JP2003110235A - Connecting method of wiring board, electro-optic device and manufacturing method and apparatus thereof, and electronic equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a connecting method of a wiring board for connecting the terminal of the board at an accurate position, to provide an electro-optic device and a manufacturing method of the electro-optical device, and to provide electronic equipment. SOLUTION: First and second boards 10, 20 have wiring patterns 12, 22 having a plurality of terminals 14, 24, and marks 16, 18, 26, 28 are arranged so that a plurality of terminals 14 and 24 are overlapped one another. The marks 16, 18, 26, 28 of the first and second boards 10, 20 are recognized, the first and second boards 10, 20 are aligned at least in the extension direction of the plurality of overlapped terminals 14, 24. A terminal that is positioned at a center section 70 of the plurality of overlapped terminals 14, 24 of the first and second boards 10, 20 is recognized. The first and second boards 10, 20 are aligned in the alignment direction of the plurality of overlapped terminals 14, 24.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board connecting method, an electro-optical device, an electro-optical device manufacturing method and device, and an electronic apparatus.

[0002]

BACKGROUND OF THE INVENTION In the manufacture of electro-optical devices, substrates having wiring formed therein are electrically connected to each other. The electro-optical device includes a display device such as a liquid crystal device or an electroluminescence display device. In the connection of substrates, it is important to align both of them with high accuracy as the number of terminals of wiring and the narrow pitch progress in recent years.

Conventionally, the alignment of the substrate has been performed with reference to the alignment mark formed at the end portion in the arrangement direction of the plurality of terminals. Specifically, the alignment marks of both substrates are aligned so that they overlap, and it is presumed that the entire terminals are properly aligned by this, so that the two are connected.

However, in actuality, the alignment mark on the substrate may be misaligned due to dimensional changes due to moisture absorption of the substrate, undulation, etc., so that accurate alignment may not be possible in some cases. In particular, in the central portion of the plurality of terminals, it has not been confirmed whether or not the wirings actually overlap with each other, and the alignment accuracy may be poor.

The present invention is intended to solve the above-mentioned problems, and an object of the present invention is to provide a wiring board connecting method, an electro-optical device, and an electro-optical device, which are capable of connecting terminals of a board at precise positions. A manufacturing method, a manufacturing apparatus, and an electronic device are provided.

[0006]

(1) In a method of manufacturing a wiring board according to the present invention, (a) a plurality of first and second boards having a wiring pattern having a plurality of terminals and a mark are provided. Are arranged so that the terminals of the
Recognizing the marks on the first and second substrates, aligning the first and second substrates in at least the extension direction of the plurality of stacked terminals, and (c) the first and second substrates. The first and second substrates are aligned in the arrangement direction of the plurality of terminals by recognizing the terminal located in the central portion of the plurality of terminals stacked.

According to the present invention, the mark is recognized and aligned, and the terminal located in the central portion of the plurality of terminals overlapped on the first and second substrates is recognized and aligned. Therefore, even if the marks themselves are displaced due to dimensional changes due to undulations and moisture absorption of the first and second substrates,
Each substrate can be aligned in the correct position. In addition, since the terminals are aligned by the central portions of the stacked terminals, it is possible to evenly distribute the dimensional changes due to swell and moisture absorption to the left and right. Therefore, the range of positional displacement between terminals can be minimized.

(2) In this wiring board connection method,
In the step (c), the terminals located at the central portions of the first and second substrates may be aligned so that the centers in the width direction overlap.

This makes it possible to align the terminals of the first and second substrates more accurately.

(3) In this wiring board connection method,
In the step (c), the terminals located in the central part of the first substrate may be aligned so as not to protrude from the terminals located in the central part of the second substrate.

(4) In this wiring board connecting method,
In the step (c), the terminals located at the central portions of the first and second substrates may have different shapes from the left and right terminals.

According to this, the terminal located in the central portion can be easily recognized, so that the terminals can be easily aligned.

(5) In this wiring board connection method,
In the step (c), the terminals located at the central portions of the first and second substrates may be formed shorter than the left and right terminals.

(6) In this wiring board connection method,
In the step (c), the terminals located at the central portions of the first and second substrates may be formed thinner than the left and right terminals.

(7) In this wiring board connection method,
At least one of the first and second substrates is
It may be a flexible substrate.

According to this, the terminals of the first and second substrates can be accurately connected even when using a flexible substrate which is likely to change in dimension due to swelling, expansion or moisture absorption.

(8) In this wiring board connecting method,
The flexible substrate may be made of polyimide.

(9) In this wiring board connection method,
The first substrate is a flexible substrate, and the second substrate
The board may be a circuit board in which an electro-optic material is sealed.

(10) The electro-optical device according to the present invention is manufactured by the above method.

(11) An electronic apparatus according to the present invention has the above electro-optical device.

(12) An electro-optical device manufacturing apparatus according to the present invention includes a first support body for supporting a first substrate having a wiring pattern having a plurality of terminals and a mark, and a plurality of terminals. A second support body that supports a second substrate having a wiring pattern and a mark, a position of the mark of the first substrate, and a position of the mark of the second substrate with respect to one of the other. For one of the first camera, the terminal located at the center of the plurality of terminals of the first board, and the terminal located at the center of the plurality of terminals of the second board. A second camera for recognizing the other position, wherein the first and second supports have the first and second substrates superposed on each other based on the recognition result of the first camera. At least in the extending direction of the plurality of terminals, the first and Moving the relative position of the second substrate, on the basis of the recognition result of the second camera, the first
And the relative positions of the first and second substrates are moved in the arrangement direction of the plurality of terminals on which the first and second substrates are stacked.

According to the present invention, it is possible to recognize and align a mark, and to recognize and align a terminal located at a central portion of a plurality of terminals on which the first and second substrates are overlapped. Therefore, even if the marks themselves are displaced due to dimensional changes due to undulations and moisture absorption of the first and second substrates, the respective substrates can be aligned at accurate positions. In addition, since the terminals are aligned by the central portions of the stacked terminals, it is possible to evenly distribute the dimensional changes due to swell and moisture absorption to the left and right. Therefore, the range of positional displacement between terminals can be minimized.

[0023]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. However, the present invention is not limited to the following embodiments.

1 to 10B are views showing a method of connecting wiring boards according to the present embodiment. More specifically, it is a diagram showing a method of manufacturing an electro-optical device to which the method of connecting wiring boards according to the present embodiment is applied. Here, the electro-optical device is a device that controls light and includes both a self-luminous type and a non-self-luminous type. The electro-optical device is, for example, a liquid crystal device, a plasma display device, an electroluminescent display device, or the like, and includes an electro-optical material (liquid crystal, discharge gas, light emitting material, etc.). The wiring board connection method according to the present embodiment may be applied to the manufacture of electronic devices (memory devices and the like) other than the electro-optical device.

In this embodiment, the first and second substrates 1 are
0 and 20 are electrically connected. FIG. 1 is a diagram illustrating the first and second substrates 10 and 20.

The first substrate 10 has the first wiring pattern 1
Have two. The first wiring pattern 12 is the first substrate 1
0 is formed on one side or both sides. First wiring pattern 1
2 may be formed of a metal such as copper, nickel or gold. The first wiring pattern 12 includes a plurality of first terminals 14
Have. The first terminal 14 may be formed on the end portion of the first substrate 10. Specifically, the plurality of first terminals 14 may be arranged along any side of the first substrate 10. The first terminals 14 are often arranged in one direction. In the example shown in FIG. 1, the pitch of the terminals 14 at the central portion in the arrangement direction is smaller than the pitch of the terminals 14 at the end portions in the arrangement direction. The terminal 14 may be plated with a metal such as tin or gold, or a brazing material such as tin-lead solder or tin-silver solder.

The first substrate 10 has one or a plurality (two in FIG. 1) of marks 16 and 18. Mark 16, 1
Reference numeral 8 is an alignment mark for aligning the first and second substrates 10 and 20. Marks 16 and 18
May be formed on one surface of the first substrate 10,
It may be formed on both sides. By forming at least two marks 16 and 18 as shown in FIG. 1, the first substrate 10 can be aligned in the vertical, horizontal, and rotational directions. The marks 16, 18 may be patterns. In that case, the marks 16 and 18 are the wiring patterns 12.
May be Specifically, two terminals located at both ends of the plurality of terminals 14 may be marks.
Alternatively, as shown in FIG. 1, in addition to the wiring pattern 12, the marks 16 and 18 may be formed outside the region of the plurality of terminals 14 at the end of the first substrate 10. Mark 1
6, 18 may be patterned in a circular shape, for example. Alternatively, the marks 16, 18 may be holes or ink.

In the example shown in FIG. 1, the first substrate 10 is a flexible substrate. That is, the first substrate 10 is
It may be a flexible tape-shaped (film-shaped) substrate. Examples of the flexible substrate include a polyester substrate and a polyimide substrate. Also, the first
The substrate 10 is a COF (Chip On Film) substrate or TAB.
It may be referred to as a (Tape Automated Bonding) substrate. Alternatively, the first substrate 10 may be a rigid substrate.

The first substrate 10 has one or a plurality (see FIG. 1).
Then, a plurality of electronic components 40 to 48 are mounted. A circuit for driving, for example, an electro-optical device is formed by the electronic components 40 to 48. Electronic parts 40-48
Are electrically connected to the first wiring pattern 12. The electronic components 40 to 48 may be mounted on the surface on which the first wiring pattern 12 is formed, or may be mounted on the opposite surface. An underfill material (not shown) (for example, resin) may be provided between the electronic components 40 to 48 and the first substrate 10. When the first substrate 10 is a flexible substrate, the flexible substrate may undulate due to the curing shrinkage of the underfill material, and thus it is effective to apply the present invention.

The second substrate 20 has the second wiring pattern 2
2, a plurality of terminals 24, and marks 26 and 28. The width of the terminal 24 may be larger than the width of the terminal 14. As shown in FIG. 1, the marks 26 and 28 may be formed in a shape different from the marks 16 and 18 of the first substrate 10. For example, the marks 26 and 28 may have a shape (for example, a cross shape) in which a plurality of rectangles are combined. The shapes of the marks 26 and 28 are the marks 1 of the first substrate 10.
It may be larger than the shapes of 6 and 18.

The second wiring pattern 22 and the terminals 2
4, the contents of the first wiring pattern 12, the terminal 14 and the marks 16 and 18 described above can be applied to other forms of the marks 26 and 28.

The second substrate 20 may be a circuit substrate on which a desired circuit is formed. The second substrate 20 may be, for example, a display unit of an organic EL panel (see FIG. 2). A pixel portion (not shown) is formed on the second substrate 20, and a plurality of first electrodes 30 (for example, anodes) are formed in a region overlapping with the pixel portion. A second electrode 32 (for example, a cathode) is formed on the side facing the first electrode 30, and an organic layer 34 (including a light emitting material) is provided between the two. Second
The substrate 20 may be provided with a cover 36 (for example, a glass cover) made of an insulating material. The cover 36 may seal the second wiring pattern 22 and the pixel portion.

A current can be supplied from the wiring pattern 22 to the first and second electrodes 30 and 32, and electrons and holes can be recombined in the organic layer 34 to emit light. The light may be transmitted from the first electrode 30 side. In that case, it is preferable that the first electrode 30 is a transparent electrode (for example, an ITO (Indium Tin Oxide) electrode) and the second substrate 20 is a transparent substrate (for example, a glass substrate). Pixel display is multicolored,
It may be monochrome or white.

An electro-optical device is manufactured using the first and second substrates 10 and 20 described above. Specifically, as shown in FIGS. 2 to 9, the first substrate 10 is overlaid and aligned with the second substrate 20, and as shown in FIGS. 10A and 10B, a plurality of terminals are provided. 14 and 24 are fixed to each other with an adhesive 50.

FIG. 2 is a view showing a cross section in the extension direction of the terminals 14 and 24 of the first and second substrates 10 and 20 (direction extending from each wiring of the wiring pattern).

An adhesive 50 is provided on at least one of the first and second substrates 10 and 20. In the example shown in FIG. 2, the adhesive 50 is provided on the region of the second substrate 20 including the plurality of terminals 24. The adhesive 50 may be transparent or light transmissive. In this way, the adhesive 50 is used to form the plurality of terminals 2.
Even if it covers 4, the terminals 24 can be recognized from the adhesive 50 side. The adhesive 50 may be in the form of a film or a paste. Alternatively, the adhesive 5
0 may be provided after completion of alignment by marks and terminals described later.

As shown in FIG. 2, the first and second substrates 1
0, 20 to the plurality of terminals 14 of the first substrate 10 and the second
The plurality of terminals 24 of the substrate 20 are arranged so as to overlap each other. Specifically, the plurality of terminals 14 and 24 are arranged so that one mark (for example, the mark 16) on the first substrate 10 and one mark (for example, the mark 26) on the second substrate 20 are in the same visual field. Stack at a rough position. If the recognition means is a camera, for example, the first and second substrates 10 and 20 are so arranged that the marks 16 and 26 are within the imaging range of the camera 60.
To place.

Next, the marks 16 and 18 on the first substrate 10 are formed.
And the marks 26 and 28 on the second substrate 20 are recognized. This aligns the first and second substrates 10 and 20. Specifically, the marks are used to align the plurality of terminals 14 and 24 that are overlapped with each other in at least the extension direction (the vertical direction in FIGS. 3 and 4). For example, when aligning the centers of the marks at the time of alignment, the centers of the marks 16, 18, 26, and 28 are positioned on the same straight line (not shown) orthogonal to the extending direction of the terminals 14 and 24. Let Also, by recognizing the mark,
The first and second substrates 10 and 20 may be aligned in the arrangement direction (horizontal direction in FIGS. 3 and 4) of the plurality of stacked terminals 14 and 24, or the arrangement directions are not aligned. May be.

For example, as shown in FIG.
The first and second substrates 10 and 20 may be aligned such that the centers of 26 and the marks 18 and 28 overlap. In this way, the first and second substrates 10 and 20 can be aligned in the extension and arrangement direction of the plurality of terminals 14 and 24 within the range of accuracy of recognition of the marks.

Alternatively, as shown in FIG. 4, mark 1
When the centers of the marks 18 and 28 deviate greatly in the arrangement direction of the terminals 14 and 24 when the centers of 6 and 26 are overlapped, the first and second substrates 10 and 20 are combined into a plurality of stacked terminals. Align in the extension direction of 14, 24.
When the first substrate 10 is a flexible substrate, dimensional changes occur due to swelling or moisture absorption.
In many cases, 8 does not allow accurate alignment in the arrangement direction. In addition, as shown in FIG. 4, the first and second substrates 10 and 20 are aligned in the mark 1 in the arrangement direction.
It is also possible to perform alignment so that the offset distances of the centers of 6 and 26 and the offset distances of the centers of the marks 18 and 28 are substantially the same.

As shown in FIG. 2, the mark recognition means is
For example, it may be a camera. Specifically, the camera 60 images the marks 16 and 26, and the camera 62 (see FIG. 5) images the marks 18 and 28.

The cameras 60, 62 may be arranged outside the first and second substrates 10, 20. In that case, the cameras 60 and 62 may be arranged on the second substrate 20 side as shown in FIG. 2, or may be arranged on the first substrate 10 side. It is preferable that the substrate on the side where the cameras 60 and 62 are arranged is light transmissive. In that case, the camera 60,
It is preferable that the mark on the side where 62 is arranged also has a light transmitting property. In this way, the size of each mark to be recognized (for example, the marks 16 and 26) is not limited, and for example, the centers of the marks can be aligned. Alternatively, unlike the example shown in FIG. 2, the mark (for example, the mark 26) on the side where the cameras 60 and 62 are arranged may be smaller than the mark (for example, the mark 16) facing it. This makes it possible to recognize the protruding portion of the mark and align the first and second substrates 10 and 20.

Alternatively, the cameras 60, 62 may be arranged inside the first and second substrates 10, 20. In that case, if a prism is arranged between each mark (for example, the marks 16 and 26), one camera can simultaneously recognize two marks arranged in different directions (vertical direction in FIG. 2).

FIG. 5 is a view showing a cross section in the arrangement direction of the terminals 14 and 24 of the first and second substrates 10 and 20. Figure 5
As shown in, the first
And a plurality of terminals 1 on which the second substrates 10 and 20 are overlapped
The terminals 14 and 24 located in the central portion 70 of 4 and 24 are recognized. Specifically, the terminal 1 of the central portion 70 of the first substrate 10
4 and the terminal 24 of the central portion 70 of the second substrate 20 connected to the terminal 14 are recognized. In that case, the relative position with respect to the other terminal may be recognized within a range including the tip portion (or the cut portion) of one of the terminals. This way
Even if one terminal does not have a light-transmitting property, the other terminal can be recognized by the portion protruding from the one terminal. In addition, one terminal 14 and 24 may be recognized, or a plurality of terminals 14 and 24 may be recognized. The terminals 14 and 24 to be recognized preferably include the most central terminal.

As a result, the first and second substrates 10,
Align 20 further. Specifically, as shown in FIGS. 6 to 9, the first and second substrates 10 and 20 are aligned in the arrangement direction of the plurality of terminals 14 and 24 that are stacked. 6 to 9 are enlarged views of the terminals 14 and 24, except for the terminals.

The range of the central portion 70 of the plurality of stacked terminals 14 and 24 is, for example, the number n of a pair of terminals included in the central portion 70 and the total pair of terminals of the plurality of stacked terminals 14 and 24. In the number m, the range may have a relationship of n ≦ m / 5.

As shown in FIG. 6, the terminals 14 and 24 may be aligned so that the centers in the width direction overlap. In this way, the first and second substrates 10 and 20 can be aligned as accurately as possible. Further, since the contact area of each terminal 14, 24 can be maximized, the contact resistance of each terminal 14, 24 can be minimized.

Alternatively, as shown in FIG. 7, the terminals 14 of the first substrate 10 may be aligned so as not to protrude from the terminals 24 of the second substrate 20. That is, when the terminals 14 and 24 have different widths, the terminal having a small width (terminal 14 in FIG. 7) is prevented from protruding from the terminal having a large width (terminal 24 in FIG. 7). This makes it possible to maximize the contact area between the terminals 14 and 24 with a simple operation. Therefore, the contact resistance of each terminal 14, 24 can be minimized.

When aligning with marks,
If the arrangement directions of the terminals 14 and 24 are also aligned, the pair of terminals 14 and 24 to be electrically connected often partially overlap each other, as shown in FIGS. 6 and 7. Therefore, the overlapping terminals 14 and 24 are
Since it is sufficient to align in the arrangement direction, the central portion 7
Alignment by the 0 terminals 14 and 24 becomes easy.

As shown in FIG. 8, the recognized terminals 114 and 124 of the central portion 70 may have a different shape from the left and right terminals. Specifically, the central portion 70 of the first substrate 10
The recognized terminal 114 is formed in a shape different from that of the left and right terminals 14, and the recognized terminal 124 of the central portion 70 of the second substrate 20 is formed in a shape different from that of the left and right terminals 24. Good. Alternatively, the recognized terminals of the central portion 70 on either one of the substrates may have a shape different from that of the left and right terminals.

By doing so, the terminals 114 and 124 located in the central portion 70 can be easily recognized, so that the terminals can be easily aligned. Specifically, even if the pair of terminals 114 and 124 to be electrically connected do not overlap with each other, it is possible to surely align them with each other without making a mistake. That is, this is effective when the terminals 14 and 24 are not aligned in the arrangement direction in the alignment by the marks.

In the example shown in FIG. 8, the recognized terminals 114 and 124 of the central portion 70 are formed shorter than the left and right terminals 14 and 24. Specifically, the terminals 114 of the first substrate 10 are formed shorter than the left and right terminals 14, and the terminals 124 of the second substrate 20 are formed shorter than the left and right terminals 24. The terminals 114 and 124 may be shortened by etching or the like. Alternatively, conversely, the terminals 114, 12
4 may be formed longer than the left and right terminals 14 and 24.

In the example shown in FIG. 9, the recognized terminals 214 and 224 of the central portion 70 are formed thinner than the left and right terminals 14 and 24. Specifically, the terminals 214 of the first substrate 10 are formed thinner than the left and right terminals 14, and the terminals 224 of the second substrate 20 are formed thinner than the left and right terminals 24. The terminals 214 and 224 may be partially narrowed in the width direction. Specifically, the terminals 214 and 22
The notch 4 may be formed in the width direction. Alternatively, the terminals 214 and 224 may be entirely thin in the width direction. The terminals 214 and 224 may be thinned by etching or the like.

As shown in FIG. 5, the recognizing means of the terminals 14 and 24 located in the central portion 70 may be the same as the recognizing means of the mark, and may be, for example, a camera. For example, one of the cameras 64 that recognizes the marks 18 and 28 is moved in parallel, and the terminal 1 located at the central portion 70 is moved.
4, 24 may be recognized. The details described above can be applied to the details of the recognition by the camera.

The above-mentioned positioning process using the marks and terminals may be manually performed based on the recognition result of the camera or the like, or may be automatically controlled based on the recognition result. In any case, the relative positions of the first support (not shown) that supports the first substrate 10 and the second support (not shown) that supports the second substrate 20 are manipulated. Then, the first and second substrates 10 and 20 are aligned.

After the alignment of the first and second substrates 10 and 20 is completed, as shown in FIGS. 10A and 10B, the plurality of terminals 14 of the first substrate 10 and the second terminals 14 are formed. The plurality of terminals 24 of the substrate 20 are overlapped with the adhesive 50. The adhesive 50 has a first portion 52 and second portions 54 located on both sides of the first portion 52.
Then, the adhesive 50 is made to react in the first portion 52 so that at least curing is started. The first portion 52 may be one portion of the adhesive 50 as shown in FIG. 10 (A), or may be a plurality of portions. Energy may be applied to the first portion 52 of the adhesive 50 in a manner consistent with the curing mechanism of the adhesive 50 used.
Note that the terminals 14 of the first substrate 10 and the terminals 24 of the second substrate 20 may be electrically connected at the first portion 52 by the initiation of the curing reaction, or they may not be electrically connected. Good.

The adhesive 50 may be a thermosetting adhesive. In that case, the adhesive force may be expressed by applying heat energy to the adhesive 50. When the thermosetting adhesive is heated, its viscosity is lowered and melted, and when it is further heated, the curing reaction starts.

In the example shown in FIG. 10A, the adhesive 50
Is an anisotropic conductive material. The anisotropic conductive material is one in which conductive particles (not shown) are dispersed in a binder, and a dispersant may be added in some cases. The binder is often a thermosetting resin. The anisotropic conductive material is the first substrate 1
It is squeezed between the terminal 14 of 0 and the terminal 24 of the second substrate 20, and electrically conductive between them is achieved by the conductive particles. Alternatively, the adhesive 50 may be an insulating adhesive, in which case the terminals 14 of the first substrate 10 and the terminals 24 of the second substrate 20 are pressed together by the contracting force of the adhesive. Then, electrical conduction may be achieved between the two.

Here, the first portion 52 refers to a portion located at the central portion 72 of the plurality of stacked terminals 14 and 24. In addition, the central portion 7 of the plurality of terminals 14 and 24 that are overlapped
The range of 2 has a relationship of n ≦ m / 3, for example, in the number n of a pair of terminals included in the central portion 72 and the number m of a pair of all terminals of the plurality of stacked terminals 14 and 24. It may be a range. First of the adhesive 50
The width of the portion 52 may be about 1/3 of the total width of the first portion 52 and the second portion 54.

In the example shown in FIG. 10A, the first tool 80 presses the first portion 52 of the adhesive 50. The first tool 80 has a heater section. Since the first tool 80 is heated by the heater part, the first tool 8
The curing reaction of the adhesive 50 can be initiated in the first portion 52, which is pressurized at zero.

For example, the first tool 80 may be heated to about 200 ° C. and pressurized at a pressure of about 1 MPa for about 5 seconds. In that case, the first portion 52 of the adhesive 50 is heated to about 160 ° C. and the curing reaction rate is about 30%. It should be noted that the first portion 52 of the adhesive 50 is at least about 13
It is preferable to heat to 0 ° C. or higher.

The curing reaction rate of the first portion 52 may exceed 0%, and may be, for example, about 10 to 50%. The first portion 52 is preferably not over-cured so as not to interfere with the curing of the second portion 54 performed in a later step.
Further, the curing reaction rate of the first portion 52 is
Higher than, for example, about 20% or higher.

Thus, the first and second substrates 10, 20
Can be secured with the first portion 52 of the adhesive 50. Next, as shown in FIG. 10B, the adhesive 50 is cured at the first and second portions 52 and 54 to electrically connect the first and second substrates 10 and 20.

In the example shown in FIG. 10B, the second tool 82 is used to move the first and second parts 52, 52 of the adhesive 50.
Pressurize 54. The second tool 82 has a heater section. Since the second tool 82 is heated by the heater portion, the first and second portions 52 pressurized by the second tool 82,
At 54, the adhesive 50 can be cured.

For example, while the second tool 82 is heated to about 250 ° C., it may be pressurized at a pressure of about 3 MPa for about 20 seconds. In that case, the 1st and 2nd parts 52 and 54 of the adhesive agent 50 are heated to about 180 degreeC, and a hardening reaction is complete | finished.

According to the present invention, the curing reaction of the first portion 52 of the adhesive 50 is initiated to initiate the first and second substrates 1
Fix it so that 0 and 20 do not shift. Therefore, when electrically connecting the first and second substrates 10 and 20, it is possible to prevent the first and second substrates 10 and 20 from slipping and being displaced. Further, since the first portion 52 of the adhesive 50 is located at the central portion 72 in the arrangement direction of the plurality of terminals 14 and 24 that are overlapped, the first and second substrates 1
A dimensional change due to expansion of 0, 20 and the like can be evenly distributed to the left and right. Therefore, the range of positional deviation between the terminals 14 and 24 can be minimized.

In the present embodiment, one first substrate 10 is used.
Although an example of aligning and electrically connecting to one second substrate 20 has been shown, the present invention is not limited to this. For example, a plurality of first substrates 10 and one second substrate 20
May be aligned and electrically connected.

The electro-optical device manufacturing apparatus to which the present invention is applied includes a first support (not shown) that supports the first substrate 10 and a second support (that does not support the second substrate 20). (Not shown), marks 26, 2 for marks 16, 18
The first camera 60, 62 for recognizing the position of 8 and the second camera 64 for recognizing the terminal 14, 24 located in the central portion 70 of the plurality of terminals 14, 24 that are overlapped are included. As the first and second supports, those already known may be used. As the second camera 64, the first camera 6
Either one of 0 and 62 may be moved and used.

The first and second supports are the first camera 6
Based on the recognition results of 0 and 62, the plurality of terminals 1 that are overlapped
4, the first and second substrates 10 in the extending direction of 24,
Move 20 relative positions. And the first and second
Of the first support in the arrangement direction of the plurality of stacked terminals 14 and 24 based on the recognition result of the second camera 64.
And the relative positions of the second substrates 10 and 20 are moved.
Both the first and second supports may move, or one of them may move.

According to this electro-optical device manufacturing apparatus, the above-described manufacturing method and its effects can be achieved.

As an electronic apparatus having the electro-optical device according to the embodiment of the invention, FIG. 11 shows a notebook personal computer 200, and FIG. 12 shows a mobile phone 30.
0 is shown.

The present invention is not limited to the above-mentioned embodiment, but various modifications can be made. For example, the present invention includes configurations that are substantially the same as the configurations described in the embodiments (for example, configurations having the same function, method and result, or configurations having the same purpose and result). Further, the invention includes configurations in which non-essential parts of the configurations described in the embodiments are replaced. Further, the present invention includes a configuration having the same effects as the configurations described in the embodiments or a configuration capable of achieving the same object. Further, the invention includes configurations in which known techniques are added to the configurations described in the embodiments.

[Brief description of drawings]

FIG. 1 is a diagram showing a wiring board according to an embodiment of the present invention.

FIG. 2 is a diagram showing a method of connecting wiring boards according to an embodiment of the present invention.

FIG. 3 is a diagram showing a method of connecting wiring boards according to an embodiment of the present invention.

FIG. 4 is a diagram showing a method of connecting wiring boards according to an embodiment of the present invention.

FIG. 5 is a diagram showing a method of connecting wiring boards according to an embodiment of the present invention.

FIG. 6 is a diagram showing a method of connecting wiring boards according to an embodiment of the present invention.

FIG. 7 is a diagram showing a method of connecting wiring boards according to the embodiment of the present invention.

FIG. 8 is a diagram showing a method of connecting wiring boards according to the embodiment of the present invention.

FIG. 9 is a diagram showing a method of connecting wiring boards according to the embodiment of the present invention.

10 (A) and 10 (B) are diagrams showing a wiring board connecting method according to an embodiment of the present invention.

FIG. 11 is a diagram showing an electronic device according to an embodiment of the present invention.

FIG. 12 is a diagram showing an electronic device according to an embodiment of the present invention.

[Explanation of symbols]

10 First substrate 12 wiring patterns 14 terminals 16 mark 18 mark 20 Second substrate 22 wiring pattern 24 terminals 26 mark 28 mark 50 adhesive 52 First Part 54 Second Part 60 cameras 62 cameras 64 cameras 70 Central part 72 Central part 80 First Tool 82 Second Tool 114 terminals 124 terminals 214 terminals 224 terminal

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H05K 1/11 H05K 1/11 D 1/14 1/14 C F term (reference) 2H092 GA50 HA15 HA24 MA31 MA48 NA18 NA27 NA29 5E317 AA07 BB03 5E338 AA12 AA16 CC01 CD13 DD12 DD32 EE32 5E344 AA02 AA22 BB02 BB04 BB05 BB10 CC23 CD04 DD10 EE23 5G435 AA17 BB05 BB12 EE33 EE37 EE40 EE41 EE47 KK05 KK

Claims (12)

[Claims] 1. A first and a second substrate having a wiring pattern having a plurality of terminals and a mark are arranged so that the plurality of terminals overlap each other, and (b) the first and the second. Recognizing the mark on the second substrate, aligning the first and second substrates in at least the extension direction of the stacked terminals, and (c) stacking the first and second substrates. A method of connecting a wiring board, wherein a terminal located at a central portion of the plurality of terminals formed is recognized and the first and second boards are aligned in the arrangement direction of the plurality of terminals stacked. 2. The wiring board connecting method according to claim 1, wherein in the step (c), the terminals located at the central portions of the first and second boards are overlapped with each other in the center in the width direction. Wiring board connection method to align with. 3. The wiring board connecting method according to claim 1, wherein in the step (c), the terminal located at the central portion of the first substrate is located at the central portion of the second substrate. A wiring board connection method that aligns the terminals so that they do not protrude from the terminals. 4. The wiring board connecting method according to claim 1, wherein in the step (c), the terminals located at the central portions of the first and second boards are: A method of connecting a wiring board having a shape different from that of the left and right terminals. 5. The wiring board connecting method according to claim 4, wherein in the step (c), the terminals located in the central portions of the first and second boards are formed shorter than the left and right terminals. Wiring board connection method. 6. The method for connecting a wiring board according to claim 4, wherein in the step (c), the terminals located in the central portion of the first and second boards are left and right terminals. A method of connecting a wiring board formed to be thinner than the above. 7. The wiring board connecting method according to claim 1, wherein at least one of the first and second boards is:
A method of connecting a wiring board which is a flexible board. 8. The method of connecting a wiring board according to claim 7, wherein the flexible substrate is made of polyimide. 9. The wiring board connecting method according to claim 1, wherein the first substrate is a flexible substrate, and the second substrate is sealed with an electro-optical material. A method of manufacturing an electro-optical device which is a stopped circuit board. 10. An electro-optical device manufactured by the method according to claim 9. 11. An electronic apparatus including the electro-optical device according to claim 10. 12. A wiring pattern having a plurality of terminals,
A first support for supporting a first substrate having a mark; a wiring pattern having a plurality of terminals; and a second support for supporting a second substrate having a mark; A first camera that recognizes the position of the mark on the substrate of the second substrate, the mark of the second substrate on the other side, and a terminal located at the center of the plurality of terminals of the first substrate. A second terminal for recognizing a terminal located at a central portion of the plurality of terminals of the second substrate and a position of the other terminal with respect to the second terminal
The camera according to claim 1, wherein the first and second supports are based on a recognition result of the first camera in at least an extension direction of the plurality of terminals on which the first and second substrates are stacked. The relative positions of the first and second substrates are moved, and based on the recognition result of the second camera, in the arrangement direction of the plurality of terminals on which the first and second substrates are stacked, An electro-optical device manufacturing apparatus that moves relative positions of a first substrate and a second substrate.