JP2003090933A - Electrooptic backplane board and information processor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a backplane board which can not only perform relative positioning of an optical data bus to a light emitting and receiving apparatus but also easily connect a circuit board for carrying out optical communications with individual elements, receive and output signals and supply power to the circuit board. SOLUTION: An optical data bus 30 is inserted and fixed in the recessed part 14 of an optical data bus fixation substrate 10, and an optical connector 50 holding a light emitting and receiving element is positioned on the fixing substrate 10 through a through hole H bored in the fixing substrate 10 to easily fix the relative position of a signal light incidence/emission part 32 to the light emitting and receiving element. The fixing substrate 10 is disposed on a printed circuit board 40 provided with an electric connector 42 to easily connect a circuit board PK mounted on the optical connector 50 to the printed circuit board 40 by using the electric connector 42.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a signal light input / output unit by forming one side of a long, plate-shaped light transmissive material in a staircase shape and inclining its end face to approximately 45 degrees with respect to the plate surface. The present invention relates to an opto-electrical backplane board having an optical data bus formed by the above, and an information processing device using the opto-electrical backplane board.

[0002]

2. Description of the Related Art Conventionally, a signal processing device employing a parallel architecture, which includes a backplane board (motherboard) and a plurality of nodes (daughter boards), has a high bus speed and a large number of buses in order to improve its processing capability. Bandwidth is being improved by making bits. Signal processing devices that employ such parallel architecture are required to achieve even higher speeds, but in order to achieve higher speeds with conventional electrical wiring, noise and delay must be taken into consideration for the motherboard and daughter board. The design of the printed circuit board is required. Further, although the wiring becomes complicated, an optical fiber connection has been introduced for speeding up.

As described above, conventionally, while the speed of the signal processing device by the electric wiring has been increased, the speed of the signal processing device by the in-system optical connection technique called optical interconnection has been studied. For an overview of this optical interconnection technology, see The Institute of Electronics, Information and Communication Engineers, Vol.
79 (No.9), pp.907-909, September 1996, "Optical interconnection technology and its application" (Osamu Wada), Journal of Japan Institute of Electronics Packaging, Vol.1, No.3 (1998), 176 Pages-179
As described in "The World of Computers that Change with Optical Interconnection" (Masatoshi Ishikawa), various forms have been proposed depending on the system configuration.

However, when introducing an optical interconnection using an optical fiber as a signal transmission medium into a device widely used not only for industrial use but also in offices and homes,
There are problems that high-precision positioning of the optical coupling unit is required and the mounting cost is high, and that it is difficult to realize interconnection of multiple nodes with a simple configuration.

On the other hand, as a technique for solving such a problem, in 2000, the 25th optical symposium, lecture number 8, "Study of backplane optical system and application to optical data bus" (Junji Okada et al.) An optical data bus 80 such as that shown in FIG. This optical data bus 80 is
It is made of a long, plate-shaped light-transmitting material (for example, a light-transmitting resin made of acryl having a refractive index of 1.49, an olefin polymer having a refractive index of 1.525, etc.), and the signal light is lengthened by repeating internal reflection. It is a translucent transmission medium that transmits in the direction.

That is, this optical data bus 80 is shown in FIG.
As shown in (a) and (b), one side along the longitudinal direction of a rectangular resin substrate made of a light transmissive resin is a light emitting element (for example, a laser diode LD) from one end side to the other end in the longitudinal direction. Alternatively, the light-receiving elements (photodiodes PD) are formed in a stepped shape at intervals that can be arranged, and each end surface on the one end side in the longitudinal direction formed in the stepped shape is inclined 45 degrees with respect to the plate surface. Thus, the signal light input / output unit 82
Is formed. 8A is a plan view of the optical data bus 80, and FIG. 8B is a side view thereof.

When optical transmission is performed using the optical data bus 80, as shown in FIG. 8C, the optical data bus 80 is provided on the end face opposite to the signal light input / output unit 82. ,
For example, the diffusion angle in the thickness direction of the optical data bus 80 is 0.2.
And a reflection diffusion portion (for example, a light diffusion film) 84 having a diffusion angle of 40 degrees in the width direction is provided, and the optical axis is orthogonal to the plate surface of the optical data bus above each signal light input / output portion 82. The laser diode LD or the photodiode PD is arranged so as to do so.

Then, in this state, when the laser diode LD disposed in the arbitrary signal light input / output section 82 is driven and laser light is made incident from above the optical data bus 80, the incident light is converted into the optical data bus. It is totally reflected by the end surface inclined by 45 degrees with respect to the plate surface of 80, transmitted to the reflection diffusion section 84, and then reflected and diffused by the reflection diffusion section 84. Then, the reflected light is totally reflected by the end face of each signal light entrance / exit portion 82 and is emitted from the upper surface of the optical data bus 80.
Therefore, the signal light emitted from the laser diode LD is transmitted to the photodiode PD arranged above the signal light incident / emission unit 82, and the laser diode LD and the optical data bus 80 are connected from the current flowing through the photodiode PD. It is possible to obtain the signal transmitted via the.

Therefore, if a backplane board using the above optical data bus as a signal transmission medium is put into practical use,
An electronic circuit for generating an electric signal and a light emitting means including a light emitting element for converting the electric signal into a signal light, a light receiving element for converting the signal light into an electric signal, and an electronic circuit for processing the converted electric signal The interconnection of the plurality of circuit boards including at least one of the light receiving means can be realized with a simple configuration.

[0010]

In order to use the above optical data bus as a signal transmission medium, how to fix the optical data bus is a problem. That is, the optical data bus is a translucent transmission medium and transmits the signal light by repeating internal reflection, so that the optical data bus and the light emitting element and the light receiving element are arranged so that the light is totally reflected at the signal light input / output section. Relative positioning is required. Further, in the optical transmission in the optical data bus, since air having a refractive index of 1 is used as the cladding layer, it is desirable not to use an adhesive when fixing the optical data bus. However, FIG.
Since a fixing means suitable for using the staircase-shaped optical data bus as shown in Fig. 4 has not been established yet, it has been conventionally possible to efficiently transmit the signal light using such an optical data bus. A fixed device for the optical data bus to be obtained was desired.

Therefore, as a method of fixing such an optical data bus, the inventors of the present invention form an optical data bus insertion concave portion that is opened corresponding to the plate surface shape of the optical data bus on the plate surface of the flat plate, and further, It was considered to use a fixed substrate having a positioning portion for positioning and fixing the light emitting element and the light receiving element above each signal light input / output portion of the optical data bus inserted in the optical data bus insertion recess.

That is, the optical data bus is inserted into the optical data bus insertion concave portion formed on the fixed substrate and fixed by using a predetermined holding member, and further, the positioning portion formed on the fixed substrate is used. Thus, the light emitting element and the light receiving element can be positioned and fixed above the respective signal light input / output sections of the optical data bus inserted in the optical data bus insertion recess.

If such a fixed substrate is used,
The relative positions of the signal light input / output unit of the optical data bus and the light emitting element and the light receiving element can be extremely easily positioned,
Moreover, since the optical data bus can be fixed without using an adhesive, the above-mentioned requirements can be sufficiently satisfied.

However, in order to actually perform optical communication using the optical data bus fixed to the fixed substrate, the light emitting element and the light receiving element positioned relative to the optical data bus are arranged on a plurality of circuit boards (described above). It is necessary to connect to the daughter board) and perform the light emitting element drive processing and the light receiving signal processing for each circuit board.

For this reason, this time, when the relative positions of the optical data bus and the light emitting element and the light receiving element are positioned by using the above-mentioned fixed substrate, the light emitting element and the light receiving element which are positioned and the actual position thereof are actually used. In addition, new problems have arisen such as how to connect to each circuit board that performs optical communication and how to control the signal processing executed by each circuit board.

That is, in order to perform optical communication between a plurality of circuit boards by using the light emitting element and the light receiving element whose relative positions to the optical data bus are positioned via the above-mentioned fixed board, it is executed in each circuit board. It is necessary to adjust the drive processing of the light emitting element and the light receiving signal processing such as synchronization between the circuit boards. For that purpose, various control signals such as a synchronization signal need to be distributed to each circuit board. In order to easily supply signals to the circuit board, new problems arise such as how to connect the light emitting element and the light receiving element positioned and fixed to the fixed board to each circuit board. Has come.

Further, it is necessary to supply power to each circuit board. When a dedicated power supply line is used for this power supply, the wiring work is troublesome, so when the fixed board is provided with a power feeding function to each circuit board, and each circuit board is mounted on the fixed board. In addition, it may be possible to supply power from the fixed board to each circuit board, but the problem of how to connect the fixed board to each circuit board arises even when such power supply is performed. ing.

The present invention has been made in view of these problems. In addition to the above-described positioning of the relative positions of the stepwise optical data bus and the light emitting element and the light receiving device, a circuit board for performing optical communication, a light emitting element, and An object is to provide an opto-electrical backplane board that can easily perform connection with a light-receiving element and signal input / output to / from a circuit board and power supply, and an information processing device using the opto-electrical backplane board. To do.

[0019]

The opto-electrical backplane board according to claim 1, which has been made to achieve the above object, has a plurality of optical data formed on a fixed optical data bus fixed substrate. The optical data bus is positioned and fixed on the printed wiring board by inserting and fixing the optical data bus into the bus insertion recesses and mounting the optical data bus on the printed wiring board, respectively. The printed wiring board and the multiplex type optical data bus fixing board are used to position and fix a plurality of optical connectors that hold a plurality of light emitting elements and light receiving elements that input and output optical signals to the light input and output sections of the optical data bus. Through holes are formed.

The multiple optical data bus fixed board is
When the optical data buses are inserted into the respective optical data bus insertion recesses, a plurality of optical data bus insertion recesses are formed so that the corresponding signal light input / output sections of the respective optical data buses are arranged substantially linearly. They are formed at substantially equal intervals. This is to enable the light emitting element and the light receiving element to be arranged in a substantially straight line along the plate surface of the circuit board when the circuit board for optical communication is attached to the optical connector.

In other words, if the signal light input / output sections corresponding to each other in each optical data bus are arranged on a substantially straight line,
On the optical connector side, it becomes possible to arrange light emitting elements and light receiving elements that input and output signal light to and from the signal light input / output section of each of these optical data buses in a line, and to arrange the circuit board along the arrangement direction. is there.

Further, in the opto-electrical backplane board according to claim 1, one or a plurality of groups of optical input / output units of each optical data bus arranged in a substantially straight line on the printed wiring board are set as a group. One optical connector (in other words, a circuit board) is assigned to the emitting part, and each optical connector and the circuit board mounted on each optical connector straddle each optical data bus on the printed wiring board (in other words, If it crosses, it is arranged.

When the optical data bus insertion recess is formed as described above, the optical connector and the circuit board are provided in one of the signal light input / output sections arranged in the longitudinal direction of the optical data bus or in a predetermined adjacent section. Since the optical connectors are arranged in one piece, it is possible to make a plurality of optical connectors holding the light emitting element and the light receiving element all common. Further, in particular, as described in the examples described later, if the optical data bus insertion recess is formed so that each of the signal light input / output sections of all the optical data buses is arranged on the orthogonal lattice, the optical connector and It becomes possible to arrange the circuit boards mounted thereon along the outer shape of the multiple optical data bus fixed board.

On the printed wiring board, a plurality of electrical connectors for supplying power or inputting / outputting signals to / from each of the circuit boards arranged in this way are fixed.
The printed wiring board performs power supply or signal input / output to / from each circuit board via the electrical connector.

As described above, according to the optoelectronic backplane board of the first aspect, by using the through hole formed in the printed wiring board or the printed wiring board and the multiplex type optical data bus fixed board, Not only can the relative positions of the light emitting element and the light receiving element held by the optical data bus and the optical connector be easily positioned, but also the circuit board mounted on the optical connector can be fed from the printed wiring board via the electrical connector or Signal input / output can be performed.

Therefore, according to the optoelectronic backplane board of the first aspect, there is provided an information processing apparatus capable of performing high-speed data communication between a plurality of circuit boards (the above-mentioned daughter boards) by utilizing the optical data bus. It is possible to construct very easily. Further, in the opto-electric backplane board according to claim 1, since the multiplex type optical data bus fixed board is detachably attached to the printed wiring board as a base, replacement of the optical data bus, etc. This multiple optical data bus fixed board unit can be performed without touching the optical data bus. For this reason, it is possible to prevent the optical data bus from being soiled or damaged when the optical data bus is replaced, and it is possible to improve workability during maintenance.

Further, since the printed wiring board and the multiplex type optical data bus fixed board are constructed as separate bodies, by appropriately selecting the material of the multiplex type optical data bus fixed board,
The coefficient of thermal expansion of the multiple optical data bus fixed substrate and the coefficient of thermal expansion of the optical data bus can be easily matched (or substantially matched). Then, when the coefficient of thermal expansion of the multiplex type optical data bus fixed board and the coefficient of thermal expansion of the optical data bus are matched (or substantially matched) in this way, the optical connector is connected to the multiplex type optical databus fixed board. It is desirable to be configured so as to be fixed to the through hole formed in the.

That is, in the optoelectronic backplane board according to the first aspect, as described in the second aspect, the through holes are formed at the time of stacking the printed wiring board and the multiple optical data bus fixing board. Formed to penetrate, and
The multiple optical data bus fixed board is made of a material having the same or substantially the same coefficient of thermal expansion as the optical data bus, and the optical connector is fixed to the through hole formed in the multiple optical data bus fixed board. By doing so, it is possible to displace the optical connector following this thermal expansion by making the degree of expansion and contraction of the multiple optical data bus fixed substrate and the optical data bus at the time of thermal change the same. At the same time, it is possible to prevent the relative performance of the light emitting element and the light receiving element in the optical connector from deviating from the signal light input / output section of the optical data bus, which may deteriorate the communication performance.

Next, in the optoelectronic backplane board according to claim 3, an optical databus guide is used instead of the multiplex type optical databus fixed board used in the optoelectronic backplane board according to claim 1. Boards are used. This optical data bus guide plate is made of a plate material having substantially the same plate thickness as the optical data bus, and a plurality of guide holes penetrating in correspondence with the plate surface shape of the optical data bus are formed in the plate surface. When a plurality of optical data buses are respectively arranged, the corresponding signal light input / output sections of the respective optical data buses are arranged at substantially equal intervals so as to be arranged on substantially straight lines.

The optical data bus guide plate is mounted on the printed wiring board, and the optical data bus is mounted on the printed wiring board by mounting the optical data bus guide board on the guide hole and the board surface of the printed wiring board. It is inserted and fixed in a concave portion for inserting an optical data bus formed by.

Further, the printed wiring board or the printed wiring board and the optical data bus guide plate are provided with a plurality of light emitting elements and light receiving elements for inputting / outputting an optical signal to / from the light input / output section of the optical data bus. A through hole is formed for positioning and fixing the connector. The optical connector, like the optical connector according to the first aspect, can be equipped with a circuit board for optical communication.

The printed wiring board according to claim 1
Similar to the printed wiring board described in, a plurality of electric connectors for feeding or inputting / outputting signals to / from the circuit board mounted on the optical connector positioned on the printed wiring board through the through hole are provided. It is fixed, and the printed wiring board performs power supply or signal input / output to / from each circuit board through the electrical connector.

Therefore, also in the optoelectronic backplane board according to claim 3, the relative positions of the optical data bus and the light emitting element and the light receiving element held by the optical connector are set in the same manner as in the first and second aspects. Not only can positioning be performed easily, but power supply or signal input / output can be performed from the printed wiring board to the circuit board mounted on the optical connector via the electric connector.

Therefore, even if the opto-electric backplane board according to claim 3 is used, it is possible to perform high-speed data communication between a plurality of circuit boards (the above-mentioned daughter boards) using the optical data bus. Can be constructed extremely easily. Also, in the opto-electric backplane board according to claim 3, since the printed wiring board and the optical data bus guide plate are formed separately, the optical data bus guide plate is appropriately selected, and thus the optical The coefficient of thermal expansion of the data bus guide plate and the coefficient of thermal expansion of the optical data bus can be easily matched (or substantially matched). Then, in this way, the coefficient of thermal expansion of the optical data bus guide plate and the coefficient of thermal expansion of the optical data bus match (or substantially match).
In this case, it is desirable that the optical connector is fixed to the through hole formed in the optical data bus guide plate, as in the second aspect.

That is, in the opto-electrical backplane board according to the third aspect, as described in the fourth aspect, the through holes may be penetrated when the printed wiring board and the optical data bus guide board are laminated. And the optical data bus guide plate is made of a material having the same or substantially the same coefficient of thermal expansion as the optical data bus, and the optical connector is fixed to the through hole formed in the optical data bus guide plate. By doing so, the optical data bus guide plate and the optical data bus can have the same degree of expansion and contraction during thermal change, and the optical connector can be displaced following this thermal expansion. It is possible to prevent the relative performance of the light emitting element and the light receiving element in the connector from deviating from the relative position of the signal light input / output section of the optical data bus, which may reduce the communication performance.

In the opto-electrical backplane board according to the third aspect, the optical data bus is inserted into the guide hole formed in the optical data bus guide plate. It will be done by the data bus alone. Next, in the optoelectronic backplane board according to claim 5, an optical databus insertion recess is provided in place of the multiplex type optical databus fixed board used in the optoelectronic backplane board according to claim 1. A plurality of single-piece optical data bus fixed boards formed by one is used.

In the plurality of single-piece type optical data bus fixed substrates, the signal light input / output sections corresponding to each other of the optical data buses inserted and fixed in the respective optical data bus insertion recesses are arranged substantially linearly. Thus, it is detachably mounted on the printed wiring board. Further, the printed wiring board has through holes for positioning and fixing a plurality of optical connectors as in the case of the first to fourth embodiments, and moreover, in the printed wiring board, a single piece type optical data is provided. On the board surface on which the bus fixing boards are laminated, a plurality of electric connectors for supplying power or inputting / outputting signals to / from the circuit board mounted on the optical connector positioned through the through hole are fixed. There is. Then, the printed wiring board performs power supply or signal input / output to / from each circuit board via the electrical connector.

Therefore, also in the optoelectronic backplane board according to the fifth aspect, the relative positions of the optical data bus and the light emitting element and the light receiving element held by the optical connector are the same as those of the first to fourth aspects. Not only can positioning be performed easily, but power supply or signal input / output can be performed from the printed wiring board to the circuit board mounted on the optical connector via the electric connector.

Therefore, even if the opto-electric backplane board according to claim 5 is used, it is possible to perform high-speed data communication between a plurality of circuit boards (daughter boards described above) using the optical data bus. Can be constructed extremely easily. Further, in the opto-electric backplane board according to claim 5, since the optical data bus is inserted and fixed in the single-piece optical data bus fixed board, the replacement of the optical data bus is performed in the single-piece optical data bus fixed board unit. Can be done at.

Therefore, according to the optoelectronic backplane board of claim 5, the optical data bus is dirty or damaged when the optical data bus is exchanged, as in the case of claims 1 and 2. Can be prevented, which in turn can improve workability during maintenance. Next, in the optoelectronic backplane board according to claim 6, as in the optoelectronic backplane board according to claims 1 to 5, a multiplex type or a single type optical data bus fixed substrate or optical data bus fixed board is provided. A plurality of optical data bus insertion recesses are formed directly on the board surface so that the plurality of optical data buses can be directly fixed to the printed wiring board without using a member for fixing the optical data bus such as a bus guide plate. A printed wiring board is used.

Then, in this printed wiring board,
The plurality of optical data bus insertion recesses are arranged such that the signal light input / output units corresponding to each other of the optical data buses are arranged substantially linearly when the optical data buses are inserted into the respective optical data bus insertion recesses. , Are formed at substantially equal intervals.

In addition, the printed wiring board according to any one of claims 1 to
5, through holes are formed for positioning and fixing a plurality of optical connectors. Moreover, in the printed wiring board, the through holes are formed on the plate surface on which the optical data bus insertion concave portion is formed. A plurality of electric connectors for supplying power or inputting / outputting signals are fixed to the circuit board mounted on the optical connector positioned via the.
Then, the printed wiring board performs power supply or signal input / output to / from each circuit board via the electrical connector.

Therefore, in the optoelectronic backplane board according to the sixth aspect as well, the relative positions of the optical data bus and the light emitting element and the light receiving element held by the optical connector are the same as those of the first to fifth aspects. In addition to the simple positioning, it is possible to perform power supply or signal input / output from the printed wiring board to the circuit board mounted on the optical connector via the electric connector.

Therefore, even if the opto-electrical backplane board according to claim 6 is used, information processing can be performed at high speed between a plurality of circuit boards (the daughter boards described above) using the optical data bus. The device can be constructed extremely easily. In the opto-electrical backplane board according to claim 6, the optical data bus is inserted into the optical data bus insertion recess formed in the printed wiring board. It will be done by itself.

On the other hand, the invention described in claim 7 is the same as claim 1.
The present invention relates to an information processing device configured using the optical data bus fixed substrate according to any one of claims 6 to 6. And
This information processing apparatus is connected to at least one of the above-mentioned opto-electrical backplane board of the present invention (claims 1 to 6), a plurality of information devices including a computer, and a signal line via a signal line. At the same time, it is electrically connected to the printed wiring board through the electrical connector fixed to the printed wiring board of the opto-electric backplane board, and is input / output from the information equipment and the printed wiring board through the signal line and the electrical connector. According to the signal, a plurality of circuit boards that perform optical communication via the optical data bus fixed on the printed wiring board and the optical data buses arranged in a substantially straight line on the printed wiring board of the optoelectronic backplane board. A plurality of light emitting elements and light receiving elements for individually inputting / outputting an optical signal to / from one or a plurality of groups of the light incident / emitting portions, with the signal light incident / emitting portions as a group. Holding, and each of the above circuit board,
It is composed of a plurality of optical connectors that support electric signals to and from the light emitting element and the light receiving element.

According to the information processing apparatus having the above-mentioned structure, the signal light can be efficiently transmitted to the backplane board for transmitting and receiving the signal between the plurality of information devices including the computer. By using the opto-electrical backplane board of the present invention, an electric signal input / output to / from each information device is once converted into a signal light on a circuit board and the signal is transmitted. Since there is no crosstalk that occurs in electric wiring like an information processing device that transmits a signal by, and because it is optical transmission, there is no disturbance in the signal waveform due to electromagnetic radiation noise from the outside,
It enables stable signal transmission. Further, by increasing the speed of the light emitting element and the light receiving element, it becomes possible to perform high-speed data transmission at a level that is difficult to achieve by electrical transmission.

In addition, the opto-electric backplane board has
An optical connector and a circuit board can be mounted through a through hole formed in a printed wiring board that constitutes this, and the power supply to the circuit board or the signal input / output of various control signals is performed by an electrical connector fixed to the printed wiring board. Since it can be directly performed from the printed wiring board via the connector, workability in assembling the information processing apparatus of the present invention can be improved.

[0048]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. In the following description, FIG. 1 shows the overall configuration of an optoelectronic backplane board 2 of an embodiment to which the present invention is applied, (a) is a perspective view of the optoelectronic backplane board, and (b) is optoelectronic. It is an end view showing a state when the backplane board is cut along the line AA shown in (a). Further, FIG. 2 is a plan view of the optoelectronic backplane board 2 as seen from above.

As shown in FIGS. 1 and 2, the opto-electrical backplane board 2 of this embodiment has a multi-connection type optical data bus fixing substrate 10 made of a synthetic resin flat plate and a multi-direction type optical data bus fixing. A plurality of (four in this embodiment) optical data bus insertion recesses 14 formed on the surface of the board 10, and a plurality of optical data buses 30 fixed respectively in the recesses 14, and a printed wiring board 40.
It consists of and.

The multiple optical data bus fixed substrate 10
Are detachably mounted on the printed wiring board 40 using screws or the like, and a plurality (four in this embodiment) are mounted on the mounting surface of the multiple optical data bus fixed board 10 in the printed wiring board 40. The electrical connector 42 of is attached.

The multiple optical data bus fixed board 10 and the printed wiring board 40 are used for positioning and fixing a plurality of optical connectors 50 (see FIG. 3 described later) on the multiple optical data bus fixed board 10. Through holes H are formed. Further, the electrical connector 42 has a plurality of optical connectors 5 positioned and fixed on the printed wiring board through the through holes H.
The power supply and the signal input / output are performed with respect to a circuit board PK (see FIG. 4), which will be described later, mounted on No. 0.

The printed wiring board 40 has a wiring pattern for supplying power to the circuit board PK via the electric connector 42 and a wiring for inputting and outputting various control signals such as synchronization signals to the circuit board PK. A pattern is formed, and electronic parts for generating a power supply voltage and various control signals supplied through each of the wiring patterns are mounted.

Here, first, the optical data bus 30 is, basically, similar to the optical data bus 80 shown in FIG. 8, a step along one side along the longitudinal direction of a rectangular resin substrate made of a light transmissive resin. A plurality of (in this embodiment, eight) signal light input / output units 32 are formed in a stepped shape, and the end faces on the one end side in the longitudinal direction, which are formed in a stepwise manner, are inclined by 45 degrees with respect to the plate surface. The projections 30a for positioning the optical data bus 30 in the optical data bus insertion recess 14 are provided on the side wall along the longitudinal direction thereof (see FIG. 2).

On the other hand, the concave portion 1 for inserting the optical data bus
Reference numeral 4 is substantially the same shape as the plate surface of the optical data bus 30. The outer shape of the optical data bus 30 makes it easy to insert the optical data bus 30 and interferes with the optical data bus 30 even if the optical data bus 30 thermally expands. It is larger than the outer shape of the optical data bus 30 so as not to exist. Also, the concave portion 1 for inserting the optical data bus
The length in the longitudinal direction of 4 is longer than that of the optical data bus 30 so that the first holding member 22 can be arranged on the rear end side when the optical data bus 30 is inserted.

As shown by the dotted line in FIG. 2, each of the recesses 14 for inserting the optical data bus has a recess of each of the optical data buses 30 when the optical data bus 30 is inserted into each of the recesses 14 for inserting the optical data bus. The corresponding signal light input / output units 32 are arranged on a substantially straight line, and the arrangement direction of the signal light input / output units 32 in each optical data bus 30 is substantially orthogonal to the straight line (in other words, all The signal light input / output sections 32 are formed so as to be arranged on an orthogonal lattice along the outer shape of the multiplex type optical data bus fixed substrate 10). That is, the central axes of the optical data bus insertion recesses 14 in the longitudinal direction are parallel to each other, and the central axes are inclined at a predetermined angle with respect to the side edge of the multiplex optical data bus fixed substrate 10. As described above, the multiple optical data bus fixed substrate 10 is formed.

Further, the optical data bus 30 is provided with optical data on the side wall along the longitudinal direction of the optical data bus insertion recess 14 (in this embodiment, the side wall of the optical data bus 30 which is formed stepwise). When inserted into the bus insertion recess 14,
A locking portion 14a for positioning the optical data bus 30 and a second holding member fixing for fixing the second holding member 18 by inserting the positioning protrusion 30a protruding from the side wall of the optical data bus 30. Portion 14b and optical data bus 3
At 0, there is formed a warp correction member fixing portion 14c for fixing the warp correction member 20 which presses and biases the side wall of the tip portion on the side where the signal light incident / emission portion 32 is formed.

The second holding member 18 is used for the optical data bus 3
By pressing and urging the side wall along the longitudinal direction of 0 with a leaf spring, the optical data bus 30 is sandwiched between the opposing inner walls of the optical data bus insertion recess 14 and the optical data bus insertion recess 14 is formed. It is for holding the optical data bus 30 therein.

The warp correction member 20 is for preventing the warp of the tip portion of the optical data bus 30 by pressing and urging the side wall of the tip portion of the optical data bus 30, and in the present embodiment. , Coil springs are used. That is, the optical data bus 30 includes a plurality of signal light input / output units 32.
Since one side of the resin substrate is formed in a step-like shape in order to form, the width becomes narrower toward the front end side of the stepped portion in which the respective signal light entrance / exit portions 32 are formed. For this reason,
In the optical data bus 30, the tip end portion formed in a step shape is easily warped toward the side where the signal light input / output unit 32 is formed due to the influence of heat or the like. If the tip portion is warped, it becomes impossible to satisfactorily enter / emit light to / from the signal light incident / emission section 32 located at the tip. Therefore, in this embodiment, the warp correction member 20 formed of a coil spring prevents the warp of the tip portion of the optical data bus 30 by pressing and urging the side wall of the tip portion of the optical data bus 30. -ing

On the other hand, the first holding member 22 arranged on the rear end side of the optical data bus 30 has the recess 14 for inserting the optical data bus.
By being inserted and fixed in the rear end portion, the end surface (rear end surface) of the optical data bus 30 on the side opposite to the signal light input / output section 32 is pressed and biased toward the front end where the signal light input / output section 32 is formed. , For holding the optical data bus 30 in the optical data bus insertion recess 14.

That is, as is apparent from FIG. 2, the first holding member 22 is made of a synthetic resin main body fixed to the rear end portion of the optical data bus insertion recess 14 with a screw and a light diffusion film (for example, a light diffusion film). , Physical Optics Corporation reflective diffusing sheet, model number "LORS 0.2 x 40PCB-MB") is attached with the light reflecting surface facing outside, and between the body and the reflective diffusing plate. And a reflection type diffusing plate (specifically, a reflecting surface of a light diffusing film) is brought into contact with the rear end surface of the optical data bus 30, and at the same time, the optical data bus 30 is pressed and urged from the rear end side to the front end side. The optical data bus 30 is composed of a coil spring and the biasing force of the coil spring.
Is held in the optical data bus insertion recess 14.

Next, the multiple optical data bus fixed substrate 1
The through-holes H for positioning and fixing the optical connector 50 on the optical disk 0 are sandwiched by the four optical data buses 30 which are arranged in parallel with each other by being inserted into the respective optical data bus insertion concave portions 14. The optical connectors 50, which are formed on both sides thereof, are fixed to the multiple optical data bus fixing board 10 so as to straddle the four optical data buses 30 by being positioned in the through holes H.

That is, the optical connector 50 is fixed to the multiplex type optical data bus fixing substrate 10 to group the four signal light input / output units 32 arranged in a straight line in each optical data bus 30. In order to input / output the signal light by using the two groups of signal light input / output units 32 adjacent to each other in the longitudinal direction of the optical data bus 30, two data buses 30 are provided in the longitudinal direction of each data bus 30. 8 elements in total are held in the juxtaposed direction.

In this embodiment, this optical connector 5
0 is fixed to the multiplex type optical data bus fixing substrate 10 so as to straddle the four optical data buses 30 by using the through holes H, so that the eight elements held in the optical connector 50 are The four optical data buses 30 can be simultaneously positioned above two continuous signal light input / output sections 32.

In the optical data bus 30 of this embodiment, eight signal light input / output sections 32 are formed at substantially equal intervals along the longitudinal direction of the optical data bus 30, so that the through holes H are arranged side by side. Four optical data buses 30 are formed on each side of the four optical data buses 30, and the four optical data buses 30 are formed above each optical data bus 30.
The four optical connectors 50 are arranged by utilizing the individual through holes H.

Each of these through holes H is formed at the same position on the multiplex type optical data bus fixed board 10 and the printed wiring board 40 so that the rod 56 of the optical connector 50 described later can be inserted therein. The diameter of the through hole H on the printed wiring board 40 side is slightly larger than the diameter of the through hole H on the multiplex optical data bus fixed board 10 side. This is because the thermal expansion coefficient of the multiple optical data bus fixing substrate 10 and the printed wiring board 40 are different, and when the rod 56 is inserted and fixed in the through hole H on the multiple optical data bus fixing substrate 10 side, the heat This is to prevent the position of the through hole H on the printed wiring board 40 side from deviating at the time of change and hindering the displacement of the rod 56.

Next, the structure of the optical connector 50 will be described with reference to FIG. In FIG. 3, (a) is a plan view of the optical connector 50 seen from above, and (b) is an optical connector 5
0 is a side view when viewed from the side, (c) is a bottom view when the optical connector 50 is viewed from below, and (d) is a state in which the optical connector 50 is cut along the line D-D shown in FIG. FIG.

As shown in FIG. 3, the optical connector 50 includes the above eight elements, specifically four light emitting elements (in this embodiment, the laser diode L housed in the CAN package).
D) and four light receiving elements (photodiode PD accommodated in the CAN package in this embodiment), the lower case 52 for accommodating the signal light input / output tip end thereof protruding downward, and the lower case 52. And an upper case 54 fixed to the upper part of the lower case 52 so as to close the upper opening of the.

The lower case 52 is composed of a long box having an open top, and at the bottom thereof eight elements for positioning the four laser diodes LD and the four photodiodes PD, respectively. An insertion hole is provided.
The element insertion holes are formed so as to be arranged in two rows along the longitudinal direction of the lower case, and the four laser diodes LD and the four photodiodes PD are respectively arranged in the element insertion holes of each row. The signal light entrance / exit tip is inserted so as to face outward. Since each of these elements has a brim on the rear end side, even if the elements are inserted into the element insertion holes, the respective elements do not jump out. A pair of rods 56 for insertion into a pair of through holes H provided in the multiplex type optical data bus fixed substrate 10 are provided on both sides of the bottom of the lower case 52 in the longitudinal direction.
Is projected.

On the other hand, the upper case 54 is the lower case 5
A coil spring 58 for urging the laser diode LD and the photodiode PD positioned at the bottom of the lower case 52 outward from the rear end side thereof is provided for closing the upper opening of 2. ing. Therefore, the laser diode LD held by the optical connector 50
The photodiode PD moves to the inside of the optical connector 50 when the tip end surface protruding from the optical connector 50 hits an external obstacle, and is projected again from the optical connector 50 when the tip end surface is opened. .

Next, on both sides in the longitudinal direction of the upper end surface of the upper case 54, the circuit boards PK for performing data communication using the laser diode LD and the photodiode PD held by the optical connector 50 are set up. A pair of substrate fixing portions 60 are provided. This board fixing portion 60 is
The circuit board PK is composed of two members for sandwiching the board surface of the circuit board PK, and the circuit board PK inserted between the members is fastened with a screw so that the circuit board PK can be mounted on the optical connector 50. Has become.

Further, in the upper case 54, in order to electrically connect the circuit board PK and the internal laser diode LD and photodiode PD, a signal line connected to the leads of the laser diode LD and the photodiode PD. (For example, flat cable) 62 to the optical connector 5
A signal line insertion hole for pulling out above 0 is bored, and the signal line 62 pulled out from this hole is the connector 6
4 is connected to the signal processing circuit formed on the circuit board PK.

The plurality (four) of electrical connectors 42 described above position and fix the optical connector 50 on the multiple optical data bus fixed board 10 (in other words, the printed wiring board 40) through the through hole H. , And the optical connector 50
When the circuit board PK is attached to the circuit board PK, the circuit board PK is arranged at a position where it can be connected to the circuit board PK via the electric connector (or directly) (see FIG. 2).

As described above, in the opto-electrical backplane board 2 of this embodiment, the optical data bus insertion recess 14 formed on the surface of the multiplex type optical data bus fixed substrate 10 is formed.
Inserting and fixing the optical data bus 30 therein, and further positioning and fixing the optical connector 50 above the optical data bus 30 by utilizing the through hole H formed in the multiplex type optical data bus fixing substrate 10. The signal light input / output unit 32 of the optical data bus 30 and the laser diode LD or the photodiode P
The relative position with respect to D can be positioned easily and surely.

The multiple optical data bus fixed substrate 10 is also provided.
Is detachably mounted on the printed wiring board 40 using screws or the like, and the optical connector 50 is mounted on the printed wiring board 40.
An electric connector 42 for inputting / outputting various control signals such as power supply and synchronization signals to / from the circuit board PK mounted on the
Is fixed.

Therefore, according to the optoelectronic backplane board 2 of this embodiment, not only the relative position between the signal light input / output unit 32 of the optical data bus 30 and the laser diode LD or the photodiode PD can be easily positioned. ,
Power supply and signal input / output can be performed from the printed wiring board 40 to the circuit board PK mounted on the optical connector 50 through the electric connector 42.

Therefore, by using the opto-electrical backplane board 2 of this embodiment, an information processing device capable of performing high-speed data communication between a plurality of circuit boards PK by using the optical data bus 30 can be extremely simplified. It is possible to build. Further, in the opto-electrical backplane board 2 of this embodiment, since the multiplex type optical data bus fixed board 10 is detachably attached to the printed wiring board 40 as a base, the optical data bus 30 is replaced. The above can be performed for each unit of the multiplex type optical data bus fixed substrate 10 without touching the optical data bus. For this reason, it is possible to prevent the optical data bus from being soiled or damaged when the optical data bus 30 is replaced, and it is possible to improve workability during maintenance.

Further, since the printed wiring board 40 and the multiplex type optical data bus fixed board 10 are constructed separately,
By appropriately selecting the material of the multiple optical data bus fixed substrate 10, the coefficient of thermal expansion of the multiple optical data bus fixed substrate 10 and the coefficient of thermal expansion of the optical data bus 30 can easily match (or substantially match). Can be made.

By doing so, the multiple optical data bus fixing substrate 10 and the optical data bus 30 are made to have the same degree of expansion and contraction at the time of heat change, and are positioned and fixed to the multiple optical data bus fixing substrate 10. The optical connector 50 can be displaced in accordance with this thermal expansion, so that the laser diode LD and the photodiode PD in the optical connector 50 and the signal light input / output unit 30 of the optical data bus 30 can be changed at the time of thermal change. It is possible to prevent the communication performance from being deteriorated due to the shift of the relative position of.

As described above, by using the optical / electrical backplane board 2 of this embodiment, the optical data bus 30 can be used as a signal transmission medium to connect a plurality of circuits very easily and without causing a transmission loss. Therefore, it is possible to easily realize an information processing device having a parallel architecture, which is compatible with high speed and can realize interconnection of multiple nodes with a simple configuration.

Then, an example of an information processing apparatus configured by using the opto-electric backplane board 2 of this embodiment will be described below with reference to FIG. The information processing apparatus shown in FIG.
A computer 70 and three hard disks 72, 74, and 76 connected to the computer 70 are provided as information devices connected to each other via the opto-electric backplane board 2. From the computer 70, a cable for inputting / outputting data in accordance with a standard such as SCSI or PCI is drawn from a data bus of an internal motherboard (or an expansion board connected to the motherboard).
Cables are also drawn from the hard disks 72 to 76 for inputting and outputting data according to the same standard.

On the other hand, four optical connectors 50 are fixed to the opto-electric backplane board 2, and the above-mentioned information devices (computer 70 and hard disks 72 to 76) are attached to the board fixing portion 60 of each optical connector 50. ) Corresponding to the circuit board PK is fixed.

Each of these circuit boards PK operates by being supplied with power and various control signals from the printed wiring board 40 through the electric connector 42 described above, and operates in accordance with corresponding information equipment (computer 70 or hard disks 72 to 7).
According to the output data from 6), a drive signal for driving the laser diode LD in the optical connector 50 is generated to drive the laser diode LD, and the received light signal output from the photodiode PD in the optical connector 50 is handled. The information device (computer 70 or hard disks 72 to 76) converts the data into readable data and outputs the data to the information device (computer 70 or hard disks 72 to 76). A processing IC 66 and other electronic components are mounted.

At the end of each circuit board PK opposite to the optical connector 50, each of the above information devices (computer 70
And a connector 68 for connecting a cable for data transmission drawn from the hard disks 72 to 76), and the information equipment (computer 70 or hard disks 72 to 76) corresponding to each circuit board PK,
Via this connector 68 and a cable which is a signal line,
They are connected to each other so that data can be transmitted.

The laser diode LD and the photodiode PD in the optical connector 50 are connected to the corresponding circuit board PK via the above-mentioned signal line 62 shown in FIG. 3D. In the information processing apparatus configured as described above, the computer 70 or the hard disk 72 to
When data is output from 76 to the circuit board PK, the output data is signal-processed by the corresponding circuit board PK, and the laser diode LD in the optical connector 50 to which the circuit board PK is fixed outputs the output data. Driven accordingly. As a result, the signal light corresponding to the output data is emitted from the laser diode LD held by the optical connector 50, and this is incident on the signal light input / output unit 32 of the optical data bus 30.

The signal light incident on the optical data bus 30 as described above is transmitted in the rear end direction within the optical data bus 30, and further, the first holding member 22 causes the optical data bus 30 to be transmitted.
The light is reflected by the reflection type diffusion plate that is in contact with the rear end face of the optical data bus 30 and returned toward the front end of the optical data bus 30. Then, the returned signal light is emitted from each optical signal input / output unit 32 of the optical data bus 30 toward the upper side of the optical data bus 30, and the photodiode arranged above each optical signal input / output unit 32. The light enters the PD and is converted into an electric signal.

Then, the electric signal is transmitted to each circuit board PK.
Then, after being converted into data to be transmitted to the corresponding information device (computer 70 or hard disks 72 to 76), it is input to the information device (computer 70 or hard disks 72 to 76) via a cable.

That is, according to the information processing apparatus shown in FIG. 4, the computer 70 controls each of the hard disks 72 to 76.
In order to save or read data to,
When data is output to the corresponding circuit board PK, the output data is the circuit board PK, the laser diode LD in the optical connector 50, the optoelectronic backplane board 2 (specifically, the optical data bus 30), and the photo in the optical connector 50. The data is transmitted to each of the hard disks 72 to 76 via the diode PD and the circuit board PK, receives a data request from the computer 70, and then is transferred from the hard disk 72 to the computer 7.
Data will be transmitted to 0 through the reverse route.

Then, in the information processing apparatus shown in FIG.
By using the opto-electric backplane board 2 that can efficiently transmit the signal light, the computer 70 and the hard disk 72 are used.
Since data can be transmitted between ~ 76 (or between hard disks 72 ~ 76), the data transmission quality can be improved as compared with an information processing apparatus that connects a plurality of information devices by electric wiring. Further, by increasing the speed of the light emitting element and the light receiving element, it becomes possible to perform high-speed data transmission at a level that is difficult to achieve by electrical transmission.

Since the circuit board PK is fixed to the opto-electric backplane board 2 via the optical connector 50, the circuit board PK is mounted on the opto-electric backplane board 2.
When fixing the circuit board or removing the circuit board PK from the optoelectronic backplane board 2, the circuit board PK can be detached from the optoelectronic backplane board 2 with the circuit board PK still attached to the optical connector 50. The attachment / detachment work can be performed extremely easily.

When the circuit board PK is fixed on the opto-electric backplane board 2 via the optical connector 50, it is also fixed on the opto-electric backplane board 2 (more specifically, on the printed wiring board 40). Electrical connector 4
2 is connected to the printed wiring board 40 via the power supply and various control signals are supplied from the printed wiring board 40, so that wiring for supplying power and inputting / outputting signals to / from the circuit board PK is not necessary. This also makes it possible to simplify the work of attaching / detaching the circuit board PK to / from the opto-electric backplane board 2.

Here, in the above embodiment, the electrical connector 4
By mounting the multiplex type optical data bus fixed board 10 on the printed wiring board 40 to which 2 is fixed, the optical data bus 30 and the optical connector 50 (more specifically, the laser diode LD
The opto-electrical backplane board 2 has been described in which the positioning with the photo diode PD) and the connection between the printed wiring board 40 and the circuit board PK can be easily performed. It is not always necessary to use the multiplex type optical data bus fixed substrate 10.

As another embodiment of the present invention, an optoelectronic backplane board constructed without using the multiplex type optical data bus fixed substrate 10 of the above embodiment will be described. FIG. 5 shows the configuration of an opto-electrical backplane board 2a of the second embodiment in which an optical data bus guide plate 10a is used instead of the multiplex type optical data bus fixed substrate 10.
(A) is a perspective view of the photoelectric backplane board 2a,
(B) is an end view showing a state in which the optoelectric backplane board 2a is cut along the line AA shown in (a).

The opto-electrical backplane board 2a of this embodiment is the same as that shown in FIG. 1 except for the optical data bus guide plate 10a, and therefore only different points will be described. The optical data bus guide plate 10a is made of a plate material having substantially the same plate thickness as that of the optical data bus 30, and a plurality of guide holes 14a penetrating corresponding to the plate surface shape of the optical data bus 30 are formed on the plate surface. Type optical data bus fixed board 1
It is formed in the same manner as the optical data bus insertion concave portion 14 at 0.

Then, this optical data bus guide plate 10a
Is mounted on the printed wiring board 40 in the same manner as the multiple optical data bus fixed board 10, and the optical data bus 30 is formed by the guide hole 14a of the optical data bus guide board 10a and the board surface of the printed wiring board 40. It is inserted and fixed in the formed optical data bus insertion recess.

Further, the optical data bus guide plate 10a includes
Similar to the multiplex type optical data bus fixed board 10, a through hole H for positioning and fixing the optical connector 50 is formed, and the printed wiring board 40 is also formed with the through hole H at the same position. Therefore, also in the opto-electric backplane board 2a of this embodiment, the signal light input / output section 32 of the optical data bus 30 and the laser diode LD are the same as those shown in FIG.
Alternatively, not only the relative position with respect to the photodiode PD can be easily positioned, but also power supply and signal input / output can be performed from the printed wiring board 40 to the circuit board PK mounted on the optical connector 50 via the electric connector 42. As a result, it becomes possible to construct an information processing device capable of performing high-speed data communication between a plurality of circuit boards PK using the optical data bus 30 very easily.

Further, since the printed wiring board 40 and the optical data bus guide plate 10a are formed as separate bodies, FIG.
Similar to the one shown in (4), the coefficient of thermal expansion of the multiple optical data bus fixed substrate 10 and the coefficient of thermal expansion of the optical data bus 30 can be easily matched by appropriately selecting the material of the optical data bus guide plate 10a ( Alternatively, they can be substantially matched). Then, by doing so, the optical data bus guide plate 10a and the optical data bus 30 have the same degree of expansion and contraction at the time of heat change, so that the optical connector 50 positioned and fixed to the multiplex type optical data bus fixing substrate 10 is fixed. Since it can be displaced following this thermal expansion, the relative positions of the laser diode LD and the photodiode PD in the optical connector 50 and the signal light input / output unit 30 of the optical data bus 30 are displaced when the heat changes. It is possible to prevent a decrease in communication performance.

In the optoelectronic backplane board 2a of this embodiment, the optical data bus 30 is inserted into the guide hole 14a formed in the optical data bus guide plate 10a. Etc. are performed by the optical data bus 30 alone.

Next, in FIG. 6, instead of the multiple optical data bus fixed substrate 10, a plurality of single optical data bus fixed substrates 10b each having only one optical data bus insertion recess 14 are formed. FIG. 6A shows the configuration of the optoelectronic backplane board 2b of the third embodiment, in which (a) is a perspective view of the optoelectric backplane board 2b, and (b) is an optoelectronic backplane board 2b shown in (a). It is an end view showing the state cut along the line A.

The opto-electrical backplane board 2b of this embodiment is the same as that shown in FIG. 1 except for the optical data bus guide plate 10a, and therefore only different points will be described. Single type optical data bus fixed board 10
Reference numeral b shows a structure in which the multiplex type optical data bus fixed substrate 10 is divided into a plurality of concave portions 14 for inserting each optical data bus. Then, each individual type optical data bus fixed substrate 10
b is a printed wiring board 40 so that the corresponding signal light input / output portions 32 of the optical data bus 30 fixed in the optical data bus insertion recess 14 are arranged substantially linearly.
It is removably mounted on.

Further, the printed wiring board 40 is provided with through holes H for positioning and fixing the optical connector 50, and the surface of the printed wiring board 40 on which the single optical data bus fixing board 10b is laminated. An electric connector 42 for supplying power to the circuit board PK mounted on the optical connector 50 positioned through the through hole H and inputting / outputting various control signals is fixed on the upper side.

Therefore, also in the optoelectronic backplane board 2b of this embodiment, the relative position between the signal light input / output unit 32 of the optical data bus 30 and the laser diode LD or the photodiode PD is the same as that shown in FIG. In addition to the simple positioning, the power supply and the signal input / output can be performed from the printed wiring board 40 to the circuit board PK mounted on the optical connector 50 via the electric connector 42. It becomes possible to construct an information processing device capable of performing high-speed data communication between a plurality of circuit boards PK by utilizing the above.

In addition, in the opto-electrical backplane board 2b of this embodiment, the single type optical data bus fixed substrate 10b is used.
Is detachably attached to the printed wiring board 40 which is a base, so that the optical data bus 30 can be replaced,
This can be performed without touching the optical data bus in units of the single component type optical data bus fixed substrate 10b. For this reason, it is possible to prevent the optical data bus from being soiled or damaged when the optical data bus 30 is replaced, and it is possible to improve workability during maintenance.

Next, FIG. 7 shows an optical data bus fixing board 10 or 10b of the above-mentioned multiple type or a single piece type, or an optical data bus fixing board 10a or the like without using the optical data bus fixing member. The structure of the opto-electric backplane board 2c of the fourth embodiment in which the data bus 30 can be fixed on the printed wiring board 40 is shown. (A) is a perspective view of the opto-electric backplane board 2c, and (b) is an optical diagram. It is an end view showing the state which cut | disconnected the electric backplane board 2c along the AA line shown to (a).

The opto-electrical backplane board 2c of this embodiment is the same as that of the above-mentioned embodiments except that the optical data bus fixing member is not used and the printed wiring board 40 has a different structure. Therefore, only different points will be described. As shown in FIG. 7, in the opto-electrical backplane board 2c of this embodiment, the plurality of optical data bus insertion recesses 14 formed on the multiplex type optical data bus fixed substrate 10 of the first embodiment are printed. It is directly formed on the wiring board 40. The arrangement of the optical data bus insertion recesses 14 on the printed wiring board 40 is exactly the same as the arrangement on the multiplex optical data bus fixed board 10.

Further, the printed wiring board 40 is provided with through holes H for positioning and fixing the optical connector 50, and on the board surface on which the optical data bus insertion concave portion 14 is formed in the printed wiring board 40. An electrical connector 42 for supplying power or inputting / outputting various control signals to / from the circuit board PK mounted on the optical connector 50 positioned through the through hole H is fixed to the.

Therefore, also in the opto-electric backplane board 2c of this embodiment, the relative position between the signal light input / output unit 32 of the optical data bus 30 and the laser diode LD or the photodiode PD is the same as in the above-mentioned embodiments. In addition to the simple positioning, the power supply and the signal input / output can be performed from the printed wiring board 40 to the circuit board PK mounted on the optical connector 50 via the electric connector 42. It becomes possible to construct an information processing device capable of performing high-speed data communication between a plurality of circuit boards PK by utilizing the above.

In the opto-electrical backplane board 2c of this embodiment, the optical data bus 30 is inserted into the optical data bus insertion recess 14 formed in the printed wiring board 40. The exchange and the like are performed by the optical data bus 30 alone.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above-mentioned embodiments, and various modes can be adopted. For example, in the above embodiment, the second holding member 18 provided on the side wall of the optical data bus 30 is described as one, but the second holding member 18 is described.
May be provided in plural with respect to the optical data bus 30, or only the first holding member 22 may be provided.
If 0 can be sufficiently held, the second holding member 18 can be deleted.

Further, the coil spring 22 of the first holding member 22
f, the leaf spring 18c of the second holding member 18 or the coil spring forming the warp correction member 20 for correcting the warp of the optical data bus 30 is changed to a cushioning material made of rubber or another spring material. You may. Further, in each of the above-described embodiments, the multiple optical data bus fixed substrate 10 and the single optical data bus fixed substrate 10b are described as those in which the optical data bus insertion concave portion 14 is simply formed on the flat plate. Is provided with a lid that protects the optical data bus 30 inserted into the optical data bus insertion recess 14 from the outside except the signal light input / output unit 32, and protects the optical data bus 30 with this lid. At the same time, the optical data bus 30 may be fixed.

Further, when the optical data bus guide plate 10a having the guide hole 14a serving as the optical data bus insertion concave portion is used, or when the optical data bus insertion concave portion 14 is formed on the printed wiring board 40 itself. Also optical data bus 3
After mounting 0, the signal light input / output unit 32 of the optical data bus 30
Other parts may be protected by a protective plate or the like.

[Brief description of drawings]

FIG. 1 is an explanatory diagram showing an overall configuration of an optoelectronic backplane board according to an embodiment.

FIG. 2 is a plan view of the optoelectronic backplane board of the embodiment as seen from above.

FIG. 3 is an explanatory diagram showing a configuration of an optical connector mounted on the optoelectronic backplane board of the embodiment.

FIG. 4 is an explanatory diagram illustrating an example of an information processing device configured using the optoelectronic backplane board according to the embodiment.

FIG. 5 is an explanatory diagram showing an overall configuration of an optoelectronic backplane board according to a second embodiment.

FIG. 6 is an explanatory diagram showing an overall configuration of an optoelectronic backplane board according to a third embodiment.

FIG. 7 is an explanatory diagram showing an overall configuration of an optoelectronic backplane board according to a fourth embodiment.

FIG. 8 is an explanatory diagram illustrating a configuration of a conventional optical data bus and a usage state thereof.

[Explanation of symbols]

2, 2a, 2b, 2c ... Optoelectronic backplane board,
10 ... Multiple optical data bus fixed board, 10c ... Optical data bus guide board, 10b ... Single optical data bus fixed board,
14 ... Recess for inserting optical data bus, 14a ... Guide hole, H
... through hole, 30 ... optical data bus, 32 ... signal light input / output section, 40 ... printed wiring board, 50 ... optical connector, 52
… Lower case, 54… Upper case, 56… Rod, 6
0 ... Board fixing part, 62 ... Signal line, 70 ... Computer,
72, 74, 76 ... Hard disk, Ha, Hb ... Step portion, LD ... Laser diode, PD ... Photodiode, PK ... Circuit board.

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Akihiro Tanaka             2288 Nishihorie, Shinkawa-cho, Nishikasugai-gun, Aichi Prefecture             Aika Kogyo Co., Ltd. (72) Inventor Kenichi Higashiura             2288 Nishihorie, Shinkawa-cho, Nishikasugai-gun, Aichi Prefecture             Aika Kogyo Co., Ltd. F term (reference) 2H037 AA01 BA02 BA11 CA32 CA38                       DA03 DA06 DA13

Claims (7)

[Claims] 1. A long, plate-shaped light-transmissive material, and one side along the longitudinal direction is stepwise with an interval at which a light emitting element or a light receiving element can be arranged from one end side to the other end in the longitudinal direction. And a plurality of optical data buses in which signal light input / output parts are formed by inclining each end face on the one end side in the longitudinal direction, which is formed in a stepwise manner, with respect to the plate surface, A plurality of optical data bus insertion recesses opened corresponding to the plate shape of each optical data bus correspond to each other when each optical data bus is inserted into the optical data bus insertion recess. Multiple optical data bus fixed substrates formed at substantially equal intervals so that the signal light input / output units are arranged substantially linearly, and the optical data buses are inserted in the optical data bus insertion recesses. The optical fiber data bus fixed board with the On the plate surface on which the multiplex type optical data bus fixing substrate is placed, the optical data buses are inserted into and fixed to the optical data bus inserting recesses so that the optical data buses can be optically transmitted to each other. A printed wiring board to which a plurality of electric connectors for supplying power to or inputting / outputting signals to / from a plurality of circuit boards for communication are fixed, and for supplying power or inputting / outputting signals to / from each of the circuit boards via the electric connectors. The printed wiring board or the printed wiring board and the multiplex type optical data bus fixed board are provided with a signal light input / output unit of each optical data bus arranged substantially linearly on the printed wiring board. A plurality of light emitting elements and light receiving elements for individually inputting and outputting an optical signal to and from one or a plurality of groups of light input / output sections, and an electric signal is applied to the light emitting elements and the light receiving elements. A plurality of optical connectors capable of mounting the circuit board for performing optical communication via the respective optical data buses by inputting and outputting the optical signals, and through holes for positioning and fixing the optical connectors. Electric backplane board. 2. The through hole is formed so as to penetrate through when the printed wiring board and the multiple optical data bus fixed board are stacked, and the multiple optical data bus fixed board is formed. The opto-electric backplane board according to claim 1, having the same or substantially the same coefficient of thermal expansion as the optical data bus. 3. A long plate-shaped light-transmissive material, and one side along the longitudinal direction is stepwise with an interval at which a light emitting element or a light receiving element can be arranged from one end side to the other end in the longitudinal direction. And a plurality of optical data buses in which the signal light input / output portions are formed by inclining each end face on the one end side in the longitudinal direction, which is formed in a stepwise manner, with respect to the plate surface, The optical data bus is made of a plate material having substantially the same plate thickness, and a plurality of guide holes penetrating the plate surface corresponding to the plate surface shape of each optical data bus are formed in the plate surface. An optical data bus guide plate formed at substantially equal intervals so that the corresponding signal light input / output units of each optical data bus are arranged substantially linearly when the buses are arranged, and the optical data bus. A guide plate is removably mounted on the optical data bus guide plate. The respective optical data buses are inserted and fixed in the guide holes provided, and the optical data inserted and fixed in the guide holes are provided on the plate surface on which the optical data bus guide plate is placed. A plurality of electric connectors for supplying power to or inputting / outputting signals to / from a plurality of circuit boards that perform optical communication with each other via a bus are fixed, and power supply or signal input / output to / from each of the circuit boards is performed via the electric connectors. The printed wiring board, or the printed wiring board and the optical data bus guide plate, is provided with a signal wiring of each of the optical data buses arranged in a substantially straight line on the printed wiring board. A plurality of light emitting elements and light receiving elements for individually inputting / outputting an optical signal to / from one or a plurality of groups of light input / output sections are held, and the light emitting elements and the light receiving elements are set as the output sections. Through holes for positioning and fixing a plurality of optical connectors capable of mounting the circuit board, which perform optical communication through the optical data buses by inputting and outputting electric signals to and from the optical element are provided. An optoelectronic backplane board featuring. 4. The through hole is formed so as to penetrate the printed wiring board and the optical data bus guide plate when they are stacked, and the optical data bus guide plate is the same as the optical data bus. Alternatively, the optoelectronic backplane board according to claim 3, which has substantially the same coefficient of thermal expansion. 5. A long, plate-shaped light-transmissive material, and one side along the longitudinal direction is stepwise with an interval at which a light emitting element or a light receiving element can be arranged from one end side to the other end in the longitudinal direction. And a plurality of optical data buses in which signal light input / output parts are formed by inclining each end face on the one end side in the longitudinal direction, which is formed in a stepwise manner, with respect to the plate surface, A plurality of single-piece optical data having an optical data bus insertion recess opened corresponding to the plate shape of the optical data bus, and one of the optical data buses being inserted and fixed in the optical data bus insertion recess The bus fixing board and the plurality of single-piece type optical data bus fixing boards are arranged such that the corresponding signal light input / output parts of the respective optical data buses inserted and fixed in the optical data bus insertion recesses are arranged substantially linearly. So that it can be detachably mounted and Power is supplied to a plurality of circuit boards that perform optical communication with each other via the optical data buses that are inserted and fixed in the optical data bus insertion recesses on the plate surface on which the single type optical data bus fixing board is placed. Alternatively, a plurality of electric connectors for performing signal input / output are fixed, and a printed wiring board for supplying power to or inputting / outputting signals to / from each of the circuit boards via the electrical connector is provided, and the printed wiring board includes: A plurality of signal light input / output units of each of the optical data buses arranged in a substantially straight line on the printed wiring board are used as a group to individually input / output an optical signal to / from one or more groups of the light input / output units. Holding a light emitting element and a light receiving element, and capable of mounting the circuit board for performing optical communication through the optical data buses by inputting and outputting electric signals to and from the light emitting element and the light receiving element. An optical / electrical backplane board having a through hole for positioning and fixing the optical connector. 6. A long, plate-shaped light-transmissive material, and one side along the longitudinal direction is stepwise with an interval at which a light emitting element or a light receiving element can be arranged from one end side to the other end in the longitudinal direction. And a plurality of optical data buses in which signal light input / output parts are formed by inclining each end face on the one end side in the longitudinal direction, which is formed in a stepwise manner, with respect to the plate surface, A plurality of optical data bus insertion recesses opened corresponding to the plate shape of each optical data bus correspond to each other when each optical data bus is inserted into the optical data bus insertion recess. The optical data bus insertion portions are formed at substantially equal intervals so that the signal light input / output portions are arranged substantially linearly, and the optical data bus insertion portions are inserted on the plate surface on which the optical data bus insertion concave portions are formed. Through the optical data buses fixed in the recesses A plurality of electric connectors for supplying power to or inputting / outputting signals to / from a plurality of circuit boards for optical communication are fixed, and a printed wiring board for supplying power or inputting / outputting signals to / from each of the circuit boards via the electric connectors. The signal light input / output section of each of the optical data buses arranged on the printed wiring board in a substantially straight line is defined as a group in the printed wiring board with respect to one or a plurality of groups of light input / output sections. By holding a plurality of light emitting elements and light receiving elements that individually input and output optical signals, and by inputting and outputting electric signals to the light emitting elements and light receiving elements, optical communication is performed via the optical data buses. An optoelectronic backplane board, wherein a plurality of optical connectors to which the circuit board can be mounted are formed with through holes for positioning and fixing. 7. The opto-electric backplane board according to claim 1, a plurality of information devices including a computer, and at least one of the information devices connected via a signal line, It is electrically connected to the printed wiring board through an electric connector fixed to the printed wiring board of the opto-electrical backplane board, and is input from the information device and the printed wiring board through the signal line and the electric connector. A plurality of circuit boards that perform optical communication via an optical data bus fixed on the printed wiring board according to the output signal, and are arranged in a substantially straight line on the printed wiring board of the optoelectronic backplane board. A plurality of signal light input / output units of each of the optical data buses are grouped into one group or a plurality of groups for individually inputting / outputting an optical signal to / from the light input / output units. A plurality of optical connectors that hold a light emitting element and a light receiving element and that support each of the circuit boards so that an electric signal can be input and output to and from the light emitting element and the light receiving element. Processing equipment.