JP2003117943A - Method for sealing with resin - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for sealing with resin capable of sealing an electronic with resin in a simple process. SOLUTION: The method for sealing with resin in provided by covering the required part of a flat board-like workpiece by using a mold equipped with a fixed mold and a movable die to apply an insert molding method. One or >= two cavity are respectively provided in the fixed mold or the movable die. The workpiece is charged in the first cavity provided in the fixed mold or the movable die. After clamping the molds so that the first cavity faces the second cavity of the opposed mold, one side surface of the workpiece is covered by filling resin to obtain a first molded article in a first process. Then, the fixed mold or the movable die are moved. After clamping the molds by combining the cavities so that the first or the second cavity faces the third cavity, the other surface side of the first molded article is covered by filling resin to obtain the second molded article in a second process. The method for sealing with resin is equipped with those first and second processes.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin sealing method suitable as a method for coating a flat work such as an electric or electronic component with a resin and an electric or electronic component obtained by the method.

[0002]

2. Description of the Related Art In order to protect electronic parts such as IC elements from oxygen and moisture, means for sealing with a resin is widely adopted. Conventionally, as this sealing method, an IC element or the like is arranged between two exterior parts,
A method is known in which the seams of the exterior parts are attached by ultrasonic welding or the like. However, in this sealing method, the process is complicated and the product yield is low, and moisture, dust or the like may enter from the bonding surface to cause a failure. Further, there is a risk of inducing forgery by peeling off the two exterior parts from the bonding surface, modifying the IC element and the like, and then bonding them again.

As another resin sealing method, Japanese Patent Laid-Open No. 6-91
No. 694, No. 11-58444, No. 11-2.
No. 54476, No. 11-254477, and Japanese Patent Laid-Open No. 2000-133665 are proposed, but there is room for improvement in terms of simplification of manufacturing process, improvement of product yield, quality of products, and the like.

The present invention solves the above-mentioned problems and is a resin encapsulation method suitable for encapsulating an electric or electronic component such as an IC element with a resin, and an electric or electronic obtained by applying the resin encapsulation method. The challenge is to provide parts.

[0005]

According to the present invention, when properly combining one or more cavities provided in a fixed mold and a movable mold, a fixed mold or a movable mold is used as a means for selecting the combination. Thus, the flat work such as the electric or electronic component to be sealed can be quickly sealed with good yield without taking it out of the mold.

That is, the invention according to claim 1 uses, as a means for solving the above-mentioned problems, a mold provided with a fixed mold and a movable mold, an insert molding method is applied, and a resin sealing for covering a required portion of a flat plate-like work is applied. The fixed mold and the movable mold each have one or two or more cavities, and the resin filling space of two or more combinations can be formed by a combination thereof, and the resin of any one combination is used. A flat plate-shaped work is loaded in the filling space, and a required portion of one surface of the workpiece is covered with resin, and then a required portion of the other surface of the workpiece is covered with resin in a resin filling space of another combination. Provide a stopping method.

Further, in the invention according to claim 2, as another means for solving the above-mentioned problems, a die provided with a fixed die and a movable die is used, and the insert molding method is applied to cover a required portion of the flat work. It is a resin sealing method, and the fixed type and / or
Alternatively, the movable die is provided with one or more cavities, respectively, and the work is loaded in the first cavity provided in the fixed die or the movable die, and the second die of the die opposed to the first cavity is provided. After the mold is clamped so as to face the cavity (that is, the resin filling space is formed), a step of filling the resin to cover one surface side of the work to obtain the primary molded product, and then the fixed mold or Move the movable mold to move the first or second
And the third or the fourth cavity are opposed to each other, the mold is clamped, and then the resin is filled and the other surface side of the primary molded product is coated to obtain a secondary molded product. A resin sealing method is provided.

Further, as another means for solving the above-mentioned problems, the invention according to claim 3 uses a die having a fixed die and a movable die, and applies an insert molding method to coat a required portion of the flat work. It is a resin sealing method, and the fixed type and / or
Alternatively, the movable die is provided with one or more cavities, respectively, and the work is loaded in the first cavity provided in the fixed die or the movable die, and the second die of the die opposed to the first cavity is provided. After the mold is clamped so as to face the cavity (that is, the resin filling space is formed), a step of filling the resin to cover one surface side of the work to obtain the primary molded product, and then the fixed mold or Move the movable mold to move the first or second
After the mold is clamped such that the cavity and the third or fourth cavity face each other, the resin is filled and the other surface side of the primary molded product is coated to obtain a secondary molded product. A resin sealing method is provided which comprises a step of loading a new work into the cavity of No. 1 and filling a resin to cover one surface side of the work to obtain a primary molded product, and repeating the above steps continuously. To do.

Each cavity described above (resin filling space)
When the resin sealing method is applied, it acts as a cavity for loading an unsealed work, a cavity for obtaining a primary molded product, a cavity for obtaining a secondary molded product, and the like. In the present invention, the fixed mold and the movable mold may each be provided with three or more cavities.

According to the tenth aspect of the present invention, as another means for solving the above problems, a mold provided with a fixed die and a movable die is used, and the insert molding method is applied to cover a required portion of the flat plate-like work. It is a resin sealing method, in which resin is filled,
After coating one surface of the flat work on the fixed mold side with resin, all or part of the movable mold (core) is moved to form a space between the mating surfaces of the movable mold and the fixed mold, and Provided is a resin sealing method in which a space is filled with a resin and the other surface of a flat work piece on the movable die side is covered with the resin.

According to the invention of claim 11, as another means for solving the above problems, a mold provided with a fixed die and a movable die is used, and an insert molding method is applied to cover a required portion of the flat work. It is a resin sealing method, and after supporting a flat plate-shaped work loaded in the cavity in the mold from both sides by projecting a pair of protruding pins provided through the fixed mold and the movable mold from both directions. Provided is a resin sealing method for filling both sides of a flat work by filling the resin and pulling out the projecting pin immediately before the completion of the filling.

When applying the resin sealing method of the present invention,
It suffices to cover the required part (all or part) according to the function and structure of the work.

The "workpiece (workpiece, processed product)" in the present invention means one that needs to be resin-sealed for various purposes, and includes, for example, electrical insulation, antioxidation, moistureproofness,
It means a material that needs to be resin-sealed for the purpose of imparting heat insulating property, buffer property, heat retaining property, scratch resistance, vibration damping property (vibration damping property), light resistance and the like. Examples of such a work include electric or electronic parts. Examples of the electric or electronic parts include ICs, LSIs, capacitors, antennas, LEDs, transistors, diodes, solenoid coils, bimetals, antennas, and crystal oscillators. Etc. can be mentioned.

Further, the resin sealing method of the present invention is suitable for a flat plate-shaped work, but is not limited to a cylindrical shape, a prismatic shape, a spherical shape,
It can also be applied to cube-shaped and irregular-shaped workpieces.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described with reference to FIGS. 1A to 1D are conceptual diagrams showing steps of a resin sealing method.

The mold comprises a fixed die 10 and a movable die 40. The fixed die 10 is movable with the fixed plate 20 connected to a resin filling means 50 such as an extrusion molding machine or an injection molding machine. It comprises an intermediate plate 30 arranged between the molds 40.

The fixed plate 20 has a sprue 21 and a resin distribution space 22, and the resin distribution space 22 is an intermediate plate 30.
Two sprues 35, 36 or 37, 38 provided on the
It has the function of supplying resin to.

The intermediate plate 30 includes two sprues 35 and 36.
Has a first cavity 31 connected to the first cavity 31 and a third cavity 32 connected to two sprues 37 and 38 which are spaced apart from the first cavity 31. Then, the intermediate plate 30 can be slid in forward and reverse directions as shown in FIGS.
Note that the recessed portion forming the first cavity 31 may be flat. The movable mold 40 has a second cavity 41.
have.

In FIG. 1A, the first cavity 3
1 is loaded with a flat work 60 such as an electric or electronic component as shown in FIG. The diameter or area of this flat plate-shaped work 60 is smaller than the diameter or area of the first cavity 31. When the portion of the first cavity 31 is made flat, the flat work 60 is held by suction means or the like.

Thereafter, as shown in FIG. 1 (b), the fixed mold 10 and the movable mold 40 are moved by a mold clamping device in a state where the first cavity 31 and the second cavity 41 are aligned so as to face each other. Clamp the mold.

Next, the molten resin is supplied from the resin filling means 50, and the sprue 21, the resin distribution space 22, and the sprue 3 are supplied.
The resin 55 is filled into the space defined by the first cavity 31 and the second cavity 41 through the steps 5 and 36. At this time, as shown in FIGS. 1A and 1B, since the diameter or area of the second cavity 41 is set larger than the diameter or area of the first cavity 31, one surface of the work 60 is 60a side (movable die 40 side) is covered with resin,
A primary molded product 61 as shown in FIG. 2A is obtained.

Next, as shown in FIG. 1C, when the mold is opened, the primary molded product 61 has moved to the second cavity 41. After that, the intermediate plate 30 is slid in the direction of the arrow to align the third cavity 32 and the second cavity 41 so as to face each other, and then the mold is clamped again. And
The space formed by the third cavity 32 and the second cavity 41 is filled with resin through the sprue 21, the resin distribution space 22, and the sprues 37 and 38. At this time, since the third cavity 32 and the second cavity 41 are set to have the same diameter or the same area, as shown in FIG. 2B, the other surface of the primary molded product 61 of FIG. A secondary molded product 62 in which 61b is covered with a resin is formed.

Thereafter, the mold is opened as shown in FIG. 1 (a), and the secondary molded product 62 is taken out. In addition, in FIG.
By loading a new work 60 in the first cavity 31 and further repeating the steps of FIGS. 1A to 1D in the same manner, secondary molded products can be continuously obtained.
This secondary molded product can be provided as a final product as it is or after further necessary processing such as printing.

Next, another embodiment of the present invention will be described with reference to FIGS. 3 (a) and 3 (b). 3A and 3B are conceptual diagrams showing steps of the resin sealing method.

The mold comprises a fixed mold 100 and a movable mold 140. The fixed mold 100 is a fixed plate 120 connected to resin filling means 50, 51 such as an extrusion molding machine or an injection molding machine.
Intermediate plate 1 arranged between the fixed plate 120 and the movable die 140
It consists of 30.

The fixed plate 120 has a sprue 121 connected to the resin filling means 50, a sprue 122 connected to the resin filling means 51, and a resin distribution space 123.
The resin distribution space 123 has a function of supplying resin only to the sprue 136 provided on the intermediate plate 130 and the sprue 138.

The intermediate plate 130 has a first cavity 131.
And has a third cavity 132 that is spaced from the first cavity 131. The intermediate plate 130 is rotatably supported by the rotary shaft 150 and can be rotated in the forward and reverse directions.

The movable mold 140 has a second cavity 141.
And a fourth cavity 142, and the rotary shaft 150
Is penetrated, but does not rotate by itself.

In FIG. 3A, the second part of the movable die 140 is
The flat plate-shaped work 60 is loaded in the cavity 141 of the above.
After that, as shown in FIG. 3B, the fixed mold 100 and the movable mold 140 are clamped by a mold clamping device in a state in which the first cavity 131 and the second cavity 141 are aligned so as to face each other. .

Next, the molten resin is supplied from the resin filling means 50, and the resin is filled into the space consisting of the first cavity 131 and the second cavity 141 through the sprue 121 and the sprue 135. At this time, as shown in FIG. 3A, the diameter or area of the first cavity 131 is the second
Since it is set larger than the diameter or area of the cavity 141 of FIG.
A primary molded product 61 whose resin is coated on the 0b side (fixing plate 120 side) is obtained.

Next, as shown in FIG. 3A, the mold is opened and the intermediate plate 130 is rotated 180 ° about the rotary shaft 150 so that the first cavity 131 and the fourth cavity 142 face each other. After adjusting to, clamp again. At this time, a new work is loaded in the second cavity 141.

Then, the sprue 122 and the resin distribution space 1
The resin is filled through the sprue 138 and the sprue 138. At this time, by the action of the sprue 138 and the resin inflow hole 145 adjacent to and connected to the fourth cavity 142, the surface of the primary molded product 61 not covered with the resin is covered with the resin. The product 62 is obtained.

Thereafter, the mold is opened as shown in FIG. 3 (a), and the secondary molded product 62 is taken out. By repeating this process, the secondary molded product can be continuously manufactured. This secondary molded product can be provided as a final product as it is or after further necessary processing such as printing.

Another embodiment of the present invention will be described with reference to FIGS. 4 (a) and 4 (b). 4A and 4B are conceptual diagrams showing steps of the resin sealing method.

The mold comprises a fixed mold 200 and a movable mold 240, and the fixed mold 200 is connected and fixed to resin filling means 50, 51 such as an extrusion molding machine or an injection molding machine. Fixed type 20
0 has two resin filling mechanisms arranged separately from each other.

One of the resin filling mechanisms is a resin filling means 50.
And a sprue 201 that connects the resin distribution space 202 with
It is composed of two sprues 203 and 204 connecting the resin distribution space 202 and the first cavity 210. The other resin filling mechanism includes a resin filling means 51 and a resin distribution space 21.
2 and a sprue 211 for connecting the resin distribution space 212
And two third sprues 213 and 214 connecting the third cavity 220.

The movable die 240 has a second cavity 241 and a fourth cavity 242 which are arranged separately from each other, and is rotated in the forward and reverse directions by the action of a rotary shaft or the like attached as necessary. Being free.

In FIG. 4A, the first cavity 2
10 is loaded with a flat work 60 such as an electric or electronic component. After that, as shown in FIG.
After aligning the movable mold 240 with the movable mold 240 so that the first cavity 210 and the second cavity 241 face each other,
Clamp with a mold clamping device.

Next, the molten resin is supplied from the resin filling means 50, passes through the sprue 201, the resin distribution space 202, and the sprues 203 and 204, and then the first cavity 210 and the second cavity 210.
The resin is filled in the space formed by the cavity 241.
At this time, since the diameter or area of the second cavity 241 is set larger than the diameter or area of the first cavity 210 as shown in FIG.
A primary molded product 61 having the one surface 60a side (movable die 240 side) covered with a resin as shown in FIG. 2A is obtained.

Next, when the mold is opened as shown in FIG. 4 (a), the primary molded product 61 has moved from the first cavity 210 to the second cavity 241. After that, the movable die 240 is rotated 180 °, and the fixed die 200 and the movable die 2 are rotated.
40 and 40 are aligned so that the third cavity 220 and the second cavity 241 in which the primary molded product is present face each other, and then the mold is again clamped as shown in FIG. 4B.

Then, the sprue 211 and the resin distribution space 2
12, and resin is filled through the sprues 213 and 214. At this time, since the third cavity 220 and the second cavity 241 are set to have the same diameter or the same area, the other surface 61b of the primary molded product 61 is coated with resin.
A secondary molded product 62 as shown in FIG. 2B is obtained.

Thereafter, the mold is opened as shown in FIG. 4 (a), and the secondary molded product 62 is taken out. In addition, in FIG.
Before performing the secondary molding, a new work is loaded in the first cavity 210, and the steps of FIGS. 4B and 4A are sequentially repeated in the same manner to continuously produce the secondary molded product. Obtainable. This secondary molded product can be provided as a final product as it is or after further necessary processing such as printing.

Further, when applying the resin sealing method of the present invention, as shown in FIG. 5A, a flat work 60 having one or more through holes 65 can be used. By using such a work 60, as shown in FIG. 5 (b), the primary molded product has one surface side covered with the resin protruding from the through hole 65 to form the protruding portion 66. The secondary molded product 62 is such that the other surface side thereof is covered with resin in a state of including the protruding portion 66. Therefore, the through hole 65 acts to relieve the filling pressure of the resin when obtaining the primary molded product, and the protrusion 66 acts to bond the resin coating both surfaces.

Another embodiment of the present invention will be described with reference to FIGS. 6 (a) and 6 (b). 6A and 6B are conceptual diagrams showing steps of the resin sealing method.

The mold comprises a fixed mold 300 and a movable mold 310, and the movable mold 310 is a core 311 that can slide.
Is equipped with.

The fixed mold 300 has a first sprue 320 and a second sprue 321 connected to the resin filling means, and the first sprue 320 is connected to a pinpoint gate 325 provided on the fixed mold 300. ing. The second
The tip of the sprue 321 is connected to the resin inflow space 330 provided in the movable die 310.

A cavity 340 is formed on a mating surface (PL surface) between the fixed die 300 and the movable die 310, and a work 341 is loaded in the cavity 340. The cavity 340 is formed by the concave surface 300a of the fixed die 300 and the flat surface 311a of the movable die 310 (core 311).

After placing the work on the flat surface 311a of the core 311, the core 311 is raised in the direction of the arrow,
A work is loaded into the recess of the fixed mold 300, and the mold is clamped by a mold clamping device. Then, the molten resin is supplied from the resin filling means, the resin is filled into the cavity 340 from the sprue 320 and the pinpoint gate 325, and one surface side of the work (fixed die 300 side) is covered with the resin.

Then, the core 311 is lowered to form a new cavity not filled with resin on the other surface side (core 311 side) of the work. And sprue 32
1. A new cavity is filled with the molten resin from the resin inflow space 330, and the other surface side of the work not covered with the resin is also covered and sealed.

Another embodiment of the present invention will be described with reference to FIGS. 7 (a) and 7 (b). 7A and 7B are conceptual diagrams showing steps of the resin sealing method.

The mold comprises a fixed mold 300 and a movable mold 310, and the mating surface (P
A cavity 340 is formed on the (L surface), and a work 341 is loaded in the cavity 340.

The fixed mold 300 has a first sprue 320 connected to the resin filling means.
0 is connected to the pinpoint gate 325. The movable die 310 includes a second sprue 3 connected to the resin filling means.
21 and the second sprue 320 is connected to the pinpoint gate 326.

The pair of projecting pins 350 and 351 and the pair of projecting pins 360 and 361 are for supporting the work 341 in the cavity 340, and penetrate the fixed mold 300 and the movable mold 310, respectively, and face each other. The
They are attached so as to be movable in their length direction (arrow direction in the figure).

As shown in FIG. 7A, the work 341 is placed in the cavity 340, and the solid mold 300 and the movable mold 31 are placed.
After clamping 0, a pair of protruding pins 350,
The work 341 is supported and fixed in the cavity 340 by adjusting the projecting positions of the 351 and the projecting pins 360 and 361.

Then, as shown in FIG. 7 (b), the molten resin is supplied from the resin filling means, the resin is filled from the sprue 320 and the sprue 321, and all the projecting pins are pulled out immediately before the completion of the filling of the resin. , Both sides of the flat work are covered and sealed.

When the above resin sealing method is applied, from the viewpoint of preventing damage to the work, the maximum pressure in the mold during resin filling is preferably less than 100 MPa at a position 25 mm away from the sprue, more preferably Is 80 MPa
Less than 40 MPa, more preferably less than 40 MPa. Such a resin filling pressure can be achieved by selecting a suitable resin.

In the resin sealing method of the present invention, a thermoplastic resin can be used as the sealing resin. As the thermoplastic resin, when a molding machine is used as a resin filling means,
It is preferable that the cylinder can be filled at a set temperature of 300 ° C. or lower. As the thermoplastic resin, when a molding machine is used as the resin filling means, the resin for sealing is a cylinder set temperature of 250 ° C., an injection speed of 1 m / min, and a flow length of 2 mm at a injection pressure of 75 MPa and a flow length of 100 mm or more. Are preferred.

As such a thermoplastic resin, one or more selected from polyamide resins, polycarbonate resins, polystyrene resins, polyolefin resins, polyester resins, polyurethane resins, acrylic resins and liquid crystal polymers can be used. preferable.

Examples of the polyamide resin include polyamide resins formed from diamine and dicarboxylic acid and copolymers thereof, such as nylon 66, polyhexamethylene sebacamide (nylon 610), polyhexamethylene dodecamide (nylon). 612), polydodecamethylene dodecanamide (nylon 1212), polymethaxylylene adipamide (nylon MXD6), polytetramethylene adipamide (nylon 46) and mixtures and copolymers thereof; nylon 6/66, 6T. Nylon 66 / 6T (6T: polyhexamethylene terephthalamide) having a content of 50 mol% or less, 6I Nylon 66 / 6I (6I: polyhexamethylene isophthalamide) having a content of 50 mol% or less, nylon 6T / 6I / 66, Nylon 6T / 6
Copolymers such as I / 610; polyhexamethylene terephthalamide (nylon 6T), polyhexamethylene isophthalamide (nylon 6I), poly (2-methylpentamethylene) terephthalamide (nylon M5T), poly (2-methylpentamethylene) ) Aromatic polyamide resins such as isophthalamide (nylon M5I), nylon 6T /
One or more selected from copolymers such as 6I and nylon 6T / M5T can be mentioned.

Further, a ring-opening polymer of a cyclic lactam, a polycondensate of an aminocarboxylic acid and a copolymer composed of these components, such as nylon 6, poly-ω-undecanamide (nylon 11), poly-ω-dodecanamide. (Nylon 12) and other aliphatic polyamide resins and copolymers thereof; copolymers of polyamides composed of diamine and dicarboxylic acid, such as nylon 6T / 6 and nylon 6T / 1
1, nylon 6T / 12, nylon 6T / 6I / 12,
One or more selected from nylon 6T / 6I / 610/12 can be mentioned.

The polycarbonate resin is obtained by applying a well-known manufacturing method such as a transesterification method and a melt polymerization method, and preferably a dihydric phenol and a carbonate precursor are prepared by a solution method or a melting method. It is produced by reacting.

Preferred dihydric phenols are 2,2-
Bis (4-hydroxyphenyl) propane (bisphenol A), bis (4-hydroxyphenyl) methane, 1,
1-bis (4-hydroxyphenyl) ethane, 2,2-bis (4-hydroxy-3,5-dimethylphenyl) propane, 2,2-bis (4-hydroxy-3,5-dibromophenyl) propane, 2 2,2-bis (4-hydroxy-3-methylphenyl) propane, bis (4-hydroxyphenyl) sulfide, bis (4-hydroxyphenyl) sulfone and the like can be mentioned. A particularly preferred dihydric phenol is a bis (4-hydroxyphenyl) alkane-based one, and particularly one containing bisphenol A as a main raw material.

Preferred examples of the carbonate precursor include carbonyl halide, carbonyl ester, haloformate and the like, and specific examples include phosgene, diphenyl carbonate, dihaloformate of dihydric phenol and a mixture thereof.
For the production of the polycarbonate-based resin, one or more of the above dihydric phenols can be used, and two or more of the polycarbonate-based resins thus obtained may be mixed and used.

Examples of polystyrene resins include polymers of styrene and styrene derivatives such as α-substituted and nucleus-substituted styrene. In addition, mainly with these monomers, vinyl compounds such as acrylonitrile, acrylic acid and methacrylic acid and / or butadiene,
Copolymers composed of monomers of conjugated diene compounds such as isoprene are also included. For example, polystyrene, high-impact polystyrene (HIPS) resin, acrylonitrile-butadiene-styrene copolymer (ABS) resin, acrylonitrile-styrene copolymer (AS resin), styrene-methacrylate copolymer (MS resin), styrene-
A butadiene copolymer (SBS resin) etc. can be mentioned. .

Further, the polystyrene resin may include a styrene copolymer obtained by copolymerizing a carboxyl group-containing unsaturated compound for improving compatibility with the polyamide resin. A styrene-based copolymer in which a carboxyl group-containing unsaturated compound is copolymerized is a carboxyl group-containing unsaturated compound in the presence of a rubbery polymer and, if necessary, another monomer copolymerizable therewith. Is a copolymer obtained by polymerizing. Specific examples of the component include 1) a monomer containing an aromatic vinyl monomer as an essential component or an aromatic vinyl-carboxyl group-containing unsaturated compound in the presence of a rubbery polymer obtained by copolymerizing a carboxyl group-containing unsaturated compound. A graft polymer obtained by polymerizing a monomer containing a saturated compound as an essential component, 2) a monomer containing an aromatic vinyl and a carboxyl group-containing unsaturated compound as essential components in the presence of a rubbery polymer. Graft copolymer obtained by copolymerizing a monomer, 3) a carboxyl group-containing unsaturated compound is not copolymerized rubber-reinforced styrene resin, a carboxyl group-containing unsaturated compound and an aromatic vinyl as essential components A mixture of a monomer with a copolymer, 4) a mixture of 1) and 2) above, a copolymer containing a carboxyl group-containing unsaturated compound and aromatic vinyl, 5) above 1), 2 ), 3), 4) and aromatic vinyl There is a mixture with a copolymer as an essential component.

In the above 1) to 5), styrene is preferred as the aromatic vinyl, and acrylonitrile is preferred as the monomer copolymerizable with the aromatic vinyl.

The polyolefin resin is a polymer containing a mono-olefin having 2 to 8 carbon atoms as a main monomer component, and includes low density polyethylene, high density polyethylene, linear low density polyethylene, polypropylene, and ethylene-propylene random copolymer. One or more selected from polymers, ethylene-propylene block copolymers, polymethylpentene, polybutene-1 and the like can be mentioned, and among these, polypropylene is preferable.

The polyester resin is known to be a carboxylic acid component having a valence of 2 or more or a derivative thereof having an ester forming ability, an alcohol component and / or a phenol component having a valence of 2 or more, or a derivative thereof having an ester forming ability. It is a saturated polyester resin obtained by polycondensation by the method.

As such a polyester resin,
Examples thereof include polyalkylene terephthalates such as polyethylene terephthalate, polybutylene terephthalate and polyhexamethylene terephthalate, and polyalkylene naphthalates such as polyethylene naphthalate and polybutylene naphthalate. . Further, it may be a copolyester containing 50% by weight or more of alkylene arylate units, or a mixture containing 50% by weight or more of alkylene arylate units as a whole. The weight average molecular weight of the polyester resin is preferably 10,000.
0 to 100,000, more preferably 15,000 to 5
It can be selected from the range of about 0,000.

The polyurethane resin is obtained by reacting isocyanates with alcohols.

The isocyanates include tolylene diisocyanate, diphenylmethane diisocyanate, polymethylene polyphenyl polyisocyanate, tolidine diisocyanate, naphthalene diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, xylylene diisocyanate, hydrogenated xylylene diisocyanate, dicyclohexylmethane diisocyanate, etc. Can be mentioned.

Examples of alcohols include polypropylene glycol, polytetramethylene glycol, polyether polyols such as modified products thereof, condensation type polyester polyols, lactone type polyester polyols, polyester polyols such as polycarbonate polyols,
Examples thereof include polybutadiene polyol, acrylic polyol, and partially saponified ethylene-vinyl acetate copolymer.

The (meth) acrylic resin is an acrylic resin or a methacrylic resin, and these are monomers selected from alkyl acrylate (C 1-10) esters and alkyl methacrylate (C 1-10) esters. It can be obtained by polymerizing the above-mentioned monomer, and may be a copolymer with another monomer copolymerizable with the above-mentioned monomer, for example, acrylonitrile.

Examples of the liquid crystal polymer include aromatic-aliphatic polyester, wholly aromatic polyester, aromatic polyazomethylene, and polyimide ester.
Of these, compounds exhibiting an anisotropic melting morphology are selected.

Examples of aromatic-aliphatic polyesters include copolymers of polyethylene terephthalate and benzoic acid. Examples of the wholly aromatic polyester include a copolymer of para-hydroxybenzoic acid and 6-hydroxy-2-naphthoic acid; a copolymer of para-hydroxybenzoic acid, terephthalic acid and 6-hydroxy-2-naphthol. it can. Examples of the aromatic polyazomethylene include poly (nitrilo-2-methyl-1,4-phenylenenitroethylidene). As the polyimide polyester, a copolymer of 2,6-naphthalenedicarboxylic acid, terephthalic acid and 4 (4-hydroxyphthalimide) phenol, diphenol and 4- (4-
Examples thereof include a copolymer with hydroxyphthalimide) benzoic acid.

The determination that these copolymers are liquid crystal polymers is made by confirming that the liquid crystal polymers exhibit optical anisotropy in the molten state. For example, a test piece adjusted to a thickness of 1 mm or less is placed on a heating stage of a deflection microscope, and heated at a temperature rising rate of 2 ° C./min in a nitrogen atmosphere. In this state, make the deflector of the deflection microscope orthogonal and
It can be easily confirmed by observing at a magnification of 100 times or 100 times. In such a method, the temperature at which these copolymers transition to the liquid crystal phase can be measured at the same time, and the transition temperature can also be measured by differential scanning calorimetry (DSC).

The sealing resin used in the present invention is preferably a combination of a polyamide resin and an ABS resin or a combination of a polycarbonate resin and an ABS resin.

The encapsulating resin used in the present invention is 1 or 2 selected from a flame retardant, a filler and a foaming agent, if necessary.
The above can be compounded.

The flame retardant may be one or a combination of two or more selected from phosphorus flame retardants, inorganic flame retardants and the like. .

The phosphorus-based flame retardant is not particularly limited as long as it is a compound having a phosphorus atom, and it is an organic phosphorus compound (phosphoric acid ester, phosphorous acid ester, phosphine, phosphine oxide, biphosphine, phosphonium salt, phosphinic acid or a salt thereof, etc.). ), Inorganic phosphates and the like. .

Among the organic phosphorus compounds, the phosphoric acid ester is
For example, aliphatic phosphate (trimethyl phosphate, triethyl phosphate, tributyl phosphate, tri (2-ethylhexyl) phosphate, tributoxyethyl phosphate, trioleyl phosphate, dibutyl phosphate, monobutyl phosphate,
Di (2-ethylhexyl) phosphate, monoisodecyl phosphate, 2-acryloyloxyethyl acid phosphate, etc.), aromatic phosphoric acid ester (triphenyl phosphate, tricresyl phosphate, trixylenyl phosphate, tris (isopropylphenyl) phosphate, Tris (o-phenylphenyl) phosphate, tris (p-phenylphenyl) phosphate, trinaphthylphosphate, cresyldiphenylphosphate, xylenyldiphenylphosphate, diphenyl (2-ethylhexyl) phosphate, di (isopropylphenyl) phenylphosphate, o -Phenylphenyl dicresyl phosphate, tris (2,6-
Dimethylphenyl) phosphate, tetraphenyl-m
-Phenylenediphosphate, tetraphenyl-p-phenylenediphosphate, phenyl resorcin polyphosphate, bisphenol A bis (diphenyl phosphate), bisphenol A polyphenyl phosphate, dipyrocatechol high positive phosphate, etc.),
Aliphatic-aromatic phosphate ester (diphenyl (2-ethylhexyl) phosphate, diphenyl-2-acryloyloxyethyl phosphate, diphenyl-2-methacryloyloxyethyl phosphate, phenyl neopentyl phosphate, pentaerythritol diphenyl diphosphate, ethyl pyrocatechol phosphate Etc. orthophosphoric acid ester and their condensates. .

Among the organic phosphorus compounds, phosphites include, for example, aromatic phosphites (triphenylphosphite, trisnonylphenylphosphite, phenylpyrocatecholphosphite, etc.) and aliphatic phosphites (tristridecylphosphite). , Dibutylhydrogen phosphite, methyl neopentyl phosphite,
Examples thereof include phosphite esters of pentaerythritol diethyldiphosphite, dineopentyl hypophosphite and the like, and condensates thereof. .

Other organic phosphorus compounds include triphenylphosphine oxide, tricresylphosphine oxide, diphenyl methanephosphonate, diethyl phenylphosphonate and the like.

The inorganic phosphate as the phosphorus flame retardant is
Examples thereof include ammonium polyphosphate, polyphosphoric acid amide, and melamine polyphosphoric acid. .

The phosphorus-based flame retardant may be red phosphorus. This red phosphorus may be crushed after converting yellow phosphorus, or may be finely divided and converted in the state of yellow phosphorus before conversion.
An untreated surface or one containing black phosphorus due to aging can be used. However, considering safety during production, the surface of the inorganic material such as metal oxides and hydrated metal oxides represented by aluminum hydroxide and magnesium hydroxide,
Those which are stabilized by being coated with an organic substance such as a thermosetting resin or a thermoplastic resin and those which are stabilized by electrolessly plating red phosphorus and subjecting to a metal coating are preferred.

It is more preferable that the thermoplastic resin is blended as a masterbatch containing a base resin, whereby the safety during production and storage is dramatically improved. However, in consideration of moldability and mechanical properties, a resin having excellent compatibility with the composition is preferable. From this, the base resin of the masterbatch is selected from the above-mentioned sealing resins 1
Alternatively, it is more preferable to use two or more in combination.

The phosphorus-based flame retardant may be an organic phosphorus compound (organic phosphate ester) having at least one ester oxygen atom directly bonded to a phosphorus atom or a condensate thereof. Such an organophosphorus compound imparts flame retardancy and improves impact resistance when added to the thermoplastic resin composition. Among the phosphoric acid esters, aromatic phosphoric acid esters (triphenyl phosphate, etc.) or their condensates are particularly preferable. In the aromatic phosphate ester, the total number of carbon atoms of the substituents on the aromatic ring can be appropriately selected and
It may be about 0 to 20 (for example, 12 to 18).
As the aromatic phosphate substituted with an alkyl group,
Examples thereof include bis C _{5 to} C ₁₀ alkylphenyl-phenylphosphate (bisnonylphenylphenylphosphate and the like). . Among phosphoric acid esters, aromatic phosphoric acid esters having a hydroxyl group (for example, in aromatic phosphoric acid esters such as tricresyl phosphate, triphenyl phosphate, etc., at least one aromatic ring is included).
Phosphoric acid ester in which one phenolic hydroxyl group is substituted) is also preferable. Examples of such a phosphoric acid ester include resorcinyl diphenyl phosphate and bisphenol A.
Diphenyl phosphate etc. can be mentioned. .

Examples of the inorganic flame retardant include various metal compounds, for example, metal hydroxides such as calcium hydroxide, dolomite and hydrotalcite, metal oxides such as tin oxide and zirconium oxide, magnesium carbonate and zinc carbonate. Examples thereof include metal carbonates such as calcium carbonate and barium carbonate, metal borates such as zinc borate, zinc metaborate and barium metaborate, and triazine compounds. .

The blending amount of the flame retardant is preferably 1 to 60 parts by weight, more preferably 5 to 100 parts by weight of the resin.
It is 50 parts by weight.

The filler is preferably a fibrous or powdered inorganic filler, such as carbon fiber, whiskers (whiskers),
Glass fiber etc. can be mentioned. However, among these, carbon fiber is preferable.

Since the carbon fibers have a great influence on the fluidity of the resin, those having a weight average fiber length of 0.7 mm or less are preferable. When the weight average fiber length is 0.7 mm or less,
Liquidity does not decrease.

The whiskers may be metallic or non-metallic and may be aluminum borate, silicon carbide, silicon nitride, potassium titanate, basic magnesium sulfate, zinc oxide, graphite, magnesia, calcium sulfate, sodium calcium phosphate, magnesium borate, Titanium diboride, α
-Alumina, chrysotile, wollastonite, etc. may be mentioned. .

The glass fiber is not particularly limited as long as it is usually used for reinforcing a resin, and may be surface-treated with a sizing agent, a coupling agent or the like. From the viewpoint of appearance, workability during mixing, pelletizing, etc., the glass fiber is preferably long in terms of enhancing the reinforcing effect.
The length in the final molded product is preferably about 0.2 to 2 mm.

The compounding amount of the filler is preferably 5 to 100 parts by weight, more preferably 1 part by weight, based on 100 parts by weight of the resin.
It is 0 to 70 parts by weight.

The foaming agent is applied to the resin portion after sealing from 1.00 to 1.00.
The foaming agent does not have to be used as long as it has a foaming structure with a foaming ratio in the range of 2.00, and if a foaming agent is compounded, the same effect can be obtained.
Therefore, it is possible to apply a method of adding a chemical foaming agent and extruding, a method of extruding while injecting a foaming gas raw material, a method of extruding a resin composition impregnated with a liquid foaming gas raw material, and the like. It can be manufactured. Examples of the chemical foaming agent and foaming gas raw material include sodium hydrogen carbonate, ammonium hydrogen carbonate, azodicarbonamide, azobisisobutyronitrile, liquid hydrocarbons such as propane and butane.

The sealing resin used in the present invention includes, if necessary, stabilizers against heat, light and oxygen (antioxidants such as phenol compounds and phosphorus compounds; benzotriazole compounds and benzophenone compounds). , UV absorbers such as phenyl salicylate compounds; hindered amine stabilizers and heat stabilizers such as tin compounds and epoxy compounds), plasticizers, slidability improvers such as dimethylpolysiloxane, anionic surfactants (eg, higher grade A lubricant such as a fatty acid salt), a release agent, an antistatic agent, a colorant and the like may be added.

[0097]

The present invention will be described in more detail based on the following examples, but the invention is not intended to be limited by these examples.

Examples 1 to 8 and Comparative Examples 1 and 2 As shown in Table 1, the work (the substrate on which the IC chip was mounted) was resin-sealed by the mold and the procedure shown in FIG. 1, FIG. 3 or FIG. . The sealing efficiency is the number of sealed products per hour, and the product yield is the ratio of products (passed products) excluding defective products when 1000 are sealed. The details of the resins used in Examples and Comparative Examples are as follows.

PA: Nylon resin (Ube Industries, Ltd., U
B1010) ABS: ABS resin (Japan A & I Corporation, Santak A)
T08) PC: Polycarbonate resin (Teflon FN1700, Idemitsu Petrochemical Co., Ltd.) PPS: Polyplastics, Fortron 02
20A9 PEEK: ICI Japan Co., Ltd., Victorex Flame Retardant 1: Teijin Chemical Co., Ltd., Fireguard 3100 Flame Retardant 2: Asahi Denka Co., Ltd., FP500 Inorganic filler: Asahi Fiberglass Co., Ltd.
606

[0100]

[Table 1]

[0101]

By applying the resin sealing method of the present invention, desired works can be continuously manufactured by a simplified method.

[Brief description of drawings]

FIG. 1 is a process drawing for explaining a resin sealing method of the present invention.

FIG. 2 is a process drawing for explaining the resin sealing method of the present invention.

FIG. 3 is a process drawing for explaining the resin sealing method of the present invention.

FIG. 4 is a process drawing for explaining the resin sealing method of the present invention.

FIG. 5 is a process drawing for explaining the resin sealing method of the present invention.

FIG. 6 is a process drawing for explaining the resin sealing method of the present invention.

FIG. 7 is a process drawing for explaining the resin sealing method of the present invention.

[Simple explanation of symbols]

10, 100, 200, 300 Fixed type 40,140,240,310 Movable type

Front page continued (51) Int.Cl. ⁷ Identification code FI theme code (reference) H01L 21/56 H01L 21/56 T 23/29 B29K 23:00 23/31 25:00 // B29K 23:00 33: 00 25:00 67:00 33:00 69:00 67:00 75:00 69:00 77:00 75:00 105: 04 77:00 B29L 31:34 105: 04 H01L 23/30 B B29L 31:34 (72) Inventor Tatsuya Nakata 3-19-20-307 Akihara, Kashiwa City, Chiba Prefecture (72) Inventor Makoto Nakazawa 2110 Nanjo, Nijo Seiki Industrial Co., Ltd. 2110 Nanjo, Sajo-machi, Hanishina-gun, Niigata F-term in Nissei Fat & Oil Industry Co., Ltd. FD136 FD328 GQ00 GQ01 4M109 AA02 BA03 CA21 EA12 EB11 EB18 EC01 5F061 AA02 BA02 CA21 CB02 DA01 DA06 DB01

Claims (23)

[Claims] 1. A mold provided with a fixed mold and a movable mold,
It is a resin sealing method for applying a required part of a flat work by applying an insert molding method, wherein the fixed mold and the movable mold each have one or two or more cavities, and two or more of them are combined by combining them. The resin-filled space of any one of the combinations can be formed by loading a flat plate-shaped work into the resin-filled space of any one of the combinations, coating a required portion of one surface of the work with resin, and then filling the resin-filled space of another combination. Inside, a resin sealing method for coating a required portion of the other surface of the work with a resin. 2. Using a mold provided with a fixed mold and a movable mold,
It is a resin sealing method for applying a required part of a flat work by applying an insert molding method, wherein the fixed mold and / or the movable mold is provided with one or more cavities, respectively. The work is loaded into the first cavity provided in the movable mold, and the mold is clamped so that the first cavity and the second cavity of the opposite mold face each other. Step of covering the side to obtain the primary molded product, then moving the fixed mold or the movable mold, and aligning the first or second cavity and the third or fourth cavity so that they are clamped. After that, a step of filling a resin and covering the other surface side of the primary molded product to obtain a secondary molded product. 3. A mold provided with a fixed mold and a movable mold,
It is a resin sealing method for applying a required part of a flat work by applying an insert molding method, wherein the fixed mold and / or the movable mold is provided with one or more cavities, respectively. The work is loaded into the first cavity provided in the movable mold, and the mold is clamped so that the first cavity and the second cavity of the opposite mold face each other. Step of covering the side to obtain the primary molded product, then moving the fixed mold or the movable mold, and aligning the first or second cavity and the third or fourth cavity so that they are clamped. After that, a step of filling the resin and covering the other surface side of the primary molded product to obtain the secondary molded product is performed. At the same time, a new work is loaded in the first cavity and the resin is filled to cover the one surface side of the work. Includes a step of coating to obtain a primary molded product And which, resin sealing method of repeating the aforementioned steps sequentially. 4. The fixed mold has first and third cavities, and the movable mold has a second cavity. A work is loaded into the first cavity of the fixed mold to obtain a primary molded product. The resin sealing method according to claim 2, wherein the secondary molded product is finally taken out from the second cavity of the movable mold by sliding the fixed mold after the molding. 5. The fixed die comprises a fixed plate having a sprue connected to the resin filling means, and an intermediate plate arranged between the fixed plate and the movable die, the intermediate plate forming the first and third cavities. The resin sealing method according to claim 4, which has. 6. The fixed mold has first and third cavities, and the movable mold has second and fourth cavities,
The secondary molded product is finally taken out from the fourth cavity of the movable mold by loading the work into the second cavity of the movable mold, obtaining the primary molded product, and then rotating the fixed mold. 3. The resin sealing method described in 3. 7. A fixed plate connected to and fixed to a resin filling means and having a sprue, and an intermediate plate having a sprue disposed between the fixed plate and the movable mold and rotatably supported by a rotary shaft. 7. The resin sealing method according to claim 6, wherein the intermediate plate has first and third cavities. 8. The fixed mold has first and third cavities, and the movable mold has second and fourth cavities,
3. The secondary mold product is finally taken out from the fourth cavity of the movable mold by loading the work into the first cavity of the fixed mold and obtaining the primary molded product, and then rotating the movable mold. 3. The resin sealing method described in 3. 9. The flat molded work has one or more through holes, and the primary molded product is covered on one surface side with the resin protruding from the through hole to the other surface side. Is covered with resin on the other surface side including the protruding portion, the through hole acts to relieve the resin filling pressure on the work, and the protruding portion binds the resin covering both surfaces. The resin sealing method according to any one of claims 1 to 8, which acts on. 10. A resin encapsulation method for covering a required portion of a flat plate-like work by applying an insert molding method using a die having a fixed die and a movable die. After coating one surface of the fixed die with resin, move all or part of the movable die to form a space between the mating surfaces of the movable die and the fixed die, and then fill the space with resin. And a resin sealing method for covering the other surface of the flat work with the resin. 11. A resin sealing method for applying a insert molding method to a desired portion of a flat work, using a mold having a fixed die and a movable die, and penetrating the fixed die and the movable die. By supporting the flat plate-shaped work loaded in the cavity in the mold from both sides by projecting a pair of projecting pins provided from both directions, the resin is filled and the projecting pins are pulled out immediately before the completion of filling. A resin sealing method for covering both surfaces of a flat work by means of the above. 12. The resin filling is carried out from a fixed die or a pinpoint gate provided in a fixed die and a movable die.
The resin sealing method according to 0 or 11. 13. The expansion ratio is 1.0 when the resin is filled.
The resin encapsulating method according to claim 1, wherein the resin encapsulating portion is foamed in the range of 0 to 2.00 and the resin encapsulating portion has a foamed structure. 14. The resin sealing method according to claim 1, wherein when the resin is filled, the maximum pressure in the mold at the time of filling the resin is less than 100 MPa at a position 25 mm away from the gate. 15. The resin encapsulating method according to claim 1, wherein a thermoplastic resin is used as the encapsulating resin. 16. When the molding resin is used as the resin filling means for the resin for sealing, the preset temperature of the cylinder is 300.
The resin sealing method according to any one of claims 1 to 15, which can be filled at a temperature of not higher than ° C. 17. When a molding machine is used as the resin filling means, the resin for sealing has a cylinder set temperature of 250 ° C.,
2 mm at injection speed 1 m / min and injection pressure 75 MPa
The flow length of thickness is 100 mm or more.
15. The resin sealing method according to any one of 15. 18. The sealing resin is a polyamide resin,
18. One or two or more selected from a polycarbonate resin, a polystyrene resin, a polyolefin resin, a polyester resin, a polyurethane resin, a (meth) acrylic resin, and a liquid crystal polymer.
The resin sealing method described. 19. The encapsulating resin is a combination of a polyamide resin and an ABS resin.
The resin sealing method according to any one of 1 to 17. 20. The resin encapsulating method according to claim 14, wherein the encapsulating resin is a combination of a polycarbonate resin and an ABS resin. 21. The resin encapsulating method according to claim 14, wherein the encapsulating resin contains a flame retardant, a filler, or a foaming agent. 22. The resin sealing method according to claim 1, wherein the flat work is an electric or electronic component. 23. An electric or electronic component obtained by applying the resin sealing method according to any one of claims 1 to 22.