JP2003119568A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2003119568A5 JP2003119568A5 JP2001313073A JP2001313073A JP2003119568A5 JP 2003119568 A5 JP2003119568 A5 JP 2003119568A5 JP 2001313073 A JP2001313073 A JP 2001313073A JP 2001313073 A JP2001313073 A JP 2001313073A JP 2003119568 A5 JP2003119568 A5 JP 2003119568A5
- Authority
- JP
- Japan
- Prior art keywords
- temperature difference
- substrate
- wiring
- insulating film
- electroless plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Description
【００１６】
請求項５に記載の発明は、基板を着脱自在に保持して該基板の表面を無電解めっき液に接触させる基板保持部と、前記基板保持部で保持し前記無電解めっき液に接触させる基板の表面の無電解めっき反応界面に温度差を設ける温度差付与手段とを有することを特徴とする無電解めっき装置である。
請求項６に記載の発明は、前記温度差付与手段は、色調差を付与した基板の表面に光を照射する光照射装置を有することを特徴とする請求項５記載の無電解めっき装置である。
請求項７に記載の発明は、前記温度差付与手段は、絶縁膜と配線が露出する基板の表面に光を照射して前記配線の表面と前記絶縁膜の表面に温度差を設ける光照射装置を有することを特徴とする請求項５記載の無電解めっき装置である。[0016]
According to the fifth aspect of the present invention, there is provided a substrate holding portion for holding the substrate in a detachable manner and bringing the surface of the substrate into contact with the electroless plating solution, and a substrate for holding the substrate by the substrate holding portion and contacting the electroless plating solution. And temperature difference applying means for providing a temperature difference at the electroless plating reaction interface on the surface of the electroless plating.
The invention according to a sixth aspect is the electroless plating apparatus according to the fifth aspect, wherein the temperature difference providing means has a light irradiation device for irradiating light onto the surface of the substrate to which the color tone difference is provided. .
The invention according to claim 7 is a light irradiation apparatus wherein the temperature difference giving means irradiates light to the surface of the substrate on which the insulating film and the wiring are exposed to provide a temperature difference between the surface of the wiring and the surface of the insulating film. The electroless plating apparatus according to claim 5, characterized in that:
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001313073A JP2003119568A (en) | 2001-10-10 | 2001-10-10 | Method and apparatus for electroless plating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001313073A JP2003119568A (en) | 2001-10-10 | 2001-10-10 | Method and apparatus for electroless plating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003119568A JP2003119568A (en) | 2003-04-23 |
| JP2003119568A5 true JP2003119568A5 (en) | 2004-12-24 |
Family
ID=19131624
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001313073A Pending JP2003119568A (en) | 2001-10-10 | 2001-10-10 | Method and apparatus for electroless plating |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003119568A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2451497A (en) * | 2007-07-31 | 2009-02-04 | Renewable Energy Corp Asa | Contact for solar cell |
| JP5917297B2 (en) | 2012-05-30 | 2016-05-11 | 東京エレクトロン株式会社 | Plating treatment method, plating treatment apparatus, and storage medium |
| JP7030858B2 (en) * | 2020-01-06 | 2022-03-07 | 株式会社Kokusai Electric | Semiconductor device manufacturing methods, substrate processing devices and programs |
-
2001
- 2001-10-10 JP JP2001313073A patent/JP2003119568A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| ES2123174T3 (en) | PROCEDURE FOR THE STRUCTURED METALLIZATION OF THE SUBSTRATE SURFACE. | |
| JP2010522102A5 (en) | ||
| HK1105243A1 (en) | Exposure equipment and device manufacturing method | |
| WO2005003864A3 (en) | Apparatus and method for providing a confined liquid for immersion lithography | |
| DE60042103D1 (en) | Transparent, electrically conductive, multilayer structure, display device in which said structure is applied, coating fluid for producing a transparent, electrically conductive layer | |
| DE69839066D1 (en) | Device for substrate coating | |
| TW200617131A (en) | Process for producing adhesive film | |
| TW200701528A (en) | Enamel substrate for mounting light emitting element, light emitting element module, illumination apparatus, display apparatus, and traffic signal device | |
| TW200514473A (en) | Pattern-forming method, forming method of wire-layout pattern, and electro-optic device and electronic device | |
| TW341715B (en) | Methods of analyzing wafer defects | |
| TW200618162A (en) | Methods for fabricating semiconductor devices | |
| ATE546835T1 (en) | METHOD FOR PRODUCING A CONDUCTOR FRAME | |
| TW200725704A (en) | Method and apparatus for fabricating polycrystalline silicon film using transparent substrate | |
| JP2003119568A5 (en) | ||
| WO2002092878A3 (en) | Electroless plating method and device, and substrate processing method and apparatus | |
| JP2006016684A5 (en) | ||
| ATE219169T1 (en) | DEVICE FOR SURFACE TREATMENT BY DIVING | |
| JP2006186331A5 (en) | ||
| ATE227611T1 (en) | METHOD AND DEVICE FOR TREATING SUBSTRATES | |
| JP2009221498A (en) | Plating film, method for producing plating film, wiring board and method for producing wiring board | |
| TW200718805A (en) | Coating methods and apparatus | |
| JP2000212760A (en) | Production of partially plated plastic molding | |
| JP2006057167A (en) | Method for forming wiring by plating | |
| DE69604863D1 (en) | Assemblable structure for electrical device, with bracket for rocker arm | |
| NO20071954L (en) | Process of producing thick film hybrid |