JP2003080793A - Recorder - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a recorder which can effectively let off heat generated at a driving circuit on a flexible wiring board. SOLUTION: The flexible wiring board 25 connected to a recording head 20 extends while being bent by an obtuse angle to a circuit board 21 via an inclined wall face 29 from a bottom face at the outside of a head holder 18. An IC chip 23 for driving a piezoelectric actuator of the recording head 20 is flip chip mounted to a face at the opposite side to the head holder 18 of the flexible wiring board 25. The IC chip 23 is pressed to a heat sink 26 by an elastic material 27 set to the inclined wall face 29. The heat generated at the IC chip 23 is efficiently emitted to the outside from the heat sink 26. The heat sink 26 is electrically connected to the circuit board 21 by a leaf spring, and therefore static electricity can be let off via the circuit board 21 to the ground.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a recording device,
More specifically, the present invention relates to a recording apparatus including a recording head that performs recording on a recording medium, a drive circuit that drives the recording head, and a flexible wiring board that transmits a signal from the drive circuit to the recording head.

[0002]

2. Description of the Related Art Conventionally, for example, an ink jet printer is known as a recording device for recording on a recording medium such as paper. In this inkjet printer, a head holder equipped with a recording head is mounted on a carriage, and the carriage is reciprocated in parallel with a platen for feeding a recording medium to perform recording. In the printhead unit of this ink jet printer, one end of a flexible wiring board is soldered to the printhead, and the opposite end is soldered to a circuit board which is a relay board between the carriage and the printhead. A drive circuit for driving the recording head is provided on the surface of the flexible wiring board.

[0003]

However, in the ink jet head printer described above, the drive circuit generates heat due to frequent drive of the recording head. If this heat cannot be effectively released to the outside, there are problems that the operation of the drive circuit becomes unstable and the drive circuit is damaged.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a recording apparatus capable of effectively radiating heat generated in a drive circuit on a flexible wiring board.

[0005]

A recording apparatus according to a first aspect of the invention for achieving the above object comprises a recording head having a plurality of recording elements for recording on a recording medium, and the recording head. A head holder for holding, and a flexible wiring board having a plurality of conducting wires provided along an outer surface of the head holder and provided on a flexible band-shaped insulator and a drive circuit for driving the recording head, A heat sink provided on the side opposite to the head holder with respect to the flexible wiring board and radiating heat generated in the drive circuit to the outside; and an elasticity provided between the flexible wiring board and the head holder. A member, the drive circuit is provided on the flexible wiring board on the side opposite to the head holder, and the heat shield is applied by the pressing force of the elastic member. And it has a configuration which is characterized by being pressed against the click.

In the recording apparatus having this structure, a flexible wiring board having a drive circuit for driving the recording head is provided along the outer surface of the head holder, and the flexible wiring board is provided on the side opposite to the head holder with respect to the flexible wiring board. A heat sink is provided, and further, an elastic member is provided between the flexible wiring board and the head holder, and the drive circuit is pressed against the heat sink by the pressing force of the elastic member. The generated heat is effectively released to the outside, and stable driving is performed.

According to a second aspect of the present invention, in addition to the configuration of the recording apparatus according to the first aspect, the head holder includes a first wall for holding the recording head,
The side wall is substantially L-shaped from the first wall and the second wall standing upright, and the flexible wiring board is located along the outer surfaces of the first wall and the second wall of the head holder. The end of the flexible wiring board located on the outer surface of the second wall has a connection terminal for connecting to an external device.

In the recording apparatus of this structure, in addition to the operation of the invention described in claim 1, the flexible wiring board is the first
The end portion of the flexible wiring board, which is located along the outer surface of the substantially L-shaped head holder including the second wall and the second wall and is located on the outer surface of the second wall, is connected to an external device. The flexible wiring board can be connected to an external device on a surface other than the wall surface on which the recording head is located, and power can be supplied from the external device to the drive circuit.

Further, in the recording apparatus of the invention according to claim 3, in addition to the configuration of the recording apparatus according to claim 2, the head holder is provided at a connecting portion between the first wall and the second wall. A flexible wiring board is bent along the first wall, the inclined wall surface, and the second wall of the head holder at an obtuse angle. To do.

In the recording apparatus of this structure, in addition to the function of the invention described in claim 2, the flexible wiring board is bent at an obtuse angle along the first wall and the inclined wall surface of the head holder, and , Is bent at an obtuse angle along the inclined wall surface and the second wall. That is, since the flexible wiring board is bent at an obtuse angle in two steps,
The flexible wiring board does not receive a large load locally and is not damaged.

The recording apparatus of the invention according to claim 4 is
In addition to the configuration of the recording apparatus according to any one of claims 1 to 3, a carriage that mounts the head holder and is movable along a recording medium is further provided, and the carriage is provided on a second wall of the head holder. A relay board having a contact for connecting the conductor on the flexible wiring board to the wiring board on the carriage; and the heat sink exposing the contact of the relay board between the recording head and the relay board, The flexible wiring board is covered and fixed to the head holder.

According to the recording apparatus having this structure, it is preferable that the recording apparatus according to any one of claims 1 to 3 be used.
In addition to the operation of the invention described in any one of 1, the wiring board is provided on the carriage movable along the recording medium, and the conductor on the flexible wiring board is provided on the second wall of the head holder. A relay board having a contact for connecting with the relay board is provided, and the heat sink is fixed between the recording head and the relay board by exposing the contact of the relay board. In addition, the heat generated in the drive circuit on the flexible wiring board can be released to the outside.

According to a fifth aspect of the present invention, in addition to the configuration of the recording apparatus according to any one of the first to fourth aspects, the heat sink is connected to the ground via the relay board. It is characterized by being

According to the recording apparatus of this structure,
In addition to the action of the invention described in any one of 1, the heat sink is connected to the ground via the relay board, and the static electricity generated in the heat sink is released to the ground, so that the drive circuit is prevented from being destroyed by the static electricity. Can be prevented.

Further, in the recording apparatus of the invention according to claim 6, in addition to the configuration of the recording apparatus according to any one of claims 1 to 5, the drive circuit is an IC chip.

According to the recording apparatus having this structure, the first to fifth aspects are provided.
In addition to the operation of the invention described in any one of 1, the drive circuit provided on the flexible wiring board is an IC chip.
The mounting space of the drive circuit on the flexible wiring board can be reduced.

[0017]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of a recording apparatus of the present invention will be described below with reference to the drawings. First, the internal configuration of an inkjet printer 1 which is an embodiment of a recording apparatus of the present invention will be described with reference to FIG. Figure 1
FIG. 3 is a perspective view showing the internal structure of the inkjet printer 1.

As shown in FIG. 1, a carriage 8 is provided inside a housing 2 of an ink jet printer 1. The carriage 8 is slidably supported by a guide rod 11 and a guide member 12, respectively. It is fixed to the belt 13 and driven by the CR motor 16 to reciprocate. A recording head unit 17 having recording heads 19 and 20 (see FIG. 2) for performing recording such as printing is attached to the carriage 8. The recording heads 19 and 20 have four color inks (cyan c, magenta m,
The recording paper P, which is a recording medium, including yellow y and black b)
It is an ink jet type that ejects ink droplets on the top to perform a recording operation, and cyan, magenta, yellow, and
Four black jet nozzle groups 7a to 7d (see FIG. 2)
Is equipped with.

Further, the recording head unit 17 has four ink cartridges 14y, 14m, 14c and 14b for supplying the inks of the respective colors to the ejection nozzle groups 7a to 7d.
Is detachably mounted. Further, in the inkjet printer 1 of the present embodiment, a platen roller 10 that conveys the recording paper P is provided at a position facing the recording heads 19 and 20, and the platen roller 10 is L (not shown).
The platen roller 1 is driven to rotate by driving the F motor.
With the rotation of 0, the recording paper P is conveyed in the direction (arrow direction shown in FIG. 1) orthogonal to the moving direction of the carriage 8.

Next, the structure of the recording head unit 17 will be described with reference to FIGS. 2 and 3
FIG. 3 is a perspective view of the recording head unit 17 as viewed from the back side of its bottom. As shown in FIGS. 2 and 3, the recording head unit 17 includes a head holder 18, recording heads 19 and 20, a circuit board 21, and a head cover 70.
Flexible wiring boards 24, 25 and an elastic material 27 (see FIG.
6) and each member is provided in the head holder 18. The cover plate / heat sink 26 is connected to the flexible wiring boards 24, 25.
On the opposite side of the head holder 18,
8 is provided. The head holder 18 is held by the carriage 8 shown in FIG. 1 and reciprocates together with the carriage 8.

The head holder 18 is integrally molded of a synthetic resin material, and has a bottom wall 18a, a back wall 18b and a left side wall 18c.
(See FIG. 4), the right side wall 18d and the front wall 18e, and has a substantially box shape with an open upper surface. The ink cartridges 14y, 14m, 14c, 14b described above
Is detachably mounted in this open portion. In addition, the outer surface 18 of the bottom wall 18 a of the head holder 18
A head holding portion 28 (see FIG. 7) is formed in a1, and two recording heads 19 and 20 for performing recording on the recording paper P are juxtaposed and adhesively fixed to the head holding portion 28. The recording head 1 is provided on the outer surface 18b1 of the back wall 18b.
Circuit board 2 serving as a relay board between the carriages 9 and 20
1 is fixed.

Further, the recording heads 19 and 20 and the circuit board 2
Flexible wiring boards 24 and 25 are connected between the first and second terminals. In the present embodiment, the plate-type piezoelectric actuators 12 provided on the recording heads 19 and 20 respectively.
An IC chip is used as a drive circuit that generates a drive voltage for driving 0 (see FIG. 10).
IC chips 22 and 23 for are mounted on the surface not on the head holder 18 side.

Then, as shown in FIG. 4, the recording head unit 17 is attached to the carriage 8 so as to be movable. More specifically, the projections 38 a and 38 b projecting from the back wall 18 b of the head holder 18 are fitted into the through holes 79 provided in the carriage 8, respectively, whereby the recording head unit 17 is positioned on the carriage 8. It is attached by known fixing means. A wiring board 80 is provided on the carriage 8. The wiring board 80 is connected to the main body side control board fixed to the stationary position of the housing 2 of the printer via a flexible wiring board (not shown), and the connection portion 80a of the wiring board 80 is connected.
Is connected to a contact 55 (see FIG. 2) on the circuit board 21 provided on the head holder 18, and the IC chip on the flexible wiring boards 24 and 25 from the main body side control board via the wiring board 80 of the carriage 8. Power and signals are supplied to 22 and 23, respectively.

Next, the structure of the head holder 18 will be described with reference to FIGS. 7 and 8. FIG. 7 is a perspective view of the head holder 18 as seen from the back side of the bottom thereof.
FIG. 3 is a perspective view of the head holder 18 as viewed from the front side of the upper part thereof. As described above, the head holder 18 has a substantially box shape composed of five wall portions, and as shown in FIGS. 7 and 8, the bottom wall 18a, the back wall 18b, and the front wall 18e are
Both have a substantially rectangular shape, and the height of the front wall 18e is
It is approximately one fourth of the height of the back wall 18b. Further, the left side wall 18c and the right side wall 18d are both the bottom wall 18a and the back wall 1a.
It has a substantially triangular shape with a right-angled portion on the side of the intersection with 8b. The right side wall 18d has an inclined surface 18d1 cut out at a predetermined angle at its right angle portion.

Further, on the bottom wall 18a of the head holder 18, the ink cartridges 14y, 14m, 14c and 14b mounted in the open portion on the upper surface side of the head holder 18,
A plurality of ink supply passages (not shown) that can be connected to the ink discharge portion (not shown) are provided. Each ink supply passage penetrates the bottom wall 18a and opens to the head holding portion 28, and is connected to an ink flow passage corresponding to each ejection nozzle group 7a to 7d of each recording head 19 and 20.

On the outer surface 18b1 of the back wall 18b of the head holder 18, two substantially rectangular ribs 35a, 35 are provided.
b is provided in a convex shape, and the tips of the ribs 35a and 35b are in contact with the back surface of the circuit board 21 (see FIG. 2). Protrusions 36 and 37 are provided on the outer side surface 18b1. The protrusions 36 and 37 have through-holes 21 formed in the circuit board 21 at their tip end cylindrical portions 36a and 37a.
The circuit board 21 is fixed by being inserted into a and 21b (see FIG. 13) and thermally crushed.

The head holder 18 has a heat sink 2 on the outer surface side near the intersection of the bottom wall 18a and the back wall 18b.
It is designed to hold 6. That is, the inclined surface 18 of the right wall 18d is provided near the end of the bottom wall 18a on the left wall 18c side.
A heat sink holding wall 40 formed to be substantially parallel to the portion near d1 is provided in a protruding manner. The heat sink holding wall 40 has an inclined surface parallel to the inclined surface 18d1. Right side wall 18
A rib 35c connects between d and the heat sink holding wall 40. Heat sink holding wall 40 and right side wall 1
The heat sink contact portion 40a is formed stepwise on the surface facing 8d.
The heat sink contact portion 40a is formed continuously with the heat sink contact portion 40a in the vicinity of the rear wall 18b side end of the outer surface 18a1 of the bottom wall 18a.

The heat sink 26 has its outer periphery abutted against the heat sink abutting portions 40a, 48 and is hermetically fixed to the head holder 18 with an adhesive or the like. Further, the sealant 71 (see FIG. 6) is filled between the heat sink 26 and the head cover 70 described later, and also between the heat sink 26 and the circuit board 21, and ink or the like is applied to the recording heads 19 and 20 and the flexible wiring boards 24 and 25. Are prevented from entering. A seal between the circuit board 21 and the rib 35c can also be provided if necessary. The heat sink 26 is made of a metal material having a good heat dissipation effect, such as aluminum, and has a plate shape.

Further, on the outer surface of the back wall 18b near the intersection with the bottom wall 18a, that is, inside the heat sink 26 fixed to the head holder 18, an elastic material for mounting an elastic material 27, which will be described later, is placed. A mounting portion 29 is provided. The elastic material mounting portion 29 is composed of a plurality of ribs having oblique sides parallel to the inclined surface 18d1 of the right wall portion 18d, and the oblique sides of these ribs form inclined wall surfaces for adhesively fixing the elastic material 27. There is.

Next, the structure of the flexible wiring boards 24 and 25 will be described with reference to FIG. As shown in FIG. 9, the flexible wiring board 24 is composed of a strip-shaped insulator 41 made of a polyimide resin having flexibility and a plurality of conductive wires provided on the strip-shaped insulator 41. The strip-shaped insulator 41 is a substantially rectangular head connecting portion 42 that is connected to the piezoelectric actuator 120 of the recording head 19 in an overlapping manner, and a substantially rectangular shape that is widened from one end of the head connecting portion 42 on the short side. IC chip holder 43
And a connecting portion 44 extending from the IC chip holding portion 43 and connected to the circuit board 21. Further, a substantially rectangular IC chip 22 that generates a drive voltage for driving the plate-type piezoelectric actuator 120 is provided at a substantially central portion of the IC chip holding portion 43.

The IC chip 22 is driven by the power source supplied by the power source line 50 and the common line 54 for the power source, and corresponds to each jet nozzle of the jet nozzle group based on the drive signal input from the signal line 51. Output line 53
It has a built-in drive circuit that outputs an injection signal. The flexible wiring board 24 includes a power supply line 50, a common line 54, a signal line 51, an output line 53, and a common line 52 along a side edge on the long side corresponding to the two ejection nozzle groups 7a and 7b of the recording head 19, respectively. Has a wiring pattern consisting of symmetric with respect to the longitudinal centerline of the flexible wiring board 24, and the IC chip 22 correspondingly has two sets of drive circuits built therein. In the head connecting portion 42, the end portions of the output line 53 and the common line 52, that is, the terminals 53a and 52a are arranged along both long side edges.

In the connecting portion 44 of the flexible wiring board 24, the other end of the common line 52, the respective ends of the power supply line 50 and the signal line 51 are arranged in a plurality of input terminal lines 45, 46, 4.
7 are arranged. The reason why it is divided into a plurality of columns in this way is that the width of each input terminal is made larger than that of the line 51 and that the entire flexible wiring board 24 is accommodated within a predetermined width. The flexible wiring board 25 also has a structure similar to that of the flexible wiring board 24 and has an IC chip 23 similar to the IC chip 22 mounted thereon.

The circuit board 21 is composed of an insulating substrate having a normal rigidity, and as shown in FIG.
A plurality of input terminal rows 45 of the flexible wiring board 24,
46, 47 corresponding to a plurality of output terminal rows 61, 62,
63, a plurality of output terminal rows 64 corresponding to the plurality of input terminal rows 45, 46, 47 of the flexible wiring board 25,
65, 66, the wiring board 80 on the carriage on the other surface
A contact 55 (see FIG. 2) connected to the connection portion 80a provided on the output terminal array 61, 62, 63, 64, 65, 66.
Has a wiring pattern (not shown) that connects the contact 55 with the contact 55. The input terminal row 4 of the flexible wiring board 24
5 terminals are connected to the terminals of the output terminal row 61 and the input terminal row 46
, The terminals of the input terminal row 47 are the terminals of the output terminal row 63, the terminals of the input terminal row 45 of the flexible wiring board 25 are the terminals of the output terminal row 64, The terminals of the terminal row 46 are connected to the terminals of the output terminal row 65, and the terminals of the input terminal row 47 are connected to the terminals of the output terminal row 66 in a one-to-one correspondence.

Further, as shown in FIGS. 9 and 13, with the flexible wiring boards 24 and 25 fixed to the circuit board 21, the side on which the flexible wiring boards extend (that is, I
The terminals of the terminal rows 46, 47 on the C chip holding portion 43 side and the terminal rows 62, 63, 65, 66 facing the terminals are
The terminal row 4 has a substantially circular shape in plan view and is on the opposite side.
5 and each terminal of the terminal row 61 facing it is substantially rectangular in plan view. Further, the terminals of the terminal row 47 closest to the IC chip holding portion 43 and the terminals of the terminal rows 63, 66 facing the terminal row 47 are formed to have a larger area than the terminals of the other rows. This is because when the terminals of the flexible wiring boards 24 and 25 and the circuit board 21 are soldered to each other, the flexible wiring board is bent from the connection portion with the circuit board, arranged in a curved state, or bent during assembly. This is also because it is difficult to peel off by increasing the soldering area on the side where peeling easily occurs.

Terminal rows 62, 63, 65 of the circuit board 21,
A through hole 72 penetrating the circuit board 21 is provided for each terminal of 66, and a conductive material forming each terminal extends along the inner surface of the through hole 72. The through hole 72 is located deviated from the center with respect to each terminal.

When connecting the flexible wiring boards 24 and 25 to the circuit board 21, the terminal row 6 of the circuit board 21 is connected.
For each of the terminals 1, 62, 63, 64, 65, 66,
Solder H (see FIG. 15) is applied in advance, the terminals of the flexible wiring boards 24 and 25 are made to correspond to the terminals of the circuit board 21, and the flexible wiring boards 24 and 25 are pressed against the circuit board 21 by a heat bar. When heated, the previously applied solder H melts,
Corresponding terminals are connected to each other. At this time, the excess solder H escapes to the through hole 72, so that the adjacent terminals are not short-circuited by the protruding solder. Further, on the flexible wiring boards 24 and 25, a solder resist S is formed so as to avoid the position where each terminal is covered, so that the melted solder does not flow out or flow into the adjacent terminals. Note that no solder resist is provided on the circuit board 21 over the entire terminal row.

Next, referring to FIG. 10, the recording head 1
The structures of 9 and 20 will be described. The recording head 1
Since both 9 and 20 have substantially the same shape, only the recording head 19 will be described here.
The description of 0 is omitted. FIG. 10 is an exploded perspective view of the recording head 19. As shown in FIG. 10, the recording head 19 is
A plurality of pressure chambers 116, which are formed by extending grooves in a direction orthogonal to the longitudinal direction of the cavity plate 110, are formed on the surface of the cavity plate 110 formed of a laminated structure of metal plates formed in a substantially rectangular shape. Plate 11
They are arranged in two columns in parallel along the longitudinal direction of 0. Then, on the cavity plate 110, the plate-type piezoelectric actuator 120 formed in a substantially rectangular plate shape is
The pressure chambers 116 are bonded so as to close the pressure chambers 116, and the head connecting portion 42 of the flexible wiring board 24 is bonded to the upper portion of the plate-type piezoelectric actuator 120 so as to overlap the plate-type piezoelectric actuator 120. . The two rows of pressure chambers 116 communicate with the two rows of ejection nozzle groups 7a and 7b on the lower surface, respectively, and eject ink downward. Two recording heads are provided with two rows of pressure chambers, respectively, so that ink of four colors is ejected.

FIG. 11 is an exploded perspective view showing a state where the plate type piezoelectric actuator 120 is separated from the cavity plate 110, and FIG. 12 is an exploded perspective view of the plate type piezoelectric actuator 120. 11 and 1
As shown in FIG. 2, the plate-type piezoelectric actuator 120
Is formed in a structure in which ten piezoelectric sheets 121 to 130 are laminated. In addition, each piezoelectric sheet 121 to 130
Among them, the piezoelectric sheets 126, 128, 130 are all formed in the same structure, and the piezoelectric sheets 126, 128, 130 are
On the upper surface of the drive electrode 1 having a narrow width at a position corresponding to each pressure chamber 116 provided in the cavity plate 110.
36 are formed respectively. Further, the end 136a of each drive electrode 136 is connected to each of the piezoelectric sheets 126, 128, 130.
Are formed so as to be exposed to the side surfaces 126a and 126b (similarly to other piezoelectric sheets).

Further, the piezoelectric sheets 123, 124, 12
5, 127, 129 are all formed in the same structure, and a strip-shaped common electrode 135, which is a common electrode for the plurality of pressure chambers 116, is formed on the upper surfaces of the piezoelectric sheets 123, 124, 125, 127, 129. Has been formed. In addition, the end portion 135 a of each common electrode 135 has a piezoelectric sheet 123,
The side surfaces 123a, 12 of 124, 125, 127, 128
3b (similar to other piezoelectric sheets) are formed so as to be exposed.

Further, on the upper surface of the uppermost piezoelectric sheet 121, the surface electrode 1 for each drive electrode 136 is formed.
31 and a surface electrode 132 for the common electrode 135
And are arranged side by side along the side surfaces 121a and 121b of the piezoelectric sheet 121. Further, the piezoelectric sheets 121 to 13 in the plate-type piezoelectric actuator 120
After stacking 0, the side electrodes 133 that electrically connect the drive electrodes 136 and the surface electrodes 131 and the common electrodes 135 and the surface electrodes 132 are electrically connected to the left and right side surfaces orthogonal to the upper surface or the lower surface thereof. Side electrodes 134 to be connected are each formed.

As shown in FIG. 9, the head connecting portion 42 of the flexible wiring board 24 is superposed on the upper surface of the piezoelectric actuator 120 of the recording head 19, and the head connecting portion 4 is attached to each surface electrode 131 of the piezoelectric actuator 120.
The terminals 53a of the two output lines and the terminals 52a of the common lines are soldered to the surface electrodes 132 in a one-to-one correspondence. The flexible wiring board 25 is similarly connected to the piezoelectric actuator 120 of the recording head 20.

In this way, the flexible wiring boards 24 and 25 are independently provided for the respective recording heads 19 and 20,
Since the IC chips 22 and 23 are provided for the respective flexible wiring boards 24 and 25, the common lines 52 are arranged on both long side edges of the flexible wiring boards 24 and 25, respectively.
The surface electrodes 132 corresponding to the common electrodes corresponding to the four rows of the injection nozzle groups of 20 are connected to the common line 52 and the circuit board 2 respectively.
It is possible to connect to the common potential, that is, the ground, through the common line of the one wiring pattern. If the flexible wiring boards 24 and 25 are composed of one insulating substrate and one IC chip is commonly used for four rows of jet nozzle groups, the inner two row jet nozzle groups of the four rows are used. The common line 52 to the circuit board 21 cannot be directly connected to the circuit board 21 and cannot have a sufficient common potential.
By configuring as described above, each recording head 19, 20
It is possible to easily connect each of the surface electrodes 132 to the circuit board and set the common electrode to a sufficient common potential.

Further, as shown in FIGS. 2 and 6, a leaf spring 95 is provided on the surface of the circuit board 21 on which the contacts 55 are provided. The leaf spring 95 is in contact with the heat sink 26 and is connected to the ground through the common wire in the wiring pattern on the circuit board 21.

FIG. 14 shows a state in which the recording heads 19 and 20, the flexible wiring boards 24 and 25, and the circuit board 21 are connected as described above, and FIG. 16 shows a state in which they are assembled to the head holder 18. Show. Recording head 1
The head cover 70 is put on the heads 9 and 20 so that the ejection nozzle groups 7a to 7d are exposed through the openings 70b and 70c of the head cover 70, and the heads 9 and 20 are adhesively fixed to the head holding portion 28 of the head holder 18. Circuit board 21
Is fixed to the projections 36 and 37 of the back wall 18b as described above.

At this time, the elastic material 27 made of rubber or resin material is bonded and fixed to the elastic material mounting portion 29 in advance, and the flexible wiring boards 24 and 25 are I-shaped.
The portion on which the C chip is mounted is arranged along the inclined surface of the elastic material 27, and the recording head 19 is bent at an obtuse angle as a whole while curving in an arc on both sides of the portion.
Circuit board 2 from bottom wall 18a where 20 is located to back wall 18b
Located across 1. Therefore, since a large force does not act on the flexible wiring boards 24 and 25 at the bent portions, the conductive wire on the flexible wiring boards 24 and 25 is not damaged.

The heat sink 16 covers the flexible wiring boards 24 and 25, and the outer peripheral portion thereof is adhesively fixed to the side wall 18d, the heat sink holding wall 40, etc. by an adhesive as described above. At this time, the inner surface of the heat sink 26 abuts the IC chips 22 and 23 to compress the elastic material 27. That is, the elastic material 27 allows the IC chips 22, 2
3 is pressed against the heat sink 26 in a heat conductive manner.
As a result, the IC chips 22 and 23 are attached to the heat sink 26.
It is not necessary to bond it to the
It is possible to effectively release the heat of the IC chips 22 and 23 without generating stress between the C chips 22 and 23 and the heat sink 26. In addition, the heat sink 26
Is connected to the ground via the circuit board 21 by the leaf spring 29, static electricity can also be discharged, and the IC chips 22 and 23 can be prevented from being destroyed by static electricity.

When the heat sink 16 is fixed as described above, the contact 55 of the circuit board 21 is not covered by the heat sink 26 but is exposed to the outside. When the head holder 18 is attached to the carriage 8, the contacts 55 of the circuit board 21 come into contact with the carriage-side connecting portion 80a and are connected to the main body side control board via the wiring board 80 and the flexible wiring board. It should be noted that the terminal rows 45, 46, 4 of the flexible wiring boards 24, 25 are provided without providing the circuit board 21.
It is also possible to expose 7 directly to the outside and bring it into contact with the substrate or the like on the carriage side.

The present invention is not limited to the above embodiment, but various modifications can be made. FIG. 17 is a plan view showing a modified example of the flexible wiring board.
8 is a sectional view taken along the line CC of FIG. FIG. 17
As shown in FIG. 3, the flexible wiring board 150 includes a substantially rectangular IC chip holding portion 151 a and a head connecting portion 15.
1b and a connecting portion 151c between the circuit board 21 and a strip-shaped insulator 151, and a plurality of conductive wires provided on the strip-shaped insulator 151. In addition, the strip-shaped insulator 151
An IC chip 155 that generates a driving voltage for driving the plate-type piezoelectric actuator 120 provided in the recording head is flip-chip mounted on the IC chip holding portion 151a.

The IC chip 155 has the power supply line 172 and the common line 17 for the power supply, as in the above embodiment.
Driven by the power source supplied by
A drive circuit that outputs an ejection signal to the output line 174 corresponding to each ejection nozzle of the ejection nozzle group based on the drive signal input from the No. 5 is incorporated. Flexible wiring board 151
Are symmetrical with respect to the longitudinal centerline of the flexible wiring board so as to respectively correspond to the ejection nozzle groups of two rows of the recording head, the power supply line 172, the common line 173, and the signal line 17
5, output line 174 and common line 1 for that output line
It has a wiring pattern composed of 62 and 165. In this embodiment, similar to the above-described embodiment, the common line 1 is provided along both longitudinal edges of the flexible wiring board 151.
62 is provided, and a common line 165 is provided along the longitudinal centerline of the flexible wiring board.

Common lines 162 and 165, a power line 172, and a common line 173 are provided in a connection portion 151c with the circuit board 21.
Also, each end of the signal line 175 is arranged to form a plurality of input terminal rows as in the above embodiment. On the flexible wiring substrate corresponding to the lower side of the IC chip 155, the power supply terminal 170 connected to the power supply line 172, the power supply terminal 171 connected to the common line 173, the terminal 175a connected to the signal line 175, the output line. A terminal 174b connected to 174 is provided. IC as shown in FIG.
Touch the terminals protruding from the chip 155 to these
The C chip 155 is adhesively fixed on the flexible wiring board. At this time, the common line 165 passing through the center of the flexible wiring board passes under the IC chip 155, but
Do not connect to the chip.

The head connecting portion 151b has an end portion of the output line 174, that is, a terminal 174, along both side edges in the longitudinal direction.
a is installed in rows, and common lines 162, 165 are provided at both ends of the row.
End portions, that is, terminals 162a and 165a are arranged. The surface electrode 131 for the drive electrode of the piezoelectric actuator 120 of the recording head is the terminal 174a of the output line 174.
Of course, in the above-described embodiment, only the surface electrode 132 at one end of the common electrode is connected to the terminal 162a of the common line 162 at the side edge. However, in the present embodiment, the common electrode is connected to the common electrode 162. Surface electrode 132 at the other end of the electrode
Is also connected to the terminal 165a of the central common line 165.

In the above-described embodiment, the common line 162 is connected from only one end of the common electrode to the common potential, that is, the ground. However, since the common electrode between the piezoelectric sheets is thin and has a large resistance value, There is a risk that the potential may rise at the portion of the common electrode far from the common line 162, and ink may not be ejected normally. However, with the above configuration, both ends of the common electrode can be connected to the ground, the rise of the potential can be suppressed over the entire common electrode, and normal injection can be performed from all the injection nozzles.

[0053]

As described above in detail, in the recording apparatus according to the first aspect of the invention, along the outer surface of the head holder,
A flexible wiring board having a drive circuit for driving the recording head is provided, and a heat sink is provided on the side opposite to the head holder with respect to the flexible wiring board,
Further, since the elastic member is provided between the flexible wiring board and the head holder, the flexible wiring board is freely deformed by the pressing force of the elastic member, and the drive circuit is pressed against the heat sink. The heat generated in the driving circuit can be effectively released to the outside, and stable driving can be performed.

Further, in the recording apparatus according to the second aspect of the invention, in addition to the effect of the first aspect of the invention, the flexible wiring board has a side wall of approximately L, which is composed of the first wall and the second wall. The end portion of the flexible wiring board, which is located along the outer surface of the V-shaped head holder and is located on the outer surface of the second wall, has a connection terminal for connecting to an external device. It is possible to connect the substrate to an external device and supply power or the like to the drive circuit from the external device.

Further, in the recording apparatus according to the third aspect of the invention, in addition to the effect of the second aspect of the invention, the flexible wiring board has an obtuse angle along the first wall and the inclined wall surface of the head holder. It is bent and further bent at an obtuse angle along the inclined wall surface and the second wall. That is,
Since the flexible wiring board is bent at an obtuse angle in two steps, the flexible wiring board is not locally subjected to a large load and is not damaged.

Further, in the recording apparatus of the invention according to claim 4, in addition to the effect of the invention described in any one of claims 1 to 3, a wiring board is provided on the carriage movable along the recording medium. A relay board having a contact for connecting the conductor on the flexible wiring board to the carriage is provided on the second wall of the head holder, and the heat sink exposes the contact of the relay board. Since it is fixed between the recording head and the relay board, the flexible wiring board can be covered and heat generated in the drive circuit on the flexible wiring board can be radiated to the outside.

Further, in the recording apparatus of the invention according to claim 5, in addition to the effect of the invention according to any one of claims 1 to 4, the heat sink is grounded to the ground through the relay board, The static electricity generated by the heat sink is
Since it escapes to the ground via the relay board, it is possible to prevent the drive circuit from being destroyed by static electricity.

Further, in the recording apparatus of the invention according to claim 6, in addition to the effect of the invention according to any one of claims 1 to 5, the drive circuit provided on the flexible wiring board is an IC.
Since it is a chip, the mounting space for the drive circuit on the flexible wiring board can be reduced.

[Brief description of drawings]

FIG. 1 is a perspective view showing an internal structure of an inkjet printer 1.

FIG. 2 is a perspective view of the recording head unit 17 as viewed from the back side of its bottom.

FIG. 3 is a perspective view of the recording head unit 17 as viewed from the back side of its bottom.

FIG. 4 is a side view showing a connection state between a recording head unit 17 and a carriage 8.

FIG. 5 is a plan view of the recording head unit 17 as seen from the upper surface side thereof.

6 is a cross-sectional view taken along the line AA of FIG.

FIG. 7 is a perspective view of the head holder 18 as viewed from the back side of its bottom.

FIG. 8 is a perspective view of the head holder 18 as viewed from the front side of the upper part thereof.

9 is a plan view showing flexible wiring boards 24 and 25 and recording heads 19 and 20. FIG.

10 is an exploded perspective view of the recording head 19. FIG.

11 is an exploded perspective view showing a state where the plate-type piezoelectric actuator 120 is separated from the cavity plate 110. FIG.

FIG. 12 shows a plate type piezoelectric actuator 1
FIG. 20 is an exploded perspective view of 20.

FIG. 13 is a plan view of the circuit board 21.

FIG. 14 is a perspective view showing a state in which flexible wiring boards 24 and 25 connected to a circuit board 21 are bent.

15 is a sectional view taken along the line BB of FIG.

FIG. 16 shows a head holder 18 including flexible wiring boards 24 and 25, a circuit board 21, and a recording head 1.
It is a perspective view showing the state where 9 and 20 are attached.

FIG. 17 is a plan view showing a modified example of the flexible wiring board.

18 is a cross-sectional view taken along the line CC of FIG.

[Explanation of symbols]

1 Inkjet Printer 2 Case 8 Carriage 10 Platen Roller 11 Guide Rod 12 Guide Member 13 Belts 14c, 14m, 14y, 14b Ink Cartridge 15 Nozzle Surface 16 CR Motor 17 Recording Head Unit 18 Head Holder 19, 20 Recording Head 21 Circuit Board 22 , 23 IC chip 24, 25 Flexible wiring board 26 Heat sink 27 Elastic material 45, 46, 47 Input terminal row 61, 62, 63, 64, 65, 66 Terminal row 80 Wiring board 80a Connection portion 95 Leaf spring H Solder S Solder resist

   ─────────────────────────────────────────────────── ─── Continued front page    F term (reference) 2C056 EA21 FA10 HA51 HA52                 2C061 AQ05 BB28 CG03 CG06 CG08                       CN03 CN11 CP05                 2C064 CC04 CC14

Claims (6)

[Claims] 1. A recording head having a plurality of recording elements for recording on a recording medium, a head holder for holding the recording head, and a head holder provided along an outer side surface of the head holder to provide flexibility. A flexible wiring board having a plurality of conducting wires provided on the strip-shaped insulator and a drive circuit for driving the recording head; and a drive circuit provided on the side opposite to the head holder with respect to the flexible wiring board. A heat sink that radiates the heat generated in step 1 to the outside; and an elastic member that is provided between the flexible wiring board and the head holder, wherein the drive circuit is on the flexible wiring board on the side opposite to the head holder. A recording apparatus, which is provided on the heat sink and is pressed against the heat sink by the pressing force of the elastic member. 2. The head holder is substantially L-shaped in side view from a first wall holding the recording head and a second wall standing upright from the first wall, and the flexible wiring board is The first of the head holders
Of the flexible wiring board located along the outer surfaces of the wall and the second wall, and located on the outer surface of the second wall has a connection terminal for connecting to an external device. The recording apparatus according to claim 1, wherein: 3. The head holder has an inclined wall surface that forms an obtuse angle with respect to both walls at a connecting portion between the first wall and the second wall, and the flexible wiring board is formed of the head holder. First
The recording apparatus according to claim 2, wherein the recording apparatus is bent at an obtuse angle along the wall, the inclined wall surface, and the second wall. 4. A carriage having the head holder mounted thereon and movable along a recording medium, wherein a conductor on the flexible wiring board is connected to a wiring board on the carriage on a second wall of the head holder. A relay board having contacts for connection, wherein the heat sink is fixed to the head holder by exposing the contacts of the relay board and covering the flexible wiring board between the recording head and the relay board. The recording apparatus according to any one of claims 1 to 3, wherein: 5. The recording apparatus according to claim 1, wherein the heat sink is connected to the ground via the relay board. 6. The recording apparatus according to claim 1, wherein the drive circuit is an IC chip.