JP2003060370A - Cooling apparatus for electronic equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide cooling apparatus for electronic equipment, capable of cooling effectively the inside of electronic equipment, by ventilating the electronic equipment in the direction of the insertion/withdrawal of its printed board. SOLUTION: Electronic equipment 100 has a mother board 102 provided in its housing 101 in nearly vertical direction; a plurality of printed boards 103, connected with the mother board 102 nearly vertically thereto the heights of whose upper ends, are larger than the height of the upper end of the mother board 102; and a cooling fan 104 for moving air, which is so attached to the housing 101 that the height thereof, is positioned between the upper ends of the printed board 103 and the mother board 102.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device cooling device capable of effectively cooling the inside of a housing of an electronic device.

[0002]

2. Description of the Related Art Conventionally, this type of electronic device cooling apparatus has, for example, an upper exhaust type shown in FIG. 3 and a side exhaust type shown in FIG. As shown in FIG. 3, the upper exhaust has a rear plate 910a inside the housing 910 of the electronic device 900.
A plurality of substantially perpendicular printed circuit boards 91 connected to each other in a substantially vertical direction with respect to a mother board 911 installed in a substantially vertical direction.
2, the cooling fan 913 is disposed substantially horizontally on the upper printed circuit board chassis 914 provided on the upper side of the printed circuit board 912, and the cooling fan 913 is driven to drive the lower cooling board 913 below the printed circuit board 912. The outside air is sucked into the housing 910 from an air suction port 915a provided in the portion 915, and the outside air sucked into the housing 910 cools the printed board 912 when passing between the plurality of printed boards 912. Then, after passing through the cooling fan 913, the switching power supply 916 is cooled by spraying it onto the switching power supply 916 installed on the cooling fan 913. After cooling the switching power supply 916, the upper portion of the rear plate 910a of the housing 910 and An air outlet 910 provided on a top plate 910b above the housing 910. It was intended to be discharged from 910d.

In the case of a side exhaust type, as shown in FIG. 4, a cooling fan 9 is provided on a side surface of a casing 910 of an electronic device 900.
13, a ventilation port 912a is provided in each of a plurality of substantially vertical printed circuit boards 912 that are connected substantially vertically to a motherboard 911 that is installed in a substantially vertical direction on the back plate 910a side inside the housing 910. The outside air is introduced from the air suction port 910c provided on the front surface of the housing 910 to the housing 910.
The outside air sucked into the inside of the housing 910 cools the plurality of printed circuit boards 912, then passes through the ventilation port 912a, and is discharged to the outside of the housing 910 by a cooling fan 913 provided on a side portion of the housing 910. It was discharged.

[0004]

However, as shown in FIG. 3, such a conventional electronic device cooling apparatus has an upper end of a mother board 911 installed substantially vertically inside a housing 910 of an electronic device 900. Height and motherboard 9
When the mother boards 911 are installed on the front side and the back side inside the housing 910, since the heights of the upper ends of the plurality of substantially vertical printed circuit boards 912 that are connected substantially perpendicular to 11 are substantially the same. Even if the cooling fan 913 is installed on the front side or the rear side of the housing 910, the motherboard 9
11 was a barrier and it was not possible to flow air in the direction of inserting and removing the printed board 912. Therefore, when the motherboard 911 is installed on the front side and the back side inside the housing 910, the cooling fan 913 is installed in the housing 91.
0 is installed in the upper part or the lower part or the side part of the 0. When the cooling fan 913 is installed in the upper part or the lower part, the cooling fan 9 is installed in the side where the cooling fan 913 is installed.
It becomes impossible to stack the other electronic devices on the upper part or the lower part by blocking 13 and therefore, when installing the other electronic devices on the upper part or the lower part,
There is a problem in that it is necessary to install the electronic equipment with a predetermined space between the electronic equipment and another electronic equipment, and the effective space of the equipment storage rack is reduced.

Further, as shown in FIG. 4, a cooling fan 91
3 is installed on the side of the housing 910, it is necessary to provide a ventilation port 912a in each printed circuit board 912 in order to secure a ventilation route, and the electronic component mounting space and the pattern arrangement space of each printed circuit board 912 are reduced. There was a problem that it would decrease.

Further, in the conventional electronic equipment cooling device, when the inside of the housing is partitioned into a plurality of rooms and the plurality of rooms have a heat generating element, a cooling fan is installed in each room having the heat generating element. However, there are problems such as an increase in power consumption and a need to secure a space for installing a cooling fan.

Further, in the conventional electronic equipment cooling device, when the housing is mounted on the equipment housing rack, the air discharged outside the housing after cooling the inside of the housing is discharged into the equipment housing rack. There was a problem of raising the temperature inside the equipment storage rack.

The present invention has been made in order to solve such a problem and allows ventilation in the direction of inserting and removing a printed circuit board, and the inside of the housing is partitioned into a plurality of rooms to form a plurality of rooms. Even if it has a heating element, it is possible to cool each room without installing a cooling fan in each room that has a heating element. (EN) Provided is an electronic device cooling device which does not raise the temperature in the device storage rack by not discharging it inside.

[0009]

An electronic device cooling apparatus of the present invention is provided with a first printed circuit board installed in a housing of an electronic device in a substantially vertical direction, and a substantially vertical direction with respect to the first printed circuit board. A plurality of second printed circuit boards connected to the second printed circuit board, the height of the upper end of which is higher than the height of the upper end of the first printed circuit board;
Mounted so as to be located at a height between an upper end of the second printed circuit board and an upper end of the first printed circuit board,
A cooling fan for moving air is provided. With this configuration, it is possible to ventilate the printed circuit board in the insertion / removal direction.

Further, the electronic device cooling apparatus of the present invention has a constitution characterized in that an air amount adjusting plate for adjusting the amount of air sucked by the cooling fan is provided on the suction side of the cooling fan. There is. With this configuration, it is possible to optimally cool the inside of the housing by adjusting the amount of air sucked by the cooling fan.

Further, in the electronic device cooling apparatus of the present invention, the casing is partitioned into a plurality of rooms, and an air re-introduction duct for introducing the air discharged by the cooling fan into another room inside the casing. The cooling fan is provided on the discharge side of the cooling fan. With this configuration, the air discharged to the outside of the housing is re-introduced into the other room inside the housing by the air re-introduction duct, so that each room having a heating element can be installed without installing a cooling fan. Can be cooled.

The electronic device cooling apparatus of the present invention has a structure characterized in that the air re-introduction duct is provided with a louver for taking in outside air. With this configuration,
When the air discharged to the outside of the housing is re-introduced into the other room inside the housing by the air re-introduction duct, the outside air with a low temperature outside the housing can be added. It will be lowered to improve the cooling performance.

Further, the electronic device cooling apparatus of the present invention has a constitution characterized by including an outside air introducing duct for introducing outside air into the suction side of the cooling fan. With this configuration, the outside air with a low temperature outside the housing can be added to the air that is re-introduced into the other room inside the housing by the air re-introduction duct, so the temperature of the air that is re-introduced can be lowered and the cooling performance can be improved. Will be improved.

Further, the electronic device cooling apparatus of the present invention has a structure characterized in that a flow straightening plate for straightening the air flowing through the inside of the air re-introduction duct is provided inside the air re-introduction duct. There is. With this configuration, the air flowing inside the air reintroduction duct is rectified.

Further, in the electronic device cooling apparatus of the present invention, an air discharge port for discharging the air introduced into the other room inside the housing by the air re-introduction duct to the outside of the housing is provided on the front surface of the housing. It has a configuration characterized by being provided.
With this configuration, the final exhaust air after cooling the inside of the housing is exhausted from the front surface side of the housing, so that the temperature rise in the equipment housing rack due to the exhaust gas can be avoided by not exhausting it into the equipment housing rack.

Further, in the electronic device cooling apparatus of the present invention, one of the plurality of rooms is provided in the lower part of the housing, and an air intake port for taking in outside air is located in the lower part of the housing. The room is provided in the room. With this configuration, when it is mounted on the equipment storage rack, it is possible to take in air without opening a space from other electronic equipment.

[0017]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

First, the structure of the electronic device cooling apparatus of the present invention will be described. 1 and 2 are views showing an embodiment of an electronic device cooling apparatus of the present invention.

An electronic equipment cooling device according to an embodiment of the present invention is a housing 1 of an electronic equipment 100, as shown in FIG. 1, which is a side view of the inside of an electronic equipment equipped with the electronic equipment cooling device.
01 Motherboard 102 installed substantially vertically inside
A plurality of printed circuit boards 103 that are connected substantially vertically to the mother board 102 and that have an upper end height higher than the upper end height of the mother board 102 and that are substantially vertical.
3 is mounted so as to be located at a height between the upper end of the mother board 102 and the upper end of the motherboard 102, and the mother board 10 is mounted between the upper end of the printed circuit board 103 and the upper end of the mother board 102.
The printed circuit board 1 of the mother board 102 from the side (front plate 101b side) where the second printed circuit board 103 is not connected
03 is connected to the side (rear plate 101a side) of the cooling fan 104, on the suction side of the cooling fan 104, the air amount adjusting plate 105 for adjusting the amount of air sucked by the cooling fan 104, The housing 101 is partitioned into a plurality of rooms 106, 107, 108, and the cooling fan 10
4 is the mother board 1 from the side of the mother board 102 where the printed circuit board 103 is not connected (the side of the front plate 101b).
No. 02, which is moved to the side to which the printed circuit board 103 is connected (on the side of the back plate 101a) and is discharged to the outside of the casing 101, is provided on the discharge side of the cooling fan 104 and the casing 10
1 Air re-introduction duct 1 to be introduced into another room 107 inside
09, a louver 110 that takes in outside air into the air reintroduction duct 109, an outside air introduction duct 111 that introduces outside air into the suction side of the cooling fan 104, and an air reintroduction duct 1
09 is provided inside the air re-introduction duct 109 for rectifying the air flowing inside the air re-introduction duct 109, and the air re-introduction duct 109 provided at the front of the housing 101.
An air outlet 113 for discharging the air introduced into the other room 107 inside the housing 101 to the outside of the housing 101, and a room 108 provided at the bottom of the housing 101 with one of the plurality of rooms provided at the bottom of the housing 101. And an air intake port 114 that takes in outside air into the housing 101.

Inside the housing 101, an upper chassis portion 115 for printed circuit boards and a lower chassis portion 11 for printed circuit boards are provided.
6, the chamber 10 between the upper chassis portion 115 for the printed circuit board and the lower chassis portion 116 for the printed circuit board.
6, a room 107 above the upper chassis portion 115 for the printed circuit board, and a room 108 below the lower chassis portion 116 for the printed circuit board are divided into three rooms.

In the room 106, a mother board 102, a printed circuit board 103, a cooling fan 104, and an air quantity adjusting plate 1
05, an outside air introduction duct 111 and the like are provided, and the room 107 has an air outlet 11 for finally discharging the air that has cooled the switching power supply 117 and the housing 101 to the outside.
3 is provided, and the air intake 114 is provided in the room 108. Further, an air re-introduction duct 109 that allows air to pass from the room 106 to the room 107 is provided on the rear surface side of the housing 101, and the lower printed circuit board chassis portion 11
6 is provided with a vent 116a.

The mother board 102 (first printed circuit board) is installed in a substantially vertical direction on the rear plate 101a side inside the housing 101 by the motherboard mounting chassis section 118 so as to be substantially parallel to the rear plate 101a of the housing 101. ing. The printed circuit board 103 (second printed circuit board) is
It is plugged into the motherboard 102 and electrically connected. The orientation of the printed circuit board 103 is the motherboard 102.
Is substantially perpendicular to the vertical direction, and a plurality of sheets are provided in a substantially vertical direction, that is, substantially parallel to the side plate of the housing 101. The height of the upper end of the printed circuit board 103 is higher than the height of the upper end of the motherboard 102.

The cooling fan 104 is a printed circuit board 103.
It is installed at a height between the upper end of the housing 101 and the upper end of the motherboard 102 and at a position on the rear plate 101a side of the housing 101, and the air inside the housing 101 is discharged to the outside of the housing 101. The air amount adjusting plate 105 is provided on the suction side of the cooling fan 104, and can slide up and down to adjust the amount of air sucked by the cooling fan 104. The outside air introduction duct 111 is provided on the back side of the housing 101, the outside air intake 111a of the outside air introduction duct 111 is provided below the cooling fan 104, and the outside air introduction duct 111 passes through the bottom of the cooling fan 104. The outside air is introduced to the suction side of the cooling fan 104.

The air re-introduction duct 109 is provided outside the rear plate 101a of the housing 101, and is configured to re-introduce the air discharged from the room 106 by the cooling fan 104 into the room 107 without letting it escape to the outside. There is. The air re-introduction duct 109 includes a louver 110 that takes in outside air into the air re-introduction duct 109, and a rectifying plate 112 that rectifies the air flowing inside the air re-introduction duct 109.

Next, the operation will be described. As shown in FIGS. 1 and 2, an electronic device cooling apparatus according to an embodiment of the present invention includes a room 106 in which a motherboard 102, a printed circuit board 103, etc. are installed, and a switching power supply 117.
Heat is generated in the room 107 in which is installed.

When the cooling fan 104 is driven, the housing 10
The outside air is taken into the inside of the room 108 from the back side of the housing 101 by the air intake port 114 provided at the position of the room 108 below the rear plate 101a. The outside air taken in passes through a ventilation hole 116a provided in the lower chassis portion 116 of the printed circuit board and is moved to the room 106. The air that has moved to the room 106 cools the printed circuit board 103 while rising, and the printed circuit board 103 is removed and inserted, that is, from the front plate 101b side of the housing 101 to the rear plate 101.
When the printed circuit board 103 of the motherboard 102 is connected to the mother board 10 between the upper end of the printed circuit board 103 and the upper end of the mother board 102, the motherboard 10 is moved to the side a.
2 to the side opposite to the side to which the printed circuit board 103 is connected, and the cooling fan 1 is moved by the air amount adjusting plate 105.
After the amount of air sucked by 04 is adjusted, it is cooled by the outside air taken in by the outside air introduction duct 111 and sent to the air re-introduction duct 109 by the cooling fan 104.

The air sent into the air re-introduction duct 109 is rectified by the rectifying plate 112 and then louvered.
It is further cooled by the outside air taken in by 10 and sent to the room 107. The air sent to the room 107 is the switching power supply 11 installed in the room 107.
7 is cooled, and is discharged from the air discharge port 113 provided on the upper part of the front plate 101b of the housing 101.

Therefore, the electronic device cooling apparatus according to the embodiment of the present invention enables ventilation in the direction of inserting and removing the printed circuit board 103, and adjusts the amount of air sucked by the cooling fan 104 to adjust the casing. This makes it possible to optimally cool the inside of the body 101. Furthermore, since the air exhausted from the room 106 to the outside of the housing 101 is re-introduced into the room 107 by the air re-introduction duct 109, it is possible to install the cooling fan 104 in each of the rooms 106 and 107 having the heating element, 1
It is possible to cool each of the housings 07, and at that time, the outside air introducing duct 111 and the louver 110 allow the housing 1 to be cooled.
01 Since the outside air having a low temperature outside is taken in, it is possible to lower the temperature of the air introduced again and improve the cooling performance inside the housing 101.

The rectifying plate 112 makes it possible to rectify the air flowing inside the air reintroduction duct 109. Furthermore, since the final exhaust after cooling the inside of the housing 101 is exhausted from the front side of the housing 101, the electronic device 10
It is possible to avoid a temperature rise in the equipment storage rack due to exhaust by not discharging the air into the equipment storage rack that stores 0, and to take in the air provided at the position of the room 108 below the rear plate 101a of the housing 101. The port 114 enables air to be taken in when mounted on a device storage rack without leaving a gap with other electronic devices.

[0030]

As described above, according to the present invention, the mother board installed in the housing of the electronic device in a substantially vertical direction and the mother board connected to the mother board in a substantially vertical direction, and the height of the upper end is the upper end of the mother board. The printed circuit board has a plurality of substantially vertical printed circuit boards that are higher than the height of the printed circuit board, and a cooling fan that is mounted so as to be located between the upper end of the printed circuit board and the upper end of the motherboard and that moves air. It is possible to provide an electronic device cooling device that allows ventilation in the insertion / removal direction.

[Brief description of drawings]

FIG. 1 is a diagram showing an electronic device cooling device according to an embodiment of the present invention.

FIG. 2 is an overall perspective view of the electronic device cooling device shown in FIG.

FIG. 3 is a diagram showing a conventional electronic device cooling device.

FIG. 4 is a diagram showing another example of a conventional electronic device cooling device.

[Explanation of symbols]

100 electronic devices 101 case 102 motherboard 103 printed circuit board 104 cooling fan 105 Air volume control plate 106, 107, 108 rooms 109 Air re-introduction duct 110 louvers 111 Outside air introduction duct 112 Current plate 113 Air outlet 114 air intake

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Masao Ohashi             3-1, Tsunashima-Higashi 4-chome, Kohoku-ku, Yokohama-shi, Kanagawa             Matsushita Communication Industry Co., Ltd. F-term (reference) 5E322 BA03 BB03 BB04 EA05

Claims (8)

[Claims] 1. A first printed circuit board installed in a casing of an electronic device in a substantially vertical direction, and a first printed circuit board connected to the first printed circuit board in a substantially vertical direction and having an upper end height of the first printed circuit board. A plurality of second printed circuit boards that are higher than the height of the upper ends of the printed circuit boards, and are mounted so as to be located at a height between the upper ends of the second printed circuit board and the upper ends of the first printed circuit boards,
An electronic device cooling device comprising a cooling fan for moving air. 2. The electronic apparatus cooling device according to claim 1, further comprising an air amount adjusting plate on an intake side of the cooling fan for adjusting an amount of air sucked by the cooling fan. 3. The enclosure is partitioned into a plurality of rooms, and an air re-introduction duct for introducing the air exhausted by the cooling fan into another room inside the enclosure is provided on the exhaust side of the cooling fan. Claim 1 or 2 characterized by the above.
The electronic device cooling device according to 1. 4. The electronic device cooling apparatus according to claim 3, wherein the air re-introduction duct is provided with a louver that takes in outside air. 5. The electronic device cooling apparatus according to claim 3, further comprising an outside air introduction duct that introduces outside air into a suction side of the cooling fan. 6. The cooling device for electronic equipment according to claim 5, wherein a rectifying plate for rectifying the air flowing inside the air reintroduction duct is provided inside the air reintroduction duct. 7. The front surface of the housing is provided with an air outlet for discharging the air introduced into the other room inside the housing by the air re-introduction duct to the outside of the housing. 6. The electronic device cooling device according to 6. 8. One of the plurality of rooms is provided in a lower part of the housing, and an air intake port for taking in outside air is provided in the room in the lower part of the housing. The electronic device cooling device according to any one of claims 3 to 7.