a molding layer (23) is formed on the substrate surface (2). 9. Movement of the nozzle (6) and / or of the substrate (9) is carried out in order to change the collision point (21) of the electrolyte jet (7) on the substrate surface (2), which collision point (2).
8. The method according to claim 7, wherein 1) is varied such that a contour layer (24) is formed, in particular on the substrate surface (2). 10. Movement of the nozzle (6) and / or of the substrate (9) to change the vertical spacing between the nozzle (6) and the substrate (9) and to the substrate surface (2). Method according to claim 7, which is carried out to change the impingement point (21) of the electrolyte jet (7) above. 11. The method according to claim 1, wherein a large number of electrolytic solution jets are simultaneously applied onto the surface of the substrate. 12. An electrolytic solution tank (5) in an apparatus for forming an electroplating layer having a predetermined three-dimensional spread on a conductive substrate surface (2) having an arbitrarily shaped contour. Pump (3) for sending the electrolytic solution (4) from the nozzle to the nozzle (6) and forming the electrolytic solution jet (7) directed onto the substrate surface (2), and the substrate (9) to be deposited. ) And a nozzle (6) are housed, and a direct current source (10), the direct current source (10) being connected to the substrate (9) and the nozzle (6). And a device for forming an electroplating layer on a substrate surface, characterized in that the arrangement of the nozzle (6) and / or the substrate (9) in the reactor (8) is variable. 13. The reactor (8) comprises a protective container (11).
And a substrate holder (1) arranged in the protective container (11).
13. The device of claim 12 having 2) and. 14. A valve (13) between the nozzle (6) and the pump (3) for controlling the transport rate of the electrolytic solution (4).
The device according to claim 12 or 13, wherein the device is provided. 15. The protective container (11) is connected to the electrolyte tank (5), which connection can be shut off via a shut-off valve (18). The described device. 16. The shutoff valve (18) is opened during the free jet operation, the shutoff valve (18) is closed during the submerged jet operation, and the electrolytic solution (4) is protected in the protective container during the submerged jet operation. 16. The device according to claim 15, which is blocked in the inside of (11) and is guided back to the electrolytic solution tank (5) through the overflow portion (22). 17. The electrolytic solution tank (5) comprises an electrolytic solution (4).
17. A device according to any one of claims 12 to 16 comprising a device for temperature control of the. 18. The nozzle (6) and / or the substrate holder (12) comprises a controlled method device for guiding the substrate holder (12) and / or the nozzle (6) during the deposition process. A device according to any one of claims 13 to 17.