JP2003117459A - Dispenser and method for manufacturing semiconductor device using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a multi-point nozzle for discharging paste eliminating or extremely reducing air residue (17), and a method for manufacturing a semiconductor device using the same. SOLUTION: The dispenser type multi-point nozzle (2) for applying the paste (8) is constituted of the paste (8) charged in a syringe (3), a plunger (7) for extruding the paste (8) and the multi-point nozzle (3) for discharging the paste (8). The multi-point nozzle (2) is constituted of a nozzle part (5) attached to the leading end of the multi-point nozzle (2), a body part (10) and a stem part (11). In the inner structure of the multi-point nozzle (2) formed by the body part (10) and the stem part (11), the side surface (14) and the bottom surface (15) of the body part (10) form a taper T1 or a curved part K.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dispenser provided with a liquid resin adhesive (silver paste) or a solder paste, and a dispenser provided with a multi-point nozzle for discharging paste, and a semiconductor device using them. The present invention relates to a manufacturing method of.

[0002]

2. Description of the Related Art As a post-process in a method of manufacturing a semiconductor device, a mount (mo
unt) there is work. Mounting is a process of mounting a semiconductor chip, which is cut by dicing, on an island of a lead frame. As a mounting method, a liquid "glue" (hereinafter referred to as paste) is applied on the island with a dispenser, and a semiconductor chip is arranged from above,
To glue. Generally, this method is called a dispense method.

FIG. 10 is a sectional view of a multipoint nozzle for discharging paste, which is attached to the tip of a conventional dispenser. In this figure, the multi-point nozzle (101) has the paste (10
It shows the state when 2) is being discharged. The multi-point nozzle (101) includes a stem portion (103) and a body portion (10).
4). The syringe (105) has the shape of a syringe and represents the tip of a dispenser. A multi-point nozzle (101) for discharging paste is attached to the tip. The stem portion (103) includes a body portion (104) and a syringe (10
5) Serves as a bridge that connects with. The body part (104) has a plurality of nozzle parts (106) at the tip,
The paste (102) is discharged from the nozzle portion (106) onto the island (102).

[0004]

However, the internal shape of the conventional body portion (104) is the same as that of the nozzle portion (106).
There is a right-angled portion (hereinafter, referred to as an intersecting portion (107)) in the vicinity, and air (air) remains in the portion, forming an air residue (108). This air remaining (108)
Due to this, a part of the air is mixed in the paste (102). As a result, it was difficult to discharge a uniform paste amount from the nozzle portion (106) onto the surface of the island (109).

The discharge amount of the paste (102) is controlled by the amount of air sent from a hose (not shown) connected to the syringe (105). Therefore, there is a drawback in that the amount of paste to be discharged varies and the characteristics of the completed semiconductor device are made unstable.

In view of the above-mentioned drawbacks, the present application provides a multi-point nozzle (101) which always discharges a fixed amount of paste (102).

[0007]

According to the present application, a syringe having a container portion for filling a paste therein, a multi-point nozzle having a space portion which is attached to the tip of the syringe and is continuous with the container portion, A plurality of nozzles provided at the tip of the multi-point nozzle, the nozzle having a cavity that is continuous with the space of the multi-point nozzle to discharge the paste from the tip, and the space of the multi-point nozzle. Inner wall has a bottom surface orthogonal to the discharging direction of the paste, and a parallel side surface, the intersection of the bottom surface and the side surface forms a tapered shape, and its manufacture. Provide a way.

[0008]

FIG. 1 is a sectional view showing a dispenser type dispenser in a resin mounting method.
(1) is a dispenser, (2) is a multi-point nozzle, (3) is a syringe, (4) is a hose, (5) is a nozzle part, (6)
Is a container, (7) is a plunger, (8) is a paste,
(9) represents the attachment / detachment portions, respectively. Note that, in the constituent elements of the present application, the same reference numerals are given to the same elements in all the drawings.

The dispenser (1) is a multi-point nozzle (2).
And a syringe (3) and a hose (4). The multi-point nozzle (2) is an array of a plurality of nozzle portions (5) for discharging the "paste" -shaped paste (8) from the tip. The syringe (3) is a syringe-shaped plastic container (6), and a pressure valve called a plunger (7) is provided inside the syringe (3). The space from the plunger (7) to the nozzle portion (5) is filled with the paste (8). The paste (8) is mainly a silver paste obtained by adding about 80% of silver (Ag) in an epoxy resin. An attaching / detaching part (9) is provided on the syringe (3) side of the hose (4), and the attaching / detaching part (9) joins the syringe (3) and the hose (4). The air sent from the outside of the hose (4) is pushed out in the direction of the arrow in FIG. 1, and eventually pressurizes the plunger (7). Most of the paste (8) inside the container (6) is discharged outside by the plunger (7). After all the paste (8) has been discharged, it is replaced with a new dispenser (1) filled with paste (8).

FIG. 2A is a sectional view showing the first embodiment of the present application, and is an enlarged view showing the multi-point nozzle (2). FIG. 2 (B) is a plan view seen from above in FIG. 2 (A). (10) shows a body part and (11) shows a stem part, respectively. (5a) represents a hole that is open in the nozzle portion (5). The arrow in the figure indicates the discharging direction of the paste (8).

2A will be described. The multi-point nozzle (2) is composed of a body portion (10) and a stem portion (11). The body part (10) and the stem part (11) are
A spiral groove is formed in a part of each other, and the two are fitted together to form an integrated multipoint nozzle (2). Therefore, both the body part (10) and the stem part (11) can be disassembled. This is in consideration of convenience at the time of cleaning, but the non-decomposable multi-point nozzle (2) in which the body portion (10) and the stem portion (11) are integrated is also included in the scope of the present application. .

Inside the multipoint nozzle (2) in which the body (10) and the stem (11) are integrated, a space (12) for filling the paste (8) is formed. A nozzle portion (5) is formed at the tip of the body portion (10), and the body portion (10) and the nozzle portion (5) are integrated metal products. Inside the nozzle part (5), a cavity part (13) for filling the paste (8) is formed. The stem portion (11) also serves to connect the body portion (10) and the tip of the syringe (3).

The space (12) and the cavity (13) are filled with the paste (8) without any gap. This space (1
2) and the cavity (13) are filled with paste (8) in both areas. A circle S in the figure is a main part of the present application and is shown in FIG.
See below.

2B will be described. For convenience of description, the internal paste (8) is omitted. Stem part (1
The four double circles seen inside the circle of 1) are nozzle holes (5a) when the nozzle portion (5) is viewed from above.
The innermost circle of the nozzle hole (5a) represents the discharge port for discharging the paste (8). The body portion (10) forms a larger circle outside the stem portion (11) when viewed in a plan view. In the present application, the embodiment has four nozzles, but in general, the multipoint nozzle (2) may have about 2 to 8 nozzles. The number of nozzles increases or decreases depending on the situation.

Referring to FIG. FIG. 3 is FIG. 2 (A)
It is the figure which expanded the principal part in the circle S illustrated in FIG.
(14) represents a side surface in the internal structure of the body portion (10). Similarly, (15) represents the bottom surface of the internal structure of the body portion (10). At this time, the side surface (14) is parallel to the paste discharging direction, and the bottom surface (15) is orthogonal to the paste discharging direction.

The inside of the body portion (10) is shown in FIG.
The seed taper T1, T2 is formed. The taper T1 is a portion where the side surface (14) and the bottom surface (15) intersect (a portion where two broken lines extending the side surface (14) and the bottom surface (15) in the figure intersect; hereinafter, referred to as an intersection portion (16)). It is an inclined surface provided in (referred to as). At this time, an angle formed by the taper T1 and the side surface (14) is an angle α, and an angle formed by the taper T1 and the bottom surface (15) is an angle β. The angle α and the angle β are respectively
It is set within the range of 90 ° <α <180 ° and 90 ° <β <180 °. The feature of the present application is that the taper T1
Is formed as an internal structure of the body portion (10).

In the present application, the viscosity of the paste (8) determined by the content of silver contained in the epoxy resin
The values of the angle α and the angle β are changed. The case where the angle α and the angle β are equal (135 °) is a commonly used case. However, in the present application, the angle α,
The angle β is not always the same angle.

The taper T2 is an inclined surface formed by the side surface of the nozzle portion (5) and the bottom surface (15) of the body portion (10). The presence of the taper T2 prevents the paste (8) filled in the body portion (10) from staying on the bottom surface (15) of the body portion (10) and promotes smooth discharge.

Next, the operation of a general dispensing method will be described. The air sent from the outside of one end of the hose (4) is sent toward the syringe (3). Air is injected into the syringe (3) and then applies pressure to the plunger (7). Pressurized plunger (7)
Pushes out the paste (8) filled in the syringe (3) toward the multipoint nozzle (2). The paste (8) is discharged from the tip through the inside of the multi-point nozzle (2) and the insides of the plurality of nozzle parts (5) (see FIG. 1).

Subsequently, the paste (8) is added to the syringe (3).
The operation of feeding the multi-point nozzle (2) at the tip will be described (see FIG. 4). FIG. 4 is a sectional view showing a method for feeding the paste (8) in the syringe (3) into the multipoint nozzle (2) attached to the tip of the syringe (3). The syringe (3) is a plastic syringe-shaped container (6) in which the paste (8) is already filled. The multi-point nozzle (2) of the present application is joined to the tip of the syringe (3), and then the upside down state is maintained. Then, air is sent into the syringe (3) from the other end of the syringe (3). The paste (8) gradually moves from the bottom to the top as shown by the arrow in FIG. 4, and eventually the paste (8) is evenly distributed inside the multipoint nozzle (2).
So that it spreads. A small amount of paste (8) is discharged from the nozzle portion (5) at the tip of the multi-point nozzle (2), which is the end point of the injection of the paste (8). This means that the paste (8) was completely filled in the multipoint nozzle (2).

After injecting the paste (8) into the multi-point nozzle (2), not a little air residue (11) as shown in FIG. 4 exists inside the body portion (10) in contact with the taper T1. The remaining air (11) at this time is
Since the taper T1 has an inclination, the prior art (see FIG.
Compared with the amount of the remaining air (107) of 0), it will be about several percent.

The air bleeding will be described (see FIG. 5). After injecting the paste (8) of FIG. 4, the upper and lower sides of the multipoint nozzle (2) are returned to their original positions (the nozzle portion (5) is on the lower side). Here, as in the prior art (FIG. 10), the air residue (11) may occur. Therefore, with the nozzle portion (5) facing downward, a small amount of air is sent from the hose (4), and the remaining air (1) is discharged from the nozzle portion (5).
The paste (12) containing air containing 1) is discharged. Thereby, the body portion (10) and the stem portion (1
The inside of 1) is filled with a paste (8) in which air is not mixed without any gap. In the present application, the taper T1
The amount of air remaining inside the body portion (10) due to the formation of
Since it is much smaller than 7), complete air bleeding can be easily realized in a short time.

Referring to FIG. FIG. 6 shows the second part of the present application.
3 is a cross-sectional view showing an embodiment of FIG. Figure 6 side view (14)
The feature is that the intersection portion (16) where the bottom surface (15) and the bottom surface (15) intersect has a curved portion K formed so as to form a smooth curve. When the radius of the curved portion K is r, the radius r is 0.5 mm
It is desirable that the range is <r <1.5 mm.

Next, a semiconductor device manufacturing method (mounting work) using the multipoint nozzle (2) of the present application will be described with reference to FIGS.

First step (FIG. 7); lead frame (1
9) is prepared.

FIG. 7 is a plan view showing the appearance of a lead frame (19) having an island (20) in the center. The island (20) is fixed to the lead frame (19) by the support lead (21). Multiple leads (2
2) is arranged so as to be separated from the island (20) and surround the periphery thereof.

Second step: The paste (8) is applied on the island (20) by a dispenser method.

FIG. 8 is a sectional view showing a state in which the paste (8) is applied by the dispenser (1). The dispenser (1) having the multi-point nozzle (2) with the air vent shown in FIG.
By sending it inside, a certain amount of paste is discharged from each of the plurality of nozzle portions (5) at the same time, and the paste (8) is applied to the surface of the island (20). At this time, by moving the dispenser (1) in the direction of the arrow, the paste (8) is applied in spots having a constant interval.

Third step (FIG. 9); semiconductor chip (17)
Mount.

FIG. 9 is a perspective view showing a state in which the semiconductor chip (17) is mounted on the island (20) whose surface is coated with the paste (8) in FIG. The semiconductor chip (17) is closely fixed from above the island (20), and the upper part of the semiconductor chip (17) is lightly pressed to die bond the semiconductor chip (17) and the island (20). Then, heat treatment is applied to paste (8).
Is cured to complete the die bond.

The mounting operation is completed through the above three steps. These mount operations are performed by the mounter (mounte
It is performed by a machine called r). Recent mounters are fully automated and their operations are all controlled by a computer.

As described above, according to the first and second embodiments and the manufacturing method of the present application, the shape inside the body portion (10) is
It becomes the taper T1 in FIG. 5 or the curved portion K in FIG. As a result, it becomes possible to easily perform air bleeding (FIG. 6), and the remaining air (11) in the body portion (10) can be completely discharged to the outside. Then, the paste (8) is filled inside the body portion (10) and the stem portion (11) of the multipoint nozzle (2) without any gap. The paste (8) pressed from the plunger (7) flows smoothly through the taper T2,
It can be discharged from the tip via the nozzle part (5).

[0033]

As described above, in the first embodiment of the present application, by forming the taper T1 in the body portion (10), the remaining air (11) can be kept to an extremely small amount. Subsequent air bleeding work is performed with the remaining air (1
Since the amount of 1) is small and the taper T1 is formed, the air residue (11) can be easily discharged to the outside. Also in the second embodiment of the present application, the same effect as described above can be obtained.

According to the first and second embodiments of the present application and the manufacturing methods thereof, the air residue (11) inside the body portion (10) is completely extinguished, so that the plunger (7) is removed. By applying pressure, it is possible to realize a manufacturing method in which a fixed amount of paste (8) is uniformly discharged. Therefore, it is possible to eliminate the concern about the characteristics of the semiconductor device due to the variation in the amount of the paste (8), and to realize stable operation characteristics of the semiconductor device.

[Brief description of drawings]

FIG. 1 is an overall sectional view showing an embodiment of the present application.

FIG. 2 is a sectional view and a plan view showing a first embodiment of the present application.

FIG. 3 is an enlarged sectional view of a main part of FIG.

FIG. 4 is a cross-sectional view showing a first embodiment of the present application.

FIG. 5 is a cross-sectional view showing a first embodiment of the present application.

FIG. 6 is a sectional view showing a second embodiment of the present application.

FIG. 7 is a plan view showing a first step of the manufacturing method of the present application.

FIG. 8 is a plan view showing a second step of the manufacturing method of the present application.

FIG. 9 is a perspective view illustrating a third step of the manufacturing method of the present application.

FIG. 10 is a sectional view showing a conventional multi-point nozzle.

Claims (5)

[Claims] 1. A syringe having a container portion filled with paste inside thereof, a multi-point nozzle attached to the tip of the syringe and having a space portion continuous with the container portion, and provided at the tip of the multi-point nozzle. A plurality of nozzle portions having a hollow portion continuous with the space portion of the multi-point nozzle to discharge the paste from the tip thereof, and the inner wall of the space portion of the multi-point nozzle is of the paste. A dispenser having a bottom surface orthogonal to the discharging direction and a side surface parallel to the discharging direction, wherein an intersecting portion of the bottom surface and the side surface has a tapered shape. 2. The dispenser according to claim 1, wherein a first angle formed by the side surface and the tapered tapered surface and a second angle formed by the bottom surface and the tapered tapered surface. In the dispenser, the first angle and the second angle are equal. 3. A multi-point nozzle having a container portion inside which a paste is filled, a multi-point nozzle attached to the tip of the syringe and having a space continuous with the container portion, and provided at the tip of the multi-point nozzle. A plurality of nozzle portions having a hollow portion continuous with the space portion of the multi-point nozzle to discharge the paste from the tip thereof, and the inner wall of the space portion of the multi-point nozzle is of the paste. A dispenser having a bottom surface orthogonal to the discharging direction and a side surface parallel to the discharging direction, and an intersection of the bottom surface and the side surface forming a gentle phase. 4. A step of preparing a first member having an adherend surface to which a paste is applied, and any one of claims 1 to 3 uses a dispenser equipped with a multi-point nozzle for discharging the paste. And a step of applying a paste filled in the dispenser to the adherend surface, and a step of adhering a second member on the paste, the method of manufacturing a semiconductor device. 5. The method of manufacturing a semiconductor device according to claim 4, wherein one of the first and second members is a lead frame and the other is a semiconductor chip. .