JP2003058064A - Planar display panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a planar display panel which has a structure integrally bonding a front face protective plate provided with an electromagnetic wave shield effect and a near infrared shield function onto the planar display panel main body, and which is provided with a near infrared shield layer having a favorable and stable near infrared shield effect and being also easily formed at a low material cost. SOLUTION: A front face protective plate 3 provided with a transparent substrate 4, an electromagnetic shield layer 5, the infrared shield layer 9 containing a near infrared absorbing agent, an antireflection layer 6 forming the outermost layer on the viewing side, and an adhesive layer 7 arranged as the outermost layer on the other face side of the transparent substrate 4 is bonded to the surface of the viewing side of the planar display panel main body 2 via the adhesive layer 7.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flat display panel, particularly a plasma display panel (hereinafter referred to as P
Abbreviated as DP. ) In order to improve the mechanical strength of the main body to prevent damage, and to reduce electromagnetic noise and near infrared rays generated from the flat display panel body, a front protective plate is attached to the surface of the flat display panel body on the visible side. The present invention relates to a flat display panel having a structure integrally bonded.

[0002]

2. Description of the Related Art In recent years,
PDPs, which have advantages such as the ability to produce large screen panels and clear full-color display, are drawing attention. PDP
Is to perform full-color display by selectively discharging and emitting phosphors in a large number of discharge cells formed between two glass plates. Due to this light emitting principle, electromagnetic waves and heat rays (near infrared rays) that cause malfunction of other devices and noise generation are emitted from the front surface of the PDP, so it is necessary to cut these electromagnetic waves and heat rays.

Conventionally, there is known a flat display panel body such as a PDP provided with a function for cutting electromagnetic waves and heat rays (near infrared rays). For example, Japanese Patent Laid-Open No. 11-119666 discloses a PDP main body and a PDP main body.
A display panel is disclosed in which a heat ray-cutting film and an electromagnetic wave shielding material are bonded to the front surface of a P body, and a transparent substrate is bonded to the front surface. However, as the heat ray cut film here, a heat ray cut coat such as ZnO or a silver thin film is applied on the base film, or an oxide transparent electrode film and a metal thin film are alternately laminated on the base film. Since a multilayer film is used, there is a problem that a thin film using such a metal material is not easy to form and the material cost is relatively high.

Therefore, for example, JP-A-57-21458, JP-A-57-198413 and JP-A-60-
Japanese Patent No. 43605 discloses an optical filter provided with a near-infrared shielding layer made of a resin composition in which an additive having a near-infrared absorbing property (near-infrared absorbing agent) is dispersed in a binder resin. With the near-infrared shielding layer having such a configuration, it is easy to form and the material is relatively inexpensive.

However, when the near-infrared shielding layer made of a near-infrared absorber is applied to the front protection plate of the type that is integrally bonded to the PDP body, the near-infrared shielding effect as designed is obtained. There was a problem that I could not do it. For example, in the structure described in JP-A-11-119666, when a near infrared ray shielding layer made of a near infrared ray absorbent is provided in place of the heat ray cut film made of a metal material, There is a problem that the near infrared ray shielding performance and the color tone of transmitted light change before and after lighting for a certain period of time.

Further, in a flat panel display panel such as a PDP, if the front protective plate itself joined to the front surface of the flat panel display panel body is deformed when an external force is applied from the viewing side, Since the external force may act on the front glass of the flat display panel body and damage the flat display panel body, it is also important to prevent this.

Therefore, an object of the present invention is a flat display panel having a structure in which a front protective plate having a function of blocking electromagnetic waves and a function of blocking near infrared rays is integrally joined to a flat display panel body. hand,
(EN) Provided is a flat display panel having a near-infrared shielding layer which has a good and stable near-infrared shielding effect, is easy to form, and is inexpensive in material cost, and more reliably damages the flat display panel body. An object of the present invention is to provide a flat display panel that can be prevented.

[0008]

Means for Solving the Problems The present inventors have proposed a near-infrared shielding effect when a near-infrared shielding layer containing a near-infrared absorber is applied to a front protective plate of a type that is joined and integrated with a PDP body. As a result of diligent examination of the change, the surface temperature of the PDP main body during lighting rises to about 60 ° C. at the average temperature of all screens, and partially rises to about 80 ° C. at the point of continuous lighting. What to do and Reference Example 1 described later
As also shown in the heat deterioration test, the inventors found that in the example of the near-infrared shielding film containing a near-infrared absorber, the optical characteristics are significantly deteriorated by being exposed to a high temperature of 80 ° C. As a result of further studies, when a glass substrate is laminated on the surface of the PDP main body, the surface temperature of the surface of the PDP main body is lowered to about 40 ° C. even at a portion reaching 80 ° C. all right. Then, as shown in the heat deterioration test of Reference Example 2 described later, in the example of the near-infrared shielding film containing a near-infrared absorber, if the heating temperature is as low as about 40 ° C., the optical characteristics are not significantly deteriorated. This has led to the completion of the present invention.

That is, the present invention is to solve at least one of the above problems, and a flat display panel of the present invention is provided with a transparent substrate, an electromagnetic wave shielding layer, and one surface side of the transparent substrate. A front protection plate including a near-infrared shielding layer containing a near-infrared absorber and an adhesive layer provided as an outermost layer on the other surface side of the transparent substrate is a flat display panel body with an adhesive layer interposed therebetween. It is characterized by being joined to the surface of the visible side of.

According to the flat-type display panel having such a structure, the near infrared ray shielding layer and the electromagnetic wave shielding layer are provided, so that the near infrared ray shielding effect and the electromagnetic wave shielding effect can be obtained. In particular, since the transparent substrate is interposed between the flat display panel body and the near-infrared shielding layer containing the near-infrared absorber, this transparent substrate is transmitted from the flat display panel body surface to the near-infrared shielding layer. It acts as a thermal buffer layer to reduce heat. Therefore, even when the surface temperature of the flat panel display panel becomes high at the time of lighting, thermal deterioration of the near-infrared absorbing agent contained in the near-infrared shielding layer is prevented, so that a good and stable near-infrared shielding effect can be obtained. To be Further, the near-infrared shielding layer using the near-infrared absorber is easy to form and the material is inexpensive, so that the cost can be reduced.

In the flat display panel of the present invention, it is preferable to provide an antireflection layer as an outermost layer of the front protective plate on one surface side of the transparent substrate. According to the flat-panel display panel having such a configuration, the antireflection effect is obtained because the antireflection layer is provided. In the present invention, the antireflection layer may be provided so as to be the outermost layer of the front surface protection plate, and further on the outside of the front surface protection plates 3 and 13 shown in FIGS. Layers other than the transparent substrate, the electromagnetic wave shielding layer, the near infrared ray shielding layer, the antireflection layer, and the adhesive layer in the present invention can be provided as necessary.

The transparent substrate is preferably a highly rigid transparent substrate having a bending elastic modulus at 23 ° C. of 2000 MPa or more. With such a configuration, the front protection plate itself is unlikely to be deformed by an external force, so that the flat display panel body can be more reliably prevented from being damaged, and the reliability is improved. In the flat display panel of the present invention,
In particular, it is preferable that the transparent substrate is made of glass.
A PDP is suitable as the flat display panel body in the present invention.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS [First Embodiment] FIG. 1 is a view showing a first embodiment of a flat display panel according to the present invention. In the present embodiment, the flat display panel 1 is composed of a flat display panel body 2 and a front protective plate 3 joined to a surface 2a on the viewing side (hereinafter referred to as the surface 2a). The front protective plate 3 includes a transparent substrate 4, an electromagnetic wave shielding layer 5, a near infrared ray shielding layer 9, an antireflection layer 6, and an adhesive layer 7.

[Flat Display Panel Body] As the flat display panel body 2, various flat display panels such as PDP, plasma addressed liquid crystal display panel (PALC), field emission display (FED), etc. can be applied. Among these, the advantage of applying the present invention to a PDP that requires shielding of electromagnetic waves and near infrared rays is great. The following explanation is for a flat display panel.
The case where DP is used is illustrated, "flat display panel 1" is described as "PDP 1", and "flat display panel body 2" is described as "PDP body 2".

As the PDP body 2, PDs having various configurations are used.
P device can be used. A typical PDP sandwiches barrier ribs for forming a large number of discharge cells between two glass substrates, forms discharge electrodes in the discharge cells, and makes red, green, or blue in each discharge cell. Xenon (Xe) is formed in each discharge cell by forming a phosphor film that emits light.
A gas containing is enclosed. Then, full-color display can be performed by selectively causing the phosphor in the discharge cell to emit light by discharge. When the PDP main body 2 is activated, electromagnetic waves and near infrared rays are emitted from its surface 2a.

[Front Protection Plate] In the present embodiment, the front protection plate 3 has an electromagnetic wave shielding layer 5, a near infrared ray shielding layer 9, and an antireflection layer 6 which are sequentially laminated on one surface of a transparent substrate 4. The adhesive layer 7 is provided on the other surface. The front protective plate 3 is bonded to the surface 2a of the PDP main body 2 via an adhesive layer 7.

(Transparent Substrate) As the transparent substrate 4, various glass substrates and various transparent resin substrates can be used. In particular, in the present embodiment, the transparent substrate 4 also serves as a thermal buffer layer, and therefore, it is preferable that the transparent substrate 4 has a small thermal conductivity and a large thermal buffering action. Specifically, it is preferable that it has a heat buffering effect such that the surface temperature on the side opposite to the bonding surface is kept at 40 ° C. or lower in the state of being bonded to the heating surface at 80 ° C.
Specific examples include various glass substrates and organic polymer materials.

The transparent substrate 4 is preferably a high-rigidity transparent substrate having a bending elastic modulus of 2000 MPa or more at 23 ° C., and examples thereof include substrates made of various kinds of glass, polycarbonate, acrylic resin and the like. Among them, glass having a large elastic modulus is preferable, and among various kinds of glass, tempered glass having an average breaking stress of 100 MPa or more, or semi-tempered glass tempered glass having an average breaking stress of 60 to 100 MPa (double strength glass) is preferable. If the bending elastic modulus of the transparent substrate 4 is 2000 MPa or more, the front protective plate 3 itself is unlikely to be deformed when an external force is applied, and the external force is less likely to act on the glass forming the surface 2a of the PDP main body 2. Therefore, it is possible to effectively improve the mechanical strength of the PDP main body 2 to which the front protection plate 3 is integrally joined and prevent the destruction thereof. Especially glass
It has a coefficient of thermal expansion of less than half that of plastic materials, does not warp even if there is a slight temperature difference between the surface on the PDP body 2 side and the opposite surface, and has heat resistance and chemical stability. Since it is also excellent in, it is suitable as the transparent substrate 4. When the above-mentioned high-rigidity transparent substrate is used as the transparent substrate 4, its thickness is set so as to give the PDP main body 2 sufficient mechanical strength and to obtain a sufficient thermal buffering action. Is about 1 to 5 mm.

The above-mentioned tempered glass or semi-tempered glass suitable as the transparent substrate 4 can be obtained by a well-known glass tempering step. For example, a glass plate in a predetermined temperature range,
Preferably, it is obtained by the air-cooling strengthening method in which the material is heated to 650 to 700 ° C. and then forcibly cooled by air. A tempered glass or a semi-tempered glass can be obtained by appropriately adjusting the air-cooling conditions (mainly the cooling rate) and the thickness. The tempered glass or semi-tempered glass produced by such air-cooling tempering is preferable from the viewpoint of safety, because even if a crack occurs, the crushed fragments are small and the end face does not become a sharp blade.

(Electromagnetic wave shielding layer) The electromagnetic wave shielding layer 5 is composed of a conductive film containing at least one metal layer or a mesh conductive film formed in a mesh shape. As the metal layer,
One or more metals selected from the group consisting of Au, Ag and Cu or a layer containing the metal as a main component is preferable, and in particular, a metal layer containing Ag as a main component has low specific resistance and small absorption. preferable. Further, as the metal layer containing Ag as a main component, diffusion of Ag is suppressed, and as a result, moisture resistance is improved.
It is preferably a metal layer containing at least one metal of u or Cu. The content ratio of at least one metal of Pd, Au, or Cu depends on the Ag content and Pd, A
It is preferably 0.3 to 10 atom% with respect to the total amount of u or Cu and the content of at least one metal.
If it is 0.3 atom% or more, the effect of stabilizing Ag can be obtained, and if it is 10 atom% or less, good film formation rate and visible light transmittance can be obtained while maintaining good moisture resistance. . Therefore, from the above viewpoint, the added amount is preferably 5.0 atomic% or less. Further, since the target cost remarkably increases as the amount of addition increases, it is in the range of about 0.5 to 2.0 atom% in consideration of the normally required moisture resistance. When a conductive film composed of one metal layer is used as the electromagnetic wave shielding layer 5, the thickness of this metal layer is 5 to 20 nm, preferably 8 to 15 nm. The method of forming this metal layer is not particularly limited, but it is preferable to directly form a thin metal film on one surface of the transparent substrate 4 by a sputtering method capable of forming a uniform film. Alternatively, a metal film may be formed on a film-shaped transparent base material by a sputtering method, and the obtained sputtered film may be attached to one surface of the transparent substrate 4.

Alternatively, when the electromagnetic shielding layer 5 is composed of a conductive film, a low sheet resistance value, a low reflectance and a high visible light transmittance can be obtained. Therefore, a multi-layer conductive layer in which oxide layers and metal layers are alternately laminated is used. A film, particularly a multilayer conductive film in which a total of (2n + 1) layers (n is an integer of 1 or more) are alternately laminated with an oxide layer, a metal layer, and an oxide layer is preferably used. Bi, Zr, Al, Ti, Sn, In and Zn are used as the oxide layer.
A layer containing an oxide of at least one metal selected from the group consisting of Preferably Ti, Sn, In
And a layer containing an oxide of at least one metal selected from the group consisting of Zn and Zn as a main component. In particular, a layer containing ZnO as a main component because of low absorption and a refractive index of around ₂ , and a layer containing TiO ₂ as a main component because a layer having a large refractive index and a preferable color tone can be easily obtained with a small number of layers. preferable. The oxide layer may be composed of multiple thin oxide layers. For example, instead of the oxide layer containing ZnO as a main component, a layer containing SnO ₂ as a main component and a layer containing ZnO as a main component can be formed.

The oxide layer containing ZnO as a main component is preferably an oxide layer containing ZnO containing at least one metal other than Zn. The one or more contained metals are present mainly in the oxide state in the oxide layer. ZnO containing one or more metals is S
ZnO containing at least one metal selected from the group consisting of n, Al, Cr, Ti, Si, B, Mg, and Ga.
Are preferred. The content ratio of the one or more metals is preferably 1 to 10 atom% with respect to the total amount of the metals and Zn, because the moisture resistance of the obtained conductive film is improved. If it is 1 atomic% or more, the internal stress of the ZnO film can be sufficiently reduced and good moisture resistance can be obtained. Further, when the content is 10 atomic% or less, the crystallinity of ZnO is maintained well and the compatibility with the metal layer is not deteriorated. The metal content is preferably 2 to 6 atom% in view of obtaining a ZnO film having stable and good reproducibility and a low internal stress, and considering the crystallinity of ZnO.

The geometrical thickness of the oxide layer (hereinafter, simply referred to as the thickness) is 20 to 60 nm (especially 3) for the oxide layer closest to the transparent substrate 4 and the oxide layer farthest from the transparent substrate 4.
0 to 50 nm), other oxide layers are 40 to 120 n
It is preferably m (particularly 40 to 100 nm). The total film thickness of the metal layer is, for example, 25 to 40 nm (especially 25 to 35 nm), and the target surface resistance value is 1.5 Ω / □ when the target surface resistance value of the obtained conductive film is 2.5 Ω / □.
In this case, the thickness is preferably 35 to 50 nm (particularly 35 to 45 nm). The total total film thickness of the oxide layer and the metal layer is, for example, 150 to 220 nm when the number of metal layers is 2.
(Especially 160 to 200 nm), 2 when the number of metal layers is 3
30 to 330 nm (especially 250 to 300 nm), and 270 to 370 nm (especially 310 to 35) when the number of metal layers is 4.
0 nm) is preferable.

Between the first metal layer and the second oxide layer, between the second metal layer and the third oxide layer, and between the third metal layer and the fourth oxide layer. In between, another layer for preventing the metal layer from being oxidized when the oxide layer is formed (hereinafter,
An oxidation barrier layer). As the oxidation barrier layer, for example, a metal layer, an oxide layer, or a nitride layer is used. Specifically, it is one or more metals selected from the group consisting of Al, Ti, Si, Ga, and Zn, oxides and nitrides of the metals, and the like. Preferably Ti or S
ZnO containing i and Ga is used. The film thickness of the oxidation barrier layer is preferably 1 to 7 nm. Within this range, the oxidation of the metal layer can be prevented while suppressing a decrease in transmittance.

When the electromagnetic wave shielding layer 5 is composed of a conductive film,
It is preferable to provide a protective layer made of an oxide film or a nitride film on the surface thereof. This protective layer is the electromagnetic wave shielding layer 5
Oxidation of the electromagnetic wave shielding layer 5 from an adhesive (especially an alkaline adhesive) when the other layer is laminated on the electromagnetic wave shielding layer 5 in order to protect (the metal layer containing Ag in particular) from moisture. It is used to protect a material layer (particularly a layer containing ZnO as a main component). Specifically, Zr, Ti, Si,
Examples thereof include oxide films and nitride films of metals such as B and Sn.
In particular, when a layer containing ZnO as a main component is used as the uppermost layer of the electromagnetic wave shielding layer 5, it is preferable to use a nitride film. Examples of the nitride film include a Zr and / or Si nitride film, and it is particularly preferable to use a composite nitride film of Zr and Si. This protective layer is preferably formed with a film thickness of 5 to 30 nm, particularly 5 to 20 nm.

The electromagnetic wave shielding layer 5 may be composed of a mesh conductive film. As the mesh conductive film, one formed by a photolithography method, one formed by a printing method, a fiber mesh, or the like can be used.
Among them, the photolithographic mesh conductive film formed by the photolithographic method is particularly preferably used because it has a small surface resistance value of about 0.05Ω / □. Specifically, the photolithographic mesh conductive film is composed of a metal mesh and a resin film, and as a method for producing this, a metal thin film such as a copper foil is stuck on the resin film, or vapor deposition or plating is performed on the resin film. A method of patterning a metal thin film formed by using a photolithographic method to etch the metal thin film in a mesh shape is mentioned.

Examples of the material of the metal thin film used for forming the photolithographic mesh conductive film include copper, aluminum, stainless steel, nickel, titanium, tin, tungsten, chromium and the like, and alloys thereof. Copper,
Aluminum and stainless steel are preferred. The thickness of the metal thin film is preferably 2 to 20 μm, more preferably 3 to 10 μm from the viewpoint of electromagnetic wave shielding property and etching property. As the resin film used for forming the photolithographic mesh conductive film, PET (polyethylene terephthalate), PM
MA (polymethylmethacrylate), PC (polycarbonate), TAC (triacetylcellulose), polystyrene, etc. are mentioned. The photolithographic mesh conductive film has a mesh specification of a pitch of 200 to 400 μm and a line width of 5 to 30.
About μm is preferable.

The electromagnetic wave shielding layer 5 is connected to a ground wire connecting electrode 8 for guiding a current generated in the electromagnetic wave shielding layer 5 due to an electromagnetic wave emitted from the PDP main body 2 to a ground wire. . The electrode 8 is formed on one surface side of the transparent substrate 4 in contact with at least a part of the peripheral edge of the electromagnetic wave shielding layer 5. The shape and size are not particularly limited, but the lower resistance is superior in terms of electromagnetic wave shielding performance. It is preferable that the electrode 8 is provided on the entire periphery of the transparent substrate 4 in order to secure the electromagnetic wave shielding effect of the electromagnetic wave shielding layer 5. As such an electrode 8, for example, an electrode obtained by applying and firing Ag paste (paste containing Ag and glass frit) or Cu paste (paste containing Cu and glass frit) is preferably used. Further, it may be configured to include a long ground wire (not shown) connected to the electrode 8. Here, the firing process for forming the electrode 8 can also serve as a glass strengthening process when the transparent substrate 4 is made of glass. Therefore, on the glass substrate before the strengthening step, the above A
By applying the g paste or the Cu paste and baking the paste, it is possible to obtain a structure in which the electrode 8 made of Ag or Cu is formed on the transparent substrate 4 made of tempered glass or semi-tempered glass.

(Antireflection Layer) The antireflection layer 6 may be a layer having an antireflection property, and can be formed by a known antireflection method. For example, an antireflection effect can be obtained by having at least an antiglare layer or a low refractive index layer. A known material having a low refractive index can be used for the low refractive index layer, but an amorphous fluorine-containing polymer is preferable from the viewpoint of antireflection effect and ease of layer formation. Further, from the viewpoint of preventing scattering of fragments when the transparent substrate 4 itself is damaged, it is preferable to laminate a low refractive index layer on one surface of the resin film. In particular, one side of a polyurethane-based soft resin film having self-healing properties and shatterproof properties, a laminate having a low refractive index layer made of an amorphous fluoropolymer, as a specific example, an arc made by Asahi Glass Co., Ltd. It is preferable to form the antireflection layer 6 on the top (trade name).

(Near infrared shielding layer) The near infrared shielding layer 9 is
It is composed of a resin composition in which a near-infrared absorber is dispersed in a resin which is a main component.

The method for forming the near-infrared ray shielding layer 9 is not particularly limited, but it is preferable to form a film by coating a solution obtained by uniformly mixing the main component, the near-infrared ray absorbing agent and the solvent on the substrate. As the coating method, for example, a dip coating method, a roll coating method, a spray coating method, a gravure coating method, a comma coating method, a die coating method or the like can be selected. These coating methods can perform continuous processing and are superior in productivity as compared with the batch type vapor deposition method and the like. Alternatively, a spin coating method capable of forming a thin and uniform coating film may be adopted.

A transparent resin film is preferable as a substrate used in the coating method, and examples thereof include polyester, acrylic, cellulose, polyethylene, polypropylene, polyolefin, polyvinyl chloride, polycarbonate, phenol and urethane. Resin films such as Among them, polyester films such as polyethylene terephthalate film are suitable. When a near-infrared shielding film having a coating film (near-infrared shielding layer 9) formed of a resin composition in which a near-infrared absorbing agent is dispersed on a transparent film is used to form the near-infrared shielding layer 9. Although not shown in the figure, the transparent resin film used as the base material is interposed between the near infrared ray shielding layer 9 and the electromagnetic wave shielding layer 5.

When a laminate having a low refractive index layer provided on one surface of a resin film such as the above-mentioned Arctop (trade name) is used as the antireflection layer 6, the antireflection layer 6 has It is also possible to form the near-infrared shielding layer 9 by using a resin film as a substrate and coating the other surface with a solution in which the main agent, the near-infrared absorber and the solvent are uniformly mixed. In this case, there is no base material between the near infrared ray shielding layer 9 and the electromagnetic wave shielding layer 5, and the near infrared ray shielding layer 9 and the antireflection layer 6 are laminated on the electromagnetic wave shielding layer 5. The body is bonded together.

Alternatively, the low-refractive index layer forming the antireflection layer 6 may contain a near-infrared absorber to form a near-infrared shielding layer having an antireflection function. In this case,
Although it is not necessary to separately provide the antireflection layer 6 and the near-infrared ray shielding layer 9, although not shown in the figure, on the electromagnetic wave shielding layer 5,
The near infrared ray shielding layer having the antireflection function is provided.

Alternatively, as the antireflection layer 6, when a laminate having a low refractive index layer provided on one surface of a resin film, such as the above-mentioned Arctop (trade name), is used,
A near infrared absorber is mixed in the resin film,
The laminate may be a near infrared ray shielding layer having an antireflection function. Also in this case, it is not necessary to separately provide the antireflection layer 6 and the near infrared ray shielding layer 9, and although not shown in the figure, the near infrared ray shielding layer having the antireflection function is provided on the electromagnetic wave shielding layer 5. It will be the configured configuration.

The main agent is not particularly limited as long as it can uniformly disperse the near-infrared absorber. For example, polyester resin, olefin resin, cycloolefin resin,
A thermoplastic resin such as a polycarbonate resin is preferably used. A specific main agent is, for example, Kanebo Co., Ltd., trade name "O-
"PET" polyester resin; product name "A" manufactured by JSR
Commercially available products such as a polyolefin resin “RTON”, a product manufactured by Nippon Zeon Co., Ltd., a cycloolefin resin manufactured by “ZEONEX”, a product manufactured by Mitsubishi Engineering Plastics, a product name “UPILON” can be used.

The solvent for dissolving the main agent is not particularly limited, but ketone solvents such as cyclohexanone, ether solvents, ester solvents such as butyl acetate, ether alcohol solvents such as ethyl cellosolve, diacetone alcohol, etc. The ketone alcohol solvent, the aromatic solvent such as toluene and the like can be used. These may be used alone or as a mixed solvent system in which two or more kinds are mixed.

As the near-infrared absorber, a dye capable of absorbing at least part of light in the near-infrared region (wavelength 780 to 1300 nm) is used, and the dye may be either a dye or a pigment. Specifically, polymethine, phthalocyanine, naphthalocyanine, metal complex, aminium, immonium, diimonium, anthraquinone, dithiol metal complex, naphthoquinone, indolephenol, azo, triallylmethane Examples thereof include, but are not limited to, compounds of the system. Especially for heat ray absorption and noise prevention of electronic devices, a near infrared absorber having a maximum absorption wavelength of 750 to 1100 nm is preferable, and a metal complex type, an aminium type, a phthalocyanine type, a naphthalocyanine type, and a diimonium type are preferable. The near-infrared absorber may be one kind or a mixture of two or more kinds.

The amount of the near-infrared ray absorbing agent contained in the near-infrared ray shielding layer 9 is preferably 0.1% by mass or more, particularly 2% by weight, with respect to the main agent in order to effectively obtain the near-infrared ray shielding effect. % Or more is preferable. Further, in order to maintain the physical properties of the main agent, it is preferable to suppress the amount of the near-infrared absorber to 10% by mass or less.

The thickness of the near infrared ray shielding layer 9 is preferably 0.5 μm or more in order to effectively obtain the near infrared ray shielding effect,
The thickness is preferably 20 μm or less from the viewpoint that the solvent during film formation does not easily remain and the operability of film formation is easy. Especially 1 to 10
It is preferably μm.

(Adhesive Layer) The front protective plate 3 has an adhesive layer 7
It is joined to the surface 2a of the PDP main body 2 via. Examples of suitable adhesives for the adhesive layer 7 in the present invention include hot-melt adhesives such as ethylene-vinyl acetate copolymer (EVA), epoxy- and acrylate-based UV-curable adhesives, and thermosetting adhesives. be able to. The adhesive layer 7 has a thickness of 0.1 to 1.0 mm, preferably 0.2 to
0.5 mm.

(Manufacturing Method) To manufacture the PDP 1 of this embodiment, for example, first, the electrode 8 and the electromagnetic wave shielding layer 5 are sequentially formed on one surface of the transparent substrate 4, and the near infrared ray shielding layer 9 is formed on the upper surface thereof. Is formed by coating or laminating, and the antireflection layer 6 is further laminated on the upper surface thereof.
Then, on the other surface of the transparent substrate 4 through the adhesive layer 7, the PD
It is bonded to the P body 2. The near-infrared ray shielding layer 9 and the antireflection layer 6 may be integrated in advance and may be attached to the electromagnetic wave shielding layer 5. Ag paste or C
When the electrode 8 is formed using u paste, the transparent substrate 4
A screen printing method can be preferably used for the application on the top. When a glass substrate is used as the transparent substrate 4, the glass substrate is also heated when the electrode 8 is fired. Therefore, the glass substrate used as the transparent substrate 4 can be strengthened by providing a step of air cooling after firing. When the electromagnetic wave shielding layer 5 is composed of a conductive film including at least one metal layer, it is preferable to form the film by a sputtering method, or a separately prepared sputter film is attached to the surface on which the electrode 8 is formed. May be. On the other hand, when the electromagnetic wave shielding layer 5 is composed of a mesh conductive film, a separately prepared mesh film on which the electrode 8 is formed is attached. For laminating each layer, an appropriate laminating means suitable for laminating films such as a roll laminating machine may be used, and an adhesive may be interposed between the layers as necessary.

When a hot-melt sheet made of a hot-melt type adhesive is used as the adhesive layer 7, a preferable method for joining the front protective plate 3 to the PDP main body 2 via the adhesive layer 7 is as follows. There is a method. That is, P
A hot melt sheet is placed on the surface 2a of the DP main body 2, a front protective plate 3 is placed on the surface, and alignment is performed, and then temporarily fixed with a heat resistant adhesive tape. After that, the temporarily fixed integrated product is put in a bag made of a heat-resistant resin with an exhaust port and sealed. Next, the exhaust port is connected to a vacuum pump to deaerate the internal air, and the device is placed in a heating oven and heated to the fusion temperature of hot melt. After heating, the vacuum of the bag taken out of the oven is released, and the adhesive layer 7 is applied to the surface 2a of the PDP main body 2.
The PDP 1 to which the front face protection plate 3 is joined is taken out via.

Since the PDP 1 according to the present embodiment includes the antireflection layer 6, the near infrared ray shielding layer 9 and the electromagnetic wave shielding layer 5, the antireflection effect, the near infrared ray shielding effect and the electromagnetic wave shielding effect can be obtained. Since the near-infrared shielding layer 9 in this embodiment is formed by using a near-infrared absorber, the material is inexpensive and easy to form. Further, the near-infrared ray absorbing agent contained in the near-infrared ray shielding layer 9 may be deteriorated by heat, but the surface temperature becomes high at the time of lighting.
Since the transparent substrate 4 is interposed between the main body 2 and the near infrared ray shielding layer 9, this transparent substrate 4 serves as a heat buffer layer.
Heat transfer from the surface 2a of the main body 2 to the near infrared ray shielding layer 9 is suppressed. Therefore, thermal deterioration of the near-infrared absorbing agent contained in the near-infrared shielding layer 9 is prevented, and a good and stable near-infrared shielding effect is obtained. Further, since the transparent substrate 4 is bonded and integrated on the surface 2a of the PDP main body 2 via the adhesive layer 7, it is between the surface 2a side of the PDP main body 2 and the protective filter provided on the front surface thereof. Compared to the case where there is a space, interface reflection is greatly reduced, and it is possible to eliminate a double image due to external scene reflection.

Further, in the present embodiment, since the electromagnetic wave shielding layer 5 is provided on the transparent substrate 4, the electromagnetic wave shielding layer 5 can be formed by the sputtering method, and the electromagnetic wave shielding layer 5 is provided so as to be connected to the electromagnetic wave shielding layer 5. The formed electrode 8 is easy to form.
Furthermore, in the present embodiment, when the electromagnetic wave shielding layer 5 is made of a conductive film including at least one metal layer, the electromagnetic wave shielding layer 5 also has an effect of shielding near infrared rays, and in addition to this. Since the near infrared ray shielding layer 9 is also provided, the near infrared ray shielding effect is further improved.

[Second Embodiment] FIG. 2 is a view showing a second embodiment of the flat display panel according to the present invention. The PDP 11 of the present embodiment differs from the PDP 1 of the first embodiment in that the electromagnetic wave shielding layer 5 is provided on the transparent substrate 4 on the PDP main body 2 side. That is,
In the front surface protection plate 13 of the present embodiment, the near infrared ray shielding layer 9 and the antireflection layer 6 are sequentially laminated on one surface of the transparent substrate 4, and the electromagnetic wave shielding layer 5 and the adhesive layer 7 are sequentially laminated on the other surface. Has been done. The front protection plate 13 is bonded to the surface 2a of the PDP body 2 via the adhesive layer 7. 2, the same components as those in FIG. 1 are designated by the same reference numerals and the description thereof will be omitted.

To manufacture the PDP 11 of this embodiment,
For example, the near infrared ray shielding layer 9 is formed on one surface of the transparent substrate 4 by coating or laminating, and the antireflection layer 6 is further laminated on the upper surface thereof. The near infrared ray shielding layer 9 and the antireflection layer 6 may be integrated in advance. Separately from this, the electrode 8 and the electromagnetic wave shielding layer 5 are sequentially formed on the other surface of the transparent substrate 4. Electrode 8
Also, the formation of the electromagnetic wave shielding layer 5 and the bonding of the layers can be performed in the same manner as in the first embodiment.
Then, the surface on which the electromagnetic wave shielding layer 5 is formed is bonded to the PDP main body 2 via the adhesive layer 7. As a method of joining the front surface protection plate 3 to the PDP main body 2 via the adhesive layer 7, the same method as in the first embodiment can be used. According to this embodiment, the same operational effects as those of the first embodiment can be obtained.

[0048]

EXAMPLE Example 1 A PDP device according to the present invention was manufactured by the following procedure.

(Preparation of Front Protective Plate) A soda lime glass substrate (thickness: 2.5 mm) was cut into the same size as the PDP body and chamfered. Next, Ag paste (manufactured by Murata Manufacturing Co., Ltd.) was printed by a screen printing method on a strip-shaped portion having a width of 10 mm from the end on the entire circumference on one surface of this rectangular glass substrate, and then baked. The heating temperature during firing was 660 ° C., and the glass substrate was strengthened by forced air cooling after heating. In order to prevent a sputtered film from being formed on this Ag paste, the portion on which the Ag paste was printed was covered with a stainless steel thin plate and temporarily fixed with an adhesive tape. Next, on the glass surface on which the Ag paste was printed, by sputtering, 3Al-ZnO (40 nm) /1.0Pd-Ag.
(10 nm) / 3Al-ZnO (80 nm) /1.0P
d-Ag (12 nm) / 3Al-ZnO (80 nm) /
1.0Pd-Ag (10 nm) / 3Al-ZnO (40
nm) multilayer film was formed. Table 1 shows the film forming conditions for each film.

[0050]

[Table 1]

"3Al-Zn" means Al
And Zn means 3 atom% of Zn based on the total amount of Zn,
Further, "3Al-ZnO" represents a film produced by sputtering in the presence of oxygen, using 3Al-Zn as a target. Further, "1.0 Pd-Ag" means Ag containing Pd in an amount of 1.0 atom% with respect to the total amount of Pd and Ag. After forming the multilayer film by sputtering, the stainless thin plate was removed.

Next, a near-infrared shielding film was attached to the surface on which the film was formed by the sputtering method by a roll laminator machine. The near-infrared shielding film used was manufactured as follows. First, an optical polyester resin (Kanebo Co., Ltd., trade name "O-PET") was used with a resin concentration of 10%.
Was dissolved in cyclopentanone to prepare a base material solution for the near infrared ray shielding film. This main ingredient solution 100
g, nickel, bis-1,2-diphenyl-
5.6 mg of 1,2-ethenedithiolate (manufactured by Midori Kagaku Co., Ltd., trade name "MIR101"), phthalocyanine dye (manufactured by Nippon Kayaku Co., Ltd., trade name "EEX Color 801")
K ”) 3.2 mg, diimmonium dye (manufactured by Nippon Kayaku Co., trade name“ IRG022 ”) 22.4 mg, and anthraquinone dye (Dai Nippon Seika Co., dye A) 0.4 mg are dissolved. The obtained solution is a polyethylene terephthalate film having a thickness of 150 μm (manufactured by Toyobo Co., Ltd.)
The above was coated by a gravure method to obtain a near infrared ray shielding film. The thickness of this near-infrared shielding film is 15 including the polyethylene terephthalate film as the base material.
It was 3 μm.

Subsequently, an antireflection film (Arc Top URP2179, manufactured by Asahi Glass Co., Ltd.) was pasted on the near infrared ray shielding film with a roll laminator, and then Ag was used.
The near infrared ray shielding film and the antireflection film on the paste were cut and peeled by a laser cutter to form an electrode, and a front protective plate was obtained.

(Integration of PDP Main Body and Front Protective Plate) The front protective plate prepared as described above and the PDP main body were joined and integrated by an adhesive layer by the following method. EVA hot melt sheet (manufactured by Bridgestone, trade name "EVASA
FE1450 ") is approximately 5m from the PDP body both vertically and horizontally
Cut into m pieces. This sheet is placed between the PDP main body and the surface of the front protective plate on which the antireflection film is not adhered, these three parts are overlapped, and several places on each side of the periphery are temporarily attached with heat-resistant adhesive tape. Fixed The temporarily fixed integrated product was put in a PET bag having an exhaust port and sealed. The pressure was reduced to 720 mmHg by a vacuum pump, the temperature was raised to 80 ° C. over 1 hour in a heating oven, and 80 minutes for 80 minutes.
Hold at ℃. While maintaining the degree of vacuum, the temperature was raised to 110 ° C over 40 minutes, and the temperature was maintained at 110 ° C for 20 minutes.
Then, when the temperature was cooled to 80 ° C., the reduced pressure was released, the temperature was cooled to room temperature, and then the integrated product (PDP) was taken out from the PET bag.

Reference Example 1: The near infrared ray shielding film used in Example 1 was subjected to a heat deterioration test by the following method. That is, the optical characteristics were measured before heating, after heating at 40 ° C. for 1000 hours, and after heating at 80 ° C. for 1000 hours.
An electric oven was used as the heating means, and the optical characteristics were evaluated by a spectrophotometer (UV3100, manufactured by Shimadzu Corporation) in terms of luminous average transmittance (unit:%), transmission color tone, and near-infrared transmittance (unit:%). Was measured. The results are shown in Table 2 below.
Shown in. In this table, the value of the average luminous transmittance is the average luminous transmittance of visible light (wavelength 380 to 780 nm),
The spectral distribution obtained by the spectrophotometer is represented by the value obtained by weighted average by standard relative luminous efficiency. The transmission color tone represents the spectral distribution by the values of coordinates (x coordinate and y coordinate) on the chromaticity diagram of CIE (International Commission on Illumination). The near-infrared transmittance value is represented by a transmittance at a wavelength of 850 nm and a transmittance at a wavelength of 900 nm.

[0056]

[Table 2]

From the results shown in Table 2, the near-infrared shielding film used in Example 1 was compared with the initial state before heating.
It is recognized that heating at 80 ° C. for 1000 hours significantly deteriorated the luminous transmittance, the transmitted color tone, and the near-infrared transmittance. For example, in general, the transmittance of a near-infrared shielding filter is 1 at a wavelength of 850 nm.
It is required that the transmittance at a wavelength of 900 nm is 10% or less at 5% or less, but after heating at 80 ° C. for 1000 hours, the near-infrared shielding effect deteriorates to the extent that this requirement cannot be satisfied. On the other hand, when heating at 40 ° C. for 1000 hours, the deterioration of the near infrared transmittance is small,
The luminous transmittance and the transmitted color tone were hardly deteriorated.

Test Example 1: A front protective plate-PDP body integrated product (PDP) manufactured in the same manner as in Example 1 was used as a sample, and a heat deterioration test was conducted by lighting for 1000 hours in total. The optical characteristics were measured in the same manner as in Reference Example 1 above. However, since the front protective plate is removed from the PDP main body after the lighting is finished so that the optical characteristics can be measured, the method of joining the front protective plate and the PDP main body is different from that of the first embodiment, and a temporary adhesive is used. Joined. Also,
In order to investigate the initial value before lighting, the optical characteristics of the front protective plate before being joined to the PDP body were measured in the same manner as in Reference Example 1. The results are shown in Table 3 below.

Comparative Example 1: A front protective plate was prepared in the same manner as in Example 1 except that the near infrared ray shielding film was provided on the PDP main body side of the transparent glass substrate. That is, in the same manner as in Example 1 above, an Ag paste was formed on tempered glass, and 3Al-ZnO was formed thereon.
(40 nm) /1.0 Pd-Ag (10 nm) / 3Al
-ZnO (80 nm) /1.0 Pd-Ag (12 nm)
/ 3 Al-ZnO (80 nm) /1.0 Pd-Ag (1
A multilayer film of 0 nm) / 3Al-ZnO (40 nm) was formed. Then, after an antireflection film (Asahi Glass Co., Ltd., trade name "Arctop URP2179") was attached to the surface on which the film was formed by this sputtering method with a roll laminator, the antireflection film on the Ag paste was laser cut. An electrode was formed by cutting and peeling. On the other hand, a near-infrared shielding film similar to that used in Example 1 was attached to the surface of the glass opposite to the surface on which the film was formed by the sputtering method, using a roll laminator to obtain a front protective plate. It was

Comparative Test Example 1: The front protective plate prepared in Comparative Example 1 and the PDP body were temporarily joined together using an adhesive, and this integrated product (PDP) was lit for a total of 1000 hours to perform a heat deterioration test. went. The optical characteristics were measured in the same manner as in Reference Example 1 above. In addition, in order to investigate the initial value before lighting, the front protective plate before being joined to the PDP main body, that is, the front protective plate prepared in Comparative Example 1 was also used as Reference Example 1.
The optical characteristics were measured in the same manner as in. The results are also shown in Table 3 below.

[0061]

[Table 3]

From the results of Table 3, in Comparative Test Example 1, 10
The luminous average transmittance increased by 1.1% before and after lighting for 00 hours, and the near infrared transmittance increased by 2.3% at the wavelength of 850 nm and 2.1% at the wavelength of 900 nm. On the other hand, in Test Example 1, the increase in the average luminous transmittance was only 0.3%, the increase in the transmittance at the wavelength of 850 nm was 0.3%, and the increase in the wavelength was 9%.
The increase in transmittance at 00 nm was 0.7%, which was small. Also, the transmission color tone is 10 in Comparative Test Example 1.
Before and after lighting for 00 hours, x value is 0.006, y value is 0.0
In Test Example 1, the x value increased by 0.002 and the y value increased by 0.003, whereas the values increased by 10. From these, it was confirmed that in Test Example 1, the deterioration of the optical characteristics was suppressed.

[0063]

As described above, according to the present invention,
On the surface of the flat display panel body, the transparent substrate, the electromagnetic wave shielding layer, and the front protection plate having the near-infrared shielding layer provided on the visible side of the transparent substrate are integrally bonded, so that the flat type Even when the surface temperature of the display panel body rises, a flat display panel having a stable near-infrared shielding effect and high reliability can be obtained. Further, as a transparent substrate, the flexural modulus at 23 ° C. is 20.
If a material having a high rigidity of 00 MPa or more is used, the external force applied from the viewing side can be supported by both the glass plate of the flat display panel body and the highly rigid transparent substrate integrally bonded to the glass plate. Therefore, extremely high rigidity is imparted to the viewing side of the flat display panel, and the flat display panel can be more reliably prevented from being damaged.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a first embodiment of a flat display panel according to the present invention.

FIG. 2 is a cross-sectional view showing a second embodiment of a flat display panel according to the present invention.

[Explanation of symbols]

1,11 Flat display panel (PDP) 2 Flat display panel body (PDP body) 2a Viewing side surface (surface) 3,13 Front protection plate 4 transparent substrate 5 Electromagnetic wave shielding layer 6 Antireflection layer 7 Adhesive layer 8 electrodes 9 Near infrared shielding layer

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) B32B 7/02 ZAB B32B 7/02 ZAB 5G435 G02B 1/10 G02B 5/22 1/11 H01J 11/02 E 5/22 29/87 H01J 11/02 29/89 29/87 G02B 1/10 A 29/89 Z F term (reference) 2H048 CA12 CA19 CA24 2K009 AA02 CC03 DD02 4F100 AB17C AB24C AB25C AG00B AK17E AK51E AR00B AR00C AR00D AR00E BA05 BA07 BA10A BA10E CA07D CB00A GB41 JD08 JD08C JD10 JD10D JG01C JK04B JN01B JN06E YY00B 5C032 CC06 CC07 DD02 DE01 DE05 DF02 DF05 DG01 HGG AO A5 AA 5A04A08 5A04A08 5C04 MA08A

Claims (5)

[Claims] 1. A transparent substrate (4), an electromagnetic wave shielding layer (5),
A near-infrared shielding layer (9) containing a near-infrared absorber provided on one surface side of the transparent substrate (4) and an adhesive provided as an outermost layer on the other surface side of the transparent substrate (4). A flat display panel comprising a front protective plate having a layer (7) and an adhesive layer (7) bonded to the surface of the flat display panel body on the viewing side. 2. The flat surface according to claim 1, wherein the front protection plate comprises an antireflection layer (6) provided as an outermost layer on one surface side of the transparent substrate (4). Type display panel. 3. The flat display panel according to claim 1, wherein the transparent substrate (4) is a highly rigid transparent substrate having a bending elastic modulus at 23 ° C. of 2000 MPa or more. 4. The flat display panel according to claim 1, wherein the transparent substrate (4) is made of glass. 5. The flat display panel according to claim 1, wherein the flat display panel body is a plasma display panel.