JP2003069122A - Optical data link - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical data link having a structure which can increase an area of a substrate whereon an electronic component to be stored in an optical data link is mounted. SOLUTION: An optical data link 1 has a mounting member 8, optical communication sub-assemblies 12, 14, wiring substrates 18, 22 and an electronic component 30. The mounting member 8 has a base 8a extending along a reference surface. The optical communication sub-assemblies 12, 14 and the wiring substrates 18, 22 are stored in a housing. The electronic component 30 is electrically connected to the optical communication sub-assembly 14 and is mounted on the wiring substrate 18. The wiring substrate 22 is electrically connected to the optical communication sub-assembly 12. The wiring substrate 18 is arranged to tilt at a first angle of π/2 radian or less to another reference surface perpendicular to the reference surface. The wiring substrate 22 is arranged to tilt at a second angle of π/2 radian or less to another reference surface.

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION The present invention relates to optical data links.

[0002]

2. Description of the Related Art An optical data link comprises an optical receiving subassembly, an optical transmitting subassembly, electronic components connected to the optical receiving subassembly, electronic components connected to the optical transmitting subassembly, and a package containing them. . The light receiving subassembly converts the received light into an electric signal. The electrical signal is processed by the electronic component and the processed electrical signal is provided via the lead terminal of the optical data link. The optical transmitter subassembly produces an optical signal in response to the drive signal. The drive signal is generated by an electronic component that processes the electrical signal provided through the lead terminals of the optical data link.

[0003]

There is a need to reduce the size of optical data links. Due to this downsizing, the components housed in the package also need to be downsized. On the other hand, there is a demand for higher performance of the optical data link.
For higher functionality, it is necessary to increase the number of parts accommodated in the package. Therefore, the inventors have discovered the problem that there is a demand for a structure of an optical data link that satisfies these conflicting requirements.

Therefore, it is an object of the present invention to provide an optical data link having a structure capable of increasing the area of a substrate on which electronic parts accommodated in the optical data link are mounted.

[0005]

One aspect of the present invention is an optical data link. The optical data link comprises a housing, first and second optical communication subassemblies, first and second substrates, and electronic components. The housing has a base portion that extends along the reference plane. The first and second optical communication subassemblies are housed in a housing. The first and second substrates are housed in the housing. The electronic component is electrically connected to the first optical communication subassembly and is mounted on the first substrate.
Further, the electronic component is electrically connected to the second optical communication subassembly and is mounted on the second substrate.

Since the first and second substrates are arranged so as to be inclined in the housing, the surface area of these substrates becomes large. Therefore, a larger electronic component or a higher-functional electronic component can be mounted.

[0007] Preferably, the first substrate is arranged so as to be inclined at a first angle of less than π / 2 radian with respect to another reference plane orthogonal to the reference plane. The second substrate is arranged so as to be inclined with respect to another reference plane at a second angle of less than π / 2 radians.

Another aspect of the invention relates to optical data links. The optical data link comprises an optical receiving subassembly, an optical transmitting subassembly, a housing, a first substrate,
A second substrate and an electronic component are provided. The light receiving subassembly receives light from a predetermined axis direction. The light transmitting subassembly emits light in the direction of a predetermined axis.
The housing has a base portion, and the base portion is provided along a first reference plane extending in a direction from the optical receiving subassembly to the optical transmitting subassembly.
The housing contains a light receiving subassembly and a light transmitting subassembly. The first substrate is arranged in the housing along a second reference plane that is inclined with respect to the first reference plane. The second substrate is arranged in the housing along the third reference plane that is inclined with respect to the first reference plane. The electronic component is mounted on the first substrate and is electrically connected to the optical receiving subassembly. Another electronic component is mounted on the second substrate and is electrically connected to the optical transmitter subassembly.

The first and second substrates are respectively the second
Since it is arranged along the third reference plane,
And the area of the component mounting surface of the second substrate is increased.

Yet another aspect of the invention relates to an optical data link. The optical data link includes a first substrate, a second substrate, an optical receiving subassembly, an optical transmitting subassembly, a housing, and electronic components. The first substrate is arranged so as to face the first side surface of the reference triangular prism extending in the direction of the predetermined axis, and the second substrate is arranged so as to face the second side surface of the reference triangular prism. ing. Electronic components are mounted on the first substrate, and other electronic components are mounted on the second substrate. The optical receiving subassembly is electrically connected to the first substrate and the optical transmitting subassembly is electrically connected to the second substrate. The housing mounts the first and second substrates, the optical receiving subassembly and the optical transmitting subassembly, and has a base portion arranged to face the third side surface of the reference triangular prism. The electronic component and the other electronic component are arranged in the electronic component arrangement area facing both the first and second substrates.

Since the first and second substrates are inclined so as to correspond to the side surfaces of the reference triangular prism, respectively,
And the area of the component mounting surface of the second substrate is increased.

In these optical data links, the base portion of the housing has a first lead terminal connected to the first substrate and a second lead terminal connected to the second substrate. . The first and second lead terminals have a bent portion that is bent toward the first and second substrates.

By arranging the substrate at an angle, the first
And the first and second necessary for connecting to the second substrate
The lead terminal length can be shortened.

Yet another aspect of the invention relates to an optical data link. The optical data link comprises a housing, first and second substrates, an optical receiving subassembly, an optical transmitting subassembly, and electronic components. The housing is
The first and second lead terminals are arranged and include a base portion extending along the reference surface. The first lead terminal has a first portion penetrating the base portion and a second portion bent at a predetermined angle with respect to the first portion except π / 2 radians. The second lead terminal has a first portion that penetrates the base portion and a second portion that is bent with respect to the first portion at a predetermined angle other than π / 2 radian.

The first substrate is electrically connected to the first lead terminal and is inclined in the housing so as to correspond to the bending of the first lead terminal. The second substrate is electrically connected to the second lead terminal and is inclined in the housing so as to correspond to the bending of the second lead terminal. The light receiving subassembly is electrically connected to the first substrate in the housing. The optical transmitter subassembly is electrically connected to the second substrate in the housing. The electronic component is mounted on the first substrate. Another electronic component is mounted on the second substrate.

Yet another aspect of the invention relates to an optical data link. The optical data link includes a housing, an optical receiving subassembly, an optical transmitting subassembly, first and second substrates, and electronic components. The housing is
The first and second lead terminals are arranged and include a base portion extending along the reference surface.

The light receiving subassembly has a plurality of lead terminals, each lead terminal having a bent end. The light receiving subassembly is positioned within the housing such that the end is oriented in a direction indicated by a first angle with respect to the reference plane that is less than π / 2 radians and greater than 0 radians. The lead terminals of the optical receiver subassembly are electrically connected to the first substrate, and the first substrate is tilted within the housing at an angle corresponding to the orientation of the lead terminals of the optical receiver subassembly. Electronic components are mounted on the first substrate.

The optical transmitter subassembly has a plurality of lead terminals, each lead terminal having a bent end. The optical transmitter subassembly is housed in a housing such that the end is oriented in a direction indicated by a second angle of less than π / 2 radians and greater than 0 radians with respect to the reference plane. The lead terminals of the optical transmission subassembly are
Is electrically connected to the second substrate, and the second substrate is
It is tilted into the housing at an angle corresponding to the orientation of the lead terminals of the optical transmitter subassembly. On the second substrate,
Equipped with electronic components.

Since the first and second substrates are tilted,
The area of the component mounting surface is increased. Further, since the optical receiving subassembly is arranged so that the end portions of the lead terminals face the direction indicated by the first angle, the length of the lead terminals required for connecting to the substrate can be shortened. . Further, since the optical transmission subassembly is arranged so that the end portions of the lead terminals face the direction indicated by the second angle, the length of the lead terminals required for connecting to the substrate can be shortened. .

Yet another aspect of the invention relates to an optical data link. The optical data link comprises a housing, first and second substrates, an optical receiving subassembly and an optical transmitting subassembly.

The housing includes a base portion and a wall portion. The base portion extends along the first reference plane. The wall portion has a second crossing portion that intersects the first reference surface on the base portion.
It extends along the reference plane. The wall portion has a first support surface provided so as to be inclined at a first angle with respect to the first reference surface. The first substrate is supported by the first support surface of the wall portion. The housing contains the optical receiving subassembly, and the optical receiving subassembly is electrically connected to the electronic components mounted on the first substrate. The wall portion also has a second support surface that is inclined at a second angle with respect to the first reference surface. The second substrate is supported by the second supporting surface of the wall portion. The housing contains the optical transmission subassembly, and the optical transmission subassembly is electrically connected to the electronic components mounted on the second substrate.

Since the first and second substrates are tilted,
The area of the component mounting surface is increased. The first and second substrates are reliably supported by their respective support surfaces.

In this optical data link, the optical receiving subassembly has a plurality of lead terminals, and each lead terminal has a bent end portion. The ends of these lead terminals are less than π / 2 radians and 0 relative to the reference plane.
Oriented in a direction indicated by a first angle greater than radians. Further, in this optical data link, the optical transmission subassembly has a plurality of lead terminals, and each lead terminal has a bent end portion. The ends of these lead terminals are oriented in a direction indicated by a second angle that is less than π / 2 radians and greater than 0 radians with respect to the reference plane.

The end portion of the lead terminal has a first angle or a second angle.
Since it is oriented in the direction indicated by the angle, the length of the lead terminal required to connect to the corresponding substrate is shortened.

In the above optical data link, the base portion of the housing has a first lead terminal connected to the first substrate and a second lead terminal connected to the second substrate. There is. The first lead terminal has a bent portion that is bent in a direction indicating the direction of the end of the lead terminal of the optical receiving subassembly. The second lead terminal has a bent portion that is bent in a direction indicating the direction of the end portion of the lead terminal of the optical transmission subassembly.

The orientation of the first lead terminal is aligned with the orientation of the end portion of the lead terminal of the optical receiving subassembly. The orientation of the second lead terminal is aligned with the orientation of the end portion of the lead terminal of the optical transmission subassembly.
Therefore, the length of these lead terminals required for connecting to the substrate is shortened.

In the optical data link described thus far, at least one of the first and second substrates is
You may make it arrange | position electronic components on the both surfaces. The area of the component mounting surface is further increased. In the optical data link, the housing has a conductive cover member that covers the first and second substrates, and the conductive cover member is bent to contact the first and second substrates. May be included. Each of the fingers serves to transfer heat from the substrate to the housing.
For optical data links, the housing may have a receptacle-type structure. One side of the first substrate may face one surface of the second substrate. It is possible to use another substrate having a different component mounting surface area on the substrate.

The above and other objects, features and advantages of the present invention will become more readily apparent from the following detailed description of the preferred embodiments of the present invention which proceeds with reference to the accompanying drawings.

[0029]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The findings of the present invention can be easily understood by considering the following detailed description with reference to the accompanying drawings shown as examples. Then,
An optical data link according to an embodiment of the present invention will be described with reference to the accompanying drawings. If possible, the same parts are designated by the same reference numerals.

(First Embodiment) Referring to FIG. 1, there is shown an optical communication module 1 according to an embodiment of the present invention.

The optical communication module 1 includes a housing 2 and
A first photoelectric conversion device 12 and a second photoelectric conversion device 14 are provided. The housing 2 can have a housing member 4 as well as a receptacle member 6. The housing member 4 supports the first and second photoelectric conversion devices 12 and 14. The receptacle member 6 includes receptacles 24, 26 extending in a predetermined axial direction.
Is provided. Receptacles 24, 26 are provided to receive an optical connector (eg, 52 in FIG. 7). The housing member 4 includes a mounting member 8 and a covering member 10.
Have. The mounting member 8 is a photoelectric conversion device 12,
Substrates 18, 22 for 14 are mounted. The covering member 10 includes the photoelectric conversion devices 12, 14 and the substrate 1.
8 and 22 are sandwiched between the mounting member 8 and the mounting member 8
It is installed in.

The housing 2, that is, the receptacle member 6, the mounting member 8 and the cover member 10, is provided with an opto-electric conversion device 12, so that it can be optically coupled to the optical connector (52 in FIG. 7) in the receptacles 24 and 26. An accommodation space in which 14 is accommodated is defined.

Each of the receptacle members 6 has a guide hole at the bottom portion which extends along a predetermined axial direction and reaches the receptacles 24 and 26. These guide holes guide the opto-electrical conversion devices 12, 14 such that their heads are aligned with a predetermined axis and project into the receptacles 24, 26. The receptacle member 6 also has a wall surface provided between the heads of the photoelectric conversion devices 12 and 14 inserted into the respective guide holes. This wall is light-
It serves to electrically shield between the electrical conversion devices 12, 14.

The mounting member 8 has a base portion 8a, a wall portion 8b and a ceiling portion 8c. The base portion 8a extends along a predetermined reference plane. The wall portion 8b is provided on one side of the base portion 8a and extends along the direction intersecting the reference plane. The ceiling portion 8c extends along the reference plane, and the wall portion 8c
It is provided at a position separated from b. Between the base portion 8a and the ceiling portion 8c, the photoelectric conversion devices 12, 1 are provided.
4 are arranged.

The base portion 8a has a series of lead terminals 20 for enabling electrical connection of the photoelectric conversion devices 12, 14. The lead terminal 20 is provided on the bottom surface of the base portion 8a facing a mounting substrate (not shown), and is bent at a predetermined position from the mounting surface of the base portion. The lead terminals 20 are arranged along the arrangement direction of the wiring boards 18 and 22. In the present embodiment, the lead terminals 20 are arranged in a predetermined axial direction.

The materials of the receptacle member 6 and the mounting member 8 are preferably made of a synthetic resin material such as liquid crystal polymer because it is easy to form a fine shape. The receptacle member 6 is preferably coated on its surface with a conductive film such as a plated film in order to enable electrical shielding. The receptacle member 6 is
It is fitted and fixed to the mounting member 8.

The terminal member 36 has the receptacles 24, 26.
Are arranged to contact along the bottom of the. Accordingly, the terminal member 36 is used to connect the receptacle member 6 to the reference potential line of the mounting board. For this reason, the terminal member 36 extends in the direction along the terminal pin 20 and includes one or more connection terminals 3 called stud pins.
6a. The terminal member 36 has a bridge portion that connects the pair of terminals 36 a through the bottom surface of the receptacle member 6 when there are a plurality of connection terminals 36 a. The bridge portion is housed in a recess provided on the bottom surface of the receptacle member 6. The terminal member 36 is held by the receptacle member 6 by being positioned in the outer frame of the guide hole and the recessed portion thereof and being fitted into the groove provided in the outer frame of the guide hole 30.

First and second photoelectric conversion device 1
Each of 2, 14 is capable of converting one of the optical and electrical signals to the other. These include an optical receiving subassembly that converts an optical signal into an electrical signal, and an optical transmitting subassembly that converts an electrical signal into an optical signal. The optical receiving subassembly includes a photoelectric conversion element portion including a semiconductor light receiving element, a housing that accommodates the photoelectric conversion element portion, and a lead terminal provided in the housing. The optical transmission subassembly includes an electro-optical conversion element unit including a semiconductor light emitting device, a housing that accommodates the electro-optical conversion element unit, and a lead terminal provided in the housing.

The wiring boards 18 and 22 are the component mounting surfaces 18
a, 22a and opposing surfaces 18b, 22b. The component mounting surfaces 18a and 22a and the opposing surfaces 18b and 22b extend along a predetermined axial direction. Component mounting surface 18a, 2
2a is provided with a wiring layer for enabling electrical connection between mounted components. Various electronic components or electronic elements are mounted on the component mounting surfaces 18a and 22a,
These electronic components or electronic elements are connected via a wiring layer. Also, the facing surfaces 18b and 22b may be mounted with electronic components or electrons. Further, the facing surfaces 18b and 22b may be provided with a conductive layer on substantially the entire surfaces thereof. This conductive layer is preferably connected to the reference potential line.

The wiring boards 18 and 22 also have the first holes 18c and 22c into which the photoelectric conversion elements or the connection pins of the photoelectric conversion elements (50 in FIGS. 6A and 6B) are inserted.
And second holes 18d and 22d into which the lead terminals 20 provided in the housing member are inserted. First holes 18c, 2
2c and the second holes 18d and 22d penetrate from one of the component mounting surface and the facing surface to the other. First hole 18
c and 22c are provided on one side of the wiring boards 18 and 22, respectively. The second holes 18d and 22d are provided along one side of the wiring board extending in a predetermined axial direction.

The wiring boards 18 and 22 are the component mounting surfaces 18
a and 22a are arranged so as to face each other. As a result, a predetermined space is secured between the wiring boards 18 and 22. The wiring boards 18 and 22 are arranged so as to be inclined with respect to the reference plane along which the base portion 8a extends, rather than being arranged in parallel. In order to define the angle of this inclination, the mounting member 8 has a pair of support surfaces 8d and 8e on the side edges of the wall portion 8b, support surfaces 8f and 8g on the opposite sides of the base portion 8a, and a ceiling portion 8c. Support surface 8 on the side
with h and 8i. The support surfaces 8d and 8e are provided so as to support the sides of the wiring boards 18 and 22. The supporting surfaces 8f and 8g are provided so as to support the lower sides of the wiring boards 18 and 22. The support surfaces 8h and 8i are provided so as to support the upper sides of the wiring boards 18 and 22.

The covering member 10 together with the mounting member 8 forms the first and second opto-electric conversion devices 12, 14 together.
To form a space for housing. The cover member 10 is preferably made of a conductive material. For this purpose, the covering member 10 may be made of metal, or may be provided with a conductive material at least on its surface. By this, the first
And serves to electrically shield the second opto-electrical conversion device 12, 14 and the wiring substrate 18, 22.

The cover member 10 includes side surface portions 10a and 10b.
And a lid portion 10c and a rear surface portion 10d. Side part 1
0a and 10b sandwich the wiring boards 18 and 22 from both sides. The lid portion 10c faces the base portion 8a, and side surface portions 10a and 10b are provided on opposite sides of the lid portion 10c. The rear surface portion 10d includes side surface portions 10a and 10b.
Also, it is adjacent to the lid portion 10c and intersects a predetermined axis along the direction in which the receptacles 24 and 26 extend. The cover member 10 also includes the side surface portions 10a and 10b and the rear surface portion 10a.
The connection terminal 10e provided in at least one of d can be provided. The connection terminal 10e is provided so as to be connected to the reference potential line of the mounting board when the optical communication module 1 is mounted on the mounting board. As a result, the reference potential line is applied to the cover member 10, so that the electrical shield characteristic can be reliably obtained.

The lid 10c is provided with one or more fingers 10f. The finger 10f has a lid 10
It is bent from c into the storage space. Due to this bending, an opening 10g is formed in the lid 10c. Finger 10
f is bent from the lid portion 10c, and thereby contacts the facing surfaces 18b and 22b of the wiring boards 18 and 22. Due to this contact, the heat generated in the wiring boards 18 and 22 propagates to the covering member 10. For this reason, the wiring board 22 has a pad metal layer 22e, and the wiring board 18 also has a pad metal layer (18e in FIG. 2). The covering member 10 radiates this heat into the air via the surface of the covering member 10. That is, the cover member 10 also serves as a heat sink.

Further, the wiring boards 18 and 22 can be provided with thermal vias made of metal in their insulating layers. This thermal via is preferably provided at the mounting position of the electronic component, and is connected to another conductive layer to make heat release efficient. The thermal via is connected to the pad metal layer 22e, but is electrically insulated from the electronic component. In FIG. 1, the wiring board 22 is moved in the direction indicated by the arrow A and attached to the mounting member 8, the wiring board 18 is moved in the direction indicated by the arrow C and attached to the mounting member 8, and the covering member 10 is attached. It is moved in the direction indicated by arrow B and attached to the mounting member 8. Thereby, the completed optical data link 1 is obtained.

FIG. 2 is a perspective view showing an optical data link 1 obtained by assembling the respective parts shown in FIG. In order to show the inside of the optical data link 1, a part of the covering member 10 is broken. FIG. 3 shows I-I of FIG.
A cross section along a line is shown. In FIG. 3, the board 18 is separated to show the mounting direction of the wiring board. 4A shows a perspective view of the optical data link 1 viewed from the front, and FIG. 4B shows a perspective view of the optical data link 1 viewed from the rear. In FIG. 4A, the board 16 on which the optical data link 1 is arranged is also shown. In FIG. 4B, the optical data link 1 is mounted on the substrate 16.

In FIG. 2, the wiring boards 18 and 22 are arranged so as to be inclined with respect to the reference plane along which the base portion 8a extends.

Referring to FIG. 3, the wiring board 22 is arranged so as to be inclined at an angle α ₁ with respect to the alternate long and short dash line 32a orthogonal to the reference plane. In order to maintain this inclination angle, the component mounting surface 22a of the wiring board 22 faces the supporting surfaces 8f and 8h, so that the wiring board 22 is supported by the supporting surfaces 8f and 8h. Further, at the same time, the supporting surface 8d may be cooperatively supported, or the supporting surface 8d
You may make it support by f and 8d or the support surfaces 8d and 8h. The angle α ₁ is greater than 0 radians and π
Less than / 2 radians. Due to the wiring board 22, the lead terminal 20 has a first portion 20a extending along the alternate long and short dash line 32a and an angle β ₁ (radian) with respect to the alternate long and short dash line 32a.
And a second portion 20b that is inclined at. The second portion 20b of the lead terminal 20 has a hole 22d in the wiring board 22.
Has been inserted into. To facilitate this insertion, the angle β ₁ is taken to be substantially equal to the angle π / 2−α ₁ (radians). The first photoelectric conversion device 12 is oriented at an angle γ ₁ (radian) so that the lead terminal 50 faces the direction of the alternate long and short dash line 38a. The lead terminal 50 of the first optical-electrical conversion device 12 has the hole 22 of the wiring board 22.
It is inserted in c. To facilitate this insertion, the angle γ ₁ is taken to be substantially equal to the angle β ₁ .

Referring to FIG. 3, the lead terminal 50 of the second photoelectric conversion device 14 is oriented at the angle γ ₂ (radian) in the direction of the alternate long and short dash line 38b. The lead terminal 20b is oriented at an angle β ₂ (radian) in the direction of the alternate long and short dash line 34b. When the wiring board 18 is moved in the direction of the arrow D, the lead terminal 50 and the lead terminal 20b of the second opto-electrical conversion device 14 are moved to the hole 18.
c and the hole 18d, respectively. Wiring board 18
By contacting the component mounting surface 18a with the supporting surfaces 8g and 8i, the wiring board 18 is positioned by the supporting surfaces 8g and 8i at an angle α ₂ (radian). Further, at the same time, the supporting surfaces 8e may support each other in cooperation, or the supporting surfaces 8g and 8e, or the supporting surfaces 8e and 8i.
You may make it support by. The angle α ₂ is greater than 0 radians and less than π / 2. The angle β ₂ is taken to be substantially equal to the angle π / 2−α ₂ (radian). Angle γ
₂ is taken to be substantially equal to the angle β ₂ .

FIG. 5 is a cross-sectional view taken along the line II-II in FIG. 4 (b). Referring to FIG. 5, the covering member 1
The finger 10f of 0 is in contact with the wiring boards 18 and 22. Component mounting surface 18a of wiring board 18
Is in contact with the supporting surfaces 8g and 8i of the mounting member 8, and the facing surface 18b is in contact with the finger 10f. Similarly, the component mounting surface 22 a of the wiring board 22 is the support surface 8 of the mounting member 8.
f, 8h, and the opposing surface 22b is the finger 10
It is in contact with f.

Referring to FIGS. 6A and 6B, there are shown photoelectric conversion elements and electro-optical conversion elements 44 included in the first and second photoelectric conversion devices 12 and 14. . Illustrative examples of the photoelectric conversion element 44 include a semiconductor light receiving element such as a photodiode (pin type photodiode or avalanche photodiode). Examples of the electro-optical conversion element 44 include a semiconductor light emitting element such as a light emitting diode and a semiconductor laser.

Opto-electrical conversion element and electro-optical conversion element 44
Each can be housed in a container 42, such as a package. The container 42 has an element housing portion 42a and a guide portion 42b.

A photoelectric conversion element and an electro-optical conversion element 44 are sealed in the element housing portion 42a of the container 42.
The element housing portion 42a has a base 42c formed of a metal material such as Kovar. A lens cap 42 made of a metal material such as stainless steel is provided on the base 42c.
d is installed. The element housing portion 42a is provided with a window portion 48 fixed to the lens cap 42d. The window portion 48 can transmit light associated with the photoelectric conversion element and the photoelectric conversion element 44, and can include a condenser lens. The lens cap 42d is inserted into a holder 42j made of a metal material such as stainless steel. The base 42c can also have a connection pin 50 for electrically connecting the photoelectric conversion element and the electro-optical conversion element 44. The container 42 is fixed to the respective wiring boards 18 and 22 via connection pins 50.
Each of the connection pins 50 is bent so that the optical axis 46 of the element 44 is along a predetermined axis.

The guide portion 42b has a guide member 42e made of a metallic material such as stainless steel. The guide member 42e is fixed on the holder 42j. A sleeve 42f made of a metallic material such as stainless steel is arranged outside the guide member 42e. Guide member 42
A split sleeve 42g made of a material such as zirconia is housed in e. The split sleeve 42g positions the stub 42h containing the optical fiber. The split sleeve 42g is fixed to the sleeve 42f via a fixing member 42i.

FIG. 7 is a side view of the optical communication module 1 according to this embodiment. The optical connector 52 is inserted into the optical communication module 1 from the direction of arrow 51.

8 (a), 8 (b), 9 (a), 9
(b), FIG. 10 (a) and FIG. 10 (b) are drawings showing that the area of the wiring substrate is increased according to the present embodiment. It is assumed that the optical data link housings shown in these figures have the same size. In the optical data link shown in FIGS. 8A and 8B, the wiring board is inclined with respect to the base portion. In this form, the size of the wiring board is represented by A and D. In the optical data link of the comparative example shown in FIGS. 9A and 9B, the wiring board is arranged vertically to the base portion. In this form, the size of the wiring board is represented by A and C. In the optical data link of the comparative example shown in FIGS. 10A and 10B, the wiring board is arranged parallel to the base portion. In this form, the size of the wiring board is represented by A and B. According to the comparative example, the area of the wiring board is increased by tilting the board.

In the optical data link shown in FIGS. 8A and 8B, by arranging the wiring boards obliquely,
A component mounting surface larger than the area of the wiring board of the optical data link of the comparative example can be obtained. Further, the length F of the lead terminal of the subassembly can be shortened compared with the lengths G and H of the lead terminals of the optical data link of the comparative example. Further, not only the receiving circuit board for the receiver and the transmitting circuit board for the transmitter can be separated from each other, but also the receiving circuit board and the transmitting circuit board are arranged so as to be highly inclined.
Therefore, the crosstalk is improved as compared with the optical data link arranged in parallel with the receiving circuit board and the transmitting circuit board.

FIG. 11 shows the bit error rate characteristic of the optical data link shown in the embodiment. The horizontal axis represents the optical input power (dBm), and the vertical axis represents the bit error rate. According to the experimental results, the bit error rate decreases to about 10 ^-10 as the optical input power increases. This indicates that the noise characteristic is improved. In this optical data link, the inclination angles of the two substrates are π / 3 radians, and the angle formed by the two substrates is 2π / 3 radians.

(Second Embodiment) FIG. 12 shows an optical data link according to another embodiment. In this embodiment, the size of one circuit board 19 is equal to that of the other circuit board 2.
Larger than the size of 3. One side 23c of the wiring board 23
Faces the component mounting surface 19a of the wiring board 19. This embodiment is suitable for an optical data link that requires different amounts of circuit components in the transmitter and the receiver. The circuit boards may be arranged not only symmetrically as in the first embodiment but also asymmetrically arranged as in the present embodiment. Also in the present embodiment, electronic elements may be arranged not only on the component mounting surface 19a of the wiring board 19 but also on the facing surface 19b. Further, the electronic elements may be arranged not only on the component mounting surface 23a of the wiring board 23 but also on the facing surface 23b.

(Third Embodiment) FIG. 13 shows an optical data link according to another embodiment. Referring to FIG. 13, the wiring board 18 is arranged so as to face one side surface of the reference triangular prism 60 extending in the direction of a predetermined axis.
The wiring board 22 is arranged so as to face another side surface of the reference triangular prism 60. The mounting member 8 has a base portion 8a arranged so as to face another side surface of the reference triangular prism. The electronic component and another electronic component are the wiring board 1
It is arranged in the electronic component arrangement area facing both 8 and 22. The electronic component placement area is shared by both the wiring boards 18 and 22. Therefore, the electronic component 6 is mounted on the wiring board 18.
4 is mounted and another electronic component 62 is mounted on the wiring board 22.
When mounted, the large electronic component 64 can occupy many areas of the electronic component placement area.

As described above, in the optical data link according to the present embodiment, since the wiring boards are arranged obliquely, the area available for mounting components is increased, and the size and functionality are small. Optical data link is realized. An optical data link capable of reducing the length of lead terminals of an optical communication subassembly is realized. Further, there is provided an optical data link having a structure in which the transmission wiring board and the reception wiring board can be arranged so as to be inclined (preferably orthogonal).
Therefore, noise immunity is improved and crosstalk is reduced.

In the optical data link in the comparative example, the transmission / reception function is realized on one wiring board. With a single substrate, the optical data link is easy to assemble. However, problems with crosstalk in the wiring board are likely to occur. In order to solve this problem, it is necessary to devise a circuit design. In the optical data link in another comparative example, the transmission function and the reception function are realized on different wiring boards. The use of two circuit boards solves the crosstalk problem, although the optical data link assembly is relatively complex.

However, as the miniaturization of the optical data link progresses, it is necessary to make the wiring board smaller. On the other hand, it is required to make the optical data link highly functional. Higher functionality increases the number of circuit components.

In order to improve resistance to external noise and crosstalk, it is possible to shorten the wiring distance between the wiring board through which a weak electric signal flows and the lead pin of the subassembly and the wiring distance between the wiring board and the outer leads. Desired. However, since the position of the subassembly and the position of the outer lead of the optical data link are specified in the optical data link standard, it is not easy to shorten the wiring distance in the structure of the optical data link of the comparative example. Absent. When the data signal includes a high frequency, the quality of communication is easily affected by noise and crosstalk. In future optical data link design,
Achieving higher functionality is required.

According to the arrangement of the wiring board of the optical data link of this embodiment, the space in the optical data link can be effectively used. For example, when the transmitting circuit requires more electronic components than the receiving circuit, the asymmetrical arrangement of the wiring boards makes it possible to provide the transmitting circuit with a large component mounting area. Moreover, in the optical data link of the present embodiment, the distance between the wiring board and the lead terminal of the subassembly can be shortened by arranging the wiring board diagonally, and the distance between the wiring board and the outer lead can be shortened. This provides a structure capable of reducing the inductance due to the wiring. Further, the substrate for the transmission circuit is arranged so as to be inclined relative to the substrate for the reception circuit. By inclining the substrate for the transmitter circuit and the substrate for the receiver circuit at an angle close to a right angle, preferably, at a right angle,
A structure capable of suppressing electromagnetic coupling between these substrates is provided.

While the principles of the invention have been illustrated and described in the preferred embodiment, those skilled in the art will recognize that the invention can be modified in arrangement and detail without departing from such principles. For example, the case where the wiring boards connected to the two subassemblies included in the optical data link are tilted has been described, but the present invention is not limited to this. Also, the optical data link may include more than one optical receiving subassembly and may include more than one optical transmitting subassembly. We therefore claim all modifications and variations coming within the scope and spirit of the claims.

[0067]

According to the present invention, there is provided an optical data link having a structure capable of increasing the area of a substrate on which electronic components accommodated in the optical data link are mounted.

[Brief description of drawings]

FIG. 1 is a drawing showing main components of an optical data link according to a first embodiment.

FIG. 2 is a perspective view of an optical data link according to the first embodiment.

FIG. 3 is a cross-sectional view corresponding to the I-I cross section of FIG. 1.

FIG. 4 (a) and FIG. 4 (b) are drawings showing the external appearance of the optical data link according to the first embodiment.

5 is a cross-sectional view taken along the line II-II of FIG. 4 (b).

FIG. 6 (a) and FIG. 6 (b) are drawings showing a subassembly.

FIG. 7 is a side view showing a connection between an optical connector and an optical data link.

FIG. 8A and FIG. 8B are diagrams showing a substrate area in the first embodiment.

9 (a) and 9 (b) are drawings showing a substrate area in a comparative example.

FIG. 10 (a) and FIG. 10 (b) are drawings showing the substrate area in another comparative example.

FIG. 11 is a noise characteristic diagram.

FIG. 12 is a cross-sectional view showing an optical data link according to a second embodiment.

FIG. 13 is a cross-sectional view showing an optical data link according to a third embodiment.

[Explanation of symbols]

1 ... Optical data link, 2 ... Housing, 4 ... Housing member,
6 ... Receptacle member, 8 ... Mounting member, 10 ... Covering member, 12, 14 ... Photoelectric conversion device, 18 ... Wiring board, 18a ... Component mounting surface, 18b ... Opposing surface, 20 ... Lead terminal, 22 ... Wiring board , 22a ... Component mounting surface, 22b
... facing surface, 24, 26 ... receptacle, 8a ... base portion, wall portion ... bb, 8c ... ceiling portion, 8d, 8e, 8f, 8
g, 8h, 8i ... Supporting surface

Continued front page    (72) Inventor Ichiro Torauchi             Sumitomoden 1 Taya-cho, Sakae-ku, Yokohama-shi, Kanagawa             Ki Industry Co., Ltd. Yokohama Works F term (reference) 5F041 AA47 DC22 DC84 FF14                 5F073 BA01 FA06 FA16 FA21 FA30                 5F088 BA15 BA16 BB01 JA20

Claims (13)

[Claims] 1. A housing having a base portion extending along a reference plane, first and second optical communication subassemblies housed in the housing, and first and second substrates housed in the housing. An electronic component electrically connected to the first optical communication subassembly and mounted on the first substrate; and an electronic component electrically connected to the second optical communication subassembly and mounted on the second substrate. An electronic component, the first substrate is arranged so as to be inclined at a first angle with respect to another reference plane orthogonal to the reference plane, and the second substrate is different from the other reference plane. An optical data link arranged to be inclined at a second angle with respect to the reference plane. 2. An optical receiving subassembly that receives light from a predetermined axis direction, an optical transmitting subassembly that emits light in the predetermined axis direction, and the optical transmitting subassembly from the optical receiving subassembly. A base having a first reference surface extending in a direction toward the assembly, the housing housing the optical receiving subassembly and the optical transmitting subassembly, and the first reference surface. A first substrate arranged in the housing along an inclined second reference plane, and a housing arranged in the housing along a third reference plane inclined with respect to the first reference plane A second substrate, and the first substrate electrically connected to the optical receiving subassembly.
And an electronic component mounted on the substrate of the second electronic component, and electrically connected to the optical transmission subassembly.
An optical data link including electronic components mounted on the substrate of. 3. A first substrate arranged to face a first side surface of a reference triangular prism extending in a predetermined axis direction, and a first substrate arranged to face a second side surface of the reference triangular prism. A second substrate, an optical receiving subassembly electrically connected to the first substrate, an optical transmitting subassembly electrically connected to the second substrate, and a third side surface of the reference triangular prism. A housing having a base portion disposed so as to face the first and second substrates, the optical receiving subassembly and the optical transmitting subassembly, and an electronic component mounted on the first substrate And an electronic component mounted on the second substrate, wherein the electronic component is arranged in an electronic component arrangement region facing both the first substrate and the second substrate, optical data Link. 4. The base portion of the housing is the first portion.
A first lead terminal connected to the second substrate, and a second lead terminal connected to the second substrate, wherein the first and second lead terminals are the first and second
The optical data link according to any one of claims 1 to 3, wherein the optical data link has a bent portion that is bent toward the substrate. 5. A housing including a base portion in which first and second lead terminals are arranged and extending along a reference plane, wherein the first lead terminal includes a first portion penetrating the base portion and the housing. The second lead terminal has a second portion bent at a predetermined angle excluding π / 2 radian with respect to the first portion, and the second lead terminal passes through the base portion and the first portion. It has a second portion bent at a predetermined angle excluding π / 2 radian with respect to the first portion, and is accommodated in the housing while being inclined so as to correspond to the bending of the first lead terminal. And a first substrate electrically connected to the first lead terminal, tilted to accommodate the bending of the second lead terminal, housed in the housing, and electrically connected to the second lead terminal. With a second substrate electrically connected An optical receiver subassembly housed in the housing and electrically connected to the first substrate; and an optical transmitter subassembly housed in the housing and electrically connected to the second substrate, An optical data link comprising: electronic components mounted on a first substrate; and electronic components mounted on the second substrate. 6. A housing including a base portion in which first and second lead terminals are arranged and extending along a reference plane, and a plurality of lead terminals whose ends are bent, and the lead terminals are bent. The edge is π with respect to the reference plane.
A light receiving subassembly disposed in the housing in a direction indicated by a first angle of less than / 2 radians and greater than 0 radians, and a plurality of lead terminals bent at their ends, The bent end of the lead terminal is π with respect to the reference plane.
An optical transmitter subassembly housed in the housing oriented in a direction indicated by a second angle of less than / 2 radians and greater than 0 radians, and electrically connected to the lead terminals of the optical receiver subassembly. A first substrate tilted in the housing at an angle corresponding to the orientation of the lead terminals of the light receiving subassembly; and the first substrate electrically connected to the lead terminals of the light transmitting subassembly. A second substrate tilted in the housing at an angle corresponding to the direction of the lead terminal of the optical transmission subassembly; electronic components mounted on the first substrate; and mounted on the second substrate. Optical data link with electronic components. 7. A base portion extending along the first reference plane,
And a housing including a wall portion on the base portion that extends along a second reference surface that intersects the first reference surface, the wall portion having a first angle with respect to the first reference surface. And a second support surface that is inclined at a second angle with respect to the first reference surface, the wall portion having a first support surface that is inclined. An electronic component mounted on the first substrate, comprising: a first substrate supported by a first supporting surface of the wall; and a second substrate supported by a second supporting surface of the wall. An optical receiver subassembly electrically connected to the housing and housed in the housing; and an optical transmitter subassembly electrically connected to an electronic component mounted on the second substrate and housed in the housing. Data link. 8. The optical receiver subassembly has a plurality of lead terminals, each lead terminal having a bent end portion, and the bent end portions of the lead terminals are the reference terminals. Oriented in a direction indicated by a first angle that is less than π / 2 radians and greater than 0 radians with respect to a plane, the optical transmission subassembly has a plurality of lead terminals, each lead terminal being bent. Bent ends of the lead terminals are oriented in a direction indicated by a second angle of less than π / 2 radians and greater than 0 radians with respect to the reference plane. The optical data link according to claim 7. 9. The base portion of the housing includes the first portion.
A first lead terminal connected to the substrate, and a second lead terminal connected to the second substrate, wherein the first lead terminal is the lead terminal of the optical receiving subassembly. The second lead terminal has a bent portion that is bent in a direction indicating an end direction, and the second lead terminal is bent in a direction indicating an end direction of the lead terminal of the optical transmission subassembly. 9. The optical data link according to claim 6, which has a bent portion. 10. The optical data link according to claim 1, wherein at least one of the first and second substrates has electronic components arranged on both surfaces thereof. 11. The housing has a conductive cover member that covers the first and second substrates, and the conductive cover member is bent so as to come into contact with the first and second substrates. 9. The optical data link according to claim 1, which has a plurality of finger parts formed therein. 12. The optical data link according to claim 1, wherein the housing has a receptacle type structure. 13. The optical data link according to claim 1, wherein one side of the first substrate faces one surface of the second substrate.