JP2003117839A - Manufacturing method for thin blade abrasive grain tool using resin binder - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thin blade abrasive grain tool using a resin binder and also a manufacturing method for such tools capable of securing its performance even under a severe processing conditions such that the grinding operation involves a high temperature heat generation without sacrificing the dispersion of fine superabrasive grains, etc. SOLUTION: A fluid resin binder compound containing at least two sorts of cation polymerizing resins having different hardnesses, in particular ring-form aliphatic series epoxy resin and glycidil-ether resin, and at hardening, a low- temperature hardening process and a high-temperature hardening process are used.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a novel method for producing a resin-bonded thin-blade abrasive grain tool, a resin-bonded thin-blade abrasive grain tool manufactured by the method, and a fluid resin bond used for producing the tool. Material composition, particularly high cutting precision and tool life, a method of manufacturing a thin blade grindstone (resin binding material thin blade abrasive grain tool) having a relatively small thickness dimension, a thin blade grindstone manufactured by the method (resin binding material thin blade grinding) It is possible to provide a granular resin) and a fluid resin binder composition used for manufacturing the same (tool).

[0002]

2. Description of the Related Art In order to cut and process hard and brittle materials such as silicon wafers, quartz and quartz, and metallic materials, a relatively small-sized grindstone having a thickness of 1 mm or less is used. For example, it is a cutting tool used in a dicing process for dividing semiconductor elements arranged in a matrix on a semiconductor wafer into pellets on a vertical surface regardless of the crystal orientation.

Phenolic resins are excellent in heat resistance and strength and have been conventionally used as a binding material for grindstones. However, since the phenol resin contains many benzene rings and has a relatively large molecular weight, it usually has a high viscosity at room temperature even if it is solid or liquid. Therefore, when a tool using abrasive grains such as a grindstone is used, the mixed material in which the abrasive grains are mixed with the phenol resin is in a powder state, and after heat pressing at room temperature, heat treatment or heat treatment is performed. Press for a while or
Are used to manufacture tools such as whetstones.

By the way, in tools using superabrasive grains such as diamond and cBN (cubic boron nitride), general abrasive grains such as alumina and SiC are mostly used together as a filler other than superabrasive grains. Is. The filler is mixed for the purpose of improving tool performance and mechanical properties such as elastic modulus and strength. It is desirable that the particle size of the filler is small in order to improve the performance and strength of the tool, but the finer the particle, the more difficult it is to disperse and the moldability deteriorates. Often. When the average particle diameter of the superabrasive grains is, for example, about 10 μm, a filler having an average particle diameter of about 8 μm is used as the filler other than the superabrasive grains.

When a powder of phenol resin is used as the resin binder composition, the particle size of the filler and the particle size of the powder resin are almost the same, so that the dispersibility may be deteriorated. Therefore, if importance is attached to the fluidity and the wetting between the abrasive grains and the resin, it is possible to use a liquid phenol resin. However, since liquid phenolic resin contains volatile components, if you try to make a tool using only this, bubbles tend to remain inside the tool during curing, and due to the large shrinkage, "crisp", "warp", "deformation" Is likely to occur and is difficult in reality. Therefore, both the powdered phenolic resin and the liquid phenolic resin are blended to sacrifice the dispersibility and moldability of particles such as abrasive grains and other fillers to some extent.

Under the above background, Japanese Patent Laid-Open No. 2001-2001
Japanese Patent No. 88037 describes a method for manufacturing a thin blade grindstone with high dimensional accuracy and high efficiency. This method uses a liquid phase photosensitive resin as a binder for abrasive grains, and injects a fluid grindstone material in which the resin and abrasive grains are mixed into a highly accurate mold to form a fluid grindstone material in the mold. It is a method in which a thin blade grindstone can be manufactured with high dimensional accuracy and high efficiency by curing it by irradiating it with light through the mold.

According to this method, fluidity can be ensured, moldability can be improved, and high-speed hardening can be performed, so that it is possible to manufacture a tool in which relatively fine abrasive grains are dispersed, and the dispersibility is also improved. Improvement can be expected.

[0008]

Now, let us consider the life of a tool using a resin binder. When considering cutting with a tool using a resin binder, the problem is whether the resin can withstand the heat generated at the grinding point.

In order to improve the heat resistance, it is considered to select a monomer having a structure such as a benzene ring which improves the heat resistance. However, the monomer containing many benzene rings becomes highly viscous or solid, and it becomes difficult to disperse the abrasive grains and other fillers.

Next, it is considered that a monomer containing many carbon double bonds in one molecule and having a high crosslinking density is preferable.
However, such a monomer has a large curing shrinkage and a cured product becomes brittle, which makes it difficult to handle.

Under such circumstances, the resin-bonded thin blade grinding wheel not only has good dispersibility of abrasive grains and is easy to manufacture, but can also ensure performance under more severe processing conditions such as high temperature heat generated during grinding. Development of granular tools and resin binders used for them is required.

The present invention has been made in view of the above problems, and the problem to be solved by the present invention is that particles containing at least superabrasive particles are sufficiently well dispersed in a resin binder,
Provided are a method for easily producing a resin-bonded thin blade abrasive grain tool capable of ensuring performance even under severe processing conditions such as high temperature heat generation during grinding, and a fluid resin-bonded material composition for the production. It is to be.

[0013]

Means for Solving the Problems As a result of intensive studies to solve the above problems, the present inventors have found that the curability is different.
At least two kinds of cationically polymerizable resins, particularly cycloaliphatic epoxy resins, and a specific fluid resin binder composition containing a glycidyl ether resin are first cured at a low temperature to a semi-cured state, whereby fine particles are obtained. It was found that the super-abrasive particles, the inorganic filler, the conductive material, and the like can be uniformly contained without sacrificing the dispersibility. Furthermore, since a semi-cured resin is used, it is easy to manufacture (mold), and the resin-bonded material thin blade abrasive grain tool manufactured by reprocessing this semi-cured resin at high temperature has an elastic modulus. -It has been found that mechanical properties such as strength are also high, performance can be secured even under more severe processing conditions such as high temperature heat generation during grinding, and the present invention has been completed based on these various findings. .

That is, according to the first aspect of the present invention, there is provided a method for manufacturing a resin-bonded thin blade abrasive grain tool having a thin plate-shaped abrasive grain holding portion in which particles containing at least superabrasive grains are held by a resin binder. And using a fluid resin binder composition containing at least two kinds of cationically polymerizable resins having different curability as the resin binder composition for the abrasive grain holding portion, and curing the same at a low temperature. There is provided a method for producing a resin-bonded thin blade abrasive grain tool characterized by including a high temperature hardening step (hereinafter, also referred to as "a method for producing a resin-bonded thin blade abrasive grain tool of the present invention").

Further, in the method for producing a resin-bonded thin blade abrasive grain tool of the present invention, the particles containing at least the superabrasive grains can contain an inorganic filler, and the inorganic filler has an average particle diameter of the above. Spherical or substantially spherical inorganic particles smaller than the average particle diameter of the superabrasive particles, and reinforcing fibers having a short diameter d smaller than the average particle diameter D of the superabrasive particles and a d / D value of 0.8 or less. Mixed particles containing at least one of them can be used. Further, the fluid resin binder composition may contain a cycloaliphatic epoxy resin and a glycidyl ether resin, and a cationic polymerization catalyst as a polymerization initiator of these resins. The fluid resin binder composition may further include a resin having a structure similar to each of the at least two kinds of cationically polymerizable resins.

In a second aspect of the present invention, there is provided a resin-bonded thin blade abrasive grain tool having a thin plate-shaped abrasive grain holding portion which holds at least particles containing superabrasive grains with a resin binder, the abrasive grain holding means Part of the resin binder was produced by subjecting a fluid resin binder composition containing at least two kinds of cationically polymerizable resins having different curability to a low temperature curing step and a high temperature curing step. There is provided a resin-bonded material thin-blade abrasive grain tool having the characteristics (1) (hereinafter, also referred to as "resin-bonded material thin-blade abrasive grain tool of the present invention").

Further, in the resin binder thin blade abrasive grain tool of the present invention, the particles containing at least superabrasive grains can contain an inorganic filler, and the inorganic filler has an average particle diameter of the superabrasive grains. At least one of spherical or substantially spherical spherical inorganic particles having an average particle diameter smaller than the average particle diameter of, and a reinforcing fiber having a short diameter d smaller than the average particle diameter D of the superabrasive grains and a d / D value of 0.8 or less. It can be a mixed particle containing different types. Further, the fluid resin binder composition may contain a cycloaliphatic epoxy resin and a glycidyl ether resin, and a cationic polymerization catalyst as a polymerization initiator of these resins. The fluid resin binder composition may further include a resin having a structure similar to each of the at least two kinds of cationically polymerizable resins.

In a third aspect of the present invention, a resin binder having a thin plate-like abrasive grain holding portion in which particles containing at least superabrasive grains are held by a resin binder, a fluid resin binder for manufacturing a thin blade abrasive grain tool. A composition, wherein the fluid resin binder composition contains at least two kinds of cationically polymerizable resins having different curability, and the at least two kinds of cationically polymerizable resins are a cycloaliphatic epoxy resin and glycidyl. Ether resin, and as a polymerization initiator of these resins, a resin binder characterized in that a cationic polymerization catalyst is added, a fluid resin binder composition for producing a thin blade abrasive tool (hereinafter, " Also referred to as "flowable resin binder composition of the present invention".

The fluid resin binder composition of the present invention may contain a resin having a structure similar to each of the at least two kinds of cationically polymerizable resins.

[0020]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below. The present invention has several forms, namely, a method for producing a resin-bonded thin-blade abrasive grain tool, a resin-bonded thin-blade abrasive grain tool produced by the method, and a fluid resin binder composition for producing the tool. included. The method for producing the resin binder thin blade abrasive grain tool of the present invention and the fluid resin binder composition for producing the tool will be mainly described, but the present invention is not limited thereto.

(Manufacturing Method of Resin Binder Thin Blade Abrasive Grain Tool of the Present Invention) A method of manufacturing the resin binder thin blade abrasive grain tool of the present invention will be described.

In the method for producing a resin-bonded thin blade abrasive grain tool of the present invention, at least two kinds of cationic polymerization having different curability are used as a fluid resinous binder composition for the production of the resin-bonded thin blade abrasive grain tool. Use a resin. Thus, by using a fluid resin having different easiness of polymerization, in the method for producing the resin binder thin blade abrasive grain tool of the present invention, fine superabrasive grains, inorganic fillers, conductive materials, etc. are uniformly dispersed. Not only is it possible to do so, but also the curing step of the fluid resin binder composition can be divided into two or more times, which facilitates the manufacture (molding) of this tool.

Specifically, a fluid resin binder composition containing at least two kinds of cationically polymerizable resins having different curability, for example, a cycloaliphatic epoxy resin and a glycidyl ether resin, and a cationic polymerization catalyst, When abrasive grains, an inorganic filler, etc. are added and stirred, these fine particles are uniformly dispersed to form a paste. Further, when the paste is reacted at a low temperature, a cycloaliphatic epoxy resin having good cationic polymerization (curability) first reacts and crosslinks (cures) in the presence of a cationic polymerization catalyst. Glycidyl ether resin has a poor cationic polysynthesis (curability), so it is difficult to polymerize at a relatively low temperature for a short time. Therefore, when it is cured at a low temperature, it becomes a semi-cured state, and the cured product remains to some extent. Therefore, it becomes easy to arrange the shape of the cured product cured into a sheet. After that, the cured product (cured product in semi-cured state) is sandwiched between plates and reprocessed at high temperature (reaction of glycidyl ether resin to crosslink (cure)) to obtain required heat resistance and strength. Can be secured. Therefore, according to the method for manufacturing the resin-bonded material thin blade abrasive grain tool of the present invention, it becomes possible to achieve both the ease of manufacturing and the processing performance.

The conditions for curing the resin having good cationic polymerization (making the fluid resin binder composition in a semi-cured state) are appropriately selected according to the resin used, but preferably 80 to About 120 ° C. and about 0.1 to 24 hours are selected. If the temperature is too low, stirring heat is generated and the hot life is shortened, which is not preferable. On the other hand, the conditions for curing the resin having poor cationic polymerization (re-treating a cured product in a semi-cured state at a high temperature) are also appropriately selected according to the resin used, but preferably 150. ~ 250
The temperature is selected to be about 0 ° C and about 0.1 to 24 hours.

The superabrasive grains used in the present invention include:
At least one of diamond, cBN (cubic boron nitride) and the like having a hardness equal to or higher than that of cBN is used.

The volume ratio of the superabrasive grains contained in the abrasive grain holding portion is preferably about 3 to 50% by volume, more preferably about 5 to 45% by volume, and further preferably 7 to 40% by volume. It is a degree. If it is less than 3% by volume, processing (cutting) tends to be impossible, which is not preferable. If it is more than 50% by volume, the holding strength of the superabrasive grains tends to be difficult to secure, which is not preferable.

The particle size of the superabrasive grains is not particularly limited, but an average particle size of about 1 to 50 μm is desirable. 1
When it is less than μm, when the inorganic filler is used together, it is necessary to make the inorganic filler fine according to the particle size of the superabrasive grains, and the dispersion in the fluid resin binder composition during production is substantially It is not preferable because it becomes difficult. The superabrasive particles having different particle diameters may be mixed if necessary. For example, it is possible to mix diamond abrasive grains having an average particle diameter of 10 μm and diamond abrasive grains having an average particle diameter of 3 μm.

The inorganic filler used in the present invention has a hardness lower than that of the superabrasive grains used in combination, and as described above, the inorganic filler is smaller than the average particle diameter of the superabrasive grains used in combination. At least one of spherical or substantially spherical inorganic particles having a small average particle diameter and reinforcing fibers having a short diameter d smaller than the average particle diameter D of the superabrasive grains and having a d / D value of 0.8 or less are used. It is a mixed particle containing.

The spherical inorganic particles are not particularly limited as long as they have a hardness lower than that of the superabrasive particles used in combination and are generally used as an abrasive, and examples thereof include SiC and A.
l ₂ O ₃ , ZrO ₂ , Cr ₂ O ₃ , CeO ₂ , Fe ₂ O
₃ , B ₄ C, Si ₃ N ₄ , SiO _{2 and the} like can be used. The average particle size of the spherical inorganic particles is not particularly limited, but is preferably at most about 80% (80% or less), more preferably at most 70% with respect to the average particle size of the superabrasive grains used in combination. (70% or less), more preferably at most 65% (65% or less) is used. If it is more than 80%, the removal of superabrasive grains is promoted, and the abrasion amount of the resin-bonded material thin blade abrasive grain tool during processing (cutting) tends to increase, which is not preferable.

Particularly, the average particle size of the superabrasive grains used in combination is 10
If it is less than μm, the superabrasive grains tend to fall off and it is difficult to secure the amount of protrusion. Therefore, it is desirable that the particle size of the spherical inorganic particles be as small as possible. However, the smaller the particle size of the spherical inorganic particles, the more difficult it is to disperse them in the resin binder. Therefore, the average particle size of the spherical inorganic particles is preferably at least 0.1 μm (0.1 μm or more).

In the abrasive grain holding portion, the volume ratio when the spherical inorganic particles are contained is preferably at least about 10% by volume (10% by volume or more), more preferably at least 15% by volume (15% by volume or more). It is about 20% by volume (more than 20% by volume), more preferably about 20% by volume.

Examples of the reinforcing fiber include ceramics, metals, metal compounds and the like, and at least one kind of them can be used. Particularly, the size (thickness) of the minor axis is preferably 0.005 μm (0.
About 005 μm or more), and preferably at most 80% (80% or less) with respect to the average particle size of the superabrasive grains used in combination.
Degree, more preferably at most 70% (70% or less)
About 65% (65% or less)
Something is used. The major axis (length) of the reinforcing fiber is preferably at most 50 μm (5
0 μm or less), more preferably at most 40 μm
(40 μm or less), more preferably at most 30
It is about μm (30 μm or less). In addition, although fine fibers have reinforcing fibers with a major axis of about 1 μm, it is effective to add the resin in which the reinforcing fibers are dispersed during production so long as the fluidity is not impaired, and these reinforcing fibers are used. It is appropriately selected depending on the resin and superabrasive grains.

On the other hand, a reinforcing fiber having a high aspect ratio such as a reinforcing fiber is preferable as a reinforcing material for the resin, but when a large amount of this is added, the viscosity of the fluid resin binder composition before curing during production becomes high. Will end up. Therefore, in the abrasive grain holding portion, the volume% when containing the reinforcing fiber is
Is preferably about 0.2 to 8% by volume, more preferably about 0.2 to 5% by volume, and further preferably about 0.2 to 3% by volume.

In addition to the spherical inorganic particles, other
Organic particles may be included. As the other inorganic particles
For the same as the spherical inorganic particles,
Also has low hardness and is commonly used as an abrasive
There is no particular limitation so long as it is, for example, SiC or Al.
_TwoO_Three, ZrO_Two, Cr_TwoO_Three, CeO_Two, Fe
_TwoO_Three, B _FourC, Si_ThreeN_Four, SiO_TwoCan be used
However, it is possible to increase the filling amount in the abrasive grain holding part.
And composition of fluid resin binder before curing during manufacturing
Use one that does not increase the viscosity when mixed with
Preferably. There are two types of these inorganic particles.
It is also possible to use a combination of the above.
For example, a GC abrasive grain (SiC-based abrasive grain) having an average particle diameter of 5 μm
And SiO with an average particle size of 0.5 μm_TwoCombine the powder
Can be used. Therefore, the
The content of the other inorganic particles is not particularly limited,
Does not hinder the purpose or effect of the present invention or exert a bad influence.
In the range, if necessary, can contain an appropriate amount
It

The total volume ratio when the superabrasive grains and the inorganic filler are contained in the abrasive grain holding portion is preferably about 20 to 70% by volume, more preferably 25 to 70% by volume.
It is about 65% by volume, more preferably about 30 to 60% by volume.

The resinous binder composition used in the method for producing the resin binder thin blade abrasive grain tool of the present invention may contain at least two kinds of the above-mentioned specific cationically polymerizable resins, and in particular, bisphenol A type. A fluid resin binder containing both a cycloaliphatic epoxy resin having a good cationic polymerization property and a glycidyl ether resin having a poor cationic polymerization property, which has high heat resistance as compared with Preference is given to using compositions.

The cycloaliphatic epoxy resin used in the present invention may be a compound having an alicyclic structure and an epoxy group bonded to it, but the molecular weight is preferably 10
About 0 to 2000, more preferably about 110 to 1500, and even more preferably about 120 to 1000 is used.

If the molecular weight is too small, the volatility of the cycloaliphatic epoxy resin becomes high and the working environment and the processing characteristics during coating are markedly deteriorated, which is not preferable. When the molecular weight is too large, the viscosity of the composition increases, which makes it difficult to uniformly apply the composition in a predetermined shape, which is not preferable.

Specific examples of the cycloaliphatic epoxy resin include 5-membered ring and 6 represented by the following general formulas (1) to (10).
Examples include those having a member ring.

[0040]

[Chemical 1] (1)

[0041]

[Chemical 2] (2)

[0042]

[Chemical 3] (3)

[0043]

[Chemical 4] (4)

[0044]

[Chemical 5] (5)

[0045]

[Chemical 6] (6)

[0046]

[Chemical 7] (7)

[0047]

[Chemical 8] (8)

[0048]

[Chemical 9] (9)

[0049]

[Chemical 10] (10)

On the other hand, as commercially available products, there are available: CHIBERGAYG: CY177, 175, 179, UCC: ERL4234, 4299, 4221 Daicel UCB: Celoxide 2021P, 2000,
There are 3000 etc.

The content of the cycloaliphatic epoxy resin used in the present invention is not particularly limited, but is preferably 30 to 30 relative to the total amount of the fluid resin binder composition.
The content is about 90% by weight, more preferably about 35 to 85% by weight, still more preferably about 40 to 80% by weight.

The glycidyl ether resin used in the present invention is a compound having a glycidyl ether group represented by the following general formula (11). Therefore, a glycidyl ester resin such as hexahydrophthalic acid diglycidyl ester can also be used as the glycidyl ether resin used in the present invention, and is included in the cationically polymerizable resin (having poor curability) used in the present invention.

[0053]

[Chemical 11] (11)

In the glycidyl ether resin, the molecular weight is preferably about 100 to 2000, more preferably about 110 to 1500, and further preferably 120 to.
Around 1000 is used.

If the molecular weight is too small, the glycidyl ether resin is highly volatile and the working environment and the processing characteristics during coating are markedly deteriorated. When the molecular weight is too large, the viscosity of the composition increases, which makes it difficult to uniformly apply the composition in a predetermined shape, which is not preferable.

Specific examples of the glycidyl ether resin include allyl glycidyl ether, butyl glycidyl ether, 2-ethylhexyl glycidyl ether, and 2-ethylhexyl glycidyl ether.
Monofunctional (monofunctional) compounds such as methyl octyl glycidyl ether and glycidol, neopentyl glycol diglycidyl ether, glycerol diglycidyl ether, ethylene glycol diglycidyl ether, 1,4
-Butanediol diglycidyl ether, molecular weight 200
Bifunctional compounds such as polypropylene glycol diglycidyl ether having a molecular weight of 0 or less, polyethylene glycol diglycidyl ether having a molecular weight of 2000 or less, glycerol triglycidyl ether, trimethylolpropane polyglycidyl ether having a molecular weight of 2000 or less, molecular weight 2000
The following trifunctional or higher polyfunctional compounds such as sorbitol polyglycidyl ether may be mentioned. A compound having two or more functional groups is preferable in terms of adhesive strength. In this case, monofunctional means having one epoxy group, bifunctional means having two epoxy groups, trifunctional means having three epoxy groups, and polyfunctional means having a plurality of epoxy groups. .

The addition of the glycidyl ether resin to the cycloaliphatic epoxy resin is effective in improving the brittleness of the resin binder. Particularly, as the glycidyl ether resin, a hydroxyl group (OH) or an ether group (-O-)
By using the glycidyl ether resin having the above, it becomes easy to disperse hydrophilic particles in the resin. Furthermore,
It is effective to improve heat resistance by selecting one having many epoxy groups.

Examples of the glycidyl ether resin having a hydroxyl group include, for example, Nagase Chemtex: Denacol (for example, EX-61 represented by the following general formula (12)).
1, EX-612, EX-614, EX-614B, E
X-622, EX-51 represented by the following general formula (13)
2 (n≈2), EX-521 (n≈3), EX-421 represented by the following general formula (14), and the following general formula (15)
EX-313 and EX-314 represented by, and EX-321 represented by the following general formula (16), etc. are commercially available.

[0059]

[Chemical 12] (12)

[0060]

[Chemical 13] (13)

[0061]

[Chemical 14] (14)

[0062]

[Chemical 15] (15)

[0063]

[Chemical 16] (16)

Examples of the glycidyl ether resin having an ether group include, for example, Nagase Chemtex: Denacol (for example, EX-81 represented by the following general formula (17)).
0 (n = 1), EX-811 (n = 2), EX-850
(N = 2), EX-851 (n = 2), EX-821
(N≈4), EX-830 (n≈9), EX-832
(N≈9), EX-91 represented by the following general formula (18)
1 (n = 1), EX-920 (n≈3), EX-941
(N = 2) and the like are commercially available.

[0065]

[Chemical 17] (17)

[0066]

[Chemical 18] (18)

The content of the glycidyl ether resin used in the present invention is not particularly limited,
Preferably about 5 to 70% by weight, more preferably 10 to 65% by weight, based on the total amount of the fluid resin binder composition.
Content, more preferably about 15 to 60% by weight.

The content of the at least two kinds of cationically polymerizable resins is preferably at least 50% by weight (50% by weight or more) based on the total amount of the fluid resin binder composition.
Degree, more preferably at least 60% by weight (60% by weight or more), and even more preferably at least 70% by weight (70% by weight).
% Or more).

On the other hand, in the above-mentioned at least two kinds of cationically polymerizable resins, when the compatibility is poor due to the combination of these resins (monomers), as the third component,
It is effective to add other resins. in this case,
As the third component, a resin (monomer) having a structure similar to each of the at least two kinds of cationically polymerizable resins can be used. For example, in the case of using a cycloaliphatic epoxy resin and a glycidyl ether resin, a resin having an epoxy group at the terminal and a cyclic skeleton such as cyclohexane can be used, and a resin having such a structure is not particularly limited. No, for example, Denacol EX-252 (Nagase Chemtex) represented by the following general formula (19), and General formula (20) EHPE-3150 shown below.
(Daicel Chemical Industries) is effectively used.

[0070]

[Chemical 19] (19)

[0071]

[Chemical 20] (20)

Therefore, in the fluid resin binder composition used in the present invention, the third component may not be contained, and when it is contained, the object and effect of the present invention are impaired, or If necessary, an appropriate amount can be contained within a range that does not adversely affect (for example, increase the viscosity of the resin). Therefore, when including it,
As mentioned above, there is no particular limitation, but the content thereof is preferably about 2 to 50% by weight, more preferably about 3 to 40% by weight, and further preferably, to the total amount of the fluid resin binder composition. About 5 to 30% by weight is selected.

Further, for the purpose of increasing the cationic polymerizability or heat resistance, or decreasing the viscosity, ethylene glycol, trimethylolpropane, polycaprolactone diol, polycaprolactone triol, as a fourth component,
Polyol compounds such as polycarbonate diol (OH
Monomers with multiple groups), vinyl ether compounds such as methyl vinyl ether and ethyl vinyl ether, alkyd resins such as glyptal resins, acrylic resins such as acrylic acid esters, methacrylic acid esters, polyacrylic acid esters, and polymethacrylic acid esters. You can The content of the fourth component is not particularly limited, and may be an appropriate amount as long as it does not impair the object and effect of the present invention or exert a bad influence.

The cationic polymerization catalyst (thermal cationic polymerization initiator) used in the present invention is, for example, a cationic system such as triflic acid salt, boron trifluoride ether complex compound, boron trifluoride or the like. Protic acid catalysts can be used. Among these, the preferred thermal cationic polymerization initiator is triflate, for example,
There are diethylammonium triflate, triethylammonium triflate, diisopropylammonium triflate, ethyldiisopropylammonium triflate, etc. available as FC-520 from 3M Company.

Among the aromatic sulfonium salts that are also used as the active energy ray cationic polymerization initiator, there are some that generate a cationic species by heat, and these are also used as the cationic polymerization catalyst (thermal cationic polymerization initiator). be able to. Specific examples include Sanshin Chemical Industry: SI series (SI-60L, 80L,
100 L, 110 L, 180 L, etc.), Asahi Denka Kogyo: Adeka Opton (CP-66, 77 etc.) and the like. Among these cationic polymerization catalysts, an aromatic sulfonium salt is preferable because it has an excellent balance of handleability, latency and curability.

The content of the cationic polymerization catalyst used in the present invention may be appropriately selected in consideration of the content of at least two kinds of cationically polymerizable resins having different curability. For example, with respect to 100 parts by weight of a mixture of at least two kinds of cationically polymerizable resins having different curability, for example, a component cycloaliphatic epoxy resin and a component glycidyl ether resin, preferably 0.01 to 15% by weight. Content (addition) of about 0.1 to 10% by weight.

The fluid resin binder composition of the present invention may contain at least two kinds of cationically polymerizable resins having different curability as described above, which may hinder the objects and effects of the present invention, or may cause adverse effects. If necessary, mix (contain) auxiliary substances such as sensitizers, leveling agents, plasticizers, defoaming agents, etc. for the preparation of fluid resin binder composition, in the range not given.
Can be made.

(Resin Binder Thin Blade Abrasive Grain Tool of the Present Invention) The resin binder thin blade abrasive grain tool of the present invention will be described.

The present invention is a resin-bonded thin blade abrasive grain tool obtained by the above-mentioned manufacturing method. The abrasive grain holding portion of the resin-bonded material thin blade abrasive grain tool of the present invention has a thin plate-like shape in which particles containing at least superabrasive grains are dispersed and held in the resin-bonded material (generally, on the rotating shaft. A thin disk-shaped member having a through hole penetrating in the thickness direction for attachment in the central portion).

The resin-bonded thin blade abrasive grain tool of the present invention can also be used for an application generally called a dicing blade. In this case, since the zero point of the machine is detected by checking the energization, the resin binder thin blade abrasive grain tool needs to be electrically conductive. Therefore, the conductive material is added to the resin-bonded material thin blade abrasive grain tool. The electrical conductivity is adjusted so that the electrical resistance between two points (about 1 cm) is about 30 kΩ or less when the tester is pressed against the resin binder thin blade abrasive grain tool.

As the conductive material, carbon black, acetylene black, Ketjen black, carbon such as graphite powder, or metal powder such as nickel, silver, cobalt, copper, or the like, which has conductivity, is particularly problematic. Can be used without.

Among the above-mentioned conductive materials, carbon is preferable from the viewpoint that sufficient conductivity can be obtained with a small amount of addition, and this content is particularly problematic as long as the necessary conductivity can be satisfied. However, an appropriate amount is mixed (contained) if necessary, but preferably 1 to 15% by volume is mixed (contained) in the abrasive grain holding portion.

On the other hand, as described above, it is also possible to use the metal powder, which is not only for ensuring the conductivity but also for dispersing the strength of the binder in the resin binder, the hardness, the elastic modulus, Alternatively, they can be mixed (contained) in order to improve heat resistance. There is no particular problem as to the content as long as it can ensure the necessary conductivity or mechanical / thermal physical properties, and an appropriate amount is mixed (contained) as necessary. In the grain holding part,
It is mixed (contained) in the range of 3 to 40% by volume.

A plurality of these conductive materials can be mixed and used, but in an amount that can satisfy the required conductivity within a range that does not impair the objects and effects of the present invention or exerts a bad influence. It is natural to use.

(Fluidic Resin Binder Composition of the Present Invention) The fluidic resin binder composition of the present invention is the fluidic resin binder composition for producing the resin binder thin blade abrasive grain tool of the present invention. This is as described in the method for manufacturing a resin-bonded material thin blade abrasive grain tool of the present invention.

[0086]

[Examples] Hereinafter, as examples of the present invention, a production method and production contents when the fluid resin binder composition of the present invention is used will be shown, and experimental results when applied to grooving of quartz will be described. However, the present invention is not limited to these embodiments.

[Manufacturing Method] The resin binder thin blade abrasive grain tool of the present invention was manufactured by the following manufacturing method. In addition, the manufacturing method (manufacturing example) of the resin binder thin blade abrasive grain tool of the present invention is shown in FIG. 1 (see FIG. 1).

(1) The following raw materials were stirred and mixed at the ratios shown in Table 1 below to prepare a fluid grinding stone material. (2) Weighing about 5 g of fluid grindstone material, sandwiching it between PET sheets (thickness 50 μm) treated with a release material,
The thickness was set to 300 μm (200 μm at the grindstone portion) by rolling. The rolled product is dried in the first (low) temperature T
_It heat-processed at ₁ (120 degreeC) for 3 hours. (3) The semi-cured product was taken out and the PET sheet was peeled off. (4) The semi-cured sheet was hollowed into a ring shape with an outer diameter of 55 and a hole diameter of 38. (5) The ring is sandwiched between Teflon (registered trademark) resin sheets and further sandwiched by a glass disk or the like, and the second (high) temperature T _{2 is applied.}
It heat-processed at (180 degreeC) for 3 hours. (6) The obtained tool (blade) has an outer diameter of φ53 and a hole diameter of φ.
Finished at 40.

[0089] [Description of raw materials]   Binder composition: Mixture of fluid resin and corresponding polymerization initiator   Filler: Spherical alumina with an average particle size of 0.6 μm   Whiskers: Tin oxide whiskers                 Diameter 0.01-0.02μm, Length 0.2-2μm   Abrasive grains: Diamond grains with an average grain size of 25 μm

[Preparation Content of Examples] Table 1 below shows the preparation content of Examples. The unit of the numbers in Table 1 is% by volume.

[0091]

[Table 1]

As a comparative example, a commercially available blade having a diamond abrasive grain size of 25 μm and a concentration of 50 (12.5% by volume) was used.

[Resin Content] The resin content is shown in Table 2 below. In addition, in Table 2 below, the total amount of the resin main body is 100% by weight, and the total amount of the resin main body is 100% by weight.

[0094]

[Table 2]

[0095] [Experimental conditions]   Processing equipment: Disco dicer DAC552,   Workpiece: Quartz,   Spindle rotation speed: 30000 rpm,   Feed rate: Condition 4 mm / s Condition 2 mm / s,   Depth of cut: condition 0.5 mm condition 1 mm,   Coolant: Water (1 liter / min),   Cutting distance: 25 cut 100mm,   Blade size: φ53 × 0.2 × φ40, and   Truing whetstone: GC600B (resin binder general whetstone).

[Test Results] Table 3 below shows the test results under the above experimental conditions when the above test conditions were selected for each of the blades of the examples and comparative examples.

[0097]

[Table 3]

For each blade of the examples and comparative examples,
Table 4 below shows the test results under the above experimental conditions when the above test conditions were selected.

[0099]

[Table 4]

The rough value of the grinding ratio was calculated from the following formula.

Approximate grinding ratio value = (cut amount) × (distance) ×
(Number of pieces) / ((outer circumference) x (amount of radial wear))

The load current value was calculated from the following formula.

[0103] Load current (A) = (current during processing)-(no-load current)

Further, the processed surface was observed and chipping was measured.

As described above, from Tables 3 and 4 above, the working example has a larger grinding ratio than the comparative example without increasing the load current value under any of the above test conditions. Therefore, it is clear that the resin-bonded material thin blade abrasive grain tool (Example) of the present invention has a long durability life without impairing the sharpness of the blade. From the above, it can be seen that the resin-bonded material thin blade abrasive grain tool (Example) of the present invention exhibits excellent processing performance.

[0106]

EFFECTS OF THE INVENTION According to the method for manufacturing a resin-bonded thin blade abrasive grain tool of the present invention, it becomes possible to achieve both ease of manufacturing and processing performance in manufacturing a resin-bonded thin blade abrasive grain tool. Further, since the fluid resin binder composition containing the above-mentioned specific at least two kinds of cationically polymerizable resins of the present invention is used as the fluid resin binder composition, particles containing superabrasive grains and the like are resin-bonded. A resin-bonded thin blade abrasive tool that is well dispersed in the material, has high mechanical properties such as elastic modulus, and can ensure performance even under severe processing conditions such as high temperature heat generation during grinding. It is possible to manufacture.

From the above, it is understood that the present invention is extremely useful particularly in the field of manufacturing a thin blade grindstone having a high cutting accuracy and a long tool life and a relatively small thickness dimension.

[Brief description of drawings]

FIG. 1 shows an example of a method for manufacturing a resin-bonded thin blade abrasive grain tool of the present invention. The resin binder thin blade abrasive grain tool of the present invention is manufactured in this order.

[Explanation of symbols]

1. 1. A paste containing a fluid resin binder composition (fluid grindstone material) 1. PET sheet 3. Support plate 4. 4. Resin binder composition in semi-cured state Blade-shaped resin binder 6. Heat resistant sheet

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) B24D 5/12 B24D 5/12 Z

Claims (16)

[Claims] 1. A method for manufacturing a resin-bonded thin-blade abrasive grain tool having a thin plate-shaped abrasive grain holding portion in which particles containing at least superabrasive grains are held by a resin binding material. The fluid resin binder composition containing at least two kinds of cationically polymerizable resins having different curability and used as the resin binder composition of 1., and including a low-temperature curing step and a high-temperature curing step in curing the same. A method of manufacturing a resin-bonded thin blade abrasive tool characterized by: 2. Particles containing at least superabrasive particles contain an inorganic filler, and the inorganic filler has a spherical or substantially spherical spherical inorganic particle having an average particle diameter smaller than the average particle diameter of the superabrasive particles. , And the short diameter d is the average particle diameter D of the superabrasive grains.
The method for manufacturing a resin-bonded thin blade abrasive grain tool according to claim 1, wherein the mixed particles include at least one kind of reinforcing fibers having a d / D value of 0.8 or less. 3. The resin according to claim 1, wherein the fluid resin binder composition contains a cycloaliphatic epoxy resin and a glycidyl ether resin, and a cationic polymerization catalyst as a polymerization initiator of these resins. A method for manufacturing a thin abrasive blade tool for a bonding material. 4. The resin binder according to claim 1, wherein the fluid resin binder composition contains a resin having a structure similar to each of the at least two kinds of cationically polymerizable resins. Method for manufacturing thin blade abrasive tool. 5. The content of the cycloaliphatic epoxy resin is 30 to 90 relative to the total amount of the fluid resin binder composition.
% By weight, and the content of the glycidyl ether resin is 5 to 70 with respect to the total amount of the fluid resin binder composition.
% By weight, and the content of the cationic polymerization catalyst is 0.01 to 15 with respect to 100 parts by weight of the mixture of these resins.
It is the weight%, The manufacturing method of the resin bonding material thin blade abrasive grain tool according to any one of claims 1 to 4. 6. The content of the resin having a structure similar to each of the at least two kinds of cationically polymerizable resins is 2 to 50% by weight based on the total amount of the fluid resin binder composition. 5. A method for manufacturing a resin-bonded thin blade abrasive grain tool according to any one of items 1 to 5. 7. A resin-bonding material thin blade abrasive grain tool having a thin plate-shaped abrasive grain holding portion in which particles containing at least superabrasive grains are held by a resin binding material, wherein the resin binding material in the abrasive grain holding portion is hardened. A resin binder produced by subjecting a fluid resin binder composition containing at least two kinds of cationically polymerizable resins having different properties to a low temperature curing step and a high temperature curing step. Thin blade abrasive tool. 8. The spherical inorganic particles, wherein the particles containing at least superabrasive particles contain an inorganic filler, and the inorganic filler has an average particle diameter smaller than the average particle diameter of the superabrasive particles. , And the short diameter d is the average particle diameter D of the superabrasive grains.
8. The resin-bonded thin blade abrasive grain tool according to claim 7, which is a mixed particle containing at least one kind of reinforcing fibers having a smaller d / D value of 0.8 or less. 9. The resin according to claim 7, wherein the fluid resin binder composition contains a cycloaliphatic epoxy resin and a glycidyl ether resin, and a cationic polymerization catalyst as a polymerization initiator of these resins. Bonding material thin blade abrasive tool. 10. The resin binder according to claim 7, wherein the fluid resin binder composition contains a resin having a structure similar to each of the at least two kinds of cationically polymerizable resins. Thin blade abrasive tool. 11. The content of the cycloaliphatic epoxy resin is 30 to 9 relative to the total amount of the fluid resin binder composition.
0% by weight, and the content of the glycidyl ether resin is 5 to 7 with respect to the total amount of the fluid resin binder composition.
0% by weight, and the content of the cationic polymerization catalyst is 0.01 to 1 with respect to 100 parts by weight of the mixture of these resins.
The resin-bonded thin blade abrasive grain tool according to claim 7, which is 5% by weight. 12. The content of a resin having a structure similar to each of the at least two kinds of cationically polymerizable resins is 2 to 50% by weight based on the total amount of the fluid resin binder composition. The resin-bonded material thin blade abrasive grain tool according to any one of items 1 to 11. 13. A fluid resin binder composition for producing a resin binder thin blade abrasive grain tool, comprising a thin plate-shaped abrasive grain holding portion holding particles containing at least superabrasive grains with a resin binder.
The fluid resin binder composition contains at least two kinds of cationically polymerizable resins having different curability, and the at least two kinds of cationically polymerizable resins are a cycloaliphatic epoxy resin and a glycidyl ether resin, and A fluid resin binder composition for producing a thin resin abrasive blade tool, characterized in that a cationic polymerization catalyst is added as a polymerization initiator for these resins. 14. The fluid resin binder composition according to claim 13, which contains a resin having a structure similar to each of the at least two kinds of cationically polymerizable resins. 15. The content of the cycloaliphatic epoxy resin is 30 to 9 relative to the total amount of the fluid resin binder composition.
0% by weight, and the content of the glycidyl ether resin is 5 to 7 with respect to the total amount of the fluid resin binder composition.
0% by weight, and the content of the cationic polymerization catalyst is 0.01 to 1 with respect to 100 parts by weight of the mixture of these resins.
The flowable resin binder composition according to claim 13 or 14, which is 5% by weight. 16. The content of the resin having a structure similar to each of the at least two kinds of cationically polymerizable resins is 2 to 50% by weight based on the total amount of the fluid resin binder composition. 15. The fluid resin binder composition according to any one of 15 to 15.