JP2003078305A - Dielectric resonator and dielectric filter, and method of manufacturing them, and filter device and communication apparatus sharing them for transmitting and receiving antennae - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a dielectric resonator which is used mainly for a high-frequency radio apparatus or the like such as a portable telephone, etc., especially, a strip line type of dielectric resonator which can use high-permittivity material high in fQ value, and a dielectric filter using it. SOLUTION: The dielectric resonator consists of a first dielectric board, a resonator electrode which is fixed in contact onto that dielectric board, a second dielectric board which is fixed in contact onto that resonator electrode, and a resin junction layer layer which is arranged around the resonator electrode between the first and second dielectric boards. The resonator of this sort is equipped with an interstage coupling capacitive electrode which is buried in the above first dielectric board and couples the resonator electrodes between stages, and capacitively coupled electrodes for input and output which are buried in the second dielectric board and are capacitively coupled severally with the resonator electrodes. The above resonator electrodes are coupled in electromagnetic fields with each other, and the resonator electrode is provided with an input terminal and an output terminal, thus making a dielectric filter.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention can use a dielectric resonator mainly used in high frequency radio equipment such as a mobile phone and a dielectric filter using the dielectric resonator, particularly a high dielectric constant material having a high fQ value. The present invention relates to a stripline dielectric resonator structure and a method for manufacturing the same.

[0002]

2. Description of the Related Art In recent years, many dielectric filters have been used as high frequency filters for mobile phones, but there is a demand for further reduction in size and thickness, and band pass filters or band stop filters in the microwave region are being demanded. Various types of known microwave stripline filters are used. The resonator of the stripline filter is thin and suitable for surface mounting.The tri-plate type laminated dielectric resonator using the dielectric substrate is used in addition to the above bandpass filter, voltage control oscillator, frequency synthesizer, etc. Widely used in.

In these conventional dielectric resonators, after forming resonator electrodes made of Ag, Cu, etc. on a plurality of dielectric ceramic green sheets, these electrode materials do not melt 90
By co-firing at a low temperature of about 0 ° C., the dielectric substrates have been joined and integrated with the internal resonator electrode.

Further, it has been reported that a resonator having a structure in which a resonator electrode is sandwiched between dielectric substrates which are once sintered at a high temperature and welded with a glass frit or the like.

[0005]

However, in the above-mentioned conventional structure, since the dielectric material that requires simultaneous firing with the resonator electrode contains glass components such as glass frit and Bi, it is essentially a high temperature sintering type. There are problems that the quality of crystals formed during sintering is low, the dielectric constant is low, and it is difficult to obtain a high Q value, as compared with the above dielectric material. Further, in the above-described conventional co-fired dielectric resonator or a dielectric resonator in which a once-sintered dielectric substrate is welded with a glass frit, cracks may occur in the dielectric substrate or the glass frit depending on the thickness of the resonator electrode. There is a problem that the characteristics are deteriorated or become unstable due to the generation of the molten glass or the invasion of the molten glass between the resonator electrode and the dielectric substrate.

The present invention is to solve the above-mentioned conventional problems. A high temperature sintering type ceramic dielectric having a high Q value and a conductor having a low resistivity such as Ag or Cu having a sufficient thickness are used in the resonance portion. It is an object of the present invention to provide a low-loss dielectric resonator and a dielectric filter that can be made smaller and thinner by using the same.

[0007]

A dielectric resonator according to the present invention is a resonator formed by disposing first and second dielectric substrates and the dielectric substrate. , The dielectric substrate is placed in direct contact with the main surfaces of the pair of dielectric resonators, and the dielectric substrate is adhered with a resin bonding layer that surrounds the resonator electrodes interposed between the pair of dielectric substrates to bond the dielectric substrate to each other. The electrode is integrated with the dielectric substrate.

That is, the structure of the dielectric resonator of the present invention is such that the first dielectric substrate, the resonator electrode contact-fixed on the first dielectric substrate, and the contact-fixed on the resonator electrode. Done second
And a resin bonding layer which is disposed between the first and second dielectric substrates around the resonator electrode and adheres the dielectric substrate.

In the resonator of the present invention, both surfaces of the resonator electrode are
Since it directly contacts the dielectric substrate, it is possible to form a resonator electrode having a low resistance in close contact with a dielectric substrate having a high dielectric constant, and form a dielectric resonator having a high Q value. it can. Such a dielectric resonator can be a dielectric filter having excellent filter characteristics. In such a resonator, in particular, a ceramic dielectric is used for the dielectric substrate and a stripline type is applied to the resonator electrodes, whereby a stripline filter having a high Q value can be obtained.

A method of manufacturing a dielectric resonator according to the present invention comprises a step of disposing a resonator electrode made of a metal foil between a first and a second dielectric substrate and a step between the main surfaces of the pair of dielectric substrates. In the above step, a step of filling a resin adhesive in a gap generated by interposing the resonator electrode and a step of heating the dielectric substrate while applying pressure to cure the adhesive to form a resin bonding layer are included.

According to this manufacturing method, by curing the adhesive, the resonator electrodes are brought into direct contact with the main surfaces of the pair of dielectric substrates to obtain a dielectric resonator integrated by the bonding layer.
By using a dielectric substrate having a high Q value, it is possible to provide a dielectric resonator having excellent characteristics.

Another method of manufacturing the dielectric resonator of the present invention is
An adhesive for forming a bonding layer is pattern-printed on the main surface of the first dielectric substrate except for a region where the resonator electrode of the lower dielectric substrate is formed, and a bonding layer made of the adhesive is formed. The step of semi-curing, the step of printing and filling a conductive paste for forming a resonator electrode in the region where the resonator electrode is to be formed, and the step of forming a resonator electrode on the first dielectric substrate After aligning the main surfaces of the second dielectric substrate so as to face each other,
Heating the first and second dielectric substrates while pressurizing them from the outer surface to completely cure the adhesive and the conductive paste to integrate the bonding layer, the resonator electrode and the dielectric substrate.
Some consist of.

The dielectric substrate used in this manufacturing method is also
Dielectrics that are high temperature sintered and have a high dielectric constant and low dielectric loss can be utilized. Since the resonator electrodes formed of the conductive paste are bonded to the main surfaces of both dielectric substrates, a high resonator Q value can be realized.

Another manufacturing method of the present invention is to prepare an adhesive film having a hollowed-out hollow portion in the outer shape of a resonator electrode on a resin film, and dispose the metal foil resonant electrode in the hollowed-out portion. A step of arranging the adhesive film between two dielectric substrates, and heating while applying pressure from the outer surfaces of the two dielectric substrates to cure the adhesive film and form a resin bonding layer And a step of forming a laminated body by integrating the dielectric substrate and the resonator electrode with a resin bonding layer.

In particular, it is preferable that the adhesive film is provided with a plurality or a large number of the above-mentioned hollow portions, and a resonator electrode is arranged in each hollow portion, and a laminated body is provided for each dielectric resonator. If the step of cutting into pieces is included, a plurality of or a large number of resonators can be manufactured from one laminated body.

In this manufacturing method, an adhesive film is prepared into a prepreg having the above-mentioned cutouts, and on the other hand, if a large dielectric substrate covering a large number of cutouts is prepared, the above-mentioned method is used. There is an advantage that a large number of resonators or filters can be mass-produced.

As the adhesive film, an adhesive resin film can be used. As another adhesive film, a mixed film obtained by mixing an adhesive resin and an inorganic filler can be used. The hollow portion is prepared in advance so that the resonator electrode of the metal foil can be fitted therein.

The above-described method for manufacturing a dielectric resonator includes a step of pre-forming a dielectric substrate by firing a green sheet containing a ceramic dielectric powder at a high temperature, and the dielectric substrate obtained by high temperature sintering. Can be an excellent resonator dielectric having a high dielectric constant and a low dielectric loss.
In particular, it is preferable to fire the laminated body after laminating a plurality of dielectric ceramic green sheets.

The resonator of the present invention includes a single resonator electrode and can be used as a notch filter and as a voltage controlled oscillator. Further, it can be used as a band pass filter or as a band elimination filter by including a plurality of resonator electrodes in an array.

The present invention includes such a dielectric filter, and the dielectric filter includes a plurality of parallel resonator electrodes in a dielectric resonator, and the dielectric filter is provided on any one of the dielectric substrates of the dielectric resonator. An inter-stage coupling capacitance electrode that is embedded and can be electrostatically coupled to the resonator electrode, and is embedded in the other dielectric substrate so that it can be electrostatically coupled to each resonator electrode. Coupling capacitance for input and output Electrodes, and the resonator electrodes are electromagnetically coupled to each other to form a filter. This makes it possible to obtain a dielectric filter having a low loss and excellent filter characteristics.

In order to manufacture the dielectric filter having such a structure of the present invention, when forming the first dielectric substrate, an interstage is formed by printing or the like between a plurality of dielectric ceramic green sheets to be laminated. In the process of arranging the coupling capacitance electrode and firing it later, and in forming the second dielectric substrate, the input / output coupling capacitance electrode is arranged by printing or the like between the plurality of laminated dielectric ceramic green sheets. And firing to prepare dielectric substrates, and a dielectric filter is formed from these substrates based on the above-described method for producing a dielectric resonator.

In the dielectric filter manufactured as described above, the resonator electrode is close to the inter-stage coupling electrode built in the first dielectric substrate, and the resonator electrodes are electromagnetically coupled to each other, In addition, an input terminal and an output terminal are provided on the resonator electrode, which is disposed in the vicinity of the input / output coupling capacitance electrode incorporated in the second dielectric substrate.

This manufacturing method can include a step of forming an external electrode on at least a part of the outer surface of the dielectric substrate. In this case, the outer surface of the laminate is already covered with the outer electrode. Therefore, if cut, a resonator having an external electrode on the outer surface can be formed. However, according to this manufacturing method, the external electrodes are not formed on the dielectric substrate in advance, and a laminated body is formed by the above process, and the laminated body is cut into individual pieces, and the external electrodes are formed on the outer surface of the dielectric resonator. May be formed.

The dielectric filter of the present invention is a transmission filter inserted as a reception filter connected between the antenna and the high frequency stage of the receiver or as a transmission filter inserted between the antenna and the power amplification stage of the transmitter. Can be used as The antenna is shared by the transmitter and the receiver, and the dielectric filter is inserted as a receiving filter between the transmitting / receiving shared antenna and the high-frequency stage of the receiver, and at the same time, another dielectric filter is inserted in the shared antenna and the power amplification stage of the transmitter. It can be used by inserting as another transmission filter between and. In this way, the dielectric filter can be used in a wireless communication device using a transmitting / receiving shared antenna.

[0025]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiment 1. The dielectric filter of this embodiment includes a first dielectric substrate, a resonator electrode fixed on the substrate, and a second dielectric electrode mounted on the resonator electrode.
And a resin bonding layer formed around the resonator electrode between the pair of dielectric substrates,
The bonding layer bonds the pair of dielectric substrates to the bonding layer, and the resonator electrodes are held in direct contact with the main surfaces of the pair of dielectric substrates.

In the present invention, the resonator electrode includes a stripline resonator. As the resonator electrode, one in which a single strip line is arranged as a resonator between dielectric substrates can be used, but such a dielectric resonator is used as a signal elimination filter in a specific frequency band. It can be used as a notch filter or as a voltage controlled oscillator whose oscillation frequency is variable. Further, the resonator electrode can be used as a filter in which two or more stripline type resonance elements can be arranged in parallel between the dielectric substrates and the bandwidth is determined by electromagnetic coupling between the resonance elements. Such a dielectric resonator is used as a band pass filter and a band elimination filter. The resonator electrode has a structure in which it is particularly easy to use a pair of parallel stripline type resonant elements, and a filter having excellent characteristics can be formed. The following embodiments exemplify a dielectric-resonator in which a pair of parallel stripline-type resonance elements are arranged and a filter using the dielectric-resonator.

1 (a), 1 (b) and 1 (b) show an example in which a pair of parallel strip lines are used for the resonator electrodes 4a and 4b, the first dielectric substrate 2 is used. The resonator electrodes 4a and 4b fixed in direct contact with the surface of the first dielectric substrate, the fixed second ceramic dielectric substrate 3 in contact with the resonator electrodes 4a and 4b, and a pair of them. Between the dielectric substrates 2 and 3 and filling the periphery of the above-mentioned resonator electrodes 4a and 4b,
And a resin bonding layer 5 for bonding. In this example, the external electrode 1 covers the outer surfaces of the first and second dielectric substrates and serves as a high frequency shield.

Conventionally, copper Cu or silver Ag is used for the resonator electrode.
Despite using a material with excellent conductivity including
Although a sufficiently high Q value could not be obtained by performing simultaneous firing of these resonator electrode materials and the dielectric substrate, the present invention is directed to high temperature firing of the dielectric substrate and resin bonding between the substrate and the electrode. Since the assembly of the dielectric resonator including the joining by layers is carried out by separate and independent procedures, the dielectric having the high Q value of the high temperature sintered product can be joined and integrated as it is with the resonator electrode and the resin adhesive layer. Excellent characteristics as a resonator can be exhibited without deteriorating the characteristics of the fired ceramic dielectric and utilizing the high conductivity of the metal electrodes. The resonator having such a structure is provided as a small dielectric filter.

In the present invention, the dielectric substrate is made of ferroelectric ceramics, and the ceramic substrate also includes a glass substrate. In particular, the invention has a fQ value of the ceramic material constituting the dielectric substrate of 3 × 1 at 1 GHz.
It is preferable to use a material in the range of 0 ³ or more.

When the fQ value of the substrate material is lower than 3 × 10 ³ , a sufficiently high Q value cannot be obtained as a dielectric resonator and sufficient characteristics cannot be obtained as a filter. This is a characteristic that can be realized with a normal glass ceramic substrate, and is a characteristic that is low enough to be obtained by a resonator using a glass ceramic substrate co-fired with silver Ag or copper Cu.
On the other hand, it is difficult to realize a ceramic whose fQ exceeds 1 × 10 ⁵ with a ceramic having a dielectric constant of 30 or more.

As the high dielectric constant material, Ba--Ti--O system, B
a-Nd-Ti-O system or Ba-Sm-Ti-O system,
Bi-Nb-O-based, Zr-Ti-Mg-Nb-O-based oxide ceramics can be used. These dielectrics are
It is preliminarily sintered at a sufficiently high temperature to obtain a ceramic having a high dielectric constant and a low dielectric loss, which is used for a resonator and a filter.

As the dielectric material, a low temperature sinterable substrate such as a glass ceramic substrate having a slightly high fQ value or a Ba-Ca-Nb-O type oxide ceramic substrate can be used.
Similarly, a high Q resonator characteristic could be obtained.

The resonator electrode is formed between a pair of dielectric substrates by forming a strip line from a metal foil or a conductive paste as described later, and two such resonator electrodes are formed. The above strip lines are arranged in parallel so that adjacent strip lines can be electromagnetically coupled to each other.

When the dielectric resonator is used as a filter, an input electrode is coupled to one end of one strip line and an output electrode is coupled to one end of the other strip line with a small capacitance. And the electrodes for inter-stage capacitive coupling are arranged on the one end sides of both strip lines. Such a coupling electrode is embedded and held in the dielectric substrate. In particular, it is desirable that the resonator electrode has a wide portion in which the other end side of the resonator strip line is an open end and the open end side is wider than the one end side.

The metal foil includes a foil of a metal material containing copper Cu or silver Ag as a main component. Such a resonant electrode is
A copper foil, a silver foil, or a copper foil whose surface is plated with silver can be used. These materials are preferable because of their low resistivity.

For the resonator electrode, a conductive resin layer containing conductive particles can be used. Such conductive particles,
A metal powder containing copper Cu or silver Ag as a main component can be used. Silver powder or copper powder is preferably used as such powder. The resin or binder forming the paste is, for example, an epoxy resin or the like. The conductive resin layer is obtained by applying the paste on the substrate and curing the binder.

The use of the conductive paste for the resonator electrode increases the conductor resistance as the electrode as compared with the metal foil, but the electrode can surely adhere to the dielectric substrate due to the presence of the adhesive resin component. Therefore, the high fQ of the dielectric substrate can be effectively utilized, and as a result, stable resonator characteristics can be obtained.

The dielectric substrate preferably has high flatness and high smoothness in the surface area of the main surface facing the resonator electrode. In particular, when the resonator electrode is a metal foil, the surface roughness of the dielectric substrate is preferably 2.0 μm or less. If the surface roughness exceeds 2.0 μm, the conductor resistance of the metal foil increases, which is not preferable. In order to provide such flatness and smoothness, the sintered ceramic substrate is precisely polished. Generally, the surface roughness is 0.1
Although it is possible to reduce the thickness to less than or equal to μm, the polishing process requires time, resulting in an increase in cost.
The range of μm is preferable.

When the resonator electrode is a metal foil, the dielectric substrate has a surface warp of 10 μm between both ends of the resonator as a flatness of the main surface on which the resonance electrode is arranged.
The following is preferable, and the warpage at the shape level of the resonator is 1
When the thickness is 0 μm or more, a gap corresponding to the warp amount is formed between the metal foil and the dielectric substrate, which lowers the Q value of the dielectric resonator, which is not preferable.

This prevents the resin bonding layer or the like from intervening between the resonator electrode and the dielectric substrate, and directly contacts the resonator electrode and the dielectric substrate to prevent the Q value from decreasing. can do.

Further, the thickness of the resonator electrode 4 is preferably 50 μm or more in order to reduce the insertion loss as a dielectric filter. On the other hand, when the thickness of the resonator electrode is 400 μm or more, the thickness of the resonator itself becomes too large, and although the resonator has a high Q, it is difficult to reduce the thickness.
Therefore, the thickness of the resonator electrode is preferably in the range of 50 to 400 μm.

The resin bonding layer is filled between a pair of dielectric substrates sandwiching the resonator electrode so as to bond the both substrates. The resin bonding layer is made of a thermosetting or thermoplastic resin. An adhesive is used. At the time of bonding, the resonator may be heated to a low temperature necessary for curing, but the resonator does not need to be heated to a particularly high temperature, so that the resonator characteristics are not deteriorated. An epoxy resin can be used for such an adhesive layer.

The adhesive forming the resin bonding layer further comprises:
A composite material in which a thermosetting resin and an inorganic filler are mixed can be included. The mixing of the inorganic filler has a function of adjusting the thermal expansion coefficient of the resin bonding layer and bringing it closer to the expansion coefficient of the dielectric substrate to stabilize the bonding between the substrates.

It is preferable that the resin bonding layer has a dielectric constant lower than that of the dielectric substrate because high frequency loss between the resonator electrodes can be suppressed to a low level. In particular, the dielectric constant of the resin bonding layer is preferably 1/4 times or less that of the dielectric substrate. From this point as well, the epoxy resin is preferable as the resin forming the resin bonding layer.

Embodiment 2. This embodiment provides a method for manufacturing a dielectric resonator. In this manufacturing method, a resonator electrode made of a metal foil is used to separate each of the first and second dielectric substrates. The step of sandwiching between the main surfaces, the step of filling a resin adhesive between the main surfaces of the two dielectric substrates formed by interposing the resonator electrodes, and the resin bonding layer by heat curing the adhesive. Forming process,
Is included. The dielectric substrate used here is prepared in advance by high temperature sintering from a ferroelectric ceramic and has a high dielectric constant and a low dielectric loss. Such a ceramic substrate is manufactured by molding a green sheet into a single layer or multiple layers from a powder mixture of oxide fine powder and a suitable binder, degreasing and sintering at a sufficiently high temperature. The ceramic substrate can also be manufactured by a method of dry-molding an oxide powder into a sheet-shaped green compact and sintering the sheet at a high temperature.

In this embodiment, FIG. 2A and FIG.
In (b), the ceramic green sheet 11 is formed from a slurry formed by kneading a dielectric oxide powder and an organic binder.
Then, a desired number of green sheets are laminated, degreased and pre-baked, and then sintered at a high temperature to obtain a dielectric substrate 12.

External electrodes can be previously formed on the sintered substrate by deposition. FIG. 2C shows an external electrode forming step. A metal film of silver Ag, copper Cu or the like is formed as an external electrode except for the electrode forming portion on the main surface of the dielectric substrate. The external electrode 13 is formed by applying a metal paste and performing a baking process. Alternatively, the metal coating may be formed by metal plating or metal spraying. However, the step of forming the external electrode may be omitted, and the external electrode may be provided on the outer surface of the dielectric substrate of the manufactured dielectric resonator or filter.

In the step of forming the resonance electrode, the main surfaces of the first and second dielectric substrates sandwich the resonator electrode, and the resonator electrode is arranged at a predetermined position. A pair of resonator electrodes are arranged on the main surface of one of the dielectric substrates in a predetermined arrangement relationship, and the main surface of the other dielectric substrate is brought into contact with the resonator electrode to form a pair of dielectrics. A resin adhesive is filled in the gap between the substrates and cured to form a resin bonding layer.

In FIG. 2D, the principal surfaces of the first and second dielectric substrates are opposed to each other, and the resonator electrodes 15a and 1a are provided between them.
5b, a pair of parallel strip lines are arranged with a metal foil, and both surfaces of the metal foil are provided with the pair of dielectric substrates 12
It is brought into close contact with the main surfaces of a and 12b. After this, as shown in FIG. 2 (e), in the gap between the two dielectric substrates 12a and 12b,
In this example, an epoxy thermosetting resin is filled as the resin adhesive in this example. Next, the adhesive is cured by heating to the resin curing temperature while applying pressure between the dielectric substrates.

After the adhesive is hardened, as shown in FIG. 2 (f), the dielectric substrates 12a and 12a are formed by the resin bonding layer 16.
b is adhered to each other to obtain a dielectric resonator in which the resonator electrodes 15a and 15b are integrated between the substrates 12a and 12b.

In this manufacturing method, the resonator electrode 15
The epoxy resin adhesive can be injected into the gap between the dielectric substrates while a and 15b are pressed from both sides of the dielectric substrates 12a and 12b and brought into close contact with the main surfaces of these substrates. It is possible to adhere strongly without the adhesive intervening on the surface closely adhered to the dielectric substrate.

In the present invention, as seen in this embodiment, since a ceramic substrate which has been previously sintered at a high temperature is used, a dielectric having a high dielectric fQ value of about 3.5 × 10 ⁴ is used. A substrate can be used (in the conventional method,
Insufficient firing of ceramics, limit f of ceramic substrate
The Q value is about 3 × 10 ³ to 4 × 10 ³ ), and between the high temperature sintering and the ceramic substrate, about 50 to 400 μ.
Since a strip line of metal foil having a considerable thickness of m is arranged and bonded with an adhesive, the Q value of the conventional resonator (shield distance is 2 mm) at 2.1 GHz is 2
What was about 50 can be improved to about 320 to 350. Therefore, this dielectric resonator can be used for a filter to reduce insertion loss.

Example 1 In this example, a dielectric resonator was manufactured according to this embodiment, and its resonator characteristics were examined. In FIG. 2, in this embodiment, the dielectric substrate is
Ceramic powder of Zr-Ti-Mg-Nb-O-based oxide and acrylic binder are mixed to form a slurry, a predetermined number of ceramic green sheets 11 formed from the slurry are laminated, and fired at a high temperature of 1350 ° C. Thickness 1m
m of ceramic dielectric substrate 12. In this example, the external electrode 13 was formed by applying a conductive paste containing Ag as a main component while leaving a predetermined surface of the dielectric substrate and baking it at 850 ° C.

Next, these two dielectric substrates 12a,
Between the 12b, a thickness of 100 μm juxtaposed with copper foil,
Stripline resonator electrodes 15a, 15 having a width of 1 mm
b was placed and the dielectric substrates 12a and 12b were brought into close contact with the resonator electrodes. After the close contact, as shown in FIG. 2 (e), an epoxy resin adhesive was filled in the gap between the two dielectric substrates 12a and 12b, and heated and cured to prepare a dielectric resonator sample A.

As a comparative example, similarly to the above-mentioned embodiment, after arranging the resonator electrodes 15a and 15b on the dielectric substrates 12a and 12b, pressure was applied from both sides of the substrate, but the space between the substrate and the electrode was intentionally applied. A gap between the substrate and the electrode was provided without adhering, and an adhesive such as an epoxy resin was injected between the dielectric substrates and cured. In this way, samples B and C in which the adhesive was interposed between the resonator electrode and the dielectric substrate were similarly prepared.

[0056]

[Table 1]

Tests were carried out using these samples A to C. The test results are shown in Table 1. From the data shown in Table 1, it can be seen that the Q value sharply decreases when the adhesive layer penetrates even a small amount into the gap between the resonator electrode and the dielectric substrate. This shows that the resonator electrode and the dielectric substrate must be in direct contact with each other in the high Q factor resonator.

Embodiment 3. The method for manufacturing a dielectric resonator of the present invention includes a method of applying a conductive paste on a dielectric substrate to form a resonator electrode. In this manufacturing method, as shown in the second embodiment, a plurality of ceramic green sheets are laminated and a laminated board is sintered at a high temperature to be molded to use a dielectric substrate having a high fQ value.

In this embodiment, in order to apply the conductive paste for the resonator electrode onto the dielectric substrate, the resonator electrode on the dielectric substrate is placed on the main surface of the first dielectric substrate. Excluding the region to be formed, a step of pattern-printing a resin adhesive for forming the resin bonding layer and semi-curing the layer of the adhesive is included. Then, in the area where the resonator electrode is to be formed,
Using the layer of the adhesive as a mask, a step of applying a conductive paste for forming a resonator electrode on the main surface of the substrate is included.

Furthermore, after aligning the main surface of the second dielectric substrate so as to face the surface of the first dielectric substrate on which the resonator electrodes are formed, the first and second dielectric substrates are aligned. Is applied while being pressed from the outer surface to completely cure the semi-cured resin bonding layer and the conductive paste to integrate the resin bonding layer, the resonator electrode, and the dielectric substrate.

3A and 3B, as in FIGS. 2A and 2B shown in the above embodiment, a plurality of ferroelectric ceramic green sheets 11 are laminated and fired. By doing so, the dielectric substrate 12 is produced. In this embodiment, in FIG. 3 (c), the dielectric substrate has an external electrode 23 formed on the surface other than the electrode formation surface.

In the step of forming the adhesive pattern shown in FIG. 3D, a resin adhesive is selectively printed and applied on the upper surface of the first dielectric substrate to form an adhesive pattern, which is preliminarily prepared. By heating, the resin bonding layer 24 is brought into a B stage semi-cured state.

FIG. 3E shows the first dielectric substrate 2 described above.
A conductive paste 25 containing metal powder is printed and filled on the patterned resin bonding layer on 2b with a squeegee 26, and then on the first dielectric substrate 22b,
The second dielectric substrate 22a is arranged.

As shown in FIG. 3 (f), the resin bonding layer 24 and the conductive paste 2 in a semi-cured state by pressurizing and heating from both sides are used.
By curing No. 5, as shown in FIG.
The first and second dielectric substrates 22a and 22b sandwich the resonator electrodes 27a and 27b, and a dielectric resonator having an integrated structure joined by the resin joining layer 24 is obtained.

As the conductive paste, as described above, the metal paste obtained by kneading the metal powder and the binder of the thermosetting resin is used. The metal paste is used for forming the resonator electrode and at the same time as forming the dielectric substrate. It can also be adhered to.
As described above, silver or copper powder is used as the metal. For other conductive pastes, a thermally decomposable metal organic compound (for example, metal alkoxide (Me-O-R)) was used and applied on the first dielectric substrate masked by the adhesive layer. After that, it is also possible to thermally decompose (MOD method) by heating to deposit a metal in the pattern to form a resonator electrode.

Example 2 Next, a dielectric resonator manufactured by the manufacturing method of this embodiment was manufactured. 3A and 3B, a plurality of Ba—Nd—Ti—O ceramic green sheets 11 were stacked and fired at 1350 ° C. to obtain a sintered ceramic substrate 12. All the surfaces of the first and second dielectric substrates, except the main surface for forming the resonator electrode, are
The external electrode 23 was formed by baking the g paste.

On the first substrate, an epoxy resin adhesive is applied on the main surface by pattern-printing on the main surface while leaving the shape of the strip line which is the resonator electrode, and is heated. No. 24 was in a semi-cured state of B stage. First above
Of the dielectric substrate 22b of the dielectric substrate 22b on which the silver foil cut into the electrode shape is fitted in the area on the dielectric substrate which is not covered by the patterned resin bonding layer 24. The second dielectric substrate 22a was placed on the above, and the resin paste was melted and cured by heating at 150 ° C. while applying pressure of 3 MPa to both outer surfaces of the two substrates.
As a result, a dielectric resonator integrally joined by the resin joining layer 24 was produced.

In the comparative example, a similar sintered dielectric substrate having the external electrodes 23 baked thereon was used, and a glass paste as an adhesive was selectively printed and applied on the main surface of the first dielectric substrate. Performed to form a patterned bonding layer 24. In the same manner as in the above embodiment, the first step is to insert a metal foil of Ag into the upper surface of the substrate not covered with the bonding layer 24, and then perform the first step.
The second dielectric substrate 22a was placed on the dielectric substrate 22b. In this comparative example, pressure is applied from both sides at 3 MPa, but since this example is a glass paste, 600
The glass was heated to 0 ° C. to melt and bond the glass. In this way, the dielectric substrates 22a and 22b facing each other, the resonator electrodes 27a and 27b, and the glass bonding layer 24 were bonded to form a dielectric resonator. The test results of Examples and Comparative Examples are shown below.

[0069]

[Table 2]

As shown in Table 2, in the resonator structure of the laminated body of this embodiment, since the resin adhesive material as the resin bonding layer has a low bonding work temperature and a low elastic modulus, the resonator electrode It can be seen that and the ceramic dielectric substrate can be directly bonded, and the resonator exhibits a high Q value.

On the other hand, in the comparative example, by applying a glass adhesive layer, the dielectric substrates are welded to each other to form a dielectric substrate having a high Q and a resonator electrode having a high conductivity. Although the structure is such that they are directly joined, the actual result is that the Q characteristic is deteriorated. In the comparative example, the molten glass was flowed and interposed between the dielectric substrate and the resonator electrode, and a crack was generated around the electrode end portion. Cracks are caused by the difference in coefficient of thermal expansion between glass and ceramic dielectric.

Fourth Embodiment In the manufacturing method of the present invention, a metal foil to be a resonator electrode, and a semi-cured adhesive film provided with a hollowed portion for supporting the outer shape of the metal foil, as an electrode carrier film, prepregized, A method of sandwiching the prepreg between a pair of dielectric substrates and heating under pressure to integrate them is included. In this manufacturing method, a step of providing a hollow portion that is hollowed out in the outer shape of the resonator electrode in the adhesive film, and arranging the resonance electrode of the metal foil in the hollow portion, the adhesive film, The step of arranging between the second dielectric substrates, and heating while applying pressure from the outer surfaces of the above-mentioned two dielectric substrates to cure the adhesive film to form a resin bonding layer, and to resonate with the dielectric substrates. Forming a laminated body by integrating the container electrode with the resin bonding layer.

A large number of cutouts are arranged on the above-mentioned adhesive film, resonator electrodes are arranged on each cutout, and after the step of forming the laminated body, the laminated body is cut to form each dielectric resonator. The process of separating into 2 is adopted.

In this embodiment, in particular, a large number of resonator electrodes are arranged in advance on a prepreg, and a pair of upper and lower dielectric substrates are sandwiched between the respective resonator electrodes to integrate them, and then the dielectric resonator is formed. A large number of dielectric resonators can be produced by cutting and dividing the electrode carrier film using the resonator electrodes to be formed as a unit.

In FIGS. 4A to 4C, the first and second dielectric substrates 12 are formed by laminating and firing a plurality of ceramic green sheets 11 as in the above-described embodiment.
The process of making a and 12b is shown. Also in this example, the external electrodes are
Preformed on the outer surface of the substrate.

FIG. 4 (d) shows a process of preparing an electrode carrier film from an adhesive film. A thermosetting resin film 31 in a semi-cured state is attached to a resonator electrode, a strip line in this example. A large number of openings 32, which have a slightly larger shape than the shape, are provided, and strip lines 33 are provided in the openings 32, respectively.
A and 33b are fitted as shown by the arrow to form the electrode carrier film 34. This electrode carrier film 34 is
The resonator electrode 33 and the resin bonding layer 31 are integrally included.

Next, as shown in FIG.
First dielectric substrate 12b made in steps (a) and (b)
And the second dielectric substrate 12a are opposed to each other, and each resonator electrode carried on the electrode carrier film 34 is sandwiched and held between them, and pressure is applied to both surfaces of the substrate to heat the adhesive film. Let it harden. As a result, the dielectric substrate, the resonator electrode, and the resin bonding layer are laminated and integrated.

In this embodiment, a pair of opposed dielectric substrates are used as one set of dielectric substrates, and the dielectric substrates of each set are separated from each other. Therefore, as shown in FIG. 4 (f), the adhesive film between the adjacent dielectric substrates is cut (at the point B in the figure), and the dielectric resonator shown in FIG. 4 (g) is cut into individual pieces. obtain.

In this embodiment, the resin bonding layer 3
Although 1 is projected from both side surfaces of the dielectric substrate 12, FIG.
By changing the cutting point in (f), it is possible to cut so that the cutting portion of the resin bonding layer 31 is flush with the end surface of the dielectric substrate.

For the adhesive film 31 in the semi-cured state for the resin bonding layer, a thermosetting resin which itself has an adhesive property by heating is used. For example, an epoxy resin can be used. As described above, the adhesive film may be added with a thermosetting resin, for example, an epoxy resin, and an inorganic powder, for example, silica fine powder, as a filler.

A non-adhesive resin film may be used as the resin bonding layer used for the electrode carrier film 34. In this case, a thin epoxy adhesive having excellent adhesiveness is applied to the surface of the film. Bond the dielectric substrates together. As such a non-adhesive resin film, it is preferable to use a resin film such as polyester resin or fluororesin (for example, polytetrafluoroethylene) having a particularly small dielectric loss tangent and excellent dielectric properties. Such a resin bonding layer is advantageous because the Q value hardly decreases even when an electric field enters.

A feature of this embodiment is that the film-shaped resin bonding layer is provided with an opening for disposing the resonator electrode. Therefore, the shape of the opening is made larger than the shape of the resonator electrode. An advantage is that an arbitrary gap can be formed between the resin bonding layer and the resonator electrode, and the influence of the dielectric properties of the resin bonding layer around the resonator electrode can be reduced.

Embodiment 5. This embodiment uses the same electrode carrier film as the previous embodiment, but this embodiment uses the first and second dielectric substrates that are large enough to cover many resonant electrodes. The outer shape is intended for mass production of the dielectric resonator or filter.

As shown in FIGS. 5 (a) and 5 (b), a plurality of dielectric ceramic green sheets 41 are laminated and then fired at a high temperature so that the dielectric characteristics are excellent and the dimension is larger than the size of the resonator electrode. First and second dielectric substrates 4 which are extremely large
Make 2a and 42b.

In FIG. 5 (c), a large semi-cured thermosetting resin film 43 such as an epoxy resin is provided with a hollow portion, that is, an opening, and a pair of stripline resonator electrodes 44a, Insert 44b into the opening,
The electrode carrier film 45 is made. Thus, in the electrode carrier film 45, the resin bonding layer 43 already carries a large number of resonator electrodes 44.

This large electrode carrier film 45 is
As shown in FIG. 5C, a first dielectric substrate 42a,
When sandwiched between the second dielectric substrate 42b and FIG.
As shown in (d), the dielectric substrate 42, the resonator electrode 44, and the resin bonding layer 43 are laminated and integrated by heating from the outer surfaces of both substrates under pressure. At the point B in the figure, the laminated dielectric substrate 46 is cut into individual dielectric resonators.

In this embodiment, the external electrode 47 is formed on the outer surface of each of the cut dielectric resonators. Such external electrodes can be formed by the electrolytic plating method, the electroless plating method, the metal spraying method, or the like, as described above.

Sixth Embodiment The dielectric filter of the present invention is an inter-stage coupling capacitor that is embedded in the pair of stripline-type resonator electrodes shown in the above embodiment and the resonator electrodes and is interstage-coupled. The electrodes and the input and output coupling capacitance electrodes embedded in the second dielectric substrate and capacitively coupled to the resonator electrodes, respectively.

The cross-sectional structure of such a dielectric filter is
As shown in FIG. 6 (f), a pair of dielectric substrates are provided with resonator electrodes 59 a and 59 b between the pair of dielectric substrates 54 and 58, and a pair of dielectric substrates 5 is formed by a resin bonding layer 60.
4, 58 are joined. The inter-stage coupling capacitance electrode 52 is embedded in one of the dielectric substrates 54 so that the inter-stage coupling capacitance electrode 52 can be coupled with one end of both of the two resonator electrodes 59a and 59b at a high capacitance with a small capacitance. It is arranged. Two resonator electrodes 59 are provided on the other dielectric substrate 58.
An input side capacitive coupling electrode 56a capacitively coupled to one of a and 59b and an output side capacitive coupling electrode 56b capacitively coupled to the other of the resonator electrodes 59a and 59b are embedded separately from each other.

Such a dielectric filter applies the high frequency signal of the capacitive coupling electrode 56a on the input side to both sides,
According to the filter characteristic formed between the pair of resonator electrodes, the signal is filtered and output from the output side capacitive coupling electrode 56a.

In the manufacture of the dielectric filter, the step of forming the dielectric substrate shown in the manufacturing method shown in the above second to fifth embodiments is used for molding the capacitive coupling electrode. In particular, this step includes the step of burying a coupling electrode for capacitively coupling with the above-mentioned resonator electrode inside a ceramic dielectric substrate. The coupling electrode includes an input side capacitive coupling electrode for inputting a high frequency signal to the resonator electrode and an output capacitive coupling electrode for outputting a high frequency signal from the resonator electrode. Further, when the resonator electrodes are two or more stripline resonators, electrodes for interstage coupling for electromagnetically coupling the striplines are included.

These coupling electrodes are arranged inside the first and second dielectric substrates sandwiching the resonator electrodes,
They are face-to-face coupled with a small capacitance so as to be capacitively coupled with each resonator electrode. Normally, one of the dielectric substrates is embedded with the inter-stage coupling electrode, and the other dielectric substrate is separated from the input coupling electrode and the output coupling electrode, respectively, on the opposite side. It is arranged.

In the embodiment described below, the first dielectric substrate is printed with a metal paste for forming the inter-stage coupling electrode 54 on one surface of at least two high dielectric constant ceramic plates. Then, align the other ceramic plate with the green sheets so as to cover the metal paste,
After that, it is baked to form an integrated dielectric substrate in which the electrodes are embedded.

Similarly for the second dielectric substrate, the input / output capacitive coupling electrode is printed with metal paste on one surface of one of the high dielectric constant ceramic plates, and the same as the other high dielectric constant ceramic plate. They are also fired together to form an electrode-embedded dielectric substrate.

This metal paste uses a metal having a high melting point, such as platinum, palladium, nickel or the like,
In the high-temperature firing of the rack plate, the above-mentioned metal coupling electrode, which is sintered, is stably integrated with the dielectric substrate.

FIG. 6 (a) shows an extremely high Q value (specifically, fQ value of 3 ×) obtained by sintering at a high temperature of about 1350 ° C.
Two ceramic plates 51a and 51b obtained by laminating a plurality of ceramic green sheets made of a dielectric material having a size of 10 ⁴ to 5 × 10 ⁴ ) are used. In this example, an inter-stage coupling capacitance electrode 52 containing palladium is formed by printing on the upper surface of the ceramic plate 51b, and the ceramic plate 51 is formed thereon.
As shown in FIG. 6B, pressure is applied to sinter and sintering is performed at the firing temperature of the dielectric substrate. In FIG. 6C, an external electrode 53 is formed on the outer surface to form a substrate 54 for interstage coupling capacitance.

On the other hand, in the same process, the input / output coupling capacitance substrate 58 in which the input / output coupling capacitance electrodes 56a and 56b made of palladium are embedded inside the dielectric substrates 55a and 55b are formed.

As shown in FIG. 6C, the inter-stage coupling capacitance substrate 54 and the input / output coupling capacitance substrate 58 form the external electrode 53 on the outer surface of the ceramic. Furthermore, after the dielectric substrate is baked, the input / output coupling capacitor substrate 58 has input / output electrode terminals 57a, 5a, 5a, 5b formed by silver paste or silver spraying on its end faces.
7b is formed.

FIG. 6D shows a procedure similar to that of the second embodiment shown in FIG. 2. In this example, a pair of stripline-type resonators are used by using Ag-plated Cu metal foil. After the electrodes 59a and 59b are placed between the inter-stage coupling capacitance substrate 54 and the input / output coupling capacitance substrate 58 and are brought into close contact with each other, FIG.
As shown in (e), a thermosetting resin adhesive such as an epoxy resin is injected and filled into the gap between the substrates. This is heated at a predetermined temperature and cured to obtain a dielectric filter in which the dielectric substrate and the resonator electrode are laminated and integrated by the resin bonding layer 60 as shown in FIG. 6 (f).

Seventh Embodiment A pair of stripline resonators are used as the resonator electrodes of the dielectric resonator or the dielectric filter of the present invention. One end of each resonator is coupled to the input / output coupling electrode, but the other end is open. It is desirable that the end is wider and the open end side is wider than the one end side.

The resonator electrode having such a structure is shown in FIG. 7. The resonator electrodes 62a and 62b arranged in the pair of dielectric substrates 61 have wide portions 62aw on their open ends.
And 62 bw respectively. Since the wide portions provided in the pair of resonators are electromagnetically coupled to each other between the electrodes, the electromagnetic waves generated between the resonators can be adjusted by adjusting the shapes of the wide portions 62aw and 62bw and the mutual intervals. The amount of field coupling can be arbitrarily controlled to set the filter to desired characteristics according to its application, which improves the degree of freedom in filter design.

As described above, the dielectric substrate is formed from the above-mentioned ceramic material having a high dielectric constant by high temperature sintering as described above, but preferably, the smoothness and the flatness of the surface are enhanced. Are preferable for forming electrodes.
As described above, the average surface roughness is 0.1 μm to 2.
0 μm range and warp between both ends of the dielectric substrate is 1
It can be 0 μm or less. As a result, in particular, the frequency of contact between the resonator electrode using the metal foil and the surface of the dielectric substrate can be increased, the distance of the non-contact space between them can be made extremely small, and a resonator having an extremely high Q value can be obtained. be able to.

Instead of the metal foil used as the resonator electrode in the above embodiment, as the resonator electrode material, for example, copper powder or silver powder, or a conductive paste obtained by mixing the mixed powder of these with an organic binder is used. It can be printed.

The dielectric constant of the resin bonding layer is preferably 1/4 or less of the dielectric constant of the dielectric substrate, and the Q of the resonator is lowered by preventing the electric field from entering the resin bonding layer. Can be prevented.

In each of the above embodiments, an example in which the external electrode is formed on the outer surface of the dielectric substrate has been described.
The present invention is not limited to this, and the external electrode may be formed on at least a part of the outer surface.

A resonator having a necessary and sufficient thickness using a dielectric substrate having a high fQ value (preferably an fQ value of about 3 × 10 ⁴ to 5 × 10 ⁴ ) obtained by high temperature firing. Since the electrodes are integrated with the dielectric substrate by a resin or a resin bonding layer containing resin as a main component, the resonator Q has a high Q value (under a condition of a distance between shield electrodes of 2 mm).
It is possible to obtain a dielectric resonator having excellent filter characteristics such as low loss and a dielectric resonator having 0 to 350).

Eighth Embodiment The dielectric filter of the present invention can be used especially by inserting it between the wireless communication device and the antenna. For example, it is used as a receiving filter device that is inserted between an antenna and a high-frequency amplification stage of a receiver to separate a signal wave from an interfering wave. Also, it can be inserted between the antenna and the power amplification stage of the transmitter to be used as a transmission filter layer land for preventing unnecessary radiation from the transmitter. Further, one antenna is shared for the transmitter and the receiver, and one filter is connected between the antenna and the transmitter, and another filter is connected between the antenna and the receiver to prevent unnecessary radiation waves from the antenna. It can be used to reduce and reduce interference reception to prevent interference.

FIG. 7 shows a block diagram of a transmission filter or a reception filter for a shared antenna that splits a transmission wave and a reception wave of a mobile phone in a cellular radio telephone system.

By arranging the dielectric filters of the present invention at both ends of the matching circuit connected to the antenna as shown in FIG. 7, the conventional coaxial resonator having a large occupied space, which is used as a transmitting / receiving antenna. Can be replaced with, and a miniaturized antenna filter device can be obtained.

Further, by using the dielectric filter of the present invention or the above antenna duplexer in a communication device such as a mobile phone, it is possible to realize a downsized communication device having excellent characteristics. .

[0111]

The dielectric resonator of the present invention comprises a first dielectric substrate, a resonator electrode contacted and fixed on the dielectric substrate,
Since the second dielectric substrate contact-fixed on the resonator electrode and the resin bonding layer arranged around the resonator electrode between the first and second dielectric substrates are used, the dielectric A high-temperature sintered ceramic substrate having a high fQ value can be used as the substrate itself, and a resonator electrode having a high Q value is bonded by directly connecting the resonator electrodes to two dielectric substrates. A filter using this can be provided.

Since a ceramics dielectric having an fQ value in the range of 3 × 10 ³ to 1 × 10 ⁵ at 1 GHz can be used as the dielectric substrate, a resonator having a high Q value and a filter using the resonator can be used. Can be provided.

The surface roughness of the dielectric substrate is 0.1 μm to 2.
In the range of 0 μm, the amount of warpage of the surface of the dielectric substrate is
If the distance between both ends of the substrate is 10 μm or less, even if a metal foil is used as the resonator electrode, the metal foil is brought into direct contact with the dielectric substrate in a wide range, thereby reducing the conductor loss and reducing the resonator. Also, the Q value of the filter can be increased.

In the method for manufacturing a dielectric resonator of the present invention, the resonator electrode made of a metal foil is sandwiched between the main surfaces of the first and second dielectric substrates, and the resonator electrode is interposed. A resin adhesive is filled between the main surfaces of the two resulting dielectric substrates,
Since the resin bonding layer is formed by heating and curing the adhesive, the metal foil is brought into direct contact with the dielectric substrate in a wide range,
This makes it possible to manufacture a resonator and a filter in which the conductor loss is reduced and the Q values of the resonator and the filter are increased.

In the method for manufacturing a dielectric resonator of the present invention, the adhesive for forming the resin bonding layer is pattern-printed except the region where the resonator electrode is to be formed, and the adhesive is semi-cured. A region where a resonator electrode is to be formed is printed and filled with a conductive paste for forming a resonator electrode, and the resonator electrode of the first dielectric substrate and the second dielectric substrate are combined to form an adhesive and a conductive material. Since the paste is completely cured to integrate the resin bonding layer, the resonator electrode, and the dielectric substrate, a resonator in which the resonance electrode of the conductive paste is in close contact with the dielectric substrate can be obtained. Resonators and filters with values can be manufactured.

In the method for manufacturing a dielectric resonator of the present invention, an adhesive film having a hollowed-out hollow portion in the outer shape of the resonator electrode is prepared in the adhesive film, and the resonance of the metal foil is formed in the hollowed-out portion. The electrode is arranged and the adhesive film is
And the second dielectric substrate, and while heating from the outer surfaces of the two dielectric substrates, the adhesive film is cured by heating to form a resin bonding layer, and the dielectric substrate and the resonator are formed. Since the electrodes are integrated with the resin bonding layer to form a laminated body, each laminated resonator can be manufactured by cutting the laminated body into individual pieces. If it is realized, a large number of resonators and filters can be mass-produced.

[Brief description of drawings]

FIG. 1 shows an exploded perspective view (a) of a dielectric resonator according to an embodiment of the present invention and a vertical sectional view (b) of the dielectric resonator shown in FIG. 1 (a).

FIG. 2 is a vertical cross-sectional view (a to f) showing the method for manufacturing the dielectric resonator according to the embodiment of the present invention.

FIG. 3 is a vertical sectional view (a to g) showing a method for manufacturing a dielectric resonator according to another embodiment of the present invention.

FIG. 4 is a vertical cross-sectional view (a to g) showing a method for manufacturing a dielectric resonator according to another embodiment of the present invention.

FIG. 5 is a vertical sectional view (a to e) showing a method for manufacturing a dielectric resonator according to still another embodiment of the present invention.

FIG. 6 is a longitudinal sectional view (a to f) showing a method for manufacturing a dielectric filter according to still another embodiment of the present invention.

FIG. 7 is a cross-sectional view showing the shape of a resonator electrode of a dielectric resonator according to another embodiment of the present invention.

FIG. 8 is a block diagram of a wireless communication device in which a filter according to another embodiment of the present invention is connected between a transmitting / receiving shared antenna and a transceiver.

[Explanation of symbols]

2 Dielectric substrate 3 Dielectric substrate 4a Resonator electrode 4b resonator electrode 5 Resin bonding layer

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Toru Yamada             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. (72) Inventor Seiichi Nakatani             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. F term (reference) 5J006 HB04 HB17 JA01 LA02 LA21                       NA04 NC03

Claims (35)

[Claims] 1. A dielectric resonator including first and second dielectric substrates, and a resonator electrode disposed between the dielectric substrates, wherein the resonator electrode is a dielectric material. A dielectric resonator, which is disposed so as to be in close contact with a main surface of a substrate, and a resin bonding layer bonds between the main surfaces of the dielectric substrate around a resonator electrode. 2. The dielectric resonator according to claim 1, wherein the resonator electrodes are at least two parallel stripline resonators. 3. The dielectric resonator according to claim 1, wherein the dielectric substrate is made of a ceramic having an fQ value of 3 × 10 ³ or more at 1 GHz. 4. The dielectric substrate is Zr—Ti—Mg—Nb.
-O system, Bi-Nb-O system, Ba-Ti-O system, Ba-
4. The dielectric resonator according to claim 1, which is made of an Nd-Ti-O-based or Ba-Sm-Ti-O-based oxide ceramic. 5. The surface roughness of the dielectric substrate is from 0.1 μm to
The dielectric resonator according to any one of claims 1 to 4, wherein the range of 2.0 µm and the amount of warp of the surface of the dielectric substrate is 10 µm or less between both ends of the substrate. 6. The dielectric resonator according to claim 1, wherein the resonator electrode is made of a metal foil containing copper or silver as a main component. 7. The dielectric resonator according to claim 1, wherein the resonator electrode is made of a conductive paste in which a metal powder containing copper or silver as a main component is mixed with an organic binder. 8. The dielectric resonator according to claim 2, wherein the resonator electrode has a wide portion on the open end side of each stripline resonator. 9. The thickness of the resonator electrode is 50 μm to 400 μm.
The dielectric resonator according to claim 1, wherein the dielectric resonator has a thickness of μm. 10. The resin bonding layer has a dielectric constant that is ¼ or less the dielectric constant of the dielectric substrate.
The dielectric resonator according to any one of 1. 11. The dielectric resonator according to claim 1, wherein the resin bonding layer comprises a thermosetting resin and an inorganic filler mixed with the resin. 12. A dielectric resonator according to claim 1, and an inter-stage coupling capacitance electrode embedded in a first dielectric substrate of the resonator for inter-stage coupling between the resonator electrodes. Input and output coupling capacitance electrodes embedded in the second dielectric substrate and capacitively coupled to the resonator electrodes, respectively, and the resonator electrodes are electromagnetically coupled to each other,
A dielectric filter with an input terminal and an output terminal on the resonator electrode. 13. The dielectric filter according to claim 12, further comprising an external electrode that covers outer surfaces of the first and second dielectric substrates. 14. A filter which is a dielectric filter for an antenna according to claim 12, wherein the filter connected between the antenna and the final stage of the transmitter or between the antenna and the high frequency amplification stage of the receiver. . 15. A filter connected between a common antenna for transmission and reception and a final stage of a transmitter, and a filter connected between the antenna for transmitting and receiving and a high frequency amplification stage of a receiver. A dielectric filter for a dual antenna for transmission and reception, comprising the dielectric filter according to claim 1. 16. A transmission including the dielectric filter according to claim 12, a transmission / reception antenna, and a transmitter final stage and / or a receiver high-frequency amplification stage connected to the transmission / reception antenna by the dielectric filter. Wireless communication device including a receiver and a receiver. 17. A step of sandwiching a resonator electrode made of a metal foil between respective main surfaces of a first and a second dielectric substrate, and a step of forming two dielectric substrates with the resonator electrode interposed therebetween. A method of manufacturing a dielectric resonator, comprising: a step of filling a resin adhesive between main surfaces; and a step of forming a resin bonding layer by heating and curing the adhesive. 18. An adhesive for patterning a resin bonding layer is pattern-printed on the main surface of a high-temperature fired first dielectric substrate, except for a region where a resonator electrode is to be formed, to form an adhesive. A step of semi-curing; a step of printing and filling a conductive paste for forming a resonator electrode in a region where a resonator electrode is to be formed; and a step of forming a second electrode on the resonator electrode of the first dielectric substrate. The main surfaces of the dielectric substrates are opposed to each other, and the first and second dielectric substrates are heated while being pressed from the outer surfaces to completely cure the adhesive and the conductive paste, and resonate with the resin bonding layer. And a dielectric substrate are integrated with each other, and a method for manufacturing a dielectric resonator comprising: 19. A step of preparing an adhesive film having a hollowed-out portion in the outer shape of a resonator electrode in an adhesive film, and arranging a metal foil resonant electrode in the hollowed-out portion, and the adhesive. A step of arranging the film between the first and second dielectric substrates, and heating while applying pressure from the outer surfaces of the above-mentioned two dielectric substrates to cure the adhesive film to form a resin bonding layer. And a step of forming a laminate by integrating a dielectric substrate and a resonator electrode with a resin bonding layer, and a method of manufacturing a dielectric resonator. 20. The adhesive film is provided with a large number of the cutout portions, resonator electrodes are arranged in the cutout portions, and the laminate is cut after the step of forming the laminate. And a step of separating each dielectric resonator.
The manufacturing method according to 8 or 19. 21. The method according to claim 17, further comprising a step of firing a green sheet containing a ceramic dielectric powder at a high temperature to form the dielectric substrate.
9. The method according to any one of 9 above. 22. The method according to claim 17, wherein the resonator electrodes are at least two parallel stripline resonators. 23. The dielectric substrate is fQ at 1 GHz.
22. The manufacturing method according to claim 17, comprising a dielectric having a value in the range of 3 × 10 ³ to 1 × 10 ⁵ . 24. The dielectric substrate is Zr—Ti—Mg—N.
b-O system, Bi-Nb-O system, Ba-Ti-O system, Ba
The manufacturing method according to any one of claims 17 to 23, which comprises a dielectric of an oxide of a -Nd-Ti-O type or a Ba-Sm-Ti-O type. 25. The surface roughness of the dielectric substrate is from 0.1 μm to
2. The range is 2.0 μm, and the amount of warpage of the surface of the dielectric substrate is 10 μm or less between both ends of the substrate.
25. The manufacturing method according to any one of 7 to 24. 26. The manufacturing method according to claim 17, wherein the metal foil of the resonator electrode comprises a metal foil containing copper or silver as a main component. 27. The conductive paste of the resonator electrode comprises a paste obtained by mixing a metal powder containing copper or silver as a main component and an organic binder.
The method according to any one of 1 to 25. 28. The resonator electrode has a wide portion on the open end side of each stripline resonator.
7. The manufacturing method according to any one of 7. 29. The thickness of the resonator electrode is 50 μm to 40 μm.
29. The manufacturing method according to claim 17, wherein the thickness is 0 μm. 30. The manufacturing method according to claim 17, wherein the resin adhesive has a dielectric constant that is ¼ or less the dielectric constant of the dielectric substrate. 31. The method according to claim 17, wherein the adhesive or the adhesive film is a composite material comprising a thermosetting resin and an inorganic filler mixed with the resin. 32. A metal paste for forming an inter-stage coupling capacitance electrode is disposed between green sheets containing a ceramic dielectric powder, and is fired at a high temperature to obtain the first and second layers.
Between the step of forming either one of the dielectric substrates of, and the green sheet containing the ceramic dielectric powder,
31. A step of arranging a metal paste for forming capacitive coupling electrodes for input and output and firing at a high temperature to form the other dielectric substrate, and then the method according to any one of claims 17 to 30. A method of manufacturing a dielectric resonator comprising: a method of manufacturing a dielectric resonator, wherein the resonator electrodes are electromagnetically coupled to each other, and an input terminal and an output terminal are coupled to the resonator electrode. 33. The manufacturing method according to claim 32, wherein the manufacturing method further includes a step of previously forming an external electrode on the dielectric substrate. 34. The manufacturing method according to claim 32, wherein the manufacturing method includes a step of forming an external electrode on an outer surface of the dielectric substrate of each of the cut dielectric resonators. 35. The manufacturing method according to claim 33, wherein the external electrode is formed by an electrolytic plating method, an electroless plating method, or a thermal spraying method.