JP2003068556A - Method of removing insulating coating film and method of manufacturing coil device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To remove an insulating coating film (10) made of polyether-sulfone resin by pressure-contacting a high-temperature iron (21) to the surface of an insulated conductor wire (1) having an insulating coating film (10) to expose the conductor (11), which is able to be soldered. SOLUTION: This method of removing an insulating coating film is constituted by setting the heating time X (seconds) and the heating temperature Y( deg.C) of the iron (21) so as to satisfy the formula Y<-20X+540.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for removing an insulating film from an insulated conductor and a method for manufacturing a coil device.

[0002]

2. Description of the Related Art In recent years, an insulated conducting wire (1) as shown in FIG. 8 has been used as a conducting wire for a coil which constitutes a transformer. The insulated conductor (1) has three layers (1) on the surface of the copper conductor (11).
The insulating film (10) is composed of 0a, 10b, and 10c, and the insulating film 10 is made of polyethersulfone resin and has a very excellent insulating performance.

A manufacturing process of a transformer using the insulated conductor (1) includes a coil winding process and a soldering process. In the coil winding process, as shown in FIG. The insulated wire (1) is fed out, and the winding wire nozzle (61) is passed through the insulated wire (1). The winding wire nozzle (61) is installed on the bobbin (80) so as to project. One terminal part (81)
After fixing it to the bobbin, attach the insulated conductor (1) to the bobbin a predetermined number of times.
Wind around (80). Next, the insulated conductor (1) is entangled with the other terminal portion (81) protruding from the bobbin (80), and the insulated conductor ( The coil device (8) is manufactured by cutting 1). The soldering process is
The terminal portion (81) around which the insulated conducting wire (1) is entangled is immersed in the molten solder bath for a predetermined time, then extracted from the molten solder bath and allowed to cool. According to the soldering step, the insulating coating of the insulated conductor entangled in the terminal portion is melted by the heat of the molten solder while being immersed in the molten solder bath, and the conductor is thereby exposed. The conductor (11) of (1) and the terminal portion (81) of the bobbin are soldered.

[0004]

In order to melt the insulating film (10) made of polyethersulfone resin by heat as described above, it is necessary to set the temperature of the molten solder to 500 ° C. or higher. When the temperature of the molten solder is 500 ° C. or higher, there is a problem that the bobbin is thermally damaged by the heat of the molten solder while the terminal portion of the bobbin is immersed in the molten solder bath. Therefore, in order to set the temperature of the molten solder to about 400 ° C., which does not cause heat damage to the bobbin, it is necessary to remove the insulating coating of the insulated conductor entangled in the terminal portion before the soldering process. is there. However, in the mechanical removal method that has been conventionally used as a method for removing the insulating coating, which uses a tool having a blade such as a cutter to scrape off the insulating coating, the insulating coating is made of polyethersulfone resin and is tough. However, the removal and peeling work takes a long time, and the blade is damaged in a short period of time as compared with an insulating film made of a material other than polyethersulfone resin, which is not practical. In addition, in the heat removal method in which the insulating coating is heated by using a gas burner to be thermally decomposed and removed, there is a problem that the conductor surface after the insulating coating is removed is covered with the oxide coating. If the surface of the conductor is covered with an oxide film, the oxide film will be present between the molten solder and the conductor during the soldering process, and the molten solder will not adhere to the conductor, and the solder will be soldered between the conductor and the terminal. I can't attach it.

Therefore, a first object of the present invention is to provide a method of removing an insulating film without forming an oxide film. A second object is to provide a method for manufacturing a coil device having an insulating film removing step in which an oxide film is not formed.

[0006]

A method for removing an insulating coating of an insulated wire according to the present invention is a hot iron (20) on the surface of an insulated wire (1) having an insulating coating (10) made of polyethersulfone resin.
Are pressed against each other to remove the insulating film (10) and expose the conductor (11). Here, when the heating time by the iron (20) is X (seconds) and the heating temperature is Y (° C.), the heating time and the heating temperature satisfying the relational expression represented by the following formula 7 are set.

[Equation 7] Y <−20X + 540

According to the method for removing the insulating coating of the insulated conductor (1) of the present invention, the surface of the insulated conductor (1) is heated for the heating time and the heating temperature satisfying the relational expression expressed by the equation (7). The surface of 11) does not reach the temperature for forming an oxide film. Therefore, there is no fear that an oxide film will be formed on the surface of the conductor (11) after the insulating film (10) is removed.

In a specific construction, the heating time Y (° C.) and the heating temperature X (second) by the iron (20) are set so as to satisfy the relational expression expressed by the following equation 8.

[Equation 8] Y ≦ −20X + 530 According to the specific configuration, the surface of the insulated conducting wire (1) is heated for the heating time and the heating temperature that satisfy the relational expression represented by the expression 8. The temperature reached is sufficiently lower than the temperature at which the oxide film is formed, and the conductor (11) after removing the insulating film (10)
No oxide film is formed on the surface of.

The coil device manufacturing device of the present invention is a device for manufacturing a coil device by winding an insulated conductor wire (1) having an insulating film (10) made of polyethersulfone resin around a core or a bobbin. , A wire feeding station for feeding the insulated wire (1), and a high-temperature iron (20) which comes into contact with and separates from the wire (1) fed out from the wire feeding station (4). The insulation conductor (1) is pressed against the surface of the insulation conductor (1), and the insulation film (10) is removed.
A film removing station for alternately forming a conductor covering part (16) and a conductor exposed part (15) in (1), and a film removing station
And a winding station for winding the conductor coating portion (16) of the insulated conductor (1) supplied through (2) on a core or a bobbin.

A method for manufacturing a coil device according to the present invention is a method for manufacturing a coil device by winding an insulated conductive wire (1) having an insulating film (10) made of polyethersulfone resin around a core or a bobbin. While feeding the insulated conductor (1), a high-temperature trowel (20) is applied to the surface of the insulated conductor (1) that is fed out.
By pressing and removing the insulating film (10),
A film removing step of alternately forming a conductor coating portion (16) and a conductor exposed portion (15) on the insulated conductor (1), and a conductor coating portion (16) of the insulated conductor (1) supplied through the film removing step. Winding step of winding the wire around a core or bobbin.

In the coil device manufacturing apparatus and manufacturing method according to the present invention, since the film removing station (2) is provided before the winding station (6), the insulated conductor ( In 1), the conductor coating portion 16 and the conductor exposed portion 15 are alternately formed. Thus, in the winding step, the conductor exposed portion (1) is provided at both ends of the conductor covered portion (16) only by winding the conductor covered portion (16) around the core or the bobbin.
5) can be placed. As a result, the step of exposing the conductor after winding the insulated conductive wire around the core or the bobbin in the conventional coil device manufacturing method becomes unnecessary.

In a concrete configuration, when the heating time by the iron (21) in the film removing station (2) and the film removing step is X (second) and the heating temperature is Y (° C.), The heating time and the heating temperature that satisfy the relational expression are set.

[Equation 9] Y ≦ −20X + 530 According to the specific configuration, in the film removing station (2) and the film removing process, the surface of the insulated conductor (1) is heated for a heating time and a heating temperature that satisfy the relational expression represented by the formula 9. Therefore, the temperature reached on the surface of the conductor (11) is sufficiently lower than the temperature at which the oxide film is formed, and no oxide film is formed on the conductor surface after the insulation film is removed.

In another specific configuration, after the film removing station (2), the exposed conductor portion of the insulated wire (1) wound around the core or bobbin at the winding station (6).
There is a soldering station for soldering at (15). Further, after the film removing step, there is a soldering step of soldering the conductor exposed portion (15) of the insulated conductive wire (1) wound around the core or bobbin in the winding step.

According to this specific structure, since the film removing station (2) is provided before the soldering station and the conductor exposed portion is formed before the soldering step, the conventional coil device manufacturing method is provided. As described above, there is no need to heat-melt the insulating film in the soldering process. Therefore, the temperature of the molten solder can be set lower than before. As a result, it is possible to prevent thermal damage to the core or bobbin due to the temperature of the molten solder in the soldering process. Further, since no oxide film is formed on the surface of the exposed conductor portion (15), solder adheres to the surface of the exposed conductor portion (15).

In another coil device manufacturing apparatus according to the present invention, an insulated conductive wire (1) having an insulating film (10) made of polyethersulfone resin is wound around a core or a bobbin,
An apparatus for manufacturing a coil device, comprising: a wire feeding station for feeding an insulated wire (1); and an insulating wire (1) fed from a wire feeding station (4), wound around a core or a bobbin, and then continuously insulated wire. A winding entanglement station for entwining (1) with a terminal portion (91) provided on a core or a bobbin and cutting the insulated conductor (1) in the vicinity of the terminal portion (91), and a winding entanglement station. For the insulated conductor wire (1) entwined with the terminal portion (91) of the core or bobbin supplied through the station (64),
An insulated conductive wire in which a high-temperature iron (23) that is separated from the contact is provided, and the iron (23) is entangled with the terminal portion (91) of the core or bobbin.
By pressing the surface of (1) and removing at least part of the insulating film (10), the exposed conductor (1
5) forming a conductor exposing station.

Another method of manufacturing a coil device according to the present invention is to wind an insulated wire (1) having an insulating film (10) made of polyethersulfone resin around a core or a bobbin.
A method for manufacturing a coil device, which comprises winding an unwinding insulated wire (1) around a core or a bobbin while letting out the insulated wire (1), and subsequently providing the insulated wire (1) on the core or bobbin. Entwined with the terminal part (91)
A winding entanglement step of cutting the insulated conductor (1) in the vicinity of 1),
A high-temperature iron (23) that is in contact with and separated from the insulated conductor (1) entwined with the terminal portion (91) of the core or bobbin supplied through the winding entanglement step is provided. (23) is pressed against the surface of the insulated conducting wire (1) entwined with the terminal portion (91) of the core or bobbin, and at least a part of the insulating film (10) is removed to form the insulated conducting wire (1). And a conductor exposing step of forming a conductor exposing portion (15).

According to another coil device manufacturing apparatus and manufacturing method of the present invention, since the conductor exposing station (24) is provided after the winding entanglement station (64), the core is not exposed in the conductor exposing step. Alternatively, at least a part of the conductor (11) of the insulated conductor (1) entwined with the terminal portion (91) of the bobbin can be exposed.

In a concrete structure, when the heating time by the trowel in the conductor exposing station (24) and the conductor exposing step is X (seconds) and the heating temperature is Y (° C.), the relation expressed by the following formula 10 is given. The heating time and heating temperature that satisfy the formula are set.

[Equation 10] Y ≦ −20X + 530 According to the specific configuration, in the conductor exposure station (24) and the conductor exposure step, the surface of the insulated conductor (1) is heated for a heating time and a heating temperature that satisfy the relational expression expressed by the equation 10. Therefore, the temperature reached on the surface of the conductor (11) is sufficiently lower than the temperature at which the oxide film is formed, and no oxide film is formed on the conductor surface after the insulation film is removed.

In another specific configuration, the terminal portion (9) of the core or bobbin is provided after the conductor exposing station (24).
A solder processing station is provided for soldering the conductor (11) of the insulated conductor (1) entangled in (1). Further, after the conductor exposing step, there is a soldering step of soldering the conductor (11) of the insulated conducting wire (1) entwined with the terminal portion (91) of the core or bobbin.

According to this specific structure, the solder treatment station is provided after the conductor exposure station (24), and at least a part of the insulating film (10) of the insulated conductor (1) is provided before the solder treatment step. Is removed and the conductor is exposed, so
Unlike the conventional coil device manufacturing method, it is not necessary to heat-melt the insulating film in the soldering process. Therefore, the temperature of the molten solder can be set lower than before. As a result, it is possible to prevent thermal damage to the core or bobbin due to the temperature of the molten solder in the soldering process. or,
Since no oxide film is formed on the surface of the exposed conductor portion (15), solder adheres to the surface of the exposed conductor portion (15).

[0021]

According to the insulating film removing method of the present invention, since an oxide film is not formed on the surface of the conductor as the insulating film is removed, soldering is possible. or,
According to the coil device manufacturing method of the present invention, by exposing the conductor surface on which the oxide film is not formed, it is possible to set the temperature of the molten solder to be lower than the conventional temperature in the soldering process. Heat damage to the bobbin is prevented.

[0022]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be specifically described below with reference to the drawings. A film removing device according to the present invention is shown in FIG. The film removing device (20) includes a pair of trowels (21), and the surface of the trowel (21) can be set to a predetermined temperature by electric heating. Between the pair of irons (21), an insulated conductor comprising a copper conductor (11) and a three-layered insulation film (10) made of polyethersulfone resin on the surface.
(1) is placed.

First, the temperature of the pair of irons (21) is set to Y (° C.). Next, as shown in FIG. 2 (a), the pair of irons (21) are moved in a direction approaching the insulated conducting wire (1) indicated by the arrow, and the insulated conducting wire (1) is moved as shown in FIG. 2 (b). Pinch, and set time X
Hold only (seconds). As a result, the surface of the insulated conducting wire (1) is heated. Then, use the insulated wire with the trowel (21) indicated by the arrow.
It is moved in the direction away from (1) to separate it from the surface of the insulated conductor (1). Where the insulated wire with the trowel (21)
The heating temperature Y (° C) and heating time X (seconds) in (1) are shown in the following equation 11
It is set so as to satisfy the relational expression represented by.

[Equation 11] Y <−20X + 540 More preferably, the heating temperature Y (° C.) and the heating time X (seconds) are
It is set so as to satisfy the following expression 12.

[Equation 12] Y ≦ −20X + 530 According to the insulating film removing method, the insulating film (10) heated by the trowel (21) is sublimated to form the conductor (11) as shown in FIG. 2 (c). It can be partially exposed. It should be noted that an oxide film is not formed on the exposed surface of the conductor (11), as is clear from the results of experiments described later.

[0024]Experiment Remove the insulation film from the insulated conductor to create a conductor whose surface is exposed.
A soldering test was performed. Table 1 shows the conditions of the iron.
Set the combination of heat temperature and heating time to
Remove the insulation film by the same method as the film removal method.
It was

[0025]

[Table 1]

For the soldering test, a test piece (3) having the shape shown in FIG. 3 (a) was used. For the soldering test, the test piece (3)
As shown in FIG. 3 (b), the conductor portion (30) is immersed in the molten solder bath (5) heated to 400 ° C. for 1 second, and then the molten solder bath (5)
The test piece (3) is allowed to cool. As a result,
When the surface of the conductor (30) is completely covered by the solder (13) as shown in (c), soldering is possible, and the solder adheres to the surface of the conductor (30) as shown in FIG. 3 (d). If not, soldering is not possible. Further, even if the solder is partially adhered to the conductor surface of the conductor portion (30), the soldering is not possible.

The results of the soldering test are shown in the graph of FIG. The graph shows the soldering test results of the conductor after the insulating film was removed by the combination of heating temperature and heating time shown in Table 1. As is clear from this result, the approximate straight line of the lowest temperature at which the soldering becomes impossible at each heating time is represented by the following expression 13. In the heating conditions included in the lower area (hereinafter, referred to as solderable area) that does not include the approximate straight line (hereinafter, referred to as solderable boundary line),
Solderable.

[Equation 13] Y = −20X + 540 The reason why soldering was successful under the heating conditions included in the solderable area was that the heating temperature included in the solderable area reached the temperature at which the conductor surface formed an oxide film. This is because the oxide film was not formed on the conductor surface after the insulation film was removed, and the conductor surface was in direct contact with the molten solder in the soldering test.

Further, under the heating condition of the lower region (hereinafter referred to as the soldering certain region) including the straight line represented by the following equation 14 (hereinafter referred to as the solderable boundary line) according to the present invention, the solder is surely soldered. Can be attached.

[Formula 14] Y = −20X + 530 The reason why soldering was successful under the heating conditions included in the certain soldering area is that if the heating conditions included in the certain soldering area, the temperature reached on the conductor surface forms an oxide film. This is because the temperature is sufficiently lower than the heating temperature, so that an oxide film is not formed on the conductor surface after the insulation film is removed, and the conductor surface is in direct contact with the molten solder in the soldering test.

As shown in FIG. 5, the coil device manufacturing apparatus according to the present invention comprises a wire sending station (4) and a winding station.
A film removing station (2) is arranged between (6), and an insulated conductor that passes through the film removing station (2) between the wire sending station (4) and the winding station (6).
The transmission route of (1) is provided. Further, a soldering station (not shown) is arranged after the winding station (6).

A winding frame (41) around which the insulated conductor (1) is wound is provided in the wire sending station (4) of the above-mentioned manufacturing apparatus, and the insulation conductor (1) is continuously connected to the film removal station ( 2)
Is being supplied to. The film removing station (2) is equipped with a film removing device (20) having a pair of trowels (21), and the insulated conductor (1) supplied from the wire sending station (4).
The surface of the is pinched by a pair of trowels (21),
(10) is removed. As a result, conductor covered portions (16) and conductor exposed portions (15) are alternately formed on the insulated conductor (1). Here, the heating temperature Y (° C.) and the heating time X (seconds) of the insulating film (10) by the trowel (21) are included in the range of the certain soldering area.

The winding station (6) has a winding nozzle (6
1) and a cutting machine (62) are provided, and a bobbin (70) is appropriately supplied. In the insulated conductor (1) supplied through the film removal station (2), the exposed conductor (15) has a winding nozzle (6).
It is entangled in one terminal part (71) of the bobbin (70) by 1),
Then, the conductor coating portion (16) is wound around the bobbin (70) a predetermined number of times. Thereafter, the conductor exposed portion (15) extending from the conductor coating portion (16) wound around the bobbin (70) is entangled with the other terminal portion (71) of the bobbin (70), and the terminal portion (71) It is cut by the cutting machine (62) near the tip.

A molten solder bath is provided at the soldering station. The terminal portion (71) of the bobbin (70) supplied through the winding station (6) is pulled up after being immersed in the molten solder bath. As a result, the surface of the conductor (11) of the conductor exposed portion (15) and the terminal portion (71) of the bobbin (70) are soldered.

In the coil device manufacturing method according to the present invention, first, in a film removing step as shown in FIGS.
A pair of hot irons (21) are pressed against the surface of the insulated conductor (1) fed from the winding frame (41) to remove the insulating film (10) at predetermined intervals. As a result, the exposed conductors (15) and the conductor coatings (16) are alternately formed on the insulated conductor (1). Here, the heating temperature Y (° C.) and the heating time X (seconds) of the insulating film (10) by the trowel (21) are included in the range of the certain soldering area.

Next, in the winding step, the winding nozzle (61)
The exposed conductor part (15) of the insulated conductor (1) is entangled with one terminal part (71) of the bobbin (70) by using, and then the conductor coating part (16) is attached to the bobbin (70) at a predetermined number of times. After winding, bobbin the exposed conductor part (15) extending from the conductor covering part (16) wound around the bobbin (70).
The coil device (7) is completed by entwining with the other terminal portion (71) of (70) and cutting the exposed conductor portion (15) at the tip of the terminal portion (71).

Further, there is a soldering step having a molten solder bath after the winding step, and the exposed conductor portion of the insulated conductor (1) is exposed.
The terminal part (71) of the bobbin (70) in which the (16) is entangled is immersed in a molten solder bath, and the surface of the conductor (11) of the exposed conductor part (16) and the terminal part (71) are soldered. To do.

According to the manufacturing apparatus and the manufacturing method of the coil device, the conductor exposed portion (16) is formed on the insulated conductor (1) before the winding step.
Therefore, the film removing step after the winding step, which is necessary in the conventional manufacturing method, is unnecessary, which simplifies the process. Further, since the conductor exposed portion is formed before the soldering step, it is not necessary to heat-melt the insulating film in the soldering step as in the conventional coil device manufacturing method. Therefore, the temperature of the molten solder can be set lower than before. As a result, heat damage to the core or bobbin due to the temperature of the molten solder can be prevented. Also, the heating temperature Y (° C) of the insulated wire (1) with the trowel (21)
Since the heating time X (seconds) is included in the range of the certain soldering area, the oxide film is formed on the surface of the conductor (11) of the conductor exposed portion (15), as is clear from the results of the above experiment. Is not formed. Therefore, in the soldering step, the surface of the conductor (11) of the conductor exposed portion (15) and the terminal portion (71) of the bobbin (70) can be reliably soldered.

As shown in FIG. 6, another coil device manufacturing apparatus according to the present invention comprises a wire sending station (4), a winding entanglement station (64), and a conductor exposing station (24). Further, a soldering station (not shown) is arranged after the conductor exposing station (24).

The wire-sending station (4) of the above manufacturing apparatus is
The insulated conductor (1) is continuously supplied to the winding station. The winding entanglement station (64) has a winding nozzle
(61) and a cutting machine (62) are provided, and a bobbin (90) is appropriately supplied. The insulated wire (1) supplied from the wire feeding station (4) is fed to the bobbin (90) by the winding nozzle (61).
After being entangled in one of the terminal portions (91) and subsequently wound around the bobbin (90) a predetermined number of times, entangled in the other terminal portion (91) and the other terminal (91) It is cut using a cutting machine (62) near the tip.

The conductor exposing station (24) has a trowel (23)
A film removing device (22) equipped with a wire is installed on the surface of the insulated conductor (1) entwined with the terminal (91) of the bobbin (90) supplied from the winding entanglement station. As shown in FIG. 7 (b), the iron (23) is pressure-welded, the insulating film (10) is removed, and a part of the conductor (1) is exposed as shown in FIG. 7 (c). Heating temperature Y (° C) and heating time X (seconds) of the insulated wire (1) with the trowel (23)
Is included in the range of the certain soldering area.

A molten solder bath is provided at the soldering station. The terminal portion of the bobbin supplied through the conductor exposing station is dipped in the molten solder bath, whereby the insulating coating of the insulated conductor entwined with the terminal portion is thermally melted. As a result, the conductor is exposed, and the surface of the conductor and the terminal portion are soldered.

In another coil device manufacturing method according to the present invention, as shown in FIG. 6, a bobbin (90) is formed by winding an insulated conductor (1) fed from a winding frame (41) using a winding nozzle (61). Engage in one terminal (91). Then, after winding the bobbin (90) a predetermined number of times, entangle it with the other terminal portion (91),
The tip end of (91) is cut using a cutting machine (62). Next, in the conductor exposing step, the high temperature iron (23) constituting the film removing device (22) as shown in FIG. 7 (a) is moved in a direction approaching the insulated conductor as shown by an arrow, As shown in b), the surface of the insulated conducting wire (1) entwined with the terminal portion (91) of the bobbin (90) is pressure-contacted to sublimate the insulating film (10),
Part of the conductor (11) is exposed as shown in (c). As a result, the conductor exposed portion 15 is formed to complete the coil device 9.

In the conductor exposing step, the heating temperature Y (° C.) and the heating time X (second) of the insulating film (10) by the trowel (23) are set.
Is included in the range of the certain soldering area.

Further, in the solder treatment step subsequent to the conductor exposing step, the terminal portion (91) of the bobbin (90) in which the insulated conductor (1) is entangled is dipped in the molten solder bath and pulled up, The surface of the exposed part (15) and the terminal part (91) are soldered.

According to the other coil device manufacturing apparatus and manufacturing method of the present invention, the insulated conductive wire is provided before the soldering process.
Since the exposed conductor part (15) is formed by removing a part of the insulating film (10) of (1), it is necessary to heat-melt the insulating film in the soldering step as in the conventional coil device manufacturing method. Absent. Therefore, the temperature of the molten solder can be set lower than before. As a result, heat damage to the core or bobbin due to the temperature of the molten solder can be prevented. Further, since the temperature Y (° C.) for heating the insulating film (10) by the trowel and the heating time X (seconds) are included in the range of the certain soldering area, the conductor (11) of the conductor exposed portion (15) is The oxide film is not formed on the surface of (). Therefore, the surface of the conductor (11) of the conductor exposed portion (15) and the terminal portion (91) of the bobbin (90) can be reliably soldered in the soldering process.

[Brief description of drawings]

FIG. 1 is a perspective view of an insulating film removing method of the present invention.

FIG. 2 is a process drawing of the insulating film removing method.

FIG. 3 is a diagram showing a soldering test.

FIG. 4 is a graph of results of a soldering test.

FIG. 5 is a process drawing of the coil device manufacturing method according to the present invention.

FIG. 6 is a process drawing of another coil device manufacturing method according to the present invention.

FIG. 7 is a diagram of a conductor exposing step in the step.

FIG. 8 is a perspective view of an insulated conductor.

FIG. 9 is a process drawing of a conventional coil device manufacturing method.

[Explanation of symbols]

(1) Insulated conductor (10) Insulation film (15) Exposed conductor (20) Film removal device (5) Molten solder bath (7) Coil device (9) Coil device

Claims (14)

[Claims] 1. A high-temperature trowel (2) is attached to the surface of an insulated wire (1) having an insulating film (10) made of polyethersulfone resin.
It is a method of exposing the conductor (11) by removing the insulating film (10) by pressing 1) under pressure, and heating time by the trowel (21) is X.
(Sec), when the heating temperature is Y (° C.), a heating time and a heating temperature that satisfy the relational expression represented by the following mathematical formula 1 are set, and an insulating film removing method for an insulated conductor. [Equation 1] Y <-20X + 540 2. The insulating film removing method according to claim 1, wherein the heating time X (second) and the heating temperature Y (° C.) by the iron (21) are set so as to satisfy the relational expression represented by the following mathematical formula 2. . [Formula 2] Y ≦ −20X + 530 3. In a device for manufacturing a coil device by winding an insulating conductor (1) having an insulating film (10) made of polyether sulfone resin around a core or a bobbin, a wire for feeding the insulating conductor (1). A station (4) and a high-temperature iron (21), which comes into contact with and separates from the insulated conductor (1) fed from the wire station (4), are provided.
(21) is pressed against the surface of the insulated conductor (1), and the insulation film (1
By removing (0), the conductor coating (1
A film removing station (2) that alternately forms 6) and exposed conductors (15), and an insulated conductor supplied through the film removing station (2)
An apparatus for manufacturing a coil device, comprising: a winding station (6) for winding the conductor coating portion (16) of (1) around a core or a bobbin. 4. A trowel at the film removal station (2)
4. The coil device according to claim 3, wherein the heating time and the heating temperature satisfying the relational expression represented by the following mathematical formula 3 are set when the heating time by (21) is X (seconds) and the heating temperature is Y (° C.). Manufacturing equipment. [Equation 3] Y ≦ −20X + 530 5. Further, after the winding station (6), solder is attached to a conductor exposed portion (15) extending from the conductor coating portion (16) of the insulated conductor (1) wound around a core or a bobbin. The apparatus for manufacturing a coil device according to claim 3 or 4, wherein a soldering station for applying is provided. 6. A method for manufacturing a coil device by winding an insulating wire (1) having an insulating film (10) made of polyethersulfone resin around a core or a bobbin, while feeding the insulating wire (1), Insulated conductive wire
Insulate the surface of (1) with a hot iron (21)
By removing (10), the insulated wire (1) is covered with a conductor.
Winding for winding a conductor removing portion (16) of the insulated conductor (1) supplied through the film removing step and the film removing step of alternately forming the conductor exposed portion (15) around a core or a bobbin. And a wire process. 7. A heating time and a heating temperature that satisfy the relational expression represented by the following mathematical formula 4, when the heating time by the trowel (21) in the film removing step is X (seconds) and the heating temperature is Y (° C.). The method for manufacturing a coil device according to claim 6, wherein: [Equation 4] Y ≦ −20X + 530 8. A soldering step of, after the winding step, soldering an exposed conductor portion (15) extending from a conductor coating portion (16) of an insulated conductor (1) wound around a core or a bobbin. The manufacturing method of the coil device according to claim 6 or 7, which has. 9. A wire for feeding an insulated conductor (1) in a device for manufacturing a coil device, which comprises winding an insulated conductor (1) having an insulation film (10) made of polyethersulfone resin around a core or a bobbin. After winding the station (4) and the insulated conductor (1) fed from the wire-sending station (4) around a core or bobbin, the insulated conductor is continuous.
A winding entanglement station for entwining (1) with a terminal portion (71) provided on a core or a bobbin and cutting the insulated conductor (1) in the vicinity of the terminal portion (71); A high-temperature iron (21) that comes into contact with and separates from the insulated conductor (1) entwined with the terminal portion (71) of the core or bobbin supplied through the station (64) is provided. 2
1) Insulated wire entwined with the core or bobbin terminal
The conductor is exposed on the insulated conductor (1) by pressing it onto the surface of (1) and removing at least a part of the insulating film (10).
An apparatus for manufacturing a coil device, comprising: a conductor exposing station forming (15). 10. Heating which satisfies the relational expression represented by the following formula 5 when the heating time by the iron (21) at the conductor exposing station (24) is X (seconds) and the heating temperature is Y (° C.) The manufacturing apparatus for a coil device according to claim 9, wherein time and heating temperature are set. [Equation 5] Y ≦ −20X + 530 11. A solder processing station for soldering a conductor (11) of an insulated conductor (1) entwined with a terminal portion (71) of a core or a bobbin after a conductor exposing station (24). (24) is provided Claim 9 or Claim 10
An apparatus for manufacturing the coil device according to 1. 12. A method for manufacturing a coil device by winding an insulating conductive wire (1) having an insulating coating (10) made of polyether sulfone resin around a core or a bobbin, while feeding the insulating conductive wire (1), Insulated conductive wire
After winding (1) around the core or bobbin, the insulated conductor (1) is continuously provided on the core or bobbin.
The winding wire wrapping step of cutting the insulated conductor (1) in the vicinity of the terminal portion (71) and the terminal portion (71) of the core or bobbin supplied through the winding wire wrapping step. A high-temperature trowel (21) that is in contact with and separated from the entangled insulated conductor (1) is provided, and the trowel (21) is entangled with the terminal portion (71) of the core or bobbin. A conductor exposing step of forming a conductor exposed portion (15) on the insulated conducting wire (1) by press-contacting the surface of (1) and removing at least part of the insulating film (10). And a method for manufacturing a coil device. 13. When the heating time by the trowel (21) in the film removing step is X (seconds) and the heating temperature is Y (° C.), the following formula 6 is obtained.
The method for manufacturing a coil device according to claim 12, wherein the heating time and the heating temperature satisfying the relational expression are set. (6) Y ≦ −20X + 530 14. The method further comprises, after the conductor exposing step, a soldering step of soldering the conductor (11) of the insulated conductor (1) entwined with the terminal portion (71) of the core or bobbin. A method for manufacturing the coil device according to claim 12 or 13.