JP2003092475A - Plastic laminated printed substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a plastic laminated printed substrate which is flexible and excellent in shape-followability, has a performance of suppressing high-frequency electromagnetic interference of a GHz band level and a flat surface, and is capable of satisfying demands such as low cost, miniaturization or multi- functionality. SOLUTION: Using a flexible base material 1 of a plastic sheet as a base substrate, conductive layers such as a signal or ground line S, passive constituents L, C and R, etc., active constituents such as an organic semiconductor transistor, and electromagnetic interference suppressor layers 2, 20 are formed by printing. In this case, a material is used as the layers 2, 20 in which soft magnetic metallic powder having flat particles are oriented and arranged, in such a way that the particles are separated each other in a polymer and each particle has an oxide layer and an organic material layer on its surface. A PCB resin is used as a surface protective insulator layer 21.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to various communication devices,
The present invention relates to a computer-related device, a printed wiring board used for an electronic device such as a sensor device,
In particular, the present invention relates to a plastic laminated printed circuit board having an electromagnetic interference suppressing function and having a flat surface.

[0002]

2. Description of the Related Art In recent years, with the explosive spread of electronic devices, the demand for low cost, small size, and multi-functionality, along with the flexibility, high conformability, and the function of preventing electromagnetic interference due to the increase in the frequency of printed circuit boards. It is also strongly desired in the field.

Conventionally, various means have been taken to meet the above demands, for example, Japanese Patent Laid-Open No. 4-93.
A flexible printed circuit board as shown in Japanese Patent No. 368 has been proposed. That is, as shown in FIG. 9, a circuit (signal line 302, signal line lands 303, 303a, power supply line 304) on the heat-resistant plastic film 301 is formed.
Etc.), an undercoat layer 308, an electromagnetic wave shield layer 309, and an overcoat layer 310 are sequentially formed, and a circuit ground pattern 305 and an electromagnetic wave shield layer 309 are provided in the undercoat layer 308.
There has been proposed a flexible printed circuit board with an electromagnetic interference suppressing function, which is connected through the same and has the same potential.

However, in the above conventional example, since the main circuit is formed of copper foil by means of plating, vapor deposition, sputtering, etc., the film formation process itself must be a batch process, and the film formation is Since complicated photolithography processing (selective masking, selective etching, etc.) is required later, it is very difficult to simplify the process, that is, to reduce the cost.

Further, the electromagnetic wave shield layer covers the entire surface excluding the electrode pad area and the functional element (IC or passive element) mounting area using a conductive paste or a metal film, and then a thick interlayer insulating layer is formed. Although it is provided with an electromagnetic interference suppressing function by penetrating and connecting to the ground pattern of the lowermost layer so as to have the same potential, the electromagnetic wave shielding layer material described above has a capability of suppressing electromagnetic interference at the GHz level. The point was extremely insufficient.

Further, in the above-mentioned conventional structure, although the substrate itself is made of a flexible material, the conductor wiring layer constituting the circuit is made of a hard metal foil, and the electromagnetic wave shield layer also has characteristics. In the case of importance, since it is still necessary to use a hard metal film, etc., it was not always satisfactory from the viewpoint of flexibility with respect to bending stress in the thickness direction, and at the same time consideration was given to flexibility with respect to lateral tensile stress. However, there is an inconvenience that the conductor wiring layer and the electromagnetic wave shield layer are broken or cracked.

Furthermore, inconvenient problems in connection through a thick interlayer insulating layer, such as completeness of filling a deep vertical hole with a conductive material and reliability of connection when bending stress is applied, etc. When the interlayer insulating layer is locally thinned in order to avoid the above, there is a disadvantage that the flatness of the surface of the completed substrate is impaired. Further, in the direction of thinning the interlayer insulating layer as a whole, it becomes extremely difficult to form a multi-layered structure, and it has been impossible to obtain a wiring board having high functionality.

[0008]

SUMMARY OF THE INVENTION Therefore, the present invention overcomes various problems of the above-mentioned conventional techniques,
To provide a plastic laminated printed circuit board that is low-priced, compact, and capable of meeting multi-functionality requirements, and that is flexible, highly conformable, and has an electromagnetic wave interference prevention function that accompanies higher frequencies of several hundred MHz to GHz. Is.

Further, the further problem to be solved by the present invention is expected to be significantly cheaper in the field of electronic equipment in the near future, and can be sufficiently applied to the organic semiconductor process which has been attracting attention today. The purpose of the present invention is to provide a flexible plastic laminated printed circuit board having a suitable flatness on the surface.

[0010]

According to the present invention, a flexible plastic substrate is used as a base substrate, and a laminated conductive circuit pattern, passive and active functional elements, and an electromagnetic interference suppression layer are printed on an organic material. Is to be formed by.

That is, the present invention is a plastic laminated printed circuit board characterized in that a plurality of conductive layers and insulating layers are alternately formed by printing on a flexible plastic substrate.

Further, according to the present invention, in the above plastic laminated printed circuit board, a through hole is provided at a predetermined position of the insulator layer to electrically connect the conductor layers. is there.

The present invention is a plastic laminated printed circuit board characterized by comprising an integrated circuit formed by forming a conductor wiring pattern and at the same time forming a passive component in the above plastic laminated printed board.

Further, according to the present invention, in the above-mentioned plastic laminated printed circuit board, a plastic is characterized by comprising an integrated circuit formed by forming an active wiring component and a passive wiring component at the same time. It is a laminated printed circuit board.

Further, the present invention is the above plastic laminated printed board, wherein at least one electromagnetic interference suppressing layer is formed.

Furthermore, the present invention provides the above plastic laminated printed circuit board, wherein the electromagnetic interference suppressing body layer has a shape corresponding to the conductor wiring pattern and is provided at at least one position in a plane direction parallel to the base material. Alternatively, a plastic laminated printed circuit board is formed at a position sandwiching the conductor wiring pattern in an in-plane direction in which the pattern exists.

Further, the present invention is the plastic laminated printed circuit board as described above, wherein the electromagnetic interference suppressor layer is a continuous film or a discontinuous film separated by fine slits.

Also, in the present invention, in the above plastic laminated printed circuit board, the shape of a cross section of the conductor layer other than the passive component and the active component or the electromagnetic interference suppressor layer parallel to the base material is a mesh. It is a plastic laminated printed circuit board having a striped or striped shape.

In the above plastic laminated printed circuit board according to the present invention, the electromagnetic interference suppressor layer is oriented and arranged in such a manner that flat soft magnetic metal powders are separated from each other in a polymer. And a plastic laminated printed circuit board made of a material having an oxide layer and an organic layer provided on the surface of the powder.

Further, the present invention is the above-mentioned plastic laminated printed circuit board, wherein a benzocyclobutene resin layer is formed on at least the outermost layer on the main surface side.

[0021]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a sectional view for explaining the basic manufacturing process of the flexible plastic laminated printed circuit board of the present invention. FIG. 1 (a) shows a flexible plastic sheet substrate 1 (hereinafter abbreviated as substrate), for example, polyethylene terephthalate (PET), polyvinyl chloride (PVC), polyurethane (PU), polyimide (P).
It is in the form of a roll or original sheet made of I) or the like.

FIG. 1B shows a state in which the lower electromagnetic interference suppressor layer 2 is applied and formed on the entire surface of the base material 1 to a thickness of 5 to 10 μm. Here, as a forming means, application by a doctor blade method, which is a kind of printing method, and solidification by drying with warm air in an inert gas atmosphere of 200 ° C. or less, the electromagnetic interference suppressing material has a flat shape. The Fe-Si-Al alloy powder was kneaded with a predetermined polymer and an organic solvent to be used in a paste form. The process may be carried out by direct printing means such as letterpress or intaglio or ink jet means or the like after adjusting the viscosity of the electromagnetic interference suppressor material with an organic solvent as appropriate.

FIG. 1 (c) shows a state in which an insulating layer 3 is entirely coated and formed on the lower electromagnetic interference suppressor layer 2 formed in FIG. 1 (b). Here, the forming means uses any of the same general printing methods as described above, and the material of the insulator layer 3 is generally PI, polyvinylphenol (PVP), benzocyclobutene (BCB) or the like having excellent flatness. Solder resists can be used.

FIG. 1D shows a lower electrode 4 of a C (capacitance) element, an R (resistance) element 5, an L (inductance) element 6 as a conductor layer on the insulator layer 3 of FIG. 1C. Signal or ground line wiring 7, power supply line wiring 8, and further metal-
1 shows a state in which a source electrode 9 and a drain electrode 10 of a transistor element having an insulator-semiconductor (MIS) structure are formed in a predetermined shape.

Here, as a means for forming each conductor layer,
Any of the same general printing methods as described above can be used, and as the material of the conductor layer, a metal paste containing silver or copper as a main component, or a conductive polymer material such as polyaniline (PA) can be used.

In addition, regarding the C element, the lower electrode is formed so as to obtain the required capacitance value in consideration of the relative permittivity and the thickness of the insulator layer (dielectric layer) formed in the following process. 4 is determined, the shape (width, length) of the R element 5 is determined so that a desired resistance value can be obtained in consideration of the specific resistance and thickness of the conductor layer. As for the above, it is a matter of course that the shape such as the spiral condition of the coil is determined so as to obtain the desired inductance value in consideration of the specific resistance and the cross-sectional area of the conductor layer.

In FIG. 1E, the interlayer insulating layer 11 is formed on each conductor layer of FIG. 1D except for a portion where an opening is required for forming a structure of each element or wiring. The state in which the is formed is shown. Means and materials are the same as those of the insulator layer 3 shown in FIG.

FIG. 1F shows a state in which the semiconductor layer 12 and the gate insulating film layer 13 of the MIS transistor are formed by a printing method. As a material of the semiconductor layer 12, Cu phthalocyanine (CuPC) or the like which is an organic semiconductor material can be used, and for the gate insulating film layer 13, PI, BCB or the like can be used.

In FIG. 1G, using the same means and materials as those shown in FIG. 1D, the upper electrode 14 of each conductor layer, that is, the C element, the lead wiring 15 of the R element 5, and the L element 6 are used. Lead-out wiring 16, lead-out wiring 17 for signal or ground line wiring 7, and further gate electrode 18 for MIS transistor
The figure shows a state in which the layers are simultaneously formed.

FIG. 1H shows a state in which the insulator layer 19 is formed after the process of FIG. 1G is completed by using the same means and materials as shown in FIG. 1C.

In FIG. 1 (i), further on the insulator layer 19,
A state in which the upper electromagnetic interference suppressor layer 20 is formed by using the same means and materials as shown in FIG. 1B is shown.

In FIG. 1 (j), after finishing the process of FIG. 1 (i), the surface protective insulating layer 21 is formed on the uppermost layer by the same printing method as described above, and the flexible plastic laminated print of the present invention is formed. The state which completed the board | substrate is shown. Here, the use of BCB resin for the surface protection insulator layer 21 is a very important point. The reason is that when a BCB monomer derivative resin is applied to the uneven surface and dried to form a BCB resin film, it has an advantage of exhibiting excellent flatness. For example, when BCB is applied to a groove having a depth of 10 μm, the uneven step can be suppressed to 1 μm or less.

As described above, the flexible plastic laminated printed circuit board of the present invention shown in FIG. 1 (j) has an electromagnetic wave from above and below in the laminated wiring circuit area having a high function level including passive and active components. The electromagnetic interference suppressing function is maintained by being sandwiched between the interference suppressing layers, and at the same time, the main surface having excellent flatness is provided.

Next, another embodiment will be described with reference to FIG. FIG. 2A shows that the electromagnetic interference suppressing function is maintained by vertically sandwiching the laminated wiring circuit region formed only of the conductor wiring layer 22 without including the passive and active components, from above and below. at the same time,
Since it has a main surface having excellent flatness and has a low function level as a printed circuit board, it has a merit of low cost because passive and active components are not incorporated.

The manufacturing process of the flexible plastic laminated printed circuit board of the form shown in FIG. 2 (a) is the same as the basic manufacturing process of FIG. 1, but the process of forming passive and active components, that is, FIG. 1 (e), FIG. 1 (f) and FIG. 1 (g) are omitted.

FIG. 2B shows a form in which the functional level is higher than that of FIG. 2A, and the conductor layer (signal and ground line S, power supply line P) and the passive component (R, The laminated wiring circuit region composed of C and L) is sandwiched between the electromagnetic interference suppressing body layers from above and below to maintain the electromagnetic interference suppressing function, and at the same time, the main surface having excellent flatness is provided.

The manufacturing process of the flexible plastic laminated printed circuit board of the form shown in FIG. 2 (b) is the same as the basic manufacturing process of FIG. 1, but the process of forming active components, that is, FIG. 1 (e), FIG. f), M in FIG. 1 (g)
Take a form that does not incorporate the IS transistor element part.

Next, still another embodiment of the present invention will be described with reference to FIG. FIG. 3 (a) is the same as FIG.
In the flexible plastic laminated printed circuit board of the present invention including the laminated wiring circuit including even the passive components shown in (b), the electromagnetic interference suppressor layer is used as the conductor wiring pattern, that is, the signal and ground line wiring 7. This is an example of a form sandwiched from above and below in a shape corresponding to the power supply line wiring 8.

This manufacturing process is the same as the manufacturing process shown in FIG. 1 (b) and FIG.
When forming the electromagnetic interference suppressor layers 2 and 20 of (i),
The signal and ground line wiring 7 and the power supply line wiring 8 have a shape corresponding to the planar shape, and the electromagnetic interference suppressing layers 2a and 20a are arranged only in the upper and lower regions thereof. Can be implemented very easily in.

FIG. 3 (b) is the same as FIG. 3 (a).
By sandwiching the conductor wiring pattern from the horizontal direction with the electromagnetic interference suppressor, it is intended to three-dimensionally perform electromagnetic shielding including the upper and lower sides, and the signal line or ground line wiring 7 and the power supply line wiring 8 are electromagnetic interference suppressor. The layer 23 is sandwiched from the side.

By adopting such a configuration of FIG. 3B, not only electromagnetic interference from the outside with respect to the printed circuit board and electromagnetic interference emitted from the printed circuit board to the outside, but also between adjacent lines and elements in the printed circuit board. Electromagnetic interference can be reduced, and malfunctions of the electronic circuit due to these can be almost completely prevented.

Next, still another embodiment of the present invention will be described with reference to FIGS. FIG. 4 is an application example of the present invention relating to the film form of the electromagnetic interference suppressor layer, in which the electromagnetic interference suppressor layer is subdivided by fine slits. FIG. 4A is an example in which it is subdivided into squares, and FIG. 4B is an example in which it is subdivided into strips. Here, the width of the slit and the sizes of the subdivided electromagnetic interference suppressor layers 101 and 101a can be arbitrarily selected, but the smaller the width of the slit is, the more preferable.

The subdivision of the electromagnetic interference suppressor layer shown in FIG. 4 can be an effective measure from the viewpoint of flexibility with respect to the tensile stress in the lateral direction of the printed circuit board. The above-mentioned flat Fe-Si-Al
This is particularly effective when a material in which a base alloy powder is kneaded with a predetermined polymer and an organic solvent to form a paste is used.

That is, in the present material which is excellent in the electromagnetic interference suppressing property in the GHz band, the electromagnetic interference suppressing effect is hardly lowered and the conventional technique is mainly adopted when the distance from the countermeasure line is up to about 100 μm. However, since it is not necessary to maintain the same potential as the ground line, subdivision is possible.

FIG. 5 shows a measure for making the conductor wiring layer as well as the electromagnetic interference suppressor layer flexible to the same tensile stress in the lateral direction. FIG. 5B is an example of a striped form. In both cases, the tensile stress resistance is much larger than that of the conventional flat plate shape, and it is particularly effective as a countermeasure against cracks and breaks in the conductor wiring due to bending and pulling during actual use. Mesh-shaped conductor wiring layer and electromagnetic interference suppressor layer 102 and stripe-shaped conductor wiring layer and electromagnetic interference suppressor layer 102
The size of a can be designed arbitrarily.

FIG. 6 is a characteristic example of the electromagnetic interference suppressor made of the flat Fe-Si-Al system described in the above-mentioned embodiment of the present invention, and shows the electromagnetic characteristics in the frequency range of 1 GHz to 4 GHz. This is the noise level attenuation effect, as shown in FIG.
Is data in the horizontal direction, and FIG. 6B is data in the vertical direction. In each case, a reduction of 10 to 15 dB was observed near 2 GHz, which is a value that is difficult to achieve with other materials.

Next, the basic usage of the above-mentioned flexible plastic laminated printed circuit board of the present invention will be described with reference to FIG.

FIG. 7A shows one form of the flexible plastic laminated printed circuit board according to the present invention shown in FIG. 2A, that is, a form in which only the conductor wiring pattern is arranged in the printed circuit board. Is an example in which an IC or LSI 103 is mounted at a predetermined position on a flat main surface to form an electronic circuit structure suitable for actual use.
The electrode lead-out lines 104 and 104a of No. 03 are conductor wiring layers 22a and 2a which become the predetermined electrode pads on the printed circuit board side.
It is connected to 2b and used as an electronic circuit structure.

FIG. 7 (b) shows another form of the flexible plastic laminated printed circuit board according to the present invention shown in FIG. 2 (b), that is, the conductor wiring pattern and the passive components R, L, C. In a form in which an element group is arranged in this printed circuit board to enhance functionality, a TFT (thin film transistor) or the like is mounted as an active element 105 at a predetermined position on a flat main surface, so that it has a shape suitable for actual use. This is an example of configuring an electronic circuit structure, in which the electrodes of the active element 105 are exposed to the electrode pads 106 and 106a which are exposed from the conductor wiring layers 22 and 22a which are the predetermined electrode pads on the printed circuit board side to the main surface. It is used as an electronic circuit structure by being connected by any means such as a face-down method.

FIG. 7 (c) shows another form of the flexible plastic laminated printed circuit board according to the present invention shown in FIG. 1 (j), that is, a conductor wiring pattern and R, L which are passive components. In a form in which the C element group and the MIS transistor which is an active component are arranged in this printed board to further enhance the functionality, the functional element 107 such as an organic light emitting element is provided at a predetermined position on the flat main surface.
Is an example in which an electronic circuit structure with a functional element having a shape suitable for actual use is configured by mounting the.

Here, the electrode 108 of the functional element 107 is
The electrode pads 109, 109a exposed from the electrodes 9, 10 on the printed circuit board side to the main surface are exposed and connected by an arbitrary means such as a face-down method.

As a more specific application possibility using the flexible plastic laminated printed circuit board according to the present invention, an electro-optical conversion device (E
In addition to L), for example, electronic paper to which a black-and-white reversal function by applying a high-frequency weak electric field or current is applied, or an organic semiconductor static induction transistor (SIT) that causes a current to flow in the vertical direction and an organic light emitter are not connected in series. , A liquid crystal display that does not require a backlight and consumes less power, in which each light emitting unit is controlled by analogic to obtain excellent image quality. It can be one of the factors that will make a dramatic progress due to its good area and shape conformity.

FIG. 8 shows an example of application to a flexible IC tag which is a sheet or label information recording medium as still another embodiment of the present invention.

FIG. 8A is a plan view of a flexible IC tag in which a signal transmitting / receiving antenna coil 203, a signal processing function unit 201, and a circuit wiring unit 202 including a passive element are formed in a flexible substrate. It is a basic configuration.

FIG. 8 (b) is a sectional view taken along the line AA of FIG. 8 (a), and the manufacturing process is based on the printing and laminating method of the organic material, and the flexible method of the present invention shown in FIG. Using the basic manufacturing process of the plastic laminated printed circuit board, specifically, the lower electromagnetic interference suppressor layer 2a, the insulating layer 2a, and the insulating layer on the surface of the base material 1 which is a base made of a flexible insulating material such as PU resin or PI resin. The body layer 3, the conductor pattern of the antenna coil 203, the signal processing function unit 201, and the circuit wiring unit 202 is formed on the body layer 3 as a conductor layer, and the printed layer stack of the insulator, the conductor, and the semiconductor is repeated to structure the function unit. After completing the above, the insulator layer 19, the upper electromagnetic interference suppressor layer 20a,
The basic structure of the IC tag can be completed by forming the surface protection insulator layer 21 that also serves as passivation.

Here, the electromagnetic interference suppressor layers 2a and 20 are used.
As the material of a, Tokin Co., Ltd. trade name "Bustaleide" was used.

The present invention is not limited to the example of the above IC tag,
For example, the present invention can be applied to any information recording medium such as an IC card, light, magnetism, a dielectric, and a composite type of these, such as a card, a sheet, and a label.

As described above, by applying the flexible plastic laminated printed circuit board of the present invention, it is possible to make the display screen of a personal computer, a mobile phone, a wristwatch or the like a curved surface, which has heretofore been a common sense, in a fixed direction. It is also possible to simultaneously visually recognize image information that was only visible from all directions. For example, one traffic light
It is also possible to cover with individual displays.

Further, not only the simple bendability but also the simultaneous bendability and pullability such as sticking to a spherical surface are improved, and it is movable in the field of medical electronic circuit equipment such as living body attachment. Since it is possible to deal with curved surfaces, it is possible to greatly expect the application developability of the present invention.

In the above-mentioned embodiment, only the consistent printing process using an organic material is described. However, the present invention is not limited to this, and even if the process is partially replaced with an inorganic process, the base material is flexible. It is possible to apply the contents of the present invention even to a hard material such as glass epoxy or bakelite, which is much improved as compared with the conventional one. . In particular,
The magnetic metal and ceramic may be sputtered, and a plastic sheet provided with an electromagnetic interference suppressing function may be printed or laminated as a base material. In this method, the electromagnetic interference suppressing body can be made thinner and has good flexibility. Become.

[0062]

As described above, according to the present invention,
It is flexible and conformable, can be applied to complex spaces, has electromagnetic wave suppression capability, does not cause malfunction or electromagnetic interference with other equipment, and has good surface flatness, so It is possible to fuse with functional elements, and therefore it can be applied to all kinds of electronic devices, and further, it is possible to provide a flexible plastic laminated printed circuit board which has a simple manufacturing process, can easily process a large area, and is extremely inexpensive. You can

The upper limit of the process temperature is at most 200.
Approximately 250 ° C, compared with the conventional so-called inorganic process using single crystal silicon or amorphous material,
The merit is immeasurable because it is extremely low and it is possible to control the characteristics after completion.

[Brief description of drawings]

FIG. 1 is a sectional view for explaining a basic manufacturing process of a plastic laminated printed circuit board of the present invention.

FIG. 2 is a sectional view of a plastic laminated printed circuit board according to another embodiment of the present invention.

FIG. 3 is a cross-sectional view for explaining a form of formation of an electromagnetic interference suppressor layer of a plastic laminated printed board according to still another embodiment of the present invention.

FIG. 4 is a plan view for explaining a plane shape of an electromagnetic interference suppressor layer formed on a plastic laminated printed board according to still another embodiment of the present invention.

FIG. 5 is a plan view for explaining planar shapes of a conductor wiring layer and an electromagnetic interference suppressing body layer formed on a plastic laminated printed board according to still another embodiment of the present invention.

FIG. 6 is a characteristic diagram of an electromagnetic interference suppressor material in the plastic laminated printed circuit board of the present invention.

FIG. 7 is a cross-sectional view for explaining a usage pattern of the plastic laminated printed circuit board of the present invention.

8A and 8B are a plan view and a cross-sectional view for explaining an embodiment in which the present invention is applied to a non-contact IC tag.

FIG. 9 is a cross-sectional view of a conventional flexible printed circuit board.

[Explanation of symbols]

1 (Plastic sheet) Substrate 2, 2a (Lower layer) Electromagnetic interference suppressor layer 3 Insulator layer 4 Lower electrode 5 R element 6 L element 7 Signal or ground line wiring 8 Power line wiring 9 (Source) electrode 10 (Drain) Electrode 11 Interlayer insulator layer (dielectric layer) 12 Semiconductor layer 13 Gate insulating film layer 14 Upper electrode of C element 15 Lead wiring of R element 16 Lead wiring of L element 17 Lead wiring of signal or ground line wiring 18 Gate electrode 19 Insulator layers 20, 20a (upper layer) Electromagnetic interference suppressor layer 21 Surface protection insulator layers 22, 22a, 22b Conductor wiring layers 23, 23a Electromagnetic interference suppressor layer 101, 101a Electromagnetic interference suppressor layer 102, 102a Conductor Wiring layer and electromagnetic interference suppressor layer 103 IC or LSI 104, 104a Electrode lead wire 105 Active element 106, 106a Electrode pad 107 Functional element 108 Electrodes 109 and 109a Electrode pad 201 Signal processing function section 202 Circuit wiring section 203 Antenna coil 301 Heat resistant plastic film 302 Signal lines 303 and 303a Signal line land 304 Power supply line 305 Ground pattern 306 Insulator layer 307 Jumper circuit 308 Undercoat layer 309 Electromagnetic wave shield layer 310 Overcoat layer B Through hole part

Claims (10)

[Claims] 1. A plastic-laminated printed circuit board comprising a flexible plastic base material and a plurality of conductive layers and insulating layers which are alternately printed on a flexible plastic base material. 2. The plastic laminated printed circuit board according to claim 1, wherein through holes are provided at predetermined positions in the insulator layer to electrically connect the conductor layers. 3. The plastic laminated printed board according to claim 1 or 2, further comprising an integrated circuit formed by forming a conductor wiring pattern and at the same time forming a passive component. 4. The plastic laminated printed circuit board according to claim 1, further comprising an integrated circuit formed by forming an active wiring component and a passive wiring component at the same time. Characteristic plastic laminated printed circuit board. 5. The plastic laminated printed circuit board according to any one of claims 1 to 4, wherein at least one electromagnetic interference suppressor layer is formed. 6. The plastic laminated printed circuit board according to claim 5, wherein the electromagnetic interference suppressor layer has a shape corresponding to the conductor wiring pattern and is provided at least at one position in a plane direction parallel to the base material. Alternatively, a plastic laminated printed circuit board is formed at a position sandwiching the conductor wiring pattern in an in-plane direction in which the pattern exists. 7. The plastic laminated printed circuit board according to claim 5 or 6, wherein the electromagnetic interference suppressor layer is a continuous film or a discontinuous film separated by fine slits. 8. The plastic laminated printed circuit board according to claim 1, wherein a cross section of the conductor layer other than the passive component and the active component or the electromagnetic interference suppressor layer parallel to the base material. A plastic laminated printed circuit board having a mesh shape or a stripe shape. 9. The plastic laminated printed circuit board according to claim 5, wherein the electromagnetic interference suppressor layer has a form in which flat soft magnetic metal powders are isolated from each other in a polymer. 2. A plastic laminated printed circuit board, characterized in that it is oriented and arranged, and is made of a material in which an oxide layer and an organic layer are provided on the surface of the powder. 10. The plastic laminated printed board according to claim 1, wherein a benzocyclobutene resin layer is formed on at least the outermost layer on the main surface side.